WO2008029456A1

WO2008029456A1 - Method for producing dental laser tip

Info

Publication number: WO2008029456A1
Application number: PCT/JP2006/317643
Authority: WO
Inventors: Chiaki Abe; Kenichi Shimodaira; Tsutomu Nishimura; Takashi Hagi; Michio Ito
Original assignee: Homs Engineering Inc.
Priority date: 2006-09-06
Filing date: 2006-09-06
Publication date: 2008-03-13

Abstract

A method for producing a dental laser tip used in dental laser treatment equipment sequentially comprising a step for providing a cylindrical core member (110) having a tapered portion with a circular cross-section where the diameter of the circle becomes smaller toward the tip side, a step for forming a shell layer (140) having a distal side thin tube portion (142) and a proximal side sleeve portion (144) on the outer circumference of the cylindrical core member (110), and a step for forming a light guide portion (146) on the shell layer (140) by drawing out the cylindrical core member (110) from the shell layer (140). According to the inventive method for producing a dental laser tip, a dental laser tip (100) having more flexible properties than by prior art can be produced, and a dental laser tip exhibiting better adaptability for the purpose of treatment or the shape of an affected part than by prior art can be produced.

Description

Specification

Manufacturing method of dental laser chip

Technical field

The present invention relates to a method for manufacturing a dental laser chip.

Background art

[0002] Dental laser treatment devices are used for dental treatment such as calculus removal, caries removal, periodontal pocket curettage, gingival remodeling, bandectomy, gingival incision, anesthesia, and pigmentation removal. (For example, see Patent Document 1.) o

FIG. 13 is a diagram for explaining a conventional dental laser treatment apparatus 900 described in Patent Document 1. In FIG. FIG. 13A is an external view of the dental laser treatment apparatus 900, and FIG. 13B is a partial cross-sectional view of a dental handpiece 930 used in the dental laser treatment apparatus 900.

FIG. 14 is a view for explaining a dental laser chip 940 that is replaceably attached to the distal end of the dental handpiece main body 932. 14 (a) is a diagram showing various shapes of the second light guiding fiber 942 in the dental laser chip 940, and FIG. 14 (b) is various shapes of the second light guiding fiber protective tube 944 in the dental laser chip 940. FIG.

[0005] As shown in FIG. 13 (a), a conventional dental laser treatment apparatus 900 includes a laser oscillation apparatus 910, a dental handpiece 930, and laser light from the laser oscillation apparatus 910 as a dental handpiece. And a light guide fiber 920 for guiding light to 930. The laser oscillation device 910 includes an Er: YAG laser 912 and a control device 914 that controls the Er: YAG laser 912. The dental handpiece 930 includes a dental handpiece body 932 and a dental laser chip 940, and the dental laser chip 940 is replaceably attached to the tip of the dental handpiece body 932.

As shown in FIG. 13 (b), the dental laser chip 940 includes a second light guide fiber 942 for guiding the laser light guided by the light guide fiber 920 to the affected area, and a second guide. And a second light guiding fiber protective tube 944 for protecting the optical fiber 942. As shown in FIG. 14, the second light guiding fiber 942 and the second light guiding fiber protective tube 944 are prepared in various shapes. Yes.

[0007] The dentist selects the second light guide fiber 942 and the second light guide fiber protective tube 944 having various shapes as shown in FIG. 14 according to the purpose of treatment and the shape of the affected part, for example. By selecting the second light guide fiber 942 and the second light guide fiber protective tube 944 having the optimum shape, a dental laser chip 940 is constructed and attached to the tip of the dental handpiece body 932. Therefore, it is possible to perform an appropriate treatment for the patient.

[0008] Patent Document 1: Japanese Patent Laid-Open No. 5-344982

Disclosure of the invention

Problems to be solved by the invention

[0009] However, since the purpose of treatment and the shape of the affected area are various, it is practically difficult to prepare a dental laser chip applicable to all of them. In the dental laser chip 940 in the treatment apparatus 900, the shape of the dental laser chip may not be adequately adapted to the purpose of treatment and the shape of the affected part depending on the purpose of treatment and the shape of the affected part. There's a problem.

[0010] Note that this problem is not a problem seen only when a laser oscillation device including an Er: YAG laser is used. A laser oscillation device including another laser such as an Nd: YAG laser, a carbon dioxide gas laser, or a semiconductor laser is used. It is a problem that can be seen in some cases as well.

Accordingly, the present invention has been made to solve the above-described problems, and is a dental laser that is more compatible with the purpose of treatment and the shape of the affected area than conventional dental laser chips. It is an object of the present invention to provide a method for manufacturing a dental laser chip capable of manufacturing the chip.

Means for solving the problem

[0012] (1) The method for producing a dental laser chip of the present invention is a method for producing a dental laser chip used in a dental laser treatment apparatus, wherein the cross-section is circular and the diameter of the circle is the tip. A cylindrical core member preparing step for preparing a cylindrical core member having a tapered portion that is smaller toward the side, and an outer shell layer having a distal-side thin tube portion and a proximal-side sleeve portion formed on the outer periphery of the cylindrical core member An outer shell layer forming step, and a light guide portion forming step for forming a light guide portion on the outer shell layer by extracting the cylindrical core member from the outer shell layer in this order. It is characterized by.

[0013] Therefore, according to the method for manufacturing a dental laser chip of the present invention, the outer shell layer having the tip side narrow tube portion is formed on the outer periphery of the cylindrical core member having the tapered portion having the shape force described above. Therefore, it becomes possible to manufacture a dental laser chip having a structure that becomes thinner toward the tip side.

As a result, it is possible to manufacture dental laser chips that have more flexible properties than conventional ones, and are more suitable for the purpose of treatment and the shape of the affected area than conventional dental laser chips. It becomes possible to manufacture a laser chip for use.

[0014] Further, according to the method for manufacturing a dental laser chip of the present invention, the outer shell layer having the proximal end sleeve portion is formed on the outer periphery of the cylindrical core member having the taper portion having the above shape. Therefore, the outer diameter of the proximal end sleeve portion is large, and it becomes possible to manufacture a dental laser chip that can be easily attached to the dental handpiece body.

[0015] Further, according to the method for manufacturing a dental laser chip of the present invention, since the light guide portion is formed in the outer shell layer by extracting the cylindrical core member from the outer shell layer, the cylindrical core is provided. By using a cylindrical core member having a high surface accuracy as a member, it becomes possible to manufacture a dental laser chip with a high inner surface accuracy and a high light transmission rate.

[0016] (2) In the method for manufacturing a dental laser chip according to (1), the outer shell layer forming step includes forming a thick layer concentrically on the outer periphery of the cylindrical core member. A thick layer processing for forming the outer shell layer having the distal end side tubular portion and the proximal end side sleeve portion by thinning the thickness of the predetermined portion on the distal end side in the thick layer; It is preferable to include the steps in this order.

[0017] By adopting such a method, it becomes possible to manufacture a dental laser chip in which the distal-side thin tube portion and the proximal-side sleeve portion are integrated. The sleeve part is not easily detached, and a highly reliable dental laser chip can be manufactured.

[0018] (3) In the method for manufacturing a dental laser chip described in (2) above, it is preferable that a thick layer composed of an electrode layer is formed in the thick layer forming step.

By adopting such a method, the surface shape of the cylindrical core member is accurately transferred to the inner surface. Therefore, it is possible to manufacture a dental laser chip with extremely high inner surface accuracy and thus high light transmission rate by using a cylindrical core member with extremely high surface accuracy. It becomes possible.

[0020] Nickel or a nickel alloy is preferably used as the metal constituting the electrode layer.

[0021] (4) In the method for manufacturing a dental laser chip according to (2) above, it is also preferable to form a thick layer made of a resin layer in the thick layer forming step.

[0022] According to such a method as well, it is possible to form an outer shell layer in which the surface shape of the cylindrical core member is precisely transferred to the inner surface, and therefore a circle with extremely high surface accuracy. By using the columnar core member, it becomes possible to manufacture a dental laser chip with extremely high inner surface accuracy and high light transmission rate.

[0023] The resin constituting the resin layer is not particularly limited. For example, ABS (acrylonitrile.butadiene-styrene copolymer) resin, PBT (polybutylene terephthalate) resin, PPS (polyphenol) -Rensulfide) resin, polyimide resin, fluorine resin, cyclic polyolefin resin, etc. can be used.

[0024] (5) In the method for manufacturing a dental laser chip according to any one of (2) to (4) above, in the thick layer processing step, in the proximal end sleeve portion, It is preferable to reduce the thickness of the predetermined portion on the base end side in the thick layer so that the outer diameter on the base end side is substantially the same as the outer diameter on the front end side of the base end side sleeve portion.

By using such a method, it is possible to manufacture a dental laser chip in which the proximal outer diameter of the proximal sleeve portion and the distal outer diameter of the proximal sleeve portion are substantially the same. This makes it possible to manufacture a dental laser chip that is easier to attach to the dental handpiece body.

(6) In the method for manufacturing a dental laser chip according to (1), the outer shell layer forming step forms a thin layer concentrically on the outer periphery of the cylindrical core member. Forming a thick layer over the base end predetermined portion of the thin layer to form the outer shell layer having the distal end side thin tube portion and the proximal end side sleeve portion. It is preferable to include the production process in this order. [0027] By adopting such a method as well, as in the method for producing a dental laser chip described in (2) above, a dental in which the distal side thin tube portion and the proximal side sleeve portion are integrated. As a result, it is possible to manufacture a dental laser chip with high reliability and without the tip side narrow tube portion being easily detached from the proximal end sleeve portion. It becomes possible.

[0028] (7) In the method for producing a dental laser chip according to (6), in the thin layer forming step, a thin layer composed of an electrode layer is formed, and in the thick layer forming step, It is preferable to form a thick layer composed of an electroplating layer.

[0029] By adopting such a method, it is possible to form an outer shell layer in which the surface shape of the cylindrical core member is precisely transferred to the inner surface, so that the cylindrical core member has extremely high surface accuracy. By using this, it becomes possible to manufacture a dental laser chip with extremely high inner surface accuracy and thus a high light transmission rate.

[0030] As the metal constituting the electrode layer, nickel or a nickel alloy is preferably used.

[0031] (8) In the method for producing a dental laser chip according to (6), in the thin layer forming step, a thin layer composed of a resin layer is formed, and in the thick layer forming step, It is preferable to form a thick layer consisting of a cocoon layer.

[0032] According to such a method as well, it is possible to form an outer shell layer in which the surface shape of the cylindrical core member is precisely transferred to the inner surface, and thus a circle with extremely high surface accuracy. By using the columnar core member, it becomes possible to manufacture a dental laser chip with extremely high inner surface accuracy and high light transmission rate.

[0033] The resin constituting the resin layer is not particularly limited. For example, ABS (acrylonitrile.butadiene-styrene copolymer) resin, PBT (polybutylene terephthalate) resin, PPS (polyphenol) -Rensulfide) resin, polyimide resin, fluorine resin, cyclic polyolefin resin, etc. can be used.

[0034] (9) In the method for manufacturing a dental laser chip according to any one of (6) to (8) above, the outer shell layer forming step is the same as the thick layer forming step. Later, the proximal-side outer diameter of the proximal-side sleeve is substantially the same as the distal-side outer diameter of the proximal-side sleeve. Thus, it is preferable to further include a thick layer processing step for reducing the thickness of the predetermined portion on the base end side in the thick layer.

[0036] (10) In the method for manufacturing a dental laser chip according to any one of (1) to (9), the diameter of the circle at the end on the front end side of the cylindrical core member is π! Preferable to be in the range of ~ 500 m.

[0037] By adopting such a method, it becomes possible to manufacture a dental laser chip having a thin outer diameter at a predetermined portion of the tip. As a result, it is possible to manufacture dental laser chips with more supple and powerful properties, and it is possible to manufacture dental laser chips that are more compatible with the purpose of treatment and the shape of the affected area. It becomes.

[0038] The reason why the diameter of the circle is in the range of 40 μm to 500 μm is that the laser beam may be excessively concentrated when the diameter of the circle is less than 10 μm. This is because the elasticity of the outer shell layer may be insufficient if the diameter of the circle exceeds 500 μm. From the above viewpoint, the diameter of the circle is more preferably in the range of 60 / ζ πι to 300 / ζ πι.

[0039] (11) In the method for manufacturing a dental laser chip according to any one of the above (1) to (10), the thickness of the outer shell layer in the predetermined portion on the tip side is 10 111 to 100. It is preferably within the range of 111.

[0040] By adopting such a method, it becomes possible to manufacture a dental laser chip having a thin thickness and a thin outer diameter at a predetermined portion of the tip. As a result, it becomes possible to manufacture a dental laser chip having more supple and powerful properties, and it is possible to manufacture a dental laser chip that is more compatible with the purpose of treatment and the shape of the affected part. Become.

[0041] It should be noted that the thickness of the outer shell layer is 10 m to: LOO m because the mechanical strength of the outer shell layer is insufficient when the thickness of the outer shell layer is less than 10 m. If the thickness of the outer shell layer exceeds 100 m, the elasticity of the outer shell layer may be insufficient. Because there is. From these viewpoints, the thickness of the outer shell layer is more preferably in the range of 30 μm to 80 μm.

[0042] (12) In the method for manufacturing a dental laser chip according to any one of (1) to (11), the cylindrical core member is cut along a plane including a central axis of the cylindrical core member. In this case, it is preferable that the angle 0 formed by the outer peripheral portion of the cylindrical core member and the central axis of the cylindrical core member in the tapered portion is in the range of 0.2 ° to 5 °.

[0043] By adopting such a method, it becomes possible to manufacture a dental laser chip having a structure in which the outer diameter gradually decreases toward the distal end side. As a result, it is possible to manufacture a dental laser chip having even more powerful properties, and it is possible to manufacture a dental laser chip that is more compatible with the purpose of treatment and the shape of the affected part. It becomes.

Note that the angle Θ is set to 0.2 ° to 5 ° when the angle Θ is less than 0.2 °. If the angle Θ exceeds 5 °, the taper angle of the distal capillary is too strong and the distal capillary is maintained while maintaining the strength. This is because it becomes difficult to make the required length. In view of these viewpoints, the angle Θ is preferably in the range of 0.5 ° to 2 °.

[0045] (13) In the method for producing a dental laser chip according to any one of (1) to (12), between the cylindrical core member preparation step and the outer shell layer forming step, The method further includes a high light reflective metal layer forming step of forming a high light reflective metal layer on an outer periphery of the cylindrical core member, and the outer shell layer forming step includes the cylindrical core through the high light reflective metal layer. It is preferable to form the outer shell layer on the outer periphery of the member.

[0046] By adopting such a method, it becomes possible to increase the reflectivity of far-infrared light in the light guide section, so that the light-transmittance of far-infrared light is increased and a carbon dioxide laser is used. It is possible to manufacture a dental laser chip particularly suitable for a dental treatment laser device provided with a laser oscillation device.

In this specification, the “highly light-reflective metal layer” refers to a layer having a far infrared reflectivity made of a relatively high metal. [0048] As the metal constituting the highly light-reflective metal layer, gold, silver, copper or other metals can be preferably used. Among these metals, gold is particularly preferable because it has high infrared reflectivity and high chemical durability.

[0049] The thickness of the highly light-reflective metal layer is preferably a value in the range of 1 μm to 10 m.

A value in the range of 2 μm to 5 μm is more preferable.

[0050] As a method of forming the highly light-reflective metal layer, a plating method or a sputtering method can be preferably used.

[0051] (14) In the method for manufacturing a dental laser chip according to (13), the high light reflective metal layer is interposed between the high light reflective metal layer forming step and the outer shell layer forming step. A high heat conductive metal layer forming step of forming a high heat conductive metal layer on the outer periphery of the outer shell layer. In the outer shell layer forming step, the high light reflective metal layer and the high heat conductive metal layer are provided. The outer shell layer is preferably formed on the outer periphery of the cylindrical core member.

[0052] By adopting such a method, the highly thermally conductive metal layer functions as a heat sink, and heat generated in the highly light reflective metal layer can be effectively released.

[0053] As the metal constituting the highly thermally conductive metal layer, copper, silver, aluminum or other metals can be preferably used.

[0054] The layer thickness of the high thermal conductive metal layer is preferably a value in the range of 5 μm to 50 μm.

A value in the range of 10 μm to 20 μm is more preferable.

[0055] As a method for forming the high thermal conductivity metal layer, a plating method or a sputtering method can be preferably used.

[0056] (15) In the method for manufacturing a dental laser chip according to any one of (1) to (14), a dielectric layer is formed on an inner surface of the outer shell layer after the light guide portion forming step. It is preferable that the method further includes a dielectric layer forming step of forming.

[0057] By adopting such a method, if the dielectric layer is formed so that the far-infrared reflectance is increased, the far-infrared light reflectance in the light guide section can be increased. Therefore, it is possible to manufacture a dental laser chip particularly suitable for a dental treatment laser device including a laser oscillation device using a carbon dioxide laser that has a high light transmittance of far infrared light. [0058] In addition, it becomes possible to protect the inner surface of the outer shell layer (for example, an electric layer or a highly light-reflective metal layer) from the outside air, and a highly reliable dental laser chip can be manufactured. .

[0059] (16) In the method for manufacturing a dental laser chip according to any one of (1) to (15) above, a reflecting member that reflects laser light laterally after the light guide portion forming step. It is preferable that the method further includes a reflection member attaching step of attaching to the end of the outer shell layer.

[0060] By adopting such a method, it becomes possible to manufacture a dental laser chip that can irradiate the laser beam from the laser oscillation device toward the side of the dental laser chip. . As a result, the range in which laser irradiation can be performed is widened, and a dental laser chip with a wider application field can be manufactured.

(17) In the method for manufacturing a dental laser chip according to any one of (1) to (16), the dental laser treatment device is a laser treatment device including a carbon dioxide laser. Is preferred.

[0062] In a laser treatment apparatus equipped with a carbon dioxide laser, far-infrared light (e = 10.6 m), which is difficult to guide with an optical fiber, is used. Even in such a case, by using the method as described above, a dental laser chip having a structure in which a hollow light guide portion is formed inside the outer shell layer is manufactured. It can be suitably used for a dental laser treatment apparatus.

Brief Description of Drawings

FIG. 1 is a view for explaining a method for producing a dental laser chip according to Embodiment 1.

FIG. 2 is a view for explaining the method for manufacturing the dental laser chip according to the first embodiment.

FIG. 3 is a view for explaining the function and effect of the method for producing a dental laser chip according to the first embodiment.

FIG. 4 is a view for explaining the method for manufacturing the dental laser chip according to the second embodiment.

FIG. 5 is a view for explaining the method for manufacturing the dental laser chip according to the second embodiment. FIG. 6 is a view for explaining the method for manufacturing the dental laser chip according to the third embodiment.

FIG. 7 is a view for explaining the method for manufacturing the dental laser chip according to the third embodiment.

FIG. 8 is a view for explaining the method for manufacturing the dental laser chip according to the fourth embodiment.

FIG. 9 is a view for explaining the effects of the method for manufacturing a dental laser chip according to Embodiment 4.

FIG. 10 is a view for explaining a modification of the reflecting member.

FIG. 11 is a view for explaining the method for manufacturing the dental laser chip according to the fifth embodiment.

FIG. 12 is a view for explaining the method for manufacturing the dental laser chip according to the fifth embodiment.

FIG. 13 is a view for explaining a conventional dental laser treatment apparatus 900. FIG.

FIG. 14 is a view for explaining a dental laser chip 940 that is replaceably attached to the tip of a dental handpiece body 932.

BEST MODE FOR CARRYING OUT THE INVENTION

Hereinafter, a method for manufacturing a dental laser chip of the present invention will be described based on the embodiment shown in the drawings.

[0065] [Embodiment 1]

1 and 2 are views for explaining a method for manufacturing a dental laser chip according to the first embodiment. 1 (a) to 1 (d) and FIGS. 2 (a) to 2 (d) are process diagrams in the method for manufacturing a dental laser chip according to the first embodiment. Fig. 1 (b) is an enlarged cross-sectional view at the portion A in Fig. 1 (a), and Fig. 2 (c) is an enlarged view at the portion A in Fig. 2 (b).

1 2

FIG. 2 (d) is an enlarged right side view of the portion A in FIG. 2 (b). Figure

2

FIG. 3 is a view for explaining the operational effects of the method for manufacturing a dental laser chip according to the first embodiment.

The method for manufacturing a dental laser chip according to Embodiment 1 is used for a dental laser treatment apparatus. This is a method for manufacturing dental laser chips, in which the `` columnar core member preparation process '', `` high light reflective metal layer formation process '', `` outer shell layer formation process '' and `` light guide section formation process '' are sequentially performed It is done. Hereinafter, each of these steps will be described with reference to FIG. 1 and FIG.

[0067] 1. Columnar core member preparation process

First, a cylindrical core member 110 having a shape as shown in FIG. The cylindrical core member 110 has a tapered portion 114 having a circular cross section and a diameter of the circle that is smaller toward the tip side. The diameter D (see FIG. 1 (b)) of the cross section at the end on the front end side of the cylindrical core member 110 (the right end of FIG. 1 (a)) is, for example, 100 m. The diameter D of the cross section at the base end side (the left end in FIG. 1 (a)) is 1000, for example.

2

m. The center axis l of the cylindrical core member l When the cylindrical core member 110 is cut along a plane including lOax, the outer periphery 112 of the cylindrical core member 110 in the tapered portion 114 and the central axis l lOax of the cylindrical core member The angle 0 made is, for example, 0.75 °. The length L of the cylindrical core member 110 is, for example, 42.5 mm.

As the cylindrical core member 110, for example, a cylindrical core member made of tungsten carbide can be suitably used. A cylindrical core member having tungsten carnoid force can be extremely hard but can have extremely high surface accuracy.

[0068] 2. High light reflective metal layer forming step

Next, as shown in FIG. 1 (c), a highly light reflective metal layer 120 made of gold is formed on the outer periphery of the cylindrical core member 110. At this time, the highly light-reflective metal layer 120 is formed leaving a portion of a predetermined length L (for example, 7 mm) from the base end side end portion of the cylindrical core member 110.

2

The thickness of the high light reflective metal layer 120 is, for example, As a method for forming the highly light-reflective metal layer 120 on the outer periphery of the cylindrical core member 110, for example, a plating method (electrolytic plating method, electroless plating method) or a sputtering method can be used.

[0069] 3. Outer shell layer formation process

The outer shell layer forming step is a step of forming the outer shell layer 140 having the distal end side thin tube portion 142 and the proximal end side sleeve portion 144 on the outer periphery of the cylindrical core member 110, and is a thick layer forming step (See Fig. 1 (d).) And thick layer processing step (see Fig. 2 (a)).

[0070] (1) Thick layer forming step First, as shown in FIG. 1 (d), a thick layer 130 made of a conductive layer is formed concentrically on the outer periphery of the cylindrical core member 110 with the highly light-reflective metal layer 120 interposed therebetween.

The thickness of the thick layer 130 is, for example, 500 / z m. The thick layer 130 is made of nickel, for example, and can be formed by an electroplating method.

[0071] (2) Thick layer processing step

Next, as shown in FIG. 2 (a), by reducing the thickness of the predetermined portion on the distal end side of the thick layer 130, the outer shell layer having the distal-side thin tube portion 142 and the proximal-side sleeve portion 144. 140 is formed.

The wall thickness of the distal end side thin tube 142 is, for example, 50 m. The thickness of the base end side sleeve portion 144 varies depending on the position, and the base end side outer diameter D of the base end side sleeve portion 144 is

3 Make the thick layer 130 so that it is almost the same as the outer diameter D at the distal end of the proximal sleeve 144.

Four

The thickness of the predetermined portion on the base end side is reduced.

[0072] In the portion R between the distal side narrow tube part 142 and the proximal side sleeve part 144, cutting with a predetermined curvature (for example, a radius of curvature R = 0.4 mm) (for example, NC cutting, etc.) .) Is given. In addition, the thick layer 130 and the highly light-reflective metal layer 120 are removed in the portion R where the proximal end surface force in the thick layer 130 is also 0.5 mm.

2

[0073] 4. Light guide formation process

Then, as shown in FIGS. 2 (b) to 2 (d), the cylindrical core member 110 is removed from the outer shell layer 140 to form a light guide 146 in the outer shell layer 140.

[0074] As described above, the dental laser chip 100 can be manufactured. By attaching a dental laser chip 100 to the tip of a dental handpiece body (both not shown) in a dental laser treatment apparatus, for example, the deepest part of the root canal that gradually bends toward the back. it becomes possible to irradiate the laser beam (see FIG. 3.) ₀

As described above, the method for manufacturing a dental laser chip according to Embodiment 1 is a method for manufacturing a dental laser chip used in a dental laser treatment apparatus, and as described above, a cylindrical core member preparation The process, the outer shell layer forming process, and the light guide part forming process are included in this order.

Therefore, according to the method for manufacturing a dental laser chip according to the first embodiment, the distal-side thin tube portion 142 is provided on the outer periphery of the cylindrical core member 110 having the tapered portion 112 having the above-described shape force. Since the outer shell layer 140 is formed, it is possible to manufacture a dental laser chip having a structure that becomes thinner toward the tip side.

In addition, according to the method for manufacturing a dental laser chip according to the first embodiment, the outer periphery having the proximal end sleeve portion 144 on the outer periphery of the cylindrical core member 110 having the tapered portion 112 having the above shape. Since the shell layer 140 is formed, the proximal end sleeve portion 144 has a large outer diameter, and a dental laser chip that can be easily attached to the dental handpiece body can be manufactured. .

Further, according to the method for manufacturing a dental laser chip according to the first embodiment, the light guide 146 is formed in the outer shell layer 140 by extracting the cylindrical core member 110 from the outer shell layer 140. Therefore, by using the cylindrical core member 110 with high surface accuracy as the cylindrical core member, it is possible to manufacture a dental laser chip with high inner surface accuracy and high light transmission rate.

In addition, according to the method for manufacturing a dental laser chip according to Embodiment 1, the distal end side thin tube portion 142 and the proximal end side slit are made thinner by reducing the thickness of the predetermined portion on the distal end side in the thick layer 130. Since the outer shell layer 140 having the groove portion 144 is formed, it is possible to manufacture the dental laser chip 100 in which the distal-side thin tube portion 142 and the proximal-side sleeve portion 144 are integrally formed. Become. As a result, the distal-side thin tube portion 142 is not easily detached from the proximal-side sleeve portion 144, and a highly reliable dental laser chip can be manufactured.

[0080] Further, according to the method for manufacturing a dental laser chip according to the first embodiment, in the thick layer forming step, the thick layer 130 composed of the electroplating layer is formed. It is possible to form the outer shell layer 140 in which the surface shape of the member 110 is precisely transferred to the inner surface. For this reason, by using the cylindrical core member 110 with extremely high surface accuracy, it is possible to manufacture a dental laser chip with extremely high inner surface accuracy and high light transmission rate. In the method for manufacturing a dental laser chip according to Embodiment 1, in the outer shell layer processing step, the proximal-side outer diameter D of the proximal-side sleeve portion 144 is equal to the proximal-side sleeve portion.

Three

The proximal end side of the thick layer 130 is substantially the same as the outer diameter D of the distal end side of 144.

Four

The thickness of the fixed part is to be reduced. As a result, the proximal end outer diameter D of the proximal end sleeve portion 144 and the distal end outer diameter D of the proximal end sleeve portion 144 are substantially the same.

3 4

The dental laser chip 100 can be manufactured, and a dental laser chip that can be more easily attached to the dental handpiece body can be manufactured.

[0082] Further, according to the method for manufacturing a dental laser chip according to Embodiment 1, the diameter of the cross section at the end portion on the distal end side of the cylindrical core member 110 is in the range of 40 m to 500 m, It is possible to manufacture a dental laser chip having a thin outer diameter at a predetermined portion of the tip. As a result, it is possible to manufacture a dental laser chip having more supple properties, and it is possible to manufacture a dental laser chip that is more compatible with the purpose of treatment and the shape of the affected part.

[0083] Further, according to the method for manufacturing a dental laser chip according to Embodiment 1, the thickness of the outer shell layer 140 in the predetermined portion on the front end side is within the range of 10 111 to 100 111. Part It is possible to manufacture a dental laser chip having a thin wall and a thin outer diameter at a predetermined part. As a result, it becomes possible to manufacture a dental laser chip having more flexible properties, and it is possible to manufacture a dental laser chip that is more compatible with the purpose of treatment and the shape of the affected part. It becomes possible.

Further, according to the method for manufacturing a dental laser chip according to the first embodiment, when the cylindrical core member 110 is cut along a plane including the central axis 1 lOax of the cylindrical core member, the tapered portion 114 is Since the angle Θ between the outer periphery 112 of the cylindrical core member 112 and the central axis l lOax of the cylindrical core member is within the range of 0.2 ° to 5 °, the outer diameter gradually increases toward the tip side. It is possible to manufacture a dental laser chip having a structure that can be reduced. As a result, it becomes possible to manufacture a dental laser chip having even more powerful properties, and it is possible to manufacture a dental laser chip that is more compatible with the purpose of treatment and the shape of the affected part. Become.

[0085] Also, according to the method for manufacturing a dental laser chip according to Embodiment 1, the cylindrical core member The method further includes a step of forming a highly light-reflective metal layer that forms a highly light-reflective metal layer 120 formed of metallurgy on the outer periphery of the cylindrical core member 110 between the preparation step and the outer shell layer formation step, and In the outer shell layer forming step, the thick layer 130 is formed on the outer periphery of the cylindrical core member 110 via the high light reflective metal layer 120. This makes it possible to increase the far-infrared light reflectivity at the light guide unit 146, thereby increasing the far-infrared light transmission rate, and providing dental treatment including a laser oscillation device using a carbon dioxide laser. It is possible to manufacture a dental laser chip particularly suitable for a laser device.

[0086] Further, according to the method for manufacturing a dental laser chip according to Embodiment 1, the dental laser treatment device is a laser treatment device including a carbon dioxide gas laser, and therefore, a hollow guide is formed inside the outer shell layer 140. By manufacturing the dental laser chip 100 having a structure in which the optical part 146 is formed, it can be suitably used for such a dental laser treatment apparatus.

[0087] [Embodiment 2]

4 and 5 are views for explaining the method of manufacturing the dental laser chip according to the second embodiment. 4 (a) to 4 (c) and FIGS. 5 (a) to 5 (d) are process diagrams in the method for manufacturing a dental laser chip according to the second embodiment. Fig. 5 (c) is an enlarged cross-sectional view at the portion A in Fig. 5 (b), and Fig. 5 (d) is an enlarged view at the portion A in Fig. 5 (b).

3 3

It is a big right side view.

[0088] The method for manufacturing a dental laser chip according to the second embodiment is similar to the method for manufacturing a dental laser chip according to the first embodiment, in which "a cylindrical core member preparation step" and "high light reflective metal layer formation" are performed. Process, outer shell layer forming process, and light guide section forming process in this order! The shape and size of the dental laser chip to be manufactured is the same as that of the dental laser chip according to the first embodiment. This is different from the manufacturing method. Hereinafter, each process of the manufacturing method of the dental laser chip according to the second embodiment will be described with reference to FIGS.

[0089] 1. Columnar core member preparation process

First, a cylindrical core member 210 having a shape as shown in FIG. The columnar core member 210 has a tapered portion 214 having a circular cross section and a diameter of the circle that is smaller toward the tip side. The diameter D of the cross section at the end on the front end side of the cylindrical core member 210 (the right end in FIG. 4A) is, for example, 300 m, and the base end side end of the cylindrical core member 210 The diameter D of the cross section at the section (the left end of FIG. 4 (a)) is, for example, 1000 m. Cylinder

2

Center axis 21 of cylindrical core member Angle formed between outer periphery 212 of cylindrical core member 210 and central axis 210ax of cylindrical core member when taper core member 210 is cut along a plane including Oax Θ is, for example, 1 °. The length L of the cylindrical core member 210 is 27.5 mm, for example.

As the cylindrical core member 210, for example, a cylindrical core member made of tungsten carbide can be suitably used.

[0090] 2. High light reflective metal layer forming process

Next, as shown in FIG. 4B, a highly light-reflective metal layer 220 made of gold is formed on the outer periphery of the cylindrical core member 210. At this time, the highly light-reflective metal layer 220 is formed leaving a portion of a predetermined length L (for example, 7 mm) from the base end side end of the cylindrical core member 210.

2

The thickness of the high light reflective metal layer 220 is, for example, As a method for forming the highly light-reflective metal layer 220 on the outer periphery of the cylindrical core member 210, for example, a plating method (electrolytic plating method, electroless plating method) or sputtering method can be used.

[0091] 3. Outer shell layer formation process

The outer shell layer forming step is a step of forming the outer shell layer 240 having the distal end side thin tube portion 242 and the proximal end side sleeve portion 244 on the outer periphery of the cylindrical core member 210, and is a thick layer forming step (See Fig. 4 (c).) And thick-wall layer processing (see Fig. 5 (a)).

[0092] (1) Thick layer formation process

First, as shown in FIG. 4 (c), a thick layer 230 made of a conductive layer is formed concentrically on the outer periphery of the cylindrical core member 210 via the highly light-reflective metal layer 220.

The thickness of the thick layer 230 is, for example, 600 m. The thick layer 230 is made of nickel, for example, and can be formed by an electroplating method.

[0093] (2) Thick layer processing step

Next, as shown in FIG. 5 (a), by reducing the thickness of the predetermined portion on the distal end side in the thick layer 230, the outer shell layer having the distal end thin tube portion 242 and the proximal end sleeve portion 244 is formed. 240 is formed.

The thickness of the distal end side thin tube portion 242 is, for example, 50 m. Thickness of proximal sleeve 244 Varies depending on the position, and the outer diameter D of the proximal end side of the proximal end sleeve portion 244 is

3 In the thick wall layer 230 so that it is substantially the same as the outer diameter D on the distal end side of the proximal end sleeve portion 244.

Four

The thickness of the predetermined portion on the base end side is reduced.

[0094] It should be noted that in the portion R between the distal end side narrow tube portion 242 and the proximal end side sleeve portion 244, cutting with a predetermined curvature (for example, a radius of curvature R = 0.5 mm) (for example, NC cutting processing, etc.) .) Is given. Further, the thick layer 230 and the highly light-reflective metal layer 220 are removed in the portion R where the proximal end surface force in the thick layer 230 is also 0.5 mm.

2

[0095] 4. Light guide formation process

Then, as shown in FIGS. 5 (b) to 5 (d), the light guide 246 is formed in the outer shell layer 240 by extracting the cylindrical core member 210 from the outer shell layer 240.

As described above, the dental laser chip 200 can be manufactured.

As described above, the dental laser chip manufacturing method according to the second embodiment is different from the dental laser chip manufacturing method according to the first embodiment in the shape and size of the dental laser chip to be manufactured. As in the case of the method for manufacturing a dental laser chip according to Embodiment 1, a columnar core member preparation step, an outer shell layer formation step, and a light guide portion formation step are included in this order. It is possible to manufacture a dental laser chip having more supple and powerful properties, and the dental laser chip is more suitable for the purpose of treatment and the shape of the affected area than conventional dental laser chips. It can be manufactured.

The method for manufacturing a dental laser chip according to Embodiment 2 is the same as the method for manufacturing the dental laser chip according to Embodiment 1 except that the shape of the dental laser chip to be manufactured is different in size. Therefore, it has the corresponding effect as it is among the effects of the method for manufacturing a dental laser chip according to the first embodiment.

[0099] [Embodiment 3]

6 and 7 are views for explaining the method of manufacturing the dental laser chip according to the third embodiment. FIGS. 6 (a) to 6 (f) and FIGS. 7 (a) to 7 (e) are process diagrams in the method for manufacturing a dental laser chip according to the third embodiment. Fig. 6 (b) is an enlarged cross-sectional view at the portion A in Fig. 6 (a), and Fig. 6 (e) is an enlarged view at the portion A in Fig. 6 (d).

4 5

Fig. 7 (d) is an enlarged cross-sectional view of the portion A in Fig. 7 (c). e) is an enlarged right side view of a portion A in FIG. 7 (c).

Five

[0100] The method for manufacturing a dental laser chip according to Embodiment 3 is similar to the method for manufacturing a dental laser chip according to Embodiment 1, in which "a cylindrical core member preparation step" and "highly light-reflective metal layer formation" are performed. Process ”,“ outer shell layer forming step ”and“ light guide portion forming step ”in this order! /, The contents of the“ outer shell layer forming step ”are the dental laser chip according to the first embodiment. This is different from the manufacturing method. Hereinafter, each process of the manufacturing method of the dental laser chip according to Embodiment 3 will be described with reference to FIGS.

[0101] 1. Cylindrical core member preparation process

First, a cylindrical core member 310 having a shape as shown in FIG. 6 (a) is prepared. The cylindrical core member 310 is the same as the cylindrical core member 110 used in the dental laser chip manufacturing method according to the first embodiment.

[0102] 2. High light reflective metal layer formation process

Next, as shown in FIG. 6C, a highly light-reflective metal layer 320 made of gold is formed on the outer periphery of the cylindrical core member 310. At this time, the highly light-reflective metal layer 320 is formed leaving a portion of a predetermined length L (for example, 7 mm) from the end portion on the base end side of the cylindrical core member 310.

2

The thickness of the high light reflective metal layer 320 is, for example, As a method for forming the highly light-reflective metal layer 320 on the outer periphery of the cylindrical core member 310, for example, a plating method (electrolytic plating method, electroless plating method) or sputtering method can be used.

[0103] 3. Outer shell layer formation process

The outer shell layer forming step is a step of forming an outer shell layer 340 having a distal end side thin tube portion 342 and a proximal end side sleeve portion 344 on the outer periphery of the cylindrical core member 310, and is a thin layer forming step ( 6 (d) and FIG. 6 (e)) and a thick layer forming step (see FIG. 6 (f) and FIG. 7 (a)).

[0104] (1) Thin layer forming process

First, as shown in FIG. 6 (d) and FIG. 6 (e), a thin layer 330 made of a conductive layer is formed concentrically on the outer periphery of the cylindrical core member 310 via the highly light-reflective metal layer 320.

The thickness of the thin layer 330 is, for example, 50 / z m. The thin layer 330 is made of nickel, for example, and can be formed by an electroplating method.

[0105] (2) Thick layer formation process Next, as shown in FIG. 6 (f), a predetermined portion of the cylindrical core member 310 is covered with a heat-shrinkable resin tube 332, and then, as shown in FIG. A thick layer 334 is formed so as to overlap with a predetermined portion on the base end side. Thereafter, as shown in FIG. 7B, the outer tube layer 340 having the distal end side thin tube portion 342 and the proximal end side sleeve portion 344 is formed by removing the resin tube 332. As the resin tube 332, a resin tube made of fluorine resin having high chemical resistance can be preferably used.

[0106] The thickness of the distal-side thin tube portion 342 is, for example, 50 µm. The thickness of the proximal sleeve portion 344 differs depending on the position, and the proximal diameter D of the proximal sleeve portion 344 is

3 The thick layer 334 is formed so that it is substantially the same as the outer diameter D on the distal end side of the proximal end sleeve portion 344.

Four

The thickness of the predetermined portion on the base end side is reduced. In the portion R of 0.5 mm from the proximal end surface of the thick layer 334, all of the thick layer 334 and the highly light-reflective metal layer 320 are

2

Has been removed.

[0107] The portion R between the distal side narrow tube portion 342 and the proximal end side sleeve portion 344 is cut with a predetermined curvature (for example, a radius of curvature R = 0.4 mm) (for example, NC cutting) .) Can also be applied.

[0108] 4. Light guide formation process

Then, as shown in FIGS. 7 (c) to 7 (e), the light guide 346 is formed in the outer shell layer 340 by extracting the cylindrical core member 310 from the outer shell layer 340.

[0109] As described above, the dental laser chip 300 can be manufactured.

[0110] Thus, the dental laser chip manufacturing method according to Embodiment 3 differs from the dental laser chip manufacturing method according to Embodiment 1 in the content of the "outer shell layer forming step". As in the case of the method for manufacturing a dental laser chip according to the first embodiment, the columnar core member preparation step, the outer shell layer formation step, and the light guide portion formation step are included in this order. It is possible to manufacture dental laser chips with supple characteristics, and to manufacture dental laser chips that are more compatible with the purpose of treatment and the shape of the affected area than conventional dental laser chips. Is possible.

[0111] In the method for manufacturing a dental laser chip according to Embodiment 3, the distal-side thin tube section 34 is formed by forming the thick-walled layer 334 so as to overlap the predetermined portion on the proximal-end side of the thin-walled layer 330. 2 and the proximal-side sleeve portion 344 are formed, so that the dental laser chip 300 in which the distal-side thin tube portion 342 and the proximal-side sleeve portion 344 are integrated is manufactured. It becomes possible. As a result, the distal capillary portion 342 is not easily detached from the proximal sleeve portion 344, and a highly reliable dental laser chip can be manufactured.

[0112] The dental laser chip manufacturing method according to the third embodiment is the same as the dental laser chip manufacturing method according to the first embodiment except that the content of the "outer shell layer forming step" is different. Therefore, it has the corresponding effect as it is among the effects of the method for manufacturing a dental laser chip according to the first embodiment.

[0113] [Embodiment 4]

FIG. 8 is a view for explaining the method of manufacturing the dental laser chip according to the fourth embodiment. 8A is a perspective view of the reflecting member 450, FIG. 8B is a perspective view of the distal end side of the dental laser chip 400 before the reflecting member 450 is attached, and FIG. FIG. 8D is a perspective view of the distal end side of the dental laser chip 400 after the member 450 is attached, and FIG. 8D is a diagram schematically showing how the laser light L is reflected by the reflecting member 450. FIG. 9 is a view for explaining the operational effects of the method for manufacturing a dental laser chip according to the fourth embodiment.

[0114] The method for manufacturing a dental laser chip according to Embodiment 4 basically includes the same steps as the method for manufacturing a dental laser chip according to Embodiment 1, This is different from the method for manufacturing a dental laser chip according to Embodiment 1 in that it further includes a reflection member attaching step later.

That is, in the method for manufacturing a dental laser chip according to Embodiment 4, after the light guide portion forming step, the reflecting member 450 that reflects the laser light to the side is provided at the end portion on the front end side of the outer shell layer 440. A reflection member attaching step for attaching is further included. The reflection member 450 includes a cap portion 452 and a reflection portion 454, as shown in FIGS. 8 (a) to 8 (d). The reflector 454 has a quadrangular pyramid shape. The reflective member 450 can be attached to the end of the outer shell layer 440 by brazing, for example.

[0116] In the method for manufacturing a dental laser chip according to Embodiment 4, the tip of the outer shell layer 440 in the light guide forming step is accompanied by the additional reflection member attaching step. A slit 448 is formed at a predetermined position on the end side. Thus, for example, also on the inner wall of the root canal can be irradiated with a laser beam (see FIG. 9.) ₀

[0117] Note that the method for manufacturing a dental laser chip according to Embodiment 4 is omitted here from the illustration, but a cylindrical core member preparation step, a highly light-reflective metal layer forming step, and an outer shell layer are provided. The forming process, the light guide part forming process, and the reflecting member attaching process are included in this order, and the processes other than the light guiding part forming process and the reflecting member attaching process are the same as those described in the first embodiment. Therefore, detailed description is omitted.

Thus, the method for manufacturing a dental laser chip according to Embodiment 4 is different from the method for manufacturing a dental laser chip according to Embodiment 1 in that a reflection member attaching step is further performed after the light guide forming step. As in the case of the method for manufacturing a dental laser chip according to the first embodiment, the cylindrical core member preparation step, the outer shell layer formation step, and the light guide portion formation step are included in this order. Therefore, it becomes possible to manufacture a dental laser chip having a supple characteristic than before, and a dental laser having better compatibility with the purpose of treatment and the shape of the affected part than a conventional dental laser chip. A chip can be manufactured.

[0119] In addition, in the method for manufacturing a dental laser chip according to Embodiment 4, after the light guide portion forming step, a reflecting member 450 that reflects laser light to the side is provided at the end portion on the front end side of the outer shell layer 440. Since the reflective member attaching step for attaching is further included, the dental laser chip 400 capable of irradiating the laser beam from the laser oscillation device toward the side of the dental laser chip can be manufactured. As a result, the possible laser irradiation range is expanded, and a dental laser chip with a wider application field can be manufactured.

[0120] The method for manufacturing a dental laser chip according to Embodiment 4 is the same as the method for manufacturing a dental laser chip according to Embodiment 1 except that it further includes a reflecting member attaching step after the light guide forming step. Therefore, it has the corresponding effect as it is among the effects of the method for manufacturing a dental laser chip according to the first embodiment.

[0121] In the method for manufacturing a dental laser chip according to Embodiment 4, the reflecting member 454 having the quadrangular pyramid shape force is used as the reflecting member, but the present invention is not limited to this. It is not something.

FIG. 10 is a diagram for explaining a modification of the reflecting member. Fig. 10 (a) to Fig. 10 (d) These are the perspective views of the reflective members 450a-450d of the modified examples 1-4.

As shown in FIG. 10 (a), the reflecting member 450a of Modification 1 has an octagonal pyramid shape force in the reflecting portion 454a. As shown in FIG. 10 (b), the reflecting member 450b of Modification 2 has a reflecting portion 454b having a conical shape. The reflecting members 450c and 450d of the modified examples 3 and 4 have the reflecting portions 454c and 454d force S as well as the shape forces shown in FIGS. 10 (c) and 10 (d). Even when the reflection members 450a to 450d of the modified examples 1 to 4 are used as the reflection member, the dental light that can reflect the laser light from the light guide portion in the outer shell layer to the side is used. Laser chips can be manufactured.

[0122] In the method for manufacturing a dental laser chip according to Embodiment 4, the case where the reflecting member 450 is attached to the end surface of the outer shell layer 440 by brazing has been described as an example, but the present invention is not limited thereto. For example, the reflecting member may be attached to the end face of the outer shell layer by press fitting, or the reflecting member may be attached to the end face of the outer shell layer by a joining method such as plating joining.

[0123] [Embodiment 5]

FIG. 11 and FIG. 12 are views for explaining the method for manufacturing the dental laser chip according to the fifth embodiment. FIGS. 11 (a) to 11 (e) and FIGS. 12 (a) to 12 (d) are process diagrams in the method for manufacturing a dental laser chip according to the fifth embodiment. Fig. 11 (b) is an enlarged cross-sectional view of the portion A in Fig. 11 (a), and Fig. 12 (c) is the portion A in Fig. 12 (b).

7 8 is an enlarged cross-sectional view of 8 part, and Fig. 12 (d) is an enlarged view of part A in Fig. 12 (b)

8

It is a right view.

[0124] The method for manufacturing a dental laser chip according to Embodiment 5 basically includes the same steps as the method for manufacturing a dental laser chip according to Embodiment 1, but a highly light-reflective metal layer is formed. The dental laser chip according to Embodiment 1 in that it further includes a high heat conductive metal layer forming step of forming a high heat conductive metal layer on the outer periphery of the high light reflective metal layer between the step and the outer shell layer forming step. This is different from the manufacturing method. That is, the method for manufacturing a dental laser chip according to Embodiment 5 includes a “cylindrical core member preparation step”, a “high light reflective metal layer forming step”, a “high heat conductive metal layer forming step”, and an “outer shell layer”. The “forming process” and the “light guide forming process” are sequentially performed. Hereinafter, these steps will be described with reference to FIG. 11 and FIG. [0125] 1. Columnar core member preparation process

First, a cylindrical core member 510 having a shape as shown in FIG. 11 (a) is prepared. The cylindrical core member 510 is the same as the cylindrical core member 110 used in the dental laser chip manufacturing method according to the first embodiment.

[0126] 2. High light reflective metal layer formation process

Next, as shown in FIG. 11 (c), a highly light-reflective metal layer 520 having a metallic force is formed on the outer periphery of the cylindrical core member 510. At this time, the highly light-reflective metal layer 520 is formed leaving a portion of a predetermined length L (for example, 7 mm) from the base end side end portion of the cylindrical core member 510.

2

The thickness of the high light reflective metal layer 520 is, for example, As a method for forming the highly light-reflective metal layer 520 on the outer periphery of the cylindrical core member 510, for example, a plating method (electrolytic plating method, electroless plating method) or sputtering method can be used.

[0127] 3. High thermal conductive metal layer formation process

Next, as shown in FIG. 11 (d), a high heat conductive metal layer 550 made of silver is formed on the outer periphery of the high light reflective metal layer 520. At this time, the highly thermally conductive metal layer 550 is formed leaving a portion of a predetermined length L (for example, 7 mm) from the base end side end of the cylindrical core member 510.

2

The thickness of the high thermal conductive metal layer 550 is, for example, 15 m. As a method for forming the high thermal conductive metal layer 550, for example, a plating method (electrolytic plating method, electroless plating method) or a notching method can be used.

[0128] 4. Outer shell layer formation process

The outer shell layer forming step is a step of forming the outer shell layer 540 having the distal end side thin tube portion 542 and the proximal end side sleeve portion 544 on the outer periphery of the cylindrical core member 510, and according to the first embodiment. As in the case of the dental laser chip manufacturing method, it includes a thick layer forming process (see Fig. Ll ( _e )) and a thick layer processing step (see Fig. 12 (a)).

[0129] (1) Thick layer formation process

First, as shown in FIG. 11 (e), a thick layer 530 made of a conductive layer is formed concentrically on the outer periphery of the cylindrical core member 550 via the highly light reflective metal layer 520 and the highly thermally conductive metal layer 550. The

The thickness of the thick layer 530 is, for example, 485 m. The thick layer 530 is made of nickel, for example. Thus, it can be formed by an electroplating method.

[0130] (2) Thick layer processing process

Next, as shown in FIG. 12 (a), the outer shell layer 540 having the distal end side thin tube portion 542 and the proximal end side sleeve portion 544 is reduced by reducing the thickness of the predetermined portion on the distal end side in the thick layer 530. Form.

The wall thickness of the distal side thin tube portion 542 is, for example, 35 m. The thickness of the proximal end sleeve portion 544 differs depending on the position, and the proximal end outer diameter D of the proximal end sleeve portion 544 is

3 Make the thick layer 530 so that it is almost the same as the outer diameter D on the distal end side of the proximal sleeve portion 544.

Four

The thickness of the predetermined portion on the base end side is reduced.

[0131] In the portion R between the distal capillary 542 and the proximal sleeve 544, cutting with a predetermined curvature (for example, radius of curvature R = 0.4 mm) (for example, NC cutting) .) Is given. Further, in the portion R where the proximal end surface force in the thick layer 530 is also 0.5 mm, the thick layer 530, the highly light-reflective metal layer 520, and the highly thermally conductive metal layer 550 have

2

Has been removed.

[0132] 5. Light guide formation process

Then, as shown in FIGS. 12 (b) to 12 (d), the cylindrical core member 510 is extracted from the outer shell layer 540 to form the light guide portion 546 in the outer shell layer 540.

[0133] As described above, the dental laser chip 500 can be manufactured.

As described above, the method for manufacturing a dental laser chip according to Embodiment 5 has a high thermal conductivity on the outer periphery of the high light reflective metal layer between the high light reflective metal layer forming step and the outer shell layer forming step. Although it differs from the method of manufacturing the dental laser chip according to the first embodiment in that it further includes a step of forming a highly thermally conductive metal layer for forming a metal layer, the manufacturing of the dental laser chip according to the first embodiment is performed. As in the case of the method, since the cylindrical core member preparation step, the outer shell layer forming step, and the light guide portion forming step are included in this order, the dental laser chip has a supple property than before. This makes it possible to manufacture a dental laser chip that is more compatible with the purpose of treatment and the shape of the affected part than conventional dental laser chips.

[0135] Also, according to the method for manufacturing a dental laser chip according to the fifth embodiment, the high thermal conductivity gold The metal layer 550 functions as a heat sink, and heat generated in the highly light-reflective metal layer 530 can be effectively released, so that higher-power laser light can be used.

[0136] The method for manufacturing a dental laser chip according to Embodiment 5 is the same as the method for manufacturing the dental laser chip according to Embodiment 1 except that the method further includes a step of forming a highly thermally conductive metal layer. Therefore, it has the corresponding effect as it is among the effects of the method for manufacturing the dental laser chip according to the first embodiment.

[0137] The method for manufacturing a dental laser chip of the present invention has been described based on the above embodiments. However, the present invention is not limited to the above embodiments, and various methods are possible without departing from the scope of the invention. For example, the following modifications are possible.

[0138] (1) In the method for manufacturing a dental laser chip of each of the above embodiments, the case including the step of forming a highly light-reflective metal layer has been described as an example, but the present invention is not limited to this. A method that does not include the step of forming a highly reflective metal layer is also included in the scope of the present invention.

(2) In the method for manufacturing a dental laser chip of each of the above embodiments, the force that forms the outer shell layers 140, 240, 340, and 540 that also have nickel force as the outer shell layer. It is not limited. As the outer shell layer, for example, an outer shell layer made of nickel alloy is formed.

[0140] (3) In the method for manufacturing the dental laser chip of each of the above embodiments, the outer shell layers 140, 240, 340, and 540, which are nickel, are formed by the electroplating method. The invention is not limited to this, and an outer shell layer composed of a resin layer may be formed by a coating method.

[0141] (4) In the method for manufacturing a dental laser chip of each of the above embodiments, the inner surface of the outer shell layer 140, 240, 340, 540 is composed of the highly light-reflective metal layer 120, 220, 320, 520. However, the present invention is not limited to this, and includes, for example, the case where a dielectric layer is formed on the inner surface of the outer shell layer. In this case, it becomes possible to increase the reflectance of the far-infrared light in the light guide section, and the inner surface of the outer shell layer (for example, an electric layer or a highly light-reflective metal layer) is exposed to the outside air. It is possible to protect it, and a highly reliable dental label One chip can be manufactured.

(5) The power of the dental laser chip manufactured by the method of manufacturing a dental laser chip of each of the embodiments described above is exemplified for use in a dental laser treatment apparatus including a carbon dioxide laser. Is not limited to this. For example, it can be used in a dental laser treatment apparatus equipped with an Er: YAG laser, Nd: YAG laser, semiconductor laser or other laser.

Explanation of symbols

[0143] 100, 200, 300, 400, 500, 940 ··· Dental laser chip, 110, 210, 310, 510… cylindrical core member, l lOax, 210ax, 310ax, 510ax… center of cylindrical core member Axis 11 2, 212, 312, 512 ... Peripheral part, 114, 214, 314, 514 ... Theno part, 120, 220, 320, 520 ... Highly reflective metal layer, 130, 230, 334 , 534 ··· Thick layer, 140, 240, 340, 5 40 ··· Outer shell layer, 142, 242, 342, 542 End side sleeve part, 146, 246, 346, 546 ... Light guiding part, 330 ... Thin layer, 332 ... Fabric tube, 448 ... Strip, 450, 450a, 450b, 450c, 450d ... Reflective member, 452, 452a, 4 52b, 452c, 452d ... cap part, 454, 454a, 454b, 454c, 454d ... reflective part, 456 ... brazing part, 550 ... high thermal conductive metal layer, 900 ... dental laser treatment apparatus, 910 ... Laser oscillator, 912 "'Er: YAG laser, 914 ... Laser controller, 920 ... Light guiding fiber, 930 ... Dental handpiece, 93 2 ... Dental handpiece body, 942 ... 2nd light guide fiber, 944 ... 2nd light guide fiber protective tube, L ... Laser light, R, R ... part, Θ ... Taper

1 2

Between the outer periphery of the cylindrical core member and the central axis of the cylindrical core member

Claims

The scope of the claims

[1] A method for producing a dental laser chip for use in a dental laser treatment apparatus,

A cylindrical core member preparation step of preparing a cylindrical core member having a circular cross section and having a tapered portion having a smaller diameter of the circle toward the tip side;

An outer shell layer forming step of forming an outer shell layer having a distal end side narrow tube portion and a proximal end side sleeve portion on the outer periphery of the cylindrical core member;

A method for producing a dental laser chip, comprising: a light guide part forming step of forming a light guide part in the outer shell layer by extracting the cylindrical core member from the outer shell layer in this order.

[2] A method for producing a dental laser chip according to claim 1, wherein

The outer shell layer forming step includes

A thick layer forming step for forming a thick layer concentrically on the outer periphery of the cylindrical core member; and by reducing a thickness of a predetermined portion on the tip side of the thick layer, the tip side tubular portion and the A method for manufacturing a dental laser chip, comprising: a thick layer processing step for forming the outer shell layer having a base sleeve portion in this order.

[3] In the method for producing a dental laser chip according to claim 2,

In the thick layer forming step, a thick layer composed of an electrode layer is formed. A method for producing a dental laser chip, comprising:

[4] In the method for producing a dental laser chip according to claim 2,

In the thick layer forming step, a thick layer composed of a resin layer is formed. A method for producing a dental laser chip, comprising:

[5] The method for manufacturing a dental laser chip according to any one of claims 2 to 4, wherein, in the thick layer processing step, an outer diameter on a proximal end side of the proximal end sleeve portion is the proximal end side. A method for producing a dental laser chip, characterized in that the thickness of a predetermined portion on the base end side of the thick layer is reduced so as to be substantially the same as the outer diameter of the distal end side of the sleeve portion.

[6] The method for producing a dental laser chip according to claim 1, wherein

The outer shell layer forming step includes Forming a thin layer concentrically on the outer periphery of the cylindrical core member; and forming a thick layer overlying a predetermined portion on the base end side of the thin layer, thereby forming the distal side thin tube portion and the A method for producing a dental laser chip, comprising: a thick layer forming step for forming the outer shell layer having a proximal sleeve portion in this order.

[7] The method for producing a dental laser chip according to claim 6,

In the thin layer forming step, forming a thin layer consisting of an electroplating layer,

[8] In the method for producing a dental laser chip according to claim 6,

In the thin layer forming step, forming a thin layer consisting of a resin layer,

[9] In the method for producing a dental laser chip according to any one of claims 6 to 8, the outer shell layer forming step includes:

After the thick layer forming step, in the thick layer, the outer diameter on the base end side of the base end side sleeve portion is substantially the same as the outer diameter on the front end side of the base end side sleeve portion. A method of manufacturing a dental laser chip, further comprising a thick layer processing step of reducing a thickness of the base end side predetermined portion.

[10] The method for manufacturing a dental laser chip according to any one of claims 1 to 9, wherein a diameter of the circle at a tip side end of the cylindrical core member is in a range of πι to 500 / ζ m. There is provided a method for producing a dental laser chip.

[11] The method for manufacturing a dental laser chip according to any one of [1] to [LO], wherein a thickness of the outer shell layer in the predetermined portion on the tip side is in a range of m to LOO / zm. A method for producing a dental laser chip.

[12] Claim 1 ~: In the method for producing a dental laser chip according to any one of L1, when the cylindrical core member is cut along a plane including a central axis of the cylindrical core member, the taper The angle 0 formed by the outer peripheral portion of the cylindrical core member and the central axis of the cylindrical core member in the portion is in the range of 0.2 ° to 5 °. Production method.

[13] In the method for producing a dental laser chip according to any one of claims 1 to 12, between the cylindrical core member preparation step and the outer shell layer forming step, on the outer periphery of the cylindrical core member. A high light reflective metal layer forming step of forming a high light reflective metal layer; and in the outer shell layer forming step, the outer shell layer is disposed on an outer periphery of the cylindrical core member via the high light reflective metal layer. A method of manufacturing a dental laser chip, characterized by forming.

[14] The method of manufacturing a dental laser chip according to claim 13,

A high heat conductive metal layer forming step of forming a high heat conductive metal layer on an outer periphery of the high light reflective metal layer between the high light reflective metal layer forming step and the outer shell layer forming step;

In the outer shell layer forming step, the outer shell layer is formed on the outer periphery of the cylindrical core member via the highly light reflective metal layer and the highly heat conductive metal layer. Of manufacturing a laser chip for use.

[15] In the method of manufacturing a dental laser chip according to any one of claims 1 to 14, after the light guide portion forming step,

A method of manufacturing a dental laser chip, further comprising a dielectric layer forming step of forming a dielectric layer on an inner surface of the outer shell layer.

[16] In the method of manufacturing a dental laser chip according to any one of claims 1 to 15, after the light guide portion forming step,

A method of manufacturing a dental laser chip, further comprising a reflecting member attaching step of attaching a reflecting member for reflecting laser light to a side to a tip side end portion of the outer shell layer.

[17] The method for manufacturing a dental laser chip according to any one of claims 1 to 16, wherein the dental laser treatment device is a laser treatment device including a carbon dioxide laser. Production method.