WO2008026750A1 - Active matrix substrate and method for manufacturing the same - Google Patents

Active matrix substrate and method for manufacturing the same Download PDF

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Publication number
WO2008026750A1
WO2008026750A1 PCT/JP2007/067092 JP2007067092W WO2008026750A1 WO 2008026750 A1 WO2008026750 A1 WO 2008026750A1 JP 2007067092 W JP2007067092 W JP 2007067092W WO 2008026750 A1 WO2008026750 A1 WO 2008026750A1
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WIPO (PCT)
Prior art keywords
active matrix
film
amorphous silicon
resin
silicon film
Prior art date
Application number
PCT/JP2007/067092
Other languages
French (fr)
Japanese (ja)
Inventor
Masahiro Hanmura
Takeyoshi Kato
Original Assignee
Zeon Corporation
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Publication date
Application filed by Zeon Corporation filed Critical Zeon Corporation
Priority to JP2008532143A priority Critical patent/JPWO2008026750A1/en
Publication of WO2008026750A1 publication Critical patent/WO2008026750A1/en

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Classifications

    • GPHYSICS
    • G02OPTICS
    • G02FOPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/136Liquid crystal cells structurally associated with a semi-conducting layer or substrate, e.g. cells forming part of an integrated circuit
    • G02F1/1362Active matrix addressed cells
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/02Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier
    • H01L27/12Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being other than a semiconductor body, e.g. an insulating body
    • H01L27/1214Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs
    • H01L27/1248Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs with a particular composition or shape of the interlayer dielectric specially adapted to the circuit arrangement
    • GPHYSICS
    • G02OPTICS
    • G02FOPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F2202/00Materials and properties
    • G02F2202/02Materials and properties organic material
    • G02F2202/022Materials and properties organic material polymeric
    • G02F2202/023Materials and properties organic material polymeric curable
    • GPHYSICS
    • G02OPTICS
    • G02FOPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F2202/00Materials and properties
    • G02F2202/10Materials and properties semiconductor
    • G02F2202/103Materials and properties semiconductor a-Si

Definitions

  • the present invention relates to an active matrix storehouse that can be manufactured by a simple process and has a high level of ifffi and a method for making the same.
  • Background sickle
  • the active matrix is the gate signal ⁇ ! And source signal that are arranged orthogonal to each other on 3 ⁇ 4K.
  • ⁇ The pixel ⁇ is placed near the intersection of the spring with a thin film transistor ( ⁇ F ⁇ ).
  • Powerful traps are used in active matrix flat panel displays, which are noisy because each display pixel is individually controlled by a TFT (switching element). Compared to matrix type flat display devices, crosstalk is less likely to occur, making it suitable for high definition and large capacity display.
  • FIG. 7 is an explanatory diagram of an example of a circuit on a conventional active matrix sickle.
  • the TFT 14 as a switching element is placed near the intersection of the gate signal 1 2 and the source signal “ ⁇ spring 1 3” arranged orthogonally on the top.
  • Applied to the gate ⁇ ⁇ 15 Depending on mE, the amount of fluid flowing from the source 3 ⁇ 4S 1 6 force to the drain consol 17 changes, and this change is passed through the contact hole to the pixel f 18. .
  • a passivation film made of silicon nitride or the like is formed on the surface of the array formed with the TFT force S by a sputtering method, a vapor deposition method, or a CVD method, and the surface is increased due to the layer-like view.
  • Many of them have a structure that is flattened and has a pixel consolation that is the drain of the TFT in the contact Honoré.
  • Patent Document 1 discloses an active matrix substrate having a passivation film made of Si N x or sio 2 and a flat film l (interlayer deception D) made of benzocyclobutene.
  • Patent Document 2 Japanese Patent Laid-Open No. 11-3070 778 Disclosure of Invention
  • the present invention has been made for the purpose of producing an active matrix which can be produced by a simple process and which has a high lightning resistance. As a result of intensive efforts to solve the above-mentioned defects, the present inventors have formed a ⁇
  • the active matrix sickle formed by silylating the surface of the FT amorphous surface silicon film and then forming a protective film on it, has a small leakage temperament. Rough force between comforts 3 ⁇ 4f Standing in a spring, and even after a long period of 3 ⁇ 4cS under high temperature and humidity, it is found that the threshold value required to flow 4
  • the present invention has been made based on the findings.
  • An active matrix comprising thin film transistors having an amorphous silicon film formed on the basis of ingenuity, where the surface of the amorphous silicon film is silylated and the surface of the force silylated amorphous silicon film Has a shelf protection film on top ACTIVITY MATRIX 3 ⁇ 43 ⁇ 4,
  • the organic matrix is an active matrix according to (2) or (3), wherein the organic matrix is a film made of a cross-linked alicyclic olefin polymer having a pole.
  • the above-mentioned crushed raw resin yarn is composed of an alicyclic olefin polymer having a pole
  • an active matrix sample having a high level and high durability can be efficiently produced by a simple operation.
  • F i g.1 (a) is a schematic plan view of one pixel unit of the contribution of the active matrix of the present invention
  • F i g.1 (b) is a partial sectional view including a TFT portion
  • .2 is a plan view of an active matrix type liquid crystal display device using the active matrix according to the present invention
  • FIG. 3 is an X of the active matrix type liquid crystal display device of FIG. — Y cross section F i g. (Part)
  • F i g.4 is a diagram showing a typical configuration example of the organic EL element in the organic EL display device of the present invention
  • F i g.5 is an active matrix organic FIG.
  • FIG. 6 is an explanatory diagram of an example of a circuit on the active matrix of the present invention used in an electroluminescence display device.
  • F i g .7 is an example illustration of a circuit on a conventional ⁇ active Matrigel Tsu + substrate .
  • reference numeral 1 is, 2 is a gate signal line, 3 is a source signal spring, 4 is a thin film transistor (TFT), 5 is a gate motion, 6 is a source electrode, 7 is a drain ®fl, and 8 is a silylated part.
  • TFT thin film transistor
  • 9 is an organic protective film
  • 10 is a contact hole
  • 11 is a pixel 12 is a gate signal
  • 13 is a source signal
  • 14 is a thin film transistor (TFT)
  • 1 5 is Goto consolation
  • 16 is source consolation
  • 17 is drain electrode
  • 18 is pixel electrode
  • 19 is ⁇ 3 ⁇ 4 f main layer
  • 20 is Goto thread color
  • 101 is active matrix 3 ⁇ 43 ⁇ 4
  • 102 is color finer 3 ⁇ 4K
  • 103 is the sole
  • 104 is ⁇ ) 3 ⁇ 43 ⁇ 4 ⁇
  • 105 is comfort.
  • 108 is the input ⁇ &
  • 110 is the nocturnal layer
  • 201 is the thin film transistor (TFT)
  • 202 is the pixel electrode
  • 203 is the gate signal! !
  • 204 is the source signal H
  • 206 is the opposite comfort
  • 207 is the color filter layer
  • 208 is the black matrix
  • 301 is the active matrix substrate
  • 302 is the shipping charge layer
  • 303 is the upper comforter
  • 304 is sealed Membrane
  • 401 is a scanning electrode
  • 402 is a thin film transistor (TFT)
  • 403 is data comfort
  • 404 is a capacitor
  • 405 is a thin film transistor (TFT)
  • 406 is an organic EL element.
  • the surface of the TFT's amorphous silicon film which has been devised for its affirmation, is silylated, and has an organic support.
  • F i g.1 (a) is a schematic plan view of one pixel unit of the active matrix ⁇ of the present invention
  • F g.1 (b) is a partial cross-sectional view including a TFT portion.
  • on the surface of genius 1, the gate signal ⁇ H2 and the source signal ⁇ ! Fountain 3 is placed next to it, and TFT 4 force S is placed near the intersection.
  • TFT 4 has a goat 5, a source ⁇ ⁇ 6, a drain 3 ⁇ 4 ⁇ 7, a body layer 19 and a gate crane 20.
  • the surface of the TFT4 amorphous silicon film formed on the ingenuity 1 is silylated and a silylated portion of 8 forces S is formed.
  • the silylation force S is shown with the thickness S, but the thickness of the silylation is the force between the atoms of the force ⁇ O—S i- CH, which can be referred to as Silyli W1. It is impossible thickness.
  • An organic protective film 9 made of organic polymer is provided on the silylation unit 8 and is connected to the drain ⁇ 7 and the pixel consolation 11 through the contact hole 10 of the shelf protection word 9. Les.
  • TF ⁇ is one per pixel, but two or more may be formed if desired.
  • Patent Documents 1 and 2 are similar to those of the conventional active matrix, and their mouths are:
  • the silylation has only to occur at least on the surface of the amorphous silicon film of the TFT.
  • TFT Amorphous silicon film The surface refers to the surface of the TFT's monolithic silicon film.
  • the silyl group used for the silylation is not particularly limited, and examples thereof include a dimethylsilyl group, a trimethylsilyl group, a triethylsilyl group, a triisopropylpropylsilyl group, a t-butyldimethylsilyl group, a tert-butylene phenylsilyl group, and A triphenylsilyl group etc. can be mentioned.
  • trimethylsilyl group can be reversed (ie, trimethylsilylation).
  • silylation means that protons on the surface such as aged are replaced by silyl groups.
  • TFT amorphous silicon S When the surface of the silicon is silylated, the surface of the amorphous silicon film becomes hydrophobic, preventing moisture from entering between the surface of the amorphous silicon film and the surface. It is considered that an active matrix having excellent thermal properties can be obtained.
  • the machine guard is usually silylated.
  • examples of the material for forming the organic protective layer include: polyolefins such as polyethylene, polypropylene pyrene, and polybutene; moon-ring olefin polymers; talyl resins; polyimide resins; polysiloxane resins; Can be mentioned.
  • the moon-ring cyclic olefin polymer has a very low hygroscopic property and can be suitably used because it has a small frequency dependence force S of dielectric constant.
  • the thickness of the tree is usually 0.:! ⁇ 10 0 ⁇ , preferably 0.5 to 50 m, more preferably 0.5 to 30 / m.
  • the cyclic cyclic olefin polymer is a polymer obtained by polymerizing an alicyclic olefin monomer having a cyclic structure and a carbon-carbon combination, and having the monomer unit as a structural unit.
  • An example of a cyclic structure is the cycloalkaline cycloalkene ⁇ If structure.
  • the cyclic structure may be or may be a polycycle (fused polycycle, bridged ring, a combination thereof).
  • the number of carbon atoms constituting one unit of the cyclic structure is usually 4 to 30 pieces, preferably 5 to 20 pieces, and more preferably 5 to 15 pieces.
  • the alicyclic olefin polymer may have a monomer unit other than the alicyclic olefin monomer as a unit.
  • the ratio of the alicyclic olefin monomer units is suitably 1 if desired, but usually 30 to 100 weight 0, preferably 50 to: L 0% by weight, more preferably 70 to: L 0% by weight. Powerful display of the organic protective film obtained [ ⁇ life is excellent.
  • ItftBH is a highly polar polymer.
  • the ratio of polar ftS in the strong polymer is not particularly limited. In terms of the total number of moles of monomer units of the alicyclic polyolefin polymer, the ability to confirm the heat resistance etc.
  • Monore 0/0 preferably 5 0: 1 0 0 Monore 0/0, and more preferably to 7 0-1 0 0 mole 0/0 of the constituent monomer units.
  • ⁇ ⁇ ' ⁇ includes, for example, carboxyl group (hydroxycarbon group), alkoxycarbonyl group, dicanolepton ⁇ hydrate group (carbonyloxycarbonyl group), ⁇ (hydroxyl group), nitrile group, epoxy group And at least one group selected from the group consisting of an oxetanyl group and an imide group (hereinafter these are collectively referred to as “special '14 3 ⁇ 4”).
  • ⁇ (3 ⁇ 43 ⁇ 43 ⁇ 4 is water ⁇ 3 ⁇ 4
  • phenols such as a hydroxyphenol group, a hydroxyphenyl alkyl group, etc., and a group containing 3 ⁇ 4 ⁇ wisteria; a hydroxyalkyl group, a hydroxyalkoxy group, a hydroxyalkoxy group
  • Substituents containing alcohol groups such as canoleponyl groups, and the like, and hydroxymethoxy group, hydroxyethoxy groups, and the like.
  • ⁇ -phenyldicarboximide group there are phenols such as a hydroxyphenol group, a hydroxyphenyl alkyl group, etc., and a group containing 3 ⁇ 4 ⁇ wisteria
  • a hydroxyalkyl group a hydroxyalkoxy group
  • hydroxyalkoxy group a hydroxyalkoxy group
  • Substituents containing alcohol groups such as canoleponyl groups, and the like, and hydroxymethoxy
  • the lunar olefin olefin polymer may have 4 tons of i ⁇ S, or 2 or more, but preferably has a force S of 2 or more. Of these, it is more preferable to have both a canolepoxinole group and an imido group.
  • Examples of the alicyclic olefin polymers having tin self-characteristics 143 ⁇ 4 include those having a repeating structural unit represented by the following formula (I).
  • is, respectively; and insects standing, 7i atom or - X n - R '(X is a methylene group, a divalent group such as a carbonyl group, n represents 0
  • R ′ may have a group, such as a methyl group, a benzyl group, a strong lpoxyl group, etc., an alkyl group having from 7 to 7 carbon atoms, an aromatic group S, or a special group.
  • is R, a force feature -X n -R ', and m is 0-2.
  • the cyclic olefin olefin polymer having a specific property may be selected from a cyclic olefin monomer having a specific ⁇ ⁇ ⁇ 43 ⁇ 4, or an S cyclic olefin polymer having a specific characteristic and a corresponding cyclic cyclic olefin. It is obtained by polymerizing the monomer and other polymerizable monomers according to the mouth; and by hydrogenation if desired.
  • the alicyclic olefin monomer it may be covered with a monomer or other monomer.
  • the special monomer may be covered with the other monomer, and the special alicyclic olefin monomer may not have 4 to 40%.
  • alicyclic olefin monomers having specific arousal include, for example, 5-hydroxycarbonylbicyclo [2.2.1] hept-2-en, 5-methino-5hydroxycarbonylbicyclo [2.2.2. 1] Hept-2-ene, 5-force lupoxymethino 5-hydroxycanoleporubicyclo [2. 2. 1] Hept-2-ene, 8-methinole-8 hydroxycarbonyltetracyclo [4.4.0. I 2 ' 5 .
  • Cycloaliphatic olefin monomers with two canolepoxyl groups 5- (4-hydroxyphenenole) bicyclo [2.2.1] hept-2-ene, 5-methino-5- (4-hydroxyphenenole ) Bicyclo [2.
  • I 7 ' 10 Dode force-3-ene, 8-carboxymethino 8- (4-hydroxyphenol) tetracyclo [4.4.0.1 3 ⁇ 45 .
  • I 7 ⁇ 10 Dode force -Cycloaliphatic olefin monomers with one hydroxyphenol group such as 3-ene; N— (4-phenol) — (5-norbornene-2,3-dicanorepoxyimide), etc. N-g ⁇ f imide group-containing alicyclic olefin monomer; These monomers can be used as warworms or as a mixture of two or more.
  • Examples of other monomers that can be polymerized with the above cyclic olefin monomer include, for example, ethylene, propylene, 1_butene, 1-pentene, 1-hexene, 3-methino propyl, ten, 3_ Methino 1-pentene, 3-ethino 1-pentene, 4-methino 1-pentene, 4-methino 1-hexene,
  • -Olefin having 2 to 20 carbon atoms such as -ethino 1-hexene, 1-otaten, 1-decene, sen, 1-dodecene, 1-tetradecene, 1-hexadecene, 1-otatadecene, and 1-eicosene;
  • These monomers can be used as warworms or as a mixture of two or more.
  • the type 1 olefin polymer used in the present invention is a polystyrene measured by gel permeation chromatography (GPC) using tetrahydrofuran (THF) as a male! Weight of ⁇ : Weight: ⁇ Molecular weight (Mw) Force S1,000-1,000,000 Forced force, 5,000-5 0 0, 0 0 0 is more preferable, and 1 0, 0 0 0 to 2 5 0, 0 0 0 is even more preferable.
  • Mw weight average molecular weight of the alicyclic olefin polymer is 1,00 0 to 1,0 0 0,0 0 0, the heat balance, heat resistance, adhesion 14, surface flatness, etc. are balanced. A dull protective film can be formed.
  • the molecular weight distribution of alicyclic olefin polymers is the ratio of the weight average weight (Mw) to the number average molecular weight (M n) measured by gel permeation chromatography using THF (Mw / n).
  • the power is preferably 5 or less S, more preferably 4 or less, and even more preferably 3 or less.
  • the organic protective layer according to the present invention is preferably formed of an alicyclic olefin polymer, more preferably an alicyclic olefin polymer having an extreme thickness.
  • Process suitability I It is more preferable that the organic protective film is formed of a crosslinked, highly polar alicyclic polyolefin polymer, because it is excellent in life.
  • the active matrix of the present invention can be manufactured, for example, according to the description of the mouth described in References 1 and 2, but it is easy and efficient to operate.
  • silylating agent used to silylate the surface of the TFT formed in step (a) of the present invention examples include hexamethyldisilazane, dimethinoresic oral silane, Trimethylenochlorosilane, N-trimethinoresylinoreacetamide, N, O-bis (trimethy / resyl) acetamide, N-methino N-trimethylsilylacetoamide, N-methino
  • the surface of the amorphous silicon film and ⁇ ! Hexamethyldisilazane can be particularly preferably used because it is excellent in the effect of preventing water from adhering to the protective film and the adhesion at the interface between the two.
  • These siri / rays can be used as war worms or as a mixture of two or more.
  • the surface of the TFT amorphous silicon film formed on the substrate is converted with a silylating agent to silylate the surface.
  • the ⁇ is placed in the silylation processing chamber equipped with a hot plate, the array with the TF ⁇ opened (after the TF ⁇ is formed on the talisman) is separated from the hot plate, and the inside of the «3 ⁇ 4 Introduce the silylating agent vapor, heat the hot plate to bring the array substrate closer to the hot plate, and evenly diffuse the silylating agent vapor below 50 0 to introduce the silylating agent vapor. Stop the exhaust and remove the array 3 ⁇ 43 ⁇ 4 to the hot plate.
  • the vapor of the silylating agent is replaced with nitrogen to stop the silylated Si ⁇ ; Silylation proceeds during the worming of the array moth and the silylating agent vapor.
  • the concentration of the silylating agent 0.1 0 1 0 / 0-5 0.01% mosquitoes child Mashi Rere.
  • the entire surface of the array sickle including the surface of the TFT amorphous silicon film is silylated.
  • Delicate insects usually last for 1 minute or longer.
  • the surface of the TFT amorphous silicon film on the array can be silylated by, for example, using an array fiber and a small amount of silylating agent in a sealed container at room temperature and normal pressure. According to the last, only the surface of the TFT's amorphous silicon film is silly and humiliating.
  • a resin film organic preserving film is formed by using a resin on the surface of the silylated TFT T monomer monolithic silicon film.
  • Non-restricted raw resin thread is not particularly limited, but it is usually an alicyclic olefin polymer having a heel, « « ⁇ Xie's compound, and wisteria U
  • the force s containing s is preferably used.
  • Preferred examples of alicyclic olefin polymers having polar I4S include, for example, alicyclic olefin polymers having the characteristics of '14 3 ⁇ 4.
  • Preferred as a cross-linking agent for example, epoxy Bisphenol A type epoxy resin, Bisphenol F type epoxy resin, Fat, Phenolic nopolak type epoxy, Fat, Cresol Novolac type epoxy resin, Polyphenolic one Polyfunctional epoxy compounds such as le-type epoxies, t-fats, cyclic sebum epoxies, greaves, autsuki dalishidinole ether, and epoxy acrylate polymers.
  • WHi ⁇ ⁇ a compound that can absorb wisteria, such as ultraviolet rays and electrical springs, and cause chemistry
  • 1, 2 -naphthoquinonediazide-5- Quinonediazide sulfonic acid halides such as sulfonic acid chloride, 1,2-naphthoquinone diazide-4-sulfonic acid cucumberide, 1,2-benzoquinone diazide-5-sulfonic acid cucumberide, and 1,1,3-tris ( 2,5-Dimethino 4-hydroxyphenol) — 3-phenenolevronone, 4, 4, 1 [1-[4- [1- [4-Hydroxyphenyl] -1 -methylethyl] phenyl] ethylidene] bisphenol
  • photoacid generators such as ester compounds with non-phenolic compounds.
  • colloidal silica force s may be included in the spectacular yarn as well as other components commonly used in the mouth leakage sensitive raw resin yarn JJ3 ⁇ 4 #).
  • ⁇ ⁇ include monoalkylene glycol solvents, polyalkylene glycol solvents, monoalkylene glycol alkyl ester solvents, polyalkylene glycol alkyl ester solvents, monoalkylene glycol diesters, and polyalkylene glycol diester solvents. Can be mentioned.
  • the above-mentioned spoiled resin yarn is an example of Po, it may be a negative type.
  • Powerful compositions can be manufactured according to mouth application.
  • the solid content concentration of the raw resin yarn used for the removal can be properly determined in consideration of the necessary resin film thickness and application: removal, etc.
  • a force of weight% S is preferred.
  • the prepared sensitive resin yarn Jj » is usually preferably applied after removing foreign matters using a filter having a pore diameter of 0.1 to 5 ⁇ um.
  • the method for forming the resin film there is no particular limitation on the method for forming the resin film, and examples thereof include a film lamination method. As a result, a resin film is formed on the array coagulation b. If a silylated TFT amorphous silicon film is formed, a desired resin film is formed; h4 humiliation. The resin film is preferably formed on the entire surface of the array.
  • the tiff self-coating method is to apply a sensation 3 ⁇ 4
  • calorie heating For example, spraying, spin coating, roll coating, die coating, and doctor Method, recirculation method, bar coating method, screen printing method, etc.
  • the calorie fever separation can be adjusted according to the column of each component and the blending ratio, but is usually 30 to 150 ° C.
  • the caro heat enjoyment time can be selected according to the blending ratio of each component, but it is usually 0.5 to 90 minutes.
  • the calorie fever can be adjusted according to the type and mixing ratio of each component, but the calorie fever is usually 3 ° to 1550 ° C, and the calorie fever time is usually 0 5 to 90 minutes.
  • Film lamination can be performed using a laminator such as a pressure laminator, press, vacuum laminator, vacuum press, roll laminator and the like.
  • step (c) the obtained resin film is irradiated with active rays to form an apocalyptic pattern in the resin film, and then the developer pattern is made to manifest, thereby revealing the object pattern. Then, pattern the resin film.
  • the line is not particularly limited as long as it can activate the Sensitive Hi compound and can change the alkali solubility of the resin composition.
  • ultraviolet rays, g-line, i-line, etc. examples thereof include light beams such as ultraviolet rays having a single wavelength, KrF excimer laser light, and Arf excimer laser light; particle beams such as electron beams.
  • males that selectively irradiate these live rays in a pattern shape to form an apologetic pattern include ultraviolet rays, g-rays, i-rays, KrF excitations, etc.
  • Examples of the method include irradiating an optical spring such as a laser beam or an Ar F excimer laser beam through a mask pattern, and drawing with a particle beam such as an electron. After irradiating the live '[ ⁇ X-ray, if desired, the resin film can be processed at 6 0-1 30 for 1-2 minutes.
  • an optical spring such as a laser beam or an Ar F excimer laser beam
  • a particle beam such as an electron.
  • an aqueous solution of an alkaline compound can be used as a developing solution for developing and revealing an image pattern formed by active ray irradiation.
  • organic compounds such as ⁇ -sodium oxide are hydroxy and potassium-containing compounds such as tetramethylammonium hydroxide and tetraethylammonium hydroxide.
  • f3 ⁇ 4 can also be used. Al force re-watering night water! 3 ⁇ 4
  • As the body water; methanol, ethanol, etc.
  • 7J ⁇ soluble organic solvents can be used. Alkaline water rough night may be obtained by adding an appropriate amount of surface active IJ or the like. Examples of males that cause the developer to have a resin pattern having a simple pattern include paddle method, spray method, and dating method. Development is usually from 5 to 55 ° C, and development time is usually between 30 and 180 seconds.
  • the array fiber is removed to remove the present it residue from the surface, the surface and the surface 13. It may be rinsed by using a rinse solution such as.
  • the entire surface of the array sickle having the noni bi bi membrane may be irradiated with live rays, or simultaneously or simultaneously, the resin membrane may be heated.
  • the removal of Calo C include a method in which the array sickle is heated in a hot plate or “Pun.”
  • the heating t3 ⁇ 4t is usually from 100 ° C. to 300 ° C.
  • the resin film formed on the array can be cross-linked; depending on the type of cross-linking agent used, it can be selected appropriately.
  • Caro heat can be performed using, for example, a hot plate, “Pun, etc.” Usually, heating is preferably 1800 to 2500 ° C., and the calo heat time is the size of the resin film.
  • the age when using a hot plate is usually 5 to 60 minutes, and the bun is used: ⁇ is usually 30 to 90. A minute is preferred.
  • the caro heat can be performed in an inert gas atmosphere such as nitrogen, anoregon, helium, neon, xenon, krypton, or the like.
  • a hole pattern to be a contact hole is formed in the resin film.
  • ITO Indium Tin Oxide is formed on the shelf bag by sputtering, for example.
  • Is formed and patterned Is formed and patterned, and the TFT drain electrode and the pixel 3 ⁇ 4 are converted through the contact hole of the resin film.
  • Turn at the same time by forming an alignment film, and forming an alignment film and performing an alignment treatment such as rubbing to obtain an active matrix 3 ⁇ 4f.
  • the flat display device of the present invention is characterized by comprising the active matrix stiffness of the present invention.
  • the flat display device of the present invention is an excellent flat display device with long, low consumption, and high contrast because it uses the example.
  • Specific examples of the device include an active matrix liquid crystal display device and an active matrix organic electroluminescence ( ⁇ ⁇ ⁇ L) display device.
  • the active matrix type liquid crystal display device is composed of a pair of 3 ⁇ 4s arranged to face each other with a liquid crystal material, a film-like liquid crystal, etc. interposed therebetween, and one of the pair of s3 ⁇ 4 is s3 ⁇ 4 This is a flat display device composed of the following active matrix examples.
  • Examples of the active matrix (referred to as “opposing male” hereinafter) disposed opposite to the active matrix include a color filter vine, a microlens, and the like.
  • the color filter material layer is provided on the pixel 113 ⁇ 41: in the active matrix, and the color filter is not provided in the opposite direction!
  • Fig. 2 shows a plan view of an active matrix type liquid crystal display device that can be made using the active matrix of the present invention
  • Fig. 3 shows a cross-sectional view taken along the line XY.
  • the active matrix 3 ⁇ 43 ⁇ 4 1 0 1 with the pixel turn 2 0 2 and the color filter 1 0 2 with the opposite comfort 2 0 6 face each other across the liquid crystal layer 1 1 0
  • the pixel is located in the opposite portion between each pixel comfort 2 0 2 and the opposite pixel 2 0 6.
  • a sheet material 10 3 force S is provided, and a pattern 1 0 5 is formed in the area between the surface area and the sheet material 10 3.
  • the color filter 3 ⁇ 43 ⁇ 4 1 0 2 is provided with an opposing comfort 2 06 force S on the color filter layer 2 0 7 having the black matrix 2 0 8, and an alignment film 1 1 1 force S is provided thereon. Talk to me.
  • the active matrix ⁇ 1 0 1 is supplied with a gate signal that provides a gate signal to sleep the TFT 2 0 1 as a switching element on the fungus, and the source signal is supplied to the spring 2 0 3 and the TFT 2 0 1.
  • the source code “Izumi 2 0 4” is set to beat each other.
  • TFT 2 0 1 force S is installed in the vicinity of the two-way " ⁇ fountain exchange" 3 ⁇ 4, and the pixel separation is 2 0 2 so as to partially overlap the two-line ⁇ !
  • the contact hole of the Aruki defensive film 1 0 4 (in the figure; the pixel comfort 2 0 2 and the drain ⁇ of the TFT 2 0 1 are connected.
  • An alignment film 1 1 1 is disposed on the top of the shock beam 1 0 4.
  • the gate signal line 2 0 3 and the source t spring 2 0 4 are formed so as to extend beyond the forehead region, and the gates are provided via the inputs »1 0 8 provided in the outer terminal region.
  • Signal 2 for TFT 2 0 1 ⁇ is input to signal 2 0 3 and the display data signal is input to source signal 1 spring 2 0 4.
  • Consolation pattern 1 0 5 force Organic f Dye protection film 1 0 4 outer shell: In addition, it is extended to the upper zone, and a signal from the sleep circuit is input.
  • the above liquid crystal display device can be manufactured according to the method described in Japanese Patent Laid-Open No. 2003-005215.
  • the key self-active matrix type organic electroluminescence (EL) display device means that each pixel power formed by the active matrix matrix arrangement of the present invention is at least one organic EL element and a ⁇ EL element for ⁇ . It has at least two TFTs.
  • the organic EL element is not particularly limited.
  • a force S formed between the positive layer 3 ⁇ 4 ⁇ ⁇ ⁇ serving as the anode and the electron input ⁇ serving as the positive layer S is formed (S ⁇ -A chain, a force layer and an electron transport layer and a force S are formed between a hole 3 ⁇ 4 ⁇ ⁇ ⁇ and an electron injection consol (S ⁇ - ⁇ 5 ⁇ , or a positive 3 ⁇ 4 ⁇ box
  • S ⁇ - ⁇ 5 ⁇ an electron injection consol
  • the electron 3 ⁇ 4 ⁇ ® ⁇ and the positive force [# transmission layer, light-emitting material layer, electron transport layer and the structure formed by DHS ⁇ , etc. S can be mentioned.
  • the device consists of holes injected from holes 3 ⁇ 4 ⁇ 3 ⁇ 43 ⁇ 4 (anode) and electrons 3 ⁇ 4 ⁇ ® ⁇ ⁇ (electrons generated from ⁇ are the generation layer and holes or electrons) transport layer interface, and TO light This is based on the principle of recombination within the material layer to emit light.
  • Fig. 4 shows a typical configuration example of the organic EL element in the organic EL display device of the present invention.
  • F i g organic EL device shown in .4 includes pixel ⁇ as an active matrix ⁇ Immm)] 301, 3 ⁇ 4 m 302, It consists of 303 forces. Further, a sealing film 304 force S is provided as the outermost layer.
  • the configuration of one pixel for a shelf EL display device usually requires at least two TFTs to synthesize the EL element for at least one organic EL element, that is, a breakdown transistor and a writing transistor. However, both transistors are omitted in the configuration example shown in FIG. These transistors are the same as the active matrix of the present invention.
  • Fig. 5 shows an example of the circuit on the active matrix antifriction of the present invention.
  • the voltage applied in sequence to 3 ⁇ 4 comfort 401 connected to the circuit is 7 planes.
  • the TFT 402 write transistor
  • the capacitor 404 is difficult to respond to the display signal from the data ®f3 ⁇ 4403 connected to the vertical I sleep circuit.
  • TFT405 ⁇ transistor
  • the above-mentioned organic EL display device is manufactured according to the method described in Japanese Patent Application Laid-Open No. 2002-333846, for example. Can be
  • This polymer 1A had a weight average weight of 3,200, a number average molecular weight of 1,900 and a weight distribution of 1.68.
  • the solution was taken out and filtered through a fluororesin filter with a pore size of 0.2 ⁇ to separate the activated carbon, and the ring-opening metathesis polymer 1 ⁇ ⁇ hydride 1 B containing B Filtration was carried out without any delay
  • the hydrogenated reaction containing hydride 1B obtained here had a concentration of 20.6% by weight of the solid content in the night, and 1 The yield of 98.1 parts by weight of hydrogen was obtained with a weight average molecular weight of 4, 43.
  • the average molecular weight of the maiden was 2,570, and the molecular weight distribution was 1.72.
  • the hydrogenation rate was 99.9%.
  • a gate is formed on the n + Si layer with a sprinkling device, and a chromium layer is formed in a 200 nm ridge, and the source ⁇ , the source signal line, and the drain are formed by photolithography. Then, an unnecessary n + Si layer between the source electrode and the drain electrode was removed to form a back channel, and an array cell with TFT force S formed on the glass substrate was obtained.
  • the resulting array £ K was silylated with a hot plate. After evacuating the interior of AK treatment 33 ⁇ 4 to H3 ⁇ 4, hexamethinoresilazane was introduced as a silylating agent, and hexamethyldisilazane vapor was treated at 50 ° C. After evenly diffusing within @ 3 ⁇ 4, array plate is removed with a hot plate.
  • the silylation was performed for 1 minute by heating to 85 ° C. Next! /, In-process hexamethyldisilazane with nitrogen, cool to room temperature, and include the amorphous silicon film surface of TFT, An array in which the entire surface was silylated (trimethylsilylated) was obtained.
  • pre-beta was performed at 90 ° C for 2 minutes using a hot plate to obtain a film thickness of 1.2 ⁇ m.
  • m resin films were formed. This resin film was irradiated with ultraviolet rays having a light bow at 3 65 nm of 5 mW / cm 2 in the air for 40 seconds through a mask of a hole pattern of 10 ⁇ mX 10 m.
  • the same measurement was performed after leaving the active matrix substrate in an atmosphere of 50 ° C. and 80% RH for 100 hours.
  • the leakage current was 1 X 10 13 AZ C m 2 , the threshold was 4 V, and there was no change.
  • Example 1 The surface obtained in Example 1 was subjected to silylation of the array, except that Atalyl resin [JSR Co., Ltd., Optoma I] was used instead of Sento Senjosei fiber 1D. In the same manner as in Example 1, he made an active matrix difficulty and made a statement.
  • Atalyl resin JSR Co., Ltd., Optoma I
  • the leakage current was 3 ⁇ 10—13 A / cm 2 and the threshold was 3 V.
  • the leakage current after leaving the temple in an atmosphere at 50 ° C and 80% RH was 1 X 1 (r 12 A / cm 2 , and the threshold direct voltage was 2 V.
  • Example 1 In the process of spin-coating the acrylic resin Sakuya [JSR Corp., Optoma I] without the silylation treatment, the array anti-reflection of the TFT force S formed on the glass intuition obtained in Example 1 was used. In the same manner as in Example 1, the same matrix as in Difficult Example 2 was used to create an active matrix, and evaluation was performed in the same manner as in Example 1.
  • Example 3 Except for the transition to the step of spin-coating the polyimide resin Gakuya Le Co., Ltd., Photo Nice] without silylation treatment of the TFT male formed on the glass substrate obtained in Example 1 In the same manner as in Example 3, the active matrix was applied, and the surface was processed in the same manner as in Example 1.
  • Example 1 the surface of the array formed with TF repulsive force S on the glass aging is silylated and then crosslinked, and the alicyclic olefin polymer with extreme wrinkles.
  • the active matrix support of Example 1 with a protective film formed on and the shelf protection is acrylic resin and polyimide resin. 3 ⁇ 4
  • Each active matrix substrate of Examples 2-3 is a long time under high temperature and humidity. It can be seen that it has practically superior performance even after being removed.
  • the active matrix substrate 3 ⁇ 4 of Comparative Example 1 in which the protective layer was formed of a crosslinked, crisp alicyclic olefin polymer without performing silylation of the surface of the array was It can be seen that the performance is inferior when compared with the silylated «Example 1 active matrix.
  • each active matrix in Comparative Examples 2 and 3 in which the surface was formed of acryl resin and polyimide resin without silylation of the surface of the array was large in leak, and should not be used as an active matrix. S I understand. Industrial applicability
  • the leakage is small, and the source ⁇ 3 ⁇ 4 drain interval rises linearly with respect to the increase of the gate electrode.
  • the power generation and the threshold HE are almost unchanged, an excellent active matrix type flat display device with long length, low consumption, and high contrast can be obtained.
  • an active matrix having excellent characteristics can be efficiently produced by a simple operation.

Abstract

This invention provides an active matrix substrate comprising a base material and a thin-film transistor with an amorphous silicon film provided on the base material. The active matrix substrate is characterized in that the amorphous silicon surface has been silylated, and an organic protective film is provided on the surface of the silylated amorphous silicon film. There is also provided a method for manufacturing the active matrix substrate, characterized by comprising the step of bringing the surface of an amorphous silicon film in a thin-film transistor formed on a base material into contact with a silylating agent to silylate the surface, the step of forming a resin film using a radiation-sensitive resin composition on the surface of the silylated amorphous silicon film, and the step of applying an active radiation to the resin film to form a latent image pattern in the resin film and then bringing a developing solution into contact with the resin film to visualize the latent image pattern to conduct patterning of the resin film.

Description

明細書 アクティブマトリックス¾¾¾びその製^去 技術分野  Description Active matrix ¾¾¾ and its manufacturing technology field
本努明は、 アクティブ、マトリックス ¾¾¾ぴその製 ^去に関する。 さらに詳しくは、 本発明は、 簡単な工程により製造することができ、 しかも高レヽ ifffi性を有するアクティブ マトリックス蔵及びその製駄法に関する。 背景鎌  This work is about active, matrix manufacturing. More particularly, the present invention relates to an active matrix storehouse that can be manufactured by a simple process and has a high level of ifffi and a method for making the same. Background sickle
アクティブマトリックス とは、 ¾K上、 互いに直交して配置される複类鉢のゲート 信^!とソース信" ^泉との交点の近傍に薄膜トランジスタ(τ F τ)を介して画素 亟が酉己 置されたものである。 力かる簾は、 アクティブマトリックス型平面表示装置に使用され ている。アクティブマトリックス型平面表示装置では、各表示画素が T F T (スィツチング 素子)により個別に制御されるのでノ ッシブマトリックス型平面表示装置に比べてクロス トークが生じにくく、 高精細化、 大容量ィ匕に適してレ、る。  The active matrix is the gate signal ^! And source signal that are arranged orthogonal to each other on ¾K. ^ The pixel 亟 is placed near the intersection of the spring with a thin film transistor (τ F τ). Powerful traps are used in active matrix flat panel displays, which are noisy because each display pixel is individually controlled by a TFT (switching element). Compared to matrix type flat display devices, crosstalk is less likely to occur, making it suitable for high definition and large capacity display.
F i g . 7は、従来のアクティブマトリックス鎌上の回路の一例の説明図である。纏 上に直交して配置されたゲート信 泉 1 2とソース信 "^泉 1 3の交点の近傍にスィッチン グ素子としての T F T 1 4が配置されている。ゲート葡亟 1 5に印加される mEに応じて、 ソース ¾S 1 6力らドレイン慰亟 1 7に流れる霞巟量が変化し、 当該変化がコンタクトホ ールを経由して画素 ®f亟 1 8にィ siされることになる。  7 is an explanatory diagram of an example of a circuit on a conventional active matrix sickle. The TFT 14 as a switching element is placed near the intersection of the gate signal 1 2 and the source signal “^ spring 1 3” arranged orthogonally on the top. Applied to the gate 葡 亟 15 Depending on mE, the amount of fluid flowing from the source ¾S 1 6 force to the drain consol 17 changes, and this change is passed through the contact hole to the pixel f 18. .
従来のァクティブマトリックス¾¾は、 T F T力 S形成されたァレイ の表面に、 スパ ッタ法、 蒸着法、 又は CVD法によりシリコン窒化物などからなるパッシベーシヨン膜が 形成され、層間絶観莫により表面が平坦化され、 層間絶観 に、 コンタクトホーノレにお いて T F Tのドレイン ®亟と された画素慰亟が設けられた構成を有するものが多い。 例えば、特許文献 1には、 S i Nx又は s i o2からなる保 パッシベーション膜)と、 ベンゾシクロブテンからなる平坦ィ l (層間絶観 Dとを有するアクティブマトリックス基 板が開示されている。 カかるアクティブマトリックス鎌の製翻程においては、 膽己パ ッシベーシヨン膜の形成を真空中で行う必要があり、 設備費が高額で、 操作が;);頁雑である という欠点がある。 一方、 赚文献 2には、 画素霞亟と配線との間に、 ソース慰亟、 ソース酉 Bf泉、 ドレイン 慰厳びパックチャネルを うシロキサン樹脂からなる第 1の有觀間絶観莫と、 ァ クリル系榭脂からなる第 2の有翻間絶観莫と力 S形成され、 T F Τのチヤネ に纖下 層の « 間絶譲が接するアクティブマトリックス が開示されている。 力かるァク ティブマトリックス纖の製 程におレヽては «g間糸翻莫を形财る工程が 2工程あ り、 さらなる製造工程の簡 匕が望まれる。 In the conventional active matrix example, a passivation film made of silicon nitride or the like is formed on the surface of the array formed with the TFT force S by a sputtering method, a vapor deposition method, or a CVD method, and the surface is increased due to the layer-like view. Many of them have a structure that is flattened and has a pixel consolation that is the drain of the TFT in the contact Honoré. For example, Patent Document 1 discloses an active matrix substrate having a passivation film made of Si N x or sio 2 and a flat film l (interlayer deception D) made of benzocyclobutene. In the production process of such active matrix sickle, it is necessary to form a self-passivation film in a vacuum, and there is a disadvantage that the equipment cost is high and the operation is;); On the other hand, in Literature 2, the first conspicuous view of siloxane resin consisting of siloxane resin between source pixel and wiring, source consol, source Bf spring, drain consolation and packed channel, A second active matrix consisting of acrylic resin is formed, and an active matrix is disclosed in which the TF チ channel is in contact with the Τ 層 layer. In the process of producing a powerful active matrix, there are two processes that form the interlacing of threads, and further simplification of the manufacturing process is desired.
[赚文献 1 ] 特開平 1 0 - 9 6 9 6 3号公報  [Reference 1] Japanese Patent Laid-Open No. 10-96 96 3
[特許文献 2] 特開平 1 1 - 3 0 7 7 7 8号公報 発明の開示  [Patent Document 2] Japanese Patent Laid-Open No. 11-3070 778 Disclosure of Invention
本発明は、 簡単な工程により製造することができ、 しかも高いィ雷頁性を有するァクティ ブマトリックス ¾¾¾びその製 ^去を することを目的としてなされたものである。 本発明者らは、 上記の讓を解決すべく鋭意職を重ねた結果、 謝上に形成された τ The present invention has been made for the purpose of producing an active matrix which can be produced by a simple process and which has a high lightning resistance. As a result of intensive efforts to solve the above-mentioned defects, the present inventors have formed a τ
F Tのァモノレファスシリコン膜の表面をシリル化した後、 その上に 保護膜を形成して なるアクティブマトリックス鎌は、 リーク暫巟が小さく、 また、 ゲート の の増 カロに対してソース Sfe Kレイン慰亟間の 荒力 ¾f泉的に立ち上がり、 しかも高温多湿の 下に長時間 ¾cSしても、 カゝかる特 [4ゃ を流すのに必要な閾値 ®£がほとんど変化 しないことを見出し、 この知見に基づいて本発明を するに至った。 The active matrix sickle formed by silylating the surface of the FT amorphous surface silicon film and then forming a protective film on it, has a small leakage temperament. Rough force between comforts ¾f Standing in a spring, and even after a long period of ¾cS under high temperature and humidity, it is found that the threshold value required to flow 4 The present invention has been made based on the findings.
すなわち、本発明は、  That is, the present invention
( 1 ) アクティブマトリックス基板の製造^去であって、  (1) Production of active matrix substrate
( a )凝才上に形成された薄膜トランジスタのァモルファスシリコン膜の表面をシリル化剤 と纖 ί[させて、該表面をシリル化する工程、  (a) a step of silylating the surface of the amorphous silicon film of the thin film transistor formed on the age with a silylating agent;
( b )シリル化されたアモルファスシリコン膜の表面の上に «clt綠 14樹脂滅物により樹 脂膜を形成する工程、 及ぴ  (b) A step of forming a resin film on the surface of the silylated amorphous silicon film by using «clt 14 resin destruction, and
( c )得られた樹脂膜に活 |¾W線を照射して樹脂膜中に激象パターンを形成し、 次いで現 像液を擲虫させることにより谢象パターンを顕在化させて、樹脂膜をパターン化する工程、 を有することを 敷とするアクティブマトリックス の製 法、 (c) The resulting resin film is irradiated with active | ¾W rays to form a fiery image pattern in the resin film, and then the image solution is made to manifest by exposing the image solution to the resin film. A process of patterning, an active matrix manufacturing method based on having
( 2) 勘才上に形成された、 アモルファスシリコン膜を有する薄膜トランジスタを備えて なるアクティブマトリックス であって、 アモルファスシリコン膜の表面がシリル化さ れており、 力 シリル化されたアモルファスシリコン膜の表面の上に棚呆護膜を有する ことを ί敷とするァクティブマトリックス ¾¾、 (2) An active matrix comprising thin film transistors having an amorphous silicon film formed on the basis of ingenuity, where the surface of the amorphous silicon film is silylated and the surface of the force silylated amorphous silicon film Has a shelf protection film on top ACTIVITY MATRIX ¾¾,
(3) シリル化が、 トリメチルシリル化である |ίΠ5( 2)記載のアクティブマトリックス基 板、  (3) The active matrix substrate according to | ίΠ5 (2), wherein the silylation is trimethylsilylation,
(4) 有機保言劐莫が、 架橋された、 極 を有する脂環式ォレフインポリマーからなる膜 である嫌己(2)又は(3)記載のアクティブマトリックス ¾¾、  (4) The organic matrix is an active matrix according to (2) or (3), wherein the organic matrix is a film made of a cross-linked alicyclic olefin polymer having a pole.
(5) シリル化剤が、 へキサメチルジシラザンである前記(1)記載のアクティブマトリツ クス の製^去、  (5) Preparation of active matrix according to (1) above, wherein the silylating agent is hexamethyldisilazane,
(6) 感腿 生樹脂糸滅物が、 極 |4¾を有する脂環式ォレフインポリマー、 «剤、 感 方 匕合物、 及 O«ljを含有してなるものである前記( 1 )又は( 5 )記載のァクティブマ トリックス の製造方法、  (6) The above-mentioned crushed raw resin yarn is composed of an alicyclic olefin polymer having a pole | 4¾, a «agent, a sensitizing compound, and O« lj (1) Or (5) the manufacturing method of the active matrix described in
(7) 鍵己( 2 )〜( 4 )のレ、ずれかに記載のァクティブマトリックス¾¾を備えてなること を糊敷とする平面表示装置、 及び  (7) A flat display device having a paste as a result of having an active matrix as described in any of the keys (2) to (4).
を ίΐί共するものである。 Are shared with ί 共 ί.
また、 本発明のアクティブマトリックス難の製造方法によれば、 高レ、 ί龍性を有する アクティブマトリックス¾¾を簡単な操作で効率的に製造することができる。 図面の簡単な説明  In addition, according to the method for producing an active matrix difficulty of the present invention, an active matrix sample having a high level and high durability can be efficiently produced by a simple operation. Brief Description of Drawings
F i g.1 (a)は本発明のアクティブマトリックス纖の一貢纖の、 1画素単位の模式的 平面図、 F i g.1 (b)は TFT部を含む部分断面図、 F i g.2は本発明のアクティブマ トリッタス を用いてィ«され籍るァクティブマトリックス型液晶表示装置の一 の 平面図、 F i g.3は F i g.2のアクティブマトリックス型液晶表示装置の X— Y断面 F i g. (一部)、 F i g.4は本発明の有機 EL表示装置における有機 EL素子の典型的な構 成例を示す図、 F i g.5はアクティブマトリックス型有機エレクトロルミネッセンス表示 装置に使用される、 本発明のアクティブマトリックス蓬上の回路の一例の説明図、 F i g.6は実施例 1のアクティブマトリックス蔵につ!/ヽての、ゲート慰亟の ¾Eと、 ソース mm/ドレイン 亟間の電流の関係を示すダラフ、 F i g .7は従来のァクティブマトリツ タス基板上の回路の一例の説明図である。 図中、 符号 1は す、 2はゲート信号線、 3は ソース信号泉、 4は薄膜トランジスタ(T FT)、 5はゲート動亟、 6はソース電極、 7は ドレイン ®fl、 8はシリル化部、 9は有機保護膜、 10はコンタクトホール、 11は画素 12はゲート信^!、 13はソース信^ 、 14は薄膜トランジスタ(T F T;)、 1 5はグート慰亟、 16はソース慰亟、 17はドレイン電極、 18は画素電極、 19は^ ¾ f本層、 20はグート糸色徽莫、 101はアクティブマトリックス ¾¾、 102はカラーフィ ノレタ ¾K、 103はシーノレ材、 104は^)¾¾薩、 105は慰1ヽ。ターン、 108は入 力 ί&、 110は?夜晶層、 111酉己向膜、 201は薄膜トランジスタ(TFT)、 202は 画素電極、 203はゲート信号!!、 204はソース信号 H、 206は対向慰亟、 207は カラーフィルタ層、 208はブラックマトリックス、 301はアクティブマトリックス基 板、 302は発搬料層、 303は上部慰顧隱、 304は封止膜、 401は走査電 極、 402は薄膜トランジスタ(T F T)、 403はデータ慰亟、 404はコンデンサ、 4 05は薄膜トランジスタ(T F T)、 406は有機 E L素子を表す。 発明を実施するための最良の形態 F i g.1 (a) is a schematic plan view of one pixel unit of the contribution of the active matrix of the present invention, F i g.1 (b) is a partial sectional view including a TFT portion, .2 is a plan view of an active matrix type liquid crystal display device using the active matrix according to the present invention, and FIG. 3 is an X of the active matrix type liquid crystal display device of FIG. — Y cross section F i g. (Part), F i g.4 is a diagram showing a typical configuration example of the organic EL element in the organic EL display device of the present invention, and F i g.5 is an active matrix organic FIG. 6 is an explanatory diagram of an example of a circuit on the active matrix of the present invention used in an electroluminescence display device. FIG. /ヽof Te, and ¾E gate慰亟, Darafu showing the relationship between the current source mm / drain亟間, F i g .7 is an example illustration of a circuit on a conventional § active Matrigel Tsu + substrate . In the figure, reference numeral 1 is, 2 is a gate signal line, 3 is a source signal spring, 4 is a thin film transistor (TFT), 5 is a gate motion, 6 is a source electrode, 7 is a drain ®fl, and 8 is a silylated part. , 9 is an organic protective film, 10 is a contact hole, 11 is a pixel 12 is a gate signal, 13 is a source signal, 14 is a thin film transistor (TFT), 1 5 is Goto consolation, 16 is source consolation, 17 is drain electrode, 18 is pixel electrode, 19 is ^ ¾ f main layer, 20 is Goto thread color, 101 is active matrix ¾¾, 102 is color finer ¾K, 103 is the sole, 104 is ^) ¾¾ 薩, 105 is comfort. Turn, 108 is the input ί &, 110 is the nocturnal layer, 111 酉 self-directed film, 201 is the thin film transistor (TFT), 202 is the pixel electrode, 203 is the gate signal! !, 204 is the source signal H, 206 is the opposite comfort, 207 is the color filter layer, 208 is the black matrix, 301 is the active matrix substrate, 302 is the shipping charge layer, 303 is the upper comforter, 304 is sealed Membrane, 401 is a scanning electrode, 402 is a thin film transistor (TFT), 403 is data comfort, 404 is a capacitor, 405 is a thin film transistor (TFT), and 406 is an organic EL element. BEST MODE FOR CARRYING OUT THE INVENTION
本発明のアクティブマトリックス は、謝才上に开誠された T FTのアモルファスシ リコン膜の表面がシリル化され、その上に有機保翻莫を有する。 F i g. 1 (a)は本発明の アクティブマトリックス纖の一肯纖の、 1画素単位の模式的平面図、 F i g.1 (b)は T FT部を含む部分断面図である。 ; 纖においては、 纖才 1の表面に、 ゲート信^ H 2と ソース信^!泉 3が して配置され、 その交点の近傍に T FT 4力 S配置されている。 TF T 4は、 グート 5、 ソース餅亟 6、 ドレイン ¾亟 7、 体層 19及ぴゲート絶鶴 20を有する。 勘才1の上に形成された TFT4のアモルファスシリコン膜の表面がシリ ル化されると共に、 シリル化部 8力 S形成されている。 本図においては、 シリル化部力 S厚さ をもって示されているが、 シリル化部の厚さはた力だ力 ^O— S i- C-Hの原子間 であり、 シリルイ W1とは呼ぶことができない厚さである。 シリル化部 8の上には、 有機高 分子からなる有機保護膜 9が設けられ、棚保言劐莫 9のコンタクトホール 10を介して、 ドレイン 亟 7と画素慰亟 11と力 S接続されてレ、る。 なお、 本 H ^では T F Τが 1画素単 位当 り 1つであるが、 所望により 2つ以上形成されていてもよい。  In the active matrix of the present invention, the surface of the TFT's amorphous silicon film, which has been devised for its affirmation, is silylated, and has an organic support. F i g.1 (a) is a schematic plan view of one pixel unit of the active matrix の of the present invention, and F g.1 (b) is a partial cross-sectional view including a TFT portion. In 纖, on the surface of genius 1, the gate signal ^ H2 and the source signal ^! Fountain 3 is placed next to it, and TFT 4 force S is placed near the intersection. TFT 4 has a goat 5, a source 餅 亟 6, a drain ¾ 亟 7, a body layer 19 and a gate crane 20. The surface of the TFT4 amorphous silicon film formed on the ingenuity 1 is silylated and a silylated portion of 8 forces S is formed. In this figure, the silylation force S is shown with the thickness S, but the thickness of the silylation is the force between the atoms of the force ^ O—S i- CH, which can be referred to as Silyli W1. It is impossible thickness. An organic protective film 9 made of organic polymer is provided on the silylation unit 8 and is connected to the drain 画素 7 and the pixel consolation 11 through the contact hole 10 of the shelf protection word 9. Les. In this H ^, TFΤ is one per pixel, but two or more may be formed if desired.
本発明のアクティブマトリックス の各構成要素、 すなわち、 ¾t才、 ゲート信 "^泉、 ソース信^!泉、 TFT、 及ひ面素慰亟などは、 例えば、 廳己特許文献 1や 2に記載される ような従来のァクティブマトリックス のものと同様であり、 それらの 口: こ言己載 の材料を用!/、て形成される。  Each component of the active matrix of the present invention, that is, ¾t, Gate Shin "^ Izumi, Source Shin ^! Izumi, TFT, Oimu Elemental Consolation, etc. is described in, for example, Patent Documents 1 and 2 They are similar to those of the conventional active matrix, and their mouths are:
本発明のアクティブマトリックス纖では、 シリル化は、 少なくとも、 TFTのァモル ファスシリコン膜の表面において生じておればよい。 T FTのアモルファスシリコン膜の 表面とは、 T F Tのチヤネ のァモノレファスシリコン膜の表面をレヽう。 該シリル化に利 用するシリル基に特に制限はなく、 例えば、 ジメチルシリル基、 トリメチルシリル基、 ト リエチルシリル基、 トリイソプロビルシリル基、 t -プチルジメチルシリル基、 t一プチノレ ジフエ-ルシリル基、 及びトリフエニルシリル基などを挙げることができる。 これらの中 で、トリメチルシリル基を好遍 翻することができる(すなわち、トリメチルシリル化)。 ここで、 シリル化とは、 凝才等の表面に雜するプロトンがシリル基によって置換される ことをいう。 T F Tのァモノレファスシリコン S莫の表面がシリル化されると、 ァモルフ了ス シリコン膜の表面が疎水性となり、 アモルファスシリコン膜の表面と «保¾1莫の間への 水分の侵入が防止さ 辱、 優れた而显熱性を有するアクティブマトリックス が得られ るものと考えられる。 In the active matrix according to the present invention, the silylation has only to occur at least on the surface of the amorphous silicon film of the TFT. TFT Amorphous silicon film The surface refers to the surface of the TFT's monolithic silicon film. The silyl group used for the silylation is not particularly limited, and examples thereof include a dimethylsilyl group, a trimethylsilyl group, a triethylsilyl group, a triisopropylpropylsilyl group, a t-butyldimethylsilyl group, a tert-butylene phenylsilyl group, and A triphenylsilyl group etc. can be mentioned. Of these, the trimethylsilyl group can be reversed (ie, trimethylsilylation). Here, silylation means that protons on the surface such as aged are replaced by silyl groups. TFT amorphous silicon S When the surface of the silicon is silylated, the surface of the amorphous silicon film becomes hydrophobic, preventing moisture from entering between the surface of the amorphous silicon film and the surface. It is considered that an active matrix having excellent thermal properties can be obtained.
本発明のアクティブマトリックス鎌において、 機保灘は、 通常、 シリル化された In the active matrix sickle of the present invention, the machine guard is usually silylated.
T F Tのァモルファスシリコン膜の表面に するようにして、 毅才の全面に形成され る。 It is formed on the entire surface of the talisman so as to be on the surface of the amorphous silicon film of TFT.
本発明において、 有機保讕莫を形成する材料としては、 例えば、 ポリエチレン、 ポリプ 口ピレン、ポリブテンなどのポリオレフイン;月旨環式ォレフィンポリマー;アタリル樹脂; ポリイミド樹脂;ポリシロキサン樹脂;ポリエーテル;などを挙げることができる。 これ らの中で、 月旨環式ォレフインポリマーは、 吸湿性が極めて小さく、誘電率の周波数依存性 力 S小さいので好適に用いることができる。 本発明において、 有樹呆讖莫の厚さは、 通常、 0.:!〜 1 0 0 μ ηι、好ましくは 0. 5〜5 0 m、より好ましくは 0. 5〜3 0 / mである。 翻旨環式ォレフインポリマーとは、 環状構造と炭素一炭素二 佶合とを有する脂環式 ォレフィン単量体を重合してなり、 該単量体単位を構造単位として有する重合体である。 環状構造としてほ、 例えば、 シクロアルカ シクロアルケ^ If造が挙げられる。 ま た、環状構造は、 であっても、多環 (縮合多環、橋架け環、 これらの組み合わ 環な ど)であってもよい。環状構造の一単位を構成する炭素原 は、特に限定はなレヽが、通常、 4〜3 0個、 好ましくは 5〜2 0個、 より好ましくは 5〜 1 5個である。  In the present invention, examples of the material for forming the organic protective layer include: polyolefins such as polyethylene, polypropylene pyrene, and polybutene; moon-ring olefin polymers; talyl resins; polyimide resins; polysiloxane resins; Can be mentioned. Among them, the moon-ring cyclic olefin polymer has a very low hygroscopic property and can be suitably used because it has a small frequency dependence force S of dielectric constant. In the present invention, the thickness of the tree is usually 0.:! ˜10 0 μμηι, preferably 0.5 to 50 m, more preferably 0.5 to 30 / m. The cyclic cyclic olefin polymer is a polymer obtained by polymerizing an alicyclic olefin monomer having a cyclic structure and a carbon-carbon combination, and having the monomer unit as a structural unit. . An example of a cyclic structure is the cycloalkaline cycloalkene ^ If structure. In addition, the cyclic structure may be or may be a polycycle (fused polycycle, bridged ring, a combination thereof). The number of carbon atoms constituting one unit of the cyclic structure is usually 4 to 30 pieces, preferably 5 to 20 pieces, and more preferably 5 to 15 pieces.
脂環式ォレフィンポリマーは、脂環式ォレフイン単量体以外の単量体単位を « ^単位と して有していてもよい。 脂環式ォレフインポリマー中、 脂環式ォレフイン単量体単位の割 合は、 所望により適: 1»尺されるが、 通常、 3 0 - 1 0 0重量0ん 好ましくは 5 0〜: L 0 0重量%、 より好ましくは 7 0〜: L 0 0重量%である。 力かる 、得られる有機保護膜 の而显熱 [·生が優れる。 ItftBH旨環式ォレフインポリマーとしては極醒を有するものカ である。 力かる重合 体中の極 ftSの 割合は特に限定されるものではない。 極 は、 脂環式ォレフインポ リマーの構成単量体単位の総モル数中、 新謝呆讓莫の ^子な而显熱性などを確呆する観点 力、ら、通常、 3 0〜1 0 0モノレ0 /0、 好ましくは 5 0〜: 1 0 0モノレ0 /0、 より好ましくは 7 0 〜1 0 0モル0 /0の構成単量体単位に するのがよい。 各構成単量禪位に する極性 基の^ Xは数に特に限定はない。 The alicyclic olefin polymer may have a monomer unit other than the alicyclic olefin monomer as a unit. In the alicyclic olefin polymer, the ratio of the alicyclic olefin monomer units is suitably 1 if desired, but usually 30 to 100 weight 0, preferably 50 to: L 0% by weight, more preferably 70 to: L 0% by weight. Powerful display of the organic protective film obtained [· life is excellent. ItftBH is a highly polar polymer. The ratio of polar ftS in the strong polymer is not particularly limited. In terms of the total number of moles of monomer units of the alicyclic polyolefin polymer, the ability to confirm the heat resistance etc. Monore 0/0, preferably 5 0: 1 0 0 Monore 0/0, and more preferably to 7 0-1 0 0 mole 0/0 of the constituent monomer units. There is no particular limitation on the number of polar groups ^ X in each constituent unit.
歸 亟 '隨としては、 例えば、 カルボキシル基(ヒドロキシカルボ-ル基)、 アルコキシ カルボニル基、ジカノレポン^^水物基 (カルボニルォキシカルボニル基)、 瞧(ヒドロキ シル基)、二トリル基、エポキシ基、ォキセタニル基、及びイミド基からなる群より選択さ れる 1種以上の基 (以下、 これらをまとめて 「特赵亟 '14¾」 という)が挙げられる。  隨 亟 '隨 includes, for example, carboxyl group (hydroxycarbon group), alkoxycarbonyl group, dicanolepton ^^ hydrate group (carbonyloxycarbonyl group), 瞧 (hydroxyl group), nitrile group, epoxy group And at least one group selected from the group consisting of an oxetanyl group and an imide group (hereinafter these are collectively referred to as “special '14 ¾”).
例えば、 特^ (¾¾¾が水^ ¾である例としては、 ヒドロキシフエ二ノレ基、 ヒドロキシフ ェ-ルアルキル基などのフエノール |¾τ藤を含む置魁; ヒドロキシアルキル基、 ヒド ロキシアルコキシ基、 ヒドロキシアルコキシカノレポニル基などのアルコール十 纖を含 む置換基;が挙げられ、ヒドロキシメトキシ¾¾ぴヒドロキシエトキシ基など力 子ましレ、。 特赵亟 '醒がィミ'ド基である例としては、 Ν-フエニルジカルボキシィミド基などが挙げ られる。  For example, as an example of which ^ (¾¾¾ is water ^ ¾, there are phenols such as a hydroxyphenol group, a hydroxyphenyl alkyl group, etc., and a group containing ¾τ wisteria; a hydroxyalkyl group, a hydroxyalkoxy group, a hydroxyalkoxy group Substituents containing alcohol groups such as canoleponyl groups, and the like, and hydroxymethoxy group, hydroxyethoxy groups, and the like. And Ν-phenyldicarboximide group.
月旨環式ォレフィンポリマーは t己特赵亟†4£を i¾Sだけ有していてもよいし、 2« 以上有していてもよいが、 2 以上有するの力 S好ましい。 中でも、 カノレポキシノレ基とィ ミド基とを併有するのがより好ましレヽ。  The lunar olefin olefin polymer may have 4 tons of i ^ S, or 2 or more, but preferably has a force S of 2 or more. Of these, it is more preferable to have both a canolepoxinole group and an imido group.
tin己特赵亟' 14¾を有する脂環式ォレフィンポリマーとしては、 例えば、 以下の式( I )で 表される繰り返し構造単位を有するものが挙げられる。 Examples of the alicyclic olefin polymers having tin self-characteristics 14¾ include those having a repeating structural unit represented by the following formula (I).
Figure imgf000009_0001
Figure imgf000009_0001
〔式(I )中、. 〜 は、 それぞ; 虫立して、 7i素原子又は- Xn- R' (Xは、 メチレン基、 カルボニル基などの二価の基であり、 nは 0又は 1であり、 R'は 基を有してもよい、 メチル基、 ベ ジル基、 力ルポキシル基などの、 炭素数:!〜 7のアルキル基、 芳香 ¾S、 又は特赵亟 である。 )であり、 〜 のうち 1つ以上は、 R,力特 亟个建である -X n—R'であり、 mは 0〜2の である。 〕· ' . In [Formula (I), ~ is, respectively; and insects standing, 7i atom or - X n - R '(X is a methylene group, a divalent group such as a carbonyl group, n represents 0 Or R ′ may have a group, such as a methyl group, a benzyl group, a strong lpoxyl group, etc., an alkyl group having from 7 to 7 carbon atoms, an aromatic group S, or a special group. And one or more of ~ is R, a force feature -X n -R ', and m is 0-2. ] '
特定 を有する旨環式ォレブインポリマーは、 特定†亟†4¾を有する旨環式才レフィ ン単量体を、又は特赵亟 を有する S驟式ォレフィン単量体と当調旨環式ォレフィン単 量体と重合可能なその他の単量体とを、 口の; 6¾に従って重合し、 所望により水素勸ロ すること.により得られる。 特 4¾は脂環式ォレフイン単量体の他、膽己その他の単量 体に被していてもよい。 また、 その他の単量体に特赵亟 '隨が被する 、脂環式ォ レフィン単量体に特¾¾个4¾が ϊ½していなくてもよレ、。  The cyclic olefin olefin polymer having a specific property may be selected from a cyclic olefin monomer having a specific † 亟 † 4¾, or an S cyclic olefin polymer having a specific characteristic and a corresponding cyclic cyclic olefin. It is obtained by polymerizing the monomer and other polymerizable monomers according to the mouth; and by hydrogenation if desired. In particular, in addition to the alicyclic olefin monomer, it may be covered with a monomer or other monomer. In addition, the special monomer may be covered with the other monomer, and the special alicyclic olefin monomer may not have 4 to 40%.
特極性醒を有する脂環式ォレフィン単量体としては、例えば、 5 -ヒドロキシカルボ二 ルビシクロ [ 2. 2. 1 ]ヘプト -2-ェン、 5—メチノ 5 ヒドロキシカルボ二ルビシクロ [ 2. 2. 1 ]ヘプト- 2 -ェン、 5-力ルポキシメチノ 5-ヒドロキシカノレポ二ルビシクロ [ 2. 2. 1]ヘプト— 2—ェン、 8—メチノレ— 8 ヒドロキシカルボ二ルテトラシクロ [4.4.0. I2'5.Examples of alicyclic olefin monomers having specific arousal include, for example, 5-hydroxycarbonylbicyclo [2.2.1] hept-2-en, 5-methino-5hydroxycarbonylbicyclo [2.2.2. 1] Hept-2-ene, 5-force lupoxymethino 5-hydroxycanoleporubicyclo [2. 2. 1] Hept-2-ene, 8-methinole-8 hydroxycarbonyltetracyclo [4.4.0. I 2 ' 5 .
17.1。]ドデカ—3—ェン、 8-カルボキシメチノ 8-ヒドロキシカルボニノ トラシクロ [4.17.1. ] Dodeca 3 -Yen, 8-Carboxymethino 8-Hydroxycarbonino Tracyclo [4.
4.0. I2'5. I7'10]ドデ力- 3 -ェンなどの 1つのカルボキシル基を有する脂環式ォレフイン 単量体; 5-ェキソ -6-エンド-ジヒドロキシカルボ-ルビシクロ [2. 2.1]ヘプト -2-ェ ン、 8—ェキソ—9—エンド—ジヒドロキシカノレボエルテトラシクロ [4.4.0. I2'5. I7·10]ド デカ— 3—ェン、ビシクロ [2.2. 1]ヘプト— 2—ェン— 5, 6—ジカルポン^ 物、テトラシ クロ [ 4.4.0 · 1 ¾5. 17' 10]ドデカー 3 -ェン— 8, 9—ジカノレボン 水物、へキサシク口 [ 6.4.0. I 2 ' 5. I 7 ' 10 ] Dode force-cycloaliphatic olefin monomers with one carboxyl group such as 3-ene; 5-exo-6-endo-dihydroxycarbo-rubicyclo [2 2.1] Hept-2-ene, 8-exo-9-endo-dihydroxycanoleboeltetracyclo [4.4.0. I 2 ' 5. I 7 · 10 ] dodeca-3-ene, bicyclo [2.2 . 1] hept - 2-E down - 5, 6 Jikarupon ^ things, Tetorashi black [4.4.0 · 1 ¾5 1 7 ' 10] Dodeka 3 -. E down - 8, Kisashiku port 9 Jikanorebon anhydride to, [6.
6. 1. I3'6. I10·13.0¾7.09'14]ヘプタデカー 4—ェン—11, 12 -ジカノレポン^ ^水物などの 6. 1. I 3 '. 6 I 10 · 13 .0 ¾7 .0 9' 14] Heputadeka 4 E down -11 12 - Jikanorepon ^ ^ anhydride etc.
2つのカノレポキシル基を有する脂環式ォレフイン単量体; 5- (4 -ヒドロキシフエ二ノレ)ビ シクロ [2.2. 1]ヘプト— 2-ェン、 5-メチノ 5— (4-ヒドロキシフエ二ノレ)ビシクロ [ 2.Cycloaliphatic olefin monomers with two canolepoxyl groups; 5- (4-hydroxyphenenole) bicyclo [2.2.1] hept-2-ene, 5-methino-5- (4-hydroxyphenenole ) Bicyclo [2.
2.1]ヘプト- 2-ェン、 5-カルボキシメチノ 5 -(4-ヒドロキシフエニル)ビシクロ [2.2.1] Hept-2-ene, 5-carboxymethino 5- (4-hydroxyphenyl) bicyclo [2.
2.1]ヘプト— 2—ェン、 8—メチノ 8_(4—ヒドロキシフエ二ノレ)テトラシクロ [4.4.0.2.1] Hept-2-en, 8-methino 8_ (4-hydroxyphenenole) tetracyclo [4.4.0.
I2'5. I7'10]ドデ力- 3-ェン、 8 -カルボキシメチノ 8 -(4—ヒドロキシフエ-ル)テトラシ クロ [4.4.0.1¾5. I7·10]ドデ力- 3 -ェンなどの 1つのヒドロキシフエ-ル基を有する脂 環式ォレフィン単量体; N— (4-フエ-ル)—( 5-ノルボルネンー 2, 3—ジカノレポキシィミド) などの N - g^fミド基含有脂環式ォレフイン単量体;等が挙げられる。これらの単量体は、 それぞれ戦虫で、 又は 2種以上を混合して用いることができる。 I 2 ' 5. I 7 ' 10 ] Dode force-3-ene, 8-carboxymethino 8- (4-hydroxyphenol) tetracyclo [4.4.0.1 ¾5 . I 7 · 10 ] Dode force -Cycloaliphatic olefin monomers with one hydroxyphenol group such as 3-ene; N— (4-phenol) — (5-norbornene-2,3-dicanorepoxyimide), etc. N-g ^ f imide group-containing alicyclic olefin monomer; These monomers can be used as warworms or as a mixture of two or more.
上 旨環式ォレフイン単量体と重合可能なその他の単量体としては、例えば、エチレン、 プロピレン、 1_ブテン、 1-ペンテン、 1-へキセン、 3 -メチノ H-プ、テン、 3 _メチノ 1 -ペンテン、 3 -ェチノ 1 -ペンテン、 4—メチノ 1 -ペンテン、 4—メチノ 1 -へキセン、 Examples of other monomers that can be polymerized with the above cyclic olefin monomer include, for example, ethylene, propylene, 1_butene, 1-pentene, 1-hexene, 3-methino propyl, ten, 3_ Methino 1-pentene, 3-ethino 1-pentene, 4-methino 1-pentene, 4-methino 1-hexene,
4, 4 -ジメチノ 1 "^キセン、 4, 4 -ジメチノ 1 -ペンテン、 4 -ェチノ!^ 1 -へキセン、 34,4-Dimethino 1 "^ xene, 4,4-dimethino 1-pentene, 4-ethino! ^ 1-hexene, 3
-ェチノ 1-へキセン、 1 -オタテン、 1ーデ、セン、 1-ドデセン、 1—テトラデセン、 1—へ キサデセン、 1—オタタデセン、及び 1 -エイコセン等の炭素数 2〜 20の -ォレフィン;-Olefin having 2 to 20 carbon atoms such as -ethino 1-hexene, 1-otaten, 1-decene, sen, 1-dodecene, 1-tetradecene, 1-hexadecene, 1-otatadecene, and 1-eicosene;
1 , 4 "^キサジェン、 4 -メチノ 1, 4 -べキサジェン、 5 -メチノ 1, 4 キサジェン、 及び 1, 7-ォクタジェン等の^^殳ジェン等、 並びに特 亟 で置換されたこれらの単 量体の置換体などが挙げられる。 これらの単量体は、 それぞれ戦虫で、 又は 2種以上を混 合して用いることができる。 1,4 "^ xagen, 4-methino 1,4-bexagen, 5-methino 1,4-xagen, and 1,7-octagen, etc. These monomers can be used as warworms or as a mixture of two or more.
本発明に用いる^ 1式ォレフィンポリマーは、 テトラヒドロフラン (THF)を、雄とす るゲルパーミエーシヨンクロマトグラフィー(G P C)で測定されるポリスチレ^!^:の重 量平:^分子量 (Mw)力 S1, 000〜1, 000, 000であること力 子ましく、 5, 000〜5 0 0 , 0 0 0であることがより好ましく、 1 0, 0 0 0〜2 5 0, 0 0 0であることがさらに 好ましレヽ。脂環式ォレフィンポリマーの重量平均分子量 (Mw)カ 1,0 0 0〜1,0 0 0,0 0 0であると、 耐显熱 ¾、 接着 14、 表面平潘生など力 Sバランスされた 呆護膜を形成す ることができる。 脂環式ォレフインポリマーの分子量分布は、 THFを?纏とするゲルパ 一ミエーションクロマトグラフィ一で測定される重量平均 量 (Mw)と数平均分子量 (M n)との比 (Mw/ n) 、 5以下であること力 S好ましく、 4以下であることがより好ましく、 3以下であることがさらに好ましレ、。 The type 1 olefin polymer used in the present invention is a polystyrene measured by gel permeation chromatography (GPC) using tetrahydrofuran (THF) as a male! Weight of ^: Weight: ^ Molecular weight (Mw) Force S1,000-1,000,000 Forced force, 5,000-5 0 0, 0 0 0 is more preferable, and 1 0, 0 0 0 to 2 5 0, 0 0 0 is even more preferable. When the weight average molecular weight (Mw) of the alicyclic olefin polymer is 1,00 0 to 1,0 0 0,0 0 0, the heat balance, heat resistance, adhesion 14, surface flatness, etc. are balanced. A dull protective film can be formed. The molecular weight distribution of alicyclic olefin polymers is the ratio of the weight average weight (Mw) to the number average molecular weight (M n) measured by gel permeation chromatography using THF (Mw / n). The power is preferably 5 or less S, more preferably 4 or less, and even more preferably 3 or less.
本発明における有機保寵莫は、 好ましくは脂環式ォレフインポリマー、 より好ましくは 極隨を有する脂環式ォレフインポリマーにより形成されるが、 謝との密着隨 保 ¾1 ^滅以降のプロセス適合 I·生に優れることから、 有機保護膜は、架橋された、極隨 を有する脂環式ォレフインポリマーにより形成されるのがさらに好ましレ、。  The organic protective layer according to the present invention is preferably formed of an alicyclic olefin polymer, more preferably an alicyclic olefin polymer having an extreme thickness. Process suitability I. It is more preferable that the organic protective film is formed of a crosslinked, highly polar alicyclic polyolefin polymer, because it is excellent in life.
' 本発明のアクティブマトリックス は、 例えば、 tfit己する 文献 1や 2に記載され る 口の 去に準じて製造することができるが、操作が容易で効率的であること力ゝら、 以 下の方法、すなわち、  '' The active matrix of the present invention can be manufactured, for example, according to the description of the mouth described in References 1 and 2, but it is easy and efficient to operate. The method, ie
( &)製才上に形成された T F Tのアモルファスシリコン膜の表面をシリル化剤と翻虫させ て、該表面をシ.リル化する工程、 ( & ) A step of translating the surface of the amorphous silicon film of TFT formed on the product with a silylating agent to silylate the surface;
( b)シリル化されたアキルファスシリコン膜の表面の上に 生樹脂糸滅物により樹 脂膜を形成する工程、 及び  (b) a step of forming a resin film on the surface of the silylated Achillus silicon film by raw resin destruction, and
( c)得られた樹脂膜に活 tt¾tt線を照射して樹脂膜中に謝象パターンを形成し、 次いで現 像液を攧虫させることにより纖パターンを顕在化させて、樹脂膜をパターン化する工程、 を有する ^去が好適である。  (c) The obtained resin film is irradiated with an active tt¾tt line to form an apocalyptic pattern in the resin film, and then the moth pattern is revealed by worming the image solution, thereby patterning the resin film. It is preferred to have the following step.
本発明 の工程( a )におレ、て、 才上に形成された T F Tの表面をシリル化するため に使用されるシリル化剤としては、 例えば、 へキサメチルジシラザン、 ジメチノレジク口口 シラン、 トリメチノレクロロシラン、 N—トリメチノレシリノレアセトアミド、 N, O-ビス(トリ メチ /レシリル)ァセトアミド、 N-メチノ N-トリメチルシリルァセトアミド、 N-メチノ  Examples of the silylating agent used to silylate the surface of the TFT formed in step (a) of the present invention include hexamethyldisilazane, dimethinoresic oral silane, Trimethylenochlorosilane, N-trimethinoresylinoreacetamide, N, O-bis (trimethy / resyl) acetamide, N-methino N-trimethylsilylacetoamide, N-methino
N -トリメチルシ Vルジェチルァミン、 N, 0-ビス(トリメチルシリル) トリフルォロァセト アミ ド、 N-トリメチルシリルイミダゾール、 テトラメチルジシラザン、 t -プチルジメチ ルク口口シラン、 N -メチノ ( t -ブチルジメチルシリノレ)トリフルォロァセトアミド、
Figure imgf000011_0001
クロロメチノレシメチノレクロロシラン、 ブロモメ チルジメチルク口口シラン、 オタタデシ/レトリクロロシラン、 N, Ν' -ビス(トリメチルシ リノレ)尿素、 Ν -トリメチルシリノ N, N' -ジフエニル尿素、 N, 0-ビス(トリメチルシリル) カーバメート、 N, 0-ビス(トリメチルシリル)サルファメート、 トリメチ /レシリ 7レトリフ ノレォロメタンスルホン酸などを挙げることができる。 これらの中で、 アモルファスシリコ ン膜の表面と^!保護膜との間への水分の^ Λ防止効果、 及び両者の界面の密着性向 • 果に優れることから、 特にへキサメチルジシラザンを好適に用いることができる。 これら のシリ /レイ は、 それぞれ戦虫で、 又は 2種以上を混合して用いることができる。
N-trimethylsilane V-rugetylamine, N, 0-bis (trimethylsilyl) trifluoroacetamide, N-trimethylsilylimidazole, tetramethyldisilazane, t-butyldimethylmethyl silane, N-methino (t-butyldimethylsilinore ) Trifluoroacetamide,
Figure imgf000011_0001
Chloromethinorecimethylenochlorochloro, bromome Tildimethylk silane, otattashi / retrichlorosilane, N, Ν'-bis (trimethylsilylole) urea, Ν-trimethylsilino N, N'-diphenylurea, N, 0-bis (trimethylsilyl) carbamate, N, 0- Bis (trimethylsilyl) sulfamate, Trimethi / Resiri 7 Retrif Nororomethanesulfonic acid, etc. can be mentioned. Among these, the surface of the amorphous silicon film and ^! Hexamethyldisilazane can be particularly preferably used because it is excellent in the effect of preventing water from adhering to the protective film and the adhesion at the interface between the two. These siri / rays can be used as war worms or as a mixture of two or more.
本発明方法において、 基材上に形成された T F Tのアモルファスシリコン膜の表面をシ リル化剤と翻虫させて該表面をシリル化する ^去に特に制限はない。 ί列えば、 ホットプレ ートを備えたシリル化処理室に T F Τが开诚されたァレイ (凝才上に T F Τを形成し た後のもの)をホットプレートから離して し、 «¾内を赚にしてシリル化剤の蒸気 を導入し、 ホットプレートを加熱してァレイ基板をホットプレート ίと近づけ、 5 0 以下 でシリル化剤の蒸気を均一に拡散させて、 シリル化剤の蒸気の導入と排気を停止し、 ァレ ィ¾¾をホットプレートに撤虫させて 8 0〜9 0。Cの Stでシリル化 ®¾を行ったのち、 シリル化剤の蒸気を窒素により置換してシリル化 Si^を停止させる; W去が挙げられる。 シ リル化は、 アレイ纖とシリル化剤の蒸気との擲虫が行われている間に進行する。 その場 合、シリル化剤の濃度は、 0. 1 010/0〜5 01%カ 子ましレヽ。上記方法によれば、 T F Tの アモルファスシリコン膜の表面を含め、 アレイ鎌の全面がシリル化さ uf辱る。 繊虫は、 通常、 1分間以上行えばよい。 In the method of the present invention, the surface of the TFT amorphous silicon film formed on the substrate is converted with a silylating agent to silylate the surface. If the 列 is placed in the silylation processing chamber equipped with a hot plate, the array with the TF Τ opened (after the TF 形成 is formed on the talisman) is separated from the hot plate, and the inside of the «¾ Introduce the silylating agent vapor, heat the hot plate to bring the array substrate closer to the hot plate, and evenly diffuse the silylating agent vapor below 50 0 to introduce the silylating agent vapor. Stop the exhaust and remove the array ¾¾ to the hot plate. After silylation at St in C, the vapor of the silylating agent is replaced with nitrogen to stop the silylated Si ^; Silylation proceeds during the worming of the array moth and the silylating agent vapor. In that case, the concentration of the silylating agent, 0.1 0 1 0 / 0-5 0.01% mosquitoes child Mashi Rere. According to the above method, the entire surface of the array sickle including the surface of the TFT amorphous silicon film is silylated. Delicate insects usually last for 1 minute or longer.
また、 上曾 法の他、 例えば、 密閉した容器に常温、 常圧でアレイ繊と少量のシリル 化剤とを同¾1 "ることにより、 アレイ 上の T F Tのァモノレファスシリコン膜の表面を シリル化する; W去が挙げられる。 カゝかる 去によれば、 実質的に、 T F Tのアモルファス シリコン膜の表面のみがシリノレィ匕さ; 辱る。  In addition to the above method, the surface of the TFT amorphous silicon film on the array can be silylated by, for example, using an array fiber and a small amount of silylating agent in a sealed container at room temperature and normal pressure. According to the last, only the surface of the TFT's amorphous silicon film is silly and humiliating.
次いで、 工程(b )において、 シリル化された、 T F Tのァモノレファスシリコン膜の表面 の上 謝生樹脂,滅物により樹脂膜 (有機保画を形成する。  Next, in the step (b), a resin film (organic preserving film is formed by using a resin on the surface of the silylated TFT T monomer monolithic silicon film.
ttHBit腿綠 1·生樹脂糸滅物としては、 特に限定されるものではなレ、が、 通常、 極隨を 有する脂環式ォレフインポリマー、架嫌 «、 «^謝匕合物、 及び藤 Uを含有してなるも の力 s好適に用いられる。  ttHBit Thigh 1 · Non-restricted raw resin thread is not particularly limited, but it is usually an alicyclic olefin polymer having a heel, «« ^ Xie's compound, and wisteria U The force s containing s is preferably used.
極 I4Sを有する脂環式ォレフィンポリマーの好ましレ、例としては、 特 亟'14¾を有する 脂環式ォレフィンポリマーカ S挙げられる。架橋剤としての好ましレ、例としては、 エポキシ 基を 2つ以上、好ましくはエポキシ基を 3つ以上有する、 ビスフエノール A型エポキ^ 脂、 ビスフエノール F型ェポキ、 脂、 フエノールノポラック型ェポキ、 脂、 クレゾ一 ルノボラック型ェポキ ^脂、ポリフエノ一ル型ェポキ、 t脂、環状脂議ェポキ、 脂、 脂月雄ダリシジノレエーテル、 エポキシァクリレート重合体等の多官能エポキシ化合物が挙 げられる。 ^WHi匕^ (紫外線や電 泉などの藤線を吸収し、ィ匕学 を引き起こす ことができるィ匕合物)の好ましレ、例としては、 1 , 2 -ナフトキノンジァジド- 5 -スルホン酸 クロライド、 1 , 2-ナフトキノンジアジド- 4-スルホン酸ク口ライド、 1 , 2 -べンゾキノ ンジアジド- 5 -スルホン酸ク口ライド等のキノンジアジドスルホン酸ハラィドと、 1, 1, 3 -トリス(2, 5—ジメチノ 4 ヒドロキシフエ-ノレ)— 3—フエニノレブロノ ン、 4, 4,一 [ 1 - [ 4- [ 1- [ 4-ヒドロキシフエ二ル]- 1 -メチルェチル]フエニル]ェチリデン]ビスフエノ 一ノ のフエノール !fek醒を有する化合物とのエステル化合物などの光酸発生剤が挙げ られる。力かる糸滅物には、 口の感漏線生樹脂糸 JJ¾#)に慣用されるその他の成分の他、 教粒子として、 例えば、 コロイダルシリカ力 s含まれていてもよい。 また、 灘 ϋとして は、 例えば、 モノアルキレングリコール溶媒、 ポリアルキレングリコール溶媒、 モノアル キレンダリコールアルキルエステル溶媒、 ポリアルキレングリコールアルキルエステル溶 媒、 モノアルキレングリコールジエステル激某、 ポリアルキレングリコールジエステル溶 媒などが挙げられる。 Preferred examples of alicyclic olefin polymers having polar I4S include, for example, alicyclic olefin polymers having the characteristics of '14 ¾. Preferred as a cross-linking agent, for example, epoxy Bisphenol A type epoxy resin, Bisphenol F type epoxy resin, Fat, Phenolic nopolak type epoxy, Fat, Cresol Novolac type epoxy resin, Polyphenolic one Polyfunctional epoxy compounds such as le-type epoxies, t-fats, cyclic sebum epoxies, greaves, autsuki dalishidinole ether, and epoxy acrylate polymers. ^ WHi 匕 ^ (a compound that can absorb wisteria, such as ultraviolet rays and electrical springs, and cause chemistry), for example, 1, 2 -naphthoquinonediazide-5- Quinonediazide sulfonic acid halides such as sulfonic acid chloride, 1,2-naphthoquinone diazide-4-sulfonic acid cucumberide, 1,2-benzoquinone diazide-5-sulfonic acid cucumberide, and 1,1,3-tris ( 2,5-Dimethino 4-hydroxyphenol) — 3-phenenolevronone, 4, 4, 1 [1-[4- [1- [4-Hydroxyphenyl] -1 -methylethyl] phenyl] ethylidene] bisphenol Examples include photoacid generators such as ester compounds with non-phenolic compounds. For example, colloidal silica force s may be included in the splendid yarn as well as other components commonly used in the mouth leakage sensitive raw resin yarn JJ¾ #). Examples of ϋ が include monoalkylene glycol solvents, polyalkylene glycol solvents, monoalkylene glycol alkyl ester solvents, polyalkylene glycol alkyl ester solvents, monoalkylene glycol diesters, and polyalkylene glycol diester solvents. Can be mentioned.
以上の 緣性樹脂糸滅物はポ、 の例であるが、 ネガ型であってもよい。 力かる組 成物は 口の施に従って製造することができる。 なお、 本発明:^去に用いる 生 樹脂糸滅物の固形分濃度としては、 必要な樹脂膜の厚さや塗布:^去などを考慮して適龍 定することができるが、 5〜4 0重量%であるの力 S好ましい。 調製された感膽綠性樹脂 糸 Jj»は、 通常、 孔径 0. 1〜5 ^umのフィルターなどを用いて異物などを除去したのち、 塗布するのが好ましい。  Although the above-mentioned spoiled resin yarn is an example of Po, it may be a negative type. Powerful compositions can be manufactured according to mouth application. In the present invention, the solid content concentration of the raw resin yarn used for the removal can be properly determined in consideration of the necessary resin film thickness and application: removal, etc. A force of weight% S is preferred. The prepared sensitive resin yarn Jj »is usually preferably applied after removing foreign matters using a filter having a pore diameter of 0.1 to 5 ^ um.
樹脂膜を形成する方法に特に制限はなく、例えば、 '» フィルム積層法などを挙げ ることができる。 これらの 去によりアレイ凝肚に樹脂膜を形成 bば、 シリル化され た、 T F Tのアモルファスシリコン膜の表面に所望の樹脂膜が形成さ; h4辱る。 樹脂膜はァ レイ勘反の全面に形成されるのが好ましレ、。  There is no particular limitation on the method for forming the resin film, and examples thereof include a film lamination method. As a result, a resin film is formed on the array coagulation b. If a silylated TFT amorphous silicon film is formed, a desired resin film is formed; h4 humiliation. The resin film is preferably formed on the entire surface of the array.
tiff己塗布法は、 感¾|¾ 1生樹旨糸 物をアレイ 上に塗布したのち、カロ熱車喿して溶 媒を除去する 去である。 生樹脂糸滅物をァレイ 上に塗布する方法としては、 例えば、 スプレー法、 スピンコート法、 ロールコート法、 ダイコート法、 ドクターブレー ド法、 回^布法、 バー塗布法、 スクリーン印刷法などを挙げることができる。カロ熱草 離は、 各成分の欄や配合割合に応じて適 尺することができるが、 通常は 3 0〜1 5 0°Cである。カロ熱享據時間は、 各成分の觀ゃ配合割合に応じて適 31択することがで きるが、 通常は 0. 5〜 9 0分間である。 The tiff self-coating method is to apply a sensation ¾ | ¾ 1 raw tree savory material onto the array, and then remove the solvent by calorie heating. For example, spraying, spin coating, roll coating, die coating, and doctor Method, recirculation method, bar coating method, screen printing method, etc. The calorie fever separation can be adjusted according to the column of each component and the blending ratio, but is usually 30 to 150 ° C. The caro heat enjoyment time can be selected according to the blending ratio of each component, but it is usually 0.5 to 90 minutes.
Ιίίϊ己フイノレム積層法は、 線 [·生榭旨@成物を、 樹脂フィルムや金属フィルムなどの 上に塗布した後に加熱草燥により?雄を除去して Bステージフィルムを得、 次いで、 この Bステージフィルムをアレイ 上に積層する; ^去である。 カロ熱 件は、 各成分の種 類や配合割合に応じて適 IS尺することができるが、 カロ熱 は、 通常、 3◦〜 1 5 0 °C であり、カロ熱時間は、 通常、 0. 5〜 9 0分間である。 フィルム積層は、加圧ラミネータ、 プレス、 真空ラミネータ、真空プレス、 ロールラミネータなどの歸機を用いて行うこと ができる。  Ιίίϊ yourself Fuinoremu lamination method, a line [- raw 榭旨 @ Narubutsu, by heating grass 燥 after applying onto a resin film or a metal film? By removing the male give B stage film, then the B Laminate stage film on the array; The calorie fever can be adjusted according to the type and mixing ratio of each component, but the calorie fever is usually 3 ° to 1550 ° C, and the calorie fever time is usually 0 5 to 90 minutes. Film lamination can be performed using a laminator such as a pressure laminator, press, vacuum laminator, vacuum press, roll laminator and the like.
工程( c )におレ、ては、 得られた樹脂膜に活 線を照射して樹脂膜中に謝象パターン を形成し、 次いで現像液を繊虫させることにより鼎象パターンを顕在化させて、樹脂膜を パターン仆する。  In step (c), the obtained resin film is irradiated with active rays to form an apocalyptic pattern in the resin film, and then the developer pattern is made to manifest, thereby revealing the object pattern. Then, pattern the resin film.
活'! 線は、 感脑 Hi匕合物を活性化させ、 ϋ¾Ι#尉生樹脂 物のアルカリ可溶性 を変化させることができるものであれば特に限定されず、 例えば、 紫外線、 g線や i線な どの単一波長の紫外線、 K r Fエキシマレーザー光、 A r Fエキシマレーザー光などの光 線;電子線などの粒子線;などを挙げることができる。 これらの活 線を選択的にパ ターン状に照射して謝象パターンを形财る雄としては、 例えば、縮小 影露條置な どにより、 紫外線、 g線、 i線、 K r Fエキ^レーザー光、 A r Fエキシマレーザー光 などの光糸泉を、 マスクパターンを介して照射する方法、 電子 などの粒子線により描画す る 去などを挙げることができる。 活 '[^謝線を照射したのち、 所望により、 樹脂膜を 6 0 - 1 3 0でで、 1〜 2分間加讓理してもよレヽ。  Live! The line is not particularly limited as long as it can activate the Sensitive Hi compound and can change the alkali solubility of the resin composition. For example, ultraviolet rays, g-line, i-line, etc. Examples thereof include light beams such as ultraviolet rays having a single wavelength, KrF excimer laser light, and Arf excimer laser light; particle beams such as electron beams. For example, males that selectively irradiate these live rays in a pattern shape to form an apologetic pattern include ultraviolet rays, g-rays, i-rays, KrF excitations, etc. Examples of the method include irradiating an optical spring such as a laser beam or an Ar F excimer laser beam through a mask pattern, and drawing with a particle beam such as an electron. After irradiating the live '[^ X-ray, if desired, the resin film can be processed at 6 0-1 30 for 1-2 minutes.
活' 線照射により形成された鼎象パターンを現像して顕在化させるための現像液と しては、アル力リ性化合物の水性赚を用レ、ることができる。アル力リ性化合物としては、 τΚ酸化ナトリゥムゃ水酸ィ匕カリゥムなどの »{匕合物、 テトラメチルアンモニゥムヒドロ キシドゃテトラェチルアンモニゥムヒドロキシドなどの有樹匕合物のい f¾をも用いるこ とができる。 アル力リ水性激夜の水! ¾某体としては、 水;メタノール、 エタノールなどの As a developing solution for developing and revealing an image pattern formed by active ray irradiation, an aqueous solution of an alkaline compound can be used. Examples of organic compounds such as τ-sodium oxide are hydroxy and potassium-containing compounds such as tetramethylammonium hydroxide and tetraethylammonium hydroxide. f¾ can also be used. Al force re-watering night water! ¾ As the body, water; methanol, ethanol, etc.
7J ^溶性有機溶媒を使用することができる。 アルカリ水粗翁夜は、 界面活醋 IJなどを適当量 添 したものであってもよい。 簡象パターンを有する樹脂膜に現像液を繊虫させる雄としては、 例えば、 パドル法、 スプレー法、 デイツビング法などを挙げることができる。 現像 は、 通常、 5〜5 5°C であり、 現像時間は、通常、 3 0〜1 8 0秒、間である。 7J ^ soluble organic solvents can be used. Alkaline water rough night may be obtained by adding an appropriate amount of surface active IJ or the like. Examples of males that cause the developer to have a resin pattern having a simple pattern include paddle method, spray method, and dating method. Development is usually from 5 to 55 ° C, and development time is usually between 30 and 180 seconds.
このようにしてパターン化された樹脂膜をアレイ凝及上に形成したのち、 所望により、 該 肚、 該 威面及ひ亥斟 黯 13の現 it¾渣を除去するために、 アレイ繊を趑 ¾K などのリンス液を用 、てリンスしてもよい。  After the resin film patterned in this way is formed on the array, if necessary, the array fiber is removed to remove the present it residue from the surface, the surface and the surface 13. It may be rinsed by using a rinse solution such as.
さらに、所望により、 謝匕合物を失活させるために、 ノターンィ bi 脂膜を有する アレイ鎌全面に活 線を照射したり、 それと同時に又は照赚、 樹脂膜を加熱して もよい。カロ C¾去としては、例えば、 アレイ鎌をホットプレートや^ "プン内で加熱す る方法が挙げられる。加熱 t¾tは、通常、 1 0 0〜3 0 0°Cである。  Furthermore, if desired, in order to inactivate the compound, the entire surface of the array sickle having the noni bi bi membrane may be irradiated with live rays, or simultaneously or simultaneously, the resin membrane may be heated. Examples of the removal of Calo C include a method in which the array sickle is heated in a hot plate or “Pun.” The heating t¾t is usually from 100 ° C. to 300 ° C.
本発明 去におレヽては、 アレイ鎌上にパターンィ i 脂膜を形成した後に、 樹脂の架橋 ®¾を行うのが好ましレ、。 ァレイ蔵上に形成された樹脂膜を架橋する; は、 使用した 架橋剤の觀に応じて適龍択することができるが、 通常 ί 口熱により行う。 カロ熱は、 例 えば、 ホットプレート、 "プンなどを用いて行うことができる。 加熱 は、 通常は 1 8 0〜2 5 0°Cであるのが好ましく、 カロ熱時間は、 樹脂膜の大きさ、厚さ、使用 βなど に応じて適 131択することができる。 例えば、 ホットプレートを用いる齢は、 通常は 5 〜6 0分間、 ブンを用いる:^は、 通常は 3 0〜9 0分間であるのカ好ましい。  In the present invention, it is preferable to carry out cross-linking of the resin after forming the pattern i oil film on the array sickle. The resin film formed on the array can be cross-linked; depending on the type of cross-linking agent used, it can be selected appropriately. Caro heat can be performed using, for example, a hot plate, “Pun, etc.” Usually, heating is preferably 1800 to 2500 ° C., and the calo heat time is the size of the resin film. Depending on the thickness, thickness, use β, etc., it is possible to select 131. For example, the age when using a hot plate is usually 5 to 60 minutes, and the bun is used: ^ is usually 30 to 90. A minute is preferred.
カロ熱は、 所望により、 窒素、 ァノレゴン、 ヘリウム、 ネオン、 キセノン、 クリプトンなど などの不活性ガス雰囲気下で行うことができる。  If desired, the caro heat can be performed in an inert gas atmosphere such as nitrogen, anoregon, helium, neon, xenon, krypton, or the like.
以上の工程(。によれば、樹脂膜にコンタクトホールとなるホールパターンが形成され る。 以後、例えば、 Ρの方法に従って、 棚保藤の上に、 例えば、 スパッタリング法 により I TO (Indium Tin Oxide)からなる画素戴亟を形成してパターニングし、 樹脂膜の. コンタクトホーノレを介して T F Tのドレイン ®Τ亟と画素 ¾亟とを換镜する。 このとき、 画 素電極を構成する I TOにより電ォ! ^ターンを同時に形成する。 その後、 配向膜を形成し てラビング処理等の配向処理を施すことによりアクティブマトリックス ¾f反を得る。  According to the above process (., A hole pattern to be a contact hole is formed in the resin film. After that, for example, according to the method of Ρ, ITO (Indium Tin Oxide is formed on the shelf bag by sputtering, for example. ) Is formed and patterned, and the TFT drain electrode and the pixel ¾ are converted through the contact hole of the resin film. ^ Turn at the same time by forming an alignment film, and forming an alignment film and performing an alignment treatment such as rubbing to obtain an active matrix ¾f.
本発明の平面表示装置は、 本発明のァクティブマトリックス凝反を備えてなることを特 徴とする。 本発明の平面表示装置は、 該¾¾を用いてなることから、 長 、 低消費 ®Λ で高コントラストな優れた平面表示装置である。 該装置の具体例としては、 アクティブマ トリックス型液晶表示装置、アクティブマトリックス型有機エレクトロルミネッセンス(Ε L)表示装置などが挙げられる。 ΙΐίΙ己アクティブマトリックス型液晶表示装置とは、 液晶材 フィルム状液晶等を間に 挟んで対向配設された一対の ¾sからなるものであって、 一対の s¾のうちの一方の皿 力 s本発明の クティブマトリックス¾¾で構成された平面表示装置である。 アクティブマ トリックス¾¾に対して対向配設される (以下、 「対向雄」 という。 )としては、 例 えば、 カラーフィルタ蔓、 マイクロレンズ 等が挙げられる。 The flat display device of the present invention is characterized by comprising the active matrix stiffness of the present invention. The flat display device of the present invention is an excellent flat display device with long, low consumption, and high contrast because it uses the example. Specific examples of the device include an active matrix liquid crystal display device and an active matrix organic electroluminescence (ル ミ ネ L) display device. The active matrix type liquid crystal display device is composed of a pair of ¾s arranged to face each other with a liquid crystal material, a film-like liquid crystal, etc. interposed therebetween, and one of the pair of s¾ is s¾ This is a flat display device composed of the following active matrix examples. Examples of the active matrix (referred to as “opposing male” hereinafter) disposed opposite to the active matrix include a color filter vine, a microlens, and the like.
また、 アクティブマトリックス とカラーフィルタ とで構成される液晶表示装置 の変开例としては、 アクティブマトリックス における画素11¾1:に、 カラーフィノレタ 材料層を 設け、 対向勘反にカラーフィルタを設けない! ^の液晶表示装置や、 導電性 を有するカラーフィルタ材料により、 アクティブマトリックス繊の画素慰亟を形成し、 対向凝及に力ラーフィルタを設けな ヽ の液晶表示装置などが挙げられる。  In addition, as an example of a liquid crystal display device composed of an active matrix and a color filter, the color filter material layer is provided on the pixel 11¾1: in the active matrix, and the color filter is not provided in the opposite direction! The liquid crystal display device of ^ and the liquid crystal display device of which the active matrix fiber pixel consolation is formed by the conductive color filter material, and the force filter is not provided on the opposite side.
F i g . 2に、本発明のアクティブマトリックス を用いて され得るアクティブマ トリックス型液晶表示装置の一 ||¾の平面図を、 F i g . 3に、その X—Y線断面図を示す。 本 H«においては、 画素潘返 2 0 2を備えたアクティブマトリックス ¾¾ 1 0 1と、 対向 慰逛2 0 6を備えたカラーフィルタ簾 1 0 2とが、液晶層 1 1 0を挟んで対向配設され、 各画素慰亟 2 0 2と対向 «亟 2 0 6との対向部分が画素となってレ、る。 難からなる表示 領域の外周にはシーノレ材 1 0 3力 S設けられ、 表^!域とシーノレ材 1 0 3の間の領域に パターン 1 0 5が している。 なお、 カラーフィルタ ¾¾ 1 0 2には、 ブラックマトリ ックス 2 0 8を有するカラーフィルタ層 2 0 7上に対向慰亟 2 0 6力 S設けられ、 その上に 配向膜 1 1 1力 S設けられてレヽる。 アクティブマトリックス纖 1 0 1には、 菌上、 スィ ツチング素子としての T F T 2 0 1を層睡するゲート信号を供^るグート信"^泉 2 0 3 及び T F T 2 0 1にソース信号を供^ Tるソース信"^泉 2 0 4が互いに鼓して設けられ てレヽる。 両信"^泉の交^ ¾近傍に T F T 2 0 1力 S設けられ、 その上に有機保護月莫 1. 0 4を 介して、 両信^!と一部重なるように画素離 2 0 2力 S設けられている。 なお、 有樹呆護 膜 1 0 4のコンタクトホール (図; において、 画素慰亟 2 0 2と T F T 2 0 1のドレ イン βが接続されている。 また、有衞呆讕莫 1 0 4の上には配向膜 1 1 1が対向配設さ れている。  Fig. 2 shows a plan view of an active matrix type liquid crystal display device that can be made using the active matrix of the present invention, and Fig. 3 shows a cross-sectional view taken along the line XY. In this H «, the active matrix ¾¾ 1 0 1 with the pixel turn 2 0 2 and the color filter 1 0 2 with the opposite comfort 2 0 6 face each other across the liquid crystal layer 1 1 0 The pixel is located in the opposite portion between each pixel comfort 2 0 2 and the opposite pixel 2 0 6. In the outer periphery of the display area consisting of difficulties, a sheet material 10 3 force S is provided, and a pattern 1 0 5 is formed in the area between the surface area and the sheet material 10 3. The color filter ¾¾ 1 0 2 is provided with an opposing comfort 2 06 force S on the color filter layer 2 0 7 having the black matrix 2 0 8, and an alignment film 1 1 1 force S is provided thereon. Talk to me. The active matrix 纖 1 0 1 is supplied with a gate signal that provides a gate signal to sleep the TFT 2 0 1 as a switching element on the fungus, and the source signal is supplied to the spring 2 0 3 and the TFT 2 0 1. The source code “Izumi 2 0 4” is set to beat each other. TFT 2 0 1 force S is installed in the vicinity of the two-way "^ fountain exchange" ¾, and the pixel separation is 2 0 2 so as to partially overlap the two-line ^! In addition, the contact hole of the Aruki defensive film 1 0 4 (in the figure; the pixel comfort 2 0 2 and the drain β of the TFT 2 0 1 are connected. An alignment film 1 1 1 is disposed on the top of the shock beam 1 0 4.
—方、 ゲート信号線 2 0 3とソースt 泉 2 0 4は、額«域を超えて延出形成されて おり、 その外側の端子領域に設けられた入力 » 1 0 8を介して、 ゲート信 泉 2 0 3に T F T 2 0 1 β用の信号 ®ΐが入力され、 ソース信^ 1泉 2 0 4に表示デ タの信号 が入力さ 辱る。 慰亟パターン 1 0 5力 有機 f呆護膜 1 0 4の外周貝:¾上に开诚され、 さ らに» ^域まで延長形成されており、睡回路からの信号が入力される。 以上の液晶表 示装置は^^の; ^去、 例えば、 特開 2003— 005215 報に記載の^去に従って 製造することができる。 -On the other hand, the gate signal line 2 0 3 and the source t spring 2 0 4 are formed so as to extend beyond the forehead region, and the gates are provided via the inputs »1 0 8 provided in the outer terminal region. Signal 2 for TFT 2 0 1 β is input to signal 2 0 3 and the display data signal is input to source signal 1 spring 2 0 4. Consolation pattern 1 0 5 force Organic f Dye protection film 1 0 4 outer shell: In addition, it is extended to the upper zone, and a signal from the sleep circuit is input. The above liquid crystal display device can be manufactured according to the method described in Japanese Patent Laid-Open No. 2003-005215.
鍵己アクティブマトリックス型有機エレクトロルミネッセンス(EL)表示装置とは、 本 発明のァクティブマトリックス マトリクス配列して形成された各画素力 少なく とも 1つの有機 EL素子と、 ^EL素子を ,βするための少なくとも 2つの TFTと を有するものである。  The key self-active matrix type organic electroluminescence (EL) display device means that each pixel power formed by the active matrix matrix arrangement of the present invention is at least one organic EL element and a ^ EL element for β. It has at least two TFTs.
有機 EL素子は、 特に制限されず、 例えば、 陽極となる正 ¾λ餅亟と 亟となる電子 入 βとの間に正 ¾ ^送層と発 才料層と力 S形成された離 ( S Η- Α鎖のもの、正孔 ¾λ竈亟と電子注入慰亟との間に発 才料層と電子輸送層と力 S形成された ( S Η - Β構 5©のもの、又は正 ¾Λ箱と電子 ¾Λ®亟との間に、正? [#送層と発光材料層と電子輸 送層とカ形成された構造 (DHS^)のものなど力 S挙げられる。 いずれの構造の でも、 有機 E L素子は正孔 ¾Λ¾¾ (陽極)から注入された正孔と電子 ¾Λ®Τ亟 (麵から さ れた電子が、発 才料層と正孔ほたは電子)輸送層の界面、 およ TO光材料層内で再結合 して発光するという原理で する。  The organic EL element is not particularly limited. For example, a force S formed between the positive layer ¾λ 餅 亟 serving as the anode and the electron input β serving as the positive layer S is formed (S Η -A chain, a force layer and an electron transport layer and a force S are formed between a hole ¾λ 竈 亟 and an electron injection consol (S Η-Β5 ©, or a positive ¾Λ box Between the electron ¾Λ® 亟 and the positive force [# transmission layer, light-emitting material layer, electron transport layer and the structure formed by DHS ^, etc. S can be mentioned. The device consists of holes injected from holes ¾Λ¾¾ (anode) and electrons ¾Λ®Τ 亟 (electrons generated from 麵 are the generation layer and holes or electrons) transport layer interface, and TO light This is based on the principle of recombination within the material layer to emit light.
F i g.4に、本発明の有機 EL表示装置における有機 EL素子の典型的な構成例を示す。 Fig. 4 shows a typical configuration example of the organic EL element in the organic EL display device of the present invention.
F i g.4に示す有機 EL素子は、アクティブマトリックス纖 immm )として 画素慰亟を含む〕 301、 ¾ m 302、
Figure imgf000017_0001
303力、ら構成され ている。 また、 最外層として封止膜 304力 S設けられている。 棚 EL表示装置の一画素 分の構成としては、 通常、 少なくとも 1つの有機 E L素子に対し、該 E L素子を馬繊する ための T F Tとして少なくとも 2つ、 すなわち、 屠働トランジスタと書き込みトランジス タが必要であるが、 F i g.4の構成例では両トランジスタは省略してある。それらのトラ ンジスタは、 本発明のァクティブマトリックス¾¾に雜する。
F i g organic EL device shown in .4 includes pixel慰亟as an active matrix纖Immm)] 301, ¾ m 302,
Figure imgf000017_0001
It consists of 303 forces. Further, a sealing film 304 force S is provided as the outermost layer. The configuration of one pixel for a shelf EL display device usually requires at least two TFTs to synthesize the EL element for at least one organic EL element, that is, a breakdown transistor and a writing transistor. However, both transistors are omitted in the configuration example shown in FIG. These transistors are the same as the active matrix of the present invention.
本発明のァクティブマトリックス¾¾では、 |5尉亟としての画素慰亟と TFTのドレイン ®Τ亟とカ S纖されている。 F i g.5に、本発明のアクティブマトリックス凝反上の回路の —例を示すが、 該回路において、 7平 ,«回路に接続された ¾慰亟 401に順じ印加さ れた電圧により T F T 402 (書き込みトランジスタ)がオン状態になり、 垂直 I睡回路に 接続されたデータ ®f¾403からの表示信号に応じた ®«がコンデンサ 404に難さ れる。 コンデンサ 404に麵された ®量により TFT405 (麵トランジスタ)が動 作し、 棚 E L素子 406に が供給さ 機 E L素子が点灯する。 戴亟 401に が印加されるまでの間この点火" Γ状態力 ¾ ^されることになる。 以上の有機 E L表示装 置は 卩の雄、 例えば、 特開 2002 - 333846号公報に記載の^去に従って製造 することができる。 麵列 In the active matrix example of the present invention, pixel comfort as | 5 cm and TFT drain size are used. Fig. 5 shows an example of the circuit on the active matrix antifriction of the present invention. In this circuit, the voltage applied in sequence to ¾ comfort 401 connected to the circuit is 7 planes. The TFT 402 (write transistor) is turned on, and the capacitor 404 is difficult to respond to the display signal from the data ®f¾403 connected to the vertical I sleep circuit. TFT405 (麵 transistor) operates by the amount of light input to the capacitor 404, and is supplied to the shelf EL element 406. The machine EL element lights up. To 401 The above-mentioned organic EL display device is manufactured according to the method described in Japanese Patent Application Laid-Open No. 2002-333846, for example. Can be
以下に、 実施例を挙げて本宪明をさらに詳細に説明するが、 本発明はこれらの鐘例に よりなんら限定されるものではない。  Hereinafter, the present invention will be described in more detail with reference to examples. However, the present invention is not limited to these examples.
製造例 1 (脂環式ォレフィンポリマーの製造) Production Example 1 (Manufacture of alicyclic olefin polymer)
8-カルボキシテトラシクロ [4.4.0. I2'5. I7'10]ドデ力- 3 -ェン 60重量部、 Ν -フエ ニノ ( 5 _ノルボルネン- 2, 3-ジカルボキシィミド) 40重量部、 1, 5-へキサジェン 2. 8重量部、 ( 1, 3 -ジメシチルイミダゾリジン- 2 -イリデン)(トリシク口へキシルホスフィ ン)ベンジリデンルテニゥムジクロリド 0.05重量部及ぴジエチレングリコールェチルメ チルエーテル 400重量部を、 窒素置換した耐圧ガラス反応 に仕込み、 撹拌下に 80°C で 2時間重合 を行って開環メタセシス重合体 1 Aを含有する重合 ®S激夜を得た。 重 合転化率は、 99.9 %以上であった。 この重合体 1 Aの重量平均 量は 3, 200、 数 平均分子量は 1, 900, 量分布は 1.68であつた。 8-carboxytetracyclo [4.4.0. I 2 ' 5. I 7 ' 10 ] Dode force-3 -en 60 parts by weight, Ν-Fuenino (5 _ norbornene-2, 3-dicarboxyimido) 40 parts by weight, 1,5-hexagen 2.8 parts by weight, (1,3-dimesitylimidazolidine-2-ylidene) (tricyclylhexylphosphine) benzylidene ruthenium dichloride 0.05 parts by weight and diethylene glycol 400 parts by weight of tilmethyl ether was charged into a nitrogen-substituted pressure-resistant glass reaction, and polymerized at 80 ° C. for 2 hours with stirring to obtain a polymerization S intense night containing ring-opening metathesis polymer 1A. The polymerization conversion rate was 99.9% or more. This polymer 1A had a weight average weight of 3,200, a number average molecular weight of 1,900 and a weight distribution of 1.68.
次いで、 水素添カロ雌としてビス(トリシク口へキシノレホスフィン)ェトキシメチレンノレ テニゥムジクロリド 0. 1重量部を重合反応溶液に加え、水素を 4MP aの圧力で 5時間溶 存させて、水素添口反応を進行させたのち、活'隨粉末 1重量部を添カロし、 ^"トクレー ブに入れて撹拌しつつ 150。Cで水素を 4 MP aの圧力で 3時間溶存させた。 次レ、で、 溶 液を取り出して孔径 0.2 μπιのフッ素樹脂製フィルターでろ過して活性炭を分離して開 環メタセシス重合体 1 Αの水素化物 1 Bを含有する水素勸ロ 激夜 476重量部を得た。 ろ過は、 滞りなく行うことができた。 ここで得られた水素化物 1Bを含有する水素添ロ反 応^ ί夜の固开分濃度は 20.6重量%であり、 Κ素化物 1 Βの収量は 98. 1重量部であつ た。 得られた水素ィ 1 Βの重量平均分子量は 4, 430、娄女平均分子量は 2, 570、 分 子量分布は 1.72であった。 水素化率は 99.9%であった。  Next, 0.1 part by weight of bis (trisoxyhexoxyrephosphine) ethoxymethylenenorethene dichloride as a hydrogenated caro female was added to the polymerization reaction solution, and hydrogen was dissolved at a pressure of 4 MPa for 5 hours. After proceeding with the inlet reaction, add 1 part by weight of the active powder, and put it in the ^ "clave and stir 150. Hydrogen was dissolved at a pressure of 4 MPa for 3 hours at C. Next The solution was taken out and filtered through a fluororesin filter with a pore size of 0.2 μπι to separate the activated carbon, and the ring-opening metathesis polymer 1 水 素 hydride 1 B containing B Filtration was carried out without any delay The hydrogenated reaction containing hydride 1B obtained here had a concentration of 20.6% by weight of the solid content in the night, and 1 The yield of 98.1 parts by weight of hydrogen was obtained with a weight average molecular weight of 4, 43. The average molecular weight of the maiden was 2,570, and the molecular weight distribution was 1.72. The hydrogenation rate was 99.9%.
得られた水素化物 1 Βの水素勸ロ Si¾灘をロータリ一エバポレータ一で議し、 固形 分濃度を 35重量%に して、 z素化物 1 C (極' 14¾としてカルボキシル基を有する脂環 式ォレフインポリマー)の溶液を得た。 «の前後で収量、水素化物の重量平均分子量、数 平均分子量、 及び^量分布に変化はなかった。 実施例 1 The hydrogen hydride of the resulting hydride 1Β was discussed in a rotary evaporator, and the solid content concentration was 35 wt%, and the z hydride 1 C (an alicyclic ring having a carboxyl group as the pole '14 ¾) was obtained. Solution of olefin polymer). There was no change in yield, weight average molecular weight, number average molecular weight, and weight distribution before and after «. Example 1
製造例 1で得られた水素化物 1 Cを含有する脂環式ォレフインポリマー?辯夜 (固形分 3 5重量0 /0) 1 0 0重量部、架橋剤として脂環 «tを有する多官能エポキシ化合物 [ダイセ ノレィ匕学工業 (株)、 EHP E 3 1 5 0 (製品名)、好 ¾約 2, 7 0 0、エポキシ 1 5] 2 5重量部、 (匕^)として 1 , 1 , 3—トリス(2, 5—ジメチ Λ^4—ヒドロキシフエ- ル) - 3-フエニルプロパン(1モル)と 1, 2 -ナフトキノンジアジド- 5 -スルホン酸ク口ラ イド(2. 5モノレ)との糸宿合物 2 5重量き 15、老ィ匕 Ρ方止斉【』として(1, 2, 2, 6, 6—ペンタメチノレ _ 4ーピペリ、ジノレ/トリデシノレ)一 1, 2 , 3, 4—ブタンテトラカノレポキシレート 5重量眘 接 着助剤として y-グリシドキシプロピルトリメトキシシラン 5重量部及ぴシリコーン系界 面活'随 IJ [蘭匕学工業 (株)、 KP 3 4 1 (製品名)] 0. 0 5重量部を混合し、 さらにジェ チレングリコールェチルメチルエーテル 9 2重量部及び N-メチノ 2 _ピロリドン 8重量 部を添 して昆合撤半した。 混合物は、 5分以内に均一な溶液になった。 この?額夜を 7し径 0. 4 5 z mのポリテトラフルォロエチレ^フィルターでろ過して、 線!"生樹脂糸滅 物 1 Dを調製した。 Alicyclic O reflex in the polymer?辯夜(solid content of 3 5 weight 0/0) 1 0 0 parts by weight containing hydride 1 C obtained in Production Example 1, a multi having an alicyclic «t as a crosslinking agent Functional epoxy compound [Daisenorei Industrial Co., Ltd., EHP E 3 1 5 0 (product name), preferred about 2,700, epoxy 1 5] 2 5 parts by weight, (匕 ^) as 1, 1 , 3-Tris (2,5-Dimethyl Λ ^ 4-Hydroxyphenol) -3-phenylpropane (1 mole) and 1,2-naphthoquinonediazide-5-sulfonic acid chloride (2.5 monolayer) ) And Ishizuku compound 2 5 weight 15, 匕 止 Ρ 方 止 斉 [] as (1, 2, 2, 6, 6-pentamethinore _ 4-piperi, Ginole / Tridecinore) 1, 2, 3, 4-Butanetetracanorepoxylate 5 parts by weight y -glycidoxypropyltrimethoxysilane as an adhesion promoter and silicone-based surface active material IJ [Ranjo Gaku Kogyo Co., Ltd., KP 3 4 1 (Made by Name) 0.0 5 parts by weight were mixed and Kongo 撤半 further added 9 2 parts by Jeffrey Chi glycol E chill methyl ether and N- Mechino 2 _-pyrrolidone 8 parts by weight. The mixture became a homogeneous solution within 5 minutes. Seven days of the forehead were filtered through a polytetrafluoroethylene filter having a diameter of 0.45 zm to prepare a wire!
ガラス謝 [コ一-ング社、 コ一二ング 1 7 3 7 (製品名)] 上に、 スパッタリング装置 を用いて、 クロムを 2 0 0 nmの に形成し、 フォトリソグラフィによりパターニング を行い、 ゲート ¾®、 ゲート信" ^泉及ぴゲート »¾5を形成した。 次いで、 CVD装置に より、 ザ一ト βとゲート酉 ¾镍を覆って、 ゲート絶観莫となるシリコン窒ィ匕物 S莫を 4 5 0 nmの厚さ、 轉体層となる a— S i層を 2 5 O nmの厚さ、 ^"ミックコンタクト層と なる n + S i層を 5 0 nmの厚さで 繊形し、 n + S i層と a— S i層をアイランド状 にパターニングした。 さらに、 ゲート 観莫と n + S i層上にスパックリング装置で、 ク ロムを 2 0 0 nmの麟に形成し、 フォトリソグラフィにより、 ソース 亟、 ソース信号 線、 ドレイン ¾»:ぴデータ »¾を形成し、 ソース肅亟とドレイン 亟の間の不要な n + S i層を除去してバックチャネルを形成し、 ガラス謝上に T F T力 S形成されたアレイ 纖を得た。 On glass glass [Corning, Co., Ltd., 1 7 3 7 (product name)], using a sputtering device, chromium was formed to 200 nm, patterned by photolithography, and gate ¾®, the gate signal "^ Izumi and the gate» ¾5 was formed. Next, the CVD system was used to cover the gate β and the gate ¾ 镍, and the silicon nitride material S A-Si layer of 25 O nm thickness, ^ "n + Si layer of Mick contact layer is 50 nm thick Then, the n + Si layer and the a-Si layer were patterned into island shapes. Furthermore, a gate is formed on the n + Si layer with a sprinkling device, and a chromium layer is formed in a 200 nm ridge, and the source 亟, the source signal line, and the drain are formed by photolithography. Then, an unnecessary n + Si layer between the source electrode and the drain electrode was removed to form a back channel, and an array cell with TFT force S formed on the glass substrate was obtained.
得られたアレイ £Kをホットプレートを備えたシリル化 W¾に A K 処3¾内部を脱 気したのちシリル化剤としてへキサメチノレジシラザンを導入し、 5 0 °Cでへキサメチルジ シラザンの蒸気を処@¾内に均一に拡散させたのち、 ホットプレートによりアレイ簾を The resulting array £ K was silylated with a hot plate. After evacuating the interior of AK treatment 3¾ to H¾, hexamethinoresilazane was introduced as a silylating agent, and hexamethyldisilazane vapor was treated at 50 ° C. After evenly diffusing within @ ¾, array plate is removed with a hot plate.
8 5 °Cに加熱して 1分間シリル化を行つた。 次!/、で、 窒素により処 内のへキサメチル ジシラザンを し、室温まで冷却して、 T F Tのアモルファスシリコン膜の表面を含み、 表面全体がシリル化(トリメチルシリル化)されたァレイ を得た。 The silylation was performed for 1 minute by heating to 85 ° C. Next! /, In-process hexamethyldisilazane with nitrogen, cool to room temperature, and include the amorphous silicon film surface of TFT, An array in which the entire surface was silylated (trimethylsilylated) was obtained.
得られた表面がシリル化されたアレイ雄に、 上記の 線性樹脂糸膽物 1 Dをスピ ンコートしたのち、ホットプレートを用いて 9 0°Cで 2分間プリベータして、膜厚 1 . 2 μ mの樹脂膜を形成した。 この樹脂膜に、 1 0 ^ mX 1 0 mのホールパターンのマスクを 介して、 3 6 5 n mにおける光弓艘が 5 mW/ c m2である紫外線を、 4 0秒間空気中で照 射した。次レ、で、 0. 4重量0 /0テトラメチルァンモニゥムヒドロキシド水灘を用レ、て、 2 5 °Cで 9 0秒間現像処理を行つたのち、愚 ¾Κで 3 0秒間リンスしてコンタクトホールの パターンを形成したところ、歹¾^ 9 0 %以上の良好なパターンが得られた。 さらに、 ォ ープンを用レ、て、 2 3 0 °Cで 1 5分間加熱するポストベータ(架橋処趣を行つた。 After spin coating the above-mentioned linear resin yarn 1D on the surface of the array male with the silylated surface, pre-beta was performed at 90 ° C for 2 minutes using a hot plate to obtain a film thickness of 1.2 μm. m resin films were formed. This resin film was irradiated with ultraviolet rays having a light bow at 3 65 nm of 5 mW / cm 2 in the air for 40 seconds through a mask of a hole pattern of 10 ^ mX 10 m. Tsugire, in, 0.4 weight 0/0 tetramethyl § emissions monitor © beam hydroxide aqueous Nada a Yore Te,, 2 5 ° C 9 0 seconds development processing line Tsutanochi, 3 0 seconds folly ¾Κ When a contact hole pattern was formed by rinsing, a good pattern of more than 90% was obtained. Furthermore, a post-beta (cross-linking treatment was carried out using an open oven and heated at 230 ° C. for 15 minutes.
有樹呆簡莫が形成されたァレイ播及を真鎌に移し、 スパッタガスとしてアルゴンと酸 素の混合ガス 比 1 0 0: 4)を用い、圧力 0. 3 P a、 D C出力 4 0 OWとし、マスク を通して D Cスパッタリングすることにより、 ドレイン爵亟に接するように、 聽2 0 0 nmの I n— S n— O系の非晶質透明導電層 (画素電¾を形成して、 アクティブマトリック ス鎌を得た。  Moved the array formed by Akihito Ariki to Makama and used a mixed gas ratio of argon and oxygen of 100: 4) as the sputtering gas, pressure 0.3 Pa, DC output 4 0 OW Then, DC sputtering through the mask is performed so that the In-Sn-O-based amorphous transparent conductive layer (pixel matrix is formed and active matrix) I got a scythe.
得られたアクティブマトリックス のソース慰亟とドレイン の間に ®£ 2 0 Vを 印加し、 ゲート獻亟に印加する ¾Εを一 2 0〜 3 0 Vに変化させて、 ソース藤とドレイ ン電極の間に流れる電流を、 マ二ュアルプロ一バーと半導体パラメータアナライザ一 (Agilentネ環、 4156C)を用いて測定した。 結果を、 F i g . 4に示す。 リーク電流は I X 1 0— 13A/ c m2であり、 閾値電圧は 4 Vであった。 Apply £ 20 V between the source and the drain of the active matrix obtained and apply it to the gate Change the ¾Ε to 20 to 30 V, and adjust the source and drain electrodes. The current flowing between them was measured using a manual prober and a semiconductor parameter analyzer (Agilent Neringu, 4156C). The results are shown in FIG. Leakage current is IX 1 0- 13 A / cm 2 , the threshold voltage was 4 V.
アクティブマトリックス基板を 5 0°C、 8 0 %RHの雰囲気中に 1 0 0時間放置したの ち、同じ測定を行つた。リーク電流は 1 X 1 0 13AZ C m2であり、閾値 は 4 Vであり、 変化はなかった。 The same measurement was performed after leaving the active matrix substrate in an atmosphere of 50 ° C. and 80% RH for 100 hours. The leakage current was 1 X 10 13 AZ C m 2 , the threshold was 4 V, and there was no change.
鐘列 2 Bell train 2
実施例 1で得られた表面がシリル化されたァレイ凝及に、 感藤線生樹脂繊物 1 Dの 代わりに、 アタリル樹脂灘 [ J S R (株)、 ォプトマ一] をスビンコ一トした以外は、 実 施例 1と同様にしてアクティブマトリックス難を條し、 言鞭を行つた。  The surface obtained in Example 1 was subjected to silylation of the array, except that Atalyl resin [JSR Co., Ltd., Optoma I] was used instead of Sento Senjosei fiber 1D. In the same manner as in Example 1, he made an active matrix difficulty and made a statement.
直後のリーク電流は 3 X 1 0— 13A/ c m2であり、閾値 は 3 Vであった。 5 0°C、 8 0 %RHの雰囲気中に 1 0 08寺間放置後のリーク電流は 1 X 1 (r12A/ c m2であり、閾 ィ直電圧は 2 Vであった。 Immediately after, the leakage current was 3 × 10—13 A / cm 2 and the threshold was 3 V. The leakage current after leaving the temple in an atmosphere at 50 ° C and 80% RH was 1 X 1 (r 12 A / cm 2 , and the threshold direct voltage was 2 V.
雄例 3 «例 1で得られた表面がシリル化されたァレイ鎌に、感觸緣 14樹脂糸城物 1 Dの 代わりに、 ポリイミド樹脂激夜 [^:レ (株)、 フォトニース] をスピンコートした以外は、 雄例 1と同様にしてアクティブマトリックス を し、言 1¾を行った。 Male Example 3 «Except for spin coat coated with polyimide resin intense night [^: Les Co., Ltd., Photo Nice] instead of Senshi 14 Resin Yarn Castle 1 D on the surface silylated surface sickle obtained in Example 1 Performed active matrix in the same manner as male example 1, and made the statement 1¾.
ィ懷直後のリーク電流は 7X10"13A/ c m2であり、閾値 は 3 Vであった。 50 °C、 80 %RHの雰囲気中に 100時間お還後のリーク電流は 3X10"12A/ c m2であり、閾 値電圧は 1.5 Vであった。 Immediately after the leakage current was 7X10 " 13 A / cm 2 and the threshold was 3 V. The leakage current after returning for 100 hours in an atmosphere of 50 ° C and 80% RH was 3X10" 12 A / cm cm 2 and the threshold voltage was 1.5 V.
比較例 1 Comparative Example 1
«例 1で得られたガラス對才上に T FT力 S形成されたアレイ纖を、 シリノレイ匕麵す ることなく、 生樹脂糸滅物 IDをスピンコートする工程に移った以外は、 m 1と同様にしてアクティブマトリックス ¾f反を し、 言? (面を行った。  «M 1 except that the array さ れ with SFT force S formed on the glass substrate obtained in Example 1 was transferred to the process of spin coating the raw resin destruction ID In the same way as the active matrix ¾f, the word? (Done face.
ί懷直後のリーク電流は 2X1 CTUAZ c m2であり、閾値電圧は 2 Vであった。 50。C、 80 %RHの雰囲気中に 100時間放置後のリーク電流は 3X10— 10AZ C m2であり、閾 値 ¾Eは OVであった。 ' 比較例 2 The leakage current immediately after ί 懷 was 2X1 CT U AZ cm 2 and the threshold voltage was 2 V. 50. C, after standing 100 hours in an atmosphere of 80% RH leakage current is 3X10- 10 AZ C m 2, the threshold value ¾E was OV. '' Comparative example 2
実施例 1で得られたガラス勘才上に TFT力 S形成されたアレイ勘反を、 シリルイ匕処理す ることなく、 アクリル樹脂裔夜 [JSR (株)、 ォプトマ一] をスピンコートする工程に移 つた は、 難例 2と同機こしてアクティブマトリックス を條し、 実施例 1と同 様にして評価を行った。  In the process of spin-coating the acrylic resin Sakuya [JSR Corp., Optoma I] without the silylation treatment, the array anti-reflection of the TFT force S formed on the glass intuition obtained in Example 1 was used. In the same manner as in Example 1, the same matrix as in Difficult Example 2 was used to create an active matrix, and evaluation was performed in the same manner as in Example 1.
^直後のリーク が 2X1 C^AZc m2であり、 ァクティブマトリックス とし て作動しなかった。 The leak immediately after was 2X1 C ^ AZc m 2 and did not work as an active matrix.
比較例 3 Comparative Example 3
実施例 1で得られたガラス對才上に T F Tカ形成されたァレイ雄を、 シリル化処理す ることなく、 ポリイミド樹脂激夜 レ (株)、 フォトニース] をスピンコートする工程に 移った以外は、 実施例 3と同様にしてァクディブマトリックス をイ^し、 例 1と 同様にして 面を行った。  Except for the transition to the step of spin-coating the polyimide resin Gakuya Le Co., Ltd., Photo Nice] without silylation treatment of the TFT male formed on the glass substrate obtained in Example 1 In the same manner as in Example 3, the active matrix was applied, and the surface was processed in the same manner as in Example 1.
ィ懷直後のリーク が 5X1 O^A c m2であり、 アクティブマトリックス S¾とし て作動しなかった。 Immediately after the leak, the leak was 5X1 O ^ A cm 2 and did not operate as an active matrix S¾.
■ 実施例 1〜3及び比較ィ列 1〜3の結果を、 第 1表に示す。 第 1表 ■ The results of Examples 1 to 3 and Comparative Columns 1 to 3 are shown in Table 1. Table 1
Figure imgf000022_0001
Figure imgf000022_0001
[注] ◎〜 Xは各実施例と比較例の相対的評価結果を記号で示したものである。  [Notes] A to X show the relative evaluation results of the examples and comparative examples by symbols.
〔◎:優、 〇:良、 △:可、 X:不可〕  [◎: Excellent, ○: Good, △: Acceptable, X: Impossible]
なお、 一は測定不可である.ことを示す。 One indicates that measurement is not possible.
第 1表及び F i g . 4より、ガラス凝才上に T F Τ力 S形成されたァレイ の表面がシリ ル化され、 その上に、 架橋された、 極隨を有する脂環式ォレフインポリマーで有灘護 膜を形成した鍾例 1のアクティブマトリックス擁、 並びに棚保難がアクリル樹脂 及びポリイミド樹月旨である ¾例 2〜 3の各アクティブマトリックス基板は、 高温多湿の 纖下に長時間羅された後でさえ実用的に優れた性能を有していることが分かる。 From Table 1 and Fig. 4, the surface of the array formed with TF repulsive force S on the glass aging is silylated and then crosslinked, and the alicyclic olefin polymer with extreme wrinkles. The active matrix support of Example 1 with a protective film formed on and the shelf protection is acrylic resin and polyimide resin. ¾ Each active matrix substrate of Examples 2-3 is a long time under high temperature and humidity. It can be seen that it has practically superior performance even after being removed.
一方、 アレイ謙の表面のシリル化を行わずに、架橋された、 極醒を有する脂環式ォ レフインポリマーで 保 ¾ϋを形成した比較例 1のアクティブマトリックス基 ¾は、 了 レイ の表面がシリル化された «例 1のァクティブマトリックス と 匕べると性能 が劣ることが分かる。 また、 アレイ纖の表面のシリル化を行わずに、 有隱讓をァク リル樹脂及びポリイミド樹脂で形成した比較例 2〜3の各アクティブマトリックス雜は、 リーク が大きく、 アクティブマトリックス として しないこと力 S分かる。 産業上の利用可能性  On the other hand, the active matrix substrate ¾ of Comparative Example 1 in which the protective layer was formed of a crosslinked, crisp alicyclic olefin polymer without performing silylation of the surface of the array was It can be seen that the performance is inferior when compared with the silylated «Example 1 active matrix. In addition, each active matrix in Comparative Examples 2 and 3 in which the surface was formed of acryl resin and polyimide resin without silylation of the surface of the array was large in leak, and should not be used as an active matrix. S I understand. Industrial applicability
本発明のアクティブマトリックス纖によれば、 リーク が小さく、 また、 ゲート電 極の の増加に対してソース β¾ ドレイン暫亟間の が直線的に立ち上がり、 しか も高温多湿の纖下に長時間 ¾gしても、 力かる †生や閾値 HEがほとんど変化しなレヽの で、長魏、低消費€Λで高コントラストな優れたアクティブマトリックス型平面表示装 置が得られる。 また、本発明のアクティブマトリックス の製 去によれば、 優れた 特性を有するアクティブマトリックス を簡単な操作で効率的に製造することができる。  According to the active matrix of the present invention, the leakage is small, and the source β¾ drain interval rises linearly with respect to the increase of the gate electrode. However, since the power generation and the threshold HE are almost unchanged, an excellent active matrix type flat display device with long length, low consumption, and high contrast can be obtained. Further, according to the production of the active matrix of the present invention, an active matrix having excellent characteristics can be efficiently produced by a simple operation.

Claims

請求の範囲 The scope of the claims
1 · アクティブマトリックス,の製^法であって、 1 · Active matrix manufacturing method,
( a )勘才上に形成された薄膜トランジスタのァモノレファスシリコン膜の表面をシリル化剤 と纖 させて、 該表面をシリノレ化する工程、  (a) a step of bringing the surface of the thin-film transistor silicon film of the thin film transistor formed on the ingenuity with a silylating agent and silinating the surface;
( b )シリル化されたアモルファスシリコン膜の表面の上に感腿綠 [4樹脂糸滅物により樹 脂膜を形成する工程、 及び  (b) Sensitive heel on the surface of silylated amorphous silicon film [4 Step of forming resin film with spoiled resin, and
( c)得られた樹脂膜に活' |¾W線を照射して樹脂膜中に觀象パターンを形成し、 次いで現 像液を擻虫させることにより '纖パターンを顕在化させて、樹脂膜をパターン化する工程、 を有することを樹敷とするアクティブマトリックス の製造方法。  (c) The resulting resin film is irradiated with an active || W line to form an image pattern in the resin film, and then the image solution is wormed to reveal the cocoon pattern to form a resin film. A process for patterning an active matrix.
2. 勘才上に开成さ Lた、 アモルファスシリコン膜を有する薄膜トランジスタを備えてな るアクティブマトリックス であって、 アモルファスシリコン膜の表面がシリル化され ており、 力 シリノレ化されたァモルファスシリコン膜の表面の上に有機保護膜を有するこ とを樹敷とするアクティブマトリックス¾&  2. An active matrix that has a thin film transistor with an amorphous silicon film that has been developed for the sake of ingenuity, and the amorphous silicon film has a silylated surface and is an amorphous silicon film. Active matrix with an organic protective film on the surface
3. シリル化が、 トリメチノレシリル化である請求の範囲 2記載のアクティブマトリックス  3. The active matrix according to claim 2, wherein the silylation is trimethinoresilylation.
4. ^保護膜が、 架橋された、 極 14¾を有する脂環式ォレフインポリマーからなる膜で ある請求の範囲 2又は 3記載のァクティブマトリックス¾& 4. The active matrix according to claim 2 or 3, wherein the protective film is a cross-linked film made of a cycloaliphatic polyolefin polymer having a pole of 14¾.
5 . シリノレ化剤が、 へキサメチルジシラザンである請求の範囲 1記載のァクティブマトリ ックス の製造方?去。  5. The method for producing an active matrix according to claim 1, wherein the silinoleating agent is hexamethyldisilazane.
6. 生榭月旨組成物が、 極性基を有する脂環式才レフインポリマー、 架橋剤、 感放 射線化合物、 及ぴ赚 I」を含有してなるものである請求の範囲 1又は 5記載のアクティブマ トリックス¾¾の製^去。  6. The composition according to claim 1 or 5, wherein the composition of ginger moonlight contains an alicyclic levine polymer having a polar group, a cross-linking agent, a radiation-sensitive compound, and 及 I. Made Active Matrix ¾¾.
7. '請求の範囲 2〜 4の!/、ずれかに記載のァクティブマトリックス¾¾を備えてなること を糚敫とする平面表示装 go  7. 'Furthermore, claims 2 to 4! /, A flat display device that is provided with an active matrix ¾¾ as described in a deviation.
PCT/JP2007/067092 2006-08-30 2007-08-27 Active matrix substrate and method for manufacturing the same WO2008026750A1 (en)

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Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011077450A (en) * 2009-10-01 2011-04-14 Fujifilm Corp Thin film transistor and method of manufacturing thin film transistor
JP2012114313A (en) * 2010-11-26 2012-06-14 Nippon Zeon Co Ltd Semiconductor element substrate
JP2021028926A (en) * 2019-08-09 2021-02-25 住友ベークライト株式会社 Method for manufacturing electronic device

Citations (2)

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Publication number Priority date Publication date Assignee Title
JPH1048607A (en) * 1996-08-02 1998-02-20 Sharp Corp Substrate for display element and its production as well as apparatus for production therefor
JP2004303770A (en) * 2003-03-28 2004-10-28 Nippon Zeon Co Ltd Process for forming organic insulating film, organic insulating film, and display

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH1048607A (en) * 1996-08-02 1998-02-20 Sharp Corp Substrate for display element and its production as well as apparatus for production therefor
JP2004303770A (en) * 2003-03-28 2004-10-28 Nippon Zeon Co Ltd Process for forming organic insulating film, organic insulating film, and display

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011077450A (en) * 2009-10-01 2011-04-14 Fujifilm Corp Thin film transistor and method of manufacturing thin film transistor
JP2012114313A (en) * 2010-11-26 2012-06-14 Nippon Zeon Co Ltd Semiconductor element substrate
JP2021028926A (en) * 2019-08-09 2021-02-25 住友ベークライト株式会社 Method for manufacturing electronic device
JP7322580B2 (en) 2019-08-09 2023-08-08 住友ベークライト株式会社 Electronic device manufacturing method

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