CN102457789A - Surface-mount microphone - Google Patents

Surface-mount microphone Download PDF

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Publication number
CN102457789A
CN102457789A CN2011102416234A CN201110241623A CN102457789A CN 102457789 A CN102457789 A CN 102457789A CN 2011102416234 A CN2011102416234 A CN 2011102416234A CN 201110241623 A CN201110241623 A CN 201110241623A CN 102457789 A CN102457789 A CN 102457789A
Authority
CN
China
Prior art keywords
mentioned
cover member
installing type
foot section
pad
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN2011102416234A
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Chinese (zh)
Inventor
李相镐
宋在景
张弘圭
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
DONGGUAN BAOXING ELECTRONICS Co Ltd
RONGCHENG BAOXING ELECTRONIC CO Ltd
TIANJIN BSE ELECTRONICS CO Ltd
BSE Co Ltd
Original Assignee
DONGGUAN BAOXING ELECTRONICS Co Ltd
RONGCHENG BAOXING ELECTRONIC CO Ltd
TIANJIN BSE ELECTRONICS CO Ltd
BSE Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by DONGGUAN BAOXING ELECTRONICS Co Ltd, RONGCHENG BAOXING ELECTRONIC CO Ltd, TIANJIN BSE ELECTRONICS CO Ltd, BSE Co Ltd filed Critical DONGGUAN BAOXING ELECTRONICS Co Ltd
Publication of CN102457789A publication Critical patent/CN102457789A/en
Pending legal-status Critical Current

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    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04RLOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R19/00Electrostatic transducers
    • H04R19/04Microphones

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  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Acoustics & Sound (AREA)
  • Signal Processing (AREA)
  • Electrostatic, Electromagnetic, Magneto- Strictive, And Variable-Resistance Transducers (AREA)
  • Details Of Audible-Bandwidth Transducers (AREA)

Abstract

The present invention relates to a surface-mount microphone comprising: a printed circuit board provided with a plurality of pads for electrical connection on the lower surface thereof; a metallic cover member connected to the printed circuit board, thereby forming a closed inner space, the cover member having at one side thereof a sound hole through which sound from the outside can be introduced; and a connecting means for connecting the printed circuit board to the cover member, wherein the cover member is provided with at least one leg part extending from at least a part of the lower end portion of the cover member such that when the surface-mount microphone is mounted onto a substrate of a user's hardware, the leg part can be inserted into and connected to a coupling slot provided in the substrate of a user's hardware. Since the present invention is provided with the leg part extending from the lower end portion of the cover member, the present invention can achieve the effects of improving coupling force and durability against shock, etc.

Description

The surface installing type microphone
Technical field
The present invention relates to the surface installing type microphone, in more detail, relate to a kind of like this surface installing type microphone: on cover member, possess foot section, the durability of contingent external impact is improved in the process of using being installed on user's product.
Background technology
Usually, microphone is as the device that external sound signal is converted to the signal of telecommunication, and the multifunctional intellectual transducer that mainly is built in Medical Devices such as communication equipments such as mobile phone, smart mobile phone, MP3, telephone set and hearing aids or miniaturization uses.
According to the difference of concrete formation, microphone is divided into numerous species such as electret condenser microphone (electret condenser microphone), digital microphone (digital microphone), micro electromechanical (MEMS) silicon microphone.
No matter these microphones are any, include printed circuit board (PCB) and form the cover member of inner space and constitute with being incorporated into this printed circuit board (PCB).In this inner space, possess and convert tones into the required electronic unit of the signal of telecommunication, for example capacitor, various semiconductor chip (chip), mems chip (MEMS DIE), AS IC (Application Specific Integrated Circuit-application-specific integrated circuit (ASIC)), amplifier, filter etc.Usually, these electronic units all are installed on the printed circuit board (PCB).
And any microphone no matter at the downside of the employed printed circuit board (PCB) of most of microphone, all has a plurality of pads (pad) of being electrically connected with user's product of being used for.This pad is also referred to as terminal.These pads are respectively applied for purposes such as ground connection, power supply input and data output.
On the other hand, utilize methods such as scolding tin, welding, these pads are connected on the user's product that uses microphone, for example, on the substrates that product possessed such as mobile phone, PDA, smart mobile phone, thereby microphone itself also is installed on this product.
That is, common microphone is to be welded on the substrate of user's product through the pad that the printed circuit board (PCB) downside with microphone is possessed, and realization is electrically connected with user's product, also is fixed on user's product certainly.
But; Microphone is not owing to there is other structure for fixing to user's product; Only rely on and borrow the combination of pad to fix on user's product; Therefore, applying to user's product under the situation of external impact, producing the problems such as the disconnection or the instability that becomes that are electrically connected between pad and the user's product.
Illustration has surface installing type microphone 100 in the past among Fig. 1 to Fig. 3.
Surface installing type microphone 100 in the past possesses cover member 102 and printed circuit board (PCB) 104 is arranged.On cover member 102, possessing has sound equipment hole 103, cover member 102 utilize as epoxy resin adhesive 106 be incorporated on the printed circuit board (PCB) 104.
Downside at printed circuit board (PCB) 104 has 4 pads 108.Be respectively applied for ground connection (Ground), power supply input, data output, all the other one just is used for harmonious the combination.
With reference to Fig. 3, surface installing type microphone 100 in the past is welded in the surface mounting technology (SMT) like the substrate 120 of user's product of mobile phone, PDA through the pad that printed circuit board (PCB) 104 downsides are possessed, and is incorporated on user's product.The pad 108 of printed circuit board (PCB) 104 passes through to be together with each other like combination members such as welding rod 110,112 with the substrate of user's product 120.
If in this state, user's product receives external impact or lasting vibration, then produces following problem: impact also can be delivered to combination member 110,112, thereby being electrically connected between pad 108 and the substrate 120 broken off or the instability that becomes.
Because along with the miniaturization gradually of nearest user's product, inner substrate also is the trend of attenuation gradually, therefore, this problem is more outstanding.And; Have following problem: because to as project such as impact, vibrate, fall; The reliability benchmark that the user requires also improves day by day; Therefore, only rely on the combination member of pad to combine to be fixed on user's product and the surface installing type microphone in the past that uses is difficult to satisfy this reliability benchmark that improves day by day.
Summary of the invention
The present invention proposes in order to address the above problem, and the object of the present invention is to provide a kind of like this surface installing type microphone: further have foot section through making cover member, thereby make the durability like external impact such as impact or vibrations is improved.
Surface installing type microphone of the present invention comprises: printed circuit board (PCB), and it possesses a plurality of pads that are used to be electrically connected (pad) at its downside; The cover member of metal material, it is incorporated into above-mentioned printed circuit board (PCB), forms airtight inner space, and forms the sound equipment hole that can import external voice in a side; And combination member; Above-mentioned printed circuit board (PCB) and above-mentioned cover member are mutually combined, it is characterized in that, wherein; Above-mentioned cover member possesses a foot section at least; This foot section is prolonged and is formed by at least a portion of cover member downside end, when above-mentioned surface installing type microphone is installed on the substrate of user's product, can insert the engagement groove that substrate possessed that is incorporated into user's product.
On the other hand, comparatively ideal is that above-mentioned cover member is a metal material, is the open substantive hexahedron in below, and above-mentioned foot section is respectively formed on the respect to one another a pair of side of above-mentioned cover member, and the part of the downside end of this side prolongs and forms.
And comparatively ideal is to form two above-mentioned foot section at the downside end of above-mentioned each side, and is spaced from each other distance.
On the other hand, comparatively ideal is that above-mentioned cover member is a metal material, is the open substantive hexahedron in its below, and above-mentioned foot section is that the part of the downside end of each side of above-mentioned cover member prolongs and forms.
In addition, comparatively ideal is that a plurality of pads that downside possessed of above-mentioned printed circuit board (PCB) comprise: the 1st pad, and it is along peripheral part in the form of a ring; The 2nd pad and the 3rd pad, it is positioned at the inboard of above-mentioned the 1st pad, with the 1st pad partition distance.
And comparatively ideal is that above-mentioned cover member and foot section play the effect of earth terminal when above-mentioned foot section is incorporated on the substrate of above-mentioned user's product formed engagement groove.
In addition, comparatively ideal is that above-mentioned combination member is that any one in the glue solidified in epoxy resin, conductive epoxy, non-conductive epoxy resin, silver paste, silicon, polyurethane, acrylic resin, welding paste and ultraviolet ray (UV).
According to surface installing type microphone of the present invention, can obtain following effect: because cover member has foot section, the operation that therefore the surface installing type microphone is installed on user's product substrate is more or less freely, and adhesion also is improved.
In addition, can obtain following effect: because cover member has foot section, when the surface installing type microphone is installed on the substrate of user's product, though receive as fall, external impact such as vibration, also can improve the durability of the electrical bond of pad.
In addition, can obtain following effect: because cover member is metal material, when using as earth terminal on the substrate that is incorporated into user's product, contact area increases, thereby improves surface installing type microphone acoustic characteristic.
Description of drawings
Fig. 1 is the stereogram of surface installing type microphone in the past,
Fig. 2 is the accompanying drawing of the downside of expression surface installing type microphone shown in Figure 1,
Fig. 3 is the concise and to the point profile that surface installing type microphone shown in Figure 1 is installed on the state on the substrate of user's product,
Fig. 4 is the stereogram of the surface installing type microphone of one embodiment of the invention,
Fig. 5 is the accompanying drawing from beneath surface installing type microphone shown in Figure 4,
Fig. 6 is the profile of the part of surface installing type microphone shown in Figure 4,
Fig. 7 to Fig. 9 is the accompanying drawing that expression surface installing type microphone shown in Figure 4 is installed on the situation on the substrate of user's product.
Symbol description
1-surface installing type microphone
The 10-printed circuit board (PCB)
12,14,16-the 1st, 2,3 pads
The 20-cover member
22-sound equipment hole
The 30-foot section
The 40-combination member
Embodiment
Fig. 4 to Fig. 9 with reference to the accompanying drawings, the surface installing type microphone 1 of detailed description one embodiment of the invention.
As stated, above-mentioned surface installing type microphone 1 is the mini table surface installation type microphone that is mainly used in like the precision equipment of communication equipments such as mobile phone, smart mobile phone, notebook computer, MP3, telephone set.Under the situation of present embodiment; Surface installing type microphone 1 is that micro electronmechanical (MEMS) microphone that comprises mems chip with portion space within it is an example; But in addition, also can be the multiple microphone that comprises electret condenser microphone (electret condenser microphone), digital microphone (digital microphone) etc.
Surface installing type microphone 1 comprises printed circuit board (PCB) 10, cover member 20, foot section 30 and combination member 40 and constitutes.
Above-mentioned printed circuit board (PCB) 10 is as common printed circuit board (PCB), has at its downside to be used for a plurality of pads 12,14,16 of being electrically connected with user's product.In addition, on the upper side of printed circuit board (PCB) 10, be printed with circuit, and electric component is installed.On the other hand, pad is also referred to as terminal.
Under the situation of present embodiment, a plurality of pads comprise the 1st pad the 12, the 2nd pad 14 and the 3rd pad 16.As shown in Figure 5, above-mentioned the 1st pad 12 is along printed circuit board (PCB) 10 peripheral parts and roughly forms foursquare ring-type.The 1st pad 16 plays ground connection (Ground) effect since with compared in the past, area is relatively large, thereby the effect of the microphone acoustic characteristic that can be improved.
Above-mentioned the 2nd pad 14 and the 3rd pad 16 play the effect of power supply and dateout respectively.2nd, 3 pads 14,16 are in the inner space of the 1st pad 12, with the mode partition distance of arranging with the 1st pad 12.
Above-mentioned cover member 20 mutually combine with printed circuit board (PCB) 10 and within it portion form airtight inner space.In inner space 14, possess to have and play the electrical and electronic parts that converts tones into action of electric signals.Under the situation of present embodiment, these electrical and electronic parts are the parts that comprise MEMS chip (MEMS Chip), but under the situation of other embodiment, can diversely be out of shape.
Cover member 20 is a metal material, is formed with sound equipment hole 22 in a side, so that external voices such as voice can import into to the inner space.Cover member 20 is the open substantive hexahedral shape of downside.
Above-mentioned foot section 30 is when surface installing type microphone 1 is installed on the substrate of user's product, can insert the combined hole that has in advance on the substrate that is incorporated into this user's product and constitutes.Foot section 30 is integrally formed with cover member 20, and is metal material.
Under the situation of present embodiment, on the long side of foot section 30 in two pairs of sides respect to one another of cover member 20.Foot section 30 is formed with 2 respectively on each side.Be that a part by the downside end of this each side prolongs and forms.
With reference to Fig. 6, foot section 30 is that the part of cover member 20 sides is first after horizontal direction prolongs slightly, forms to prolongation to vertical lower again.The length that the downward direction of foot section 30 prolongs forms with the length that can insert the engagement groove 204 (with reference to Fig. 7) that forms in advance on the substrate that is fixed in user's product fully.
On the other hand, under the situation of present embodiment, foot section 30 has 4, on a pair of side respect to one another, respectively have 2 respectively, but the present invention is defined in this.That is, under the situation of other embodiment, the number of foot section 30 and position can diversely be out of shape.
For example, although not shown,, foot section can respectively form one on 4 sides, or also can on adjacent side, respectively form one respectively, and maybe can also be that the bottom of a pair of relative side is whole prolongs and forms.
When a plurality of pad 12,14,16 electrical bond were on the substrate of user's product, foot section 30 combined to be fixed in the engagement groove 204 (with reference to Fig. 7 to Fig. 9) on the substrate of above-mentioned user's product.
On the other hand, the formed pad of printed circuit board (PCB) 10 downsides utilizes surface mounting technology (SMT usually; Surface mounting technology) be installed on the substrate of user's product, therefore, comparatively ideal is on the substrate that pad is installed on user's product the time, and foot section 30 also together is fixed on the substrate.At this moment, foot section 30 can be electrically connected with the 1st pad 12.
Above-mentioned combination member 40 is formations that printed circuit board (PCB) 10 and cover member 20 are mutually combined.Combination member 40 comprises the adhesive like the epoxy resin of liquid condition, can after being injected into the contact portion of the printed circuit board (PCB) that fits together each other 10 and cover member 20, harden to form.
On the other hand, combination member 40 can also be that silver paste, silicon, polyurethane, acrylic resin, welding paste, ultraviolet ray (UV) solidify any one in the glue except that epoxy resin.
Below, the effect and the effect of the surface installing type microphone 1 that possesses above-mentioned formation described.
The surface installing type microphone 1 of present embodiment possesses the part that cover member 20 bottoms are arranged and prolongs and the foot section 30 of formation; Therefore; When the surface installing type microphone was installed on the substrate of user's product, foot section 30 also can be incorporated into the engagement groove that forms in advance on the substrate of user's product.Therefore, have following advantage: the combination durability of contingent impact significantly improves in the use of 1 pair of user's product of surface installing type microphone.
In addition, have following advantage: cover member 20 and foot section 30 are conductive metal materials, so the increase of the contact area of surface installing type microphone, thereby acoustic characteristic improves.
In addition, have following advantage: cover member 20 has foot section 30, so the adhesion between the substrate 200 of surface installing type microphone 1 and user's product is firmer.
In Fig. 7 to Fig. 9, the situation of the fastener hole 204 that the substrate 200 that illustration has 4 foot section 30 that the surface installing type microphone 1 of present embodiment possessed to insert to be incorporated into user's product is possessed.
The pad 12,14,16 that printed circuit board (PCB) 10 downsides of surface installing type microphone 1 are possessed through having utilized the methods such as welding of surface mounting technology, is incorporated into the printed circuit pattern 202,206,208 that the substrate 200 of user's product is possessed respectively.At this moment, foot section 30 is also inserted corresponding fastener hole 204 respectively, thereby methods such as utilization welding combine.
On the other hand; Has following advantage: under the situation of present embodiment; Pad that printed circuit board (PCB) 10 downsides are possessed 12,14,16 is for along earthy the 1st pad 12 of printed circuit board (PCB) peripheral part with at the 2nd, 3 inboard pads 14,16 of the 1st pad 12; Therefore, when the surface installing type microphone is installed on the substrate of user's product, the possibility that have foot section 30 and the 2nd, 3 pads 14 hardly, is short-circuited between 16.
On the other hand, under the situation of present embodiment, if remove foot section 30, surface installing type microphone 1 is flat hexahedral shape.But the present invention is defined in this shape.That is, under the situation of other embodiment, as long as foot section is formed at the bottom of side, then the shape of the surface installing type microphone except that foot section can be deformed into multiple shape, for example cylindrical, elliptical cylinder-shape, polygon cylindricality etc.

Claims (7)

1. surface installing type microphone comprises:
Printed circuit board (PCB), it possesses a plurality of pads that are used to be electrically connected (pad) at its downside;
The cover member of metal material, it is incorporated into above-mentioned printed circuit board (PCB), forms airtight inner space, and forms the sound equipment hole that can import external voice in a side; And
Combination member mutually combines above-mentioned printed circuit board (PCB) and above-mentioned cover member,
It is characterized in that,
Above-mentioned cover member possesses a foot section at least; This foot section is prolonged and is formed by at least a portion of cover member downside end; When above-mentioned surface installing type microphone is installed on the substrate of user's product, can insert the engagement groove that substrate possessed that is incorporated into user's product.
2. surface installing type microphone according to claim 1 is characterized in that,
Above-mentioned cover member is a metal material, is the open substantive hexahedron in below,
Above-mentioned foot section is respectively formed on the respect to one another a pair of side of above-mentioned cover member, and the part of the downside end of this side prolongs and forms.
3. surface installing type microphone according to claim 2 is characterized in that,
Downside end in above-mentioned each side forms two above-mentioned foot section, and is spaced from each other distance.
4. surface installing type microphone according to claim 1 is characterized in that,
Above-mentioned cover member is a metal material, is the open substantive hexahedron in its below,
Above-mentioned foot section is that the part of the downside end of each side of above-mentioned cover member prolongs and forms.
5. surface installing type microphone according to claim 1 is characterized in that,
A plurality of pads that downside possessed of above-mentioned printed circuit board (PCB) comprise: the 1st pad, and it is along peripheral part in the form of a ring; The 2nd pad and the 3rd pad, it is positioned at the inboard of above-mentioned the 1st pad, with the 1st pad partition distance.
6. surface installing type microphone according to claim 5 is characterized in that,
When above-mentioned foot section was incorporated on the substrate of above-mentioned user's product formed engagement groove, above-mentioned cover member and foot section played the effect of earth terminal.
7. surface installing type microphone according to claim 1 is characterized in that,
Above-mentioned combination member is that any one in the glue solidified in epoxy resin, conductive epoxy, non-conductive epoxy resin, silver paste, silicon, polyurethane, acrylic resin, welding paste and ultraviolet ray (UV).
CN2011102416234A 2010-10-19 2011-08-19 Surface-mount microphone Pending CN102457789A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR1020100101883A KR101156052B1 (en) 2010-10-19 2010-10-19 surface mounting type microphone
KR10-2010-0101883 2010-10-19

Publications (1)

Publication Number Publication Date
CN102457789A true CN102457789A (en) 2012-05-16

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CN2011203056725U Expired - Fee Related CN202172476U (en) 2010-10-19 2011-08-19 Surface mounting microphone

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KR (1) KR101156052B1 (en)
CN (2) CN102457789A (en)
WO (1) WO2012053708A1 (en)

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1917382A (en) * 2005-06-28 2007-02-21 捷讯研究有限公司 Microphone coupler for communication device
WO2007129787A1 (en) * 2006-05-09 2007-11-15 Bse Co., Ltd. Silicon condenser microphone having additional back chamber and sound hole in pcb
CN201072476Y (en) * 2007-06-21 2008-06-11 中兴通讯股份有限公司 LCD module group with hand-written function
CN202178857U (en) * 2010-10-12 2012-03-28 宝星电子股份有限公司 Microphone device

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR19990073516A (en) * 1998-11-19 1999-10-05 장세열 Electric-Acoustic Transducer Having Moving Magnet and Transducing Method thereof
KR100982239B1 (en) * 2007-11-02 2010-09-14 주식회사 비에스이 Mems microphone package

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1917382A (en) * 2005-06-28 2007-02-21 捷讯研究有限公司 Microphone coupler for communication device
WO2007129787A1 (en) * 2006-05-09 2007-11-15 Bse Co., Ltd. Silicon condenser microphone having additional back chamber and sound hole in pcb
CN201072476Y (en) * 2007-06-21 2008-06-11 中兴通讯股份有限公司 LCD module group with hand-written function
CN202178857U (en) * 2010-10-12 2012-03-28 宝星电子股份有限公司 Microphone device
CN102447985A (en) * 2010-10-12 2012-05-09 宝星电子股份有限公司 Microphone device

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KR101156052B1 (en) 2012-06-20
KR20120040452A (en) 2012-04-27
CN202172476U (en) 2012-03-21
WO2012053708A1 (en) 2012-04-26

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Application publication date: 20120516