WO2007119291A1 - 版、この版を用いたパターン形成装置、およびパターン形成方法 - Google Patents
版、この版を用いたパターン形成装置、およびパターン形成方法 Download PDFInfo
- Publication number
- WO2007119291A1 WO2007119291A1 PCT/JP2007/053283 JP2007053283W WO2007119291A1 WO 2007119291 A1 WO2007119291 A1 WO 2007119291A1 JP 2007053283 W JP2007053283 W JP 2007053283W WO 2007119291 A1 WO2007119291 A1 WO 2007119291A1
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- WIPO (PCT)
- Prior art keywords
- pattern
- electrode
- plate
- developer
- ultrasonic wave
- Prior art date
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Classifications
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B5/00—Optical elements other than lenses
- G02B5/20—Filters
- G02B5/201—Filters in the form of arrays
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41F—PRINTING MACHINES OR PRESSES
- B41F17/00—Printing apparatus or machines of special types or for particular purposes, not otherwise provided for
- B41F17/08—Printing apparatus or machines of special types or for particular purposes, not otherwise provided for for printing on filamentary or elongated articles, or on articles with cylindrical surfaces
- B41F17/14—Printing apparatus or machines of special types or for particular purposes, not otherwise provided for for printing on filamentary or elongated articles, or on articles with cylindrical surfaces on articles of finite length
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41F—PRINTING MACHINES OR PRESSES
- B41F17/00—Printing apparatus or machines of special types or for particular purposes, not otherwise provided for
- B41F17/24—Printing apparatus or machines of special types or for particular purposes, not otherwise provided for for printing on flat surfaces of polyhedral articles
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41F—PRINTING MACHINES OR PRESSES
- B41F35/00—Cleaning arrangements or devices
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41M—PRINTING, DUPLICATING, MARKING, OR COPYING PROCESSES; COLOUR PRINTING
- B41M1/00—Inking and printing with a printer's forme
- B41M1/10—Intaglio printing ; Gravure printing
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B5/00—Optical elements other than lenses
- G02B5/20—Filters
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
- H05K3/1266—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by electrographic or magnetographic printing
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/01—Tools for processing; Objects used during processing
- H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
- H05K2203/0117—Pattern shaped electrode used for patterning, e.g. plating or etching
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/01—Tools for processing; Objects used during processing
- H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
- H05K2203/0143—Using a roller; Specific shape thereof; Providing locally adhesive portions thereon
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
- H05K2203/0285—Using ultrasound, e.g. for cleaning, soldering or wet treatment
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/05—Patterning and lithography; Masks; Details of resist
- H05K2203/0502—Patterning and lithography
- H05K2203/0517—Electrographic patterning
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/20—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern
- H05K3/207—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern using a prefabricated paste pattern, ink pattern or powder pattern
Definitions
- the present invention relates to, for example, a flat image display device, a wiring board, a plate used for manufacturing an IC tag, a pattern forming apparatus using the plate, and a pattern forming method.
- a photolithography technique has played a central role as a technique for forming a fine pattern on the surface of a substrate.
- this photolithography technology is increasing its resolution and performance, it requires huge and expensive manufacturing facilities, and the manufacturing cost is also increasing according to the resolution.
- inkjet technology has begun to be put to practical use as a patterning technology that makes the most of the features of simple equipment and non-contact patterning, but there are limits to high resolution and high productivity. I have to say that there is. That is, in this respect, electrophotographic technology, in particular, electrophotographic technology using liquid toner has excellent potential.
- An object of the present invention is to provide a plate capable of forming a high-definition pattern with high resolution, a pattern forming apparatus using the plate, and a pattern forming method.
- a plate of the present invention includes a holding unit that holds a pattern formed by a charged developer, and a first electrode that causes an electric field to act on the pattern held by the holding unit.
- An ultrasonic generator that generates an ultrasonic wave that acts on the pattern held by the holding unit.
- the pattern of the developer held by the holding unit is transferred to the transfer medium
- an electric field is formed between the supply member that supplies the developer and the first electrode, thereby forming the pattern of the holding unit.
- the ultrasonic wave is acted on the pattern of the holding part by operating the ultrasonic wave generating part so that the pattern is separated from the holding part of the plate and the medium to be transferred
- the pattern can be reliably transferred to the medium to be transferred.
- the plate of the present invention includes a high-resistance layer having a pattern-like concave portion opened on the surface, a first electrode layer provided on the back side of the high-resistance layer, and the first electrode.
- a piezoelectric layer provided on the back side of the layer, a second electrode layer provided on the back side of the piezoelectric layer, and an AC voltage applied between the first and second electrode layers to provide the piezoelectric body.
- the pattern forming apparatus of the present invention includes a holding unit that holds a pattern formed by a charged developer, a first electrode that causes an electric field to act on the pattern held by the holding unit, and the holding A plate having an ultrasonic wave generating unit that generates an ultrasonic wave that acts on the pattern held by the unit, and supplying the charged developer to the holding unit via a supply member facing the holding unit.
- a developing device that forms an electric field between the supply member and the first electrode to form a pattern with a developer on the holding portion; a transfer medium that faces the holding portion that holds the pattern; An electric field is formed between the electrodes and the pattern is urged toward the transfer medium, and the pattern is held by applying an ultrasonic wave to the pattern via the ultrasonic wave generator. Part Peeled and having a transfer device for transferring to said transfer medium, a cleaning device for the pattern to clean the holder after transferring to the transfer medium, the.
- the pattern forming apparatus of the present invention includes a high resistance layer having a pattern-shaped recess opening on the surface, a first electrode layer provided on the back side of the high resistance layer, and the first A piezoelectric layer provided on the back side of the electrode layer, a second electrode layer provided on the back side of the piezoelectric layer, and an AC voltage applied between the first and second electrode layers to provide the piezoelectric body
- a liquid developer in which charged developer particles are dispersed is supplied to the surface through a plate having an ultrasonic wave generation unit that generates ultrasonic waves from the layer and a supply member facing the surface of the high resistance layer.
- a developing device that forms an electric field between the supply member and the first electrode layer, collects developer particles in the liquid developer in the recesses, and develops a pattern; and the high resistance layer An electric field is formed between the transfer medium facing the surface of the first electrode layer and the first electrode layer, The pattern in which the developer particles are collected in the concave portion is urged toward the transfer medium, and the ultrasonic wave is applied to the pattern via the ultrasonic wave generating portion, whereby the pattern is removed from the concave portion.
- a transfer device for peeling and transferring to the transfer medium; and And a cleaning device for cleaning the concave portion after the transfer to the transfer medium.
- the pattern forming method of the present invention includes a developing step of forming a pattern with the developer on a plate provided with an electrode for forming an electric field to be applied to the charged developer and an ultrasonic generator, and An electric field is formed between the electrode and the transfer medium with the transfer medium facing the plate on which the pattern by the developer is formed, and the pattern is biased toward the transfer medium. And a transfer step of operating the ultrasonic wave generation unit to apply ultrasonic waves to the pattern, peeling the pattern from the plate, and transferring the pattern to the transfer medium.
- FIG. 1 is a schematic diagram showing a pattern forming apparatus according to an embodiment of the present invention.
- FIG. 2 is a cross-sectional view of a pattern forming original plate used in the pattern forming apparatus of FIG.
- FIG. 3 is a diagram for explaining a wiring structure of individual electrodes of the pattern forming original plate of FIG.
- FIG. 4 is a plan view of the pattern forming original plate of FIG.
- FIG. 5 is a partially enlarged perspective view of FIG. 2 pattern forming original plate.
- FIG. 6 is a schematic diagram showing a developing device incorporated in the pattern forming apparatus of FIG.
- FIG. 7 is a schematic view for explaining a transfer process of the pattern forming apparatus of FIG. 1.
- FIG. 8 is a schematic view for explaining in detail the transfer process of the pattern forming apparatus of FIG. 1.
- FIG. 9 is a schematic view for explaining a cleaning process of the pattern forming apparatus of FIG. 1.
- FIG. 10 is a schematic diagram for explaining in detail the cleaning process of the pattern forming apparatus of FIG. 1.
- FIG. 11 is a schematic view showing a pattern forming apparatus according to another embodiment of the present invention.
- the pattern forming apparatus 10 is a plate-shaped pattern forming original plate 1 (plate) conveyed in the direction of arrow T in the figure, and is opposed to the lower side of the conveying path of the pattern forming original plate 1
- a plurality of developing devices 2r, 2g, and 2b (hereinafter collectively referred to as “developing devices”) are developed by supplying a liquid developer of each color (r: red, g: green, b: blue) to the pattern forming master 1.
- a transfer device 3 for transferring the developer particles held on the pattern forming original plate 1 to a flat plate-shaped transfer medium M waiting on the left side in the drawing.
- the pattern forming apparatus 10 includes an AC corona static eliminator 4 for neutralizing a surface of a high resistance layer 15 (to be described later) of the pattern forming original plate 1, and a surface of the high resistance layer 15 is, for example, +400 [V]. It has a DC corona charger 5 to be electrified and a cleaner 6 (cleaning device) for cleaning the pattern forming original plate 1 after transfer.
- FIG. 2 shows a cross-sectional view of the pattern forming original plate 1.
- a common electrode 12 (second electrode) made of a conductive layer such as aluminum is formed on the surface of an insulating substrate 11 such as a glass plate by vapor deposition or sputtering. , The second electrode layer) is formed, and then the piezoelectric layer 13 is formed.
- a conductive layer such as aluminum is formed by vapor deposition or sputtering, and by patterning the electrodes as shown in FIG. 3 by using a photolithography method or the like, the individual electrodes 14 (first electrodes , First electrode layer).
- patterning master 1 is completed by patterning high resistance layer 15.
- the piezoelectric layer 13 is formed of a piezoelectric material such as a PZT piezoelectric material, a lead titanate piezoelectric material, lithium niobate, or zinc oxide.
- the film thickness of the piezoelectric layer 13 is determined by the piezoelectric characteristics and driving frequency of the piezoelectric body. For example, in the case of a lead titanate-based piezoelectric body, when the driving frequency is 50 [MHz], 45 [/ m] It becomes a film thickness of about.
- a method for forming the piezoelectric layer 13 there is a method in which a thick film piezoelectric body is bonded with an adhesive such as an epoxy resin and then polished. When zinc oxide is used, the piezoelectric layer 13 is formed by sputtering. It can also be formed. Furthermore, it is possible to form the piezoelectric layer 13 by applying a piezoelectric material dispersed in a solvent and then baking it.
- the individual electrodes 14 are patterned in such a manner that the pixel electrodes 56 of the respective colors are connected in a row with the same color, and the pixel electrodes 56 of different colors are electrically separated from each other. That is, different voltages for each color can be applied to the individual electrodes 14 for each color.
- the two red pixel electrodes 56r are connected to a red power supply (not shown) via power supply lines 57r and 58r.
- the green pixel electrode 56g is connected to a green power supply (not shown) via power supply lines 57g and 58g
- the blue pixel electrode 56b is connected to a blue power supply (not shown) via power supply lines 57b and 58b. ing.
- the pixel electrodes 56 of each color it is possible to develop a phosphor pattern of three colors using a single intaglio.
- the high resistance layer 15 is made of, for example, polyimide, acrylic, polyester, urethane, epoxy, Teflon (registered trademark), nylon or the like having a volume resistivity of 10 1Q [ ⁇ cm] or more (including an insulator).
- the film thickness is 5 [ ⁇ ] to 50 [ ⁇ ], preferably 10 [/ im] to 30 [/ im].
- FIG. 4 On the surface of the high resistance layer 15, a pattern in which a large number of rectangular recesses 15a (holding portions) are arranged and arranged as shown in FIG. 4 (as a plan view) is formed.
- recesses 15a corresponding to pixels for three colors are formed on the high resistance layer 15. It was recessed from the surface. That is, the recesses 15a are formed at positions corresponding to all the pixel electrodes 56r, 56g, 56b of the individual electrodes shown in FIG.
- the pixel electrode 14 of the individual electrode is exposed at the bottom of the recess 15a, and the depth of the recess 15a is the thickness of the high resistance layer 15. Is roughly equivalent to
- FIG. 6 shows an enlarged schematic structure of the developing device 2. Since the developing devices 22g and 2b for each color described above have the same structure except that the liquid developer used is different, the developing devices 2 are described here.
- the developing device 2 has two casings 21 and 22 arranged along the transport direction T of the pattern forming original plate 1.
- the pattern forming original plate 1 has a pattern with the concave portion 15a described above arranged downward. It is conveyed in a posture facing the developing device 2 placed thereon.
- a developing roller 23 (supply member) is provided in the casing 21 on the upstream side in the transport direction.
- the developing roller 23 is disposed at a position where the peripheral surface thereof is opposed to the surface of the high resistance layer 15 of the pattern forming original plate 1 being conveyed with a gap of about 150 ⁇ 50 m]. It rotates at a speed of 1.2 to 4 times, more preferably 1.5 to 2.5 times in the same direction (counterclockwise direction in the figure) as the transport direction of Master 1.
- a sponge roller 24 that rotates in the opposite direction to the developing roller 23 is disposed in contact with the developing roller 23 below the pattern forming original plate 1.
- the sponge roller 24 cleans the liquid developer adhering to the peripheral surface of the developing roller 23 that has passed the position facing the pattern forming original plate 1.
- a nozzle 25 for supplying a liquid developer to the peripheral surface of the developing roller 23 is provided on the inner side surface of the housing 21.
- the liquid developer is accommodated in a developer tank (not shown), and is supplied into the casing 21 via a nozzle 25 by a pump (not shown) or the like, and the excess liquid developer collected by the sponge roller 24 is collected.
- the developer is collected into the developer tank via the discharge port 26 provided at the bottom bottom of the casing 21.
- the liquid developer is configured by dispersing phosphor particles of various colors (developer particles) in an insulating liquid. The phosphor particles of each color are added with metal sarcophagus so that they are positively charged.
- a squeeze roller 27 is provided in the casing 22 on the downstream side along the conveyance direction of the pattern forming original plate 1.
- the squeeze roller 27 has a peripheral surface that is closer to the pattern forming original plate 1 than the developing roller 23, that is, in this embodiment, 25 [/ im] to 75 [/] from the surface of the high resistance layer 15. im], more preferably 30 [ ⁇ m] to 50 [ ⁇ m] apart, and rotates in the direction opposite to the conveyance direction T of the pattern forming original plate 1 (clockwise in the figure).
- the squeeze roller 27 partially removes the liquid developer supplied to the intaglio 1 by the developing roller 23, and the film thickness of the liquid developer remaining on the intaglio 1 is increased! ] Control to about 30 [ ⁇ m].
- a cleaning blade 28 formed of a rubber piece is disposed in contact. Excess liquid developer collected from the peripheral surface of the squeeze roller 27 by the cleaning blade 28 is illustrated via a discharge port 29 provided at the bottom of the housing 22. Shina is collected into the developer tank.
- the pattern forming original plate 1 is conveyed at a constant speed in the direction of arrow T as shown in FIG.
- the AC corona neutralizer 4 applies an AC high voltage to a corona wire (not shown) to neutralize the surface of the high resistance layer 15 of the pattern forming master 1.
- the DC corona charger 5 applies a positive high voltage to the corona wire to generate a positive corona, and the surface of the high resistance layer 15 of the pattern forming master 1 is, for example, +400 [V Is charged.
- the developing device 2r that executes red development of the first color is disposed at the operating position (the position illustrated in FIG. 1). Then, a liquid developer containing red phosphor particles is supplied to the surface of the high resistance layer 15 of the pattern forming master 1 via the developing device 2r. At this time, the liquid developer is conveyed as a liquid film having a thickness of about several hundreds m by the peripheral surface of the developing roller 23 that rotates counterclockwise in FIG. 6, and this liquid film is transferred to the high resistance layer 15 of the intaglio 1. Supplied in contact with the surface. At this time, the liquid developer is also supplied into the patterned concave portion 15a formed on the surface of the high resistance layer 15.
- a voltage of +200 [V] is applied to the developing roller 23 via a power supply device (not shown).
- the red individual electrode 14r of the pattern forming master 1 is grounded, and a voltage of +300 V is applied to the green individual electrode 14g and the blue individual electrode 14b.
- the positively charged red phosphor particles in the liquid developer interposed between and in contact with the developing roller 23 and the pattern forming original plate 1 become the high-resistance layer 15 charged to +400 [V].
- the green and blue individual electrodes 14g and 14b to which a voltage of + 300V is applied are repelled, while the grounded red individual electrode 14r is attracted by the action of a potential difference of 200 [V].
- the red phosphor particles are collected on the red individual electrode 14r by the action of both.
- the peripheral surface of the developing roller 23 is cleaned by the sponge roller 24, and the liquid developer that has not been supplied to the pattern forming original plate 1 is not shown through the discharge port 26. It is collected in the tank.
- the high resistance layer 15 of the pattern forming original plate 1 A liquid film with a thickness of about 100 [/ m] adheres to the surface, and the phosphor particles that have not been collected in the concave portion 15a of the red pattern float inside. If this phosphor particle floats and causes a capri, the liquid film is squeezed by the squeeze roller 27 and, at the same time, the suspended phosphor particle adheres to the surface of the squeeze roller 27 and is collected. There is a need.
- a voltage of about 200 [V] ⁇ 50 [V] is applied to the squeeze roller 27 via a power supply device (not shown), and this voltage causes the phosphor floating in the liquid film. Particles are attracted to squeeze roller 27.
- a liquid film having a thickness of about 30 to 30 [z m] remains on the surface of the high resistance layer 15 of the pattern forming original plate 1 that has passed through the drawing process by the squeeze roller 27.
- the removal amount of the liquid film by the squeeze roller 27 is controlled so that such a liquid film remains on the surface of the pattern forming original plate 1.
- the intaglio 1 that has been developed for the first color remains wet.
- the pattern forming original plate 1 is conveyed to a transfer step. As shown in FIG. 7, the pattern forming original plate 1 on which the patterns of the three-color phosphor particles are formed is spaced above and opposed to the glass plate M waiting on the downstream side in the transport direction. . In this state, the pattern forming original plate 1 is separated upward from the glass plate M so that the glass plate M does not come into contact with the liquid developer that has wetted the surface of the high resistance layer 15 of the pattern forming original plate 1. In this state, the pattern forming original plate 1 is aligned with the glass plate M by a positioning mechanism (not shown).
- the positioning mechanism reads the alignment marks preliminarily engraved on both the pattern forming original plate 1 and the glass plate M using optical means, detects the misalignment between the two, and corrects this misalignment. In this way, the pattern forming master 1 and the glass plate M are moved relative to each other.
- the insulating liquid that has wetted the surface of the pattern forming original plate 1 is brought into contact with the surface of the glass plate M.
- Adjacent to the back of the glass plate M pattern forming master 1 By applying a negative high voltage via the transfer device 3 arranged in contact, and applying a high-frequency voltage to the common electrode 12 of the pattern forming master 1 to emit ultrasonic waves from the piezoelectric layer 13, Transfer the phosphor particles to the glass substrate M.
- a negative high voltage of about _7 [KV] is applied to the transfer device 3 composed of the conductive elastic roller pressed against the back surface of the glass plate M via a power supply device (not shown), while individually All electrodes 14 are grounded.
- a potential difference is formed between the glass plate M and the individual electrode 14 of the pattern forming original plate 1, and the positively charged phosphor particles collected in the recesses 15a of the pattern forming original plate 1 are directed to the glass plate M.
- An electric field in the direction of force is generated.
- a sinusoidal high frequency wave (driving frequency 50 MHz) of about ⁇ 50 [V] is simultaneously applied to the common electrode 12 to emit ultrasonic waves from the piezoelectric layer 13.
- This ultrasonic wave acts on the phosphor particles collected in the recess 15a, and the phosphor particles are peeled off from the recess 15a.
- the phosphor film having a large film size and a large particle size developed in the concave portion can be transferred to the glass substrate M with high efficiency by a transfer method using both an electric field action and an ultrasonic action.
- the pattern forming original plate 1 which has finished the transfer process in this way is conveyed to a tallying process as shown in FIG.
- the force that can improve the transfer efficiency by the electric field action and the ultrasonic action Nevertheless, there is a possibility that slight phosphor particles may remain in the concave portion 15a of the pattern forming original plate 1. is there. For this reason, a step of cleaning the phosphor particles remaining in the recess 15a is required.
- the cleaner 6 is lifted to the illustrated operating position by an elevator mechanism (not shown), and the liquid developer remaining on the pattern forming original plate 1 is cleaned.
- a sine wave high frequency (drive frequency 50 MHz) of ⁇ 50 [V] is simultaneously applied to the common electrode 12 of the pattern forming original plate 1, Ultrasonic waves are radiated from the piezoelectric layer 13 as in the transfer process described above. In this way, the cleaning efficiency can be significantly improved by emitting ultrasonic waves during the operation of the cleaner 6.
- the cleaner 6 applies a voltage of about _300 [V] to the cleaning roller to form an electric field between the individual electrodes 14, and causes the electric field to act on the phosphor particles remaining in the recess 15a.
- the remaining phosphor particles are cleaned by adsorbing to the leaning roller. At this time, for example, when the remaining phosphor particles are attached to the corners of the recess 15a, the phosphor particles can be reliably removed by applying ultrasonic waves.
- both the electric field action and the ultrasonic action are used during transfer of the phosphor particles, so that the thick and large film collected in the concave portion 15a of the pattern forming original plate 1 can be obtained.
- the phosphor particles having a particle size can be transferred to the glass plate M with high efficiency and reliability. Further, the cleaning efficiency can be greatly improved by applying an electric field and an ultrasonic wave during the cleaning operation.
- the pattern forming original plate 1 of the present embodiment by using the pattern forming original plate 1 of the present embodiment, almost all of the phosphor particles collected in the recesses 15a can be transferred to the glass plate M, and image disturbance due to transfer defects can be prevented. Transfer images can be formed. Further, by using the pattern forming original plate 1 of the present embodiment, phosphor particles that may slightly remain in the recesses 15a can be reliably tallyed, and a clean original plate 1 can be provided at all times. High-definition and high-definition patterns can be formed.
- the force described in the case of patterning using the plate-shaped pattern forming original plate 1 is not limited to this, and as shown in FIG. It is also possible to use a drum-shaped original plate 51 in which the original plate 1 is wound around the circumferential surface of the cylindrical body or the pattern forming original plate is directly formed on the circumferential surface of the cylindrical body.
- the peripheral surface of the original plate 51 is discharged by the AC corona discharger 4, and then the original plate 51 by the DC corona charger 5.
- the surface of the high resistance layer 15 is positively charged.
- the red phosphor particles are aggregated in the concave portions 15a of the original plate 51 by the developing device 2r to develop the red pattern.
- the charging / developing process is the same as in the above-described embodiment.
- the green phosphor particles are developed through the developing device 2g, and the blue phosphor particles are developed through the developing device 2b.
- the glass plate M is conveyed toward the left in the right direction in the figure by a conveying device (not shown), and enters between the transfer roller 3 and the original 51.
- the transfer roller 3 is formed of, for example, a conductive rubber roller having a rubber hardness of 40 degrees, and a voltage of ⁇ 7 [KV] is applied via a power supply device (not shown).
- a voltage is applied to the piezoelectric layer 13 of the original plate 51 to Sound waves are emitted and act on the phosphor particles of each color in the recess 15a. Under these conditions, three color phosphor layers are transferred to the glass plate M.
- the alignment mark engraved on the glass plate M and the original plate 51 is detected by a positioning mechanism (not shown), and the transfer is performed while controlling the relative movement between the two with high accuracy.
- the surface of the high resistance layer 15 of the original 51 is cleaned by the cleaner 6. Even during the tailing, as described above, an electric field is applied to the phosphor particles, and an ultrasonic wave is applied to reliably clean the phosphor particles remaining in the recess 15a.
- the original 51 is discharged and charged for the development and transfer of the phosphor layer on the next medium. Further, the glass plate M is transported in the reverse direction by the transport device 31 and returned to the initial position, and unwanted residual charges are removed by the charge removing device 40.
- the apparatus configuration can be reduced in size and space can be saved as compared with the pattern forming original plate 1 described above.
- the original plate 51 is formed in a cylindrical shape, the force S can be gradually brought into and out of contact with the flat glass plate M, and a turbulent flow is generated in the liquid film interposed therebetween. This can prevent the problem that the phosphor layer transferred to the glass plate M peels off.
- the present invention is not limited to the above-described embodiments as they are, but can be embodied by modifying the constituent elements without departing from the spirit of the invention in the implementation stage.
- various inventions can be formed by appropriately combining a plurality of constituent elements disclosed in the above-described embodiment. For example, some components may be deleted from all the components shown in the above-described embodiment.
- the constituent elements in different embodiments may be appropriately combined.
- the configuration in which the piezoelectric layer 13 is sandwiched between the common electrode 12 and the individual electrode 14 as the ultrasonic wave generation unit is adopted.
- Sound wave generation means can be used.
- a configuration in which an ultrasonic wave generating means is externally attached to the back surface of the substrate of the pattern forming original plate may be used.
- the present invention is not limited to this, and the concave portion 15a is formed as a single color plate.
- the number of electrodes is reduced to 1/3 to form a so-called solid electrode layer at the position of the individual electrode 14 You may do it.
- the phosphor particles may be developed one by one and transferred to the glass plate M.
- the present invention is not limited to this, and all the components are charged with the opposite polarity and operated. May be.
- the present invention can be applied to an apparatus for forming a conductive pattern in a circuit board, an IC tag, or the like.
- the liquid imaging agent is, for example, resin particles having an average particle size of 0.3 [zm] and metal fine particles having an average particle size of 0.02 [zm] adhering to the surface (for example, copper, If a charge control agent such as palladium, silver, platinum, etc.) and a metal sarcophagus are used, a wiring pattern made of a developer may be formed on a silicon wafer, for example, by the same method as the above-described embodiment. it can.
- the plate and the pattern forming apparatus of the present invention have the above-described configuration and action, the pattern by the developer can be reliably transferred to the transfer medium, and remains on the plate after transfer.
- the developer can be reliably cleaned, and high-definition patterns with high resolution can be formed.
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- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Printing Methods (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Optical Filters (AREA)
Abstract
Description
Claims
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP07714781A EP2015621A4 (en) | 2006-03-14 | 2007-02-22 | PLATE, SHAPING DEVICE USING PLATE, AND SHAPING METHOD |
JP2008510746A JP4846789B2 (ja) | 2006-03-14 | 2007-02-22 | 版、この版を用いたパターン形成装置、およびパターン形成方法 |
US12/209,922 US20090060577A1 (en) | 2006-03-14 | 2008-09-12 | Plate, and pattern forming device and pattern forming method using the same plate |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2006-069530 | 2006-03-14 | ||
JP2006069530 | 2006-03-14 |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US12/209,922 Continuation US20090060577A1 (en) | 2006-03-14 | 2008-09-12 | Plate, and pattern forming device and pattern forming method using the same plate |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2007119291A1 true WO2007119291A1 (ja) | 2007-10-25 |
Family
ID=38609108
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/JP2007/053283 WO2007119291A1 (ja) | 2006-03-14 | 2007-02-22 | 版、この版を用いたパターン形成装置、およびパターン形成方法 |
Country Status (7)
Country | Link |
---|---|
US (1) | US20090060577A1 (ja) |
EP (1) | EP2015621A4 (ja) |
JP (1) | JP4846789B2 (ja) |
KR (1) | KR100986516B1 (ja) |
CN (1) | CN101406113A (ja) |
TW (1) | TW200745795A (ja) |
WO (1) | WO2007119291A1 (ja) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20120127136A1 (en) * | 2010-08-18 | 2012-05-24 | Kent Displays Incorporated | Display device including piezoelectric and liquid crystal layers |
TWI427321B (zh) | 2011-05-05 | 2014-02-21 | Au Optronics Corp | 電濕潤顯示器及其驅動方法 |
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH049902A (ja) * | 1990-04-27 | 1992-01-14 | Toppan Printing Co Ltd | 微細パターンの形成方法 |
JPH04165306A (ja) * | 1990-10-30 | 1992-06-11 | Dainippon Printing Co Ltd | カラーフィルタの製造方法 |
JPH06265712A (ja) | 1993-03-10 | 1994-09-22 | Toppan Printing Co Ltd | カラーフィルタの製造方法およびそれに用いるトナーとその製造方法と現像液 |
JPH10324994A (ja) * | 1997-05-26 | 1998-12-08 | Fuji Xerox Co Ltd | 画像形成方法、画像形成装置及びカラーフィルターの製造方法 |
JP2002527783A (ja) | 1998-10-13 | 2002-08-27 | エレクトロック コーポレイション | 電子生産応用分野に適した機能性トナー材料の静電印刷 |
JP2004030980A (ja) | 2002-06-21 | 2004-01-29 | Toshiba Corp | 画像表示装置の製造方法 |
Family Cites Families (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US2832977A (en) * | 1952-02-05 | 1958-05-06 | Haloid Co | Electrostatic cleaning device |
US3741117A (en) * | 1970-07-10 | 1973-06-26 | Sinclair & Valentine Co Inc | Pressureless non contact electrostatic printing |
JPH07181854A (ja) * | 1993-12-21 | 1995-07-21 | Ricoh Co Ltd | 電子写真装置 |
JPH07257006A (ja) * | 1994-03-17 | 1995-10-09 | Teruyoshi Ando | 凹版印刷方法と凹版印刷装置 |
US5467183A (en) * | 1994-08-01 | 1995-11-14 | Xerox Corporation | Electrostatic color printing system with sonic toner release development |
JPH0973091A (ja) * | 1995-09-05 | 1997-03-18 | Sharp Corp | 帯電スペーサ塗布装置 |
JPH09244415A (ja) * | 1996-03-08 | 1997-09-19 | Ricoh Co Ltd | 画像形成方法 |
JP2001005358A (ja) * | 1999-06-18 | 2001-01-12 | Dainippon Screen Mfg Co Ltd | 湿式電子写真装置のクリーニング装置 |
US20070076084A1 (en) * | 2005-09-30 | 2007-04-05 | Xerox Corporation | Reimageable printing member |
-
2007
- 2007-02-22 EP EP07714781A patent/EP2015621A4/en not_active Withdrawn
- 2007-02-22 WO PCT/JP2007/053283 patent/WO2007119291A1/ja active Application Filing
- 2007-02-22 KR KR1020087022237A patent/KR100986516B1/ko not_active IP Right Cessation
- 2007-02-22 JP JP2008510746A patent/JP4846789B2/ja not_active Expired - Fee Related
- 2007-02-22 CN CNA2007800092641A patent/CN101406113A/zh active Pending
- 2007-03-13 TW TW096108623A patent/TW200745795A/zh unknown
-
2008
- 2008-09-12 US US12/209,922 patent/US20090060577A1/en not_active Abandoned
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH049902A (ja) * | 1990-04-27 | 1992-01-14 | Toppan Printing Co Ltd | 微細パターンの形成方法 |
JPH04165306A (ja) * | 1990-10-30 | 1992-06-11 | Dainippon Printing Co Ltd | カラーフィルタの製造方法 |
JPH06265712A (ja) | 1993-03-10 | 1994-09-22 | Toppan Printing Co Ltd | カラーフィルタの製造方法およびそれに用いるトナーとその製造方法と現像液 |
JPH10324994A (ja) * | 1997-05-26 | 1998-12-08 | Fuji Xerox Co Ltd | 画像形成方法、画像形成装置及びカラーフィルターの製造方法 |
JP2002527783A (ja) | 1998-10-13 | 2002-08-27 | エレクトロック コーポレイション | 電子生産応用分野に適した機能性トナー材料の静電印刷 |
JP2004030980A (ja) | 2002-06-21 | 2004-01-29 | Toshiba Corp | 画像表示装置の製造方法 |
Non-Patent Citations (1)
Title |
---|
See also references of EP2015621A4 * |
Also Published As
Publication number | Publication date |
---|---|
JPWO2007119291A1 (ja) | 2009-08-27 |
KR20080103556A (ko) | 2008-11-27 |
EP2015621A1 (en) | 2009-01-14 |
TW200745795A (en) | 2007-12-16 |
CN101406113A (zh) | 2009-04-08 |
EP2015621A4 (en) | 2011-05-04 |
US20090060577A1 (en) | 2009-03-05 |
KR100986516B1 (ko) | 2010-10-07 |
JP4846789B2 (ja) | 2011-12-28 |
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