CN221414072U

CN221414072U - Detection device of chip test sorting machine

Info

Publication number: CN221414072U
Application number: CN202322947002.9U
Authority: CN
Inventors: 梁成; 苏婷
Original assignee: Quanzhou Lambda Instrument Equipment Co ltd
Current assignee: Quanzhou Lambda Instrument Equipment Co ltd
Priority date: 2023-11-01
Filing date: 2023-11-01
Publication date: 2024-07-26
Anticipated expiration: 2033-11-01

Abstract

The utility model discloses a detection device of a chip test sorting machine, which comprises a chip test supporting plate and an adjusting mechanism, wherein a placement table, a rotating mechanism, a test table and a moving mechanism are arranged on the chip test supporting plate, the test table is arranged at the rear side of the placement table, a power test probe and a spectrum test probe are sequentially arranged on the test table, the placement table comprises a low-temperature elevating block, a low-temperature test block, a high-temperature cushion block and a high-temperature test table which are sequentially arranged from bottom to top, the low-temperature elevating block is arranged on the rotating mechanism, the low-temperature elevating block is of a telescopic structure, and a chip is placed on the high-temperature test table. The utility model can not only perform high-temperature test on the laser chip, but also perform low-temperature test, can realize the rapid switching of the power test probe and the spectrum test probe, realize the free adjustment of the angle and the position of the chip, ensure the correct position of the chip adjustment, facilitate the test, improve the test efficiency, and can perform the height adjustment of the low-temperature elevating block, thereby adapting to the test requirements of different regular chips.

Description

Detection device of chip test sorting machine

Technical Field

The utility model relates to the technical field of chip testing, in particular to a detection device of a chip testing and sorting machine.

Background

The chip yield is one of the important factors influencing the enterprise cost, the semiconductor laser belongs to a compound semiconductor, the main materials of the semiconductor laser are very fragile gallium arsenide and indium phosphide, and the low yield is a common problem in each process link of the preparation of the semiconductor laser. The production rate is generally over 70%, but the loss of 30% is accumulated in the following packaging and the final product strict judgment standard. The yield is not high, special test equipment is needed to screen defective products, the Bar strip test is always stopped at the low end in the prior art, the chips after the Bar strip test need secondary splitting, and various factors in the middle link can lead to yield loss of 3-5% for severe high-end chips. Along with the increasing speed of semiconductor laser chips, the subsequent packaging has the trend of smaller chip size and more complex process, and the secondary damaged chips are used as good products to flow into the subsequent packaging link, so that huge cost expenditure is brought, and the production cost of finished devices is increased. In addition, the semiconductor laser chip is very sensitive to temperature, and the contact of the Bar strip on the test bench cannot completely meet the requirement of heat dissipation of the chip under the high-temperature test condition, so that the repeated test of GRR cannot be ensured.

Disclosure of utility model

The present utility model is directed to a detection device of a chip test handler, so as to solve the problems set forth in the background art.

In order to achieve the above purpose, the present utility model provides the following technical solutions: the utility model provides a detection device of chip test sorter, detection device includes the chip test backup pad and is used for driving the adjustment mechanism of chip test backup pad along XY axle motion, install the platform of placing that is used for placing the chip in the chip test backup pad, be used for the rotatory rotary mechanism of drive place the platform, be used for the testboard of test chip and be used for driving testboard lateral shifting and longitudinal movement's mobile mechanism, the testboard sets up in place the bench rear side, install power test probe and spectrum test probe on the testboard in proper order, the top of placing the platform is equipped with a pair of power supply probe, place the bench including low temperature block, low temperature test block, high temperature cushion and the high temperature testboard that set gradually from down, low temperature block sets up on rotary mechanism, just low temperature block is the extending structure, the lateral wall of high temperature testboard is connected with the heating rod, the chip is placed on the high temperature testboard.

Further, the adjusting assembly comprises an XY-axis electric sliding table.

Further, rotary mechanism includes rotating electrical machines, rotation axis and synchronous pulley subassembly, be connected through synchronous pulley subassembly between rotating electrical machines and the rotation axis, the rotation axis rotates with chip test backup pad to be connected.

Further, the rotating mechanism further comprises a fixed sleeve, the fixed sleeve is installed under the chip test supporting plate, and the synchronous pulley assembly is installed on the fixed sleeve.

Further, the moving mechanism comprises a substrate arranged on the chip testing supporting plate, a sliding seat is arranged on the substrate, a lifting table is arranged on the sliding seat, a manual sliding table is arranged on the lifting table, and the testing table is arranged on the manual sliding table.

Further, the low-temperature heightening block comprises a telescopic rod and a plurality of extending blocks penetrating through the telescopic rod, and a supporting component is arranged between the plurality of extending blocks.

Further, the supporting component comprises a supporting block and a spring, one end of the spring is propped against the extending block, the other end of the spring is fixed on the supporting block, and the supporting block is in contact connection with the adjacent extending block.

Further, a groove for the supporting block to extend in is formed in the extending block.

Further, the telescopic rod comprises a plurality of sections of telescopic pipes, the head and the tail of the plurality of sections of telescopic pipes are mutually sleeved, a positioning mechanism is arranged at the joint end of the two sections of telescopic pipes, and comprises a bulge arranged in the upper section of telescopic pipe and a chute arranged outside the lower section of telescopic pipe and matched with the bulge.

Compared with the prior art, the utility model has the beneficial effects that: the placing table can perform high-temperature test and low-temperature test on the laser chip, the placing table and the test table are placed on the chip test supporting plate, the power test probe and the spectrum test probe can be rapidly switched through the moving mechanism, meanwhile, the angle and the position of the chip can be freely adjusted through the adjusting mechanism and the rotating mechanism, the correct position of the chip adjustment is guaranteed, the test is convenient, the test efficiency is improved, the low-temperature elevating block is of a telescopic structure, the height of the low-temperature elevating block can be adjusted, the test requirements of different regular chips are met, the correct contact between the chip and the test probe is ensured, the test accuracy and the test reliability are improved, and the contact and separation between the laser chip and the power supply probe can be realized through telescopic operation.

Drawings

FIG. 1 is a schematic diagram of a detecting device of a chip test handler according to the present utility model;

FIG. 2 is a schematic diagram showing the structure of the low temperature elevating block in the detecting device of the chip test handler according to the present utility model when it is stretched;

FIG. 3 is a schematic view showing the assembly structure of the extension block and the support block in the inspection apparatus of the chip test handler according to the present utility model;

FIG. 4 is a schematic view of an assembly structure of a telescopic rod in a detecting device of a chip test handler according to the present utility model;

In the figure, 1-chip test support plate, 2-adjusting mechanism, 3-placing table, 31-low temperature elevating block, 311-telescopic rod, 3111-telescopic tube, 3112-protrusion, 3113-chute, 312-extension block, 3121-recess, 313-support assembly, 3131-support block, 3132-spring, 32-low temperature test block, 33-high temperature cushion block, 34-high temperature test table, 35-heating rod, 36-temperature sensor, 41-rotating motor, 42-rotating shaft, 431-synchronizing wheel one, 432-synchronizing wheel two, 433-synchronizing belt, 44-fixed sleeve, 45-rotating sensor, 46-rotating sensing plate, 47-micro photoelectric sensor, 5-test table, 51-power test probe, 52-spectrum test probe, 53-through 60% attenuation sheet, 6-moving mechanism, 61-substrate, 62-slide, 63-elevating slide, 64-manual slide.

Detailed Description

The following description of the embodiments of the present utility model will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present utility model, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model.

As shown in fig. 1 to 4, the present embodiment provides a detection device of a chip test handler, the detection device includes a chip test support plate 1 and an adjusting mechanism 2 for driving the chip test support plate 1 to move along XY axis, a placing table 3 for placing chips, a rotating mechanism for driving the placing table 3 to rotate, a test table 5 for testing chips, and a moving mechanism 6 for driving the test table 5 to move laterally and longitudinally are mounted on the chip test support plate 1, the test table 5 is disposed at the rear side of the placing table 3, a power test probe 51 and a spectrum test probe 52 are sequentially mounted on the test table 5, for example, The power test probe 51 adopts a PD detector, in order to ensure the measurement accuracy of the optical power, a 60% attenuation sheet 53 is used, the spectrum test probe 52 adopts an optical fiber jumper, a pair of power supply probes are arranged above the placing table 3, the placing table 3 comprises a low-temperature elevating block 31, a low-temperature test block 32, a high-temperature cushion block 33 and a high-temperature test table 34 which are sequentially arranged from bottom to top, the low-temperature elevating block 31 is arranged on a rotating mechanism, the low-temperature elevating block 31 is of a telescopic structure, the side wall of the high-temperature test table 34 is connected with a heating rod 35 and a temperature sensor 36, the chip is arranged on the high-temperature test table 34, In this embodiment, the adjusting assembly 2 includes an XY-axis electric sliding table, the XY-axis electric sliding table is in the prior art, the low-temperature elevating block 31 includes a telescopic rod 311 and a plurality of extension blocks 312 penetrating through the telescopic rod 311, a supporting assembly 313 is disposed between the extension blocks 312, the first and the last extension blocks 312 are fixed at the front and the tail ends of the telescopic rod 311, 1-31 extension blocks 312 penetrate through the middle of the telescopic rod, taking 1 extension block 312 as an example, the telescopic rod 311 includes a plurality of telescopic tubes 3111, the telescopic tubes 3111 are round tubes and made of hard materials, the first and the last of the telescopic tubes 3111 are mutually sleeved, A positioning mechanism is arranged at the joint end of the two sections of telescopic pipes 3111, the positioning mechanism comprises a protrusion 3112 arranged in the upper section of telescopic pipe 3111 and a sliding chute 31131 arranged outside the lower section of telescopic pipe 3111 and matched with the protrusion 3112, thus the extension length of the telescopic pipe 3111 can be adjusted, the adjacent two telescopic pipes can be prevented from being separated from each other, the sliding chute 122 is designed to facilitate the extension and prevent the deformation of the upper section of telescopic pipe 3111, the supporting assembly 313 comprises a supporting block 3131 and a spring 3132, one end of the spring 3132 is pressed against the extension block 312, The other end is fixed on the supporting block 3131, the supporting block 3131 is connected with the adjacent extending block 312 in a contact way, a groove 3121 for the extending of the supporting block 3131 is arranged on the extending block 312, one end of a spring 3132 is fixed in the groove 3121 formed on the extending block 312, the other end is connected with the supporting block 3131, the supporting block 3131 can extend into or extend out of the extending block 312, when the telescopic rod 311 is elongated, under the action of the spring 3132, the supporting block 3131 is ejected out to be attached to the adjacent extending block 312, when the telescopic rod 311 is compressed, the spring 3132 is compressed, the supporting block 3131 gradually extends into the extending block 312, adjacent two extension blocks 312 are attached; The rotating mechanism comprises a rotating motor 41, a rotating shaft 42, a synchronous pulley assembly and a fixed sleeve 44, wherein the rotating motor 41 is connected with the rotating shaft 42 through the synchronous pulley assembly, the rotating shaft 42 is rotationally connected with the chip test supporting plate 1, the fixed sleeve 44 is arranged below the chip test supporting plate 1, the synchronous pulley assembly is arranged on the fixed sleeve 44, the synchronous pulley assembly comprises a synchronous pulley I431, a synchronous pulley II 432 and a synchronous belt 433, the synchronous pulley I431 is arranged on a motor shaft of the rotating motor 41, the synchronous pulley II 432 is arranged on the fixed sleeve 44, the rotating shaft 42 is arranged on the synchronous pulley II 432, the synchronous belt 433 is sleeved on the synchronous wheel one 431 and the synchronous wheel 432, a rotary inductor 45 and a rotary induction plate 46 are arranged under the fixed sleeve 44, a micro photoelectric sensor 47 is arranged on the rotary induction plate 46, so that accurate rotation of the chip test supporting plate 1 is realized, an XY-axis electric sliding table drives the chip test supporting plate 1 to adjust the X-axis (transverse) and Y-axis (longitudinal) positions of the chip test supporting plate 1, and meanwhile, a rotary mechanism is matched to drive the chip test supporting plate 1 to rotate, so that correction on the position of a laser chip is realized, and a pair of subsequent probes can be well contacted with the laser chip; The moving mechanism 6 comprises a base plate 61 arranged on the chip testing support plate 1, a sliding seat 62 is arranged on the base plate 61, a lifting table 63 is arranged on the sliding seat 62, a manual sliding table 64 is arranged on the lifting table 63, the test table 5 is arranged on the manual sliding table 64, the lifting table 63 and the manual sliding table 64 are in the prior art, the manual sliding table 64 can adjust the front and back positions of the test table 5, the lifting table 63 can adjust the height of the test table 5, and the height and the front and back positions of the power testing probe 51 and the spectrum testing probe 52 can be conveniently adjusted so as to be suitable for the position of a laser chip.

During operation, the laser chip to be tested is placed on the placing table 3, the length of the low-temperature pad block 31 is adjusted according to the specification of the laser chip, when the telescopic rod 311 is lengthened, under the action of the spring 3132, the supporting block 3131 is ejected out to be attached to the adjacent extension block 312, when the telescopic rod 311 is compressed, the spring 3132 is compressed, the supporting block 3131 gradually stretches into the extension block 312, the adjacent two extension blocks 312 are attached, the heating rod 35 heats the test table 5, the heat is not easy to dissipate due to the attachment of the adjacent two extension blocks 312, the temperature sensor 36 senses the temperature of the laser chip, the power supply probe downwards moves to be in contact with the laser chip, the power supply probe electrifies the laser chip, the power test probe 51 tests the optical power of the laser chip, the spectrum test probe 52 tests the spectrum of the laser chip, after the test is completed, or the length of the low-temperature pad block 31 is reduced, the laser chip is separated from the power supply probe, and the laser chip form a circuit, the power supply probe and the laser chip form the circuit, the circuit through the ammeter and the voltmeter test current and the voltmeter, the efficiency can be improved, the efficiency of the laser chip can be tested at a plurality of stations, and the efficiency can be improved, and the test efficiency can be conveniently.

The placing table can perform high-temperature test and low-temperature test on the laser chip, the placing table and the test table are placed on the chip test supporting plate, the power test probe and the spectrum test probe can be rapidly switched through the moving mechanism, meanwhile, the angle and the position of the chip can be freely adjusted through the adjusting mechanism and the rotating mechanism, the correct position of the chip adjustment is guaranteed, the test is convenient, the test efficiency is improved, the low-temperature elevating block is of a telescopic structure, the height of the low-temperature elevating block can be adjusted, the test requirements of different regular chips are met, the correct contact between the chip and the test probe is ensured, the test accuracy and the test reliability are improved, and the contact and separation between the laser chip and the power supply probe can be realized through telescopic operation.

Although the present utility model has been described with reference to the foregoing embodiments, it will be apparent to those skilled in the art that modifications may be made to the embodiments described, or equivalents may be substituted for elements thereof, and any modifications, equivalents, improvements and changes may be made without departing from the spirit and principles of the present utility model.

Claims

1. The utility model provides a detection device of chip test sorter which characterized in that: the detection device comprises a chip test supporting plate and an adjusting mechanism for driving the chip test supporting plate to move along an XY axis, a placing table for placing chips, a rotating mechanism for driving the placing table to rotate, a test table for testing the chips and a moving mechanism for driving the test table to move transversely and longitudinally are arranged on the chip test supporting plate, the test table is arranged on the rear side of the placing table, a power test probe and a spectrum test probe are sequentially arranged on the test table, a pair of power supply probes are arranged above the placing table, the placing table comprises a low-temperature elevating block, a low-temperature test block, a high-temperature cushion block and a high-temperature test table which are sequentially arranged from bottom to top, the low-temperature elevating block is arranged on the rotating mechanism and is of a telescopic structure, a heating rod is connected to the side wall of the high-temperature test table, and the chips are placed on the high-temperature test table.

2. The apparatus for detecting a chip test handler according to claim 1, wherein: the adjusting mechanism comprises an XY-axis electric sliding table.

3. The apparatus for detecting a chip test handler according to claim 1, wherein: the rotating mechanism comprises a rotating motor, a rotating shaft and a synchronous pulley assembly, wherein the rotating motor is connected with the rotating shaft through the synchronous pulley assembly, and the rotating shaft is rotationally connected with the chip testing support plate.

4. The inspection device of a chip test handler according to claim 3, wherein: the rotating mechanism further comprises a fixed sleeve, the fixed sleeve is installed below the chip test supporting plate, and the synchronous pulley assembly is installed on the fixed sleeve.

5. The apparatus for detecting a chip test handler according to claim 1, wherein: the moving mechanism comprises a substrate arranged on a chip testing supporting plate, a sliding seat is arranged on the substrate, a lifting table is arranged on the sliding seat, a manual sliding table is arranged on the lifting table, and the testing table is arranged on the manual sliding table.

6. The apparatus for detecting a chip test handler according to claim 1, wherein: the low-temperature elevating block comprises a telescopic rod and a plurality of extension blocks penetrating through the telescopic rod, and a supporting component is arranged between the extension blocks.

7. The apparatus for inspecting a chip test handler according to claim 6, wherein: the support assembly comprises a support block and a spring, one end of the spring is propped against the extension block, the other end of the spring is fixed on the support block, and the support block is in contact connection with the adjacent extension block.

8. The apparatus for detecting a chip test handler according to claim 7, wherein: the extension block is provided with a groove into which the support block extends.

9. The apparatus for inspecting a chip test handler according to claim 6, wherein: the telescopic rod comprises a plurality of sections of telescopic pipes, the head and the tail of each section of telescopic pipe are sleeved with each other, a positioning mechanism is arranged at the joint end of the two sections of telescopic pipes, and comprises a bulge arranged in the last section of telescopic pipe and a chute arranged outside the next section of telescopic pipe and matched with the bulge.