CN220271485U - Semiconductor electrical property testing device - Google Patents

Abstract

The utility model relates to the technical field of semiconductor testing and discloses a semiconductor electrical property testing device which comprises a bottom plate, wherein a conveying device is fixedly arranged on one side of the bottom plate, a support is fixedly arranged on the other side of the bottom plate, a wafer placing groove is formed in one side, far away from the conveying device, of the top of the bottom plate, a horizontal driving mechanism is arranged above the support, a sliding block is arranged at the driving end of the horizontal driving mechanism, and a lifting driving device is arranged at the bottom of the sliding block. The device of the utility model can continuously test the wafer and greatly improve the test efficiency of the wafer.

Description

Semiconductor electrical property testing device

Technical Field

The utility model relates to the technical field of semiconductor testing, in particular to a semiconductor electrical property testing device.

Background

Semiconductor devices may be formed on a substrate, such as a silicon wafer, by repeatedly performing a series of manufacturing processes. For example, in order to manufacture a semiconductor device, various manufacturing processes such as a deposition process for forming a thin layer on a wafer, an etching process for patterning the thin layer to form a circuit, a planarization process for planarizing the thin layer, and the like may be performed on the wafer.

After the semiconductor device is formed, an electrical test process for inspecting electrical properties of the semiconductor device may be performed. The test process may be performed by a probe station including a probe card having a plurality of probes, and a test head that provides electrical signals to the semiconductor device and analyzes output signals derived from the semiconductor device to check electrical characteristics of the semiconductor device may be connected to the probe card.

Prior patent (publication number CN114252664 a) discloses a probe station comprising a chuck configured to support a substrate; a probe card disposed above the chuck and configured to electrically test a semiconductor device formed on the substrate; a camera unit disposed above the chuck and configured to image the substrate; and a camera driving part configured to move the camera unit in a horizontal direction. The camera driving part includes a braking unit for stopping the camera unit at a predetermined position using an eddy current braking force.

In the process of implementing the present utility model, the inventor finds that at least the following problems in the prior art are not solved: in the prior art, when the semiconductor device is used, the semiconductor device has no continuity in detection, the inventor discovers that the semiconductor device needs to be manually placed before detection, then is fixed through a corresponding clamping assembly, and is taken out after detection, so that the process is complicated, and the testing efficiency is affected.

Disclosure of Invention

The utility model aims to provide a semiconductor electrical performance testing device which is used for solving the problems in the background technology.

In order to achieve the above purpose, the present utility model provides the following technical solutions: the utility model provides a semiconductor electrical property testing arrangement, includes the bottom plate, one side fixed mounting of bottom plate has conveyor, opposite side fixed mounting of bottom plate has the support, the wafer standing groove has been seted up to one side that conveyor was kept away from at the bottom plate top, the top of support is provided with horizontal actuating mechanism, horizontal actuating mechanism's drive end is provided with the slider, the bottom of slider is provided with lift drive arrangement, lift drive arrangement's drive end is provided with the probe subassembly, the probe subassembly includes probe platform and probe, the probe sets up in probe platform bottom, the grip slipper is installed through the spring in the top of probe platform, the grip slipper bottom is provided with fixture.

As a preferred embodiment of the utility model, the horizontal driving mechanism comprises a first rotating motor and a first screw, wherein the first rotating motor is fixedly arranged above the side wall of the support, the driving end of the first rotating motor penetrates through the support to be fixedly connected with one end of the first screw, the first screw penetrates through the sliding block movably, the sliding block is in spiral connection with the first screw, and the top of the sliding block abuts against the inner wall of the top of the support.

As a preferred embodiment of the utility model, the middle part of the bottom of the clamping seat is provided with the accommodating hole, the driving end of the lifting driving device movably penetrates through the top of the clamping seat into the accommodating hole, two springs are arranged, the bottoms of the two springs are fixedly connected with two sides of the top of the probe station respectively, and the tops of the two springs are fixedly connected with the top of the accommodating hole.

As a preferred embodiment of the utility model, the clamping mechanism comprises four groups of sliding grooves, a second rotating motor, a guide rod, a second screw rod and clamping blocks, wherein the four sliding grooves are formed in the bottom of the clamping seat and are in an annular array shape, the second rotating motor is fixedly arranged on one side of the inner part of the corresponding sliding groove, the guide rod is horizontally arranged in the corresponding sliding groove, the second screw rod is fixedly arranged at the driving end of the second rotating motor, the second screw rod and the guide rod movably penetrate through the clamping blocks, and the second screw rod and the clamping blocks are connected in a threaded mode.

As a preferred embodiment of the present utility model, a third rotating motor is disposed at the bottom of the probe station, and one end of the probe is fixedly connected to the driving end of the third rotating motor.

Compared with the prior art, the utility model provides a semiconductor electrical property testing device, which has the following beneficial effects:

this kind of semiconductor electrical property testing arrangement, through conveyor who sets up, horizontal actuating mechanism and grip slipper, when using, put the wafer on conveyor and transmit, when carrying the grip slipper below, move down through lift actuating mechanism control grip slipper, utilize the fixture to centre gripping with the wafer, then move the grip slipper to wafer standing groove top through horizontal actuating mechanism, lift actuating mechanism continues control grip slipper and moves down, when the grip slipper moves to and offsets with the bottom plate top, the continuation of lift actuating mechanism drive end impels can make the drive end release the probe, under the condition that the wafer bottom was restricted by the standing groove, the probe is tested the wafer, after the test is accomplished, lift actuating device's drive end resets, then the fixture loosens the wafer can, compared in prior art, this device makes the test serialization of wafer, can improve the test efficiency of wafer by a wide margin.

Drawings

Other features, objects and advantages of the present utility model will become more apparent upon reading of the detailed description of non-limiting embodiments, given with reference to the accompanying drawings in which:

FIG. 1 is a front view of a semiconductor electrical property testing apparatus according to the present utility model;

fig. 2 is a front cross-sectional view of a holder of a semiconductor electrical property testing apparatus according to the present utility model.

In the figure: 1. a bottom plate; 2. a conveying device; 3. a support; 4. a wafer placement groove; 5. a slide block; 6. a lifting driving device; 7. a probe station; 8. a probe; 9. a spring; 10. a clamping seat; 11. a first rotating electric machine; 12. a first screw; 13. a receiving hole; 14. a sliding groove; 15. a second rotating electric machine; 16. a guide rod; 17. a second screw; 18. a clamping block; 19. and a third rotary electric machine.

Detailed Description

For a better understanding of the objects, structures and functions of the present utility model, a semiconductor electrical property testing apparatus according to the present utility model will be described in further detail with reference to the accompanying drawings.

As shown in fig. 1-2, the present utility model provides a technical solution: the utility model provides a semiconductor electrical property testing arrangement, includes bottom plate 1, one side fixed mounting of bottom plate 1 has conveyor 2, and conveyor 2 is belt conveyor, the opposite side fixed mounting of bottom plate 1 has support 3, wafer standing groove 4 has been seted up to one side that conveyor 2 was kept away from at bottom plate 1 top, the top of support 3 is provided with horizontal actuating mechanism, horizontal actuating mechanism's drive end is provided with slider 5, the bottom of slider 5 is provided with lift drive arrangement 6, and lift drive arrangement 6 is cylinder or push rod motor, lift drive arrangement 6's drive end is provided with the probe subassembly, the probe subassembly includes probe platform 7 and probe 8, probe 8 sets up in probe platform 7 bottom, the grip block 10 is installed through spring 9 at the top of probe platform 7, grip block 10 bottom is provided with fixture;

when the device is used, a wafer is placed on the conveying device 2 for conveying, the clamping seat 10 is controlled to move downwards through the lifting driving device 6 when the wafer is conveyed to the lower side of the clamping seat 10, the clamping mechanism is used for clamping the wafer, then the clamping seat 10 is moved to the upper side of the wafer placing groove 4 through the horizontal driving mechanism, the lifting driving device 6 continuously controls the clamping seat 10 to move downwards, when the clamping seat 10 moves to prop against the top of the bottom plate 1, the continuous pushing of the driving end of the lifting driving device 6 can enable the driving end to push out the probe 8, under the condition that the bottom of the wafer is limited by the wafer placing groove 4, the probe 8 tests the wafer, after the test is completed, the driving end of the lifting driving device 6 is reset, and then the clamping mechanism loosens the wafer.

In this embodiment, the horizontal driving mechanism includes a first rotating motor 11 and a first screw 12, the first rotating motor 11 is fixedly mounted above the side wall of the support 3, the driving end of the first rotating motor 11 penetrates through the support 3 and is fixedly connected with one end of the first screw 12, the first screw 12 movably penetrates through the sliding block 5, the sliding block 5 is in spiral connection with the first screw 12, the top of the sliding block 5 abuts against the inner wall of the top of the support 3, and the first rotating motor 11 drives the sliding block 5 to horizontally move through rotating the first screw 12, so that the horizontal driving of the clamping seat 10 is realized.

In this embodiment, the bottom middle part of grip slipper 10 has seted up accommodation hole 13, the drive end activity of lift drive arrangement 6 runs through the top of grip slipper 10 to accommodation hole 13 in, spring 9 is provided with two, two the bottom of spring 9 respectively with the both sides fixed connection at probe station 7 top, two the top of spring 9 all with accommodation hole 13's top fixed connection.

In this embodiment, the clamping mechanism includes four sets of sliding grooves 14, a second rotating motor 15, a guide rod 16, a second screw 17 and clamping blocks 18, four sliding grooves 14 are formed at the bottom of the clamping seat 10 and are in an annular array shape, the second rotating motor 15 is fixedly installed at one side of the inner portion of the corresponding sliding groove 14, the guide rod 16 is horizontally installed in the corresponding sliding groove 14, the second screw 17 is fixedly installed at the driving end of the second rotating motor 15, the second screw 17 and the guide rod 16 movably penetrate through the clamping blocks 18, the second screw 17 is in threaded connection with the clamping blocks 18, the second rotating motor 15 rotates by controlling the second screw 17, so that the clamping blocks 18 slide in the sliding grooves 14 under the limitation of the guide rod 16, and the four clamping blocks 18 synchronously move, so that the wafer is clamped.

In this embodiment, a third rotating motor 19 is disposed at the bottom of the probe platform 7, one end of the probe 8 is fixedly connected with the driving end of the third rotating motor 19, and the third rotating motor 19 can rotate the probe 8 to adjust the testing position of the probe 8.

It will be understood that the utility model has been described in terms of several embodiments, and that various changes and equivalents may be made to these features and embodiments by those skilled in the art without departing from the spirit and scope of the utility model. In addition, many modifications may be made to adapt a particular situation or material to the teachings of the utility model without departing from the essential scope thereof. Therefore, it is intended that the utility model not be limited to the particular embodiment disclosed, but that the utility model will include all embodiments falling within the scope of the appended claims.

Claims (5)

1. The utility model provides a semiconductor electrical property testing arrangement, includes bottom plate, its characterized in that: one side fixed mounting of bottom plate has conveyor, opposite side fixed mounting of bottom plate has the support, the wafer standing groove has been seted up to one side that conveyor was kept away from at the bottom plate top, the top of support is provided with horizontal actuating mechanism, horizontal actuating mechanism's drive end is provided with the slider, the bottom of slider is provided with lift drive arrangement, lift drive arrangement's drive end is provided with the probe subassembly, the probe subassembly includes probe platform and probe, the probe sets up in probe platform bottom, the grip slipper is installed through the spring in the top of probe platform, the grip slipper bottom is provided with fixture.

2. The semiconductor electrical property testing apparatus according to claim 1, wherein: the horizontal driving mechanism comprises a first rotating motor and a first screw rod, the first rotating motor is fixedly arranged above the side wall of the support, the driving end of the first rotating motor penetrates through the support to be fixedly connected with one end of the first screw rod, the first screw rod movably penetrates through the sliding block, the sliding block is in spiral connection with the first screw rod, and the top of the sliding block abuts against the inner wall of the top of the support.

3. A semiconductor electrical property testing apparatus according to claim 2, wherein: the bottom middle part of grip slipper has seted up the accommodation hole, the drive end activity of lift drive arrangement runs through the top of grip slipper to in the accommodation hole, the spring is provided with two, two the bottom of spring respectively with the both sides fixed connection at probe platform top, two the top of spring all with the top fixed connection of accommodation hole.

4. A semiconductor electrical property testing apparatus according to claim 3, wherein: the clamping mechanism comprises four groups of sliding grooves, a second rotating motor, guide rods, second screws and clamping blocks, wherein the four sliding grooves are formed in the bottom of the clamping seat and are in annular array shapes, the second rotating motor is fixedly arranged on one side of the inner portion of each corresponding sliding groove, the guide rods are horizontally arranged in the corresponding sliding grooves, the second screws are fixedly arranged at the driving ends of the second rotating motor, the second screws and the guide rods are movably penetrated through the clamping blocks, and the connection mode of the second screws and the clamping blocks is threaded connection.

5. The semiconductor electrical property testing apparatus according to claim 1, wherein: the bottom of probe platform is provided with the third rotating electrical machines, the one end and the drive end fixed connection of third rotating electrical machines of probe.