WO2008075409A1 - Base pour un bloc de puissance, procédé de production d'une base pour un bloc de puissance et bloc de puissance - Google Patents

Base pour un bloc de puissance, procédé de production d'une base pour un bloc de puissance et bloc de puissance Download PDF

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Publication number
WO2008075409A1
WO2008075409A1 PCT/JP2006/325271 JP2006325271W WO2008075409A1 WO 2008075409 A1 WO2008075409 A1 WO 2008075409A1 JP 2006325271 W JP2006325271 W JP 2006325271W WO 2008075409 A1 WO2008075409 A1 WO 2008075409A1
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WO
WIPO (PCT)
Prior art keywords
heat dissipation
substrate
power module
heat
insulating substrate
Prior art date
Application number
PCT/JP2006/325271
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English (en)
Japanese (ja)
Inventor
Keiji Toh
Hidehito Kubo
Masahiko Kimbara
Katsufumi Tanaka
Kota Otoshi
Eiji Kono
Shinobu Yamauchi
Shintaro Nakagawa
Shinobu Tamura
Original Assignee
Kabushiki Kaisha Toyota Jidoshokki
Showa Denko K.K.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kabushiki Kaisha Toyota Jidoshokki, Showa Denko K.K. filed Critical Kabushiki Kaisha Toyota Jidoshokki
Priority to PCT/JP2006/325271 priority Critical patent/WO2008075409A1/fr
Publication of WO2008075409A1 publication Critical patent/WO2008075409A1/fr

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • H01L23/3735—Laminates or multilayers, e.g. direct bond copper ceramic substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/07—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L29/00
    • H01L25/072—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L29/00 the devices being arranged next to each other
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H01L23/3672—Foil-like cooling fins or heat sinks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Definitions

  • the present invention relates to a power module base constituting a power module.
  • aluminum includes pure aluminum except when expressed as “aluminum nitride”, “acid aluminum” and “pure aluminum”. In addition, an aluminum alloy is included.
  • a power module including a power device composed of a semiconductor element such as an IGBT (Insulated Gate Bipolar Transistor) the heat generated from the semiconductor element is efficiently radiated to set the temperature of the semiconductor element to a predetermined value.
  • a predetermined value such as an IGBT (Insulated Gate Bipolar Transistor)
  • an aluminum wiring layer is formed on one surface and an aluminum heat transfer layer is formed on the other surface, and an aluminum heat sink bonded to the heat transfer layer of the insulating substrate.
  • a base for a power module comprising a substrate and an aluminum heat sink bonded to the opposite surface of the heat dissipation substrate to the insulating substrate, and a coolant flow path is formed inside the heat sink. (See Patent Document 1).
  • a power device is mounted on a wiring layer of an insulating substrate and used as a power module.
  • This power module is applied to, for example, an inverter circuit of a moving body such as a hybrid car that uses an electric motor as a part of a driving source, thereby supplying electric power to be supplied to the electric motor according to the operating state of the moving body. Come to control.
  • the heat generated also by the power device force is transmitted to the heat sink through the wiring layer, the insulating substrate, the heat transfer layer, and the heat release substrate, and is radiated to the coolant flowing in the coolant flow path.
  • the heat dissipation substrate and the heat sink which also have an aluminum force with a relatively large linear expansion coefficient, tend to be heated to a relatively high temperature due to the heat generated by the power device force, and to be relatively large.
  • the coefficient of linear expansion of the ceramics forming the insulating substrate is smaller than that of aluminum, so it is heated by heat generated from the power device. Even if it becomes, it does not try to thermally expand as much as a heat dissipation board and a heat sink.
  • the insulating substrate, the heat dissipation substrate, and the heat sink are thermally expanded at the time of heating during the brazing, After being brazed, the insulating substrate, heat dissipation substrate, and heat sink shrink after heat.
  • the linear expansion coefficient of the heat dissipation board and the heat sink is larger than the linear expansion coefficient of the insulating board, the degree of thermal expansion of the heat dissipation board and the heat sink is larger than that of the insulating board.
  • the heat shrinkage of the heat sink is larger than that of the insulating substrate.
  • Patent Document 1 Japanese Unexamined Patent Publication No. 2003-86744
  • An object of the present invention is to provide a power module base that solves the above-described problems and that can improve durability while preventing deterioration in heat dissipation performance.
  • the present invention has the following aspect power.
  • a heat dissipation substrate made of a highly thermally conductive material, and an insulating substrate bonded to one surface of the heat dissipation substrate Heat dissipation caused by the difference in linear expansion coefficient between the insulating layer and the heat dissipation board, which is bonded to the other surface of the heat dissipation board, and the wiring layer provided on the opposite side of the insulating substrate to the side bonded to the heat dissipation board
  • a base for a power module comprising: a restraint plate that restrains warping of the substrate; and a radiation fin that is joined to a surface of the restraint plate opposite to the side joined to the heat dissipation substrate.
  • a heat transfer layer made of a high thermal conductivity material is provided on the surface of the insulating substrate opposite to the side where the wiring layer is provided, and the heat transfer layer and the heat dissipation substrate are joined together.
  • the base for power modules according to any one of 1) to 6).
  • the term "symmetric" includes, in addition to the mathematically defined strict symmetry, a state close to symmetry, that is, from the thickness direction of the heat dissipation board.
  • a state where a part of both of them is overlapped is included.
  • the insulating substrate is made of ceramic, and the ceramic is aluminum nitride.
  • thermoelectric joint The base for a thermoelectric joint according to any one of 1) to 8) above, wherein the constraining plate is made of ceramics, and the ceramics is also aluminum nitride, acid aluminum or silicon nitride. .
  • the cooling jacket is fixed on the surface of the heat dissipation board to which the restraining plate is joined so as to cover the heat dissipation fin, and the cooling liquid flows through the cooling jacket 1)
  • a heat dissipation substrate made of a high thermal conductivity material is laminated on the other surface side of the insulating substrate having the wiring layer provided on the surface, and the insulating substrate is disposed on the surface of the heat dissipation substrate opposite to the insulating substrate.
  • a constraining plate that restrains warpage of the heat dissipating substrate due to the difference in linear expansion coefficient with the heat dissipating substrate is laminated, and heat dissipating fins are arranged on the surface of the constraining plate opposite to the heat dissipating substrate, and the insulating substrate and the heat dissipating substrate.
  • a method for manufacturing a base for a power module characterized in that a heat dissipation substrate and a restraint plate, and a restraint plate and a heat dissipation fin are brazed simultaneously.
  • a heat transfer layer made of a highly heat conductive material is provided on the surface of the insulating substrate opposite to the surface on which the wiring layer is provided, and the heat transfer layer and the heat dissipation substrate are brazed.
  • a cooling jacket is disposed on the surface of the heat sink board on the side of the restraint plate so as to cover the heat sink fins, and the insulation board and the heat sink board, the heat sink board and the restraint board, and the brace of the restraint board and the heat sink fins.
  • a power module is configured by mounting a power device on the wiring layer of the insulating substrate.
  • This power module is applied to, for example, an inverter circuit of a hybrid car that uses an electric motor as a part of a drive source, and controls the electric power supplied to the electric motor in accordance with the operating condition.
  • the heat generated from the power device is transmitted to the heat radiating fins through the wiring layer, the insulating substrate, the heat radiating substrate, and the restraining plate, and the heat radiating fin force is also radiated.
  • the heat dissipation board is heated to a high temperature (for example, about 150 ° C) by the heat generated from the power device, so it tries to thermally expand.
  • the linear expansion coefficient of aluminum is larger than that of the insulating substrate, so the heat dissipation is caused by the difference in thermal expansion between the heat dissipation substrate and the insulating substrate.
  • the substrate is pulled by the insulating substrate and tries to warp.
  • a constraining plate that restrains the warpage of the heat dissipation board due to the difference in linear expansion coefficient between the insulation board and the heat dissipation board is joined to the surface of the heat dissipation board opposite to the side bonded to the insulating board. Therefore, the warping of the heat dissipation substrate is restrained by the restraining plate. Therefore, it is possible to prevent cracks from being generated on the insulating substrate and peeling at each bonding surface, thereby improving durability.
  • the insulating substrate, the heat radiating substrate, and the heat radiating fins are joined by, for example, brazing, the insulating substrate and the heat radiating substrate are heated during heating during brazing. In addition to expansion, it is brazed in a thermally expanded state, and after heating is complete The edge substrate and the heat dissipation substrate are thermally contracted.
  • the heat dissipation board is made of a highly thermally conductive material such as aluminum, and its coefficient of linear expansion is larger than that of the insulating board, so the degree of thermal expansion of the heat dissipation board is greater than that of the insulating board.
  • the heat shrinkage of the heat dissipation board is also larger than that of the insulating substrate.
  • the heat dissipation substrate is pulled by the insulating substrate because the degree of shrinkage is greater than that of the insulating substrate. It tries to warp.
  • a restraint plate that restrains the warpage of the heat sink due to the difference in linear expansion coefficient between the insulating substrate and the heat sink is bonded to the surface of the heat sink opposite to the side bonded to the insulating substrate. Therefore, the warping of the heat dissipation substrate is restrained by the restraining plate. Therefore, it is possible to prevent the insulating substrate from being cracked or to peel off at each bonding surface, and the durability is improved.
  • the heat transmitted from the power device mounted on the insulating substrate is diffused in the surface direction of the heat transfer layer and transferred to the heat radiating substrate. Heat transfer to the radiating fin is improved.
  • the heat dissipation board is formed of a high thermal conductivity material such as aluminum, for example, and its linear expansion coefficient is larger than that of the insulating substrate, so the degree of thermal expansion of the heat dissipation substrate is higher than that of the insulating substrate. As a result, the degree of thermal contraction of the heat dissipation substrate becomes larger than that of the insulating substrate. For this reason, when the insulating substrate and the heat dissipation substrate thermally contract when cooled to room temperature after the brazing is completed, the heat dissipation substrate is larger than the insulation substrate, and the heat dissipation substrate becomes the insulation substrate. It tries to warp by being pulled by.
  • a restraint plate that restrains the warpage of the heat dissipation board due to the difference in linear expansion coefficient between the insulation board and the heat dissipation board is joined to the surface of the heat dissipation board opposite to the side bonded to the insulating board.
  • the warping of the heat dissipation board is restrained by the restraining plate. Therefore, it is possible to prevent the insulating substrate from being cracked or to peel off at each bonding surface, and the durability is improved.
  • the thermal resistance between the insulating substrate and the heat dissipation substrate is reduced, and the heat dissipation performance is improved.
  • the heat radiating substrate and the restraining plate, and the restraining plate and the heat radiating fin are respectively brazed
  • the insulating substrate and the heat dissipation substrate are thermally expanded and brazed in a thermally expanded state, and after the heating, the insulating substrate and the heat dissipation substrate are thermally contracted.
  • the heat dissipation board is made of a high thermal conductivity material such as aluminum, and its coefficient of linear expansion is larger than that of the insulating board, so the degree of thermal expansion of the heat dissipation board is higher than that of the insulating board.
  • the degree of thermal contraction of the heat dissipation substrate is also larger than that of the insulating substrate.
  • the heat dissipation substrate is pulled by the insulating substrate because the degree of shrinkage is greater in the heat dissipation substrate than in the insulation substrate. Stretched and tries to warp.
  • a restraint plate that restrains the heat dissipation board warpage caused by the difference in linear expansion coefficient between the insulation board and the heat dissipation board is joined to the surface of the heat dissipation board opposite to the side bonded to the insulating board. Therefore, the warping of the heat dissipation board is restrained by the restraining plate. Therefore, it is possible to prevent the insulating substrate from cracking or peeling off at each bonding surface, and the durability is improved.
  • the insulating substrate bonded to one surface of the heat dissipation substrate and the other surface are bonded to each other.
  • the both surfaces of the heat dissipation substrate are pulled almost evenly by the restrained plate. Therefore, it is possible to more reliably prevent the heat dissipation substrate from warping.
  • the insulating substrate and the constraining plate can be made of a ceramic substrate having a general thickness such as aluminum nitride, and the material availability is improved.
  • the heat generated by the power device mounted on the insulating substrate is transferred to the heat radiating fin through the insulating substrate and the heat radiating substrate, and the heat radiating fin force cooling jacket. Heat is dissipated to the coolant flowing inside. Therefore, the heat dissipation performance is relatively excellent.
  • the heat transfer layer of the insulating substrate and the heat dissipation substrate, the heat dissipation substrate and the restraint plate, and the restraint plate and the heat dissipation plate When the fins are brazed, or as in the case of the power module base in 6) above, the insulating substrate and the heat dissipation substrate, the heat dissipation substrate and the restraint plate, and the restraint plate and the heat dissipation fin will each be If attached, the cooling jacket can be brazed to the heat dissipation board simultaneously with these brazings, so that the fixing operation of the cooling jacket is simplified.
  • the heat dissipation substrate and the restraint plate, and the restraint plate and the heat dissipation fin are brazed, as in the method for manufacturing the power module base of 16) and 17) above.
  • the insulating substrate and the heat dissipation substrate are thermally expanded and brazed in a thermally expanded state, and after the heating is completed, the insulating substrate and the heat dissipation substrate are thermally contracted.
  • the heat dissipation board is made of a highly thermally conductive material such as aluminum, and its coefficient of linear expansion is larger than that of the insulating board.
  • the degree of thermal expansion of the heat dissipation board is larger than that of the insulating board.
  • the degree of thermal contraction of the heat dissipation substrate is also larger than that of the insulating substrate.
  • the insulation substrate and heat dissipation substrate heat shrink when cooled to room temperature after brazing.
  • the degree of shrinkage is larger in the heat dissipation substrate than in the insulating substrate, and the heat dissipation substrate is pulled by the insulating substrate and tends to warp.
  • the cooling jacket is brazed to the heat dissipation board at the same time as the insulating board and the heat dissipation board, the heat dissipation board and the restraint plate, and the restraint plate and the heat dissipation fin are brazed. Since it can be attached, the fixing work of the cooling jacket becomes easy.
  • FIG. 1 the upper side of FIG. 1 is referred to as the front and the lower side is referred to as the rear, and the upper and lower sides and the left and right sides of FIG.
  • FIG. 1 This embodiment is shown in FIG. 1 and FIG.
  • FIG. 1 shows the overall configuration of the power module using the power module base of Embodiment 1
  • FIG. 2 shows the configuration of the main part thereof.
  • the power module base (1) is joined to the upper surface of the heat dissipation board (2) with a square heat dissipation board (2) long in the front-rear direction and spaced apart in the front-rear direction.
  • Warpage of the heat dissipation substrate (2) due to the difference in the linear expansion coefficient between the insulating substrate (3) and the heat dissipation substrate (2) A restraint plate (4) for restraining the heat sink, a heat dissipating fin (5) joined to the surface of the restraint plate (4) opposite to the side joined to the heat sink substrate (2), and the bottom surface of the heat sink substrate (2) And a cooling jacket (6) fixed so as to cover the radiating fin (5).
  • the heat dissipation substrate (2) is formed of a high thermal conductivity material such as aluminum or copper (including a copper alloy; hereinafter the same), here aluminum.
  • the insulating substrate (3) may be formed with any insulating material force as long as it satisfies the required insulating properties, thermal conductivity, and mechanical strength. For example, a ceramic force is also formed. In this case, aluminum oxide, aluminum nitride, silicon nitride or the like is used.
  • the thickness of the insulating substrate (3) is preferably 0.1 to Lmm.
  • a wiring layer (7) is provided on the upper surface of the insulating substrate (3), and a heat transfer layer (8) is provided on the lower surface.
  • the wiring layer (7) is made of a metal such as aluminum or copper having excellent conductivity, but has high electrical conductivity, high deformability, and high strength and excellent solderability with semiconductor elements. Preferably, it is made of pure aluminum.
  • the heat transfer layer (8) is made of a metal such as aluminum or copper with excellent thermal conductivity, but has a high thermal conductivity, high deformability, high purity and excellent wettability with the brazing filler metal. It is preferable to be made of high purity aluminum.
  • the wiring layer (7) and the heat transfer layer (8) are preferably formed of the same material.
  • the heat transfer layer (8) is brazed to the heat dissipation substrate (2). Insulating substrate (3) provided with wiring layer (7) and heat transfer layer (8) in advance includes DBA (Direct Brazed Aluminum, registered trademark) substrate, DBC (Direct Bonded Copper, registered trademark) substrate, etc. Can be used.
  • the constraining plate (4) may be formed of any material force as long as the linear expansion coefficient and Young's modulus are the same as those of the insulating substrate (3). Ceramic, Invar alloy, electromagnetic soft iron, etc. Formed from. When ceramic force is also formed, aluminum oxide, aluminum nitride, silicon nitride, etc. are used. However, it is preferable that the constraining plate (4) is made of the same material as the insulating substrate (3) and has a thickness comparable to that of the insulating substrate (3).
  • the restraint plate (4) is arranged symmetrically with respect to the insulating substrate (3) with the heat dissipation substrate (2) interposed therebetween.
  • the same number of restraining plates (4) as the insulating substrate (3) may be used, or a smaller number of restraining plates (4) than the insulating substrate (3) may straddle multiple insulating substrates (3). May be used.
  • the horizontal dimension is almost the same as that of the insulating substrate (3), and the longitudinal dimension is the front edge of the front insulating substrate (3) and the rear edge of the rear insulating substrate (3).
  • a restraining plate (4) that is substantially the same as the distance.
  • the radiating fin (5) is made of a highly heat conductive material such as aluminum or copper, here aluminum, and includes a wave crest, a wave bottom, and a connecting portion that connects the wave crest and the wave bottom.
  • the corrugated shape is brazed to the restraining plate (4) with the wave crest portion and the wave bottom portion oriented in the longitudinal direction.
  • the same number of heat dissipation fins (5) as the restraint plate (4) are brazed to each restraint plate (4).
  • a smaller number of radiating fins (5) than the restraining plate (4) are brazed across the plurality of restraining plates (4).
  • the cooling jacket (6) has a box-like shape as a whole, and a heat radiating fin housing portion (11) that is surrounded by the peripheral wall (9) and that opens upward is provided therein.
  • the coolant inlet pipe (12) is connected to the front wall of the peripheral wall (9) of the cooling jacket (6), and the coolant outlet pipe (13) is connected to the rear wall of the radiator fin housing (11). Connected by welding, etc.
  • a plurality of screw holes (14) are formed in the left and right wall portions of the cooling jacket (6) at intervals in the front-rear direction.
  • the peripheral edge of the heat sink (2) is placed on the peripheral wall (9) of the cooling jacket (6), and the male screw (15) (fastener) passing through the heat sink (2) is screwed into the screw hole (14).
  • the cooling jacket (6) is fixed to the heat radiating board (2) by screwing into the heat radiating fin housing part (11).
  • the upper end opening of 11) is closed by the heat dissipation board (2).
  • a known appropriate sealing means such as an O-ring or gasket is used between the lower surface of the peripheral edge of the heat dissipation substrate (2) and the peripheral wall (9) of the cooling jacket (6). Sealed liquid-tight. Accordingly, the coolant fed into the inlet pipe (12) flows backward through the radiating fin housing portion (11) in the cooling jacket (6), and the outlet pipe (13) force is also sent out.
  • the power module base (1) is manufactured as follows.
  • the heat dissipation substrate (2) is laminated on the surface of the insulating substrate (3) on which the heat transfer layer (8) is provided, and the heat dissipation substrate (2) on the opposite side of the insulating substrate (3).
  • the restraint plate (4) is laminated on the surface, and the heat dissipating fins (5) are placed on the surface of the restraint plate (4) opposite to the heat dissipating substrate (2).
  • a sheet-like aluminum brazing material made of an Al—Si alloy, an Al—Si—Mg alloy, or the like is interposed between the two.
  • the insulating substrate (3), the heat radiating substrate (2), the restraint plate (4), and the heat radiating fin (5) are temporarily fixed by an appropriate means, and an appropriate load is applied to the joint surface in a vacuum atmosphere. Or by heating to 570-600 ° C in an inert gas atmosphere, release from the heat transfer layer (8) of the insulating substrate (3).
  • the thermal substrate (2), the heat dissipation substrate (2) and the restraint plate (4), and the restraint plate (4) and the heat dissipation fin (5) are brazed at the same time. Thereafter, the cooling jacket (6) is fixed to the heat dissipation substrate (2). In this way, the base for the module (1) is manufactured.
  • the insulating substrate (3), the wiring layer (7), the heat transfer layer (8), the heat radiating substrate (2), and the restraint plate (4) are thermally expanded and heated. They are brazed in the expanded state, and after heating, they shrink by heat.
  • the degree of thermal expansion of the heat radiating board (2) is larger than that of the insulating board (3) and the restraining board (4). It becomes larger than (4). For this reason, if the insulation substrate (3) and the heat dissipation substrate (2) are thermally shrunk when cooled to room temperature after brazing is completed, the degree of shrinkage is greater for the heat dissipation substrate (2) than for the insulation substrate (3).
  • the heat dissipation substrate (2) When there is no restraint plate (4), the heat dissipation substrate (2) will be pulled by the insulating substrate (3) and will try to warp. However, on the opposite side of the heat dissipation substrate (2) bonded to the insulating substrate (3), the heat dissipation substrate (3) and the heat dissipation substrate (2) are caused by the difference in coefficient of linear expansion between the insulating substrate (3) and the heat dissipation substrate (2). Since the restraint plate (4) that restrains the warpage of 2) is joined, the warp of the heat dissipation substrate (2) is restrained by the restraint plate (4). Therefore, it is possible to prevent the insulating substrate (3) from being cracked or peeled off at each joint surface, and the durability is improved.
  • the power device is mounted by attaching the power device (P) on the wiring layer (7) of the insulating substrate (3), for example, by soldering. Is configured.
  • This power module is applied to, for example, an inverter circuit of a hybrid car that uses an electric motor as a part of a drive source, and controls the electric power supplied to the electric motor in accordance with the driving situation.
  • the heat generated by the power device (P) is generated by the wiring layer (7), the insulating substrate (3), the heat transfer layer (8), the heat dissipation substrate (2), and the restraint plate (4). Then, the heat is transmitted to the heat radiating fin (5) and radiated from the heat radiating fin (5) to the coolant flowing through the heat radiating fin housing (11) in the cooling jacket (6).
  • the heat dissipation substrate (2) is heated to a high temperature (for example, about 150 ° C) by the heat generated by the power device (P) force, so if there is no restraint plate (4), the heat dissipation substrate (2) Due to the difference in thermal expansion between the heat sink and the insulating substrate (3), the heat radiating substrate (2) is pulled by the insulating substrate (3) and tends to warp. However, due to the difference in coefficient of linear expansion between the insulating substrate (3) and the heat dissipating board (2) on the surface of the heat dissipating substrate (2) opposite to the side bonded to the insulating substrate (3).
  • Restraining plate (4) that restrains warpage of heat sink (2) to be joined Therefore, the warping of the heat dissipation board (2) is restrained by the restraining plate (4). Therefore, it is possible to prevent the insulating substrate (3) from being cracked or peeled off at each joint surface, and the durability is improved.
  • the linear thermal expansion coefficient between the insulating substrate (3) and the heat dissipation substrate (2) Even if the heat dissipation substrate (2) contracts and warps under the restraint of the insulating substrate (3) due to the difference, the warp of the heat dissipation substrate (2) is restrained by the restraint plate (4). Accordingly, it is possible to prevent the insulating substrate (3) from being cracked or to peel off at each bonding surface, and the durability is improved.
  • the case where the power module is left for a long time in a low-temperature environment is, for example, the case where the power module is used for a long time outdoors in the winter in a hybrid car.
  • the heat transfer layer (8) and the heat dissipation substrate (2) of the circuit board, the heat dissipation substrate (2) and the restraint plate (4), and the restraint plate (4) and Joining to the heat dissipating fin (5) is performed by brazing, but it may be performed by bonding using an adhesive instead.
  • the heat transfer layer (8) is not formed on the lower surface of the insulating substrate (3), and the insulating substrate (3) is directly connected to the heat dissipation substrate (2 ) Is brazed. This brazing is performed, for example, in the same manner as in the first embodiment. Other configurations are the same as those in the first embodiment.
  • the insulating substrate (3) and the heat radiating substrate (2), the heat radiating substrate (2) and the constraining plate (4), and the constraining plate (4) and the radiating fin (5 )) By bonding with an adhesive.
  • the cooling jacket (6) is fixed to the heat dissipation board (2) by the male screw (15) (fastener) screwed into the screw hole (14).
  • the cooling jacket (6) may be fixed to the heat dissipation substrate (2) by brazing. In this case, the cooling jacket (6) and the heat dissipation substrate (2) are brazed simultaneously with the brazing of the other members described above.
  • FIG. [0073] In the case of the power module base (25) of Embodiment 3, the restraint plate (4) is embedded in a recess (26) formed in the lower surface of the heat dissipation substrate (2). The lower surface of the restraint plate (4) and the lower surface of the heat dissipation board (2) are flush with each other.
  • the radiating fin (5) has a horizontal dimension that is approximately equal to the horizontal width of the radiating board (2) .
  • the radiating fin (5) is located on the lower surface of the restraint plate (4) and the lower surface of the radiating board (2). It is brazed to the left and right sides of the recess (26). Further, the cooling jacket (6) is not fixed to the heat dissipation board (2). Other configurations are the same as those in the first embodiment.
  • the heat radiating fins (5 ) Is sent to the wind.
  • the heat generated by the power device (P) is radiated through the wiring layer (7), insulating substrate (3), heat transfer layer (8), heat dissipation substrate (2), and restraint plate (4). It is transmitted to (5) and is radiated to the wind from the radiating fin (5).
  • the heat transfer layer (8) and the heat dissipation board (2) of the circuit board, the heat dissipation board (2) and the restraint plate (4), and the restraint plate (4) and the heat dissipation fin (5 Bonding with) may be performed by bonding using an adhesive.
  • the heat transfer layer (8) is not formed on the lower surface of the insulating substrate (3), and the insulating substrate (3) is directly connected to the heat dissipation substrate (2 ) Is brazed.
  • Other configurations are the same as those of the third embodiment.
  • the insulating substrate (3) and the heat radiating substrate (2), the heat radiating substrate (2) and the restraint plate (4), and the joint between the restraint plate (4) and the heat radiating fin (5) are adhesives. It may be performed by bonding using
  • the restraint plate (4) is embedded in a recess (26) formed in the lower surface of the heat dissipation substrate (2), and the heat dissipation substrate (2)
  • the recess (26) is not necessarily required.
  • a part of the force restricting plate (4) of the radiating fin (5) may be cut out so as to be accommodated.
  • the power module base of the present invention constitutes a power module including a power device, and is preferably used for efficiently radiating heat generated from a semiconductor element.
  • FIG. 1 is a plan view showing a power module including a power module base according to Embodiment 1 of the present invention.
  • FIG. 2 is an enlarged sectional view taken along line II-II in FIG.
  • FIG. 3 is a cross-sectional view corresponding to FIG. 2 and showing a power module including a power module base according to Embodiment 2 of the present invention.
  • FIG. 4 is a cross-sectional view corresponding to FIG. 2, showing a power module including a power module base according to Embodiment 3 of the present invention.
  • FIG. 5 is a cross-sectional view corresponding to FIG. 2 and showing a power module including a power module base according to Embodiment 4 of the present invention.

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Ceramic Engineering (AREA)
  • Materials Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

L'invention concerne une base (1) pour un bloc de puissance comprenant un substrat de dissipation thermique (2) constitué d'un matériau à haute conductibilité thermique, un substrat isolant (3) lié à un côté du substrat de dissipation thermique (2), et une couche de câblage (7) disposée sur le côté du substrat isolant (3) à l'opposé du côté lié au substrat de dissipation thermique (2). La base (1) pour un bloc de puissance est en outre équipée d'une plaque de restriction (4) liée à l'autre côté du substrat de dissipation thermique (2) afin de restreindre le gauchissement du substrat de dissipation thermique (2) dû à la différence des coefficients de dilatation linéiques entre le substrat isolant (3) et le substrat de dissipation thermique (2), et une ailette de dissipation thermique (5) liée au côté de la plaque de restriction (4) à l'opposé du côté lié au substrat de dissipation thermique (2). Avec une telle base (1) pour un bloc de puissance, la durabilité peut être améliorée tout en empêchant la diminution de la performance de dissipation thermique.
PCT/JP2006/325271 2006-12-19 2006-12-19 Base pour un bloc de puissance, procédé de production d'une base pour un bloc de puissance et bloc de puissance WO2008075409A1 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
PCT/JP2006/325271 WO2008075409A1 (fr) 2006-12-19 2006-12-19 Base pour un bloc de puissance, procédé de production d'une base pour un bloc de puissance et bloc de puissance

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Application Number Priority Date Filing Date Title
PCT/JP2006/325271 WO2008075409A1 (fr) 2006-12-19 2006-12-19 Base pour un bloc de puissance, procédé de production d'une base pour un bloc de puissance et bloc de puissance

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EP2224481A1 (fr) * 2009-02-04 2010-09-01 Kabushiki Kaisha Toyota Jidoshokki Dispositif semi-conducteur
EP2141740A3 (fr) * 2008-07-04 2010-12-01 Kabushiki Kaisha Toyota Jidoshokki Dispositif semi-conducteur
WO2011030754A1 (fr) * 2009-09-09 2011-03-17 三菱マテリアル株式会社 Procédé de production de substrat pour module de puissance à dissipateur thermique, substrat pour module de puissance à dissipateur thermique et module de puissance
JP2012199452A (ja) * 2011-03-23 2012-10-18 Dowa Metaltech Kk 金属−セラミックス接合基板およびその製造方法
JP2014082466A (ja) * 2012-09-27 2014-05-08 Dowa Metaltech Kk 放熱板およびその製造方法
US20140318831A1 (en) * 2011-12-12 2014-10-30 Mitsubishi Materials Corporation Power module substrate, power module substrate with heat sink, power module, paste for forming flux component intrusion-preventing layer and method for bonding bonded body
US20160111345A1 (en) * 2013-08-29 2016-04-21 Mitsubishi Electric Corporation Semiconductor module, semiconductor device, and vehicle
CN106469696A (zh) * 2015-08-19 2017-03-01 Acp动力公司 功率半导体的封装和冷却装置
DE102016125348B4 (de) 2016-12-22 2020-06-25 Rogers Germany Gmbh Trägersubstrat für elektrische Bauteile und Verfahren zur Herstellung eines Trägersubstrats

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JP2012199452A (ja) * 2011-03-23 2012-10-18 Dowa Metaltech Kk 金属−セラミックス接合基板およびその製造方法
US20140318831A1 (en) * 2011-12-12 2014-10-30 Mitsubishi Materials Corporation Power module substrate, power module substrate with heat sink, power module, paste for forming flux component intrusion-preventing layer and method for bonding bonded body
JP2014082466A (ja) * 2012-09-27 2014-05-08 Dowa Metaltech Kk 放熱板およびその製造方法
US20160111345A1 (en) * 2013-08-29 2016-04-21 Mitsubishi Electric Corporation Semiconductor module, semiconductor device, and vehicle
DE112013007390B4 (de) 2013-08-29 2020-06-25 Mitsubishi Electric Corporation Halbleitermodul, Halbleitervorrichtung und Fahrzeug
US11239123B2 (en) * 2013-08-29 2022-02-01 Mitsubishi Electric Corporation Semiconductor module, semiconductor device, and vehicle
CN106469696A (zh) * 2015-08-19 2017-03-01 Acp动力公司 功率半导体的封装和冷却装置
DE102016125348B4 (de) 2016-12-22 2020-06-25 Rogers Germany Gmbh Trägersubstrat für elektrische Bauteile und Verfahren zur Herstellung eines Trägersubstrats

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