CN214672511U - Diode wafer electrical characteristic detection device - Google Patents
Diode wafer electrical characteristic detection device Download PDFInfo
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- CN214672511U CN214672511U CN202120725013.0U CN202120725013U CN214672511U CN 214672511 U CN214672511 U CN 214672511U CN 202120725013 U CN202120725013 U CN 202120725013U CN 214672511 U CN214672511 U CN 214672511U
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Abstract
The utility model discloses a diode wafer electrical characteristic detection device, which comprises a base, a wafer bearing seat, a lifting mechanism, an XY axis moving mechanism and a probe clamping piece; the wafer bearing seat is connected with the base through a lifting mechanism, and a wafer clamping jaw capable of adjusting the clamping range is arranged on the wafer bearing seat; the XY axis moving mechanism is arranged on the base, the probe clamping piece is arranged on the XY axis moving mechanism, and the detection probe is clamped on the probe clamping piece. The device need not artifical manual operation and detects, carries out the electrical property by equipment automatic drive detection probe to each diode on the wafer and detects, greatly improves detection efficiency, saves a large amount of human costs, and this device simple structure, easy operation, it is with low costs, the adaptable not unidimensional wafer of the wafer centre gripping jack catch of this device simultaneously realizes the detection to unidimensional wafer.
Description
Technical Field
The utility model relates to a diode wafer electrical characteristic detection area, concretely relates to diode wafer electrical characteristic detection device.
Background
After the production of the diode wafer is finished, electrical characteristics of diodes on the wafer need to be tested, at present, the electrical characteristics of the diodes are still tested by testers manually, but the manual testing mode is low in efficiency and consumes a large amount of manpower and material resources because a plurality of diodes are arranged on one wafer.
Disclosure of Invention
In order to solve the problem, the utility model provides a diode wafer electrical characteristic detection device, automated inspection diode electrical characteristic improves efficiency of software testing, the cost of using manpower sparingly.
The technical scheme of the utility model is that: a diode wafer electrical characteristic detection device comprises a base, a wafer bearing seat, a lifting mechanism, an XY axis moving mechanism and a probe clamping piece;
the wafer bearing seat is connected with the base through a lifting mechanism, and a wafer clamping jaw capable of adjusting the clamping range is arranged on the wafer bearing seat;
the XY axis moving mechanism is arranged on the base, the probe clamping piece is arranged on the XY axis moving mechanism, and the detection probe is clamped on the probe clamping piece.
Furthermore, the wafer bearing seat is a square bearing seat;
the wafer clamping jaw comprises four limiting fixing plates and four inverted L-shaped clamping plates, and the limiting fixing plates correspond to the inverted L-shaped clamping plates one by one;
the four limiting fixing plates are respectively arranged at the central positions of the four side edges of the wafer bearing seat; the lower end of the limiting fixing plate is provided with a first through hole, and the top end of the limiting fixing plate is provided with a second through hole with a circular cross section; the first through hole is vertical to the second through hole and is communicated with the second through hole; threads are arranged on the side wall of the second through hole;
the transverse plate of the inverted L-shaped clamping plate penetrates through the first through hole.
Furthermore, the outer side surface of the vertical plate of the inverted L-shaped clamping plate is of an arc-shaped structure.
Furthermore, the wafer bearing seat is respectively provided with scale marks from the center to the centers of the four sides of the wafer bearing seat.
Further, the XY-axis moving mechanism comprises four supporting rods, an X-axis ball screw, a Y-axis ball screw and a Y-axis guide rod;
the four supporting rods are respectively arranged at the four corners of the base, the Y-axis ball screw is arranged on two of the supporting rods, and the Y-axis guide rod is arranged on the other two supporting rods; one end of the X-axis ball screw is connected with the Y-axis ball screw, and the other end of the X-axis ball screw is connected with the Y-axis guide rod;
the X-axis ball screw is provided with a base, and the probe clamping piece is arranged on the base.
Furthermore, the X-axis ball screw is driven by an X-axis stepping motor, and the Y-axis ball screw is driven by a Y-axis stepping motor;
the X-axis stepping motor is electrically connected with a main controller, the Y-axis stepping motor is electrically connected with a slave controller, and the main controller is electrically connected with the slave controller through an RS485 interface.
Furthermore, at least three first photoelectric sensors for detecting the positions of the bases are arranged on the X-axis ball screw, and at least three second photoelectric sensors for detecting the positions of the X-axis ball screw are arranged on the Y-axis ball screw; the first photoelectric sensor is electrically connected with the master controller, and the second photoelectric sensor is electrically connected with the slave controller.
Further, the lifting mechanism is an electric cylinder telescopic rod; the driving motor of the electric cylinder telescopic rod is electrically connected with a lifting controller, and the lifting controller is electrically connected with the main controller through an RS485 interface.
The utility model provides a pair of diode wafer electrical characteristic detection device sets up test probe on the probe holder, is moved in X, Y two directions by XY axle moving mechanism drive test probe, drives test probe preset position, and later elevating system drive wafer bears the seat and rises, makes the diode on the wafer contact test probe and detects. The device need not artifical manual operation and detects, carries out the electrical property by equipment automatic drive detection probe to each diode on the wafer and detects, greatly improves detection efficiency, saves a large amount of human costs, and this device simple structure, easy operation, it is with low costs, the adaptable not unidimensional wafer of the wafer centre gripping jack catch of this device simultaneously realizes the detection to unidimensional wafer.
Drawings
FIG. 1 is a schematic structural view of an embodiment of the present invention;
FIG. 2 is a schematic top view of a wafer carrier according to an embodiment of the present invention;
fig. 3 is a schematic view of a sectional structure of a limiting fixing plate according to an embodiment of the present invention.
In the figure, 1-base, 2-wafer bearing seat, 3-lifting mechanism, 4-limit fixing plate, 5-bolt, 6-inverted L-shaped clamping plate, 7-supporting rod, 8-Y-axis ball screw, 9-X-axis ball screw, 10-first photoelectric sensor, 11-probe clamping piece, 12-Y-axis guide rod, 13-scale, 14-first through hole and 15-second through hole.
Detailed Description
The present invention will be described in detail below with reference to the accompanying drawings by way of specific examples, which are illustrative of the present invention and are not limited to the following embodiments.
As shown in fig. 1-3, the present embodiment provides a diode wafer electrical characteristic detecting apparatus, which includes a base 1, a wafer carrying base 2, a lifting mechanism 3, an XY axis moving mechanism, and a probe holder 11.
The wafer bearing seat 2 is connected with the base 1 through the lifting mechanism 3, and the lifting mechanism 3 drives the wafer bearing seat 2 to move up and down. The wafer bearing seat 2 is provided with a wafer clamping claw, and when in detection, the wafer is placed on the wafer bearing seat 2 and is clamped and fixed by the wafer clamping claw.
The XY axis moving mechanism is arranged on the base 1, the probe clamping piece 11 is arranged on the XY axis moving mechanism, and the detection probe is clamped on the probe clamping piece 11. The XY-axis moving mechanism drives the probe clamping piece 11 to move in two directions X, Y, so that the detection probe reaches the position of the diode to be detected, and then the lifting mechanism 3 is driven to lift the wafer bearing seat 2, so that the detection probe contacts the diode to detect. After detecting one diode, the lifting mechanism 3 falls down to lower the wafer, and the XY-axis moving mechanism is started again to enable the detection probe to reach the position of the next diode to be detected, so that all diodes on the wafer are detected in sequence.
The XY-axis moving mechanism of the present embodiment includes four support rods 7, an X-axis ball screw 9, a Y-axis ball screw 8, and a Y-axis guide rod 12. The four supporting rods 7 are respectively arranged at the four corners of the base 1, the Y-axis ball screws 8 are arranged on two of the supporting rods 7, and the Y-axis guide rods 12 are arranged on the other two supporting rods 7; one end of the X-axis ball screw 9 is connected with the Y-axis ball screw 8, and the other end is connected with the Y-axis guide rod 12. A base is arranged on the X-axis ball screw 9, and the probe clamping piece 11 is arranged on the base. The X-axis ball screw 9 is started to drive the base to be linked with the probe clamping piece 11 to move along the X-axis ball screw 9, so that the movement of the detection probe in the X direction is realized. And starting the Y-axis ball screw 8 to enable the X-axis ball screw 9 to move along the Y-axis ball screw 8 (the Y-axis guide rod 12 plays a role in limiting, supporting and guiding), and driving the probe clamping piece 11 to move in the Y direction, so that the movement of the detection probe in the Y direction is realized.
In this embodiment, the X-axis ball screw 9 is driven by an X-axis stepping motor, and the Y-axis ball screw 8 is driven by a Y-axis stepping motor. The X-axis stepping motor is electrically connected with a main controller, the Y-axis stepping motor is electrically connected with a slave controller, and the main controller is electrically connected with the slave controller through an RS485 interface. The stepping motors in the X-axis direction and the Y-axis direction are controlled by two controllers, wherein the controller in the X-axis direction is used as a master controller, the controller in the Y-axis direction is used as a slave controller, the master controller sends a walking instruction to the slave controller, and the master controller waits for a feedback signal from the slave controller.
In order to improve the moving precision, a high-precision ball screw is adopted in the concrete implementation. In addition, in the present embodiment, the X-axis ball screw 9 is provided with at least three first photoelectric sensors 10 for detecting the positions of the bases, and the Y-axis ball screw 8 is provided with at least three second photoelectric sensors for detecting the positions of the X-axis ball screw 9; the first photosensor 10 is electrically connected to the master controller, and the second photosensor is electrically connected to the slave controller. Further improving the moving accuracy.
The wafer carrier 2 of this embodiment is lifted by the lifting mechanism 3, and the lifting mechanism 3 of this embodiment may be an electric cylinder telescopic rod. The driving motor of the electric cylinder telescopic rod is electrically connected with a lifting controller, and the lifting controller is electrically connected with the main controller through an RS485 interface. The main controller sends an instruction to the lifting controller to inform the lifting controller to drive the electric cylinder telescopic rod after the detection probe reaches the specified position.
In the embodiment, when the electrical characteristics of the diode on the wafer are detected, the wafer is placed on the wafer bearing seat 2, and the wafer bearing seat 2 is provided with the wafer clamping claws for clamping and fixing the wafer, so that the clamping range of the wafer clamping claws can be adjusted to adapt to wafers with different sizes. Specifically, the wafer bearing seat 2 is a square bearing seat, the wafer clamping jaws comprise four limiting fixing plates 4 and four inverted L-shaped clamping plates 6, and the limiting fixing plates 4 correspond to the inverted L-shaped clamping plates 6 one by one.
The four limiting fixing plates 4 are respectively arranged at the central positions of the four side edges of the wafer bearing seat 2; the lower end of the limiting fixing plate 4 is provided with a first through hole 14, and the top end of the limiting fixing plate 4 is provided with a second through hole 15 with a circular cross section; the first through hole 14 is vertical to the second through hole 15, and the two through holes are communicated; threads are arranged on the side wall of the second through hole 15; the transverse plate of the inverted "L" shaped clamping plate 6 extends through the first through hole 14. The inverted L-shaped clamping plate 6 is moved and adjusted to a proper position in the first through hole 14, and then the bolt 5 is inserted into the second through hole 15 to fix the inverted L-shaped clamping plate 6. The part has the advantages of simple structure, easy adjustment, convenient operation and satisfied fixing force.
In order to facilitate the adjustment to a proper position, the wafer bearing seat 2 is respectively provided with a scale 13 line from the center to the centers of the four sides thereof for the reference of a tester.
In addition, the outer side surface of the vertical plate of the inverted L-shaped clamping plate 6 is of an arc-shaped structure so as to be attached to the side edge of the wafer, and the clamping effect is improved.
The above disclosure is only for the preferred embodiments of the present invention, but the present invention is not limited thereto, and any person skilled in the art can think of the inventive changes, and several improvements and decorations made without departing from the principle of the present invention should fall within the protection scope of the present invention.
Claims (8)
1. A diode wafer electrical characteristic detection device is characterized by comprising a base, a wafer bearing seat, a lifting mechanism, an XY axis moving mechanism and a probe clamping piece;
the wafer bearing seat is connected with the base through a lifting mechanism, and a wafer clamping jaw capable of adjusting the clamping range is arranged on the wafer bearing seat;
the XY axis moving mechanism is arranged on the base, the probe clamping piece is arranged on the XY axis moving mechanism, and the detection probe is clamped on the probe clamping piece.
2. The apparatus for detecting electrical characteristics of a diode wafer as claimed in claim 1, wherein the wafer carrier is a square carrier;
the wafer clamping jaw comprises four limiting fixing plates and four inverted L-shaped clamping plates, and the limiting fixing plates correspond to the inverted L-shaped clamping plates one by one;
the four limiting fixing plates are respectively arranged at the central positions of the four side edges of the wafer bearing seat; the lower end of the limiting fixing plate is provided with a first through hole, and the top end of the limiting fixing plate is provided with a second through hole with a circular cross section; the first through hole is vertical to the second through hole and is communicated with the second through hole; threads are arranged on the side wall of the second through hole;
the transverse plate of the inverted L-shaped clamping plate penetrates through the first through hole.
3. The device for detecting the electrical characteristics of the diode wafer as claimed in claim 2, wherein the outer side surface of the vertical plate of the inverted L-shaped clamping plate is of an arc-shaped structure.
4. The device for detecting the electrical characteristics of a diode wafer as claimed in claim 3, wherein the wafer carrier is provided with graduation marks respectively from the center to the centers of four sides thereof.
5. The device for detecting the electrical characteristics of the diode wafer as claimed in any one of claims 1 to 4, wherein the XY-axis moving mechanism comprises four support rods, an X-axis ball screw, a Y-axis ball screw and a Y-axis guide rod;
the four supporting rods are respectively arranged at the four corners of the base, the Y-axis ball screw is arranged on two of the supporting rods, and the Y-axis guide rod is arranged on the other two supporting rods; one end of the X-axis ball screw is connected with the Y-axis ball screw, and the other end of the X-axis ball screw is connected with the Y-axis guide rod;
the X-axis ball screw is provided with a base, and the probe clamping piece is arranged on the base.
6. The device for detecting the electrical characteristics of a diode wafer as claimed in claim 5, wherein the X-axis ball screw is driven by an X-axis stepping motor, and the Y-axis ball screw is driven by a Y-axis stepping motor;
the X-axis stepping motor is electrically connected with a main controller, the Y-axis stepping motor is electrically connected with a slave controller, and the main controller is electrically connected with the slave controller through an RS485 interface.
7. The device for detecting the electrical characteristics of the diode wafer as claimed in claim 6, wherein the X-axis ball screw is provided with at least three first photoelectric sensors for detecting the positions of the pedestals, and the Y-axis ball screw is provided with at least three second photoelectric sensors for detecting the positions of the X-axis ball screw; the first photoelectric sensor is electrically connected with the master controller, and the second photoelectric sensor is electrically connected with the slave controller.
8. The device for detecting the electrical characteristics of the diode wafer according to claim 6 or 7, wherein the lifting mechanism is an electric cylinder telescopic rod; the driving motor of the electric cylinder telescopic rod is electrically connected with a lifting controller, and the lifting controller is electrically connected with the main controller through an RS485 interface.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202120725013.0U CN214672511U (en) | 2021-04-09 | 2021-04-09 | Diode wafer electrical characteristic detection device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202120725013.0U CN214672511U (en) | 2021-04-09 | 2021-04-09 | Diode wafer electrical characteristic detection device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN214672511U true CN214672511U (en) | 2021-11-09 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202120725013.0U Active CN214672511U (en) | 2021-04-09 | 2021-04-09 | Diode wafer electrical characteristic detection device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN214672511U (en) |
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2021
- 2021-04-09 CN CN202120725013.0U patent/CN214672511U/en active Active
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