WO2008025919A3 - Procédé de marquage d'une plaque semi-conductrice pour son identification et plaque semi-conductrice marquée par ce procédé - Google Patents

Procédé de marquage d'une plaque semi-conductrice pour son identification et plaque semi-conductrice marquée par ce procédé Download PDF

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Publication number
WO2008025919A3
WO2008025919A3 PCT/FR2007/051811 FR2007051811W WO2008025919A3 WO 2008025919 A3 WO2008025919 A3 WO 2008025919A3 FR 2007051811 W FR2007051811 W FR 2007051811W WO 2008025919 A3 WO2008025919 A3 WO 2008025919A3
Authority
WO
WIPO (PCT)
Prior art keywords
semi
plate
marking
conductor plate
identification
Prior art date
Application number
PCT/FR2007/051811
Other languages
English (en)
Other versions
WO2008025919A2 (fr
Inventor
Dominique Bocquene
Pierre Tauzinat
Original Assignee
Microcomposants De Haute Secur
Dominique Bocquene
Pierre Tauzinat
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Microcomposants De Haute Secur, Dominique Bocquene, Pierre Tauzinat filed Critical Microcomposants De Haute Secur
Publication of WO2008025919A2 publication Critical patent/WO2008025919A2/fr
Publication of WO2008025919A3 publication Critical patent/WO2008025919A3/fr

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/544—Marks applied to semiconductor devices or parts, e.g. registration marks, alignment structures, wafer maps
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41M—PRINTING, DUPLICATING, MARKING, OR COPYING PROCESSES; COLOUR PRINTING
    • B41M5/00—Duplicating or marking methods; Sheet materials for use therein
    • B41M5/26—Thermography ; Marking by high energetic means, e.g. laser otherwise than by burning, and characterised by the material used
    • B41M5/262—Thermography ; Marking by high energetic means, e.g. laser otherwise than by burning, and characterised by the material used recording or marking of inorganic surfaces or materials, e.g. glass, metal, or ceramics
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67282—Marking devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67294—Apparatus for monitoring, sorting or marking using identification means, e.g. labels on substrates or labels on containers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2223/00—Details relating to semiconductor or other solid state devices covered by the group H01L23/00
    • H01L2223/544—Marks applied to semiconductor devices or parts
    • H01L2223/54406—Marks applied to semiconductor devices or parts comprising alphanumeric information
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2223/00—Details relating to semiconductor or other solid state devices covered by the group H01L23/00
    • H01L2223/544—Marks applied to semiconductor devices or parts
    • H01L2223/54433—Marks applied to semiconductor devices or parts containing identification or tracking information
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2223/00—Details relating to semiconductor or other solid state devices covered by the group H01L23/00
    • H01L2223/544—Marks applied to semiconductor devices or parts
    • H01L2223/54453—Marks applied to semiconductor devices or parts for use prior to dicing
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2223/00—Details relating to semiconductor or other solid state devices covered by the group H01L23/00
    • H01L2223/544—Marks applied to semiconductor devices or parts
    • H01L2223/54493—Peripheral marks on wafers, e.g. orientation flats, notches, lot number
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Ceramic Engineering (AREA)
  • Optics & Photonics (AREA)
  • Laser Beam Printer (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Thermal Transfer Or Thermal Recording In General (AREA)

Abstract

L'invention concerne un procédé de marquage d'une plaque (1) en matériau semi-conducteur pour son identification. Dans ce procédé, on focalise le faisceau (3) d'un laser (2) dans le volume de la plaque (1) sur des points de ce volume. Cette focalisation est réalisée de manière à modifier localement, à l'endroit des points (4), les propriétés optiques du matériau de la plaque (1). L'ensemble des points (4) du volume de la plaque (1) dont les propriétés optiques ont été modifiées est positionné à l'intérieur d'une zone (8) de marquage et définit un code qui identifie la plaque (1). L'invention a pour but de minimiser la pollution lors du marquage de la plaque et celle induite postérieurement lors de la fabrication à partir de ce substrat (1).
PCT/FR2007/051811 2006-08-31 2007-08-10 Procédé de marquage d'une plaque semi-conductrice pour son identification et plaque semi-conductrice marquée par ce procédé WO2008025919A2 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
FR0653547A FR2905521A1 (fr) 2006-08-31 2006-08-31 Procede de marquage d'une plaque semi-conductrice pour son identification et plaque semi-conductrice marquee par ce procede
FR0653547 2006-08-31

Publications (2)

Publication Number Publication Date
WO2008025919A2 WO2008025919A2 (fr) 2008-03-06
WO2008025919A3 true WO2008025919A3 (fr) 2008-05-02

Family

ID=37686495

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/FR2007/051811 WO2008025919A2 (fr) 2006-08-31 2007-08-10 Procédé de marquage d'une plaque semi-conductrice pour son identification et plaque semi-conductrice marquée par ce procédé

Country Status (2)

Country Link
FR (1) FR2905521A1 (fr)
WO (1) WO2008025919A2 (fr)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
ITBO20100620A1 (it) * 2010-10-15 2012-04-16 Marchesini Group Spa Apparato idoneo per operare in un ambiente dove vengono manipolati prodotti farmaceutici o cosmetici ed uso di un componente provvisto di scritte e/o loghi e/o segni in un ambiente dove vengono manipolati prodotti farmaceutici o cosmetici
CN108630563B (zh) * 2017-03-17 2020-11-03 中芯国际集成电路制造(上海)有限公司 晶圆识别码的监测方法以及监测结构
EP3712717A1 (fr) * 2019-03-19 2020-09-23 Comadur S.A. Methode pour marquer une glace de montre en saphir

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11214299A (ja) * 1998-01-27 1999-08-06 Komatsu Ltd ドットマークの読み取り装置と読み取り方法
EP1073097A2 (fr) * 1999-07-26 2001-01-31 Komatsu Ltd Dispositif de lecture de marque en forme de point et procédé de lecture
EP1117129A2 (fr) * 2000-01-12 2001-07-18 Tokyo Seimitsu Co.,Ltd. Appareil d'inspection des plaquettes de semi-conducteurs
US20030003608A1 (en) * 2001-03-21 2003-01-02 Tsunetoshi Arikado Semiconductor wafer with ID mark, equipment for and method of manufacturing semiconductor device from them
EP1300872A1 (fr) * 2001-10-08 2003-04-09 Infineon Technologies SC300 GmbH & Co. KG Dispositif d' identification de dispositifs à semi-conducteur
WO2003033199A1 (fr) * 2001-10-19 2003-04-24 U.C. Laser Ltd. Procede d'amelioration de l'alignement de tranches
US20040089958A1 (en) * 2002-11-08 2004-05-13 Kazuhisa Arai Conductor wafer and substrate
US20060065985A1 (en) * 2004-09-30 2006-03-30 Berman Michael J Substrate edge scribe

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11214299A (ja) * 1998-01-27 1999-08-06 Komatsu Ltd ドットマークの読み取り装置と読み取り方法
EP1073097A2 (fr) * 1999-07-26 2001-01-31 Komatsu Ltd Dispositif de lecture de marque en forme de point et procédé de lecture
EP1117129A2 (fr) * 2000-01-12 2001-07-18 Tokyo Seimitsu Co.,Ltd. Appareil d'inspection des plaquettes de semi-conducteurs
US20030003608A1 (en) * 2001-03-21 2003-01-02 Tsunetoshi Arikado Semiconductor wafer with ID mark, equipment for and method of manufacturing semiconductor device from them
EP1300872A1 (fr) * 2001-10-08 2003-04-09 Infineon Technologies SC300 GmbH & Co. KG Dispositif d' identification de dispositifs à semi-conducteur
WO2003033199A1 (fr) * 2001-10-19 2003-04-24 U.C. Laser Ltd. Procede d'amelioration de l'alignement de tranches
US20040089958A1 (en) * 2002-11-08 2004-05-13 Kazuhisa Arai Conductor wafer and substrate
US20060065985A1 (en) * 2004-09-30 2006-03-30 Berman Michael J Substrate edge scribe

Also Published As

Publication number Publication date
FR2905521A1 (fr) 2008-03-07
WO2008025919A2 (fr) 2008-03-06

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