WO2008062522A1 - Équipement de test de composant électronique et procédé de transport de plateau - Google Patents

Équipement de test de composant électronique et procédé de transport de plateau Download PDF

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Publication number
WO2008062522A1
WO2008062522A1 PCT/JP2006/323337 JP2006323337W WO2008062522A1 WO 2008062522 A1 WO2008062522 A1 WO 2008062522A1 JP 2006323337 W JP2006323337 W JP 2006323337W WO 2008062522 A1 WO2008062522 A1 WO 2008062522A1
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WO
WIPO (PCT)
Prior art keywords
test
tray
unit
electronic device
height
Prior art date
Application number
PCT/JP2006/323337
Other languages
English (en)
Japanese (ja)
Inventor
Akihiko Ito
Yoshiyuki Masuo
Original Assignee
Advantest Corporation
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Advantest Corporation filed Critical Advantest Corporation
Priority to PCT/JP2006/323337 priority Critical patent/WO2008062522A1/fr
Priority to TW096139626A priority patent/TW200823471A/zh
Publication of WO2008062522A1 publication Critical patent/WO2008062522A1/fr

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Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2893—Handling, conveying or loading, e.g. belts, boats, vacuum fingers
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks

Definitions

  • the present invention relates to an IC in which various electronic components such as semiconductor integrated circuit elements (hereinafter also referred to as IC devices typically) are brought into electrical contact with contact portions provided in an interface portion of a test head.
  • the present invention relates to an electronic component test apparatus for testing a device, and a tray transport method for transporting a tray so as to face an interface unit in the electronic component test apparatus.
  • an electronic component testing apparatus is used to test the performance and function of the Ic device in the knocked state.
  • a handler that constitutes an electronic component test apparatus an electronic component is received from a tray (hereinafter referred to as a customer tray) for accommodating an IC device before testing or accommodating a tested IC device.
  • a tray hereinafter referred to as a customer tray
  • a large number of IC devices are placed on a tray that circulates in the test equipment (hereinafter referred to as the test tray), the test tray is transported into the handler, and each IC device is accommodated in the test tray in the interface section of the test head. (Hereinafter simply referred to as HiFix.) Electrical contact is made with the socket provided in the electronic component testing device body (hereinafter referred to as a tester).
  • the test tray loaded with each IC device is unloaded from the test head and placed on the customer tray according to the test result, and sorting into categories such as non-defective and defective products is performed.
  • a type having a plate-panel contactor as shown in FIG. 10A and a type using a spring probe (so-called pogo pin) as a contactor as shown in FIG. 10B are known. Furthermore, as shown in FIG. 10C, the whole is composed of an elastomer, and a type in which a fine metal wire or gold powder embedded in the elastomer is used as a contactor is also known.
  • the height from the upper surface of the HiFix 51 to the upper part of the socket 52A is H, which is the highest among the three types of sockets.
  • the height from the top surface of HiFix 51 to the top of the socket 52B is H, which is lower than the socket shown in FIG. 10A (H ⁇ H) o
  • the height from the upper surface of the HiFix 51 to the top of the socket 52C is H, which is the lowest among the three types of sockets.
  • the sockets have various heights.
  • the transport position L of the test tray TST transported on the HiFix 51 is adjusted to the highest socket 52A from the upper surface of the HiFix 51. It is set at a constant height H. Therefore, socket 52A is another socket.
  • time the time required until the IC device test is completed and the next IC device test can be started. This is called time.
  • the thicknesses of the pushers 122A to 122C that press the IC device against the sockets 52A to 52C of the test head are inversely proportional to the heights of the sockets 52A to 52C. . That is, the thinnest pusher 122A is used for the test with the socket 52A shown in FIG. 10A, and the pusher 122B having a medium thickness is used for the test with the socket 52B shown in FIG. 10B. The thickest pusher 122C is used for testing with the socket 52C shown.
  • the standby position of the pusher while the test tray TST is being transported onto HiFix 51 is set to be constant according to the thickest pusher 122C. For this reason, the spacing force between the pusher and the test tray is the narrowest with S in the case shown in Figure 10C.
  • An object of the present invention is to provide an electronic component test apparatus and a tray transport method capable of shortening the index time.
  • the electronic component testing apparatus includes a test unit that electrically contacts the electronic device under test with a contact portion provided in an interface unit of the test head in a state where the electronic device under test is mounted on the tray.
  • the test unit includes a transport unit that transports the tray along a predetermined direction, and a first adjustment unit that can change a relative distance of the transport unit with respect to the interface unit.
  • an electronic component test apparatus see claim 1).
  • a first adjustment unit is provided in the test unit, and the first adjustment unit changes the relative distance of the conveyance unit with respect to the interface unit. This ensures that the contact between the tray and the contact part is the shortest even when the contact part is replaced with a change in the product type of the electronic device under test and the height of the contact part changes.
  • the index time can be shortened by changing the distance of the conveying means relative to the interface unit by the first adjusting means.
  • the electronic device further includes an application unit that applies thermal stress to the electronic device under test in a state where the electronic device under test is mounted on the tray, and the application unit includes: Loading means for loading the tray into the test unit; and second adjusting means capable of changing a relative distance of at least a part of the loading unit with respect to the interface unit together with the conveying unit; , (See claim 2).
  • the distance of the carry-in means with respect to the interface unit is adjusted by the second adjustment means to the distance to the transfer means with respect to the interface unit, which has been changed by the first adjustment means. It is possible to smoothly deliver the tray.
  • the electronic device further includes a removing unit that removes thermal stress from the electronic device under test in a state where the electronic device under test is mounted on the tray.
  • Unloading means for unloading the tray from the test section; and third adjusting means capable of changing a relative distance of at least a part of the unloading means with respect to the interface section together with the transfer means; (Refer to claim 3).
  • the distance of the unloading means to the interface unit is changed by the first adjusting means.
  • the electronic device under test in order to perform a test of an electronic device under test, is provided in an interface portion of a test head in a state of being mounted on a tray.
  • An electronic component testing apparatus comprising a test unit for electrically contacting the electronic device under test to a contact portion, wherein the test unit provides a pressing portion to the electronic device under test mounted on the tray.
  • An electronic component testing apparatus is provided (see claim 4).
  • a fourth adjustment means is provided in the test part, and the relative distance of the pressing means with respect to the interface part is changed by the fourth adjustment means.
  • the electronic device under test is electrically connected to the contact portion provided in the interface portion of the test head in a state where the electronic device under test is mounted on the tray.
  • a tray transport method in which the tray is transported by the transport means so as to face the interface section.
  • a tray transport method is provided that changes the relative distance of the transport means relative to the interface when the height changes (see claim 5).
  • the relative distance of the transport means with respect to the interface portion is changed. This ensures that the distance between the tray and the contact part is the shortest even when the contact part is changed as the product type of the EUT is changed and the height of the contact part changes.
  • the index time can be shortened by changing the distance of the conveying means to the interface section.
  • the test unit presses the pressing unit against the electronic component to be tested that is mounted on the tray, so that the electronic component to be tested is directed to the contact unit. Therefore, when the height of the contact portion changes, it is preferable to change the relative distance of the pressing portion with respect to the interface portion (see claim 9).
  • the relative distance of the pressing portion with respect to the interface portion is changed. This ensures that the distance between the pusher and the tray is the shortest even when the contact part is replaced with the replacement of the electronic device under test and the height of the contact part changes.
  • the index time can be shortened by changing the distance of the pressing means to the interface section.
  • the pressing portion with respect to the interface portion is set so that the relative distance of the pressing portion with respect to the tray becomes the shortest. It is preferable to change the relative distance (see claim 10).
  • FIG. 1 is a schematic cross-sectional view showing an electronic component testing apparatus according to an embodiment of the present invention.
  • FIG. 2 is a perspective view showing an electronic component testing apparatus according to an embodiment of the present invention.
  • FIG. 3 is a conceptual diagram showing tray handling in the electronic component testing apparatus according to the embodiment of the present invention.
  • FIG. 4 is an exploded perspective view showing an IC stocker used in the electronic component testing apparatus according to the embodiment of the present invention.
  • FIG. 5 is a perspective view showing a customer tray used in the electronic component testing apparatus according to the embodiment of the present invention.
  • FIG. 6 is an exploded perspective view showing a test tray used in the electronic component testing apparatus according to the embodiment of the present invention.
  • FIG. 7 is a schematic cross-sectional view showing the inside of the chamber portion of the electronic device test apparatus according to the embodiment of the present invention.
  • FIG. 8 is a schematic cross-sectional view showing the inside of a chamber portion of an electronic device test apparatus according to another embodiment of the present invention.
  • FIG. 9A is a cross-sectional view showing the positional relationship between the pusher, the test tray, and the socket when a socket having a plate-panel contactor is attached to the test head in the embodiment of the present invention.
  • FIG. 9B is a cross-sectional view showing the positional relationship between the pusher, the test tray, and the socket when the socket having the spring probe is attached to the test head in the embodiment of the present invention.
  • FIG. 9C is a cross-sectional view showing the positional relationship between the pusher, the test tray, and the socket when an elastomer type socket is attached to the test head in the embodiment of the present invention.
  • FIG. 10A shows a conventional electronic component testing apparatus having a panel-panel contactor.
  • FIG. 5 is a cross-sectional view showing the positional relationship among a pusher, a test tray, and a socket when the socket is mounted on a test head.
  • FIG. 10B is a cross-sectional view showing the positional relationship between the pusher, the test tray, and the socket when the socket having the spring probe is attached to the test head in the conventional electronic component testing apparatus.
  • FIG. 10C is a cross-sectional view showing the positional relationship between the pusher, the test tray, and the socket when an elastomer type socket is mounted on the test head in the conventional electronic component testing apparatus.
  • FIG. 1 is a schematic sectional view showing an electronic component testing apparatus according to an embodiment of the present invention
  • FIG. 2 is a perspective view showing the electronic component testing apparatus according to an embodiment of the present invention
  • FIG. 3 is an embodiment of the present invention. It is a conceptual diagram which shows the handling of the tray in the electronic component testing apparatus which concerns on this.
  • FIG. 3 is a view for understanding the tray handling method in the electronic component testing apparatus according to the present embodiment.
  • the members arranged side by side in the vertical direction are flattened. Some parts are shown. Therefore, its mechanical (three-dimensional) structure will be described with reference to FIG.
  • the electronic component testing apparatus 1 is configured to determine whether the IC device can operate properly using the test head 5 and the tester 6 in a state where a high-temperature or low-temperature temperature stress is applied to the IC device. This is a device that classifies IC devices based on the test results.
  • the test of IC devices by this electronic component test equipment 1 is performed by the test tray TST (see Fig. 6) that is circulated and transported in the handler 1 from the customer tray KST (see Fig. 5) on which many IC devices to be tested are mounted. ) Is executed by replacing the IC device.
  • IC devices are indicated by! / In the figure and indicated by IC!
  • the handler 1 in the present embodiment stores an IC device to be tested from now on, and also classifies and stores the tested IC devices, and a storage unit A loader unit 300 for feeding IC devices sent from 200 to the chamber unit 100, a chamber unit 100 including the test head 5, and an unloader unit 400 for classifying and extracting tested IC devices tested in the chamber unit 100.
  • the power is composed! RU
  • a HiFix 51 interface unit that relays the electrical connection between the test head 5 and the socket 52 is mounted on the top of the test head 5.
  • a socket 52 having a number of contact bins in electrical contact with the input / output terminals of the IC device is provided on the top of the semiconductor device 51.
  • the test head 5 is connected to the tester 6 through the cable 7 shown in FIG. 1.
  • the IC device connected to the socket 52 is electrically connected to the tester 6 through the high fix 51, the test head 5 and the cable 7. And test the IC device with the test signal of the tester.
  • handler 1 A space 8 is provided in the lower part, and the test head 5 is replaceably disposed in this space.
  • the IC device and the socket 50 on the test head 5 are connected. Can be brought into electrical contact.
  • it is replaced with a socket suitable for the shape and number of pins of the IC device of that type.
  • FIG. 4 is an exploded perspective view showing an IC stocker used in the electronic component test apparatus according to the embodiment of the present invention
  • FIG. 5 is a perspective view showing a customer tray used in the electronic component test apparatus according to the embodiment of the present invention. .
  • the storage unit 200 includes a pre-test stock force 201 for storing an IC device before a test, and a tested stock force 202 for storing an IC device classified according to a test result.
  • these stockers 201 and 202 include a frame-shaped tray support frame 203, and an elevator 204 that also moves up and down by the lower force of the tray support frame 203 entering the upper part. It has.
  • a plurality of customer trays KST are stacked on the tray support frame 203, and only the stacked customer trays KST are moved up and down by the elevator 204.
  • the concave accommodating portions for accommodating the IC devices are arranged in 14 rows ⁇ 13 columns.
  • the number of the pre-test stock 201 and the test stock 202 is set to an appropriate number as necessary. It can be done.
  • FIG. 6 is an exploded perspective view showing a test tray used in the electronic device testing apparatus according to the embodiment of the present invention.
  • the customer tray KST described above is installed on the lower side of the device base 101 on the two window portions 370 of the loader unit 300 by the tray transfer arm 205 provided between the storage unit 200 and the device base 101. Carried from.
  • the IC device loaded in the customer tray KST is transferred by the device transfer device 310 to the precursor 360, where the positional relationship between the IC devices is corrected. Thereafter, the IC device transferred to the precursor 360 is moved again by the transfer device 310, stopped at the loader unit 300, and loaded onto the test tray TST.
  • the test tray TST has a rectangular frame 701 with crosspieces 702 provided in parallel and at equal intervals, and both sides of the crosspieces 702 and sides 701 a of the frame 701 facing the crosspieces 702.
  • a plurality of mounting pieces 703 are formed so as to protrude at equal intervals.
  • the insert housing portion 704 is configured by the space between these bars 702 or between the bars 702 and the side 701a and the two mounting pieces 703.
  • Each insert accommodating portion 704 accommodates one insert 710, and this insert 710 is attached to two attachment pieces 703 in a floating state using fasteners 705. .
  • attachment holes 706 for attaching the insert 710 to the attachment piece 703 are formed at both ends of the insert 710.
  • 64 such inserts 710 are attached to one test tray TST, and are inserted into 4 rows and 16 mm IJ.
  • each insert 710 has the same shape and the same dimensions, and an IC device is accommodated in each insert 710.
  • the IC housing portion of the insert 710 is determined according to the shape of the IC device to be housed. In the example shown in FIG.
  • the loader unit 300 includes a device transfer device 310 that transfers the IC device from the customer tray KST to the test tray TST.
  • the device transporting device 310 includes two rails 311 installed on the device base 101, and the two rails 311.
  • a movable arm 312 that can reciprocate between the stray tray TST and the customer tray KST (this direction is referred to as Y direction), and a movable head supported by the movable arm 312 and movable in the X-axis direction 313 And the force is composed.
  • a suction pad (not shown) is mounted downward on the movable head 313 of the device transfer device 310, and the suction head moves while sucking to hold the IC device from the customer tray KST. Then, transfer the IC device to the test tray TST.
  • about eight suction pads are attached to one movable head 313, so that eight IC devices can be loaded onto the test tray TST at a time.
  • FIG. 7 is a schematic cross-sectional view showing the inside of the chamber portion of the electronic device test apparatus according to the embodiment of the present invention.
  • test tray TST described above is sent to the chamber unit 100, and the test of each IC device is performed with the IC device mounted on the test tray TST.
  • the chamber unit 100 includes a soak chamber 110 that applies a target high or low temperature stress to the IC device loaded on the test tray TST,
  • the test chamber 120 that electrically contacts the IC device that has been subjected to thermal stress in the soak chamber 110 to the socket 52 on the high-figure 51 and the IC device force tested in the test chamber 120 also removes the thermal stress. It consists of a soak chamber 130 and force.
  • the soak chamber 110 is disposed so as to protrude above the test chamber 120.
  • a vertical transfer device is provided inside the soak chamber 110, and a plurality of test trays TST are placed in the vertical direction until the test chamber 120 is empty. Wait while being supported by the transport device. Mainly, high-temperature or low-temperature thermal stress is applied to the IC device during this standby.
  • the soak chamber 110 has a loading device 111 for loading the test tray TST into the test unit 120 and a relative height of the loading device 111 with respect to the HiFix 51. And a height adjusting device 112 for fixing at that height.
  • the height adjusting device 112 provided in the soak chamber 110 in the embodiment corresponds to an example of the second adjusting means in the present invention.
  • the carry-in device 111 has a large number of rotating rollers 11 la arranged in a straight line. These rotating rollers 11 la can be driven to rotate by a motor or the like, not particularly shown, and a test tray TST is provided via an inlet 110a formed between the soak chamber 110 and the test chamber 120. Can be moved along the horizontal direction and loaded into the test section 120. As shown in the figure, the carry-in device 111 is supported by a spring member 111b so as to be movable in the vertical direction.
  • the height adjusting device 112 includes a gantry 112a, a stepping motor 112b, a screw shaft 112c, a ball screw adapter 112d, an upper plate 112e, and a shaft 112f.
  • the gantry 112a is provided on the soak chamber 110, and a motor 112b is provided on the upper plate of the gantry 112a.
  • a screw shaft 112c is connected to the drive shaft of the motor 112b.
  • the screw shaft 112c passes through the upper plate of the gantry 112a and is rotatably supported by the lower plate of the gantry 112a via a rotary bearing (not shown) at its lower end.
  • a male screw portion is formed over the entire surface
  • the ball screw adapter 112d has a female screw portion, and the screw shaft 112c and the ball screw adapter 112d are screwed together. is doing.
  • the ball screw adapter 112d is fixed to a substantially central portion of the upper plate 112e, and the upper end of the shaft 112f is fixed to the lower surface of the upper plate 112e.
  • the shaft 112f passes through the upper wall surface of the soak chamber 110 and is connected to the carry-in device 111 at the lower end thereof.
  • the height adjustment device 112 is connected to a control device 140 that controls the drive of the motor 112b.
  • a command signal is transmitted from the control device 140 to the height adjustment device 112.
  • the motor 112b is driven to rotate based on this command signal, the upper plate 112e moves up and down via the ball screw mechanisms 112c and 112d, and thereby the loading device 111 also moves up and down via the shaft 112f fixed to the upper plate 112e.
  • the relative height of the loading device 111 with respect to HiFix 51 changes.
  • the motor 112b stops and the loading device 111 is fixed at that height. Yes.
  • a HiFix 51 attached to the upper part of the test head 5 is disposed.
  • a plurality of sockets 52 are arranged so as to face the insert 710 of the test tray TST.
  • a plurality of pushers 122 for pressing the IC device toward the socket 52 during the test is provided so as to face each other.
  • Each pusher 122 is held by a match plate 121, and the match plate 121 can be moved up and down by a Z-axis drive device 123.
  • the pusher 122 in the present embodiment corresponds to an example of a pressing portion in the present invention
  • the Z-axis drive device 123 in the present embodiment corresponds to an example of pressing means and a fourth height adjusting device in the present invention. .
  • the Z-axis drive device 123 includes a gantry 123a, a stepping motor 123b, a screw shaft 123c, a ball screw adapter 123d, an upper plate 123e, a shaft 123f, and a drive plate 123g.
  • the gantry 123a is provided on the test chamber 120, and a motor 123b is provided on the upper plate of the gantry 123a.
  • a screw shaft 123c is connected to the drive shaft of the motor 123b.
  • the screw shaft 123c passes through the upper plate of the gantry 123a and is rotatably supported by the lower plate of the gantry 123a at the lower end thereof via a rotary bearing.
  • On the outer peripheral surface of the screw shaft 123c a male screw portion is formed over the entire surface, and at the same time, a female screw portion is formed in the ball screw adapter 123d, and the screw shaft 123c and the ball screw adapter 123d are screwed together. ing.
  • the ball screw adapter 123d is fixed to a substantially central portion of the upper plate 123e, and the upper end of the shaft 123f is fixed to the lower surface of the upper plate 123e.
  • the shaft 123f passes through the upper wall surface of the test chamber 120 and is fixed to the drive plate 123g at the lower end thereof.
  • the drive plate 123g is provided so as to face the match plate 121 holding the pusher 122.
  • this Z-axis drive device 123 is also connected to a control device 140 that controls the drive of the motor 123b.
  • the drive plate 123g is lowered to pusher 12 2
  • the standby position of the pusher 122 can be changed by moving the drive plate 123g up and down.
  • the motor 123b is driven to rotate, whereby the ball screw mechanisms 123c and 123d, the upper plate 123e and The drive plate ⁇ 123g is lowered through the shaft 123f and held by the match plate 121 !, the pusher 122 force.
  • the input / output terminals of the IC device are in electrical contact with the contact pins of the socket 52, and the test of the IC device by the tester 6 is executed.
  • the test result is stored in an address determined by, for example, an identification number attached to the test tray TST and an IC device number assigned in the test tray TST.
  • the motor 123b is driven to rotate.
  • the drive plate 123g moves up and down via the ball screw mechanisms 123c and 123d, the upper plate 123e, and the shaft 123f, and the relative height of the pusher 122 with respect to the HiFix 51 changes.
  • the motor 123b stops and the standby position of the pusher 122 is fixed at that height.
  • a transfer device 124 is provided in the test chamber 120 to transfer the test tray TST from the soak chamber 110 side to the unsoak chamber 130 side along the horizontal direction.
  • the conveying device 124 includes a belt conveyor 124a in which the force on the side of the soak chamber 110 is also arranged toward the side of the unsoak chamber 130.
  • This belt conveyor 124a can transport the test tray TST loaded with the IC device before the test from the entrance 110a to the upper part of the HiFix 51, and when the test of the IC device is completed, the test tray TST can be transported to the outlet 120a. It is possible.
  • the transport device 124 is supported by a spring member 124b so as to be movable in the vertical direction.
  • the test chamber 120 is provided with a height adjusting device 125 capable of changing the height of the transport device 124 relative to the tie-fix 51 and fixing it at that height. ing.
  • the height provided in the test chamber 120 The adjusting device 125 corresponds to an example of the first adjusting means of the present invention.
  • the height adjusting device 125 includes a stepping motor 125a, a screw shaft 125b, a ball screw adapter 125c, an upper plate 125d, and a shaft 125e.
  • the motor 125a is provided on the upper plate of the gantry 123a of the Z-axis drive device 123.
  • a screw shaft 125b is connected to the drive shaft of the motor 125a.
  • the screw shaft 125b passes through the upper plate of the gantry 123a and is rotatably supported by the lower plate of the gantry 123a at the lower end thereof via a rotary bearing (not shown).
  • the outer surface of the screw shaft 125b is formed with a male screw portion over the entire surface, and the ball screw adapter 125c is formed with a female screw portion.
  • the screw shaft 125b and the ball screw adapter 125c are screwed together. is doing.
  • This ball screw adapter 125c is fixed to the upper plate 125d, and the lower surface of the upper plate 125d is fixed to the upper end of the shaft 125e.
  • the shaft 125e passes through the upper wall surface of the test chamber 120 and is connected to the transfer device 124 at the lower end thereof.
  • the height adjusting device 125 is also connected to a control device 140 that controls the driving of the motor 125a.
  • a command signal is transmitted from the control device 140 to the height adjusting device 125.
  • the unloading device 124 also moves up and down via the ball screw mechanisms 125b and 125c, the upper plate 125d and the shaft 125e, and the relative height of the conveying device 124 with respect to the fix 51. Changes.
  • the motor 125a stops and the transport device 124 is fixed at that height.
  • the unsoak chamber 130 is also arranged so as to protrude above the test chamber 120, as shown in FIG. 2, and is vertical as conceptually shown in FIGS. A transport device is provided.
  • the IC device when a high temperature is applied in the soak chamber 110, the IC device is cooled to the room temperature by blowing air. On the other hand, when a low temperature is applied in the soak chamber 110, the IC device is heated with warm air or a heater to return to a temperature at which condensation does not occur, and then the heat-removed IC device is removed from the unloader section. Carry out to 400.
  • the unsoak chamber 130 As shown in FIG. An unloading device 131 for unloading and a height adjusting device 132 for changing the relative height of the unloading device 131 with respect to the HiFix 51 and fixing it at that height are provided.
  • the height adjusting device 132 provided in the unsoak chamber 130 corresponds to an example of the third adjusting means in the present invention.
  • the carry-out device 131 has a large number of rotating rollers 131a arranged in a straight line, like the carry-in device 111 of the soak chamber 110. These rotating rollers 131a can be driven to rotate by a motor or the like (not shown), and the test tray TST is horizontally moved through an outlet 120a formed between the test chamber 120 and the unsoak chamber 130. It is possible to move it along the test section 120. As shown in the figure, the carry-out device 131 is supported by a spring member 131b so as to be movable in the vertical direction.
  • the height adjustment device 132 includes a pedestal 132a, a stepping motor 132b, a screw shaft 132c, a ball screw adapter 132d, an upper plate 132e, and a shaft 132f! / RU
  • the gantry 132a is provided on the unsoak chamber 130, and a motor 132b is provided on the upper plate of the gantry 132a.
  • a screw shaft 132c is connected to the drive shaft of the motor 132b.
  • the screw shaft 132c passes through the upper plate of the gantry 132a, and is rotatably supported by the lower plate of the gantry 132a at its lower end via a rotary bearing (not shown).
  • a male screw portion is formed over the entire surface, whereas the ball screw adapter 132d has a female screw portion, and the screw shaft 132c and the ball screw adapter 132d are screwed together. is doing.
  • the ball screw adapter 132d is fixed to a substantially central portion of the upper plate 132e, and the upper end of the shaft 132f is fixed to the lower surface of the upper plate 132e.
  • the shaft 132f passes through the upper wall surface of the unsoak chamber 130 and is connected to the carry-out device 131 at the lower end thereof.
  • the height adjustment device 132 is connected to a control device 140 that controls the drive of the motor 132b.
  • a command signal is transmitted from the control device 140 to the height adjustment device 132.
  • the motor 132b is driven to rotate based on this command signal, the ball screw mechanism 132c , 132d, the upper plate 132e, and the shaft 132f, the carry-out device 131 moves up and down, and the relative height of the carry-out device 131 with respect to the HiFix 51 changes.
  • the motor 132b is stopped and the carry-out device 131 is fixed at that height.
  • an inlet for carrying the test tray TST from the apparatus base 101 is formed in the upper part of the soak chamber 110 in the upper part of the soak chamber 110.
  • an outlet for carrying out the test tray TST to the apparatus base 101 is also formed in the upper part of the unsoak chamber 130.
  • the apparatus base 101 is provided with a tray transfer apparatus 102 for taking in and out the test tray TST from the chamber section 110 through these inlets and outlets.
  • the tray conveying device 102 is constituted by, for example, a rotating roller.
  • the test tray TST from which the unsoak chamber 130 force is also unloaded by the tray transfer device 102 is returned to the soak chamber 110 via the unloader unit 400 and the loader unit 300! /.
  • FIG. 8 is a schematic cross-sectional view showing the inside of a chamber portion of an electronic component test apparatus according to another embodiment of the present invention.
  • the relative heights of the devices 111, 124, and 131 with respect to the i-fix 51 are changed using the height adjusting devices 112, 123, and 132.
  • the relative heights of the devices 111, 124, 131 may be adjusted using the spacers ll ld, 124d, 131d instead of the height adjusting devices 112, 123, 132.
  • a stopper 11 lc is provided to regulate the upper limit of the vertical movement by the spring member 11 lb.
  • a spacer 11 Id having a predetermined thickness is interposed between the loading device 111 and the stopper 11 lc so that the relative height of the loading device 111 with respect to the HiFix 51 is fixed at a desired height. Is possible.
  • spacers 124d and 13 Id are interposed between the transport device 124 and the stopper 124c, and between the carry-out device 131 and the stopper 131c, respectively. It is possible to fix the relative height of each device 124, 131 at the desired height.
  • the unloader unit 400 is also provided with two transport devices 410 having the same structure as the device transport device 310 provided in the loader unit 300, and the device transport device 410 is carried out to the unloader unit 400.
  • the test tray TST force is also transferred to the customer tray KST according to the test results of the tested IC device strength test.
  • the device base 101 in the unloader unit 400 has a pair of customer trays KST carried from the storage unit 200 to the unloader unit 400 as desired on the upper surface of the device base 101.
  • Two sets of windows 470 are formed.
  • an elevating table for elevating and lowering the customer tray KST is provided below each window portion 470.
  • a fully loaded IC device that has been tested is loaded.
  • the customer tray KST, which has become, is lowered and transferred to the tray transfer arm 205.
  • FIGS. 9A to 9C are cross-sectional views showing the positional relationship between the pusher, the test tray, and the socket when three types of sockets having different heights are mounted on the test head in the embodiment of the present invention.
  • FIG. The socket 52A shown in FIG. 9A is a type having a plate-panel contactor
  • the socket 52B shown in FIG. 9B is a type using a spring probe as a contactor
  • the socket 52C shown in FIG. It is composed of an elastomer and is a type that uses metal wires or gold powder embedded in the elastomer as contactors.
  • the transfer device 124 is moved by the height adjustment device 125 provided in the test chamber 120 so that the distance between the lower end of the test tray TST at the transfer position L and the upper end of the socket 52B becomes the optimum value S.
  • the optimum value S is the shortest value in a range where the test tray TST and the socket 52B do not interfere with each other, and is preferably about 0.5 to 1. Omm, for example.
  • the standby position of the pusher 122B is lowered by the device 123.
  • the optimum value S is the test
  • the shortest value within a range where the tray TST and the pusher 122B do not interfere with each other For example, about 0.5 to 1. Omm is preferable.
  • the height of the soak chamber 110 is adjusted so that the height of the loading device 111 is made equal to the height of the conveying device 124 as the conveying position L of the test tray TST is changed by the height adjusting device 125.
  • the loading device 111 is lowered by the device 112.
  • the test tray TST can be smoothly transferred from the carry-in device 111 to the transport device 124.
  • the carry-out device 131 is lowered by the height adjusting device 132 of the unsoak chamber 130 so that the height of the carry-out device 131 is aligned with the height of the transport device 124. As a result, it is possible to smoothly deliver the test tray TST to the carry-out device 131 with the conveying device 124 force.
  • the conveying device 124 is lowered by the height adjusting device 125 so that the distance between the lower end of the test tray TST at the conveying position L and the upper end of the socket 52C becomes the optimum value S.
  • the standby position of the pusher 122C is lowered by the device 123.
  • the height adjusting device 125 adjusts the height of the carry-in device 111 and the carry-out device 131 to the height of the transport device 124 as the transport position L of the test tray TST is changed by the height adjuster 125.
  • the loading device 111 and the unloading device 131 are lowered by 112 and 132. As a result, the test tray TST can be smoothly transferred between the carry-in device 111, the transfer device 124, and the carry-out device 131.
  • the conveying device 124 is raised by the height adjusting device 125 so that the distance between the lower end of ST and the upper end of the socket 52B becomes the optimum value S.
  • the Z axis is adjusted so that the distance between the upper end of the test tray TST at the transfer position L and the lower end (pressing surface) of the pusher 122B becomes the optimum value S along with the adjustment by the height adjusting device 125.
  • the standby position of the pusher 122B is raised by the device 123.
  • the height adjusting device 125 adjusts the height of the carry-in device 111 and the carry-out device 131 to the height of the transport device 124 as the transport position L of the test tray TST is changed by the height adjuster 125.
  • the carry-in device 111 and the carry-out device 131 are raised by 112 and 132. As a result, the test tray TST can be smoothly transferred between the carry-in device 111, the transfer device 124, and the carry-out device 131.
  • the conveying device 124 is raised by the height adjusting device 125 so that the distance between the lower end of the test tray TST at the conveying position L and the socket 52C becomes the optimum value S.
  • the Z axis is adjusted so that the distance between the upper end of the test tray TST at the transfer position L and the lower end (pressing surface) of the pusher 122A becomes the optimum value S along with the adjustment by the height adjusting device 125.
  • the standby position of the pusher 122C is raised by the driving device 123.
  • the height adjusting device 125 adjusts the height of the carry-in device 111 and the carry-out device 131 to the height of the transport device 124 as the transport position L of the test tray TST is changed by the height adjuster 125.
  • the carry-in device 111 and the carry-out device 131 are raised by 112 and 132. As a result, the test tray TST can be smoothly transferred between the carry-in device 111, the transfer device 124, and the carry-out device 131.
  • the height adjustment device 125 changes the transport position L of the transport device 124, and the pusher The Z-axis drive unit 124 pushes the plate so that the distance between the test tray and TST is the optimum value S.

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)

Abstract

Un équipement de test de composant électronique (1) comprend une section de test (120) pour permettre à un dispositif CI de toucher électriquement une prise (52) disposée dans un point élevé (51) fixé à la partie supérieure d'une tête de test (5) avec le dispositif CI monté sur le plateau de test (TST) afin de tester le dispositif CI. La section de test (120) comporte un transporteur (124) pour transporter le plateau de test (TST) dans la direction horizontale, et un dispositif d'ajustement de hauteur (125) pour faire varier la hauteur du transporteur (124) par rapport au point élevé (51).
PCT/JP2006/323337 2006-11-22 2006-11-22 Équipement de test de composant électronique et procédé de transport de plateau WO2008062522A1 (fr)

Priority Applications (2)

Application Number Priority Date Filing Date Title
PCT/JP2006/323337 WO2008062522A1 (fr) 2006-11-22 2006-11-22 Équipement de test de composant électronique et procédé de transport de plateau
TW096139626A TW200823471A (en) 2006-11-22 2007-10-23 Electronic component test equipment and method for conveying tray

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2006/323337 WO2008062522A1 (fr) 2006-11-22 2006-11-22 Équipement de test de composant électronique et procédé de transport de plateau

Publications (1)

Publication Number Publication Date
WO2008062522A1 true WO2008062522A1 (fr) 2008-05-29

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PCT/JP2006/323337 WO2008062522A1 (fr) 2006-11-22 2006-11-22 Équipement de test de composant électronique et procédé de transport de plateau

Country Status (2)

Country Link
TW (1) TW200823471A (fr)
WO (1) WO2008062522A1 (fr)

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH1183943A (ja) * 1997-09-05 1999-03-26 Nec Corp 半導体デバイス挿抜機
WO2004011952A1 (fr) * 2002-07-30 2004-02-05 Advantest Corporation Systeme d'essai de dispositif electronique
JP2006030151A (ja) * 2004-06-16 2006-02-02 Ueno Seiki Kk 電子部品測定装置及び電子部品測定方法

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH1183943A (ja) * 1997-09-05 1999-03-26 Nec Corp 半導体デバイス挿抜機
WO2004011952A1 (fr) * 2002-07-30 2004-02-05 Advantest Corporation Systeme d'essai de dispositif electronique
JP2006030151A (ja) * 2004-06-16 2006-02-02 Ueno Seiki Kk 電子部品測定装置及び電子部品測定方法

Also Published As

Publication number Publication date
TW200823471A (en) 2008-06-01
TWI349109B (fr) 2011-09-21

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