WO2008072877A1

WO2008072877A1 - Probing tester and testing method for a wafer using the same

Info

Publication number: WO2008072877A1
Application number: PCT/KR2007/006435
Authority: WO
Inventors: Meang Kwon Kim; Jeon Ho Jin; Ki Uk Choi; Su Hyun Choi
Original assignee: Secron Co., Ltd.
Priority date: 2006-12-15
Filing date: 2007-12-11
Publication date: 2008-06-19
Also published as: TW200834079A; TWI363180B

Abstract

Disclosed herein are a probing tester and a testing method for a wafer using the same. The probing tester includes a chuck, a plurality of supporting pins, and a vacuum device. The chuck is configured such that a wafer is seated thereon, and is provided with a plurality of through- holes, which pass through the chuck vertically with respect to the upper surface thereof. The supporting pins are located under the chuck, are provided with vacuum holes, which formed from upper to lower ends thereof, and are provided at locations respectively corresponding to the plurality of through-holes. The vacuum device is configured to form a vacuum state inside the plurality of vacuum holes such that the wafer is drawn to and held on the upper ends of the plurality of supporting pins.

Description

PROBING TESTER AND TESTING METHOD FOR A WAFER

USING THE SAME

Technical Field

[1] The present invention relates to a probing tester for testing wafers and a testing method for a wafer using the same and, more particularly, to the probing tester for testing wafers and the testing method for a wafer using the same, which can improve the accuracy with which a wafer is seated on a chuck, can prevent the wafer from being damaged due to the unstable operation of a plurality of supporting pins, and can reduce a test cycle period. Background Art

[2] Generally, in a process of manufacturing a semiconductor device, only functional chips, and not defective chips, must be selected from among semiconductor chips fabricated on a wafer in a step of assembling a semiconductor device. Accordingly, it is important to determine whether semiconductor chips fabricated on a wafer are functional or defective. For this purpose, probing testers for testing whether semiconductor chips, which are fabricated on a wafer, are functional or defective by bringing probes into contact with the semiconductor chips are widely used.

[3] The probing tester determines whether individual semiconductor chips, which are fabricated on a wafer, are functional or defective by electrically testing the individual semiconductor chips using a probe card. Accordingly, in order to assure the accuracy of testing of the probing tester, the probes of the probe card must accurately come into contact with the respective electrodes of the individual semiconductor chips.

[4] Meanwhile, the conventional probing tester, as shown in FIGS. 1 and 2, includes a chuck 10, in which a wafer W is seated, and a tester unit 20, on which a probe card is mounted. A plurality of supporting pins 12, which is installed under the chuck 10, is configured to protrude upwards from the chuck 10 through a plurality of through-holes 11 provided in the chuck 10. Furthermore, the probing tester includes a raising and lowering unit 30, which raises and lowers both the chuck 10 and the plurality of supporting pins 12.

[5] In the probing tester, a process of bringing the probes 21 of the probe card into contact with the electrodes of semiconductor chips fabricated on the wafer W is as follows.

[6] First, the supporting pins 12 are raised, and protrude upwards from the chuck 10 through the respective through-holes 11. Thereafter, the wafer W is carried in so as to be supported by the raised supporting pins 12. Subsequently, the plurality of supporting pins 12 is lowered, and the wafer W is seated on the upper surface of the chuck 10. Thereafter, the chuck 10 is raised by the raising and lowering unit 30, and thus the probes 21 of the probe card, which is mounted over the chuck 10, come into contact with the electrodes of the semiconductor chips fabricated on the wafer W.

[7] In this case, the probes 21 of the probe card must be accurately brought into contact with the respective electrodes of the individual semiconductor chips, as described above. For this purpose, the wafer W must be aligned with the center of the chuck 10 when seated.

[8] In the conventional probing tester, described above, as shown in FIG. 2, the supporting pins 12 are raised by a link 40 having a cantilever structure, which is operated using a link drive unit (not shown).

[9] Here, the conventional probing tester has a complicated link structure in which all of the supporting pins 12 are operated in conjunction with the operation of the single link 40, so that, when the supporting pins 12 are operated to be raised and lowered, a large operation error may occur, or some malfunction may occur. That is, a problem occurs in that the supporting pins 12 are raised and lowered with different idle clearances and at different speeds because the link 40 is connected with the supporting pins 12 via a plurality of members.

[10] Accordingly, the conventional probing tester is problematic in that the operation error, which occurs because the wafer W slides from the upper ends of the supporting pins 12 due to the different idle clearances and the ascending and descending speeds between the supporting pins 12, is increased, and thus the accuracy with which the wafer W, carried on the upper end thereof, is seated on the upper surface of the chuck 10 is lowered.

[11] Furthermore, there is the case where the wafer W is damaged because the wafer W slides from the upper ends of the supporting pins 12 or because the wafer W falls due to the malfunction of a link structure, which occurs occasionally. Furthermore, in the case where a large operation error occurs or some malfunction occurs, the probing tester generates an error signal and the operation thereof is interrupted, and thus wafer testing is delayed.

[12] Accordingly, the conventional probing tester has a structure in which the stability thereof is low, as described above, so that the ascending and descending speed of the supporting pins 12 cannot be increased due to concern about the movement and sliding of the wafer W. Furthermore, in the case where the wafer W slides or falls, the probing tester generates an error signal and interrupts the operation thereof, and thus wafer testing is delayed. Accordingly, the conventional probing tester is problematic in that the wafer test cycle period is increased. Disclosure of Invention

Technical Problem

[13] A purpose of the present invention is providing a probing tester and a testing method for a wafer using the same, which can improve the accuracy with which a wafer is seated on the upper surface of a chuck, can prevent the wafer from being damaged due to the unstable operation of the supporting pins, and can improve the productivity of the probing tester per unit time by shortening the wafer test cycle period. Technical Solution

[14] The probing tester may further include a supporting pin supporter configured such that the plurality of supporting pins is fixedly coupled thereto, and a chuck raising and lowering unit for raising and lowering the chuck relative to the plurality of supporting pins.

[15] The supporting pin supporter may further include a connection hole that communicates with the plurality of vacuum holes and is connected to the vacuum device.

[16] The through-holes may be located at an identical distance from the center of the chuck, and may be provided in three or more radial directions, which are spaced apart from each other at regular angles, from the center of the chuck.

[17] The chuck raising and lowering unit may include a support frame for supporting and fastening the supporting pin supporter, a ball screw located under and connected to the supporting pin supporter, with bearings therebetween, a rotational guide member engaged with the ball screw and configured to raise or lower in conjunction with the rotation of the ball screw, one or more connection frames for connecting the rotational guide member with the chuck, and a drive unit for rotating the ball screw.

[18] The probing tester may further include a supporting pin supporter configured such that the plurality of supporting pins is fixedly coupled thereto, and a supporter raising and lowering unit for raising and lowering the supporting pin supporter relative to the chuck.

[19] The supporter raising and lowering unit may include a support member coupled under the supporting pin supporter, a rack gear provided in the longitudinal direction of the support member, a pinion gear engaged with the rack gear, and a motor coupled with the central shaft of the pinion gear.

[20] The probing tester may further include heat insulating members that are provided in the supporting pins or the supporting pin supporter.

[21] The probing tester may further include a chuck raising and lowering unit that raises or lowers the chuck relative to the plurality of supporting pins.

[22] The testing method may further include a step of causing the wafer to be drawn to and held on the upper ends of the plurality of supporting pins by operating a vacuum device, wherein the vacuum device is configured such that the operation thereof is stopped when the wafer is seated on the upper surface of the chuck.

Advantageous Effects

[23] As described above, in accordance with the probing tester of the present invention and the testing method for a wafer using the same, the supporting pins are fixedly coupled with the supporting pin supporter, so that the supporting pins can stably support a wafer.

[24] Furthermore, the wafer is drawn to and held on the upper ends of the supporting pins by the vacuum holes, which are formed in the supporting pins, and the vacuum device, so that the wafer can be prevented from sliding from the upper ends of the supporting pins. Accordingly, the accuracy with which the wafer is seated on the upper surface of the chuck can be improved.

[25] Furthermore, the supporting pins stably support the wafer as described above, so that damage to the wafer attributable to the unstable operation of the supporting pins can be prevented.

[26] In addition to ensuring the stability of the supporting pins, the operation speed of the plurality of supporting pins, which are used to seat the wafer on the chuck, can be increased, and thus the wafer test cycle time can be reduced. Accordingly, the productivity of the probing testerper unit time can be increased. Brief Description of the Drawings

[27] FIG. 1 is a side view of a conventional probing tester

[28] FIG. 2 is a cut away perspective view of the conventional probing tester

[29] FIG. 3 is a partially cut away perspective view of the probing tester according to a first embodiment of the present invention;

[30] FIG. 4 is a partially cut away perspective view showing the state in which the chuck of the probing testeraccording to the first embodiment of the present invention is raised

[31] FIG. 5 is a rear view of the probing tester according to the first embodiment of the present invention

[32] FIG. 6 is a front view schematically showing the operation in which the probing tester according to the first embodiment of the present invention seats a wafer in the chuck or separates the wafer from the chuck;

[33] FIG. 7 is a flowchart illustrating a testing method for a wafer using the probing tester according to the first embodiment of the present invention

[34] FIG. 8 is a partially cut away perspective view of a probing tester according to a second embodiment of the present invention

[35] FIG. 9 is a partially cut away perspective view showing the state in which the supporting pin supporterof the probing tester according to the second embodiment of the present invention is descended; [36] FIG. 10 is a front view schematically showing the operation in which the probing testeraccording to the second embodiment of the present invention seats a wafer in a chuck or separates the wafer from the chuck; and [37] FIG. 11 is a flowchart illustrating a testing method for a wafer using the probing tester according to the second embodiment of the present invention. [38] "&^■ Description of characters of principal elements ~k

[39] 100, 100': chuck 110, 110': through-holes

[40] 200, 200': supporting pin supporter

[41] 210, 210': supporting pins

[42] 211, 211': vacuum holes 212: vacuum device

[43] 213: heat insulating members 220, 220': connection holes

[44] 230, 230': airtight members

[45] 300: chuck raising and lowering unit

[46] 310: support frame 320: ball screw

[47] 330: rotational guide member 340: connection frames

[48] 350: drive unit 351 : drive motor

[49] 352: driving pulley 353: driven pulley

[50] 354: belt 360: chuck guide part

[51] 400: supporter raising and lowering unit

[52] 410: support member 420: rack gear

[53] 430: pinion gear 440: motor

[54] 450: supporter guide part 451 : guide protrusion

[55] 452: guide table W: wafer

Mode for the Invention [56] Embodiments of the present invention are described in detail below with reference to the accompanying drawings so that the embodiments can be readily implemented by a person having ordinary knowledge in the art to which the present invention pertains.

However, the present invention may be implemented in various ways, and is not limited to the embodiments described herein. [57] The construction and operation of a probing tester according to the first embodiment of the present invention are described in detail with reference to FIGS. 3 to 6 below. [58] As shown in FIG. 3, the probing tester according to the first embodiment of the present invention includes a chuck 100, a supporting pin supporter 200, and a chuck raising and lowering unit 300. [59] The chuck 100 is configured such that a wafer W is seated thereon so as to be brought into contact with the probes of a probe card, and raises and lowers the seated wafer W. A plurality of through-holes 110, passing though the chuck 100 vertically with respect to the upper surface thereof, is formed in the chuck 100.

[60] The through-holes 110 function as paths which enable a plurality of supporting pins

210, which will be described later, to pass therethrough and protrude upwards from the upper surface from the chuck 100. The through-holes 110 are located at identical distances from the center of the chuck 100, and are formed in respective radial directions, which are spaced apart from each other at regular angles, from the center of the chuck 100. Three through-holes 110 are preferably formed, but the number of through-holes is not limited to three.

[61] The supporting pin supporter 200 is responsible for synchronizing the motion of respective supporting pins 210 so that the wafer W can be stably seated on the upper surface of the chuck 100. The supporting pins 210are provided in the supporting pin supporter 200 at locations corresponding to the respective through-holes 110. Accordingly, the supporting pins 210 are inserted into respective through-holes 110 and passthrough the chuck 100, thus protruding upwards from the upper surface of the chuck 100.

[62] The supporting pins 210 are fixedly coupled to the supporting pin supporter 200, and are always maintained parallel to each other, so that the motion thereof is stable. That is, the motion of the supporting pins 210 is synchronized by the supporting pin supporter 200, and thus stability can be ensured.

[63] The supporting pins 210 support the carried-in wafer W in the state in which the pins protrude upwards from the upper surface of the chuck 100. Accordingly, a gap, which corresponds to the height of the pins 210 protruding from the upper surface of the chuck 100, is formed between the wafer W and the upper surface of the chuck 100. This gap enables a carriage unit (not shown in the drawing), which is used to carry the wafer in and out, to be safely moved therethrough.

[64] The supporting pins 210 may include a plurality of vacuum holes 211 that are formed from upper to lower ends thereof. The plurality of vacuum holes 211 is connected to a vacuum device 212. The vacuum device 212 forms a vacuum state inside the plurality of vacuum holes 211, and causes the wafer W to be drawn to and held on the upper ends of supporting pins 210. Accordingly, the supporting pins 210 can more stably support the wafer W until the wafer W is seated on the upper surface of the chuck 100.

[65] As described above, the supporting pins 210 are coupled to the supporting pin supporter 200. In this case, in order to prevent air in the vacuum holes 211, which are formed in respective supporting pins 210, from leaking from connection portions with the supporting pin supporter 200 to the outside, sealing members 230 may be ad- ditionally provided, as shown in FIG. 3.

[66] Furthermore, the supporting pin supporter 200 may further include a connection hole 220, which communicates with the vacuum holes 211 and is connected to the vacuum device 212. The connection hole 220 enables the integration of the vacuum holes 21 lwith the connection paths of the vacuum device 212, so that the construction of the equipment can be simplified, by which the stability of the supporting pins 210 can be increased. That is, the vacuum holes 211 are connected to the vacuum device 212 via a single connection hole 220.

[67] Here, the vacuum device 212 may be implemented using the equipment of a vacuum device, which is provided to cause the wafer W, seated on the upper surface of the chuck 100, to be drawn to and held on the upper surface of the chuck 100.

[68] Meanwhile, the above-described chuck raising and lowering unit 300 raises or lowers the chuck 100 relative to the supporting pins 210. The chuck raising and lowering unit 300, as shown in FIGS. 3 to 5, includes a support frame 310, a ball screw 320, a rotational guide member 330, connection frames 340, a drive unit 350, and a chuck guide part 360.

[69] The support frame 310 supports and fastens the supporting pin supporter 200, thus enabling the supporting pins 210 to stably support the wafer W. The support frame 310 is not necessarily limited to a frameform, and may be implemented in various ways using any member that can support and fasten the supporting pin supporter200.

[70] The ball screw 320 rotates in response to rotational force received from the drive unit 350. The ball screw 320 is located under and connected to the supporting pin supporter 200, with bearings therebetween, and is provided so as to be able to rotate freely relative to the supporting pin supporter 200. Accordingly, the supporting pin supporter 200 is fastened by the support frame 310 even though the ball screw 320 rotates, so that the stability with which the wafer W is supported by the supporting pins 210 is ensured.

[71] The rotational guide member 330 includes a ball screw nut, which is engaged with the ball screw 320 and converts the rotational motion of the ball screw 320 into rectilinear motion. That is, the rotational guide member 330 is engaged with the ball screw 320 and ascends or descends in response to the rotation of the ball screw 320.

[72] The connection frames 340 are provided such that the rotational guide member 330 can be connected with the chuck 100. However, the connection frames 340 are not necessarily limited to the form of a frame, and may be implemented in various ways using any member that can connect the rotational guide member 330 with the chuck 100. For example, the connection frames 340 may be implemented in the form of a connection plate. In the probing tester according to the first embodiment of the present invention, four connection frames 340 are provided,but a single connection frame may be provide according to the form thereof.

[73] The rotational guide member 330 and the chuck 100 are connected by the connection frames 340, and thus the ascending and descending motion of the rotational guide member 330 causes the ascent and descent of the chuck 100.

[74] The drive unit 350 supplies rotational power for rotating the ball screw 320. The drive unit 350, as shown in FIG. 5, includes a drive motor 351, a driving pulley 352, a driven pulley 353, and a belt 354.

[75] The drive motor 351 generates power for the rotation of the driving pulley 352, which will be described later.Preferably, the drive motor 351 is implemented using a stepping motor in order to accurately operate the chuck raising and lowering unit 300.

[76] The driving pulley 352 is coupled with the rotational shaft of the drive motor 351, and is rotated by the power received from the drive motor 351.

[77] The driven pulley 353 receives rotational force from the driving pulley 352 through the belt 354. Furthermore, the driven pulley 353 is coupled to the lower end of the ball screw 320, and causes the ball screw 320 to rotate by transmitting the received rotational force to the ball screw 320.

[78] The belt 354 transmits the rotational forceof the driving pulley 352, which is operated by the drive motor 351, to the driven pulley 353. The belt 354may be made of material that can prevent slippage from drive and driven pulleys 352 and 353, or may alternatively include such material.

[79] The chuck guide part 360 guides the chuck 100 so that the chuck 100 can be raised and lowered. The chuck guide part 360 of the probing tester according to the first embodiment of the present invention, as shown in FIG. 4, may be provided in such a way that protrusions 361 having a predetermined size or depressions 362 having a predetermined depth are formed on or in each of the connection frames 340. Alternatively, the chuck guide part 360 may be provided in the rotational guide member 330.

[80] A testing method for a wafer using the probing tester according to the first embodiment of the present invention is described with reference to FIGS. 6 and 7 below.

[81] First, when the chuck 100 is located below the probe card at step slOO, the chuck

100 is lowered by the chuck raising and lowering unit 300, and thus the supporting pins 210 protrude upwards from the upper surface of the chuck 100 through the respective through-holes 110 at step sl20. Thereafter, in order to support the wafer Wusing the supporting pins 210, the wafer W is carried in and placed on the upper ends of the protruding supporting pins 210 by a separate carriage unit at step sl40.

[82] Subsequently, the vacuum device 212 operates, and thus the wafer W is drawn to and held on the upper ends of the supporting pins 210 at step si 60. Thereafter, the chuck 100 is primarily raised by the chuck raising and lowering unit 300 and the operation of the vacuum device 212 is stopped, and thus the wafer Wis seated on the upper surface of the chuck 100 at step si 80. When the chuck 100 is raised in this manner, the supporting pins 210 are lowered relative to the chuck 100, and thus the wafer Wis seated on the upper surface of the chuck 100, as shown in FIG. 6.

[83] Thereafter, the chuck 100 is secondarily raised by the chuck raising and lowering unit 300, and thus the probes of the probe card, which is mounted over the chuck 100, are brought into contact with the electrodes of semiconductor chips fabricated on the wafer W, at step s200.

[84] Thereafter, a test is performed on the semiconductor chips fabricated on the wafer at step s220. When the test is completed, the chuck 100 is primarily lowered, and thus the probes of the probe card are spaced apart from the wafer W at step s240. Subsequently, the chuck 100 is secondarily lowered and the supporting pins 210 protrude upwards from the chuck 100, and thus the wafer W is separated from the upper surface of the chuck 100 at step s260.

[85] Thereafter, the wafer W is carried off of the upper ends of the plurality of supporting pins 210 by the separate carriage unit, at step s280.

[86] The construction and operation of a probing tester according to a second embodiment of the present invention is described in detail with reference to FIGS. 8 to 10 below. The construction of the probing tester according to the second embodiment of the present invention is the same as that of the probing tester according to the first embodiment of the present invention, except for a supporter raising and lowering unit 400 and heat insulating members 213. Accordingly, a description of the present embodiment focused on the supporter raising and lowering unit 400 and the heat insulating members 213 of the probing tester according to the second embodiment of the present invention is given below.

[87] The supporter raising and lowering unit 400 raises a supporting pin supporter 200' relative to a chuck 100.' The supporter raising and lowering unit 400, as shown in FIGS. 8 and 9, includes a support member 410, a rack gear 420, a pinion gear 430, a motor 440, and a supporter guide part 450.

[88] The support member 410 is coupled under the supporting pin supporter 200,' and supports the supporting pin supporter 200.' The support member 410 is preferably implemented in a single frame form or in a shaft form, but the present invention is not limited thereto.

[89] The rack gear 420 is provided in a longitudinal direction with respect to the outer circumferential surface of the support member 410, and converts the rotational motion of the motor 440 into the rectilinear motion of the support member 410. In order to more stably raise and lower the support member 410, a pair of rack gears 420, which are symmetrical with respect to the support member 410, may be provided. [90] The pinion gear 430 is rotated by power received from the motor 440, and transmits the rotational force to the rack gear 420. The number of pinion gears 430 may be the same as the number of rack gears 420 so that they correspond to respective rack gears 420.

[91] The motor 440 supplies power for raising the support member 410. The number of motors 440 may be the same as the number of pinion gears 430 so that they correspond to respective pinion gears 430.

[92] The supporter guide part 450 is mounted to the support member 410, thus enabling the supporting pin supporter 200' to be stably raised and lowered. The supporter guide part 450 includes a guide protrusion 451, which is provided in the support member 410, and a guide table 452, which has a guide depression formed therein. The support member 410 can perform ascending and descending motion more stably thanks to the guide table 452, which is fastened so that it does not move.

[93] Meanwhile, the above-described heat insulating members 213interrupts heat, which is radiated from the support member 410, so that it is not transmitted to the supporting pins 210,' with the result that the accuracy with which the wafer W is seated on the upper surface of the chuck 100' can be improved.

[94] In greater detail, the heat that is radiated from the supporter raising and lowering unit 400 is transmitted to the support member 410. This heat may be transmitted to the supporting pins 210.' When the temperature of the supporting pins 210,' which is used to support the wafer W, is increased, the probability of the wafer W sliding from the supporting pins 210' is increased. Accordingly, in the case where the heat insulating members 213 interrupt the transmission of heat, the accuracy with which the wafer W is seated on the upper surface of the chuck 100' can be improved.

[95] Preferably, the heat insulating members 213 are provided in the respective lower ends of the supporting pins 210' along with airtight members 230,' as shown in FIG. 8. However, the heat insulating members 213 may be separately provided in the supporting pin supporter 200.'

[96] A testing method for a wafer using the probing tester according to the second embodiment of the present invention is described with reference to FIGS. 10 and 11 below.

[97] First, when the chuck 100' is located below the probe card at step s500, the supporting pin supporter 200' is raised by the supporter raising and lowering unit 400, and thus the supporting pins 210'protrude upwards from the upper surface of the chuck 100' through the through-holes 110' at step s520. Thereafter, in order to support the wafer W using the supporting pins 210', the wafer W is carried in and placed on the upper ends of the protruding supporting pins 210' by a separate carriage unit at step s540. [98] Subsequently, a vacuum device 212' operates, and thus the wafer W is drawn to and held on the upper ends of the supporting pins 210' at step s560. Thereafter, as shown in FIG. 10, the supporting pin supporter 200' is lowered by the supporter raising and lowering unit 400, and the operation of the vacuum device 212' is stopped, and thus the wafer W is seated on the upper surface of the chuck 100' at step s580.

[99] Thereafter, the chuck 100' is raised by a separate chuck raising and lowering device, which is not shown, or the probe card, which is mounted over the chuck 100,' is lowered by a separate probe card raising and lowering device, and thus the probes of the probe card are brought into contact with the electrodes of semiconductor chips fabricated on the wafer W at step s600.

[100] Thereafter, a test is performed on the semiconductor chips fabricated on the wafer at step s620. When the test is completed, the chuck 100' is lowered by the chuck raising and lowering device, or the probe card is raised by the probe card raising and lowering device, and thus the probes of the probe card are spaced apart from the wafer W at step s640. Subsequently, the chuck 100' is lowered and the supporting pins 210' protrude upwards from the upper surface of the chuck 100,' and thus the wafer W is separated from the upper surface of the chuck 100,' at step s660.

[101] Thereafter, the wafer W is carried off of the upper ends of the supporting pins 210' by the separate carriage unit, at step s680.

[102] As described above, in accordance with the probing tester of the present invention and the testing method for a wafer using the same, the wafer can be stably supported by fixedly coupling the supporting pins to the supporting pin supporter, and slippage of the wafer from the upper ends of the supporting pins is prevented by causing the wafer to be drawn to and held on the upper ends of the supporting pins using the vacuum holes, which are formed in the supporting pins, and the vacuum device, with the result that the accuracy with which the wafer is seated on the upper surface of the chuck can be improved.

[103] Although only particular embodiments of the present invention have been described in detail above, it will be apparent to those skilled in the art that various variations and modifications are possible within the scope of the technical spirit of the present invention, and it should be appreciated that such modifications and variations are all included in the scope of the accompanying claims. Industrial Applicability

[104] The present invention can provide a probing tester and a testing method for a wafer using the same, which can improve the accuracy with which a wafer is seated on the upper surface of a chuck, can prevent the wafer from being damaged due to the unstable operation of the supporting pins, and can improve the productivity of the probing tester per unit time by shortening the wafer test cycle period.

Claims

[1] A probing tester for testing the semiconductor chips fabricated on a wafer, the probing tester comprising: a chuck configured such that a wafer is seated thereon, and provided with a plurality of through-holes, which pass through the chuck vertically with respect to an upper surface thereof; a plurality of supporting pins located under the chuck, provided with vacuum holes, which formed from upper to lower ends thereof, and provided at locations respectively corresponding to the plurality of through-holes and a vacuum device configured to form a vacuum state inside the plurality of vacuum holes such that the wafer is drawn to and held on the upper ends of the plurality of supporting pins. [2] The probing tester according to claim 1, further comprising: a supporting pin supporter configured such that the plurality of supporting pinsis fixedly coupled thereto; and a chuck raising and lowering unit for raising and lowering the chuck relative to the plurality of supporting pins. [3] The probing tester according to claim 2, wherein the supporting pin supporter further comprises a connection hole that communicates with the plurality of vacuum holes and is connected to the vacuum device. [4] The probing tester according to claim 2, wherein the through-holes are located at an identical distance from a center of the chuck, and are provided in three or more radial directions, which are spaced apart from each other at regular angles, from the center of the chuck. [5] The probing tester according to claim 2, wherein the chuck raising and lowering unit comprises: a support frame for supporting and fastening the supporting pin supporter a ball screw located under and connected to the supporting pin supporter, with bearings therebetween a rotational guide member engaged with the ball screw and configured to raise or lower in conjunctionwith rotation of the ball screw one or more connection frames for connecting the rotational guide member with the chuck and a drive unit for rotating the ball screw. [6] The probing tester according to claim 1, further comprising: a supporting pin supporter configured such that the plurality of supporting pins is fixedly coupled thereto; and a supporter raising and lowering unit for raising and lowering the supporting pin supporter relative to the chuck. [7] The probing tester according to claim 6, wherein the supporter raising and lowering unit comprises: a support member coupled under the supporting pin supporter a rack gear provided in a longitudinal direction of the support member a pinion gear engaged with the rack gear and a motor coupled with a central shaft of the pinion gear. [8] The probing tester according to any one of claims 2 to 7, further comprising heat insulating members that are provided in the supporting pins or the supporting pin supporter. [9] A probing tester, the probing tester testing the semiconductor chips fabricated on a wafer, the probing tester comprising: a chuck configured such that a wafer is seated thereon, and provided with a plurality of through-holes, which pass through the chuck vertically with respect to an upper surface thereof; and a supporting pin supporter provided under the chuck, and fixedly coupled with a plurality of supporting pins, which is provided at respective locations corresponding to the plurality of through-holes wherein the plurality of supporting pins is provided to support the wafer in a state in which the supporting pins are inserted into the respective through-holes and protrude upwards from an upper surface of the chuck. [10] The probing tester according to claim 9, further comprising a chuck raising and lowering unit that raises or lowers the chuck relative to the plurality of supporti ng pins. [11] A testing method for a wafer, the method testing semiconductor chips, which are fabricated on a wafer, by bringing the wafer into contact with probes of a probe card in probing tester, the testing method comprising the steps of: positioning a chuck, which is provided in the probing tester, below the probe card protruding the plurality of supporting pins upwards from an upper surface of the chuck by lowering the chuck carrying a wafer in and supporting the carried-in wafer on the plurality of- supporting pins; and seating the wafer on the upper surface of the chuck by raising the chuck. [12] The testing method according to claim 11, further comprising a step of causing the wafer to be drawn to and held on upper ends of the plurality of supporting pins by operating a vacuum device, wherein the vacuum device is configured such that operation thereof is stopped when the wafer is seated on the upper surface of the chuck.