WO2008029456A1 - procédé de production d'une pointe de laser pour dentisterie - Google Patents

procédé de production d'une pointe de laser pour dentisterie Download PDF

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Publication number
WO2008029456A1
WO2008029456A1 PCT/JP2006/317643 JP2006317643W WO2008029456A1 WO 2008029456 A1 WO2008029456 A1 WO 2008029456A1 JP 2006317643 W JP2006317643 W JP 2006317643W WO 2008029456 A1 WO2008029456 A1 WO 2008029456A1
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WO
WIPO (PCT)
Prior art keywords
laser chip
dental laser
layer
core member
outer shell
Prior art date
Application number
PCT/JP2006/317643
Other languages
English (en)
Japanese (ja)
Inventor
Chiaki Abe
Kenichi Shimodaira
Tsutomu Nishimura
Takashi Hagi
Michio Ito
Original Assignee
Homs Engineering Inc.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Homs Engineering Inc. filed Critical Homs Engineering Inc.
Priority to PCT/JP2006/317643 priority Critical patent/WO2008029456A1/fr
Publication of WO2008029456A1 publication Critical patent/WO2008029456A1/fr

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Classifications

    • A—HUMAN NECESSITIES
    • A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
    • A61C—DENTISTRY; APPARATUS OR METHODS FOR ORAL OR DENTAL HYGIENE
    • A61C1/00—Dental machines for boring or cutting ; General features of dental machines or apparatus, e.g. hand-piece design
    • A61C1/0046—Dental lasers
    • A—HUMAN NECESSITIES
    • A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
    • A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
    • A61B18/00—Surgical instruments, devices or methods for transferring non-mechanical forms of energy to or from the body
    • A61B18/18—Surgical instruments, devices or methods for transferring non-mechanical forms of energy to or from the body by applying electromagnetic radiation, e.g. microwaves
    • A61B18/20—Surgical instruments, devices or methods for transferring non-mechanical forms of energy to or from the body by applying electromagnetic radiation, e.g. microwaves using laser
    • A61B18/22—Surgical instruments, devices or methods for transferring non-mechanical forms of energy to or from the body by applying electromagnetic radiation, e.g. microwaves using laser the beam being directed along or through a flexible conduit, e.g. an optical fibre; Couplings or hand-pieces therefor
    • A61B2018/2205—Characteristics of fibres
    • A61B2018/2222—Fibre material or composition

Definitions

  • the present invention relates to a method for manufacturing a dental laser chip.
  • Dental laser treatment devices are used for dental treatment such as calculus removal, caries removal, periodontal pocket curettage, gingival remodeling, bandectomy, gingival incision, anesthesia, and pigmentation removal.
  • dental treatment such as calculus removal, caries removal, periodontal pocket curettage, gingival remodeling, bandectomy, gingival incision, anesthesia, and pigmentation removal.
  • FIG. 13 is a diagram for explaining a conventional dental laser treatment apparatus 900 described in Patent Document 1.
  • FIG. 13A is an external view of the dental laser treatment apparatus 900
  • FIG. 13B is a partial cross-sectional view of a dental handpiece 930 used in the dental laser treatment apparatus 900.
  • FIG. 14 is a view for explaining a dental laser chip 940 that is replaceably attached to the distal end of the dental handpiece main body 932.
  • 14 (a) is a diagram showing various shapes of the second light guiding fiber 942 in the dental laser chip 940
  • FIG. 14 (b) is various shapes of the second light guiding fiber protective tube 944 in the dental laser chip 940.
  • FIG. 14 (a) is a diagram showing various shapes of the second light guiding fiber 942 in the dental laser chip 940
  • FIG. 14 (b) is various shapes of the second light guiding fiber protective tube 944 in the dental laser chip 940.
  • a conventional dental laser treatment apparatus 900 includes a laser oscillation apparatus 910, a dental handpiece 930, and laser light from the laser oscillation apparatus 910 as a dental handpiece. And a light guide fiber 920 for guiding light to 930.
  • the laser oscillation device 910 includes an Er: YAG laser 912 and a control device 914 that controls the Er: YAG laser 912.
  • the dental handpiece 930 includes a dental handpiece body 932 and a dental laser chip 940, and the dental laser chip 940 is replaceably attached to the tip of the dental handpiece body 932.
  • the dental laser chip 940 includes a second light guide fiber 942 for guiding the laser light guided by the light guide fiber 920 to the affected area, and a second guide. And a second light guiding fiber protective tube 944 for protecting the optical fiber 942. As shown in FIG. 14, the second light guiding fiber 942 and the second light guiding fiber protective tube 944 are prepared in various shapes. Yes.
  • the dentist selects the second light guide fiber 942 and the second light guide fiber protective tube 944 having various shapes as shown in FIG. 14 according to the purpose of treatment and the shape of the affected part, for example.
  • a dental laser chip 940 is constructed and attached to the tip of the dental handpiece body 932. Therefore, it is possible to perform an appropriate treatment for the patient.
  • Patent Document 1 Japanese Patent Laid-Open No. 5-344982
  • the purpose of treatment and the shape of the affected area are various, it is practically difficult to prepare a dental laser chip applicable to all of them.
  • the shape of the dental laser chip may not be adequately adapted to the purpose of treatment and the shape of the affected part depending on the purpose of treatment and the shape of the affected part. There's a problem.
  • this problem is not a problem seen only when a laser oscillation device including an Er: YAG laser is used.
  • a laser oscillation device including another laser such as an Nd: YAG laser, a carbon dioxide gas laser, or a semiconductor laser is used. It is a problem that can be seen in some cases as well.
  • the present invention has been made to solve the above-described problems, and is a dental laser that is more compatible with the purpose of treatment and the shape of the affected area than conventional dental laser chips. It is an object of the present invention to provide a method for manufacturing a dental laser chip capable of manufacturing the chip.
  • the method for producing a dental laser chip of the present invention is a method for producing a dental laser chip used in a dental laser treatment apparatus, wherein the cross-section is circular and the diameter of the circle is the tip.
  • the outer shell layer having the tip side narrow tube portion is formed on the outer periphery of the cylindrical core member having the tapered portion having the shape force described above. Therefore, it becomes possible to manufacture a dental laser chip having a structure that becomes thinner toward the tip side.
  • the outer shell layer having the proximal end sleeve portion is formed on the outer periphery of the cylindrical core member having the taper portion having the above shape. Therefore, the outer diameter of the proximal end sleeve portion is large, and it becomes possible to manufacture a dental laser chip that can be easily attached to the dental handpiece body.
  • the cylindrical core is provided.
  • a cylindrical core member having a high surface accuracy as a member, it becomes possible to manufacture a dental laser chip with a high inner surface accuracy and a high light transmission rate.
  • the outer shell layer forming step includes forming a thick layer concentrically on the outer periphery of the cylindrical core member.
  • the surface shape of the cylindrical core member is accurately transferred to the inner surface. Therefore, it is possible to manufacture a dental laser chip with extremely high inner surface accuracy and thus high light transmission rate by using a cylindrical core member with extremely high surface accuracy. It becomes possible.
  • Nickel or a nickel alloy is preferably used as the metal constituting the electrode layer.
  • the resin constituting the resin layer is not particularly limited.
  • ABS acrylonitrile.butadiene-styrene copolymer
  • PBT polybutylene terephthalate
  • PPS polyphenol
  • Rensulfide polyphenol
  • polyimide resin fluorine resin
  • cyclic polyolefin resin etc.
  • a dental laser chip in which the proximal outer diameter of the proximal sleeve portion and the distal outer diameter of the proximal sleeve portion are substantially the same. This makes it possible to manufacture a dental laser chip that is easier to attach to the dental handpiece body.
  • the outer shell layer forming step forms a thin layer concentrically on the outer periphery of the cylindrical core member. Forming a thick layer over the base end predetermined portion of the thin layer to form the outer shell layer having the distal end side thin tube portion and the proximal end side sleeve portion. It is preferable to include the production process in this order. [0027]
  • nickel or a nickel alloy is preferably used as the metal constituting the electrode layer.
  • (8) In the method for producing a dental laser chip according to (6), in the thin layer forming step, a thin layer composed of a resin layer is formed, and in the thick layer forming step, It is preferable to form a thick layer consisting of a cocoon layer.
  • the resin constituting the resin layer is not particularly limited.
  • ABS acrylonitrile.butadiene-styrene copolymer
  • PBT polybutylene terephthalate
  • PPS polyphenol
  • Rensulfide polyphenol
  • polyimide resin fluorine resin
  • cyclic polyolefin resin etc.
  • the outer shell layer forming step is the same as the thick layer forming step.
  • the proximal-side outer diameter of the proximal-side sleeve is substantially the same as the distal-side outer diameter of the proximal-side sleeve.
  • a dental laser chip in which the proximal outer diameter of the proximal sleeve portion and the distal outer diameter of the proximal sleeve portion are substantially the same. This makes it possible to manufacture a dental laser chip that is easier to attach to the dental handpiece body.
  • the diameter of the circle at the end on the front end side of the cylindrical core member is ⁇ ! Preferable to be in the range of ⁇ 500 m.
  • the diameter of the circle is in the range of 40 ⁇ m to 500 ⁇ m is that the laser beam may be excessively concentrated when the diameter of the circle is less than 10 ⁇ m. This is because the elasticity of the outer shell layer may be insufficient if the diameter of the circle exceeds 500 ⁇ m. From the above viewpoint, the diameter of the circle is more preferably in the range of 60 / ⁇ ⁇ to 300 / ⁇ ⁇ .
  • the thickness of the outer shell layer in the predetermined portion on the tip side is 10 111 to 100. It is preferably within the range of 111.
  • the thickness of the outer shell layer is 10 m to: LOO m because the mechanical strength of the outer shell layer is insufficient when the thickness of the outer shell layer is less than 10 m. If the thickness of the outer shell layer exceeds 100 m, the elasticity of the outer shell layer may be insufficient. Because there is. From these viewpoints, the thickness of the outer shell layer is more preferably in the range of 30 ⁇ m to 80 ⁇ m.
  • the cylindrical core member is cut along a plane including a central axis of the cylindrical core member.
  • the angle 0 formed by the outer peripheral portion of the cylindrical core member and the central axis of the cylindrical core member in the tapered portion is in the range of 0.2 ° to 5 °.
  • the angle ⁇ is set to 0.2 ° to 5 ° when the angle ⁇ is less than 0.2 °. If the angle ⁇ exceeds 5 °, the taper angle of the distal capillary is too strong and the distal capillary is maintained while maintaining the strength. This is because it becomes difficult to make the required length. In view of these viewpoints, the angle ⁇ is preferably in the range of 0.5 ° to 2 °.
  • the method further includes a high light reflective metal layer forming step of forming a high light reflective metal layer on an outer periphery of the cylindrical core member, and the outer shell layer forming step includes the cylindrical core through the high light reflective metal layer. It is preferable to form the outer shell layer on the outer periphery of the member.
  • the “highly light-reflective metal layer” refers to a layer having a far infrared reflectivity made of a relatively high metal.
  • gold, silver, copper or other metals can be preferably used as the metal constituting the highly light-reflective metal layer.
  • gold is particularly preferable because it has high infrared reflectivity and high chemical durability.
  • the thickness of the highly light-reflective metal layer is preferably a value in the range of 1 ⁇ m to 10 m.
  • a value in the range of 2 ⁇ m to 5 ⁇ m is more preferable.
  • a method of forming the highly light-reflective metal layer a plating method or a sputtering method can be preferably used.
  • the high light reflective metal layer is interposed between the high light reflective metal layer forming step and the outer shell layer forming step.
  • the high light reflective metal layer and the high heat conductive metal layer are provided.
  • the outer shell layer is preferably formed on the outer periphery of the cylindrical core member.
  • the highly thermally conductive metal layer functions as a heat sink, and heat generated in the highly light reflective metal layer can be effectively released.
  • the metal constituting the highly thermally conductive metal layer copper, silver, aluminum or other metals can be preferably used.
  • the layer thickness of the high thermal conductive metal layer is preferably a value in the range of 5 ⁇ m to 50 ⁇ m.
  • a value in the range of 10 ⁇ m to 20 ⁇ m is more preferable.
  • a method for forming the high thermal conductivity metal layer a plating method or a sputtering method can be preferably used.
  • a dielectric layer is formed on an inner surface of the outer shell layer after the light guide portion forming step. It is preferable that the method further includes a dielectric layer forming step of forming.
  • the far-infrared light reflectance in the light guide section can be increased. Therefore, it is possible to manufacture a dental laser chip particularly suitable for a dental treatment laser device including a laser oscillation device using a carbon dioxide laser that has a high light transmittance of far infrared light. [0058] In addition, it becomes possible to protect the inner surface of the outer shell layer (for example, an electric layer or a highly light-reflective metal layer) from the outside air, and a highly reliable dental laser chip can be manufactured. .
  • a reflecting member that reflects laser light laterally after the light guide portion forming step It is preferable that the method further includes a reflection member attaching step of attaching to the end of the outer shell layer.
  • the dental laser treatment device is a laser treatment device including a carbon dioxide laser. Is preferred.
  • a dental laser chip having a structure in which a hollow light guide portion is formed inside the outer shell layer is manufactured. It can be suitably used for a dental laser treatment apparatus.
  • FIG. 1 is a view for explaining a method for producing a dental laser chip according to Embodiment 1.
  • FIG. 2 is a view for explaining the method for manufacturing the dental laser chip according to the first embodiment.
  • FIG. 3 is a view for explaining the function and effect of the method for producing a dental laser chip according to the first embodiment.
  • FIG. 4 is a view for explaining the method for manufacturing the dental laser chip according to the second embodiment.
  • FIG. 5 is a view for explaining the method for manufacturing the dental laser chip according to the second embodiment.
  • FIG. 6 is a view for explaining the method for manufacturing the dental laser chip according to the third embodiment.
  • FIG. 7 is a view for explaining the method for manufacturing the dental laser chip according to the third embodiment.
  • FIG. 8 is a view for explaining the method for manufacturing the dental laser chip according to the fourth embodiment.
  • FIG. 9 is a view for explaining the effects of the method for manufacturing a dental laser chip according to Embodiment 4.
  • FIG. 10 is a view for explaining a modification of the reflecting member.
  • FIG. 11 is a view for explaining the method for manufacturing the dental laser chip according to the fifth embodiment.
  • FIG. 12 is a view for explaining the method for manufacturing the dental laser chip according to the fifth embodiment.
  • FIG. 13 is a view for explaining a conventional dental laser treatment apparatus 900.
  • FIG. 13 is a view for explaining a conventional dental laser treatment apparatus 900.
  • FIG. 14 is a view for explaining a dental laser chip 940 that is replaceably attached to the tip of a dental handpiece body 932.
  • FIGS. 2 (a) to 2 (d) are process diagrams in the method for manufacturing a dental laser chip according to the first embodiment.
  • Fig. 1 (b) is an enlarged cross-sectional view at the portion A in Fig. 1 (a)
  • Fig. 2 (c) is an enlarged view at the portion A in Fig. 2 (b).
  • FIG. 2 (d) is an enlarged right side view of the portion A in FIG. 2 (b).
  • FIG. 3 is a view for explaining the operational effects of the method for manufacturing a dental laser chip according to the first embodiment.
  • the method for manufacturing a dental laser chip according to Embodiment 1 is used for a dental laser treatment apparatus.
  • This is a method for manufacturing dental laser chips, in which the ⁇ columnar core member preparation process '', ⁇ high light reflective metal layer formation process '', ⁇ outer shell layer formation process '' and ⁇ light guide section formation process '' are sequentially performed It is done.
  • each of these steps will be described with reference to FIG. 1 and FIG.
  • the cylindrical core member 110 has a tapered portion 114 having a circular cross section and a diameter of the circle that is smaller toward the tip side.
  • the diameter D (see FIG. 1 (b)) of the cross section at the end on the front end side of the cylindrical core member 110 (the right end of FIG. 1 (a)) is, for example, 100 m.
  • the diameter D of the cross section at the base end side (the left end in FIG. 1 (a)) is 1000, for example.
  • the center axis l of the cylindrical core member l When the cylindrical core member 110 is cut along a plane including lOax, the outer periphery 112 of the cylindrical core member 110 in the tapered portion 114 and the central axis l lOax of the cylindrical core member
  • the angle 0 made is, for example, 0.75 °.
  • the length L of the cylindrical core member 110 is, for example, 42.5 mm.
  • cylindrical core member 110 for example, a cylindrical core member made of tungsten carbide can be suitably used.
  • a cylindrical core member having tungsten carnoid force can be extremely hard but can have extremely high surface accuracy.
  • a highly light reflective metal layer 120 made of gold is formed on the outer periphery of the cylindrical core member 110.
  • the highly light-reflective metal layer 120 is formed leaving a portion of a predetermined length L (for example, 7 mm) from the base end side end portion of the cylindrical core member 110.
  • the thickness of the high light reflective metal layer 120 is, for example, As a method for forming the highly light-reflective metal layer 120 on the outer periphery of the cylindrical core member 110, for example, a plating method (electrolytic plating method, electroless plating method) or a sputtering method can be used.
  • a plating method electrolytic plating method, electroless plating method
  • a sputtering method can be used.
  • the outer shell layer forming step is a step of forming the outer shell layer 140 having the distal end side thin tube portion 142 and the proximal end side sleeve portion 144 on the outer periphery of the cylindrical core member 110, and is a thick layer forming step (See Fig. 1 (d).) And thick layer processing step (see Fig. 2 (a)).
  • Thick layer forming step First, as shown in FIG. 1 (d), a thick layer 130 made of a conductive layer is formed concentrically on the outer periphery of the cylindrical core member 110 with the highly light-reflective metal layer 120 interposed therebetween.
  • the thickness of the thick layer 130 is, for example, 500 / z m.
  • the thick layer 130 is made of nickel, for example, and can be formed by an electroplating method.
  • the outer shell layer having the distal-side thin tube portion 142 and the proximal-side sleeve portion 144. 140 is formed.
  • the wall thickness of the distal end side thin tube 142 is, for example, 50 m.
  • the thickness of the base end side sleeve portion 144 varies depending on the position, and the base end side outer diameter D of the base end side sleeve portion 144 is
  • the thickness of the predetermined portion on the base end side is reduced.
  • the cylindrical core member 110 is removed from the outer shell layer 140 to form a light guide 146 in the outer shell layer 140.
  • the dental laser chip 100 can be manufactured. By attaching a dental laser chip 100 to the tip of a dental handpiece body (both not shown) in a dental laser treatment apparatus, for example, the deepest part of the root canal that gradually bends toward the back. it becomes possible to irradiate the laser beam (see FIG. 3.) 0
  • the method for manufacturing a dental laser chip according to Embodiment 1 is a method for manufacturing a dental laser chip used in a dental laser treatment apparatus, and as described above, a cylindrical core member preparation The process, the outer shell layer forming process, and the light guide part forming process are included in this order.
  • the distal-side thin tube portion 142 is provided on the outer periphery of the cylindrical core member 110 having the tapered portion 112 having the above-described shape force. Since the outer shell layer 140 is formed, it is possible to manufacture a dental laser chip having a structure that becomes thinner toward the tip side.
  • the outer periphery having the proximal end sleeve portion 144 on the outer periphery of the cylindrical core member 110 having the tapered portion 112 having the above shape Since the shell layer 140 is formed, the proximal end sleeve portion 144 has a large outer diameter, and a dental laser chip that can be easily attached to the dental handpiece body can be manufactured. .
  • the light guide 146 is formed in the outer shell layer 140 by extracting the cylindrical core member 110 from the outer shell layer 140. Therefore, by using the cylindrical core member 110 with high surface accuracy as the cylindrical core member, it is possible to manufacture a dental laser chip with high inner surface accuracy and high light transmission rate.
  • the distal end side thin tube portion 142 and the proximal end side slit are made thinner by reducing the thickness of the predetermined portion on the distal end side in the thick layer 130. Since the outer shell layer 140 having the groove portion 144 is formed, it is possible to manufacture the dental laser chip 100 in which the distal-side thin tube portion 142 and the proximal-side sleeve portion 144 are integrally formed. Become. As a result, the distal-side thin tube portion 142 is not easily detached from the proximal-side sleeve portion 144, and a highly reliable dental laser chip can be manufactured.
  • the thick layer 130 composed of the electroplating layer is formed in the thick layer forming step. It is possible to form the outer shell layer 140 in which the surface shape of the member 110 is precisely transferred to the inner surface. For this reason, by using the cylindrical core member 110 with extremely high surface accuracy, it is possible to manufacture a dental laser chip with extremely high inner surface accuracy and high light transmission rate.
  • the proximal-side outer diameter D of the proximal-side sleeve portion 144 is equal to the proximal-side sleeve portion.
  • the proximal end side of the thick layer 130 is substantially the same as the outer diameter D of the distal end side of 144.
  • the thickness of the fixed part is to be reduced.
  • the proximal end outer diameter D of the proximal end sleeve portion 144 and the distal end outer diameter D of the proximal end sleeve portion 144 are substantially the same.
  • the dental laser chip 100 can be manufactured, and a dental laser chip that can be more easily attached to the dental handpiece body can be manufactured.
  • the diameter of the cross section at the end portion on the distal end side of the cylindrical core member 110 is in the range of 40 m to 500 m, It is possible to manufacture a dental laser chip having a thin outer diameter at a predetermined portion of the tip. As a result, it is possible to manufacture a dental laser chip having more supple properties, and it is possible to manufacture a dental laser chip that is more compatible with the purpose of treatment and the shape of the affected part.
  • the thickness of the outer shell layer 140 in the predetermined portion on the front end side is within the range of 10 111 to 100 111. Part It is possible to manufacture a dental laser chip having a thin wall and a thin outer diameter at a predetermined part. As a result, it becomes possible to manufacture a dental laser chip having more flexible properties, and it is possible to manufacture a dental laser chip that is more compatible with the purpose of treatment and the shape of the affected part. It becomes possible.
  • the tapered portion 114 is Since the angle ⁇ between the outer periphery 112 of the cylindrical core member 112 and the central axis l lOax of the cylindrical core member is within the range of 0.2 ° to 5 °, the outer diameter gradually increases toward the tip side. It is possible to manufacture a dental laser chip having a structure that can be reduced. As a result, it becomes possible to manufacture a dental laser chip having even more powerful properties, and it is possible to manufacture a dental laser chip that is more compatible with the purpose of treatment and the shape of the affected part. Become.
  • the cylindrical core member The method further includes a step of forming a highly light-reflective metal layer that forms a highly light-reflective metal layer 120 formed of metallurgy on the outer periphery of the cylindrical core member 110 between the preparation step and the outer shell layer formation step, and In the outer shell layer forming step, the thick layer 130 is formed on the outer periphery of the cylindrical core member 110 via the high light reflective metal layer 120.
  • This makes it possible to increase the far-infrared light reflectivity at the light guide unit 146, thereby increasing the far-infrared light transmission rate, and providing dental treatment including a laser oscillation device using a carbon dioxide laser. It is possible to manufacture a dental laser chip particularly suitable for a laser device.
  • the dental laser treatment device is a laser treatment device including a carbon dioxide gas laser, and therefore, a hollow guide is formed inside the outer shell layer 140.
  • the dental laser chip 100 having a structure in which the optical part 146 is formed, it can be suitably used for such a dental laser treatment apparatus.
  • FIGS. 5 (a) to 5 (d) are process diagrams in the method for manufacturing a dental laser chip according to the second embodiment.
  • Fig. 5 (c) is an enlarged cross-sectional view at the portion A in Fig. 5 (b)
  • Fig. 5 (d) is an enlarged view at the portion A in Fig. 5 (b).
  • the method for manufacturing a dental laser chip according to the second embodiment is similar to the method for manufacturing a dental laser chip according to the first embodiment, in which "a cylindrical core member preparation step” and “high light reflective metal layer formation” are performed. Process, outer shell layer forming process, and light guide section forming process in this order!
  • the shape and size of the dental laser chip to be manufactured is the same as that of the dental laser chip according to the first embodiment. This is different from the manufacturing method.
  • each process of the manufacturing method of the dental laser chip according to the second embodiment will be described with reference to FIGS.
  • a cylindrical core member 210 having a shape as shown in FIG.
  • the columnar core member 210 has a tapered portion 214 having a circular cross section and a diameter of the circle that is smaller toward the tip side.
  • the diameter D of the cross section at the end on the front end side of the cylindrical core member 210 is, for example, 300 m, and the base end side end of the cylindrical core member 210
  • the diameter D of the cross section at the section is, for example, 1000 m. Cylinder
  • Center axis 21 of cylindrical core member Angle formed between outer periphery 212 of cylindrical core member 210 and central axis 210ax of cylindrical core member when taper core member 210 is cut along a plane including Oax ⁇ is, for example, 1 °.
  • the length L of the cylindrical core member 210 is 27.5 mm, for example.
  • cylindrical core member 210 for example, a cylindrical core member made of tungsten carbide can be suitably used.
  • a highly light-reflective metal layer 220 made of gold is formed on the outer periphery of the cylindrical core member 210.
  • the highly light-reflective metal layer 220 is formed leaving a portion of a predetermined length L (for example, 7 mm) from the base end side end of the cylindrical core member 210.
  • the thickness of the high light reflective metal layer 220 is, for example, As a method for forming the highly light-reflective metal layer 220 on the outer periphery of the cylindrical core member 210, for example, a plating method (electrolytic plating method, electroless plating method) or sputtering method can be used.
  • a plating method electrolytic plating method, electroless plating method
  • sputtering method a method for forming the highly light-reflective metal layer 220 on the outer periphery of the cylindrical core member 210.
  • the outer shell layer forming step is a step of forming the outer shell layer 240 having the distal end side thin tube portion 242 and the proximal end side sleeve portion 244 on the outer periphery of the cylindrical core member 210, and is a thick layer forming step (See Fig. 4 (c).) And thick-wall layer processing (see Fig. 5 (a)).
  • a thick layer 230 made of a conductive layer is formed concentrically on the outer periphery of the cylindrical core member 210 via the highly light-reflective metal layer 220.
  • the thickness of the thick layer 230 is, for example, 600 m.
  • the thick layer 230 is made of nickel, for example, and can be formed by an electroplating method.
  • the outer shell layer having the distal end thin tube portion 242 and the proximal end sleeve portion 244 is formed. 240 is formed.
  • the thickness of the distal end side thin tube portion 242 is, for example, 50 m. Thickness of proximal sleeve 244 Varies depending on the position, and the outer diameter D of the proximal end side of the proximal end sleeve portion 244 is
  • the thickness of the predetermined portion on the base end side is reduced.
  • the light guide 246 is formed in the outer shell layer 240 by extracting the cylindrical core member 210 from the outer shell layer 240.
  • the dental laser chip 200 can be manufactured.
  • the dental laser chip manufacturing method according to the second embodiment is different from the dental laser chip manufacturing method according to the first embodiment in the shape and size of the dental laser chip to be manufactured.
  • a columnar core member preparation step, an outer shell layer formation step, and a light guide portion formation step are included in this order. It is possible to manufacture a dental laser chip having more supple and powerful properties, and the dental laser chip is more suitable for the purpose of treatment and the shape of the affected area than conventional dental laser chips. It can be manufactured.
  • the method for manufacturing a dental laser chip according to Embodiment 2 is the same as the method for manufacturing the dental laser chip according to Embodiment 1 except that the shape of the dental laser chip to be manufactured is different in size. Therefore, it has the corresponding effect as it is among the effects of the method for manufacturing a dental laser chip according to the first embodiment.
  • FIGS. 6 (a) to 6 (f) and FIGS. 7 (a) to 7 (e) are process diagrams in the method for manufacturing a dental laser chip according to the third embodiment.
  • Fig. 6 (b) is an enlarged cross-sectional view at the portion A in Fig. 6 (a)
  • Fig. 6 (e) is an enlarged view at the portion A in Fig. 6 (d).
  • Fig. 7 (d) is an enlarged cross-sectional view of the portion A in Fig. 7 (c).
  • e) is an enlarged right side view of a portion A in FIG. 7 (c).
  • the method for manufacturing a dental laser chip according to Embodiment 3 is similar to the method for manufacturing a dental laser chip according to Embodiment 1, in which "a cylindrical core member preparation step” and “highly light-reflective metal layer formation” are performed.
  • the contents of the“ outer shell layer forming step ” are the dental laser chip according to the first embodiment. This is different from the manufacturing method.
  • each process of the manufacturing method of the dental laser chip according to Embodiment 3 will be described with reference to FIGS.
  • a cylindrical core member 310 having a shape as shown in FIG. 6 (a) is prepared.
  • the cylindrical core member 310 is the same as the cylindrical core member 110 used in the dental laser chip manufacturing method according to the first embodiment.
  • a highly light-reflective metal layer 320 made of gold is formed on the outer periphery of the cylindrical core member 310.
  • the highly light-reflective metal layer 320 is formed leaving a portion of a predetermined length L (for example, 7 mm) from the end portion on the base end side of the cylindrical core member 310.
  • the thickness of the high light reflective metal layer 320 is, for example, As a method for forming the highly light-reflective metal layer 320 on the outer periphery of the cylindrical core member 310, for example, a plating method (electrolytic plating method, electroless plating method) or sputtering method can be used.
  • a plating method electrolytic plating method, electroless plating method
  • sputtering method a method for forming the highly light-reflective metal layer 320 on the outer periphery of the cylindrical core member 310.
  • the outer shell layer forming step is a step of forming an outer shell layer 340 having a distal end side thin tube portion 342 and a proximal end side sleeve portion 344 on the outer periphery of the cylindrical core member 310, and is a thin layer forming step ( 6 (d) and FIG. 6 (e)) and a thick layer forming step (see FIG. 6 (f) and FIG. 7 (a)).
  • a thin layer 330 made of a conductive layer is formed concentrically on the outer periphery of the cylindrical core member 310 via the highly light-reflective metal layer 320.
  • the thickness of the thin layer 330 is, for example, 50 / z m.
  • the thin layer 330 is made of nickel, for example, and can be formed by an electroplating method.
  • the thickness of the distal-side thin tube portion 342 is, for example, 50 ⁇ m.
  • the thickness of the proximal sleeve portion 344 differs depending on the position, and the proximal diameter D of the proximal sleeve portion 344 is
  • the thick layer 334 is formed so that it is substantially the same as the outer diameter D on the distal end side of the proximal end sleeve portion 344.
  • the thickness of the predetermined portion on the base end side is reduced.
  • all of the thick layer 334 and the highly light-reflective metal layer 320 are
  • NC cutting for example, NC cutting
  • the light guide 346 is formed in the outer shell layer 340 by extracting the cylindrical core member 310 from the outer shell layer 340.
  • the dental laser chip 300 can be manufactured.
  • the dental laser chip manufacturing method according to Embodiment 3 differs from the dental laser chip manufacturing method according to Embodiment 1 in the content of the "outer shell layer forming step".
  • the columnar core member preparation step, the outer shell layer formation step, and the light guide portion formation step are included in this order. It is possible to manufacture dental laser chips with supple characteristics, and to manufacture dental laser chips that are more compatible with the purpose of treatment and the shape of the affected area than conventional dental laser chips. Is possible.
  • the distal-side thin tube section 34 is formed by forming the thick-walled layer 334 so as to overlap the predetermined portion on the proximal-end side of the thin-walled layer 330. 2 and the proximal-side sleeve portion 344 are formed, so that the dental laser chip 300 in which the distal-side thin tube portion 342 and the proximal-side sleeve portion 344 are integrated is manufactured. It becomes possible. As a result, the distal capillary portion 342 is not easily detached from the proximal sleeve portion 344, and a highly reliable dental laser chip can be manufactured.
  • the dental laser chip manufacturing method according to the third embodiment is the same as the dental laser chip manufacturing method according to the first embodiment except that the content of the "outer shell layer forming step" is different. Therefore, it has the corresponding effect as it is among the effects of the method for manufacturing a dental laser chip according to the first embodiment.
  • FIG. 8 is a view for explaining the method of manufacturing the dental laser chip according to the fourth embodiment.
  • 8A is a perspective view of the reflecting member 450
  • FIG. 8B is a perspective view of the distal end side of the dental laser chip 400 before the reflecting member 450 is attached
  • FIG. 8D is a perspective view of the distal end side of the dental laser chip 400 after the member 450 is attached
  • FIG. 8D is a diagram schematically showing how the laser light L is reflected by the reflecting member 450.
  • FIG. 9 is a view for explaining the operational effects of the method for manufacturing a dental laser chip according to the fourth embodiment.
  • the method for manufacturing a dental laser chip according to Embodiment 4 basically includes the same steps as the method for manufacturing a dental laser chip according to Embodiment 1, This is different from the method for manufacturing a dental laser chip according to Embodiment 1 in that it further includes a reflection member attaching step later.
  • the reflecting member 450 that reflects the laser light to the side is provided at the end portion on the front end side of the outer shell layer 440.
  • a reflection member attaching step for attaching is further included.
  • the reflection member 450 includes a cap portion 452 and a reflection portion 454, as shown in FIGS. 8 (a) to 8 (d).
  • the reflector 454 has a quadrangular pyramid shape.
  • the reflective member 450 can be attached to the end of the outer shell layer 440 by brazing, for example.
  • the tip of the outer shell layer 440 in the light guide forming step is accompanied by the additional reflection member attaching step.
  • a slit 448 is formed at a predetermined position on the end side.
  • the method for manufacturing a dental laser chip according to Embodiment 4 is different from the method for manufacturing a dental laser chip according to Embodiment 1 in that a reflection member attaching step is further performed after the light guide forming step.
  • the cylindrical core member preparation step, the outer shell layer formation step, and the light guide portion formation step are included in this order. Therefore, it becomes possible to manufacture a dental laser chip having a supple characteristic than before, and a dental laser having better compatibility with the purpose of treatment and the shape of the affected part than a conventional dental laser chip. A chip can be manufactured.
  • a reflecting member 450 that reflects laser light to the side is provided at the end portion on the front end side of the outer shell layer 440. Since the reflective member attaching step for attaching is further included, the dental laser chip 400 capable of irradiating the laser beam from the laser oscillation device toward the side of the dental laser chip can be manufactured. As a result, the possible laser irradiation range is expanded, and a dental laser chip with a wider application field can be manufactured.
  • the method for manufacturing a dental laser chip according to Embodiment 4 is the same as the method for manufacturing a dental laser chip according to Embodiment 1 except that it further includes a reflecting member attaching step after the light guide forming step. Therefore, it has the corresponding effect as it is among the effects of the method for manufacturing a dental laser chip according to the first embodiment.
  • the reflecting member 454 having the quadrangular pyramid shape force is used as the reflecting member, but the present invention is not limited to this. It is not something.
  • FIG. 10 is a diagram for explaining a modification of the reflecting member.
  • Fig. 10 (a) to Fig. 10 (d) These are the perspective views of the reflective members 450a-450d of the modified examples 1-4.
  • the reflecting member 450a of Modification 1 has an octagonal pyramid shape force in the reflecting portion 454a.
  • the reflecting member 450b of Modification 2 has a reflecting portion 454b having a conical shape.
  • the reflecting members 450c and 450d of the modified examples 3 and 4 have the reflecting portions 454c and 454d force S as well as the shape forces shown in FIGS. 10 (c) and 10 (d). Even when the reflection members 450a to 450d of the modified examples 1 to 4 are used as the reflection member, the dental light that can reflect the laser light from the light guide portion in the outer shell layer to the side is used. Laser chips can be manufactured.
  • the reflecting member 450 is attached to the end surface of the outer shell layer 440 by brazing has been described as an example, but the present invention is not limited thereto.
  • the reflecting member may be attached to the end face of the outer shell layer by press fitting, or the reflecting member may be attached to the end face of the outer shell layer by a joining method such as plating joining.
  • FIG. 11 and FIG. 12 are views for explaining the method for manufacturing the dental laser chip according to the fifth embodiment.
  • FIGS. 11 (a) to 11 (e) and FIGS. 12 (a) to 12 (d) are process diagrams in the method for manufacturing a dental laser chip according to the fifth embodiment.
  • Fig. 11 (b) is an enlarged cross-sectional view of the portion A in Fig. 11 (a)
  • Fig. 12 (c) is the portion A in Fig. 12 (b).
  • FIG. 7 8 is an enlarged cross-sectional view of 8 part
  • Fig. 12 (d) is an enlarged view of part A in Fig. 12 (b)
  • the method for manufacturing a dental laser chip according to Embodiment 5 basically includes the same steps as the method for manufacturing a dental laser chip according to Embodiment 1, but a highly light-reflective metal layer is formed.
  • the dental laser chip according to Embodiment 1 in that it further includes a high heat conductive metal layer forming step of forming a high heat conductive metal layer on the outer periphery of the high light reflective metal layer between the step and the outer shell layer forming step. This is different from the manufacturing method.
  • the method for manufacturing a dental laser chip according to Embodiment 5 includes a “cylindrical core member preparation step”, a “high light reflective metal layer forming step”, a “high heat conductive metal layer forming step”, and an “outer shell layer”.
  • the “forming process” and the “light guide forming process” are sequentially performed. Hereinafter, these steps will be described with reference to FIG. 11 and FIG. [0125] 1.
  • a cylindrical core member 510 having a shape as shown in FIG. 11 (a) is prepared.
  • the cylindrical core member 510 is the same as the cylindrical core member 110 used in the dental laser chip manufacturing method according to the first embodiment.
  • a highly light-reflective metal layer 520 having a metallic force is formed on the outer periphery of the cylindrical core member 510.
  • the highly light-reflective metal layer 520 is formed leaving a portion of a predetermined length L (for example, 7 mm) from the base end side end portion of the cylindrical core member 510.
  • the thickness of the high light reflective metal layer 520 is, for example, As a method for forming the highly light-reflective metal layer 520 on the outer periphery of the cylindrical core member 510, for example, a plating method (electrolytic plating method, electroless plating method) or sputtering method can be used.
  • a high heat conductive metal layer 550 made of silver is formed on the outer periphery of the high light reflective metal layer 520.
  • the highly thermally conductive metal layer 550 is formed leaving a portion of a predetermined length L (for example, 7 mm) from the base end side end of the cylindrical core member 510.
  • the thickness of the high thermal conductive metal layer 550 is, for example, 15 m.
  • a method for forming the high thermal conductive metal layer 550 for example, a plating method (electrolytic plating method, electroless plating method) or a notching method can be used.
  • the outer shell layer forming step is a step of forming the outer shell layer 540 having the distal end side thin tube portion 542 and the proximal end side sleeve portion 544 on the outer periphery of the cylindrical core member 510, and according to the first embodiment.
  • it includes a thick layer forming process (see Fig. Ll ( e )) and a thick layer processing step (see Fig. 12 (a)).
  • a thick layer 530 made of a conductive layer is formed concentrically on the outer periphery of the cylindrical core member 550 via the highly light reflective metal layer 520 and the highly thermally conductive metal layer 550.
  • the thickness of the thick layer 530 is, for example, 485 m.
  • the thick layer 530 is made of nickel, for example. Thus, it can be formed by an electroplating method.
  • the outer shell layer 540 having the distal end side thin tube portion 542 and the proximal end side sleeve portion 544 is reduced by reducing the thickness of the predetermined portion on the distal end side in the thick layer 530.
  • the wall thickness of the distal side thin tube portion 542 is, for example, 35 m.
  • the thickness of the proximal end sleeve portion 544 differs depending on the position, and the proximal end outer diameter D of the proximal end sleeve portion 544 is
  • the thickness of the predetermined portion on the base end side is reduced.
  • the cylindrical core member 510 is extracted from the outer shell layer 540 to form the light guide portion 546 in the outer shell layer 540.
  • the dental laser chip 500 can be manufactured.
  • the method for manufacturing a dental laser chip according to Embodiment 5 has a high thermal conductivity on the outer periphery of the high light reflective metal layer between the high light reflective metal layer forming step and the outer shell layer forming step.
  • it differs from the method of manufacturing the dental laser chip according to the first embodiment in that it further includes a step of forming a highly thermally conductive metal layer for forming a metal layer, the manufacturing of the dental laser chip according to the first embodiment is performed.
  • the dental laser chip since the cylindrical core member preparation step, the outer shell layer forming step, and the light guide portion forming step are included in this order, the dental laser chip has a supple property than before. This makes it possible to manufacture a dental laser chip that is more compatible with the purpose of treatment and the shape of the affected part than conventional dental laser chips.
  • the high thermal conductivity gold The metal layer 550 functions as a heat sink, and heat generated in the highly light-reflective metal layer 530 can be effectively released, so that higher-power laser light can be used.
  • the method for manufacturing a dental laser chip according to Embodiment 5 is the same as the method for manufacturing the dental laser chip according to Embodiment 1 except that the method further includes a step of forming a highly thermally conductive metal layer. Therefore, it has the corresponding effect as it is among the effects of the method for manufacturing the dental laser chip according to the first embodiment.
  • the force that forms the outer shell layers 140, 240, 340, and 540 that also have nickel force as the outer shell layer is not limited.
  • the outer shell layer for example, an outer shell layer made of nickel alloy is formed.
  • the outer shell layers 140, 240, 340, and 540 which are nickel, are formed by the electroplating method.
  • the invention is not limited to this, and an outer shell layer composed of a resin layer may be formed by a coating method.
  • the inner surface of the outer shell layer 140, 240, 340, 540 is composed of the highly light-reflective metal layer 120, 220, 320, 520.
  • the present invention is not limited to this, and includes, for example, the case where a dielectric layer is formed on the inner surface of the outer shell layer. In this case, it becomes possible to increase the reflectance of the far-infrared light in the light guide section, and the inner surface of the outer shell layer (for example, an electric layer or a highly light-reflective metal layer) is exposed to the outside air. It is possible to protect it, and a highly reliable dental label One chip can be manufactured.
  • the power of the dental laser chip manufactured by the method of manufacturing a dental laser chip of each of the embodiments described above is exemplified for use in a dental laser treatment apparatus including a carbon dioxide laser. Is not limited to this. For example, it can be used in a dental laser treatment apparatus equipped with an Er: YAG laser, Nd: YAG laser, semiconductor laser or other laser.

Abstract

La présente invention concerne un procédé de production d'une pointe de laser pour dentisterie utilisée dans un équipement de traitement dentaire par laser comprenant successivement une étape fournissant un élément central cylindrique (110) présentant une partie effilée avec une coupe transversale circulaire dans laquelle le diamètre du cercle se réduit vers le côté de la pointe, une étape de formation d'une couche d'enveloppe (140) comportant une partie de tube mince latérale distale (142) et une partie de manchon latérale proximale (144) sur la circonférence externe de l'élément central cylindrique (110), et une étape de formation d'une partie de guidage de la lumière (146) sur la couche d'enveloppe (140) en tirant l'élément central cylindrique (110) à partir de la couche d'enveloppe (140). Selon le procédé de l'invention, une pointe de laser pour dentisterie (100) présentant des propriétés plus souples qu'avec l'art antérieur et montrant une meilleure adaptabilité aux fins du traitement ou de la forme d'une partie affectée qu'avec l'art antérieur, peut être fabriquée.
PCT/JP2006/317643 2006-09-06 2006-09-06 procédé de production d'une pointe de laser pour dentisterie WO2008029456A1 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
PCT/JP2006/317643 WO2008029456A1 (fr) 2006-09-06 2006-09-06 procédé de production d'une pointe de laser pour dentisterie

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2006/317643 WO2008029456A1 (fr) 2006-09-06 2006-09-06 procédé de production d'une pointe de laser pour dentisterie

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WO2008029456A1 true WO2008029456A1 (fr) 2008-03-13

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Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0196602A (ja) * 1987-10-08 1989-04-14 Hitachi Cable Ltd 中空光導波路の製造方法
JPH05344982A (ja) * 1991-11-27 1993-12-27 Morita Mfg Co Ltd レーザ医療装置
JPH09173353A (ja) * 1995-12-27 1997-07-08 Matsushita Electric Ind Co Ltd プローブ装置
JPH1062633A (ja) * 1996-08-22 1998-03-06 New Japan Radio Co Ltd 導波路及びその製造方法
JPH10221544A (ja) * 1997-02-07 1998-08-21 Mitsunobu Miyagi レーザプローブ
JP2003310639A (ja) * 2002-04-19 2003-11-05 Mitsunobu Miyagi レーザプローブ、レーザハンドピース並びに医療用レーザ装置

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0196602A (ja) * 1987-10-08 1989-04-14 Hitachi Cable Ltd 中空光導波路の製造方法
JPH05344982A (ja) * 1991-11-27 1993-12-27 Morita Mfg Co Ltd レーザ医療装置
JPH09173353A (ja) * 1995-12-27 1997-07-08 Matsushita Electric Ind Co Ltd プローブ装置
JPH1062633A (ja) * 1996-08-22 1998-03-06 New Japan Radio Co Ltd 導波路及びその製造方法
JPH10221544A (ja) * 1997-02-07 1998-08-21 Mitsunobu Miyagi レーザプローブ
JP2003310639A (ja) * 2002-04-19 2003-11-05 Mitsunobu Miyagi レーザプローブ、レーザハンドピース並びに医療用レーザ装置

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