TWM499043U - 具熱交換機制的散熱器結構 - Google Patents
具熱交換機制的散熱器結構 Download PDFInfo
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- TWM499043U TWM499043U TW104201378U TW104201378U TWM499043U TW M499043 U TWM499043 U TW M499043U TW 104201378 U TW104201378 U TW 104201378U TW 104201378 U TW104201378 U TW 104201378U TW M499043 U TWM499043 U TW M499043U
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- 239000012530 fluid Substances 0.000 claims description 11
- 230000017525 heat dissipation Effects 0.000 claims description 7
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 6
- 238000009792 diffusion process Methods 0.000 description 5
- 230000000694 effects Effects 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 239000002245 particle Substances 0.000 description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- 238000004891 communication Methods 0.000 description 1
- 239000007791 liquid phase Substances 0.000 description 1
- 230000000630 rising effect Effects 0.000 description 1
- 238000010792 warming Methods 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
- H01L23/427—Cooling by change of state, e.g. use of heat pipes
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/0233—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes the conduits having a particular shape, e.g. non-circular cross-section, annular
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/0275—Arrangements for coupling heat-pipes together or with other structures, e.g. with base blocks; Heat pipe cores
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/04—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F1/00—Tubular elements; Assemblies of tubular elements
- F28F1/006—Tubular elements; Assemblies of tubular elements with variable shape, e.g. with modified tube ends, with different geometrical features
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F1/00—Tubular elements; Assemblies of tubular elements
- F28F1/10—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses
- F28F1/12—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element
- F28F1/24—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element and extending transversely
- F28F1/26—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element and extending transversely the means being integral with the element
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F1/00—Tubular elements; Assemblies of tubular elements
- F28F1/10—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses
- F28F1/12—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element
- F28F1/24—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element and extending transversely
- F28F1/30—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element and extending transversely the means being attachable to the element
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
- H01L21/4814—Conductive parts
- H01L21/4871—Bases, plates or heatsinks
- H01L21/4882—Assembly of heatsink parts
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
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- Engineering & Computer Science (AREA)
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- Thermal Sciences (AREA)
- General Engineering & Computer Science (AREA)
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- Life Sciences & Earth Sciences (AREA)
- Geometry (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Description
本創作係有關於一種具有均溫板或熱管的散熱器,尤指一種具熱交換機制的散熱器結構。
隨著科技蓬勃發展,現代電子裝置逐漸追求輕薄短小之訴求,因此電子裝置內部的電子元件也需縮小尺寸。但是,電子元件尺寸縮小且性能增加下,會導致電子元件運作時產生大量熱量,熱量若不能排除而累積在電子元件上,電子元件便有可能因為不斷升高的溫度而造成損壞。
傳統為排除電子元件產生熱量,通常會利用一散熱器熱貼接電子元件以將熱量散逸至外部環境中。此散熱器可包含一導熱塊及穿設於導熱塊的一熱管,將導熱塊熱貼接電子元件並藉由熱管將熱量傳導出去;或者,散熱器也可包含一均溫板,將均溫板直接熱貼接電子元件。
然而,現今的電子元件僅配合單一的熱管或均溫板已不敷使用,因熱管具有擴散熱阻較高之問題,均溫板具有熱傳遞方向狹隘之問題。因此,如何將熱管與均溫板結合在一起使用,以同時具有擴散熱阻低及熱傳遞方向廣泛之優點,是業者亟欲改良散熱器的重點之一。
有鑑於此,本創作人遂針對上述現有技術,特潛心研究並配合學理的運用,盡力解決上述之問題點,即成為本創作人改良之目標。
本創作之ㄧ目的,在於提供一種具熱交換機制的散熱器結構,其係利用將熱管與均溫板結合在一起使用,以讓均溫板內部的熱量由熱管的兩端帶出,進而增加散熱器結構的散熱效率,並同時具有擴散熱阻低及熱傳遞方向廣泛之優點。
為了達成上述之目的,本創作係提供一種具熱交換機制的散熱器結構,包括:一均溫板,包含一殼體、披覆於該殼體內部的一第一毛細結構及填充於該殼體內部的一第一工作流體,該殼體設有至少一對貫穿孔及具有一內頂壁;至少一熱管,埋設於該殼體內部,該熱管的兩端分別穿設於該對貫穿孔並裸露出該殼體,該熱管包含一管體、披覆於該管體內部的一第二毛細結構及填充於該管體內部的一第二工作流體;以及複數毛細構件,連接於該內頂壁,每一該毛細構件一端貼接於該第一毛細結構,另一端熱抵接於該熱管。
本發明還具有以下功效:
第一、各毛細構件夾置在內頂壁及熱管之間,且各毛細構件與第一毛細結構相互貼接,以幫助均溫板與熱管快速進行熱交換,以加強熱管的散熱效果。
第二、各毛細構件抵接於熱管,使熱管被毛細構件所抵持定位,以讓散熱器結構具有優良的結構穩固性。
10‧‧‧散熱器結構
1‧‧‧均溫板
11‧‧‧殼體
111‧‧‧貫穿孔
112‧‧‧內頂壁
113‧‧‧內底壁
12‧‧‧第一毛細結構
13‧‧‧支撐柱
14‧‧‧支撐體
141‧‧‧第一突出柱
142‧‧‧第二突出柱
15、15’、15”‧‧‧側壁
2‧‧‧熱管
21‧‧‧管體
22‧‧‧第二毛細結構
23、23’‧‧‧散熱鰭片
3‧‧‧毛細構件
31‧‧‧延伸柱
32‧‧‧第三毛細結構
圖1係本創作散熱器結構第一實施例之立體分解圖。
圖2係本創作散熱器結構第一實施例之立體組合圖。
圖3係本創作散熱器結構第一實施例之剖面示意圖。
圖4係本創作散熱器結構第二實施例之立體組合圖。
圖5係本創作散熱器結構第三實施例之組合示意圖。
圖6係本創作散熱器結構第四實施例之組合示意圖。
圖7係本創作散熱器結構第五實施例之組合示意圖。
圖8係本創作散熱器結構第六實施例之立體組合圖。
圖9係本創作散熱器結構第七實施例之立體組合圖。
有關本創作之詳細說明及技術內容,將配合圖式說明如下,然而所附圖式僅作為說明用途,並非用於侷限本創作。
請參考圖1至圖9所示,本創作係提供一種具熱交換機制的散熱器結構,此散熱器結構10主要包括一均溫板1、一或複數熱管2及複數毛細構件3。
圖1至圖3所示,均溫板1包含一殼體11、披覆於殼體11內部的一第一毛細結構12及填充於殼體11內部的一第一工作流體,殼體11設有一或複數對貫穿孔111及具有一內頂壁112。其中,第一毛細結構12可為顆粒燒結體、金屬網體、溝槽或其組合所構成,第一工作流體可為純水或甲醇。
詳細說明如下,殼體11更具有一內底壁113,本實施例之殼體11由一上殼體及一下殼體相互組接而成,但不以此為限制。其中,內頂壁112形成在上殼體上,內底壁113形成在下殼體上。
另外,殼體11延伸有設置在內底壁113及熱管2之間的複數支撐柱13,第一毛細結構12披覆於各支撐柱13的外部。
再者,殼體11延伸有設置在內頂壁112及內底壁113之間的複數支撐體14,第一毛細結構12披覆於各支撐體14的外部,進一步說明如下,每一支撐體14包含自內頂壁112向下延伸的一第一突出柱141及自內底壁113向上延伸的一第二突出柱142,各第一突出柱141與各第二突出柱142相互抵接。
圖1至圖3所示,熱管2埋設於殼體11內部,熱管2的兩端分別穿設於各貫穿孔111並裸露出殼體11,熱管2包含一管體21、披覆於管體21內部的一第二毛細結構22及填充於管體21內部的一第二工作流體,均溫板1與熱管2的內部相互不連通。其中,如圖2及圖4所示,熱管2的數量可為一或複數,貫穿孔111配合熱管2的數量也可為一或複數對;第二毛細結構22可為顆粒燒結體、金屬網體、溝槽或其組合所構成,第二工作流體可為純水或甲醇。
另外,如圖8所示,熱管2裸露出殼體11的兩端套接有複數散熱鰭片23;如圖9所示,熱管2裸露出殼體11的兩端以剷銷方式(Skive Fin)剷銷有複數散熱鰭片23’。
此外,如圖2及圖5至圖7所示,管體21可為一一字形管體、一L字形管體、一U字形管體或一波浪形管體等幾何形狀管體。
又,此對貫穿孔111會配合管體21的外型配置,如圖2所示,管體21為一字形管體,則此對貫穿孔111形成在殼體11的相對兩側壁15;如圖5所示,管體21為L字形管體,則此對貫穿孔111形成在殼體11的相鄰兩側壁15’;如圖6所示,管體21為U字形管體,則此對貫穿孔111形成在殼體11的相同一側壁15”。
圖1至圖3所示,各毛細構件3連接於內頂壁112,每一毛細構件3一端貼接於第一毛細結構12,另一端熱抵接於熱管2,每一毛細構件3包含自內頂壁112向下延伸的一延伸柱31及披覆於延伸柱31外部的一第三毛細結構32,第一毛細結構12與第三毛細結構32為一體連接成型,所以第三毛細結構32與第一毛細結構12相同,故第三毛細結構32可為顆粒燒結體、金屬網體、溝槽或其組合所構成。
另外,各支撐柱13與各毛細構件3呈相對設置,即各支撐柱13與各毛細構件3分別夾置在熱管2的上、下方。
圖1至圖3所示,本創作散熱器結構10之組合,其係利用均溫板1包含殼體11、披覆於殼體11內部的第一毛細結構12及填充於殼體11內部的第一工作流體,殼體11設有此對貫穿孔111及具有內頂壁112;熱管2埋設於殼體11內部,熱管2的兩端分別穿設於各貫穿孔111並裸露出殼體11,熱管2包含管體21、披覆於管體21內部的第二毛細結構22及填充於管體21內部的第二工作流體;各毛細構件3連接於內頂壁112,每一毛細構件3一端貼接於第一毛細結構12,另一端熱抵接於熱管2。藉此,將熱管2與均溫板1結合在一起使用,以讓均溫板1內部的熱量由熱管2的兩端帶出,進而增加散熱器結構10的散熱效率,並同時具有擴散熱阻低及熱傳遞方向廣泛之優點。
圖1至圖3所示,本創作散熱器結構10之使用狀態,因熱管2埋設於殼體11內部,熱管2的兩端分別穿設於各貫穿孔111並裸露出殼體11,讓均溫板1內部的熱量由熱管2的兩端帶出,使散熱器結構10具有均溫板1的擴散熱阻及熱管2的熱傳遞方向廣泛之特性,以提高散熱器結構10之散熱效率。
另外,各毛細構件3連接於內頂壁112,每一毛細構件3一端貼接於第一毛細結構12,另一端熱抵接於熱管2,讓第一工作流體冷凝成液相後可順著毛細構件3流至熱管2,而對熱管2進行降溫,幫助均溫板1與熱管2快速進行熱交換,以加強熱管2的散熱效果。
再者,各毛細構件3抵接於熱管2,使熱管2被毛細構件3所抵持定位,以讓散熱器結構10具有優良的結構穩固性。
綜上所述,本創作之具熱交換機制的散熱器結構,確可達到預期之使用目的,而解決習知之缺失,並具有產業利用性、新穎性與進步性,完全符合新型專利申請要件,爰依專利法提出申請,敬請詳查並賜准本案專利,以保障創作人之權利。
10‧‧‧散熱器結構
1‧‧‧均溫板
11‧‧‧殼體
111‧‧‧貫穿孔
112‧‧‧內頂壁
113‧‧‧內底壁
12‧‧‧第一毛細結構
13‧‧‧支撐柱
14‧‧‧支撐體
141‧‧‧第一突出柱
142‧‧‧第二突出柱
15‧‧‧側壁
2‧‧‧熱管
21‧‧‧管體
22‧‧‧第二毛細結構
3‧‧‧毛細構件
31‧‧‧延伸柱
32‧‧‧第三毛細結構
Claims (10)
- 【第1項】一種具熱交換機制的散熱器結構,包括:
一均溫板,包含一殼體、披覆於該殼體內部的一第一毛細結構及填充於該殼體內部的一第一工作流體,該殼體設有至少一對貫穿孔及具有一內頂壁;
至少一熱管,埋設於該殼體內部,該熱管的兩端分別穿設於該對貫穿孔並裸露出該殼體,該熱管包含一管體、披覆於該管體內部的一第二毛細結構及填充於該管體內部的一第二工作流體;以及
複數毛細構件,連接於該內頂壁,每一該毛細構件一端貼接於該第一毛細結構,另一端熱抵接於該熱管。 - 【第2項】如請求項1所述之具熱交換機制的散熱器結構,其中每一該毛細構件包含自該內頂壁向下延伸的一延伸柱及披覆於該延伸柱外部的一第三毛細結構,該第一毛細結構與該第三毛細結構為一體連接成型。
- 【第3項】如請求項1所述之具熱交換機制的散熱器結構,其中該殼體具有一內底壁,該殼體延伸有設置在該內底壁及該熱管之間的複數支撐柱,該第一毛細結構披覆於各該支撐柱的外部。
- 【第4項】如請求項3所述之具熱交換機制的散熱器結構,其中各該支撐柱與各該毛細構件呈相對設置。
- 【第5項】如請求項1所述之具熱交換機制的散熱器結構,其中該殼體具有一內底壁,該殼體延伸有設置在該內頂壁及該內底壁之間的複數支撐體,該第一毛細結構披覆於各該支撐體的外部。
- 【第6項】如請求項5所述之具熱交換機制的散熱器結構,其中每一該支撐體包含自該內頂壁向下延伸的一第一突出柱及自該內底壁向上延伸的一第二突出柱,各該第一突出柱與各該第二突出柱相互抵接。
- 【第7項】如請求項1所述之具熱交換機制的散熱器結構,其中該對貫穿孔形成在該殼體的相對兩側壁、相鄰兩側壁或相同一側壁。
- 【第8項】如請求項1所述之具熱交換機制的散熱器結構,其中該管體為一一字形管體、一L字形管體、一U字形管體或一波浪形管體。
- 【第9項】如請求項1所述之具熱交換機制的散熱器結構,其中該熱管裸露出該殼體的兩端套接有複數散熱鰭片。
- 【第10項】如請求項1所述之具熱交換機制的散熱器結構,其中該熱管裸露出該殼體的兩端剷銷有複數散熱鰭片。
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US14/662,656 US9721869B2 (en) | 2015-01-28 | 2015-03-19 | Heat sink structure with heat exchange mechanism |
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Cited By (3)
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Family Cites Families (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3831664A (en) * | 1973-11-07 | 1974-08-27 | Boeing Co | Heat pipe interfaces |
DE2602530B1 (de) * | 1976-01-23 | 1977-05-18 | Inst Fuer Kerntechnik & Energ | Latentwaermespeicher |
JPS5541358A (en) * | 1978-09-20 | 1980-03-24 | Babcock Hitachi Kk | Heat transferring apparatus |
JPS63217195A (ja) * | 1987-03-05 | 1988-09-09 | Furukawa Electric Co Ltd:The | 複合ヒ−トパイプ |
US5309457A (en) * | 1992-12-22 | 1994-05-03 | Minch Richard B | Micro-heatpipe cooled laser diode array |
US5647429A (en) * | 1994-06-16 | 1997-07-15 | Oktay; Sevgin | Coupled, flux transformer heat pipes |
US5655598A (en) * | 1995-09-19 | 1997-08-12 | Garriss; John Ellsworth | Apparatus and method for natural heat transfer between mediums having different temperatures |
US5579830A (en) * | 1995-11-28 | 1996-12-03 | Hudson Products Corporation | Passive cooling of enclosures using heat pipes |
GB2313185B (en) * | 1996-05-15 | 1999-11-10 | British Gas Plc | Radiators |
US20020050341A1 (en) * | 1999-08-12 | 2002-05-02 | Dussinger Peter M. | Heat pipe heat spreader with internal solid heat conductor |
US20080115911A1 (en) * | 2006-11-22 | 2008-05-22 | Tyco Electronics Corporation | Heat dissipation system for solarlok photovoltaic interconnection system |
US20090260785A1 (en) * | 2008-04-17 | 2009-10-22 | Wang Cheng-Tu | Heat plate with capillary supporting structure and manufacturing method thereof |
US20110297355A1 (en) * | 2010-06-07 | 2011-12-08 | Celsia Technologies Taiwan, Inc. | Heat-conducting module and heat-dissipating device having the same |
TWI498074B (zh) * | 2010-09-23 | 2015-08-21 | Foxconn Tech Co Ltd | 可攜式消費性電子裝置的散熱裝置 |
KR101203876B1 (ko) * | 2012-06-05 | 2012-11-22 | 아이엘지에너지기술(주) | 직교방향형 끼움식 난방용 히트파이프 |
-
2015
- 2015-01-28 TW TW104201378U patent/TWM499043U/zh unknown
- 2015-03-19 US US14/662,656 patent/US9721869B2/en active Active
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI645150B (zh) * | 2017-04-10 | 2018-12-21 | 華碩電腦股份有限公司 | 均溫板及使用該均溫板的散熱模組 |
CN107567248A (zh) * | 2017-09-08 | 2018-01-09 | 中微冷却技术(深圳)有限公司 | 液冷散热装置 |
CN107567248B (zh) * | 2017-09-08 | 2020-04-17 | 中微冷却技术(深圳)有限公司 | 液冷散热装置 |
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