Classifications

• • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
  • F28—HEAT EXCHANGE IN GENERAL
  • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
  • F28D9/00—Heat-exchange apparatus having stationary plate-like or laminated conduit assemblies for both heat-exchange media, the media being in contact with different sides of a conduit wall
• • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
  • F28—HEAT EXCHANGE IN GENERAL
  • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
  • F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
  • F28F3/02—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations
  • F28F3/04—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations the means being integral with the element
  • F28F3/042—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations the means being integral with the element in the form of local deformations of the element
• • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
  • F28—HEAT EXCHANGE IN GENERAL
  • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
  • F28D1/00—Heat-exchange apparatus having stationary conduit assemblies for one heat-exchange medium only, the media being in contact with different sides of the conduit wall, in which the other heat-exchange medium is a large body of fluid, e.g. domestic or motor car radiators
  • F28D1/02—Heat-exchange apparatus having stationary conduit assemblies for one heat-exchange medium only, the media being in contact with different sides of the conduit wall, in which the other heat-exchange medium is a large body of fluid, e.g. domestic or motor car radiators with heat-exchange conduits immersed in the body of fluid
  • F28D1/03—Heat-exchange apparatus having stationary conduit assemblies for one heat-exchange medium only, the media being in contact with different sides of the conduit wall, in which the other heat-exchange medium is a large body of fluid, e.g. domestic or motor car radiators with heat-exchange conduits immersed in the body of fluid with plate-like or laminated conduits
• • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
  • F28—HEAT EXCHANGE IN GENERAL
  • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
  • F28D1/00—Heat-exchange apparatus having stationary conduit assemblies for one heat-exchange medium only, the media being in contact with different sides of the conduit wall, in which the other heat-exchange medium is a large body of fluid, e.g. domestic or motor car radiators
  • F28D1/02—Heat-exchange apparatus having stationary conduit assemblies for one heat-exchange medium only, the media being in contact with different sides of the conduit wall, in which the other heat-exchange medium is a large body of fluid, e.g. domestic or motor car radiators with heat-exchange conduits immersed in the body of fluid
  • F28D1/03—Heat-exchange apparatus having stationary conduit assemblies for one heat-exchange medium only, the media being in contact with different sides of the conduit wall, in which the other heat-exchange medium is a large body of fluid, e.g. domestic or motor car radiators with heat-exchange conduits immersed in the body of fluid with plate-like or laminated conduits
  • F28D1/0308—Heat-exchange apparatus having stationary conduit assemblies for one heat-exchange medium only, the media being in contact with different sides of the conduit wall, in which the other heat-exchange medium is a large body of fluid, e.g. domestic or motor car radiators with heat-exchange conduits immersed in the body of fluid with plate-like or laminated conduits the conduits being formed by paired plates touching each other
  • F28D1/0316—Assemblies of conduits in parallel
• • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
  • F28—HEAT EXCHANGE IN GENERAL
  • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
  • F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
  • F28F3/02—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations
  • F28F3/04—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations the means being integral with the element

Definitions

• the invention relates primarily to a heat exchanger, consisting of a stack of hollow plates, which has very high performance, that is to say a very large volume conductance associated with a reduced frontal area, a need for low power mechanical means for the propulsion of the fluids concerned and the possibility of treating liquid and / or gaseous fluids, at differential pressures and relatively high temperatures.
• the invention also relates, secondly, heat exchangers similar to the previous, generally less powerful than him but may be better suited to certain particular applications.
• Hollow-plate heat exchangers have a much higher performance than full-metal finned heat exchangers. Indeed, for the same volume conductance, in such a liquid / gas heat exchanger, the gap between contiguous hollow plates is much greater than that between full fins. In this way, the weight of the former, their size, their frontal surface and the power consumed (pumping liquid (s) and / or gas ventilation), are significantly lower than those of the latter. And yet, solid metal fin heat exchangers remain of universal use in many fields. Under these conditions, when the thermal engines are equipped with conventional water / air radiators, the frontal surface (master torque) of these radiators measures approximately 0.3 dm per kW to be evacuated, whereas their implementation consumes mechanical power (ventilation). and pumping) which equals up to 10% of the thermal power to dissipate, or more if the temperature differences are small. This shows the interest of heat exchangers with hollow plates.
• Heat exchangers consisting of a one-piece stack of hollow wafers made of polymer, glass or metal, are described in European Patent EP 1 579 163 B1, granted to TET.
• the method for producing one of these exchangers is to manufacture, by thermo-blowing a polymer parison, an accordion-shaped blank, provided with biconvex bellows, embossed walls by alternating bosses with steep slopes, then to perform a controlled compression.
• these bellows take the definitive form of a one-piece stack rigid hollow inserts, with a thin internal channel, connected to two internal collectors.
• Such monobloc polymer heat exchangers provide completely satisfactory results for many applications, as long as the desired volume conductance remains average (at most 20 W / ° C / dm 3 ) and the treated fluids are at moderate differential pressure. (at most 0.1 MPa) and at low temperature ( ⁇ 100 ° C). Indeed, in many particular cases, their advantages of weight, cost, size and power consumed (3 to 5% of the thermal power to be evacuated) largely compensate for these limited performances, especially when the initial temperature difference between the two fluids concerned is relatively low ( ⁇ 60 ° C).
• This monobloc heat exchanger formed of hollow wafers with corrugated walls of polymer, is of multiple interest. Its walls conciliate a certain stiffness and a certain finesse, which are two antinomic characters, so that its weight, its cost, its size are small. Its thin internal channel makes it possible, despite a laminar flow of the coolant, to obtain a good thermal conductance between this liquid and the wall of the hollow wafer.
• its embossed walls generate a relatively large turbulence in the flow of air between platelets, which makes it possible to substantially increase the distance between them. This considerably reduces the energy required to propel air between these pads. In addition, this significant turbulence of the air flowing between the plates increases the apparent thermal conductivity of this air and therefore the overall thermal conductance of the exchanger.
• thermo-blow and controlled compression biconvex bellows a polymer blank stum on limited results, as soon as we seek to increase the level of performance sought and including the volume conductance of the heat exchanger thus produced.
• this technique it is impossible to completely control the two-step manufacturing process of a one-piece stack of hollow wafers, as regards the thicknesses of the internal channel and those of the wafer walls, although these thicknesses are determining parameters for the value of the volume conductance of the exchanger.
• the average value is of the order of a millimeter and the dispersion of about fifty percent, this dispersion being essentially due to the irregular thinning of the wall during the thermo-blow of the blank .
• the new heat exchangers in particular designed for this particular use, must be equipped with metal hollow plates, provided with an internal channel as fine and precise as possible and with walls that are both rigid and very thin.
• metal hollow plates provided with an internal channel as fine and precise as possible and with walls that are both rigid and very thin.
• They will obviously be totally different from those of the previous ones. They will be borrowed from a heavy and bulky heat exchange device, developed for the cooling of electrical transformers of distribution networks, described in US Pat. Nos. 3,153,447 in 1964 and US Pat. No. 3,849,851 in 1974.
• This device consists of large hollow metal plates with embossed walls, connected by welding to two external collectors, adapted to be vertically arranged and cooled by circulating air by natural convection.
• the first object of the invention is a high performance heat exchanger, formed of hollow plates with thin metal walls stiffened by an appropriate embossing, having both weight, compactness and reduced frontal area, low mechanical power consumption and very high volumetric conductance. , while being well adapted to a reliable industrialization easily controllable and, furthermore, capable of treating liquid and / or gaseous fluids, at high temperatures and / or differential pressures.
• the second subject of the invention relates to improved heat exchangers, similar to the previous one, which are less efficient than it, but better adapted to particular specific applications, different from those of this previous one, comprising a stack of hollow wafers, with thin polymer walls. or glass, stiffened by an appropriate embossing.
• the third object of the invention is a compact radiator with a reduced frontal surface, made from these improved heat exchangers, having a high thermal conductance and requiring very low pumping and ventilation powers.
• a heat exchanger with reduced weight and bulk and with a very high volume conductance suitable for treating fluids with high differential pressures and high temperatures, in which: hollow metal plates with a thin internal channel are stacked stepwise constant and connected to external collectors; these plates comprise a central embossed area, located between two connection areas provided with narrow mouths with a surface substantially equal to that of a cross section of the central zone;
• the walls of these wafers have been made by stamping and cutting a sheet of metal; the lateral edges of the two walls of a hollow plate are welded; is characterized in that
• each hollow plate are at the same time rigid and very thin, their embossed central zone presenting one or more aligned series of alternating bosses, endowed with sharpened facets with steep slopes, creating a large number of sharp edges, oriented in directions oblique or perpendicular to the alignment of the bosses; the gap between the opposing facets is uniform, very narrow, exactly known and practically constant, in the range of expected differential pressures; the separation spaces of the platelets are relatively narrow.
• the thickness of the walls of the plates does not need to be thin and their rigidity is not a particular problem, so that the embossing of the central zone of these walls is not the solution to a problem of stiffness which, in this case, practically does not exist. Indeed, an adequate thickness of walls made of a conventional metal provides without difficulty. It is only a question of increasing the heat exchange surface of the plates without increasing their dimensions. This is done by longitudinal undulations that result from relatively small depressions, made at constant pitch in the walls. The particular profile of these ripples is represented: it is commonplace and can hardly be characterized by any originality, this aspect of things having no interest in this type of exchangers. On the other hand, because of these corrugations, the internal channel of the hollow plates has an undulating thickness which varies symmetrically about a relatively large average value. And the walls of this internal channel do not have facets sloping facing.
• the first provision of the invention it is first of all very thin-walled plates (for example, 0.15 mm for some steels) to which their hardening, obtained "as a bonus" on the occasion of a standard stamping (cold), gives a hardness and an elastic limit particularly large: each facet of these hollows and bumps acts as a stiff lamella and, in addition, each sharp edge behaves like a beam in which these lamellae are recessed. These slats can therefore take only a very limited arrow, under the action of differential pressures applied.
• each hollow bossed plate according to the invention owes its remarkable primary stiffness to the fact that the metal constituting its walls is hardened and that, in addition, its alternating bosses significantly increase the moment of inertia.
• each hollow plate comprises at least two alignments of alternative bosses
• this internal partition thus formed between two contiguous alignments of alternating bosses constitutes a barrier for the flow of liquid entering the hollow wafer.
• Each barrier has the first effect of preventing a large direct flow between the two external collectors, along a smooth wall of small area and therefore not very effective for the desired heat exchange, especially since this surface is not swept by a strong current of air since it is in the wake of the upstream collector.
• this barrier has the second effect of directing the incoming current towards the two alignments of alternating bosses with high heat exchange efficiency and thus maximizing the heat exchange effected.
• the angles formed by the adjacent two-facet normals of the alternating bosses measure at least 30 ° so that the sharp edges of these facets can be effective in creating turbulence and be comparable to beams in which the facets of these bosses are recessed; the maximum angle of the adjacent two-facet normals is limited by the restrictions imposed on the drawing conditions of the metal foil concerned.
• the facets facing a wafer have parallel walls and the gap separating these walls is constant and of the same order of magnitude as their thickness.
• the alternative bosses have, in their own, two isosceles trapezoid-shaped facets, having a common longitudinal edge, and, in sharing, two diamond-shaped facets; the large diagonal diamond facets can measure a few tens of times the thickness of the wall of platelets.
• the alternative bosses have, in their own right, two triangular-shaped facets and, in sharing, two hexagonal-shaped facets having a common transverse edge; the difference between the transverse edges of the facets in hexagon can measure a few tens of times the thickness of the wall of the platelets.
• the embossed central zone of each hollow plate is connected to the external collectors by two connection zones provided with lateral edges having a high obliquity and smooth walls comprising portions of conical frustums.
• the external collectors have an aerodynamic profile adapted to minimize their screening.
• symmetrical bosses facets appear as cut diamonds and have several secondary facets, with complementary sharp edges.
• the volume conductance of the heat exchanger thus produced is particularly high. And this, for several reasons: (1) platelets have metal walls that have negligible thermal resistance, (2) the thermal resistance of the very thin layer of water or oil inside these platelets is low , despite the laminar flow of this layer and the relatively high thermal resistivity of these liquids and (3) the turbulence and the apparent thermal conductivity of the air, which flows between the platelets, increase with the height of the bosses and the total number sharp edges they contain. With at least two alignments each comprising some alternative bosses, with facets inclined at approximately 45 °, an effective compromise is made between the various parameters concerned.
• embossing bosses whose slope facets is less than about 50 ° is a standard operation that poses no problem of realization and a minimum angle of 30 ° between the normal two adjacent facets ensures a good turbulence in the flow of air and a minimum width for each of the alignments of the bosses in the central area of the pads, since the height of these hollows and bumps is fixed.
• a minimum angle of 30 ° between the adjacent two-faceted normals gives the edge concerned sufficient stiffness to be comparable to a beam, all of these edges being then comparable to a trellis of beams. .
• metals used for the manufacture of the walls of the hollow wafers according to the invention are not very numerous but well known to the stamping specialists and that finally the choice (aluminum or steel, for example) example) will be primarily determined by the mechanical behavior of these metals in the operating temperature range of the heat exchangers that will incorporate these platelets.
• the industrial manufacture of very high performance heat exchangers comprises a set of operations perfectly controllable and relatively easy to automate, which leads to an interesting cost price for the mass production of these exchangers. Indeed, these operations are as follows:
• a compact radiator with a very high volume conductance, is characterized in that it comprises two identical groups of metal heat exchangers with hollow plates, associated with two main upstream and downstream collectors, with reduced thickness, provided with flat faces in the shape of right trapezes, slightly apart from each other and so arranged that their square corners are opposite;
• the individual headers upstream and downstream of the exchangers of each group are respectively connected, at a constant interval little greater than the width of the central zone of the exchangers, to the two faces of these two main headstream upstream and downstream collectors.
• FIG. above a first embossed hollow plate wall according to the invention
• FIG. 2A is a view from above of a second embossed hollow plate wall according to the invention and FIGS. 2B and 2C, views of particular facets of this wall;
• FIG. 3 is a longitudinal section of the alternative bosses of this first wall;
• Figure 4 is a longitudinal section of a hollow wafer end, welded to a collector;
• FIG. 5 is a perspective view of a heat exchanger with fifteen hollow plates
• Figure 6 is a top view of a radiator according to the invention constructed by means of these heat exchangers.
• FIG. 1 there is shown a first embodiment of a thin metal wall 10 of a hollow wafer.
• This wall has been stamped and then cut so as to have a central embossed zone 13, disposed between two connection zones.
• this wall is made of aluminum and has a thickness of 0.3 mm and its embossed central zone is 60 mm wide and 76 mm long.
• This central zone 13 is formed by two identical, contiguous alignments 12 and 14 of alternating bosses, separated by a narrow rectilinear zone 16, 4 mm wide.
• the two connection areas 18 and 20 have smooth walls.
• Each alignment comprises two identical alternating bosses formed of bumps and depressions, that is, for the alignments 12-14, four bumps 22 1-2 and 24 1-2 , on the one hand, and four recesses 22V 2 and 24'i -2 , on the other hand, the latter being represented in gray.
• Each bump 22i -2 -24 1-2 or each hollow 22'i_ 2 -24 * j_ 2 has the form of a roof with four slopes having four sharp edges steeply inclined, or for each alternating boss of the alignment 12: (1) own, two symmetrical trapezes 26 1-2 and 28i -2 for the bumps, and 26'i_ 2 and 28 ' 1-2 for the hollows, all with a large base of 19 mm, (2) shared with the contiguous boss of the same alignment, two isosceles triangles 30j- 2 and 32].
• the lines 38-40 and the flanges 42-44 are 1 mm wide and form a small step of 0.2 mm high, which determines half of the internal thickness of a plate at the peaks of its bosses.
• These two flat lines 38-40 end at the two flat portions 46-48 of the two connection areas 18-20 of the wall 10 and these two parallel flanges 42-44 terminate with the two pairs of oblique outer flanges 50j-502 and 52. ] -52 2 of these same connection areas; they form the other part of the joint plane of the walls of the wafer.
• Each edge 5Or 2 or 52 ⁇ 2 forms an angle of 60 ° with the longitudinal line of symmetry of the wall 10.
• each connection zone 18-20 comprises a portion of almost flat truncated cone 54-56, of 87.5 ° half-angle at the top.
• This frustoconical portion is delimited by two pairs of circular arcs 58] - 2 and 60] - 2 , the latter pair being 8 mm long.
• their ends are connected to each other by two steps of 1.5 mm high, so that the surface of each of the mouths upstream or downstream, thus arranged for a hollow plate, measure 24 mm 2 , substantially the cross-sectional area of the inner space of the embossed central zone 13 of the wafer.
• FIG. 2A there is shown a thin metal wall 11, stamped then cut, which constitutes a second embodiment of a hollow wafer wall according to the invention.
• This wall 11 differs from the previous wall 10 only by its embossed central zone, which has only one alignment of bosses 15 wide by 26 mm, and by the shape of its alternating bosses.
• This single alignment comprises three bumps 22b] _ 3 and three recesses 22'b 1-3 , the latter being represented in gray.
• Each boss 22b 1-3 and each recess 22'bi -3 has the form of a roof with four steeply inclined slopes.
• Figure 2B shows a triangle side facet 25, with three secondary facets 1-3 forming a relatively flat trihedral with three sharp edges, provided with a diamond tip 39, located at the center of gravity of this triangle.
• FIG. 2C shows a longitudinal facet in hexagon 31, having six triangles with coplanar sides 41j- 6 , provided with a central diamond tip 4S 1-6 , similar to that 39 of FIG. 2B.
• the height of these tips is determined by the limitations of stamping technology of metal sheets.
• Figures 1 and 2A illustrate two of the possible forms that can take the bosses of the embossed walls of the hollow plates according to the invention. And Figures 2B and 2C illustrate the possible variants that can be known the main facets of these bosses, to improve their ability to produce turbulence in air currents between pads.
• FIG. 3 represents an enlargement of a longitudinal section along an axis AA '(see FIG. 1) of one end of a portion of a hollow wafer before it is connected to a collector.
• This plate is the result of the welding of the two walls 10a and 10b, this wall 10b being the wall 10a turned upside down, about the transverse axis of symmetry BB '(see fig.l).
• This AA 'cut is made along the crests 35 2 and 35 '2 of the alternating boss formed by the boss 24 2 and the hollow 24' 2 of the alignment 14 and it passes through the connection zone 18 of the wall 10a of this wafer.
• FIG. 4 represents an enlargement of a section of this same end of the wafer, made along the longitudinal line of symmetry CC (see FIG. 1) of the alignments 12 and 14 of alternative bosses and the connection zones 18 and 20 of FIG. the wall 10a.
• the thickness of the portion 62 of the internal channel of a hollow wafer, located between the nested crests 34 '- 35' 2 or 34'i-35 2 of the embossed zone of this wafer, is 0.4 mm and that of the portion 64 of this internal channel, located between the slopes at 45 ° of the rising or falling flanks of these bosses, is 0.28 mm.
• the thickness of the inner channel 66, between the planar portions of the connection areas 18 and 20, is 0.4 mm.
• the right part of the section along the line AA ' represents (1) the beginning 68 of the progressive separation of the walls of the two conical sections facing each other 54-56 of the walls 1 Oa-10b, which terminate these two connection zones, (2) the two symmetrical steps of these walls which start with the circles 58 2 and 58] and (3) the two symmetrical outer flanges 52 2 and 50j which define the joint plane of the walls 10a and 10b .
• the section shown is made along the longitudinal axis of symmetry CC of a hollow plate end engaged and welded by a weld bead 70, in the edges and ends of a slot 72, in 120 ° arc shape, formed in the connecting shell 74 of an external collector 75, formed by two elongated shells, welded to each other.
• the section shown shows two parallel sections 16a and 16b of the narrow central zones of the walls 10a and 10b, separated by a gap 66 of 0.4 mm and two other divergent sections 54 and 56 corresponding to the conical sections facing the connecting zones of the two walls 10a and 10b of the hollow wafer.
• an elemental heat exchanger 76 which comprises fifteen thin hollow metal fins 78 I-15 with embossed walls. The ends of these hollow plates are engaged and welded as indicated above in slots with circular edges, having 3.5 mm wide and a pitch of 8 mm, made in the walls of the external collectors 80-82, aerodynamic profile.
• the collectors 80-82 are constituted by two elongate shells, with a U-shaped cross-section, welded to one another along a line 83. They are made from metal strips cut from sheets identical to those used for the manufacture of the stamped walls of the wafers.
• the sink depths of the collectors are different for the even and odd-numbered exchangers.
• the length of the largest 88 2 - 9O 2 of the parallel sides of the two main manifolds 84-86 is determined by the number of heat exchangers 76 to be mounted.
• the short sides of the two main manifolds 84-86 have lengths determined by the spacing of the outer collectors 80-82 and by the gap 100 (typically 5 mm) which separates their oblique sides.
• Such an assembly of heat exchangers formed by stacks of thin hollow metal plates with very thin walls stiffened by embossing makes it possible to form a compact radiator which is particularly useful for cooling high power thermal engines (> 100 kW). They have in fact a very low torque master, a very high thermal conductance, reduced pumping and ventilation powers, limited space and weight. It is also suitable for the treatment of exhaust gases of diesel engines, used cooled to improve the low-speed operation of these engines. More generally, any heat exchange between two fluids, in particular between a liquid and a gas, having a high temperature and / or differential pressure (up to about 600 ° C. and 1 MPa) can be effectively achieved by means of such a device. compact metal set.
• the invention is not limited to the examples described.
• the length and width of the hollow wafers can be significantly larger than those illustrated in FIG. 1 and can be several decimetres in length. It is the same for the number of alternative bosses in each alignment and the number of alignments in each plate.
• the maximum dimensions of a wafer are in practice determined by those of the plate of the stamping press available. As for the number of hollow plates in a heat exchanger, it can go up to a few tens. It is the same for the total number of exchangers assembled in a compact radiator.
• glass heat exchangers with high performance and better than any other, perfectly adapted to their conditions of use.
• these glass heat exchangers will have high volumetric conductances, but however halfway to those indicated above for hollow-plate exchangers either monoblock polymer or metal of the type according to the invention (20 or 100 W / ° C / dm 3 ).
• the maximum temperatures and differential pressures that may be applied to these glass heat exchangers, they will be lower than those that support the metal heat exchangers according to the present invention and higher than those for the polymer monoblock exchangers according to the patent TET.
• polymer heat exchangers having a volume conductance of about 50% greater than that of these monobloc exchangers, while maintaining their ranges of differential pressures and temperatures. .

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• Engineering & Computer Science (AREA)
• Physics & Mathematics (AREA)
• Thermal Sciences (AREA)
• Mechanical Engineering (AREA)
• General Engineering & Computer Science (AREA)
• Heat-Exchange Devices With Radiators And Conduit Assemblies (AREA)
• External Artificial Organs (AREA)
• Fuel Cell (AREA)
• Supporting Of Heads In Record-Carrier Devices (AREA)
• Laminated Bodies (AREA)
• Superconductors And Manufacturing Methods Therefor (AREA)

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• 2006
  • 2006-06-13 FR FR0605248A patent/FR2902183A1/fr not_active Withdrawn
• 2007
  • 2007-06-12 CN CNA2007800221680A patent/CN101466993A/zh active Pending
  • 2007-06-12 KR KR1020097000628A patent/KR20090048433A/ko not_active Application Discontinuation
  • 2007-06-12 CA CA002654633A patent/CA2654633A1/en not_active Abandoned
  • 2007-06-12 BR BRPI0714038-0A2A patent/BRPI0714038A2/pt not_active IP Right Cessation
  • 2007-06-12 AU AU2007259127A patent/AU2007259127A1/en not_active Abandoned
  • 2007-06-12 AT AT07788872T patent/ATE442564T1/de not_active IP Right Cessation
  • 2007-06-12 RU RU2008152225/06A patent/RU2413152C2/ru not_active IP Right Cessation
  • 2007-06-12 EP EP07788872A patent/EP2032928B1/fr not_active Not-in-force
  • 2007-06-12 US US12/304,642 patent/US20100012303A1/en not_active Abandoned
  • 2007-06-12 MX MX2008015912A patent/MX2008015912A/es active IP Right Grant
  • 2007-06-12 WO PCT/FR2007/000967 patent/WO2007144498A2/fr active Application Filing
  • 2007-06-12 ES ES07788872T patent/ES2333486T3/es active Active
  • 2007-06-12 JP JP2009514846A patent/JP2009540264A/ja active Pending
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