WO2008023440A1 - Élément optique doté d'un film de protection contre un laser, et son procédé de fabrication - Google Patents

Élément optique doté d'un film de protection contre un laser, et son procédé de fabrication Download PDF

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Publication number
WO2008023440A1
WO2008023440A1 PCT/JP2006/316762 JP2006316762W WO2008023440A1 WO 2008023440 A1 WO2008023440 A1 WO 2008023440A1 JP 2006316762 W JP2006316762 W JP 2006316762W WO 2008023440 A1 WO2008023440 A1 WO 2008023440A1
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WIPO (PCT)
Prior art keywords
optical element
film
substrate
oxygen
layer
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PCT/JP2006/316762
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English (en)
Japanese (ja)
Inventor
Yasuaki Inoue
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Nalux Co., Ltd.
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Publication date
Application filed by Nalux Co., Ltd. filed Critical Nalux Co., Ltd.
Priority to PCT/JP2006/316762 priority Critical patent/WO2008023440A1/fr
Priority to JP2007551888A priority patent/JP4178190B2/ja
Priority to PCT/JP2007/066483 priority patent/WO2008023802A1/fr
Publication of WO2008023440A1 publication Critical patent/WO2008023440A1/fr
Priority to US12/379,519 priority patent/US8263172B2/en

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    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B1/00—Optical elements characterised by the material of which they are made; Optical coatings for optical elements
    • G02B1/10—Optical coatings produced by application to, or surface treatment of, optical elements
    • G02B1/11—Anti-reflection coatings
    • G02B1/113—Anti-reflection coatings using inorganic layer materials only
    • G02B1/115—Multilayers
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
    • C23C14/08—Oxides
    • C23C14/083—Oxides of refractory metals or yttrium
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/24—Vacuum evaporation
    • C23C14/32—Vacuum evaporation by explosion; by evaporation and subsequent ionisation of the vapours, e.g. ion-plating

Definitions

  • the present invention relates to an optical element including a damage suppression film on a substrate made of a blue laser-compatible plastic material and a method for manufacturing the same.
  • the present invention relates to an optical element having a laser damage suppression film used for a blue laser having a short wavelength and a pi power (30 mWZm 2 or more) and a method for manufacturing the same.
  • plastic materials that can handle a relatively low-power blue laser have the power of each material manufacturer. There is no plastic material that can withstand a high-power blue laser.
  • an antireflection film is often formed on the surface of a plastic lens used in a video camera, a still camera, glasses, or the like.
  • Such an antireflection film is formed of a multilayer film in which low refractive index layers and high refractive index layers are alternately laminated.
  • Such multilayer films are disclosed in JP-A-11-30703, JP-A-11-171596, JP-A-11 326634, JP-A-2002-71903, JP-A-2003-98308 and JP-A-2003-.
  • the method of manufacturing an optical element according to the present invention includes a layer made of a low-refractive material and a high-refractive material on a plastic substrate while plasma is generated by a high-frequency power source in accordance with an ion plating method.
  • This is a method of manufacturing an optical element including a multilayer film in which layers that also have force are alternately laminated.
  • the manufacturing conditions including atmospheric gas pressure when laminating layers made of highly refractive materials are set so that the oxidative transmission coefficient of the optical element to be manufactured is 30 cm 3 mm / (m 2 24 hr atm) or less. It is characterized by having decided.
  • the optical element manufactured by the method according to the present invention has a small oxygen transmission coefficient, and thus is not easily damaged by blue laser irradiation.
  • FIG. 1 is a diagram showing a configuration of an optical element provided with a laser damage suppressing film according to one embodiment of the present invention.
  • FIG. 2 is a diagram showing a result of measuring a change in light transmittance of an optical element after irradiating the optical element with a blue laser for 1000 hours.
  • FIG. 3 is a diagram showing the result of measuring the total wavefront aberration (RMS) of the optical element before and after irradiating the optical element with a blue laser for 1000 hours.
  • RMS total wavefront aberration
  • FIG. 4 is a diagram showing a configuration of an ion plating apparatus for performing an ion plating method.
  • FIG. 5 is a diagram showing the amount of change in light transmittance of an optical element in which a conventional film is formed on a conventional substrate and an optical element in which improvement films 1 and 2 are formed on a conventional substrate.
  • FIG. 6 is a diagram showing oxygen transmission coefficients of an optical element in which a conventional film is formed on a conventional substrate and an optical element in which improvement films 1 and 2 are formed on a conventional substrate.
  • FIG. 7 A diagram showing the change in the amount of chemiluminescence after irradiation with a blue laser on an optical element in which a conventional film is formed on a conventional substrate and an optical element in which an improvement film 1 is formed on a conventional substrate, and then stopped. is there.
  • FIG. 8 is an enlarged view of a part of the time axis in FIG.
  • FIG. 9 is a view showing a change in light transmittance between a conventional substrate and a nitrogen molded substrate.
  • FIG. 10 is a graph showing the amount of fluorescence emitted from a conventional substrate and a nitrogen-molded substrate at a wavelength of about 320 nm when excited at a wavelength of 280 nm.
  • FIG. 11 is a diagram showing a change in light transmittance between an optical element in which the improvement film 1 is formed on a conventional substrate and an optical element in which the improvement film 1 is formed on a nitrogen-molded substrate.
  • FIG. 12 is a flowchart showing a method for obtaining conditions for manufacturing an optical element having a small oxygen transmission coefficient by changing manufacturing conditions.
  • FIG. 13 is a diagram showing a change in oxygen transmission coefficient of an optical element when the output of a high-frequency power source is changed.
  • FIG. 14 is a diagram showing a change in oxygen transmission coefficient of an optical element when an oxygen pressure value during film formation of a highly refractive material is changed.
  • FIG. 15 is a diagram showing a change in the oxygen transmission coefficient of the optical element when the argon pressure value during film formation of the low refractive index material is changed.
  • FIG. 1 is a diagram showing a configuration of an optical element provided with a laser damage suppressing film according to one embodiment of the present invention.
  • a layer 103 made of monoacidic silicon (SiO) is formed on a substrate 101 that also has a plastic material strength for blue laser.
  • the layer 103 made of silicon monoxide fulfills a function of improving the adhesion between the substrate 101 having plastic material strength and the layer formed thereon.
  • layers 105 made of a low refractive material and layers 107 made of a high refractive material cover are alternately laminated. In this embodiment, three layers 105 made of a low refractive material cover and three layers 107 made of a high refractive material cover are formed.
  • the blue laser compatible plastic material is an olefin-based material. More specifically, it is a thermoplastic transparent olefin cycloolefin polymer having a function of preventing acidification.
  • the layer 103 made of silicon monoxide is formed on the substrate 101 by a vacuum deposition method.
  • the material to be thinned in this case, silicon monoxide
  • the material to be thinned is heated with a resistance wire.
  • the material is irradiated with an electron beam and evaporated by heating.
  • the evaporated material is deposited (deposited) on the substrate to form a thin film.
  • the thickness of the layer 103 made of silicon monoxide is about several hundred nanometers.
  • the low refractive index material is silicon dioxide (SiO 2) in the present embodiment. From silicon dioxide
  • the refractive index of the layer 105 is 1.4-1.5.
  • the layer 105 which is also composed of diacid oxide, is formed by vacuum evaporation.
  • the thickness of the layer 105, which is also a diacid key, is several tens to several hundreds of nanometers.
  • Aluminum fluoride (A1F magnesium fluoride (MgF diacid)
  • Oxidized silicon oxide (SiO 2) can also be used.
  • the high refractive index material is composed of tantalum pentoxide (Ta 2 O 3) and titanium dioxide (TiO 2).
  • the refractive index of the layer 107 which mainly consists of tantalum pentoxide, is 2.0-2.3.
  • the layer 107 mainly composed of tantalum pentoxide force is formed by an ion plating method.
  • the ion plating method uses gas plasma to ionize a part of evaporated particles and deposit it on a substrate biased at a negative high voltage. Since the vapor deposition material is accelerated by the electric field and adheres to the substrate, a film having a strong adhesion can be obtained.
  • the thickness of the layer 107 mainly composed of tantalum pentoxide is several tens to several hundreds of nanometers.
  • the material of the layer 107 a material in which the values of x and y of TaO are appropriately determined (tantalum oxide-based material) can be used.
  • an acid titanium-based material can be used as the high refractive index material.
  • the multilayer film may have an antireflection function in addition to the laser damage suppressing function.
  • FIG. 4 is a diagram illustrating a configuration of an ion plating apparatus for performing the ion plating method.
  • An ion plating apparatus is disclosed in, for example, Japanese Patent Publication No. 1-48347.
  • a substrate member made up of a conductive member supporting the substrate 408 is provided in the vacuum chamber 412.
  • a capacitor 406 is configured by the rudder 407 and a support member such as a conductive member that supports the base material holder via an insulating member.
  • a high frequency power supply 401 is connected between the vacuum chamber 412 and the substrate holder 407 via a blocking capacitor 403 and a matching box 402 to supply a high frequency voltage.
  • a DC power supply 404 is connected between the vacuum chamber 412 and the substrate holder 407 via a choke coil 405 so that the substrate holder 407 side becomes a cathode, and a DC noise voltage is supplied.
  • the output of the high frequency power supply 401 is 500 W
  • the voltage of the DC power supply 404 is 100V.
  • the output of the high frequency power supply 401 is preferably a power S of 300-900W. By adjusting the output value within this range, the denseness of the film can be increased.
  • Capacitor 406 force By operating together with a matching box 402 connected to a high-frequency power source 401 that supplies a high-frequency voltage into the chamber 412 to perform matching
  • a stable electric field can be formed and maintained between the evaporation material 409 and the substrate 408 on the resistance heating board 410. As a result, a high-purity 'high density' and high adhesion thin film can be formed on the surface of the substrate 408.
  • the bottom of the crucible including the resistance heating board 410 has an electron gun 4 for electron beam heating.
  • No plasma generation refers to the case where the high frequency power supply 401 and the DC power supply 404 are not used. In this case, the film is formed by a vacuum deposition method.
  • RH resistance heating
  • EB electron beam heating
  • an atmospheric gas such as oxygen or argon is introduced into the vacuum chamber 412 by a valve (not shown).
  • the oxygen introduction pressure setting is a setting of the oxygen pressure in the chamber.
  • Oxygen partial pressure is preferably in the range of 3.0X10- 3 ⁇ 5.0X10- 2 Pa.
  • Plasma is generated in the vacuum chamber 412 by the high frequency voltage supplied from the high frequency power supply 401.
  • the vaporized material particles pass through the plasma, it becomes ionized. Since the particles in the ionized state receive plasma assist and vigorously collide with the base material 408 and deposit, a highly dense film is formed.
  • the gas pressure of the atmospheric gas affects the generation of plasma, and there is a gas pressure that ionizes the gas and efficiently generates plasma.
  • Ion plating method Ion plating method Vacuum deposition method
  • Comparative Example 3 an optical element including a blue laser compatible plasticizer having no surface coated at all was also prepared.
  • FIG. 2 is a diagram showing the results of measuring the amount of change in light transmittance of the optical element after irradiating the optical element with a blue laser for 1000 hours at an ambient temperature of 25 ° C.
  • E energy density of the blue laser radiation is about 120mWZmm 2.
  • the amount of change in light transmittance of the optical element is
  • the amount of change in light transmittance is 90% if the transmittance before irradiation is 90% and the transmittance after irradiation is 80%, the amount of change in light transmittance is 90%.
  • FIG. 2B shows the measurement result of the change in light transmittance of the optical element of the present embodiment.
  • a in FIG. 2 shows the measurement result of the light transmittance change amount of Comparative Example 1.
  • C in FIG. 2 shows the measurement result of the light transmittance change amount of Comparative Example 2.
  • D in FIG. 2 shows the measurement result of the change in light transmittance of the optical element of Comparative Example 3.
  • the optical element of Comparative Example 3 was irradiated with a blue laser in a nitrogen atmosphere.
  • FIG. 3 is a diagram showing the result of measuring the total wavefront aberration (RMS) of the optical element before and after irradiating the optical element with a blue laser for 1000 hours at an ambient temperature of 25 ° C.
  • the energy density of the blue laser radiation is about 120mWZmm 2.
  • the total wavefront aberration is a deviation of the wavefront from the reference spherical surface expressed as a standard deviation.
  • the reference spherical surface refers to a spherical surface that takes the principal ray as the center and intersects the optical axis at the center of the entrance and exit pupils.
  • the total wavefront aberration is measured by generating an interference fringe with an interferometer. Map force of fringes Calculates wavefront aberration.
  • ⁇ 1 and ⁇ 2 in FIG. 3 show the measurement results of the total wavefront aberration of the optical element of the present embodiment.
  • ⁇ 1 and ⁇ 2 in Fig. 3 show the measurement results of total wavefront aberration in Comparative Example 1.
  • C1′C2 in FIG. 3 shows the measurement result of the total wavefront aberration of Comparative Example 2.
  • D1 'D2 in Fig. 3 shows the measurement result of the total wavefront aberration of the optical element of Comparative Example 3.
  • the optical element of Comparative Example 3 was irradiated with a blue laser in a nitrogen atmosphere.
  • Al, Bl, Cl, and D1 show the measurement results of total wavefront aberration before blue laser irradiation
  • A2, B2, C2, and D2 show the measurement results of total wavefront aberration after blue laser irradiation.
  • the light transmittance change amount is about -10% in Comparative Example 1 (A in Fig. 2), about -20% in Comparative Example 2 (C in Fig. 2), and in Comparative Example 3 (Fig. 2). D) About-5% decrease.
  • Comparative Example 2 where the ion plating method is not used to form the high refractive index material layer (C in Fig. 2) the light transmittance of the optical element is greatly reduced.
  • the reason why the light transmittance of the optical element decreases is that, when high-power blue laser is irradiated for a long time, the chemical bond of the polymer plastic is broken (damaged) and the bonding state changes. Conceivable. If the ion plating method is used for forming the high refractive index material layer, the above damage can be suppressed.
  • the total wavefront aberration after irradiation with the high-power blue laser is about 2.5 times in the case of Comparative Example 1 ( ⁇ 1 ⁇ ⁇ 2 in Fig. 3) using PMMA plastics for the substrate.
  • Comparative Examples 2 and 3 the total wavefront aberration after irradiating the same blue laser is almost unchanged. Therefore, in the case of an optical element using a blue laser compatible plastic, it is considered that the shape of the optical element surface hardly changes.
  • ⁇ In the case of an optical element using MA plastic, the total wavefront aberration is considered to increase because the shape of the optical element surface changes.
  • the film is formed by the ion plating method! /, And the plasma state is generated by the 1S plasma CVD method, the ion beam assisted vapor deposition method, the sputtering method, or the like. Do film formation.
  • the present invention is characterized in that a film is formed on a blue laser plastic material substrate by a method of generating plasma such as an ion plating method.
  • a substrate that is a thermoplastic transparent olefin cycloolefin polymer having an antioxidant function as a catalytic action that creates a function having an oxidative decomposition ability from moisture and oxygen, and by an ion plating method It is thought to be suppressed by improving the film density by forming a film (forming an oxygen-impermeable film). Therefore, it can be estimated that substrate damage due to blue laser light is suppressed. The grounds for this estimation are also expected from the measurement results of the change in light transmittance when a laser irradiation experiment was performed in a nitrogen atmosphere (D in Fig. 2). Further, it is considered that the denseness of the film is further improved in the film formation by the ion plating method by using the tantalum oxide-based material.
  • a multilayer film formed by the following film forming method will be described.
  • a multilayer film formed by this film forming method is referred to as an improvement film 1.
  • the film forming method shown in Table 3 is different from the film forming method shown in Table 1 in that a low refractive material layer having a diacid-like key force is formed while generating a plasma state in an argon atmosphere.
  • Argon partial pressure value is 3.0 X 10 _3 ⁇ 5.0 X 10- 2 Pa and even preferably les within the scope of the time of forming the low refractive index material layer.
  • a low refractive material layer is formed while generating a plasma state in an argon atmosphere, the substrate is exposed to a high temperature environment (e.g. 85 ° C) or a high temperature and high humidity environment (e.g. 60 ° C 90%) for a long time. In any case, this is more advantageous than an oxygen plasma atmosphere in which there is almost no change in transmittance.
  • the output of the high frequency power source for generating plasma is 500W.
  • the DC voltage is 300V.
  • the characteristic of the optical element is specifically an oxygen transmission coefficient.
  • the reason for paying attention to the oxygen transmission coefficient is that, as will be described later, when the oxygen transmission coefficient of the optical element is low, the amount of change in the light transmission of the optical element is small.
  • gas permeability coefficient can be expressed by the following equation.
  • Gas permeation coefficient gas permeation amount (standard state volume) x thickness
  • the unit of the oxygen transmission coefficient is cm 3 'mmZ (m 2 ⁇ 24hr ⁇ atm).
  • FIG. 12 is a flowchart showing a method for obtaining conditions for producing an optical element having a small oxygen transmission coefficient by changing the production conditions.
  • step S010 of Fig. 12 initial values of manufacturing conditions are determined.
  • step S020 of FIG. 12 the optical element is manufactured according to the manufacturing conditions.
  • step S030 of FIG. 12 the oxygen transmission coefficient of the manufactured optical element is measured.
  • step S040 of FIG. 12 the force with which the necessary data has been collected is determined. If necessary data has been collected, exit. If the necessary data has not been collected, go to step S050.
  • step S050 of FIG. 12 the manufacturing conditions are changed.
  • FIG. 13 is a diagram showing a change in the oxygen transmission coefficient of the optical element when the output of the high-frequency power source is changed.
  • Table 3 shows the manufacturing conditions such as the argon pressure value when depositing a low refractive index material and the oxygen pressure value when depositing a highly refractive material.
  • the oxygen permeability coefficient of the manufactured optical element varies greatly depending on the output of the high-frequency power source at the time of manufacture, and the oxygen permeability coefficient is minimized when the 500 W power is 600 W.
  • the pressure value by introducing oxygen instead of argon when forming a low refractive material as a 6x10 _ 3 Pa in the case of changing the output of the high frequency power source, a change in the oxygen permeability coefficient of the optical element Observe that the oxygen permeability coefficient monotonously decreases as the output of the high-frequency power supply increases.
  • the oxygen permeability coefficient is about 110 cm 3 ⁇ ⁇ mZ (m 2 ⁇ 24 hr ⁇ atm) when the output of the high-frequency power source is OW, and 40 cm 3 ⁇ mm / (m 2 ⁇ 24 hr ⁇ atm) when the output is 800 W.
  • FIG. 14 is a diagram showing a change in the oxygen transmission coefficient of the optical element when the oxygen pressure value when the highly refractive material is deposited is changed.
  • Table 3 shows the argon pressure values when depositing low refractive index materials.
  • the output of the high frequency power supply is 500W.
  • the oxygen transmission coefficient of the optical element varies greatly depending on the oxygen pressure value when depositing a highly refractive material, and if it is 3 xlO _2 Pa or less, the force is 20 cm 3 'mm / (m 2 ' 24 hr'atm) or less. "It increases rapidly when it exceeds 2 Pa.
  • 6x10 _ 3 Pa pressure value by introducing oxygen instead of argon when forming a low refractive material, the output of the high frequency power source, a 500 W, an oxygen pressure for depositing the high-refractive material
  • the oxygen permeability coefficient of the optical element varies greatly depending on the oxygen pressure value when the highly refractive material is deposited, and is 30 cm 3 mm / (m 2 ⁇ 24hr ⁇ atm) or less is the oxygen pressure when depositing highly refractive materials
  • the value is 1.5xlO _2 Pa or less.
  • FIG. 15 is a diagram showing a change in the oxygen transmission coefficient of the optical element when the argon pressure value when the low refractive index material is formed is changed.
  • Table 3 shows the oxygen pressure values when depositing highly refractive materials.
  • the output of the high frequency power supply is 500W.
  • Oxygen permeability coefficient of the optical element is largely changed by the argon pressure values during the formation of the low ⁇ material, the oxygen permeability coefficient is minimized when the 5xlO _3 Pa of 7xlO _3 Pa.
  • the oxygen pressure value in forming a high refractive material 3xlO _2 Pa the output of the high frequency power source, a 500 W, oxygen was introduced in place of argon when forming a low refractive material oxygen pressure
  • the oxygen permeability coefficient increases monotonically as the oxygen pressure value increases.
  • the oxygen permeability coefficient is about 60 «11 3 '1111117 (111 2 ' 24111: '&1; 111) when the oxygen pressure value is 10 _ ⁇ &, and about 80cm 3 ⁇ when the oxygen pressure value is lxlO _2 Pa mm / (m 2 ⁇ 24hr ⁇ atm).
  • the output of the high frequency power source is a 600W from 500 W, oxygen pressure value when you depositing a high refractive material is not more than 3xlO _2 Pa, when forming the low ⁇ material introducing argon gas as the atmosphere gas, when argon pressure values force 5xlO _3 Pa is 7xlO _3 Pa, small optical elements of oxygen permeability coefficient is produced.
  • the reason for this is that under the above conditions, the particle force of the film-forming material is turned on, plasma is generated optimally for deposition and film formation, and a dense film that hardly transmits oxygen is formed. it is conceivable that.
  • the conditions in Table 3 match the above conditions.
  • the above conditions are merely numerical values in the present embodiment and are merely! /.
  • the method shown in FIG. 12 is used to change the output of a high-frequency power source, the atmospheric gas pressure value when depositing a high refractive material, and the atmospheric gas pressure value when depositing a low refractive index material.
  • the conditions for manufacturing an optical element having a small oxygen transmission coefficient can be obtained.
  • a multilayer film formed by the following film forming method will be described.
  • a multilayer film formed by this film forming method is referred to as an improvement film 2.
  • the improvement film 2 does not include an adhesion layer made of silicon monoxide, and has a layer made of tantalum oxide material as the first layer on the substrate.
  • the total film thickness of the improvement film 1 is 547.5 nm, while the total film thickness of the improvement film 2 is 182. Onm.
  • a diffractive optical element having a fine structure formed on the surface if the film thickness is thick, the influence on the shape of the fine structure increases.
  • the improvement film 2 has a small film thickness and thus has little influence on the shape of the microstructure.
  • the output of the high-frequency power source for generating plasma is 500W.
  • the DC voltage is 300V.
  • a multilayer film having a structure similar to that of the improvement film 1 formed by a vacuum deposition method that does not generate plasma is referred to as a conventional film.
  • a substrate made of a thermoplastic transparent olefin cycloolefin polymer, which is not a nitrogen molded substrate described later, is referred to as a conventional substrate.
  • FIG. 5 is a diagram showing the light transmittance change amount of the optical element in which the conventional film is formed on the conventional substrate and the optical element in which the improvement films 1 and 2 are formed on the conventional substrate.
  • the optical transmittance change amount of the optical element formed with the improvement films 1 and 2 is greatly improved compared to the optical transmittance change amount of the optical element formed with the conventional film.
  • FIG. 6 is a diagram showing oxygen transmission coefficients of an optical element in which a conventional film is formed on a conventional substrate and an optical element in which improvement films 1 and 2 are formed on a conventional substrate.
  • the oxygen transmission coefficient of the optical element in which the improved films 1 and 2 are formed on the conventional substrate is lower than the oxygen transmission coefficient of the optical element in which the conventional film is formed on the conventional substrate.
  • An optical element in which the improvement films 1 and 2 are formed on the substrate is difficult to transmit oxygen.
  • the optical element is irradiated with a blue laser, it is assumed that the deterioration of the substrate material is accelerated by a chemical reaction mediated by oxygen, and the amount of change in light transmittance is increased. This assumption is consistent with the fact that in FIG. 2, when the uncoated optical element of Comparative Example 3 is placed in a nitrogen atmosphere, the decrease in light transmittance is relatively small.
  • FIG. 7 shows the change in the amount of chemiluminescence after the blue laser was irradiated to the optical element in which the conventional film was formed on the conventional substrate and the optical element in which the improvement film 1 was formed on the conventional substrate.
  • FIG. FIG. 8 is an enlarged view of a part of the time axis of FIG. In FIGS. 7 and 8, the amount of chemiluminescence shows the relative magnitude. For up to 20 seconds after the irradiation is stopped, the chemiluminescence amount of the optical element in which the conventional film is formed on the conventional substrate is larger than the chemiluminescence amount of the optical element in which the improvement film 1 is formed on the conventional substrate. Chemiluminescence is believed to be caused by oxygen-mediated reactions.
  • An optical element with improved film 1 formed on a conventional substrate has a lower oxygen permeability coefficient than an optical element formed with a conventional film on a conventional substrate, and is less likely to transmit oxygen. It is thought that the chemical reaction is suppressed. Therefore, the oxygen transmission coefficient is small! / And the optical element has a small light transmittance change amount.
  • FIG. 9 is a diagram showing the amount of fluorescent emission between a conventional substrate and a nitrogen-molded substrate at a wavelength of about 320 nm when excited at a wavelength of 280 nm.
  • a nitrogen-molded substrate refers to a substrate obtained by drying a thermoplastic transparent olefin cycloolefin polymer in nitrogen, transporting it in a nitrogen atmosphere, and molding it in a nitrogen atmosphere.
  • the amount of fluorescent light emission is an arbitrary unit and indicates a relative size. Since the fluorescence emission is considered to be oxygen-mediated, the reason why the amount of fluorescence emission of the nitrogen-molded substrate is small is considered to be because the amount of oxygen absorbed is smaller than that of the conventional substrate.
  • FIG. 10 is a diagram showing the amount of change in light transmittance between the conventional substrate and the nitrogen molded substrate.
  • the amount of change in light transmittance of the nitrogen-shaped substrate is significantly smaller than the amount of change in light transmittance of the conventional substrate.
  • the nitrogen molded substrate is less susceptible to damage from the blue laser irradiation than the conventional substrate.
  • Damage caused by irradiation with a blue laser is considered to proceed due to a chemical reaction mediated by oxygen. Therefore, it is considered that a nitrogen-molded substrate is less susceptible to damage due to blue laser irradiation because it absorbs less oxygen than a conventional substrate.
  • FIG. 11 is a diagram showing a change in light transmittance between an optical element in which the improvement film 1 is formed on a conventional substrate and an optical element in which the improvement film 1 is formed on a nitrogen-molded substrate.
  • the amount of change in light transmittance can be kept very small by combining a low-oxygen absorption substrate with a nitrogen-molded substrate and an improved film 1 that hardly transmits oxygen.
  • the present invention includes an optical power including an output of a high-frequency power source and an atmospheric gas pressure when laminating a layer made of a low refractive material and an atmospheric gas pressure when laminating a layer made of a high refractive material.
  • conditions for manufacturing an optical element with a small change in light transmittance can be determined by measuring the oxygen transmission coefficient of the optical element.
  • the output of the high-frequency power source and the pressure of the atmospheric gas when laminating the layer made of the low refractive material and the atmosphere when laminating the layer made of the high refractive material Since it is clear that the manufacturing conditions of the optical element, including the gas pressure, greatly affect the optical transmittance change amount of the optical element, the optical transmittance can be measured by measuring the optical transmittance change amount of the optical element. Conditions for manufacturing an optical element with a small amount of change can also be determined.
  • the optical element according to the present invention functions as an antireflection optical element, an optical filter, a beam splitter, and the like.

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  • Surface Treatment Of Optical Elements (AREA)

Abstract

Procédé de fabrication d'un élément optique doté d'un film de protection contre un laser déposé sur un substrat en plastique, ledit film de protection résistant à un laser bleu de puissance élevée. Le procédé de fabrication consiste à placer sur le substrat en plastique un élément optique doté d'un film multicouche constitué de couches alternées de matériau à faible réfraction et de matériau à forte réfraction en générant simultanément un plasma à l'aide d'une alimentation haute fréquence. Le procédé est caractérisé en ce que les conditions de fabrication, notamment l'énergie fournie par l'alimentation haute fréquence, la pression du gaz atmosphérique lors de la formation des couches de matériau à faible réfraction, et la pression du gaz atmosphérique lors de la formation des couches de matériau à forte réfraction, sont établies de façon à ce que l'élément optique obtenu possède un coefficient de diffusion d'oxydation inférieur ou égal à 30 cm3.mm/(m2.24h.atm) de façon à assurer le dépôt des particules de matériau ionisées dans l'atmosphère de plasma dans des conditions adéquates.
PCT/JP2006/316762 2006-08-25 2006-08-25 Élément optique doté d'un film de protection contre un laser, et son procédé de fabrication WO2008023440A1 (fr)

Priority Applications (4)

Application Number Priority Date Filing Date Title
PCT/JP2006/316762 WO2008023440A1 (fr) 2006-08-25 2006-08-25 Élément optique doté d'un film de protection contre un laser, et son procédé de fabrication
JP2007551888A JP4178190B2 (ja) 2006-08-25 2007-08-24 多層膜を有する光学素子およびその製造方法
PCT/JP2007/066483 WO2008023802A1 (fr) 2006-08-25 2007-08-24 Dispositif optique à film multicouche et procédé pour produire celui-ci
US12/379,519 US8263172B2 (en) 2006-08-25 2009-02-24 Method for producing optical element having multi-layered film

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2006/316762 WO2008023440A1 (fr) 2006-08-25 2006-08-25 Élément optique doté d'un film de protection contre un laser, et son procédé de fabrication

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WO2008023440A1 true WO2008023440A1 (fr) 2008-02-28

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011039123A (ja) * 2009-08-07 2011-02-24 Konica Minolta Opto Inc 光学素子の製造方法及び光学素子
CN108594460A (zh) * 2018-05-31 2018-09-28 北京小米移动软件有限公司 结构光模组和电子设备

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005076095A (ja) * 2003-09-02 2005-03-24 Shincron:Kk 薄膜形成装置及び薄膜形成方法

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005076095A (ja) * 2003-09-02 2005-03-24 Shincron:Kk 薄膜形成装置及び薄膜形成方法

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011039123A (ja) * 2009-08-07 2011-02-24 Konica Minolta Opto Inc 光学素子の製造方法及び光学素子
CN108594460A (zh) * 2018-05-31 2018-09-28 北京小米移动软件有限公司 结构光模组和电子设备
CN108594460B (zh) * 2018-05-31 2024-03-01 北京小米移动软件有限公司 结构光模组和电子设备

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