WO2007139159A1 - 有機金属化合物の供給装置 - Google Patents
有機金属化合物の供給装置 Download PDFInfo
- Publication number
- WO2007139159A1 WO2007139159A1 PCT/JP2007/061005 JP2007061005W WO2007139159A1 WO 2007139159 A1 WO2007139159 A1 WO 2007139159A1 JP 2007061005 W JP2007061005 W JP 2007061005W WO 2007139159 A1 WO2007139159 A1 WO 2007139159A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- container
- trimethylindium
- supply
- supply device
- gas
- Prior art date
Links
- 150000002736 metal compounds Chemical class 0.000 title abstract description 8
- 239000007789 gas Substances 0.000 claims abstract description 120
- 239000012159 carrier gas Substances 0.000 claims abstract description 74
- 239000007787 solid Substances 0.000 claims abstract description 12
- 150000002902 organometallic compounds Chemical class 0.000 claims description 43
- 238000004891 communication Methods 0.000 claims description 26
- 238000007599 discharging Methods 0.000 abstract 1
- IBEFSUTVZWZJEL-UHFFFAOYSA-N trimethylindium Chemical compound C[In](C)C IBEFSUTVZWZJEL-UHFFFAOYSA-N 0.000 description 131
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 52
- 238000013112 stability test Methods 0.000 description 51
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 44
- 229910052719 titanium Inorganic materials 0.000 description 44
- 239000010936 titanium Substances 0.000 description 43
- 239000002245 particle Substances 0.000 description 36
- 229910052786 argon Inorganic materials 0.000 description 26
- VZSRBBMJRBPUNF-UHFFFAOYSA-N 2-(2,3-dihydro-1H-inden-2-ylamino)-N-[3-oxo-3-(2,4,6,7-tetrahydrotriazolo[4,5-c]pyridin-5-yl)propyl]pyrimidine-5-carboxamide Chemical compound C1C(CC2=CC=CC=C12)NC1=NC=C(C=N1)C(=O)NCCC(N1CC2=C(CC1)NN=N2)=O VZSRBBMJRBPUNF-UHFFFAOYSA-N 0.000 description 17
- 229910001220 stainless steel Inorganic materials 0.000 description 14
- 239000010935 stainless steel Substances 0.000 description 14
- 238000012360 testing method Methods 0.000 description 13
- 230000000052 comparative effect Effects 0.000 description 10
- HMUNWXXNJPVALC-UHFFFAOYSA-N 1-[4-[2-(2,3-dihydro-1H-inden-2-ylamino)pyrimidin-5-yl]piperazin-1-yl]-2-(2,4,6,7-tetrahydrotriazolo[4,5-c]pyridin-5-yl)ethanone Chemical compound C1C(CC2=CC=CC=C12)NC1=NC=C(C=N1)N1CCN(CC1)C(CN1CC2=C(CC1)NN=N2)=O HMUNWXXNJPVALC-UHFFFAOYSA-N 0.000 description 9
- 239000012299 nitrogen atmosphere Substances 0.000 description 9
- RGCLLPNLLBQHPF-HJWRWDBZSA-N phosphamidon Chemical compound CCN(CC)C(=O)C(\Cl)=C(/C)OP(=O)(OC)OC RGCLLPNLLBQHPF-HJWRWDBZSA-N 0.000 description 9
- 238000012856 packing Methods 0.000 description 8
- 229910052751 metal Inorganic materials 0.000 description 7
- 239000002184 metal Substances 0.000 description 7
- 229910052738 indium Inorganic materials 0.000 description 6
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 description 6
- 238000000034 method Methods 0.000 description 6
- 238000012986 modification Methods 0.000 description 6
- 230000004048 modification Effects 0.000 description 6
- YLZOPXRUQYQQID-UHFFFAOYSA-N 3-(2,4,6,7-tetrahydrotriazolo[4,5-c]pyridin-5-yl)-1-[4-[2-[[3-(trifluoromethoxy)phenyl]methylamino]pyrimidin-5-yl]piperazin-1-yl]propan-1-one Chemical compound N1N=NC=2CN(CCC=21)CCC(=O)N1CCN(CC1)C=1C=NC(=NC=1)NCC1=CC(=CC=C1)OC(F)(F)F YLZOPXRUQYQQID-UHFFFAOYSA-N 0.000 description 5
- -1 adducts Chemical class 0.000 description 5
- 239000011521 glass Substances 0.000 description 5
- MKYBYDHXWVHEJW-UHFFFAOYSA-N N-[1-oxo-1-(2,4,6,7-tetrahydrotriazolo[4,5-c]pyridin-5-yl)propan-2-yl]-2-[[3-(trifluoromethoxy)phenyl]methylamino]pyrimidine-5-carboxamide Chemical compound O=C(C(C)NC(=O)C=1C=NC(=NC=1)NCC1=CC(=CC=C1)OC(F)(F)F)N1CC2=C(CC1)NN=N2 MKYBYDHXWVHEJW-UHFFFAOYSA-N 0.000 description 4
- 230000002093 peripheral effect Effects 0.000 description 4
- DEXFNLNNUZKHNO-UHFFFAOYSA-N 6-[3-[4-[2-(2,3-dihydro-1H-inden-2-ylamino)pyrimidin-5-yl]piperidin-1-yl]-3-oxopropyl]-3H-1,3-benzoxazol-2-one Chemical compound C1C(CC2=CC=CC=C12)NC1=NC=C(C=N1)C1CCN(CC1)C(CCC1=CC2=C(NC(O2)=O)C=C1)=O DEXFNLNNUZKHNO-UHFFFAOYSA-N 0.000 description 3
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 3
- 125000005595 acetylacetonate group Chemical group 0.000 description 3
- 238000001947 vapour-phase growth Methods 0.000 description 3
- NIPNSKYNPDTRPC-UHFFFAOYSA-N N-[2-oxo-2-(2,4,6,7-tetrahydrotriazolo[4,5-c]pyridin-5-yl)ethyl]-2-[[3-(trifluoromethoxy)phenyl]methylamino]pyrimidine-5-carboxamide Chemical compound O=C(CNC(=O)C=1C=NC(=NC=1)NCC1=CC(=CC=C1)OC(F)(F)F)N1CC2=C(CC1)NN=N2 NIPNSKYNPDTRPC-UHFFFAOYSA-N 0.000 description 2
- AFCARXCZXQIEQB-UHFFFAOYSA-N N-[3-oxo-3-(2,4,6,7-tetrahydrotriazolo[4,5-c]pyridin-5-yl)propyl]-2-[[3-(trifluoromethoxy)phenyl]methylamino]pyrimidine-5-carboxamide Chemical compound O=C(CCNC(=O)C=1C=NC(=NC=1)NCC1=CC(=CC=C1)OC(F)(F)F)N1CC2=C(CC1)NN=N2 AFCARXCZXQIEQB-UHFFFAOYSA-N 0.000 description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- 239000004809 Teflon Substances 0.000 description 2
- 229920006362 Teflon® Polymers 0.000 description 2
- YZCKVEUIGOORGS-NJFSPNSNSA-N Tritium Chemical compound [3H] YZCKVEUIGOORGS-NJFSPNSNSA-N 0.000 description 2
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 2
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- 150000001875 compounds Chemical class 0.000 description 2
- 230000007423 decrease Effects 0.000 description 2
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 2
- 150000002894 organic compounds Chemical class 0.000 description 2
- HTDIUWINAKAPER-UHFFFAOYSA-N trimethylarsine Chemical compound C[As](C)C HTDIUWINAKAPER-UHFFFAOYSA-N 0.000 description 2
- 229910052722 tritium Inorganic materials 0.000 description 2
- 229910052725 zinc Inorganic materials 0.000 description 2
- 239000011701 zinc Substances 0.000 description 2
- YJTKZCDBKVTVBY-UHFFFAOYSA-N 1,3-Diphenylbenzene Chemical group C1=CC=CC=C1C1=CC=CC(C=2C=CC=CC=2)=C1 YJTKZCDBKVTVBY-UHFFFAOYSA-N 0.000 description 1
- LDXJRKWFNNFDSA-UHFFFAOYSA-N 2-(2,4,6,7-tetrahydrotriazolo[4,5-c]pyridin-5-yl)-1-[4-[2-[[3-(trifluoromethoxy)phenyl]methylamino]pyrimidin-5-yl]piperazin-1-yl]ethanone Chemical compound C1CN(CC2=NNN=C21)CC(=O)N3CCN(CC3)C4=CN=C(N=C4)NCC5=CC(=CC=C5)OC(F)(F)F LDXJRKWFNNFDSA-UHFFFAOYSA-N 0.000 description 1
- 229910052582 BN Inorganic materials 0.000 description 1
- PZNSFCLAULLKQX-UHFFFAOYSA-N Boron nitride Chemical compound N#B PZNSFCLAULLKQX-UHFFFAOYSA-N 0.000 description 1
- OYPRJOBELJOOCE-UHFFFAOYSA-N Calcium Chemical compound [Ca] OYPRJOBELJOOCE-UHFFFAOYSA-N 0.000 description 1
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 239000005749 Copper compound Substances 0.000 description 1
- GYHNNYVSQQEPJS-UHFFFAOYSA-N Gallium Chemical compound [Ga] GYHNNYVSQQEPJS-UHFFFAOYSA-N 0.000 description 1
- FYYHWMGAXLPEAU-UHFFFAOYSA-N Magnesium Chemical compound [Mg] FYYHWMGAXLPEAU-UHFFFAOYSA-N 0.000 description 1
- PWHULOQIROXLJO-UHFFFAOYSA-N Manganese Chemical compound [Mn] PWHULOQIROXLJO-UHFFFAOYSA-N 0.000 description 1
- VCUFZILGIRCDQQ-KRWDZBQOSA-N N-[[(5S)-2-oxo-3-(2-oxo-3H-1,3-benzoxazol-6-yl)-1,3-oxazolidin-5-yl]methyl]-2-[[3-(trifluoromethoxy)phenyl]methylamino]pyrimidine-5-carboxamide Chemical compound O=C1O[C@H](CN1C1=CC2=C(NC(O2)=O)C=C1)CNC(=O)C=1C=NC(=NC=1)NCC1=CC(=CC=C1)OC(F)(F)F VCUFZILGIRCDQQ-KRWDZBQOSA-N 0.000 description 1
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 1
- 229910052581 Si3N4 Inorganic materials 0.000 description 1
- FHKPLLOSJHHKNU-INIZCTEOSA-N [(3S)-3-[8-(1-ethyl-5-methylpyrazol-4-yl)-9-methylpurin-6-yl]oxypyrrolidin-1-yl]-(oxan-4-yl)methanone Chemical compound C(C)N1N=CC(=C1C)C=1N(C2=NC=NC(=C2N=1)O[C@@H]1CN(CC1)C(=O)C1CCOCC1)C FHKPLLOSJHHKNU-INIZCTEOSA-N 0.000 description 1
- JAWMENYCRQKKJY-UHFFFAOYSA-N [3-(2,4,6,7-tetrahydrotriazolo[4,5-c]pyridin-5-ylmethyl)-1-oxa-2,8-diazaspiro[4.5]dec-2-en-8-yl]-[2-[[3-(trifluoromethoxy)phenyl]methylamino]pyrimidin-5-yl]methanone Chemical compound N1N=NC=2CN(CCC=21)CC1=NOC2(C1)CCN(CC2)C(=O)C=1C=NC(=NC=1)NCC1=CC(=CC=C1)OC(F)(F)F JAWMENYCRQKKJY-UHFFFAOYSA-N 0.000 description 1
- UDWPONKAYSRBTJ-UHFFFAOYSA-N [He].[N] Chemical compound [He].[N] UDWPONKAYSRBTJ-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 239000012298 atmosphere Substances 0.000 description 1
- 229910052788 barium Inorganic materials 0.000 description 1
- DSAJWYNOEDNPEQ-UHFFFAOYSA-N barium atom Chemical compound [Ba] DSAJWYNOEDNPEQ-UHFFFAOYSA-N 0.000 description 1
- 150000001553 barium compounds Chemical class 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 150000001622 bismuth compounds Chemical class 0.000 description 1
- 229910052791 calcium Inorganic materials 0.000 description 1
- 239000011575 calcium Substances 0.000 description 1
- 229940043430 calcium compound Drugs 0.000 description 1
- 150000001674 calcium compounds Chemical class 0.000 description 1
- 239000000969 carrier Substances 0.000 description 1
- 239000012876 carrier material Substances 0.000 description 1
- 238000005229 chemical vapour deposition Methods 0.000 description 1
- FOJZPLNOZUNMJO-UHFFFAOYSA-M chloro(dimethyl)indigane Chemical compound [Cl-].C[In+]C FOJZPLNOZUNMJO-UHFFFAOYSA-M 0.000 description 1
- 239000004927 clay Substances 0.000 description 1
- 229910052570 clay Inorganic materials 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 150000001880 copper compounds Chemical class 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- NJLLQSBAHIKGKF-UHFFFAOYSA-N dipotassium dioxido(oxo)titanium Chemical compound [K+].[K+].[O-][Ti]([O-])=O NJLLQSBAHIKGKF-UHFFFAOYSA-N 0.000 description 1
- 239000000835 fiber Substances 0.000 description 1
- 229910052733 gallium Inorganic materials 0.000 description 1
- 150000002259 gallium compounds Chemical class 0.000 description 1
- 239000011491 glass wool Substances 0.000 description 1
- 229910021397 glassy carbon Inorganic materials 0.000 description 1
- 229910002804 graphite Inorganic materials 0.000 description 1
- 239000010439 graphite Substances 0.000 description 1
- 239000001307 helium Substances 0.000 description 1
- 229910052734 helium Inorganic materials 0.000 description 1
- SWQJXJOGLNCZEY-UHFFFAOYSA-N helium atom Chemical compound [He] SWQJXJOGLNCZEY-UHFFFAOYSA-N 0.000 description 1
- 229910052739 hydrogen Inorganic materials 0.000 description 1
- 239000001257 hydrogen Substances 0.000 description 1
- 150000002431 hydrogen Chemical class 0.000 description 1
- 150000002472 indium compounds Chemical class 0.000 description 1
- 239000011261 inert gas Substances 0.000 description 1
- 150000002484 inorganic compounds Chemical class 0.000 description 1
- 229910010272 inorganic material Inorganic materials 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 150000002506 iron compounds Chemical class 0.000 description 1
- 150000002642 lithium compounds Chemical class 0.000 description 1
- UBJFKNSINUCEAL-UHFFFAOYSA-N lithium;2-methylpropane Chemical compound [Li+].C[C-](C)C UBJFKNSINUCEAL-UHFFFAOYSA-N 0.000 description 1
- 229910052749 magnesium Inorganic materials 0.000 description 1
- 239000011777 magnesium Substances 0.000 description 1
- 150000002681 magnesium compounds Chemical class 0.000 description 1
- 229910052748 manganese Inorganic materials 0.000 description 1
- 239000011572 manganese Substances 0.000 description 1
- 150000002697 manganese compounds Chemical class 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000002488 metal-organic chemical vapour deposition Methods 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 229910052698 phosphorus Inorganic materials 0.000 description 1
- 239000011574 phosphorus Substances 0.000 description 1
- 239000011148 porous material Substances 0.000 description 1
- 239000010453 quartz Substances 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 1
- 229910010271 silicon carbide Inorganic materials 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 1
- 229910052712 strontium Inorganic materials 0.000 description 1
- CIOAGBVUUVVLOB-UHFFFAOYSA-N strontium atom Chemical compound [Sr] CIOAGBVUUVVLOB-UHFFFAOYSA-N 0.000 description 1
- 150000003438 strontium compounds Chemical class 0.000 description 1
- YWWDBCBWQNCYNR-UHFFFAOYSA-N trimethylphosphine Chemical class CP(C)C YWWDBCBWQNCYNR-UHFFFAOYSA-N 0.000 description 1
- JQPMDTQDAXRDGS-UHFFFAOYSA-N triphenylalumane Chemical compound C1=CC=CC=C1[Al](C=1C=CC=CC=1)C1=CC=CC=C1 JQPMDTQDAXRDGS-UHFFFAOYSA-N 0.000 description 1
- 150000003752 zinc compounds Chemical class 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/448—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for generating reactive gas streams, e.g. by evaporation or sublimation of precursor materials
- C23C16/4481—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for generating reactive gas streams, e.g. by evaporation or sublimation of precursor materials by evaporation using carrier gas in contact with the source material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G53/00—Conveying materials in bulk through troughs, pipes or tubes by floating the materials or by flow of gas, liquid or foam
- B65G53/04—Conveying materials in bulk pneumatically through pipes or tubes; Air slides
- B65G53/16—Gas pressure systems operating with fluidisation of the materials
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G53/00—Conveying materials in bulk through troughs, pipes or tubes by floating the materials or by flow of gas, liquid or foam
- B65G53/04—Conveying materials in bulk pneumatically through pipes or tubes; Air slides
- B65G53/16—Gas pressure systems operating with fluidisation of the materials
- B65G53/18—Gas pressure systems operating with fluidisation of the materials through a porous wall
- B65G53/22—Gas pressure systems operating with fluidisation of the materials through a porous wall the systems comprising a reservoir, e.g. a bunker
Definitions
- the present invention relates to a supply device that supplies an organometallic compound together with a carrier gas by causing the carrier gas to flow through a container filled with an organometallic compound that is solid at room temperature.
- MOCVD method metal organic chemical vapor deposition
- MOCVD method metal organic chemical vapor deposition
- Patent Document 1 As a supply device for gasifying and supplying a solid organometallic compound at room temperature, the one disclosed in Patent Document 1 is known.
- the supply device disclosed in Patent Document 1 includes a container filled with an organic metal compound, a carrier gas introduction tube inserted from the upper part of the container into the inside, and a disperser installed at the lower part of the tube. have.
- An organic compound gas and carrier gas discharge port is provided at the upper part of the container, and the lower part of the container is a narrow-diameter part with a smaller inner diameter than the upper part.
- Patent Document 1 Japanese Patent Publication No. 5-10320
- An object of the present invention is to provide an industrially suitable organometallic compound supply apparatus capable of stably supplying an organometallic compound that is solid at room temperature over a long period of time.
- An object of the present invention is to provide a first and second column type packed with an organometallic compound that is solid at room temperature. And a second container, and a communication member that communicates the insides of the first and second containers at their lower ends.
- a carrier gas inlet is provided in the upper part of the first container, and the second container The upper part of the container is provided with an outlet for a carrier gas containing an organometallic compound, which is solved by an organometallic compound supply device.
- the introduction port may include a gas introduction pipe attached to the first container so that the carrier gas introduced into the first container collides with the upper wall surface of the first container.
- the tip of the gas introduction pipe faces upward in the first container.
- the introduction port may include a distributor that disperses the carrier gas introduced into the first container.
- the disperser may have a baffle plate that disperses the carrier gas introduced into the first container by colliding with it, or has a perforated hole disposed in the first container. It may have a pipe or a filter placed inside the first container.
- the first container and the second container are arranged apart from each other.
- the connecting member may have a communication pipe that connects the first and second containers.
- the communication pipe can be composed of one or more straight pipes.
- an industrially suitable organometallic compound supply apparatus that can stably supply an organometallic compound that is solid at room temperature over a long period of time.
- FIG. 1 is a schematic cross-sectional view of an organometallic compound supply device according to a first embodiment of the present invention.
- FIG. 2 is a schematic cross-sectional view of a modification of the supply device shown in FIG.
- FIG. 3 is a schematic cross-sectional view of another modification of the supply device shown in FIG.
- FIG. 4 is a schematic cross-sectional view of an organometallic compound supply device according to a second embodiment of the present invention.
- FIG. 5 is a schematic cross-sectional view of an organometallic compound supply device according to a third embodiment of the present invention.
- FIG. 6 is a schematic cross-sectional view of a modification of the supply device shown in FIG. 7 is a schematic cross-sectional view of another modification of the supply device shown in FIG.
- FIG. 8 is a schematic cross-sectional view of another modification of the supply device shown in FIG.
- FIG. 9 is a front view showing the appearance of a specific example of the supply device according to the present invention.
- FIG. 10 is a rear view of the supply device shown in FIG.
- FIG. 11 is a right side view of the supply device shown in FIG.
- FIG. 12 is a left side view of the supply device shown in FIG.
- FIG. 13 is a plan view of the supply device shown in FIG.
- FIG. 14 is a bottom view of the supply device shown in FIG.
- FIG. 15 is a graph showing the test results of Example 1_1.
- FIG. 16 is a graph showing the test results of Example 1-2.
- FIG. 17 is a schematic cross-sectional view of the supply device used in Comparative Examples 1 and 2.
- FIG. 18 is a graph showing the test results of Comparative Example 1.
- FIG. 19 is a graph showing the test results of Example 2-1.
- FIG. 20 is a graph showing the test results of Example 3-1.
- the supply device is composed of two column-type containers 1 and 1 ′ arranged in parallel at a distance from each other, and a communication pipe 5 that connects the inside of the two containers 1 and 1 ′ at the lower end of the containers 1 and 1 ′. have.
- a gas inlet for introducing a carrier gas into the container 1 is provided at the upper end of one container 1
- a gas introduction pipe 2 is attached.
- a gas outlet pipe 3 that constitutes a gas inlet for leading the gas in the container 1 ′ to the outside is attached to the upper end of the other container 1 ′.
- a filling port 4 is provided in the middle of the gas introduction pipe 2 and the gas outlet pipe 3 to fill the container 1 and 1 ′ with a solid organometallic compound at room temperature. Yes.
- the filling port 4 is configured to be openable and closable. By opening the filling port 4, the organometallic compound can be filled into the containers 1 and 1 ′.
- the shape of the containers 1 and 1 ' is a column type, for example, a cylindrical shape, a triangular cylindrical shape, a rectangular cylindrical shape, a hexagonal cylindrical shape, etc. can be used.
- Shaped containers 1, 1 ' are preferably used.
- the shapes of the two containers 1 and 1 ′ may be the same or different from each other.
- the total capacity of the two containers 1, 1 ' is not particularly limited, but considering practicality, it is preferably in the range of 10-500 ml, more preferably in the range of 10-3000 ml, Particularly preferred is 25 to 1000 ml.
- the capacities of the containers 1 and 1 ′ may be the same or different from each other.
- the container 1 into which the carrier gas is introduced that is, the gas introducing pipe 2 is provided, and the capacity of the container 1 is set as the gas outlet pipe. It is desirable to make it larger than the capacity of the container 1 'provided with 3.
- the ratio of the capacity of the container 1 provided with the gas introduction pipe 2 to the capacity of the container 1 ′ provided with the gas outlet pipe 3 is preferably 1 to 80, more preferably. 1-40.
- the carrier gas flows in the containers 1, 1 'mainly in the axial direction of the containers 1, 1'. Therefore, the internal dimensions of container 1 and 1 'are high relative to the diameter so that the carrier gas flowing through container 1 and 1' can efficiently contact the organometallic compound in container 1 and 1 '.
- the ratio is preferably 0.8-10.0, more preferably 1.2-10.0. This value assumes that containers 1 and 1 'are cylindrical, but if they are not cylindrical, the cross-sectional area is equal to the cross-sectional area, and the circular diameter of the area can be obtained.
- the communication pipe 5 communicates the inside of the two containers 1, 1 'so that gas can flow between them. If it is a thing, its shape and structure are not particularly limited. For example, by bending one straight pipe, two containers 1, 1 'are formed into a predetermined shape that can be connected at the lower end, and multiple straight pipes are joined together to have a predetermined shape. Can be used as the communication pipe 5. From the viewpoint of the design of the communication pipe 5, it is desirable to configure the communication pipe 5 as a straight pipe.
- the length of the communication pipe 5 is not particularly limited, and can be appropriately designed according to the size and arrangement of the two containers 1, 1 '.
- the diameter of the communication pipe 5 is not particularly limited as long as the cross-sectional area of the communication pipe 5 is smaller than the cross-sectional area of the container 1, 1 'at the connection with the container 1, 1'.
- the shape, size, and the mounting angle with respect to the containers 1 and 1' are not particularly limited.
- organometallic compound that is solid at room temperature used in the present invention examples include lithium compounds such as tert-butyllithium; trimethylindium, dimethylchloroindium, cyclopentagenylindium, trimethylindium'trimethylarsine Organic indium compounds such as adducts, trimethylindium and trimethylphosphine adducts; Organic zinc compounds such as ethyl phosphite iodide, ethylcyclopentagenzyl zinc and cyclopentagenzyl zinc; methyl dichroic aluminum, triphenylaluminum, etc.
- lithium compounds such as tert-butyllithium
- trimethylindium, dimethylchloroindium, cyclopentagenylindium trimethylindium'trimethylarsine
- Organic indium compounds such as adducts, trimethylindium and trimethylphosphine adducts
- Organic zinc compounds such as ethyl phosphite iodide, e
- Organo-aluminum compounds Organic gallium compounds such as methyl dichroic gallium, dimethyl chloro-gallium, dimethyl bromogallium; Magnesium compounds such as bis (cyclopentagenyl) magnesium; Triphenyl bisma Bismuth compounds such as; Manganese compounds such as bis (cyclopentagenyl) manganese; Iron compounds such as Huaikousen; Bis (acetylacetonato) barium, dipivaloylmethanatobarium ⁇ 1, 10-phenantine phosphorus adduct, etc.
- the supply device of the present invention may be applicable to an organic compound that does not contain a metal, a metal that contains or does not contain a metal, and an inorganic compound.
- the organometallic compound may be supported on a carrier inert to the organometallic compound.
- Examples of the carrier material used in such a case include alumina, silica, clay, glassy carbon, graphite, potassium titanate, sponge titanium, quartz, silicon nitride, boron nitride, silicon carbide, stainless steel, Anoleminium, nickel, titanium, tandastain, fluororesin, glass, etc. are used. These carriers may be used alone or in admixture of two or more.
- the shape of the carrier is not particularly limited, and for example, an indeterminate shape, round shape, square shape, spherical shape, fiber shape, net shape, spring shape, coil shape, cylindrical shape, or the like can be used.
- the specific surface area of the support be as large as possible in order to efficiently bring the organometallic compound supported on the support into contact with the carrier gas.
- Specific examples of such a carrier include, for example, alumina hole packing, Raschig rings (made of glass, Teflon (registered trademark)), helipack (made of glass, stainless steel), Dixon packing (made of stainless steel), Fengke (made of glass). , Sponge titanium, stainless sintered element, glass wool, and the like.
- the filling of the organometallic compound into the filling device can be performed by using a generally known method.
- the organometallic compound can be filled into the containers 1 and 1 ′ by introducing the organometallic compound as it is from the filling port 4 in an inert gas atmosphere.
- the carrier gas introduced into the container 1, 1 ' is not particularly limited as long as it is inert with respect to the organometallic compound filled in the container 1, 1'.
- argon, nitrogen Helium, hydrogen, etc. can be used. These carrier gases may be used alone or in combination of two or more.
- the supply device of the present embodiment described above connects the gas introduction pipe 2 to the carrier gas source and discharges the gas in a state in which the organic metal compound is filled into the containers 1 and 1 'from the respective filling ports 4.
- the tube 3 is connected to a vapor phase growth apparatus.
- Carrier gas is introduced from the carrier gas source to the supply device while the supply device is maintained at a constant temperature.
- the introduced carrier gas is routed from container 1 to communication pipe 5 to container 1 '.
- the gas is supplied from the gas outlet pipe 3 to the vapor phase growth apparatus.
- the organic metal compound vaporized in each container 1, 1 ′ accompanies the flow of the carrier gas, whereby the vaporized organic metal compound is supplied from the supply device to the vapor phase growth apparatus together with the carrier gas.
- the carrier gas efficiently contacts with the organometallic compound, and the vaporized organometallic compound can be satisfactorily carried by the carrier gas. It can be supplied stably over a long period of time.
- the filling port 4 is provided in the middle part of the gas introduction pipe 2 and the gas outlet pipe 3 .
- the filling port 4 of the container 1 ′ is provided separately from the gas outlet pipe 3, or the filling port 4 of both containers 1, 1 ′ is provided separately from the gas introduction pipe 2 and the gas outlet pipe 3.
- FIG. 4 shows an organometallic compound supply apparatus according to a second embodiment of the present invention.
- the shape of the gas introduction pipe 2 connected to the container 1 is different from that of the first embodiment. More specifically, the gas introduction pipe 2 bends inside the container 1 so that the carrier gas introduced into the container 1 collides with at least the upper wall surface of the upper wall surface and the side wall surface inside the container 1, The spout, which is the tip, faces upward.
- Other configurations are the same as those in the first embodiment, and thus detailed description thereof is omitted.
- the carrier gas immediately after being introduced into the container 1 from the gas introduction pipe 2 collides with the upper wall surface inside the container 1.
- the introduced carrier gas is dispersed throughout the interior of the container 1, and a carrier gas flow can be formed throughout the interior of the container 1.
- the carrier gas containing the organometallic compound can be supplied more stably.
- the distal end portion of the gas introduction pipe 2 is bent so as to introduce the carrier gas substantially perpendicularly to the upper wall surface of the container 1, and the carrier into the container 1
- the gas introduction angle is not particularly limited as long as the carrier gas introduced into the container 1 collides with at least the upper wall surface of the upper wall surface and the side wall surface inside the container 1.
- the filling port 4 of the container 1 is configured separately from the gas introduction pipe 2.
- the capacity of the two containers 1, 1 ' is different.
- the filling port 4 of the container 1 may be provided in the middle part of the gas introduction pipe 2, and the capacity of the two containers 1, 1 ′ may be the same.
- the filling port 4 of the container 1 ′ may be configured separately from the gas outlet pipe 3.
- 5 to 8 show an organometallic compound supply apparatus according to a third embodiment of the present invention.
- the supply device includes a disperser 6 that disperses the carrier gas in the container 1 inside the container 1 into which the carrier gas is introduced.
- the disperser 6 is arranged inside the container 1, and the structure and material thereof are not limited as long as the introduced gas can be dispersed in the container 1.
- the size of the disperser 6 is appropriately selected depending on the shape and size of the container 1, the amount of carrier gas to be introduced, the thickness of the gas introduction pipe 2, and the like.
- Examples of the disperser 6 include a filter made of sintered metal or glass, a net, a two-cam, a baffle plate, a perforated pipe, and the like, and preferably a sintered metal filter, a baffle plate, and a perforated pipe. More preferably, a baffle plate or a perforated pipe can be used.
- baffle plate When a baffle plate is used as the disperser 6, disposing the baffle plate in parallel with the upper wall surface of the container 1 allows the carrier gas introduced into the container 1 to be well dispersed in the container 1. I like it.
- a perforated pipe As the disperser 6, it is possible to arrange the perforated pipe so that the hole formed in the perforated pipe faces in a direction perpendicular to the upper wall surface of the container 1. It is preferable when it is dispersed and introduced into the inside.
- the disperser 6 is configured by a baffle plate that is processed into a cone shape with a recessed central portion.
- the baffle plate is arranged below the gas introduction pipe 2 in parallel with the upper wall surface of the container 1 with the recessed portion facing the jet port of the gas introduction pipe 2.
- the carrier gas introduced into the container 1 from the gas introduction pipe 2 collides with the baffle plate, whereby the carrier gas immediately after being introduced into the container 1 is dispersed in the container 1.
- the disperser 6 is configured by a perforated pipe having a plurality of holes formed on the peripheral surface, and the perforated pipe has a peripheral surface that is in contact with the upper wall surface of the container 1. They are arranged at right angles. As a result, the hole formed in the perforated pipe faces in a direction perpendicular to the upper wall surface of the container 1.
- the number and size of holes provided in the perforated pipe are not particularly limited. Also, at the hole position Although not particularly limited, in order to disperse the carrier gas more uniformly in the container 1, it is preferable that holes are formed over the entire circumference of the nozzle.
- the disperser 6 composed of a perforated pipe can be configured as a part of the gas introduction pipe 2 by making a plurality of holes in the peripheral surface of the gas introduction pipe 2. Alternatively, the disperser 6 made of a perforated pipe may be formed of a member different from the gas introduction pipe 2.
- the carrier gas passes from the gas introduction pipe 2 through the disperser 6 which is a perforated pipe, and is distributed and introduced into the perforation force container 1 provided on the peripheral surface thereof.
- the disperser 6 is configured by a baffle plate made of a flat plate.
- the baffle plate is arranged parallel to the upper wall surface of the container 1 so as to face the gas introduction pipe 2 below the gas introduction pipe 2.
- the carrier gas introduced into the container 1 from the gas introduction pipe collides with the baffle plate, whereby the carrier gas immediately after being introduced into the container 1 is dispersed into the container 1.
- the disperser 6 is composed of a filter attached to the lower end of the gas introduction pipe 2.
- the carrier gas is introduced into the container 1 through the filter, and is distributed and introduced into the container 1 by passing through the fine holes of the filter.
- the filling port 4 of the container 1 may be provided in the middle part of the gas introduction pipe 2, or the capacity of the two containers 1, 1 ′ may be the same. Good.
- the filling port 4 of the container 1 ′ is configured separately from the gas outlet pipe 3.
- FIGs. 9 to 14 specifically show the external appearance of an example of a supply device configured according to the present invention.
- 9 is a front view thereof
- FIG. 10 is a rear view thereof
- FIG. 11 is a right side view thereof
- FIG. 12 is a left side view thereof
- FIG. 13 is a plan view thereof
- FIG. Fig. 9 ⁇ Supply equipment shown in 14
- the container has two cylindrical containers, and the capacity of the container into which the carrier gas is introduced is larger than the capacity of the container from which the carrier gas is led out.
- the filling port is provided separately from the gas introduction pipe.
- the insides of the two containers are connected by a communication pipe connected to the lower end of the container.
- the communication pipe is a combination of straight pipes.
- the concentration of trimethylindium flowing out from the gas outlet 3 was measured with an ultrasonic gas concentration meter (trade name: Piezocon (manufactured by Lorex)).
- Trimethylindium supply stability test (filling amount: about 25 g) Trimethylindium is prepared as a solid organometallic compound at room temperature, and helipack (stainless steel, 1.3 mm x 2.5 mm x 2.3 mm) is used as a carrier. (Manufactured by Tokyo Special Wire Mesh Co., Ltd.) In a Teflon (registered trademark) container with an internal volume of 250 ml, 38 ml of Helipac and 33 g of trimethylindium were added and heated to 90 ° C to completely melt trimethylindium. After cooling to room temperature, trimethylindium was supported on the helipac, then crushed with a spatula, sieved with a 4 mesh and 20 mesh sieve, and a helipad with a particle size of 0.84 to 4.76 mm.
- 71 g of helium-pack-supported trimethylindium having a particle size of 0.84 to 4.76 mm was filled in two containers 1 and 1 ′ of the supply device configured as shown in FIG. 1 in a nitrogen atmosphere. Filled from 4. Containers 1 and 1 ′ were both cylindrical with the same size (inner diameter: 17.5 mm, height: 135 mm, internal volume: 31 ml).
- the communication pipe 5 was a straight pipe with an inner diameter of 4.3 mm.
- Containers 1, 1 'and communication pipe 5 were made of stainless steel.
- This supply device was installed in a thermostat kept at 30 ° C, and argon gas as a carrier gas was introduced into the container 1 from the gas introduction pipe 2 at a flow rate of 300 ml per minute.
- the supply amount of trimethylindium obtained from the gas outlet tube 3 of the container 1 ′ was about 0.38 g per hour, and the supply rate was stable up to 85% of the usage rate (FIG. 15).
- Example 1 2 Trimethylindium supply stability test (filling amount: about 25 g)
- the volume of the container 1 into which the carrier gas is introduced is larger than the volume of the container 1 ′ from which the carrier gas is derived, and the filling port 4 of the container 1 is connected to the gas inlet 2.
- a stainless steel supply device was used.
- the container 1 had an inner diameter of 54 mm, a height of 135 mm, and an internal volume of 230 ml.
- the size of the container 1 ′ is the same as the container 1 ′ used in Example 1-1.
- the communication pipe 5 was also a straight pipe having an inner diameter of 4.3 mm, as in Example 1-1.
- This supply device was filled with 71 g of trimethylindium supported on a helipad having a particle diameter of 0.84 to 4.76 mm obtained in the same manner as in Example 1-1, through a filling port 4 in a nitrogen atmosphere.
- This supply device was installed in a thermostat kept at 30 ° C, and argon gas was flowed at 300 ml per minute as a carrier gas from the gas introduction pipe 2. As a result, the amount of trimethylindium supplied from the gas outlet pipe 3 was about 0.38 g per hour, and the supply rate was stable up to 80% of the usage rate (Fig. 16).
- the configuration of the container 1 into which the carrier gas was introduced was the same as that used in Example 11 except that the inner diameter was 37.1 mm, the height was 1 35 mm, and the internal volume was 138 ml.
- a stainless steel supply device (see Fig. 2) was used. This supply device was filled with 71 g of helium-pack-supported trimethylindium having a particle size of 0.84 to 4.76 mm obtained in the same manner as in Example 1-1 through a filling port 4 in a nitrogen atmosphere.
- This supply device was installed in a thermostat kept at 30 ° C, and argon gas was allowed to flow through the gas introduction pipe 2 as a carrier gas at a rate of 300 ml per minute. As a result, the amount of trimethylindium supplied from the gas outlet pipe 3 was about 0.40 g per hour, and the supply rate was stable up to 82% of the usage rate.
- Example 1_1 a particle size of 0.84 to 4.76 obtained in the same manner as in Example 1-1, except that sponge titanium (particle size: 0.84 to 2.00 mm (manufactured by Toho Titanium Co.)) was used as a carrier supporting trimethylindium. 75 g of trimethylindium with sponge titanium on mm was charged through the filling port 4 under a nitrogen atmosphere into the same feeding apparatus used in Example 1_1.
- the supply device is installed in a thermostatic chamber maintained at 30 ° C, and the carrier gas is supplied from the gas introduction pipe 2. Then, argon gas was flowed at 300 ml per minute. As a result, the amount of trimethylindium supplied from the gas outlet pipe 3 was about 0.40 g per hour, and the supply rate was stable up to 87% of the usage rate.
- Dixon packing (stainless steel, ⁇ 3.0 mm, height 3.0 mm (Okutani Wire Mesh Co., Ltd.)) was used as a carrier for supporting trimethylindium.
- 53 g of Dickson packing-carrying trimethylenoleinite having a particle diameter of 0.84 to 4.76 mm obtained in the above was filled into the same feeding apparatus used in Example 1-1 through the filling port 4 under a nitrogen atmosphere.
- This supply device was installed in a thermostat kept at 30 ° C, and argon gas was flowed at 300 ml per minute as a carrier gas from the gas introduction pipe 2. As a result, the amount of trimethylindium supplied from the gas outlet pipe 3 was about 0.40 g per hour, and the supply rate was stable up to 84% of the usage rate.
- Example 14 152 g of sponge titanium-supporting trimethylindium having a particle size of 0.84 to 4.75 mm was used as the supply unit in the same manner as Example 14 except that the supply unit used in Example 12 was used as the supply unit. Filled and tested for feed stability. As a result, the supply amount of trimethylindium was about 0.40 g per hour, and the supply rate was stable up to 85% of the usage rate.
- Example 16 except that the amount of trimethylindium supported on sponge titanium was changed to 211 g, the supply device was filled with sponge titanium-supported trimethylindium having a particle size of 0.84 to 4.75 mm in the same manner as in Example 1-6. A supply stability test was conducted. As a result, the supply amount of trimethylindium was about 0.40 g per hour, and the supply rate was stable up to 85% of the usage rate.
- Example 1_1 In the same manner as in Example 1_1 except that the amount of argon gas introduced was 600 ml / min in Example 1-1, 71 g of helium-pack-supported trimethylindium having a particle size of 0.84-4.75 mm was supplied. The container was filled and a feed stability test was performed. As a result, the supply amount of trimethylindium was about 0.80 g per minute, and the supply rate was stable up to 84% of the usage rate.
- Example 1 _4 75 g of tritium indium with sponge titanium having a particle size of 0.84 to 4.75 mm was charged into the supply device in the same manner as Example 1 _4 except that the amount of argon gas introduced was 600 ml per minute. A sex test was performed. As a result, the supply amount of trimethylindium was about 0.80 g per minute, and the supply rate was stable up to 87% of the usage rate.
- Example 1_5 53 g of Dixon packing-supported trimethylindium having a particle size of 0.84 to 4.75 mm was charged into the supply device in the same manner as Example 1_5 except that the amount of argon gas introduced was 600 ml per minute. A stability test was performed. As a result, the supply amount of trimethylindium was about 0.80 g per minute, and the supply rate was stable up to 83% of the usage rate.
- Example 16 the same procedure as in Example 16 except that the amount of argon gas introduced was 600 ml / min. A sex test was performed. As a result, the supply amount of trimethylindium was about 0.80 g per hour, and the supply rate was stable up to 85% of the usage rate.
- Example 1-3 the carrier of trimethylindium is sponge titanium, and the temperature in the thermostatic chamber to which the supply device is attached is set to 20 ° C.
- a supply device was filled with 151 g of trimethylindium with 4.76 mm sponge titanium and a supply stability test was conducted. As a result, the supply amount of trimethylindium was about 0.19 g per hour, and the supply rate was stable up to 85% of the usage rate.
- Example 1-12 except that the amount of argon gas introduced was 600 ml per minute, in the same manner as in Example 1-11 12, 51 g of trimethylindium with sponge titanium having a particle size of 0.84 to 4.76 mm was charged into the supply device. A supply stability test was conducted. As a result, the supply amount of trimethylindium was about 0.38 g per hour, and the supply rate was stable up to 85% of the usage rate. [0070] (Comparative Example 1) Trimethylindium supply stability test (filling amount: about 25 g) As shown in Fig.
- the gas outlet pipe 3 extends to near the bottom wall of the container 1.
- This supply apparatus was installed in a thermostat kept at 30 ° C, and argon gas was flowed at 300 ml / min as a carrier gas from the gas introduction pipe 2. As a result, the supply amount of trimethylindium was approximately 0.36 g per hour, and the supply rate was stable only to 55% of the usage rate (Fig. 18).
- Comparative Example 1 as the carrier for supporting trimethylindium, a sponge titanium carrying trimethylindium having a particle diameter of 0.84 to 4.76 mm was used in the same manner as in Comparative Example 1 except that the same sponge titanium as in Example 1-4 was used. 77 g was charged through the filling port 4 into the feeding apparatus in a nitrogen atmosphere.
- This supply device was installed in a thermostat kept at 30 ° C, and argon gas was allowed to flow from the gas introduction pipe 2 at a rate of 300 ml per minute. As a result, the supply amount of trimethylindium was about 0.39 g per hour, and the supply rate was stable only up to 56% of the usage rate.
- Table 1 summarizes the main test conditions and test results of Examples 1 to 113 and Comparative Examples 1 and 2 described above.
- Example 2-1 Trimethylindium supply stability test (filling amount: about 25 g)
- 72 g of helium-pack-supported trimethylindium having a particle size of 0.84 to 4.76 mm was obtained.
- the obtained helipak-supported trimethylindium (72 g) was filled through a filling port 4 into a stainless steel supply device having two cylindrical containers 1 and 1 ′ as shown in FIG.
- the container 1 provided with the gas introduction pipe 2 had an inner diameter of 37.1 mm, a height of 135 mm, and an internal volume of 138 ml.
- the container 1 ′ provided with the gas outlet pipe 3 had an inner diameter of 17.5 mm, a height of 135 mm, and an internal volume of 31 ml.
- Communication pipe 5 is a straight pipe with an inner diameter of 4.3 mm. Consists of.
- the gas introduction pipe 2 is bent inside the container 1 so as to introduce the carrier gas perpendicularly to the upper wall surface (introduction angle: 90 °).
- This supply apparatus was installed in a thermostat kept at 30 ° C, and argon gas was introduced into the container 1 as a carrier gas from the gas introduction pipe 2 at a flow rate of 300 ml per minute.
- the supply amount of trimethylindium obtained from the gas outlet tube 3 of the container 1 ′ was about 0.40 g per hour, and the supply rate was stable up to 89% of the usage rate (FIG. 19).
- Example 2-1 except that sponge titanium (particle size: 0.84 to 2.00 mm (manufactured by Toho Titanium)) was used as the carrier supporting trimethylindium, a particle size of 0.84 was used.
- a supply device was filled with 77 g of trimethylindium carrying titanium sponge of ⁇ 4.76 mm, and a supply stability test was conducted. As a result, the supply amount of trimethylindium was about 0.40 g per minute, and the supply rate was stable up to 92% of the usage rate.
- Example 2-1 the same procedure as in Example 2-1, except that Dixon packing ( ⁇ : 3.0mm, height: 3.0mm (manufactured by Okutani Wire Mesh Co., Ltd.)) was used as the carrier supporting trimethylindium. Then, 51 g of Dickson packing-supported trimethylindium having a particle size of 0.84 to 4.76 mm was filled in the feeder, and a supply stability test was performed. As a result, the supply amount of trimethylindium was about 0.40 g per minute, and the supply rate was stable up to 89% of the usage rate.
- Dixon packing ⁇ : 3.0mm, height: 3.0mm (manufactured by Okutani Wire Mesh Co., Ltd.)
- Example 2-1 51 g of Dickson packing-supported trimethylindium having a particle size of 0.84 to 4.76 mm was used as the supply device in the same manner as in Example 2-1, except that the amount of helium pack-supported trimethylindium was 140 g. Filled and tested for feed stability. As a result, the supply amount of trimethylindium was about 0.40 g per minute, and the supply rate was stable up to 89% of the usage rate.
- Example 2-2 153 g of sponge titanium-supported trimethylindium having a particle diameter of 0.84 to 4.76 mm was used as a supply device in the same manner as in Example 2-2, except that the amount of trimethylindium supported on sponge titanium was 153 g. Filled and tested for feed stability. as a result, The supply amount of trimethylindium was about 0.40 g per minute, and the supply rate was stable up to 92% of the usage rate.
- Example 2-1 except that the amount of argon gas introduced was 600 ml per minute, 72 g of helium-pack-supported trimethylindium having a particle size of 0.84 to 4.76 mm was charged into the supply device in the same manner as Example 2_1. A supply stability test was conducted. As a result, the supply amount of trimethylindium was about 0.80 g per minute, and the supply rate was stable up to 87% of the usage rate.
- Example 2-2 77 g of tritium indium with sponge titanium having a particle size of 0.84 to 4.76 mm was charged into the supply apparatus in the same manner as in Example 2_2 except that the amount of argon gas introduced was 600 ml per minute. A supply stability test was conducted. As a result, the supply amount of trimethylindium was about 0.80 g per minute, and the supply rate was stable up to 92% of the usage rate.
- Example 2-3 5 lg of Dixon packing-supported trimethylindium having a particle size of 0.84 to 4.76 mm was charged into the supply device in the same manner as in Example 23, except that the amount of argon gas introduced was 600 ml per minute. A supply stability test was conducted. As a result, the supply amount of trimethylindium was about 0.80 g per minute, and the supply rate was stable up to 88% of the usage rate.
- Example 2-4 except that the amount of argon gas introduced was 600 ml per minute, 140 g of helium-pack-supported trimethylindium having a particle size of 0.84 to 4.76 mm was charged into the supply device in the same manner as in Example 24. A supply stability test was conducted. As a result, the supply amount of trimethylindium was about 0.80 g per minute, and the supply rate was stable up to 88% of the usage rate.
- Example 2-5 153 g of sponge titanium-supporting trimethylindium having a particle size of 0.84 to 4.76 mm was charged into the supply apparatus in the same manner as Example 2_5 except that the amount of argon gas introduced was 600 ml per minute. A supply stability test was conducted. As a result, the supply amount of trimethylindium was about 0.80 g per minute, and the supply rate was stable up to 91% of the usage rate.
- Table 2 summarizes main test conditions and test results of Examples 1_1 to 1_10. [0088] [Table 2]
- Example 3 Trimethylindium supply stability test (filling amount: about 25 g)
- 71 g of helipack-supported trimethylindium having a particle size of 0.84 to 4.76 mm was obtained.
- the obtained helipak-supported trimethylindium 7 lg was filled through a filling port 4 into a stainless steel supply device having two cylindrical containers 1 and 1 ′ as shown in FIG.
- the container 1 in which the gas introduction pipe 2 can be provided had an inner diameter force S37.1 mm, a height force Sl35 mm, and an internal volume force Sl38 ml.
- the container 1 ′ provided with the gas outlet pipe 3 had an inner diameter of Sl7.5 mm, a height of 135 mm, and an internal volume of 31 ml.
- the communication pipe 5 is a straight pipe with an inner diameter of 4.3 mm.
- a disperser 6 composed of a cone-shaped baffle plate having a recessed central part is disposed inside the container 1, below the gas introduction pipe 2, a disperser 6 composed of a cone-shaped baffle plate having a recessed central part is disposed.
- This supply device was installed in a thermostat kept at 30 ° C, and argon gas was introduced into the container 1 as a carrier gas from the gas introduction pipe 2 at a flow rate of 300 ml per minute.
- argon gas was introduced into the container 1 as a carrier gas from the gas introduction pipe 2 at a flow rate of 300 ml per minute.
- the container 1 ' The amount of trimethylindium obtained from the lead-out tube 3 was about 0.40 g per hour, and the supply rate was stable up to 89% of the usage rate (Fig. 20).
- Example 3-1 the same procedure as in Example 3-1, except that Dixon packing ( ⁇ : 3.0mm, height: 3.0mm (Okutani Wire Mesh Co., Ltd.)) was used as the carrier supporting trimethylindium. Then, 52 g of Dickson packing-supported trimethylindium having a particle size of 0.84 to 4.76 mm was filled in the feeding device, and a feeding stability test was performed. As a result, the supply amount of trimethylindium was about 0.40 g per minute, and the supply rate was stable up to 89% of the usage rate.
- Dixon packing ⁇ : 3.0mm, height: 3.0mm (Okutani Wire Mesh Co., Ltd.)
- Example 3-1 except that sponge titanium (particle size: 0.84 to 2.00 mm (manufactured by Toho Titanium)) was used as the carrier supporting trimethylindium, a particle size of 0.84 was used.
- a supply device was filled with 75 g of trimethylindium supported with sponge titanium of ⁇ 4.76 mm, and a supply stability test was conducted. As a result, the supply amount of trimethylindium was about 0.40 g per minute, and the supply rate was stable up to 93% of the usage rate.
- helipak-supported trimethylindium 71 having a particle size of 0.84 to 4.76 mm was obtained.
- the obtained helipak-supported trimethylindium (71 g) was filled through a filling port 4 into a stainless steel supply device having two cylindrical containers 1 and 1 ′ as shown in FIG.
- the containers 1, 1 ′ and the communication pipe 5 are the same as those used in Example 3-1.
- the gas introduction pipe 2 is integrally provided with a disperser 6 made of a perforated pipe.
- This supply device was installed in a thermostat kept at 30 ° C, and argon gas was introduced into the container 1 as a carrier gas from the gas introduction pipe 2 at a flow rate of 300 ml per minute.
- the supply amount of trimethylindium obtained from the gas outlet tube 3 of the container 1 ′ was about 0.40 g per hour, and the supply rate was stable up to 89% of the usage rate.
- Example 1-1 In the same manner as in Example 1-1, helipak-supported trimethylindium 71 having a particle size of 0.84 to 4.76 mm was obtained. The resulting helipack-supported trimethylindium 7 lg was added in a nitrogen atmosphere as shown in FIG.
- a stainless steel supply device having two cylindrical containers 1 and 1 ′ as shown in FIG.
- the containers 1, 1 ′ and the communication pipe 5 are the same as those used in Example 3-1.
- a disperser 6 made of a flat plate is disposed below the gas introduction pipe 2.
- This supply apparatus was installed in a thermostat kept at 30 ° C, and argon gas was introduced into the container 1 as a carrier gas from the gas introduction pipe 2 at a flow rate of 300 ml per minute.
- the supply amount of trimethylindium obtained from the gas outlet tube 3 of the container 1 ′ was about 0.40 g per hour, and the supply rate was stable up to 89% of the usage rate.
- Example 1-1 helipak-supported trimethylindium 71 having a particle size of 0.84 to 4.76 mm was obtained.
- the obtained Helipak-supported trimethylindium (71 g) was filled through a filling port 4 into a stainless steel supply device having two cylindrical containers 1 and 1 ′ as shown in FIG.
- the containers 1, 1 ′ and the communication pipe 5 are the same as those used in Example 3-1.
- a disperser 6 composed of a sintered metal filter is attached to the lower end of the gas introduction pipe 2.
- This supply device was installed in a thermostat kept at 30 ° C, and argon gas was introduced into the container 1 as a carrier gas from the gas introduction pipe 2 at a flow rate of 300 ml per minute.
- the supply amount of trimethylindium obtained from the gas outlet tube 3 of the container 1 ′ was about 0.40 g per hour, and the supply rate was stable up to 88% of the usage rate.
- Example 3-3 75 g of trimethylindium carrying sponge titanium having a particle size of 0.84 to 4.76 mm was supplied in the same manner as Example 3-3, except that a supply device having different dimensions of containers 1 and 1 ′ was used.
- the equipment was filled and a feed stability test was performed.
- the dimensions of the container 1 were an inner diameter: 55 mm, a height: 135 mm, and an internal volume of 302 ml, and the dimensions of the container 1 ′ were an inner diameter: 23 mm, a height of 135 mm, and an internal volume of 53 ml.
- the supply amount of trimethylindium was 0.40 g per minute, and the supply rate was stable up to 92% of the usage rate.
- Example 3-3 the filling amount of trimethylindium carrying sponge titanium was set to 150 g.
- 153 g of sponge titanium-supporting trimethylindium having a particle size of 0.84 to 4.76 mm was filled in a supply device, and a supply stability test was performed.
- the supply amount of trimethylindium was about 0.40 g per minute, and the supply rate was stable up to 93% of the usage rate.
- Example 3-1 0.84 ⁇ 4.76 mm carrier-supported trimethylindium was filled in a feeding device under a nitrogen atmosphere, and a feeding stability test was performed.
- Table 3 summarizes the main test conditions and test results of Example 3_ :! to 3-22.
- Indium carrier Trimethyl supply Supply device ⁇ Dish tank Argon Stable use Filling amount ⁇ Indium device Internal volume Gas amount Ratio ' 3 amount *!
- ⁇ 3 ⁇ 4 2 Indicates the total amount of carrier and trimethylindium charged in the feeder.
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- General Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Chemical Vapour Deposition (AREA)
- Air Transport Of Granular Materials (AREA)
- Feeding, Discharge, Calcimining, Fusing, And Gas-Generation Devices (AREA)
Abstract
Description
Claims
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020147014023A KR20140075019A (ko) | 2006-05-30 | 2007-05-30 | 유기금속 화합물의 공급 장치 |
JP2008517972A JP5509593B2 (ja) | 2006-05-30 | 2007-05-30 | 有機金属化合物の供給装置 |
US12/302,796 US20090159003A1 (en) | 2006-05-30 | 2007-05-30 | Device for supplying organic metal compound |
Applications Claiming Priority (10)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2006149395 | 2006-05-30 | ||
JP2006-149395 | 2006-05-30 | ||
JP2006-353881 | 2006-12-28 | ||
JP2006353880 | 2006-12-28 | ||
JP2006353881 | 2006-12-28 | ||
JP2006353879 | 2006-12-28 | ||
JP2006-353879 | 2006-12-28 | ||
JP2006-353880 | 2006-12-28 | ||
JP2007-104886 | 2007-04-12 | ||
JP2007104886 | 2007-04-12 |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2007139159A1 true WO2007139159A1 (ja) | 2007-12-06 |
Family
ID=38778677
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/JP2007/061005 WO2007139159A1 (ja) | 2006-05-30 | 2007-05-30 | 有機金属化合物の供給装置 |
Country Status (6)
Country | Link |
---|---|
US (1) | US20090159003A1 (ja) |
JP (1) | JP5509593B2 (ja) |
KR (2) | KR20090018095A (ja) |
CN (1) | CN103350905A (ja) |
TW (1) | TWI400370B (ja) |
WO (1) | WO2007139159A1 (ja) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2009059871A (ja) * | 2007-08-31 | 2009-03-19 | Sumitomo Chemical Co Ltd | 有機金属化合物供給容器 |
JP2010248628A (ja) * | 2009-03-27 | 2010-11-04 | Ube Ind Ltd | 有機金属化合物の供給装置 |
JP2011202199A (ja) * | 2010-03-24 | 2011-10-13 | Ube Industries Ltd | 有機金属化合物の供給装置 |
JP2013509736A (ja) * | 2009-11-02 | 2013-03-14 | シグマ−アルドリッチ・カンパニー、エルエルシー | 蒸発器 |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP6237882B2 (ja) * | 2014-03-27 | 2017-11-29 | 宇部興産株式会社 | 有機金属化合物含有ガスの供給装置 |
KR20180063242A (ko) * | 2015-10-06 | 2018-06-11 | 엔테그리스, 아이엔씨. | 고체 전구체의 저온 소결 |
KR102286480B1 (ko) * | 2018-11-27 | 2021-08-06 | 주식회사 레이크머티리얼즈 | 이중 구조의 유기금속 화합물 공급 장치 |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6164417U (ja) * | 1984-09-29 | 1986-05-01 | ||
JPH01159630U (ja) * | 1989-03-27 | 1989-11-06 | ||
JP2005033146A (ja) * | 2003-07-11 | 2005-02-03 | Tosoh Finechem Corp | 固体有機金属化合物の充填方法および充填容器 |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US1234567A (en) * | 1915-09-14 | 1917-07-24 | Edward J Quigley | Soft collar. |
US6444038B1 (en) * | 1999-12-27 | 2002-09-03 | Morton International, Inc. | Dual fritted bubbler |
EP1160355B1 (en) * | 2000-05-31 | 2004-10-27 | Shipley Company LLC | Bubbler |
US7186385B2 (en) * | 2002-07-17 | 2007-03-06 | Applied Materials, Inc. | Apparatus for providing gas to a processing chamber |
US7547363B2 (en) * | 2003-07-08 | 2009-06-16 | Tosoh Finechem Corporation | Solid organometallic compound-filled container and filling method thereof |
UA86810C2 (ru) * | 2004-05-20 | 2009-05-25 | Акцо Нобель Н.В. | Барботер для обеспечения испарения вещества в процессе химического осаждения из паровой фазы |
JP4456947B2 (ja) * | 2004-07-09 | 2010-04-28 | 新日鉄エンジニアリング株式会社 | 気泡塔型フィッシャー・トロプシュ合成スラリー床反応システム |
US8673413B2 (en) * | 2006-01-27 | 2014-03-18 | Tosoh Finechem Corporation | Method for packing solid organometallic compound and packed container |
-
2007
- 2007-05-30 CN CN2013102382913A patent/CN103350905A/zh active Pending
- 2007-05-30 TW TW096119263A patent/TWI400370B/zh not_active IP Right Cessation
- 2007-05-30 US US12/302,796 patent/US20090159003A1/en not_active Abandoned
- 2007-05-30 KR KR1020087029774A patent/KR20090018095A/ko active Search and Examination
- 2007-05-30 JP JP2008517972A patent/JP5509593B2/ja active Active
- 2007-05-30 WO PCT/JP2007/061005 patent/WO2007139159A1/ja active Application Filing
- 2007-05-30 KR KR1020147014023A patent/KR20140075019A/ko not_active Application Discontinuation
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6164417U (ja) * | 1984-09-29 | 1986-05-01 | ||
JPH01159630U (ja) * | 1989-03-27 | 1989-11-06 | ||
JP2005033146A (ja) * | 2003-07-11 | 2005-02-03 | Tosoh Finechem Corp | 固体有機金属化合物の充填方法および充填容器 |
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2009059871A (ja) * | 2007-08-31 | 2009-03-19 | Sumitomo Chemical Co Ltd | 有機金属化合物供給容器 |
JP2010248628A (ja) * | 2009-03-27 | 2010-11-04 | Ube Ind Ltd | 有機金属化合物の供給装置 |
JP2013509736A (ja) * | 2009-11-02 | 2013-03-14 | シグマ−アルドリッチ・カンパニー、エルエルシー | 蒸発器 |
US9297071B2 (en) | 2009-11-02 | 2016-03-29 | Sigma-Aldrich Co. Llc | Solid precursor delivery assemblies and related methods |
KR101765734B1 (ko) * | 2009-11-02 | 2017-08-07 | 시그마-알드리치 컴퍼니., 엘엘씨 | 고형 전구체 전달 어셈블리 및 관련 방법 |
JP2011202199A (ja) * | 2010-03-24 | 2011-10-13 | Ube Industries Ltd | 有機金属化合物の供給装置 |
Also Published As
Publication number | Publication date |
---|---|
TW200817539A (en) | 2008-04-16 |
JP5509593B2 (ja) | 2014-06-04 |
US20090159003A1 (en) | 2009-06-25 |
KR20090018095A (ko) | 2009-02-19 |
CN103350905A (zh) | 2013-10-16 |
KR20140075019A (ko) | 2014-06-18 |
TWI400370B (zh) | 2013-07-01 |
JPWO2007139159A1 (ja) | 2009-10-08 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
WO2007139159A1 (ja) | 有機金属化合物の供給装置 | |
US10465286B2 (en) | Method and apparatus to help promote contact of gas with vaporized material | |
JP5438142B2 (ja) | 供給装置 | |
US7487956B2 (en) | Method and apparatus to help promote contact of gas with vaporized material | |
TW200952073A (en) | An improved sublimation bed and substrate processing system | |
TW201139726A (en) | Solid precursor delivery assemblies and related methods | |
WO2010053878A2 (en) | Laminar flow in a precursor source canister | |
JP5521681B2 (ja) | 有機金属化合物の供給装置 | |
JP5521680B2 (ja) | 有機金属化合物の供給装置 | |
TW200920490A (en) | A vessel for providing organometallic compound | |
JP5262083B2 (ja) | 固体有機金属化合物の供給装置 | |
JPH03502714A (ja) | 有機金属化学的気相成長用元素水銀供給源 | |
TWI273144B (en) | Container for loading solid organic metal compound and method for loading the same | |
JPH06196414A (ja) | 気相成長用ガス供給装置 | |
TW201250053A (en) | Thermalizing gas injectors for generating increased precursor gas, material deposition systems including such injectors, and related methods |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
WWE | Wipo information: entry into national phase |
Ref document number: 200780022492.2 Country of ref document: CN |
|
121 | Ep: the epo has been informed by wipo that ep was designated in this application |
Ref document number: 07744418 Country of ref document: EP Kind code of ref document: A1 |
|
WWE | Wipo information: entry into national phase |
Ref document number: 2008517972 Country of ref document: JP |
|
NENP | Non-entry into the national phase |
Ref country code: DE |
|
WWE | Wipo information: entry into national phase |
Ref document number: 1020087029774 Country of ref document: KR |
|
WWE | Wipo information: entry into national phase |
Ref document number: 12302796 Country of ref document: US |
|
122 | Ep: pct application non-entry in european phase |
Ref document number: 07744418 Country of ref document: EP Kind code of ref document: A1 |