WO2008066764A1 - Système de dissipateur de chaleur pour un système d'interconnexion de réseau photovoltaïque - Google Patents

Système de dissipateur de chaleur pour un système d'interconnexion de réseau photovoltaïque Download PDF

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Publication number
WO2008066764A1
WO2008066764A1 PCT/US2007/024336 US2007024336W WO2008066764A1 WO 2008066764 A1 WO2008066764 A1 WO 2008066764A1 US 2007024336 W US2007024336 W US 2007024336W WO 2008066764 A1 WO2008066764 A1 WO 2008066764A1
Authority
WO
WIPO (PCT)
Prior art keywords
heat
enclosure
heat pipe
heat sink
diode
Prior art date
Application number
PCT/US2007/024336
Other languages
English (en)
Inventor
Scott Stephen Duesterhoeft
Original Assignee
Tyco Electronics Corporation
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tyco Electronics Corporation filed Critical Tyco Electronics Corporation
Priority to EP07840086A priority Critical patent/EP2089911A1/fr
Priority to CN2007800431481A priority patent/CN101542747B/zh
Publication of WO2008066764A1 publication Critical patent/WO2008066764A1/fr

Links

Classifications

    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02S—GENERATION OF ELECTRIC POWER BY CONVERSION OF INFRARED RADIATION, VISIBLE LIGHT OR ULTRAVIOLET LIGHT, e.g. USING PHOTOVOLTAIC [PV] MODULES
    • H02S40/00—Components or accessories in combination with PV modules, not provided for in groups H02S10/00 - H02S30/00
    • H02S40/30—Electrical components
    • H02S40/34—Electrical components comprising specially adapted electrical connection means to be structurally associated with the PV module, e.g. junction boxes
    • H02S40/345—Electrical components comprising specially adapted electrical connection means to be structurally associated with the PV module, e.g. junction boxes with cooling means associated with the electrical connection means, e.g. cooling means associated with or applied to the junction box
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02S—GENERATION OF ELECTRIC POWER BY CONVERSION OF INFRARED RADIATION, VISIBLE LIGHT OR ULTRAVIOLET LIGHT, e.g. USING PHOTOVOLTAIC [PV] MODULES
    • H02S40/00—Components or accessories in combination with PV modules, not provided for in groups H02S10/00 - H02S30/00
    • H02S40/30—Electrical components
    • H02S40/34—Electrical components comprising specially adapted electrical connection means to be structurally associated with the PV module, e.g. junction boxes
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E10/00—Energy generation through renewable energy sources
    • Y02E10/50—Photovoltaic [PV] energy

Definitions

  • the present invention is directed to a heat dissipation system for a photovoltaic array interconnection system, and more particularly to a connection box having a heat pipe for dissipating heat generated by internal components of the photovoltaic interconnection system.
  • PV interconnection systems lack efficient means for expelling heat generated from internal system electronic components, e.g., diode assemblies, to the exterior of the interconnection enclosure. This inability to expel the heat more rapidly causes a risk of heat rise sufficient to damage the enclosure and/or the internal components of the interconnection system.
  • Heat pipes are devices that are well known, for example, for use in space technology, dehumidification and air conditioning applications, and laptop CPU cooling systems.
  • "Heat pipe” is a term that refers to a closed pipe containing a working fluid such as water which is present in two phases, liquid and gas.
  • a heat pipe consists of a sealed aluminum or copper container whose inner surfaces have a capillary wicking material.
  • the heat pipe has the ability to transport heat against gravity by an evaporation-condensation cycle with the help of porous capillaries that form the wick.
  • the wick provides the capillary action that returns the condensate to the evaporator.
  • a portion of the heat pipe is placed over the hot spot and thereby serves as an evaporator, while a portion remote from the evaporator serves as a condenser, which returns liquid to the evaporator.
  • the evaporation and condensing cool the component efficiently until the heat load becomes so great that the working fluid evaporates faster than the condensing fluid can return to the evaporator, at which point the evaporator "dries out". Once the evaporator dries out, the increase in temperature with increased power is orders of magnitude greater than before the dry out point was reached.
  • the process of moving heat is essentially reduced to conduction by the thin walled tube.
  • the basic components of a heat pipe are the container, the working fluid, and the wick (or capillary) structure.
  • the container isolates the working fluid from the outside environment, is leak-proof, maintains the pressure differential across its walls, and enable transfer of heat to take place from and into the working fluid.
  • the container material is non-porous to prevent the diffusion of vapor, and has high thermal conductivity to minimize the temperature drop between the heat source and the wick.
  • the wick generates capillary pressure to transport the working fluid from the condenser to the evaporator, and distributes the liquid around the evaporator section to any area where heat is absorbed by the heat pipe. Internally, a liquid that enters the pores of the capillary material under its own pressure, thereby saturating all internal surfaces.
  • Heat pipes are used in air-conditioners, refrigerators, heat exchangers, transistors, capacitors, etc. Heat pipes are also used in laptop computers to reduce the working temperature for better efficiency. They are essentially maintenance free. Heat pipes have proven to be an accepted method of providing thermal control in notebook computers and portable personal computers (PCs) to transfer and dissipate CPU-generated heat selectively throughout the system without adversely impacting temperature-sensitive components.
  • the present invention is directed to a heat dissipation system for a photovoltaic array interconnection system.
  • the heat dissipation system includes an enclosure, one or more diode elements, a heat pipe system, and one or more heat sinks attached either end of the heat pipe system.
  • the enclosure includes apertures for inserting power cables.
  • the heat pipe system is in thermal communication with the diode elements, and the heat pipe system penetrates the walls of the enclosure between the diode and the heat sink.
  • the heat sink is disposed on an exterior of the enclosure. Cooling fins are arranged on the heat sink such that heat from the heat pipe is conducted into the fins, and heat from the fins is dissipated to the ambient atmosphere on the exterior of the enclosure.
  • connection box for a photovoltaic array interconnection system.
  • the connection box includes an enclosure, one or more diode elements, a heat pipe system, and one or more heat sinks attached either end of the heat pipe system.
  • the enclosure includes apertures for inserting power cables.
  • the heat pipe system is in thermal communication with the diode elements, and the heat pipe system penetrates the walls of the enclosure between the diode and the heat sink.
  • the heat sink is disposed on an exterior of the enclosure. Cooling fins are arranged on the heat sink such that heat from the heat pipe is conducted into the fins, and heat from the fins is dissipated to the ambient atmosphere on the exterior of the enclosure.
  • An advantage of the present invention is increased heat dissipation characteristics for connection boxes in a photovoltaic array interconnection system.
  • Another advantage is the use of heat pipe technology for eliminating heat generated by interconnection components in a connection box.
  • FIG. 1 is a perspective view of the PV interconnection system of the present invention.
  • Figure 2 is a sectional plan view of the PV interconnection system.
  • Figure 3 is a cross-sectional view of the PV interconnection system taken along the lines 3-3 in Figure 2.
  • the heat dissipation system of the present invention is applied to an interconnection system for photovoltaic (PV) arrays, and preferably to a roof mounted PV array, although the PV arrays may be independently mounted on frames, building facades or other configurations.
  • PV photovoltaic
  • connection box 12 houses the components of the interconnection system 10, including a series of electrical connectors 14 for connecting conductors of the PV array (not shown).
  • Connectors 16 are mounted to rail assemblies 14. Up to six rail assemblies 14 per connection box 12 is the preferred arrangement, although more than six rail assemblies 14 may be enclosed within a connection box suitable for larger configurations.
  • the rail assemblies 14 provide mechanical support for the connectors 14.
  • Connectors 16 are electrically isolated from the diode assemblies 15.
  • connection box 12 has cable couplers 18, and an aperture or apertures 34 disposed on the underside of the box 12 in the area opposite of the cable couplers 18.
  • the cable couplers 18 are sealed penetrations for the external connection cables 36 that interconnect to other interconnection systems [not shown] in order to form parallel or series wiring configurations for the power system.
  • the cable couplers 18 seal the interior of the connection box 12 from water or other liquids, as well as dirt and dust, while allowing the cables 36 to enter the connection box 12.
  • the cable couplers 18 are designed for high voltage and . high current carrying capacity, and preferably conform to the established International Protection (IP) standard IP-67, for sealing requirements in the photovoltaic industry.
  • IP International Protection
  • connection box 12 provides disconnect means for isolating the connection box 12 from the other connection boxes in the power system. Proper mating of the cable couplers 18 is ensured by polarity keyed housing, fully shrouded contacts, and squeeze to release connection system. It should be understood that the connection box 12 also may include additional interconnection system components, for example, diode assemblies, jumpers, printed circuit boards, etc., which are omitted from the figures for simplicity.
  • the heat pipe 26 extends through the connection box 12 in thermal contact with all of the diodes 15.
  • the diodes 15 are suspended between the rail assemblies 14.
  • the diodes 15 may have a semicircular recess (not shown) conforming to the outer diameter of the heat pipe 26.
  • the recesses are configured to receive the heat pipe 26 transversely in the connection box 12, so as to maintain thermal conductivity between the heat pipe 26 and the diodes 15.
  • the heat pipe 26 is preferably bonded to the diodes 15 with thermally conductive epoxy or adhesive 38.
  • the heat pipe may be embedded in an overmolded cover which mates with the diode 15 when attached to the box portion 12.
  • the heat pipe 26 penetrates the connection box 12 on opposite sides.
  • the heat sinks 28 are also preferably bonded to the heat pipe 26 with a thermally conductive adhesive material. Alternate means for bonding the heat pipe 26 with the heat sink 28 may be employed, for example, embedding the pipe in the heat sink 28, threaded connections, soldering or brazing.
  • the heat sinks 28 may be any type of conventional heat sink.
  • the heat sinks 28 include a plurality of cooling fins 32 that provide expanded fin surface area and airflow paths for optimum heat transfer.
  • the cooling fins 32 are connected by a common base portion 32.
  • the heat sinks 28 expel the heat to the ambient environment outside of the connection box 12, for example, the outdoor air surrounding an array of PV roof tiles.
  • heat pipe 26 condenses and is returned by capillary action to the inside of the connection box, and the cycle is continuously repeated, thereby efficiently removing greater heat than can be passively radiated through the surfaces of the connection box 12.
  • more than one heat pipe 26 with heat sinks 28 may be installed, for example, where the diode assemblies 15 may be arranged in tandem or in multiple rows, where a single heat pipe 28 cannot contact all of the diode assemblies.
  • the heat pipe 26 may be configured in a variety of non-linear shapes, for example, U-shape, W-shape or S-shape, where the heat pipe 26 is configured for a similarly configured diode arrangement.

Landscapes

  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

L'invention concerne un système de dissipateur de chaleur pour un système d'interconnexion de réseau photovoltaïque (PV) qui comprend une enceinte contenant un ou plusieurs éléments de diode. Un système de tuyau de chaleur comporte des puits de chaleur attachés à une extrémité ou aux deux. Le tuyau de chaleur traverse l'enceinte en contact thermique avec les ensembles de diode. Des ailettes de refroidissement sont disposées sur le puits de chaleur de telle sorte que la chaleur provenant du tuyau de chaleur est conduite à l'intérieur de l'ailette et l'ailette dissipe la chaleur vers l'atmosphère ambiante à l'extérieur de l'enceinte afin de refroidir les composants à l'intérieur de l'enceinte.
PCT/US2007/024336 2006-11-22 2007-11-21 Système de dissipateur de chaleur pour un système d'interconnexion de réseau photovoltaïque WO2008066764A1 (fr)

Priority Applications (2)

Application Number Priority Date Filing Date Title
EP07840086A EP2089911A1 (fr) 2006-11-22 2007-11-21 Système de dissipateur de chaleur pour un système d'interconnexion de réseau photovoltaïque
CN2007800431481A CN101542747B (zh) 2006-11-22 2007-11-21 用于光电阵列互连系统的散热系统

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US11/562,683 2006-11-22
US11/562,683 US20080115911A1 (en) 2006-11-22 2006-11-22 Heat dissipation system for solarlok photovoltaic interconnection system

Publications (1)

Publication Number Publication Date
WO2008066764A1 true WO2008066764A1 (fr) 2008-06-05

Family

ID=39284749

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2007/024336 WO2008066764A1 (fr) 2006-11-22 2007-11-21 Système de dissipateur de chaleur pour un système d'interconnexion de réseau photovoltaïque

Country Status (4)

Country Link
US (1) US20080115911A1 (fr)
EP (1) EP2089911A1 (fr)
CN (1) CN101542747B (fr)
WO (1) WO2008066764A1 (fr)

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JP2011018463A (ja) * 2009-07-07 2011-01-27 Kitani Denki Kk 太陽光発電システムにおけるケーブルの締付け接続固定構造

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JP2009099971A (ja) * 2007-09-28 2009-05-07 Enphase Energy Inc 光電池モジュール用の汎用インターフェース
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US8435056B2 (en) * 2009-04-16 2013-05-07 Enphase Energy, Inc. Apparatus for coupling power generated by a photovoltaic module to an output
US8248804B2 (en) * 2009-04-24 2012-08-21 Connex Electronics Co., Ltd. Smart junction box for solar cell module
GB0919934D0 (en) 2009-11-16 2009-12-30 Sunamp Ltd Energy storage systems
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US9083121B2 (en) 2010-12-17 2015-07-14 Sunpower Corporation Diode-included connector, photovoltaic laminate and photovoltaic assembly using same
US8519278B2 (en) 2011-02-16 2013-08-27 Amphenol Corporation Photovoltaic junction box
WO2013012852A1 (fr) 2011-07-18 2013-01-24 Enphase Energy, Inc. Ensemble de montage élastique pour modules photovoltaïques
JP5729648B2 (ja) * 2011-10-13 2015-06-03 ホシデン株式会社 太陽電池モジュール用端子ボックス
USD734653S1 (en) 2012-11-09 2015-07-21 Enphase Energy, Inc. AC module mounting bracket
CN104242815A (zh) * 2014-09-29 2014-12-24 谢英健 一种光伏太阳能接线盒
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TWM499043U (zh) * 2015-01-28 2015-04-11 Cooler Master Co Ltd 具熱交換機制的散熱器結構
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Also Published As

Publication number Publication date
US20080115911A1 (en) 2008-05-22
CN101542747B (zh) 2012-07-18
CN101542747A (zh) 2009-09-23
EP2089911A1 (fr) 2009-08-19

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