WO2008018228A1 - Composition adhésive, pellicule adhésive et procédé de décollement - Google Patents

Composition adhésive, pellicule adhésive et procédé de décollement Download PDF

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Publication number
WO2008018228A1
WO2008018228A1 PCT/JP2007/061433 JP2007061433W WO2008018228A1 WO 2008018228 A1 WO2008018228 A1 WO 2008018228A1 JP 2007061433 W JP2007061433 W JP 2007061433W WO 2008018228 A1 WO2008018228 A1 WO 2008018228A1
Authority
WO
WIPO (PCT)
Prior art keywords
meth
adhesive composition
adhesive
acrylic acid
adhesive layer
Prior art date
Application number
PCT/JP2007/061433
Other languages
English (en)
Japanese (ja)
Inventor
Takahiro Asai
Koichi Misumi
Atsushi Miyanari
Yoshihiro Inao
Akihiko Nakamura
Koji Saito
Original Assignee
Tokyo Ohka Kogyo Co., Ltd.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Ohka Kogyo Co., Ltd. filed Critical Tokyo Ohka Kogyo Co., Ltd.
Publication of WO2008018228A1 publication Critical patent/WO2008018228A1/fr

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
    • C09J133/04—Homopolymers or copolymers of esters
    • C09J133/06—Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, the oxygen atom being present only as part of the carboxyl radical
    • C09J133/08—Homopolymers or copolymers of acrylic acid esters
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J125/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by an aromatic carbocyclic ring; Adhesives based on derivatives of such polymers
    • C09J125/02—Homopolymers or copolymers of hydrocarbons
    • C09J125/04—Homopolymers or copolymers of styrene
    • C09J125/08—Copolymers of styrene
    • C09J125/14—Copolymers of styrene with unsaturated esters
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors

Definitions

  • the present invention relates to an adhesive composition, an adhesive film, and a peeling method, and in particular, an adhesive composition that foams when heated to 200 ° C. or higher, an adhesive film, and the adhesion by foaming.
  • the present invention relates to a method for easily peeling an adhesive layer made of an adhesive composition from a substrate.
  • Patent Document 4 further contains a component that generates an acid by irradiating light, thereby reducing the adhesive force of the adhesive substance not only by the action of foaming but also by the action of the acid, and peeling off.
  • a facilitating method is disclosed.
  • the lower alkyl group represented by R 4 may be linear or branched as long as it is an alkyl group having 1 to 4 carbon atoms. Also good. Specific examples include a methyl group, an ethyl group, an n-propyl group, an isopropyl group, an n-butyl group, a sec-butyl group, and a tert-butyl group.
  • the (meth) acrylic acid alkyl ester comprising a chain structure constituting the polymer as the main component of the adhesive composition may be used alone or in combination of two or more. May be used.
  • Embodiment 3 A method for peeling the adhesive layer made of the adhesive composition according to Embodiment 1 will be described below as Embodiment 3.
  • the specific use of the adhesive composition is not particularly limited as long as it is used for use as an adhesive.
  • the adhesive composition is used for temporarily bonding a semiconductor wafer to a support plate for a wafer support system will be described as an example.
  • the released gas at a temperature of 100 ° C or higher is a gas other than an azeotropic gas with water vapor or water, that is, a gas that also generates adhesive composition force.
  • High strength at 100 ° C. or higher indicates that the adhesive composition is decomposed by heat.

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Adhesive Tapes (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)

Abstract

La présente invention concerne une composition adhésive composée essentiellement d'un polymère obtenu par copolymérisation d'un styrène, d'un ester (méth)acrylique présentant une structure cyclique et d'un (méth)acrylate d'alkyle présentant une structure de chaîne. L'ester (méth)acrylique présente un groupe fonctionnel dissocié de la liaison ester par l'action de la chaleur de telle sorte que, si la force d'adhésion de la composition adhésive ne se détériore pas à environ 100 °C, la composition adhésive, lorsqu'elle est chauffée à 200 °C ou plus, s'expanse pour provoquer la détérioration de la force d'adhésion. En conséquence, par exemple, lors du détachement de la plaque de support de la plaquette semi-conductrice, le temps nécessaire pour détacher une couche adhésive depuis la plaquette semi-conductrice peut être réduit. En outre, étant donné que la force d'adhésion de la composition adhésive n'est pas détériorée à environ 100 °C, mais détériorée lorsque ladite composition est chauffée à 200 °C ou plus, il est possible d'obtenir un détachement facile de la couche adhésive du substrat.
PCT/JP2007/061433 2006-08-07 2007-06-06 Composition adhésive, pellicule adhésive et procédé de décollement WO2008018228A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2006-215070 2006-08-07
JP2006215070A JP5048980B2 (ja) 2006-08-07 2006-08-07 接着剤組成物、接着フィルムおよび剥離方法

Publications (1)

Publication Number Publication Date
WO2008018228A1 true WO2008018228A1 (fr) 2008-02-14

Family

ID=39032766

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2007/061433 WO2008018228A1 (fr) 2006-08-07 2007-06-06 Composition adhésive, pellicule adhésive et procédé de décollement

Country Status (3)

Country Link
JP (1) JP5048980B2 (fr)
TW (1) TW200811259A (fr)
WO (1) WO2008018228A1 (fr)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4976829B2 (ja) 2006-11-29 2012-07-18 東京応化工業株式会社 接着剤組成物、及び接着フィルム
JP5525782B2 (ja) 2009-01-13 2014-06-18 東京応化工業株式会社 接着剤組成物および接着フィルム

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2005073811A1 (fr) * 2004-01-30 2005-08-11 Tokyo Ohka Kogyo Co., Ltd. Composition résistante positive et procédé de formation d’un modèle résistant
JP2005314453A (ja) * 2004-04-27 2005-11-10 Sumitomo Chemical Co Ltd アクリル樹脂及び該樹脂を含有する粘着剤
JP2007119646A (ja) * 2005-10-28 2007-05-17 Tokyo Ohka Kogyo Co Ltd 接着剤組成物および接着フィルム

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101046551B1 (ko) * 2006-05-16 2011-07-05 닛뽕소다 가부시키가이샤 블록 코폴리머

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2005073811A1 (fr) * 2004-01-30 2005-08-11 Tokyo Ohka Kogyo Co., Ltd. Composition résistante positive et procédé de formation d’un modèle résistant
JP2005314453A (ja) * 2004-04-27 2005-11-10 Sumitomo Chemical Co Ltd アクリル樹脂及び該樹脂を含有する粘着剤
JP2007119646A (ja) * 2005-10-28 2007-05-17 Tokyo Ohka Kogyo Co Ltd 接着剤組成物および接着フィルム

Also Published As

Publication number Publication date
JP2008038039A (ja) 2008-02-21
TW200811259A (en) 2008-03-01
JP5048980B2 (ja) 2012-10-17

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