WO2007129787A1 - Silicon condenser microphone having additional back chamber and sound hole in pcb - Google Patents

Silicon condenser microphone having additional back chamber and sound hole in pcb Download PDF

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Publication number
WO2007129787A1
WO2007129787A1 PCT/KR2006/003092 KR2006003092W WO2007129787A1 WO 2007129787 A1 WO2007129787 A1 WO 2007129787A1 KR 2006003092 W KR2006003092 W KR 2006003092W WO 2007129787 A1 WO2007129787 A1 WO 2007129787A1
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WO
WIPO (PCT)
Prior art keywords
case
substrate
chamber
microphone
pcb
Prior art date
Application number
PCT/KR2006/003092
Other languages
French (fr)
Inventor
Chung-Dam Song
Original Assignee
Bse Co., Ltd.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Bse Co., Ltd. filed Critical Bse Co., Ltd.
Priority to US11/919,688 priority Critical patent/US7949142B2/en
Priority to EP06783527.2A priority patent/EP1875773B1/en
Priority to JP2008514567A priority patent/JP2008533950A/en
Publication of WO2007129787A1 publication Critical patent/WO2007129787A1/en

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Classifications

    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R19/00—Electrostatic transducers
    • H04R19/01—Electrostatic transducers characterised by the use of electrets
    • H04R19/016—Electrostatic transducers characterised by the use of electrets for microphones
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R1/00—Details of transducers, loudspeakers or microphones
    • H04R1/02—Casings; Cabinets ; Supports therefor; Mountings therein
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R19/00—Electrostatic transducers
    • H04R19/04—Microphones
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R31/00—Apparatus or processes specially adapted for the manufacture of transducers or diaphragms therefor
    • H04R31/006—Interconnection of transducer parts
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R2201/00—Details of transducers, loudspeakers or microphones covered by H04R1/00 but not provided for in any of its subgroups
    • H04R2201/003—Mems transducers or their use
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R2201/00—Details of transducers, loudspeakers or microphones covered by H04R1/00 but not provided for in any of its subgroups
    • H04R2201/02—Details casings, cabinets or mounting therein for transducers covered by H04R1/02 but not provided for in any of its subgroups

Definitions

  • the present invention relates to a condenser microphone, and more particularly to a silicon condenser microphone having an additional back chamber and a sound hole in a PCB.
  • a condenser microphone widely used in a mobile communication terminal and an audio system comprises a voltage bias element, a pair of a diaphragm/ backplate for constituting a capacitor C varying according to a sound pressure, and a JFET (Junction Field Effect Transistor) for buffering an output signal.
  • the conventional the condenser microphone is assembled by sequentially inserting a vibrating plate, a spacer ring, an insulation ring, a backplate and a conductive ring in a case, and finally inserting a PCB and curling an end portion of the case toward the PCB.
  • a semiconductor processing technique using a micromachining is proposed as a technique for integrating a microscopic device.
  • the technique also known as a MEMS (Micro Electro Mechanical System) employs a semiconductor manufacturing process, an integrated circuit technology in particular, to manufacture a microscopic sensor, an actuator and an electromechanical structure having a size in a unit of D.
  • MEMS Micro Electro Mechanical System
  • conventional components of the microphone such as the vibrating plate, the spacer ring, the insulation ring, the backplate and the conductive ring may be miniaturized and integrated, and may have a high performance, a multifunction, a high stability and a high reliability through a high precision microscopic process.
  • Fig. 1 is a diagram exemplifying a conventional MEMS chip structure used in a silicon condenser microphone.
  • a MEMS chip 10 has a structure wherein a backplate 13 is formed on a silicon wafer 14 using a MEMS technology and a vibrating plate 11 is disposed having a spacer 12 therebetween.
  • the backplate 13 includes a sound hole 13a formed therein, and the MEMS chip 10 is generally manufactured by the micromachining technology and a semiconductor chip manufacturing technology.
  • FIG. 2 is a lateral cross-sectional view illustrating a conventional silicon condenser microphone employing the MEMS chip.
  • a conventional silicon condenser microphone 1 is assembled by mounting the MEMS chip 10 and a ASIC (application specific integrated circuit) chip 20 on a PCB 40 and inserting the same in a case 30 having a sound hole 30a formed therein.
  • ASIC application specific integrated circuit
  • a silicon condenser microphone comprising: a case for blocking an inflow of an external sound; a substrate including a chamber case, a MEMS chip having an additional back chamber formed by the chamber case, a ASIC chip for operating the MEMS chip, a conductive pattern for bonding to the case, and a sound hole for passing the external sound therethrough; a fixing means for fixing the case to the substrate; and an adhesive for a bonding the case and the substrate, wherein the adhesive is applied to an entirety of a bonding surface of the case and the substrate fixed by the fixing means.
  • the present invention includes a chamber case for forming an additional back chamber under a MEMS chip in order to increase a back chamber space of the MEMS chip, thereby improving a sensitivity and a noise problem such as a THD (Total Harmonic Distortion).
  • a THD Total Harmonic Distortion
  • the microphone when a sound hole is formed in a substrate instead of a case, the microphone may be mounted on a main PCB via various methods. Therefore, a mounting space may be small.
  • the case since the case is fixed to a PCB by a laser welding and bonded by an adhesive, the case is fixed during the bonding to prevent a generation of a defect, and a mechanical firmness is improved due to a high bonding strength.
  • the silicon condenser microphone in accordance with the present invention is robust to the external noise, and reduces a processing cost and the manufacturing cost.
  • Fig. 1 is a diagram exemplifying a conventional MEMS chip structure used in a silicon condenser microphone.
  • Fig. 2 is a lateral cross-sectional view illustrating a conventional silicon condenser microphone employing a MEMS chip.
  • Fig. 3 is a lateral cross-sectional view illustrating a silicon condenser microphone having an additional back chamber and a sound hole in a PCB in accordance with a first embodiment of the present invention.
  • Fig. 4 is a lateral cross-sectional view illustrating a silicon condenser microphone having an additional back chamber and a sound hole in a PCB in accordance with a second embodiment of the present invention.
  • Fig. 4 is a lateral cross-sectional view illustrating a silicon condenser microphone having an additional back chamber and a sound hole in a PCB in accordance with a second embodiment of the present invention.
  • Fig. 5 is a diagram exemplifying an additional back chamber in a form of a square pillar in accordance with the present invention.
  • Fig. 6 is a diagram exemplifying an additional back chamber in a form of a cylinder in accordance with the present invention.
  • Fig. 7 is a lateral cross-sectional view illustrating an example wherein a microphone having a connection terminal formed on a component surface is mounted on a main
  • Fig. 8 is a lateral cross-sectional view illustrating an example wherein a microphone is mounted on a main PCB in accordance with the second embodiment of the present invention.
  • Fig. 3 is a lateral cross-sectional view illustrating a silicon condenser microphone having an additional back chamber and a sound hole in a PCB in accordance with a first embodiment of the present invention.
  • Fig. 3 is a lateral cross-sectional view illustrating a silicon condenser microphone having an additional back chamber and a sound hole in a PCB in accordance with a first embodiment of the present invention.
  • the silicon condenser microphone 100 having an additional back chamber 152 and a sound hole 140a in accordance with the first embodiment has a structure wherein a chamber case 150 for forming the additional back chamber 152 and an ASIC chip 120 for driving an electrical signal of a MEMS chip 110 are disposed on a PCB substrate 140 having a conductive pattern 141 and connection terminals 142 and 144, a MEMS chip 110 is disposed on the chamber case 150, and a case 130 is attached to the PCB substrate 140.
  • the conductive pattern 141 and the ground connection terminal 144 are connected via a through-hole 146.
  • the chamber case 150 increases a space of the back chamber of the MEMS chip 110 to improve a sensitivity and improve a noise problem such as THD (Total Harmonic Distortion), wherein a through-hole 150a for connecting a back chamber 15 formed by the MEMS chip 110 with the additional back chamber 152 is disposed on an upper surface of the chamber case 150.
  • the MEMS chip 110 has a structure wherein the backplate 13 is formed on the silicon wafer 14 using the MEMS technology and the vibrating plate 11 is formed to have the spacer 12 therebetween as shown in Fig. 1.
  • the chamber case 150 may have a shape of a square pillar or a cylinder, and may be manufactured using a metal or a mold resin.
  • an electrical wiring is disposed on the chamber case 150 so as to transmit the electrical signal of the MEMS chip 110 to the ASIC chip 120.
  • the chamber case 150 having the through-hole 150a on an upper surface thereof for forming the additional back chamber, the MEMS chip 110 attached on the through- hole 150a of the chamber case 150 to expand the back chamber, and the ASIC chip 120 are disposed on the PCB substrate 140, the conductive pattern 141 is disposed on a portion of the PCB substrate 140 that is in contact with the case 130.
  • the sound hole 140a for passing through an external sound is disposed at a position wherein the chamber case 150 is mounted, a sealing pad 148 for carrying out a hole sealing of the sound hole 140a by soldering for preventing a distortion of a sound wave in a space between a main PCB (reference numeral 310 in Fig. 7) and the microphone is disposed around the sound hole 140a disposed at a lower surface of the PCB substrate 140.
  • a reference numeral 148a denoted a sound hole formed by the sealing pad 148.
  • the case 130 is a metal case having one surface open wherein the case 130 has the shape of the cylinder or the square pillar.
  • the case 130 has an end portion in contact with the conductive pattern 141 of the PCB substrate 140 and has a closed bottom surface to prevent an inflow of the external sound as well.
  • the case 130 is attached to the PCB substrate 140 by aligning the metal case 130 on the conductive pattern 141 formed on the PCB substrate 140 and then spot- welding at least two points by a laser welding or a spot welding and then sealing a contacting portion of the case 130 and the PCB substrate 140 with an adhesive 164 such as an epoxy.
  • a reference numeral 162 denotes a welding point.
  • the MEMS chip 110 is attached to the chamber case 150 such that the through-hole 150a of the chamber case 150 is positioned inside the back chamber 15 of the MEMS chip 110.
  • the case 130 having the shape of the cylinder or the square pillar is fixed to the conductive pattern 141 of the PCB substrate 140 by the laser welding.
  • the case 130 is bonded to the PCB substrate 140 by the adhesive 164.
  • the adhesive 164 may be a conductive epoxy, a non-conductive epoxy, a silver paste, a silicon, a urethane, an acryl and a cream solder.
  • the MEMS chip 110 having the additional back chamber 152 formed by the chamber case 150 and the ASIC chip 120 are mounted on the PCB substrate 140, and the square or circular conductive pattern 141 is disposed at a portion that is in contact with the case 130 having the shape of the cylinder or the square pillar.
  • a connection pad or the connection terminal for connecting to an external device may be freely disposed on the large PCB substrate, and the conductive pattern 141 may be manufactured by disposing a copper film via a conventional PCB manufacturing process and then plating a nickel or a gold.
  • a ceramic substrate, a FPCB substrate or a metal PCB may be used instead of the PCB substrate 140.
  • the case 130 having the shape of the cylinder or the square pillar has a contacting surface with the PCB substrate 140 open such that chip components may be housed inside, wherein an upper surface thereof is closed the external sound does not flows in.
  • the case 130 may be manufactured using a brass, a copper, a stainless steel, an aluminum or a nickel alloy and may be plated with gold or silver.
  • a welding point 162 which is a portion of the contacting portion is welded with the laser using a laser welder (not shown) to fix the case 130 to the PCB substrate 140.
  • an assembly of the microphone is complete by applying the adhesive 164 to the entire contacting portion.
  • the welding refers to spot- welding one or more points (preferably two or four points) in order to fix the case 130 to the PCB substrate 140 rather than welding an entire contacting surface of the case 130 and the PCB substrate 140.
  • a bonding point formed between the case 130 and the PCB substrate 140 through such welding is referred to as the welding point 162.
  • the case 130 is fixed to the PCB substrate 140 by the welding point 162 such that the case 130 is not moved during a bonding using the adhesive 164 or a curing process for bonding at a proper position.
  • the conductive pattern 141 is connected to the ground connection terminal 144 through the through-hole 146, and when the case 130 is bonded, an external noise is blocked to remove the noise.
  • connection terminals 142 and 144 for connecting to the external device may be formed at a bottom surface of the PCB substrate 140, and each of the connection terminals 142 and 144 is electrically connected to a chip component side through the through-hole.
  • the connection terminals 142 and 144 extend about the PCB substrate 140, the rework may be facilitated by using an electric solder through an exposed surface.
  • the laser welding is exemplified as a method for fixing the case 130 to the PCB substrate 140
  • a soldering or a punching may be used for fixing the case 130 to the PCB substrate 140
  • the conductive epoxy, the non-conductive epoxy, the silver paste, the silicon, the urethane, the acryl or the cream solder may be used as the adhesive 164.
  • FIG. 4 is a lateral cross-sectional view illustrating a silicon condenser microphone having an additional back chamber and a sound hole in a PCB in accordance with a second embodiment of the present invention.
  • a difference between the silicon condenser microphone 100 of the first embodiment and the silicon condenser microphone 100' of the second embodiment is a position of the sound hole 140a formed in the PCB substrate 140, wherein the sound hole 140a is formed at a position of the additional back chamber 152 formed by the chamber case 150 in case of the first embodiment and the sound hole 140a is formed between the chamber case 150 and the ASIC chip 120 away from the chamber case 150 in case of the second embodiment.
  • the silicon condenser microphone 100 of the first embodiment has a back type structure wherein the external sound passes through the sound hole 140a of the PCB substrate 140 to reach the additional back chamber 152
  • the silicon condenser microphone 100' of the second embodiment has a structure wherein the external sound passes through the sound hole 140a of the PCB substrate 140 and then passes through a space in the case 130 to reach the MEMS chip 110.
  • Fig. 5 is a diagram exemplifying an additional back chamber in the form of the square pillar in accordance with the present invention
  • Fig. 6 is a diagram exemplifying an additional back chamber in the form of the cylinder in accordance with the present invention.
  • the chamber case 150 for forming the additional back chamber 152 may have the shape of the square pillar 150' and the cylinder 150", and the through-hole 150a is disposed on an upper portion of the square pillar 150' or the cylinder 150" to form a path with the back chamber 15 of the MEMS chip 110.
  • the silicon condenser microphone 100 having various shapes may be manufactured by attaching the case 130 having various shapes on the PCB substrate 140.
  • the ASIC chip 120 and the MEMS chip 110 are mounted on the PCB substrate 140.
  • the MEMS chip 110 includes the additional back chamber 152 by the chamber case 150.
  • the case may have the shape of the cylinder, the square pillar, a cylinder having a wing at an end thereof, or a square pillar having a wing at an end thereof.
  • Fig. 7 is a lateral cross-sectional view illustrating an example wherein a microphone having a connection terminal formed on a component surface is mounted on a main PCB in accordance with the first embodiment of the present invention.
  • connection terminals 142 and 144 for connecting to a connection pad 320 of the main PCB 310 of a product on which the microphone is mounted are disposed in the component side of the PCB substrate 140. At least two and up to eight connection terminals may be formed.
  • the reference numeral 162 denotes the welding point.
  • the main PCB 310 of the product on which the silicon condenser microphone is mounted comprises a circular or a square inserting hole 310a in order to mount the case 130 of the silicon condenser microphone.
  • the connection pad 320 corresponding to the connection terminals 142 and 144 disposed on the PCB substrate 140 of the microphone are disposed.
  • connection pad 320 of the main PCB 310 is coupled to the connection terminals 142 and 144 by a soldering 330 as well as the case 130 extruding at a center of the component side of the substrate 140 is inserted the inserting hole 310a of the main PCB 310.
  • Fig. 8 is a lateral cross-sectional view illustrating an example wherein a microphone is mounted on a main PCB in accordance with the second embodiment of the present invention.
  • the silicon condenser microphone in accordance with the second embodiment of the present invention has a constitution identical to that of Fig. 4, and a main PCB 300 for mounting the silicon condenser microphone of the second embodiment comprises a sound hole 300a for passing through a sound form an external source, a sealing pad 302 disposed around the sound hole 300a, and a connection pad 304 corresponding to the connection terminals 142 and 144 of the microphone as shown in Fig. 8.
  • the present invention includes a chamber case for forming an additional back chamber under a MEMS chip in order to increase a back chamber space of the MEMS chip, thereby improving a sensitivity and a noise problem such as a THD (Total Harmonic Distortion).
  • a THD Total Harmonic Distortion

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Acoustics & Sound (AREA)
  • Signal Processing (AREA)
  • Manufacturing & Machinery (AREA)
  • Electrostatic, Electromagnetic, Magneto- Strictive, And Variable-Resistance Transducers (AREA)
  • Pressure Sensors (AREA)
  • Micromachines (AREA)

Abstract

A silicon condenser microphone having an additional back chamber and a sound hole in a PCB is disclosed. The silicon condenser microphone in accordance with the present invention comprises a case for blocking an inflow of an external sound; a substrate including a chamber case, a MEMS chip having an additional back chamber formed by the chamber case, a ASIC chip for operating the MEMS chip, a conductive pattern for a bonding to the case, and a sound hole for passing the external sound therethrough; a fixing means for fixing the case to the substrate; and an adhesive for bonding the case and the substrate, wherein the adhesive is applied to an entirety of a bonding surface of the case and the substrate fixed by the fixing means. Therefore, when the sound hole is formed through the PCB instead of the case, the microphone may be mounted in various ways, thereby reducing a mounting space, and the chamber case for forming the additional back chamber under the MEMS chip is employed in order to increase a back chamber space of the MEMS chip, thereby improving a sensitivity and a noise problem such as a THD (Total Harmonic Distortion).

Description

Description
SILICON CONDENSER MICROPHONE HAVING ADDITIONAL BACK CHAMBER AND SOUND HOLE IN PCB
Technical Field
[1] The present invention relates to a condenser microphone, and more particularly to a silicon condenser microphone having an additional back chamber and a sound hole in a PCB. Background Art
[2] Generally, a condenser microphone widely used in a mobile communication terminal and an audio system comprises a voltage bias element, a pair of a diaphragm/ backplate for constituting a capacitor C varying according to a sound pressure, and a JFET (Junction Field Effect Transistor) for buffering an output signal. The conventional the condenser microphone is assembled by sequentially inserting a vibrating plate, a spacer ring, an insulation ring, a backplate and a conductive ring in a case, and finally inserting a PCB and curling an end portion of the case toward the PCB.
[3] Recently, a semiconductor processing technique using a micromachining is proposed as a technique for integrating a microscopic device. The technique, also known as a MEMS (Micro Electro Mechanical System) employs a semiconductor manufacturing process, an integrated circuit technology in particular, to manufacture a microscopic sensor, an actuator and an electromechanical structure having a size in a unit of D. In accordance with a MEMS chip microphone manufactured via the micro- machining technology, conventional components of the microphone such as the vibrating plate, the spacer ring, the insulation ring, the backplate and the conductive ring may be miniaturized and integrated, and may have a high performance, a multifunction, a high stability and a high reliability through a high precision microscopic process.
[4] Fig. 1 is a diagram exemplifying a conventional MEMS chip structure used in a silicon condenser microphone. Referring to Fig. 1, a MEMS chip 10 has a structure wherein a backplate 13 is formed on a silicon wafer 14 using a MEMS technology and a vibrating plate 11 is disposed having a spacer 12 therebetween. The backplate 13 includes a sound hole 13a formed therein, and the MEMS chip 10 is generally manufactured by the micromachining technology and a semiconductor chip manufacturing technology.
[5] Fig. 2 is a lateral cross-sectional view illustrating a conventional silicon condenser microphone employing the MEMS chip. Referring to Fig. 2, a conventional silicon condenser microphone 1 is assembled by mounting the MEMS chip 10 and a ASIC (application specific integrated circuit) chip 20 on a PCB 40 and inserting the same in a case 30 having a sound hole 30a formed therein.
[6] However, as shown in Fig. 2, because a back chamber 15 of the conventional silicon condenser microphone 1 is formed by the MEMS chip 10, a space of the back chamber 15 is extremely small due to a size of the MEMS chip 10 which is a semiconductor chip. Therefore, a sound quality of the microphone is degraded. Disclosure of Invention Technical Problem
[7] It is an object of the present invention to provide a silicon condenser microphone having an additional back chamber and a sound hole in a PCB in order to improve an acoustic characteristic. Technical Solution
[8] In order to achieve the above-described object, there is provided a silicon condenser microphone comprising: a case for blocking an inflow of an external sound; a substrate including a chamber case, a MEMS chip having an additional back chamber formed by the chamber case, a ASIC chip for operating the MEMS chip, a conductive pattern for bonding to the case, and a sound hole for passing the external sound therethrough; a fixing means for fixing the case to the substrate; and an adhesive for a bonding the case and the substrate, wherein the adhesive is applied to an entirety of a bonding surface of the case and the substrate fixed by the fixing means. Advantageous Effects
[9] As described above, the present invention includes a chamber case for forming an additional back chamber under a MEMS chip in order to increase a back chamber space of the MEMS chip, thereby improving a sensitivity and a noise problem such as a THD (Total Harmonic Distortion).
[10] In addition, when a sound hole is formed in a substrate instead of a case, the microphone may be mounted on a main PCB via various methods. Therefore, a mounting space may be small. In addition, since the case is fixed to a PCB by a laser welding and bonded by an adhesive, the case is fixed during the bonding to prevent a generation of a defect, and a mechanical firmness is improved due to a high bonding strength. Thereby the silicon condenser microphone in accordance with the present invention is robust to the external noise, and reduces a processing cost and the manufacturing cost.
[11] While the present invention has been particularly shown and described with reference to the preferred embodiment thereof, it will be understood by those skilled in the art that various changes in form and details may be effected therein without departing from the spirit and scope of the invention. Brief Description of the Drawings
[12] Fig. 1 is a diagram exemplifying a conventional MEMS chip structure used in a silicon condenser microphone. [13] Fig. 2 is a lateral cross-sectional view illustrating a conventional silicon condenser microphone employing a MEMS chip. [14] Fig. 3 is a lateral cross-sectional view illustrating a silicon condenser microphone having an additional back chamber and a sound hole in a PCB in accordance with a first embodiment of the present invention. [15] Fig. 4 is a lateral cross-sectional view illustrating a silicon condenser microphone having an additional back chamber and a sound hole in a PCB in accordance with a second embodiment of the present invention. [16] Fig. 5 is a diagram exemplifying an additional back chamber in a form of a square pillar in accordance with the present invention. [17] Fig. 6 is a diagram exemplifying an additional back chamber in a form of a cylinder in accordance with the present invention. [18] Fig. 7 is a lateral cross-sectional view illustrating an example wherein a microphone having a connection terminal formed on a component surface is mounted on a main
PCB in accordance with the first embodiment of the present invention. [19] Fig. 8 is a lateral cross-sectional view illustrating an example wherein a microphone is mounted on a main PCB in accordance with the second embodiment of the present invention.
Mode for the Invention [20] The above-described objects and other objects and characteristics and advantages of the present invention will now be described in detail with reference to the accompanied drawings. [21] Fig. 3 is a lateral cross-sectional view illustrating a silicon condenser microphone having an additional back chamber and a sound hole in a PCB in accordance with a first embodiment of the present invention. [22] As shown in Fig. 3, the silicon condenser microphone 100 having an additional back chamber 152 and a sound hole 140a in accordance with the first embodiment has a structure wherein a chamber case 150 for forming the additional back chamber 152 and an ASIC chip 120 for driving an electrical signal of a MEMS chip 110 are disposed on a PCB substrate 140 having a conductive pattern 141 and connection terminals 142 and 144, a MEMS chip 110 is disposed on the chamber case 150, and a case 130 is attached to the PCB substrate 140. The conductive pattern 141 and the ground connection terminal 144 are connected via a through-hole 146. [23] The chamber case 150 increases a space of the back chamber of the MEMS chip 110 to improve a sensitivity and improve a noise problem such as THD (Total Harmonic Distortion), wherein a through-hole 150a for connecting a back chamber 15 formed by the MEMS chip 110 with the additional back chamber 152 is disposed on an upper surface of the chamber case 150. The MEMS chip 110 has a structure wherein the backplate 13 is formed on the silicon wafer 14 using the MEMS technology and the vibrating plate 11 is formed to have the spacer 12 therebetween as shown in Fig. 1. The chamber case 150 may have a shape of a square pillar or a cylinder, and may be manufactured using a metal or a mold resin. In addition, although not shown, an electrical wiring is disposed on the chamber case 150 so as to transmit the electrical signal of the MEMS chip 110 to the ASIC chip 120.
[24] The chamber case 150 having the through-hole 150a on an upper surface thereof for forming the additional back chamber, the MEMS chip 110 attached on the through- hole 150a of the chamber case 150 to expand the back chamber, and the ASIC chip 120 are disposed on the PCB substrate 140, the conductive pattern 141 is disposed on a portion of the PCB substrate 140 that is in contact with the case 130. The sound hole 140a for passing through an external sound is disposed at a position wherein the chamber case 150 is mounted, a sealing pad 148 for carrying out a hole sealing of the sound hole 140a by soldering for preventing a distortion of a sound wave in a space between a main PCB (reference numeral 310 in Fig. 7) and the microphone is disposed around the sound hole 140a disposed at a lower surface of the PCB substrate 140. A reference numeral 148a denoted a sound hole formed by the sealing pad 148.
[25] The case 130 is a metal case having one surface open wherein the case 130 has the shape of the cylinder or the square pillar. The case 130 has an end portion in contact with the conductive pattern 141 of the PCB substrate 140 and has a closed bottom surface to prevent an inflow of the external sound as well. The case 130 is attached to the PCB substrate 140 by aligning the metal case 130 on the conductive pattern 141 formed on the PCB substrate 140 and then spot- welding at least two points by a laser welding or a spot welding and then sealing a contacting portion of the case 130 and the PCB substrate 140 with an adhesive 164 such as an epoxy. A reference numeral 162 denotes a welding point.
[26] In accordance with a method for manufacturing the silicon condenser microphone
100 of the first embodiment, after the chamber case 150 is mounted on the PCB substrate 140 such that the sound hole 140a of the PCB substrate 140 is positioned inside the additional back chamber 152 and the ASIC chip 120 is mounted on the PCB substrate 140, the MEMS chip 110 is attached to the chamber case 150 such that the through-hole 150a of the chamber case 150 is positioned inside the back chamber 15 of the MEMS chip 110.
[27] Thereafter, the case 130 having the shape of the cylinder or the square pillar is fixed to the conductive pattern 141 of the PCB substrate 140 by the laser welding. The case 130 is bonded to the PCB substrate 140 by the adhesive 164. The adhesive 164 may be a conductive epoxy, a non-conductive epoxy, a silver paste, a silicon, a urethane, an acryl and a cream solder.
[28] Referring to Fig. 3, the MEMS chip 110 having the additional back chamber 152 formed by the chamber case 150 and the ASIC chip 120 are mounted on the PCB substrate 140, and the square or circular conductive pattern 141 is disposed at a portion that is in contact with the case 130 having the shape of the cylinder or the square pillar.
[29] Since a size of the PCB substrate 140 is larger than that of the case 130 having the shape of the cylinder or the square pillar, a connection pad or the connection terminal for connecting to an external device may be freely disposed on the large PCB substrate, and the conductive pattern 141 may be manufactured by disposing a copper film via a conventional PCB manufacturing process and then plating a nickel or a gold. A ceramic substrate, a FPCB substrate or a metal PCB may be used instead of the PCB substrate 140.
[30] The case 130 having the shape of the cylinder or the square pillar has a contacting surface with the PCB substrate 140 open such that chip components may be housed inside, wherein an upper surface thereof is closed the external sound does not flows in. The case 130 may be manufactured using a brass, a copper, a stainless steel, an aluminum or a nickel alloy and may be plated with gold or silver.
[31] After aligning the case 130 to the conductive pattern 141 of the PCB substrate 140, a welding point 162 which is a portion of the contacting portion is welded with the laser using a laser welder (not shown) to fix the case 130 to the PCB substrate 140. Thereafter, an assembly of the microphone is complete by applying the adhesive 164 to the entire contacting portion. The welding refers to spot- welding one or more points (preferably two or four points) in order to fix the case 130 to the PCB substrate 140 rather than welding an entire contacting surface of the case 130 and the PCB substrate 140. A bonding point formed between the case 130 and the PCB substrate 140 through such welding is referred to as the welding point 162. The case 130 is fixed to the PCB substrate 140 by the welding point 162 such that the case 130 is not moved during a bonding using the adhesive 164 or a curing process for bonding at a proper position. In addition, the conductive pattern 141 is connected to the ground connection terminal 144 through the through-hole 146, and when the case 130 is bonded, an external noise is blocked to remove the noise.
[32] At least two and up to eight connection terminals 142 and 144 for connecting to the external device may be formed at a bottom surface of the PCB substrate 140, and each of the connection terminals 142 and 144 is electrically connected to a chip component side through the through-hole. Particularly, in accordance with the embodiment of the present invention, when the connection terminals 142 and 144 extend about the PCB substrate 140, the rework may be facilitated by using an electric solder through an exposed surface.
[33] In accordance with the embodiment of the present invention, while the laser welding is exemplified as a method for fixing the case 130 to the PCB substrate 140, a soldering or a punching may be used for fixing the case 130 to the PCB substrate 140, and the conductive epoxy, the non-conductive epoxy, the silver paste, the silicon, the urethane, the acryl or the cream solder may be used as the adhesive 164.
[34] Fig. 4 is a lateral cross-sectional view illustrating a silicon condenser microphone having an additional back chamber and a sound hole in a PCB in accordance with a second embodiment of the present invention. A difference between the silicon condenser microphone 100 of the first embodiment and the silicon condenser microphone 100' of the second embodiment is a position of the sound hole 140a formed in the PCB substrate 140, wherein the sound hole 140a is formed at a position of the additional back chamber 152 formed by the chamber case 150 in case of the first embodiment and the sound hole 140a is formed between the chamber case 150 and the ASIC chip 120 away from the chamber case 150 in case of the second embodiment.
[35] Therefore, while the silicon condenser microphone 100 of the first embodiment has a back type structure wherein the external sound passes through the sound hole 140a of the PCB substrate 140 to reach the additional back chamber 152, the silicon condenser microphone 100' of the second embodiment has a structure wherein the external sound passes through the sound hole 140a of the PCB substrate 140 and then passes through a space in the case 130 to reach the MEMS chip 110. In accordance with the first embodiment, it is preferable that positions of the backplate 13 and the vibrating plate 11 are exchanged in a structure of the MEMS chip shown in Fig. 1.
[36] In accordance with the silicon condenser microphone 100' of the second embodiment, since a constitution thereof is identical to that of the silicon condenser microphone 100 of the first embodiment except the position of the sound hole 140a, an additional detailed description is omitted.
[37] Fig. 5 is a diagram exemplifying an additional back chamber in the form of the square pillar in accordance with the present invention, and Fig. 6 is a diagram exemplifying an additional back chamber in the form of the cylinder in accordance with the present invention.
[38] As shown in Fig. 5 and 6, the chamber case 150 for forming the additional back chamber 152 may have the shape of the square pillar 150' and the cylinder 150", and the through-hole 150a is disposed on an upper portion of the square pillar 150' or the cylinder 150" to form a path with the back chamber 15 of the MEMS chip 110.
[39] The silicon condenser microphone 100 having various shapes may be manufactured by attaching the case 130 having various shapes on the PCB substrate 140. The ASIC chip 120 and the MEMS chip 110 are mounted on the PCB substrate 140. The MEMS chip 110 includes the additional back chamber 152 by the chamber case 150. For instance, the case may have the shape of the cylinder, the square pillar, a cylinder having a wing at an end thereof, or a square pillar having a wing at an end thereof.
[40] Fig. 7 is a lateral cross-sectional view illustrating an example wherein a microphone having a connection terminal formed on a component surface is mounted on a main PCB in accordance with the first embodiment of the present invention.
[41] As shown in Fig. 7, in accordance with a silicon condenser microphone according to an alternate first embodiment, after the case 130 having the shape of the cylinder or the square pillar is fixed to the PCB substrate 140 larger than the case by the welding, the case 130 is bonded by the adhesive 164. The connection terminals 142 and 144 for connecting to a connection pad 320 of the main PCB 310 of a product on which the microphone is mounted are disposed in the component side of the PCB substrate 140. At least two and up to eight connection terminals may be formed. The reference numeral 162 denotes the welding point. When the connection terminals extends to a sidewall of the substrate or extends to an opposite surface of the component side in addition to the sidewall, a heat transfer of the electric solder is improved to facilitate the rework.
[42] The main PCB 310 of the product on which the silicon condenser microphone is mounted comprises a circular or a square inserting hole 310a in order to mount the case 130 of the silicon condenser microphone. The connection pad 320 corresponding to the connection terminals 142 and 144 disposed on the PCB substrate 140 of the microphone are disposed.
[43] As shown in Fig. 7, in accordance with the silicon condenser microphone mounted on the main PCB 310, the connection pad 320 of the main PCB 310 is coupled to the connection terminals 142 and 144 by a soldering 330 as well as the case 130 extruding at a center of the component side of the substrate 140 is inserted the inserting hole 310a of the main PCB 310.
[44] Therefore, in accordance with a mounting method of the present invention, since the case 130 extruding over the PCB substrate of the microphone is inserted in the inserting hole 310a of the main PCB 310, an overall height after the mounting is smaller than the conventional microphone wherein the connection terminals are formed on an opposite side of the component side to be mounted the main PCB, resulting in an efficient use of a space required for mounting the product.
[45] Fig. 8 is a lateral cross-sectional view illustrating an example wherein a microphone is mounted on a main PCB in accordance with the second embodiment of the present invention. [46] The silicon condenser microphone in accordance with the second embodiment of the present invention has a constitution identical to that of Fig. 4, and a main PCB 300 for mounting the silicon condenser microphone of the second embodiment comprises a sound hole 300a for passing through a sound form an external source, a sealing pad 302 disposed around the sound hole 300a, and a connection pad 304 corresponding to the connection terminals 142 and 144 of the microphone as shown in Fig. 8.
[47] Therefore, after aligning the sound hole 140a formed on the PCB substrate 140 of the silicon condenser microphone of the second embodiment to the sound hole 300a the main PCB 300 and connecting terminals 142 and 144 to the connection pad 304, the silicon condenser microphone is attached to the main PCB 300 via a soldering 330. Industrial Applicability
[48] The present invention includes a chamber case for forming an additional back chamber under a MEMS chip in order to increase a back chamber space of the MEMS chip, thereby improving a sensitivity and a noise problem such as a THD (Total Harmonic Distortion).

Claims

Claims
[1] A silicon condenser microphone comprising: a case for blocking an inflow of an external sound; a substrate including a chamber case, a MEMS chip having an additional back chamber formed by the chamber case, a ASIC chip for operating the MEMS chip, a conductive pattern for a bonding to the case, and a sound hole for passing the external sound therethrough; a fixing means for fixing the case to the substrate; and an adhesive for bonding the case and the substrate, wherein the adhesive is applied to an entirety of a bonding surface of the case and the substrate fixed by the fixing means.
[2] The microphone in accordance with claim 1 , wherein the sound hole is disposed on a portion of the substrate corresponding to a position of the additional back chamber.
[3] The microphone in accordance with one of claims 1 and 2, further comprising a sealing pad for preventing a distortion of an acoustic wave, the sealing pad being disposed around the sound hole of the substrate.
[4] The microphone in accordance with claim 1, wherein the fixing means comprises a welding point formed by a laser welding or a soldering, and wherein the adhesive comprises one of a conductive epoxy, a non-conductive epoxy, a silver paste, a silicon, a urethane, an acryl and a cream solder.
[5] The microphone in accordance with claim 1, wherein the case comprises a cylindrical case or a square pillar case, and wherein an end portion of the case is a straight type or curled outward to form a wing.
[6] The microphone in accordance with claim 1 , wherein the chamber case comprises a cylindrical chamber case or a square pillar chamber case, and comprises a through-hole connected to a back chamber of the MEMS chip.
[7] The microphone in accordance with claim 1, wherein the substrate comprises one of a PCB, a ceramic substrate, a FPCB substrate and a metal PCB.
PCT/KR2006/003092 2006-05-09 2006-08-07 Silicon condenser microphone having additional back chamber and sound hole in pcb WO2007129787A1 (en)

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JP2008514567A JP2008533950A (en) 2006-05-09 2006-08-07 Silicon condenser microphone with an additional back chamber and acoustic holes formed in the substrate

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Cited By (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2010051707A1 (en) * 2008-11-07 2010-05-14 歌尔声学股份有限公司 Silicon microphone
US20110198714A1 (en) * 2010-02-18 2011-08-18 Analog Devices, Inc. Packages and methods for packaging mems microphone devices
US20110266641A1 (en) * 2009-10-19 2011-11-03 Bse Co., Ltd. Silicon condenser microphone having an additional back chamber and a fabrication method therefor
CN102457789A (en) * 2010-10-19 2012-05-16 宝星电子股份有限公司 Surface-mount microphone
US8447057B2 (en) 2011-03-18 2013-05-21 Analog Devices, Inc. Packages and methods for packaging MEMS microphone devices
US8625832B2 (en) 2011-04-04 2014-01-07 Invensense, Inc. Packages and methods for packaging microphone devices
US8779535B2 (en) 2012-03-14 2014-07-15 Analog Devices, Inc. Packaged integrated device die between an external and internal housing
US8861312B2 (en) 2007-03-14 2014-10-14 Qualcomm Incorporated MEMS microphone
US9661408B2 (en) 2012-10-26 2017-05-23 Analog Devices, Inc. Packages and methods for packaging
DE102017128956A1 (en) * 2017-12-06 2019-06-06 Peiker Acustic Gmbh & Co Kg Microphone assembly and method of making a microphone assembly
US10730743B2 (en) 2017-11-06 2020-08-04 Analog Devices Global Unlimited Company Gas sensor packages
US11587839B2 (en) 2019-06-27 2023-02-21 Analog Devices, Inc. Device with chemical reaction chamber

Families Citing this family (121)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2008134530A2 (en) 2007-04-25 2008-11-06 University Of Florida Research Foundation, Inc. A capacitive microphone with integrated cavity
KR200448302Y1 (en) 2007-05-26 2010-03-30 고어텍 인크 Silicon condenser microphone
KR100904285B1 (en) * 2007-06-04 2009-06-25 주식회사 비에스이 Condenser microphone
KR101008399B1 (en) * 2007-09-03 2011-01-14 주식회사 비에스이 Condenser microphone using the ceramic package whose inside is encompassed by metal or conductive materials
KR100982239B1 (en) * 2007-11-02 2010-09-14 주식회사 비에스이 Mems microphone package
US8450817B2 (en) * 2008-08-14 2013-05-28 Knowles Electronics Llc Microelectromechanical system package with strain relief bridge
JP2010161271A (en) * 2009-01-09 2010-07-22 Panasonic Corp Semiconductor package
KR101039256B1 (en) * 2010-01-18 2011-06-07 주식회사 비에스이 Mems microphone package using additional chamber
CN102859688B (en) * 2010-02-26 2015-05-27 优博创新科技产权有限公司 Semiconductor package for mems device and method of manufacturing the same
KR101094452B1 (en) 2010-05-20 2011-12-15 주식회사 비에스이 Microphone assembly
EP2432249A1 (en) 2010-07-02 2012-03-21 Knowles Electronics Asia PTE. Ltd. Microphone
TWI501358B (en) * 2011-04-08 2015-09-21 Unimicron Technology Crop Carrier and method for fabricating thereof
CN103858446A (en) 2011-08-18 2014-06-11 美商楼氏电子有限公司 Sensitivity adjustment apparatus and method for MEMS devices
JP5668664B2 (en) * 2011-10-12 2015-02-12 船井電機株式会社 MICROPHONE DEVICE, ELECTRONIC DEVICE EQUIPPED WITH MICROPHONE DEVICE, MICROPHONE DEVICE MANUFACTURING METHOD, MICROPHONE DEVICE SUBSTRATE, AND MICROPHONE DEVICE SUBSTRATE MANUFACTURING METHOD
JP2013090142A (en) * 2011-10-18 2013-05-13 Hosiden Corp Electret capacitor microphone
US9485560B2 (en) 2012-02-01 2016-11-01 Knowles Electronics, Llc Embedded circuit in a MEMS device
DE102012203373A1 (en) * 2012-03-05 2013-09-05 Robert Bosch Gmbh Micromechanical sound transducer arrangement and a corresponding manufacturing method
US8940742B2 (en) 2012-04-10 2015-01-27 Infinity Pharmaceuticals, Inc. Heterocyclic compounds and uses thereof
US9402118B2 (en) 2012-07-27 2016-07-26 Knowles Electronics, Llc Housing and method to control solder creep on housing
US9491539B2 (en) 2012-08-01 2016-11-08 Knowles Electronics, Llc MEMS apparatus disposed on assembly lid
US9078063B2 (en) 2012-08-10 2015-07-07 Knowles Electronics, Llc Microphone assembly with barrier to prevent contaminant infiltration
MY174974A (en) 2012-09-14 2020-05-29 Bosch Gmbh Robert Device testing using acoustic port obstruction
US9148695B2 (en) 2013-01-30 2015-09-29 The Nielsen Company (Us), Llc Methods and apparatus to collect media identifying data
US9467785B2 (en) 2013-03-28 2016-10-11 Knowles Electronics, Llc MEMS apparatus with increased back volume
US9503814B2 (en) 2013-04-10 2016-11-22 Knowles Electronics, Llc Differential outputs in multiple motor MEMS devices
US9301075B2 (en) * 2013-04-24 2016-03-29 Knowles Electronics, Llc MEMS microphone with out-gassing openings and method of manufacturing the same
EP3000241B1 (en) 2013-05-23 2019-07-17 Knowles Electronics, LLC Vad detection microphone and method of operating the same
US10020008B2 (en) 2013-05-23 2018-07-10 Knowles Electronics, Llc Microphone and corresponding digital interface
US10028054B2 (en) 2013-10-21 2018-07-17 Knowles Electronics, Llc Apparatus and method for frequency detection
US20180317019A1 (en) 2013-05-23 2018-11-01 Knowles Electronics, Llc Acoustic activity detecting microphone
US9711166B2 (en) 2013-05-23 2017-07-18 Knowles Electronics, Llc Decimation synchronization in a microphone
CN104219610A (en) * 2013-05-29 2014-12-17 山东共达电声股份有限公司 MEMS microphone
US9521499B2 (en) * 2013-06-26 2016-12-13 Infineon Technologies Ag Electronic device with large back volume for electromechanical transducer
US9386370B2 (en) 2013-09-04 2016-07-05 Knowles Electronics, Llc Slew rate control apparatus for digital microphones
TWI532387B (en) * 2013-09-30 2016-05-01 南茂科技股份有限公司 Package of microelectromechanical system microphone chip
WO2015051241A1 (en) 2013-10-04 2015-04-09 Infinity Pharmaceuticals, Inc. Heterocyclic compounds and uses thereof
US9502028B2 (en) 2013-10-18 2016-11-22 Knowles Electronics, Llc Acoustic activity detection apparatus and method
US9147397B2 (en) 2013-10-29 2015-09-29 Knowles Electronics, Llc VAD detection apparatus and method of operating the same
GB2521448B (en) * 2013-12-20 2021-07-21 Nokia Technologies Oy An apparatus and method for providing an apparatus comprising a covering portion for an electronic device
EP4066834A1 (en) 2014-03-19 2022-10-05 Infinity Pharmaceuticals, Inc. Heterocyclic compounds for use in the treatment of pi3k-gamma mediated disorders
US9831844B2 (en) 2014-09-19 2017-11-28 Knowles Electronics, Llc Digital microphone with adjustable gain control
US9554214B2 (en) 2014-10-02 2017-01-24 Knowles Electronics, Llc Signal processing platform in an acoustic capture device
WO2016054491A1 (en) 2014-10-03 2016-04-07 Infinity Pharmaceuticals, Inc. Heterocyclic compounds and uses thereof
US9743191B2 (en) 2014-10-13 2017-08-22 Knowles Electronics, Llc Acoustic apparatus with diaphragm supported at a discrete number of locations
CN105611474B (en) * 2014-11-24 2019-01-29 山东共达电声股份有限公司 A kind of silicon capacitor microphone
US9743167B2 (en) 2014-12-17 2017-08-22 Knowles Electronics, Llc Microphone with soft clipping circuit
KR20170099976A (en) * 2014-12-25 2017-09-01 후아웨이 테크놀러지 컴퍼니 리미티드 microphone
WO2016112113A1 (en) 2015-01-07 2016-07-14 Knowles Electronics, Llc Utilizing digital microphones for low power keyword detection and noise suppression
WO2016118480A1 (en) 2015-01-21 2016-07-28 Knowles Electronics, Llc Low power voice trigger for acoustic apparatus and method
US10121472B2 (en) 2015-02-13 2018-11-06 Knowles Electronics, Llc Audio buffer catch-up apparatus and method with two microphones
US9866938B2 (en) 2015-02-19 2018-01-09 Knowles Electronics, Llc Interface for microphone-to-microphone communications
US9800971B2 (en) 2015-03-17 2017-10-24 Knowles Electronics, Llc Acoustic apparatus with side port
CN104730656A (en) * 2015-04-01 2015-06-24 苏州旭创科技有限公司 Optical module and manufacturing method thereof
WO2016183494A1 (en) 2015-05-14 2016-11-17 Knowles Electronics, Llc Microphone with coined area
US10291973B2 (en) 2015-05-14 2019-05-14 Knowles Electronics, Llc Sensor device with ingress protection
US9478234B1 (en) 2015-07-13 2016-10-25 Knowles Electronics, Llc Microphone apparatus and method with catch-up buffer
US9794661B2 (en) 2015-08-07 2017-10-17 Knowles Electronics, Llc Ingress protection for reducing particle infiltration into acoustic chamber of a MEMS microphone package
CN108349985A (en) 2015-09-14 2018-07-31 无限药品股份有限公司 Solid form, preparation method, the composition and its application method comprising it of isoquinolines
CN105203233A (en) * 2015-10-16 2015-12-30 瑞声声学科技(深圳)有限公司 Mems pressure sensor
CN108432265A (en) 2015-11-19 2018-08-21 美商楼氏电子有限公司 Differential type mems microphone
US9516421B1 (en) 2015-12-18 2016-12-06 Knowles Electronics, Llc Acoustic sensing apparatus and method of manufacturing the same
DE112016005824T5 (en) 2015-12-18 2018-08-30 Knowles Electronics, Llc MICROPHONE WITH HYDROPHOBIC IMPACT PROTECTION
CN108605181A (en) 2016-02-01 2018-09-28 美商楼氏电子有限公司 Equipment for biased mem S motors
WO2017136763A1 (en) 2016-02-04 2017-08-10 Knowles Electronics, Llc Differential mems microphone
WO2017136744A1 (en) 2016-02-04 2017-08-10 Knowles Electronics, Llc Microphone and pressure sensor
US20170240418A1 (en) * 2016-02-18 2017-08-24 Knowles Electronics, Llc Low-cost miniature mems vibration sensor
WO2017205533A1 (en) 2016-05-26 2017-11-30 Knowles Electronics, Llc Microphone device with integrated pressure sensor
US11104571B2 (en) 2016-06-24 2021-08-31 Knowles Electronics, Llc Microphone with integrated gas sensor
US10499150B2 (en) 2016-07-05 2019-12-03 Knowles Electronics, Llc Microphone assembly with digital feedback loop
US10206023B2 (en) 2016-07-06 2019-02-12 Knowles Electronics, Llc Transducer package with through-vias
US10153740B2 (en) 2016-07-11 2018-12-11 Knowles Electronics, Llc Split signal differential MEMS microphone
US9860623B1 (en) 2016-07-13 2018-01-02 Knowles Electronics, Llc Stacked chip microphone
US10257616B2 (en) 2016-07-22 2019-04-09 Knowles Electronics, Llc Digital microphone assembly with improved frequency response and noise characteristics
DE112017003785B4 (en) 2016-07-27 2021-09-02 Knowles Electronics, Llc Microelectromechanical system (MEMS) device package
CN110024281B (en) 2016-10-28 2024-05-07 三星电子株式会社 Transducer assembly and method
DE112017006148B4 (en) 2016-12-05 2024-04-25 Knowles Electronics, Llc RAMPING SENSOR PERFORMANCE IN A MICROELECTROMECHANICAL SYSTEM DEVICE
CN106454669B (en) * 2016-12-06 2022-05-27 无锡红光微电子股份有限公司 MEMS microphone encapsulation
US10315912B2 (en) 2016-12-28 2019-06-11 Knowles Electronics, Llc Microelectromechanical system microphone
US11218804B2 (en) 2017-02-14 2022-01-04 Knowles Electronics, Llc System and method for calibrating microphone cut-off frequency
PL3373597T3 (en) * 2017-03-07 2020-02-28 G.R.A.S. Sound & Vibration A/S Low profile surface mount microphone
EP3855129B1 (en) 2017-03-22 2023-10-25 Knowles Electronics, LLC Interface circuit for a capacitive sensor
CN110710225B (en) * 2017-05-25 2021-05-11 美商楼氏电子有限公司 Microphone device and method for manufacturing microphone device
US10887712B2 (en) 2017-06-27 2021-01-05 Knowles Electronics, Llc Post linearization system and method using tracking signal
US11274034B2 (en) 2017-07-26 2022-03-15 Knowles Electronics, Llc Acoustic relief in MEMS
CN111095948B (en) 2017-09-08 2021-05-11 美商楼氏电子有限公司 System and method for reducing microphone noise
WO2019055858A1 (en) 2017-09-18 2019-03-21 Knowles Electronics, Llc System and method for acoustic hole optimization
DE112018005381T5 (en) * 2017-09-21 2020-06-25 Knowles Electronics, Llc INCREASED MEMS DEVICE IN A MICROPHONE WITH PENETRATION PROTECTION
CN111344248A (en) 2017-11-14 2020-06-26 美商楼氏电子有限公司 Sensor package with ingress protection
CN112088539B (en) 2018-03-21 2022-06-03 美商楼氏电子有限公司 Microphone and control circuit for same
US10820083B2 (en) 2018-04-26 2020-10-27 Knowles Electronics, Llc Acoustic assembly having an acoustically permeable membrane
CN112189347B (en) 2018-05-18 2022-10-04 美商楼氏电子有限公司 Microphone assembly and method of forming a microphone assembly
US11095990B2 (en) 2018-06-19 2021-08-17 Knowles Electronics, Llc Microphone assembly with reduced noise
CN112335263B (en) 2018-06-19 2022-03-18 美商楼氏电子有限公司 Integrated circuit, microphone assembly and sensor system
US11467025B2 (en) * 2018-08-17 2022-10-11 Invensense, Inc. Techniques for alternate pressure equalization of a sensor
US11206494B2 (en) 2018-10-05 2021-12-21 Knowles Electronics, Llc Microphone device with ingress protection
WO2020072938A1 (en) 2018-10-05 2020-04-09 Knowles Electronics, Llc Methods of forming mems diaphragms including corrugations
DE112019005007T5 (en) 2018-10-05 2021-07-15 Knowles Electronics, Llc Acoustic transducer with a low pressure zone and membranes that have increased compliance
WO2020076846A1 (en) 2018-10-09 2020-04-16 Knowles Electronics, Llc Digital transducer interface scrambling
WO2020123550A2 (en) 2018-12-11 2020-06-18 Knowles Electronics, Llc Multi-rate integrated circuit connectable to a sensor
US11598821B2 (en) 2019-01-22 2023-03-07 Knowles Electronics, Llc. Leakage current detection from bias voltage supply of microphone assembly
US11197104B2 (en) 2019-01-25 2021-12-07 Knowles Electronics, Llc MEMS transducer including free plate diaphragm with spring members
WO2020160348A1 (en) 2019-02-01 2020-08-06 Knowles Electronics, Llc Microphone assembly with back volume vent
EP3694222B1 (en) 2019-02-06 2024-05-15 Knowles Electronics, LLC Sensor arrangement and method
US10694297B1 (en) * 2019-03-25 2020-06-23 Fortemedia, Inc. Back chamber volume enlargement microphone package
DE102019125815A1 (en) * 2019-09-25 2021-03-25 USound GmbH Sound transducer unit for generating and / or detecting sound waves in the audible wavelength range and / or in the ultrasonic range
US11778390B2 (en) 2019-11-07 2023-10-03 Knowles Electronics, Llc. Microphone assembly having a direct current bias circuit
CN213694049U (en) * 2019-12-10 2021-07-13 楼氏电子(苏州)有限公司 Microphone assembly and microphone assembly substrate
DE202020107185U1 (en) 2019-12-23 2021-01-13 Knowles Electronics, Llc A microphone assembly incorporating a DC bias circuit with deep trench isolation
US11787690B1 (en) 2020-04-03 2023-10-17 Knowles Electronics, Llc. MEMS assembly substrates including a bond layer
US11240600B1 (en) 2020-11-12 2022-02-01 Knowles Electronics, Llc Sensor assembly and electrical circuit therefor
US11671775B2 (en) 2020-12-30 2023-06-06 Knowles Electronics, Llc Microphone assembly with transducer sensitivity drift compensation and electrical circuit therefor
US11743666B2 (en) 2020-12-30 2023-08-29 Knowles Electronics, Llc. Microphone assembly with transducer sensitivity drift compensation and electrical circuit therefor
US11916575B2 (en) 2020-12-31 2024-02-27 Knowleselectronics, Llc. Digital microphone assembly with improved mismatch shaping
US11909387B2 (en) 2021-03-17 2024-02-20 Knowles Electronics, Llc. Microphone with slew rate controlled buffer
US11897762B2 (en) 2021-03-27 2024-02-13 Knowles Electronics, Llc. Digital microphone with over-voltage protection
US11528546B2 (en) 2021-04-05 2022-12-13 Knowles Electronics, Llc Sealed vacuum MEMS die
US11540048B2 (en) 2021-04-16 2022-12-27 Knowles Electronics, Llc Reduced noise MEMS device with force feedback
US11649161B2 (en) 2021-07-26 2023-05-16 Knowles Electronics, Llc Diaphragm assembly with non-uniform pillar distribution
US11772961B2 (en) 2021-08-26 2023-10-03 Knowles Electronics, Llc MEMS device with perimeter barometric relief pierce
US11780726B2 (en) 2021-11-03 2023-10-10 Knowles Electronics, Llc Dual-diaphragm assembly having center constraint
CN114363782A (en) * 2022-01-10 2022-04-15 华天科技(南京)有限公司 Silicon microphone sensor structure and manufacturing method

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004200766A (en) * 2002-12-16 2004-07-15 Karaku Denshi Kofun Yugenkoshi Capacitor microphone and its manufacturing method
US20050018864A1 (en) * 2000-11-28 2005-01-27 Knowles Electronics, Llc Silicon condenser microphone and manufacturing method
WO2005086535A1 (en) * 2004-03-09 2005-09-15 Matsushita Electric Industrial Co., Ltd. Electret capacitor microphone

Family Cites Families (26)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61278295A (en) * 1985-06-04 1986-12-09 Matsushita Electric Ind Co Ltd Directional dynamic microphone unit
JPS6453618A (en) * 1987-08-25 1989-03-01 Matsushita Electric Ind Co Ltd Crystal oscillator
JPH0263590U (en) 1988-10-31 1990-05-11
JPH042194A (en) * 1990-04-19 1992-01-07 Sanyo Electric Co Ltd Coating apparatus
JPH05143875A (en) * 1991-11-19 1993-06-11 Tec Eng Kk Robbery preventive alarm device
JP3106026B2 (en) * 1993-02-23 2000-11-06 日本碍子株式会社 Piezoelectric / electrostrictive actuator
JPH09260948A (en) * 1996-03-21 1997-10-03 Matsushita Electric Ind Co Ltd Crystal oscillator
JPH1062286A (en) * 1996-08-23 1998-03-06 Tokin Corp Electrostatic capacitance type pressure sensor
JPH10213505A (en) * 1997-01-28 1998-08-11 Tokin Corp Pressure sensor
JP2000048952A (en) * 1998-07-30 2000-02-18 Tdk Corp Organic el element module
JP3287330B2 (en) 1999-04-22 2002-06-04 日本電気株式会社 High frequency circuit shield structure
CN1205841C (en) 1999-09-06 2005-06-08 声扬灵比股份有限公司 Pressure transducer
JP3805576B2 (en) 1999-09-14 2006-08-02 松下電器産業株式会社 Vibration transducer and acceleration sensor equipped with the vibration transducer
JP2001264201A (en) * 2000-03-17 2001-09-26 Tokin Corp Capacitance type pressure sensor
US7166910B2 (en) * 2000-11-28 2007-01-23 Knowles Electronics Llc Miniature silicon condenser microphone
GB2386031B (en) 2000-12-22 2004-08-18 Bruel & Kjaer Sound & Vibratio A highly stable micromachined capacitive transducer
JP2003134592A (en) * 2001-10-25 2003-05-09 Minebea Co Ltd Speaker
AU2003221959A1 (en) 2002-04-15 2003-11-03 Kevin S. Jones Single crystal silicon membranes for microelectromechanical applications
US6781231B2 (en) * 2002-09-10 2004-08-24 Knowles Electronics Llc Microelectromechanical system package with environmental and interference shield
DE10303263B4 (en) * 2003-01-28 2012-01-05 Infineon Technologies Ag microphone array
US7466835B2 (en) 2003-03-18 2008-12-16 Sonion A/S Miniature microphone with balanced termination
KR200330089Y1 (en) 2003-07-29 2003-10-11 주식회사 비에스이 Integrated base and electret condenser microphone using the same
JP2007124449A (en) * 2005-10-31 2007-05-17 Sanyo Electric Co Ltd Microphone and microphone module
JP2007178221A (en) * 2005-12-27 2007-07-12 Yamaha Corp Semiconductor device, its manufacturing method, and spacer manufacturing method
US7436054B2 (en) * 2006-03-03 2008-10-14 Silicon Matrix, Pte. Ltd. MEMS microphone with a stacked PCB package and method of producing the same
JP5006705B2 (en) 2007-06-18 2012-08-22 株式会社クボタ Walking type management machine

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20050018864A1 (en) * 2000-11-28 2005-01-27 Knowles Electronics, Llc Silicon condenser microphone and manufacturing method
JP2004200766A (en) * 2002-12-16 2004-07-15 Karaku Denshi Kofun Yugenkoshi Capacitor microphone and its manufacturing method
WO2005086535A1 (en) * 2004-03-09 2005-09-15 Matsushita Electric Industrial Co., Ltd. Electret capacitor microphone

Cited By (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8861312B2 (en) 2007-03-14 2014-10-14 Qualcomm Incorporated MEMS microphone
WO2010051707A1 (en) * 2008-11-07 2010-05-14 歌尔声学股份有限公司 Silicon microphone
US8519492B2 (en) * 2009-10-19 2013-08-27 Bse Co., Ltd. Silicon condenser microphone having an additional back chamber and a fabrication method therefor
EP2493214A4 (en) * 2009-10-19 2017-08-16 BSE Co., Ltd. Silicon condenser microphone having an additional back chamber and a fabrication method therefor
US20110266641A1 (en) * 2009-10-19 2011-11-03 Bse Co., Ltd. Silicon condenser microphone having an additional back chamber and a fabrication method therefor
US8577063B2 (en) * 2010-02-18 2013-11-05 Analog Devices, Inc. Packages and methods for packaging MEMS microphone devices
US20110198714A1 (en) * 2010-02-18 2011-08-18 Analog Devices, Inc. Packages and methods for packaging mems microphone devices
CN102457789A (en) * 2010-10-19 2012-05-16 宝星电子股份有限公司 Surface-mount microphone
US8447057B2 (en) 2011-03-18 2013-05-21 Analog Devices, Inc. Packages and methods for packaging MEMS microphone devices
US8625832B2 (en) 2011-04-04 2014-01-07 Invensense, Inc. Packages and methods for packaging microphone devices
US8779535B2 (en) 2012-03-14 2014-07-15 Analog Devices, Inc. Packaged integrated device die between an external and internal housing
US9661408B2 (en) 2012-10-26 2017-05-23 Analog Devices, Inc. Packages and methods for packaging
US10730743B2 (en) 2017-11-06 2020-08-04 Analog Devices Global Unlimited Company Gas sensor packages
DE102017128956A1 (en) * 2017-12-06 2019-06-06 Peiker Acustic Gmbh & Co Kg Microphone assembly and method of making a microphone assembly
US11587839B2 (en) 2019-06-27 2023-02-21 Analog Devices, Inc. Device with chemical reaction chamber

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JP2008533950A (en) 2008-08-21
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US20090092274A1 (en) 2009-04-09
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EP1875773A4 (en) 2011-01-12
EP1875773A1 (en) 2008-01-09

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