WO2007106101A3 - Procédé destiné à fabriquer des couches à surface contenue et dispositifs comprenant ces couches - Google Patents
Procédé destiné à fabriquer des couches à surface contenue et dispositifs comprenant ces couches Download PDFInfo
- Publication number
- WO2007106101A3 WO2007106101A3 PCT/US2006/013118 US2006013118W WO2007106101A3 WO 2007106101 A3 WO2007106101 A3 WO 2007106101A3 US 2006013118 W US2006013118 W US 2006013118W WO 2007106101 A3 WO2007106101 A3 WO 2007106101A3
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- layer
- same
- devices made
- contained layers
- making contained
- Prior art date
Links
- 230000005855 radiation Effects 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
- H10K71/10—Deposition of organic active material
- H10K71/12—Deposition of organic active material using liquid deposition, e.g. spin coating
- H10K71/13—Deposition of organic active material using liquid deposition, e.g. spin coating using printing techniques, e.g. ink-jet printing or screen printing
- H10K71/135—Deposition of organic active material using liquid deposition, e.g. spin coating using printing techniques, e.g. ink-jet printing or screen printing using ink-jet printing
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04L—TRANSMISSION OF DIGITAL INFORMATION, e.g. TELEGRAPHIC COMMUNICATION
- H04L9/00—Cryptographic mechanisms or cryptographic arrangements for secret or secure communications; Network security protocols
- H04L9/30—Public key, i.e. encryption algorithm being computationally infeasible to invert or user's encryption keys not requiring secrecy
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/10—OLEDs or polymer light-emitting diodes [PLED]
- H10K50/11—OLEDs or polymer light-emitting diodes [PLED] characterised by the electroluminescent [EL] layers
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- General Physics & Mathematics (AREA)
- Computing Systems (AREA)
- Computer Networks & Wireless Communication (AREA)
- Signal Processing (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Theoretical Computer Science (AREA)
- Computer Security & Cryptography (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Electroluminescent Light Sources (AREA)
- Thin Film Transistor (AREA)
- Solid State Image Pick-Up Elements (AREA)
Abstract
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP06749552A EP1989818A4 (fr) | 2006-03-02 | 2006-04-10 | Procédé destiné à fabriquer des couches à surface contenue et dispositifs comprenant ces couches |
JP2008557249A JP2009528663A (ja) | 2006-03-02 | 2006-04-10 | 閉じ込められた層を製造するための方法、及び同方法によって製造されたデバイス |
CN200680053669.0A CN101507177B (zh) | 2006-03-02 | 2006-04-10 | 制备限制的层的方法和用该方法制造的装置 |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US75154906P | 2006-03-02 | 2006-03-02 | |
US60/751,549 | 2006-03-02 |
Publications (2)
Publication Number | Publication Date |
---|---|
WO2007106101A2 WO2007106101A2 (fr) | 2007-09-20 |
WO2007106101A3 true WO2007106101A3 (fr) | 2009-04-16 |
Family
ID=38470737
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/US2006/013118 WO2007106101A2 (fr) | 2006-03-02 | 2006-04-10 | Procédé destiné à fabriquer des couches à surface contenue et dispositifs comprenant ces couches |
Country Status (6)
Country | Link |
---|---|
EP (1) | EP1989818A4 (fr) |
JP (2) | JP2009528663A (fr) |
KR (1) | KR20080108100A (fr) |
CN (1) | CN101507177B (fr) |
TW (1) | TW200735435A (fr) |
WO (1) | WO2007106101A2 (fr) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2011501360A (ja) * | 2007-10-15 | 2011-01-06 | イー・アイ・デュポン・ドウ・ヌムール・アンド・カンパニー | 溶液処理された電子デバイス |
WO2009055628A1 (fr) * | 2007-10-26 | 2009-04-30 | E. I. Du Pont De Nemours And Company | Procédé et matériaux pour fabriquer des couches contenues et dispositifs fabriqués à partir de ceux-ci |
US8772774B2 (en) | 2007-12-14 | 2014-07-08 | E. I. Du Pont De Nemours And Company | Backplane structures for organic light emitting electronic devices using a TFT substrate |
KR20160078973A (ko) * | 2013-10-31 | 2016-07-05 | 카티바, 인크. | 잉크젯 인쇄를 위한 폴리티오펜-포함 잉크 조성물 |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5435887A (en) * | 1993-11-03 | 1995-07-25 | Massachusetts Institute Of Technology | Methods for the fabrication of microstructure arrays |
US20040079940A1 (en) * | 2002-08-02 | 2004-04-29 | Samsung Sdi Co., Ltd. | Substrate and organic electroluminescence device using the substrate |
US20040175646A1 (en) * | 2001-07-26 | 2004-09-09 | Tadashi Hatanaka | Polyamic acid resin composition |
US20050023661A1 (en) * | 2003-02-06 | 2005-02-03 | Neomax Co., Ltd. | Hermetic sealing cap and method of manufacturing the same |
Family Cites Families (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5416203A (en) * | 1977-07-07 | 1979-02-06 | Nippon Paint Co Ltd | Dry making method of photosensitive resin plate |
US5392980A (en) * | 1993-12-29 | 1995-02-28 | Dell Usa, L.P. | Method and apparatus for reworking ball grid array packages to allow reuse of functional devices |
DE19500912A1 (de) * | 1995-01-13 | 1996-07-18 | Basf Ag | Elektrolumineszierende Anordnung |
JPH09203803A (ja) * | 1996-01-25 | 1997-08-05 | Asahi Glass Co Ltd | カラーフィルタの製造方法及びそれを用いた液晶表示素子 |
JP4413035B2 (ja) * | 1997-08-08 | 2010-02-10 | 大日本印刷株式会社 | パターン形成体およびパターン形成方法 |
JP2001237069A (ja) * | 2000-02-23 | 2001-08-31 | Dainippon Printing Co Ltd | El素子およびその製造方法 |
KR20010085420A (ko) * | 2000-02-23 | 2001-09-07 | 기타지마 요시토시 | 전계발광소자와 그 제조방법 |
US6656611B2 (en) * | 2001-07-20 | 2003-12-02 | Osram Opto Semiconductors Gmbh | Structure-defining material for OLEDs |
JP4231645B2 (ja) * | 2001-12-12 | 2009-03-04 | 大日本印刷株式会社 | パターン形成体の製造方法 |
US6955773B2 (en) * | 2002-02-28 | 2005-10-18 | E.I. Du Pont De Nemours And Company | Polymer buffer layers and their use in light-emitting diodes |
WO2004042474A1 (fr) * | 2002-11-06 | 2004-05-21 | Asahi Glass Company, Limited | Composition de resine photosensible de type negatif |
JP2004177793A (ja) * | 2002-11-28 | 2004-06-24 | Seiko Epson Corp | 微細構造物の製造方法およびこの微細構造物の製造方法を用いて製造された自発光素子、光学素子、デバイス並びにこのデバイスを備えた電子機器 |
JP2004234901A (ja) * | 2003-01-28 | 2004-08-19 | Seiko Epson Corp | ディスプレイ基板、有機el表示装置、ディスプレイ基板の製造方法および電子機器 |
JP4632193B2 (ja) * | 2003-09-18 | 2011-02-16 | 大日本印刷株式会社 | パターニング用基板の製造方法 |
US7067841B2 (en) * | 2004-04-22 | 2006-06-27 | E. I. Du Pont De Nemours And Company | Organic electronic devices |
-
2006
- 2006-04-10 WO PCT/US2006/013118 patent/WO2007106101A2/fr active Application Filing
- 2006-04-10 JP JP2008557249A patent/JP2009528663A/ja active Pending
- 2006-04-10 CN CN200680053669.0A patent/CN101507177B/zh not_active Expired - Fee Related
- 2006-04-10 KR KR1020087022342A patent/KR20080108100A/ko active Search and Examination
- 2006-04-10 EP EP06749552A patent/EP1989818A4/fr not_active Withdrawn
- 2006-04-11 TW TW095112893A patent/TW200735435A/zh unknown
-
2012
- 2012-12-03 JP JP2012264562A patent/JP2013048118A/ja active Pending
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5435887A (en) * | 1993-11-03 | 1995-07-25 | Massachusetts Institute Of Technology | Methods for the fabrication of microstructure arrays |
US20040175646A1 (en) * | 2001-07-26 | 2004-09-09 | Tadashi Hatanaka | Polyamic acid resin composition |
US20040079940A1 (en) * | 2002-08-02 | 2004-04-29 | Samsung Sdi Co., Ltd. | Substrate and organic electroluminescence device using the substrate |
US20050023661A1 (en) * | 2003-02-06 | 2005-02-03 | Neomax Co., Ltd. | Hermetic sealing cap and method of manufacturing the same |
Also Published As
Publication number | Publication date |
---|---|
CN101507177B (zh) | 2014-08-13 |
EP1989818A2 (fr) | 2008-11-12 |
EP1989818A4 (fr) | 2011-05-18 |
KR20080108100A (ko) | 2008-12-11 |
TW200735435A (en) | 2007-09-16 |
JP2009528663A (ja) | 2009-08-06 |
CN101507177A (zh) | 2009-08-12 |
WO2007106101A2 (fr) | 2007-09-20 |
JP2013048118A (ja) | 2013-03-07 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
WO2007120654A3 (fr) | Procede permettant de fabriquer des couches contenues et dispositifs fabriques avec celles-ci | |
WO2006036366A3 (fr) | Procede de formation d'un dispositif traite avec une solution | |
WO2009046060A3 (fr) | Appareils et procédés pour produire de l'énergie électrique renforcée de photons par conversion-abaissement | |
TW200633062A (en) | Method for patterning an organic material to concurrently form an insulator and a semiconductor and device formed thereby | |
WO2010011390A3 (fr) | Couches hybrides utilisables pour les enrobages des dispositifs électroniques ou tout autre articles | |
EP2246876A4 (fr) | Composition hydrofuge pour substrat à exposer, procédé de formation de motif de résist, dispositif électronique fabriqué par le procédé de formation, procédé conférant une hydrofractricité à un substrat à exposer, ensemble destiné à conférer une hydrofractricité à un substrat à exposer, et procédé conférant une hydrofractricité à un substrat à exposer | |
WO2007109784A3 (fr) | Traitements de surface pour ensembles engrenage spiro-coniques | |
TW200701478A (en) | Capacitor with nano-composite dielectric layer and method for fabricating the same | |
GB2462845B (en) | Organic electronic devices and methods of making the same using solution processing techniques | |
WO2008019349A3 (fr) | cellule solaire en couche mince interdigitée | |
TW200740689A (en) | Fabrication of inorganic materials using templates with labile linkage | |
WO2008110883A3 (fr) | Procédé de fabrication de stratifié, dispositif ainsi applique, stratifié ainsi obtenu, procédé d'enrobage de substrats et substrat enrobé ainsi obtenu | |
WO2009137604A3 (fr) | Procédé de formation d'un dispositif électronique à l'aide d'une espèce améliorant une séparation | |
SG140481A1 (en) | A method for fabricating micro and nano structures | |
WO2011050336A3 (fr) | Dispositifs à semi-conducteur dotés d'une zone d'absorption améliorée et procédés associés | |
WO2007066277A3 (fr) | Procede de formation d'une couche sur la surface d'un premier materiau enfoui dans un deuxieme materiau de la structure d'un dispositif semi-conducteur | |
WO2011070316A3 (fr) | Dispositif électronique | |
TW200733447A (en) | Large area organic electronic devices and methods of fabricating the same | |
WO2009148859A3 (fr) | Procédé et appareillage pour durcissement aux uv avec de la vapeur d'eau | |
WO2007106101A3 (fr) | Procédé destiné à fabriquer des couches à surface contenue et dispositifs comprenant ces couches | |
WO2010034280A3 (fr) | Composant optoélectronique organique | |
WO2010065835A3 (fr) | Structures de fond de panier pour dispositifs électroniques traités en solution | |
WO2012166850A3 (fr) | Procédés pour la réparation de diélectriques de faible k utilisant une immersion dans un plasma de carbone | |
TW200640318A (en) | Method of forming film pattern, method of manufacturing device, electro-optical device, and electronic apparatus | |
GB2411289B (en) | Forming a semiconductor device |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
WWE | Wipo information: entry into national phase |
Ref document number: 200680053669.0 Country of ref document: CN |
|
121 | Ep: the epo has been informed by wipo that ep was designated in this application |
Ref document number: 06749552 Country of ref document: EP Kind code of ref document: A2 |
|
REEP | Request for entry into the european phase |
Ref document number: 2006749552 Country of ref document: EP |
|
WWE | Wipo information: entry into national phase |
Ref document number: 2006749552 Country of ref document: EP |
|
WWE | Wipo information: entry into national phase |
Ref document number: 2008557249 Country of ref document: JP |
|
NENP | Non-entry into the national phase |
Ref country code: DE |
|
WWE | Wipo information: entry into national phase |
Ref document number: 1020087022342 Country of ref document: KR |