WO2007088146A1 - Procédé permettant d'appliquer des ions alcalins sur la surface d'une couche d'absorption de cigsse d'une cellule solaire de chalkopyrite - Google Patents
Procédé permettant d'appliquer des ions alcalins sur la surface d'une couche d'absorption de cigsse d'une cellule solaire de chalkopyrite Download PDFInfo
- Publication number
- WO2007088146A1 WO2007088146A1 PCT/EP2007/050818 EP2007050818W WO2007088146A1 WO 2007088146 A1 WO2007088146 A1 WO 2007088146A1 EP 2007050818 W EP2007050818 W EP 2007050818W WO 2007088146 A1 WO2007088146 A1 WO 2007088146A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- absorber layer
- substrate
- layer
- etching
- solar cell
- Prior art date
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- 239000006096 absorbing agent Substances 0.000 title claims abstract description 44
- 238000000034 method Methods 0.000 title claims abstract description 42
- 239000003513 alkali Substances 0.000 title claims abstract description 15
- 150000002500 ions Chemical class 0.000 title claims abstract description 15
- DVRDHUBQLOKMHZ-UHFFFAOYSA-N chalcopyrite Chemical compound [S-2].[S-2].[Fe+2].[Cu+2] DVRDHUBQLOKMHZ-UHFFFAOYSA-N 0.000 title claims abstract description 7
- 229910052951 chalcopyrite Inorganic materials 0.000 title claims abstract description 7
- 239000000758 substrate Substances 0.000 claims abstract description 25
- 238000005530 etching Methods 0.000 claims abstract description 14
- 239000000126 substance Substances 0.000 claims abstract description 10
- 238000000576 coating method Methods 0.000 claims abstract description 4
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 claims description 39
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 claims description 13
- 235000011121 sodium hydroxide Nutrition 0.000 claims description 13
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 11
- KWYUFKZDYYNOTN-UHFFFAOYSA-M Potassium hydroxide Chemical compound [OH-].[K+] KWYUFKZDYYNOTN-UHFFFAOYSA-M 0.000 claims description 8
- 238000000151 deposition Methods 0.000 claims description 8
- 230000008021 deposition Effects 0.000 claims description 8
- 238000000224 chemical solution deposition Methods 0.000 claims description 5
- MNWBNISUBARLIT-UHFFFAOYSA-N sodium cyanide Chemical compound [Na+].N#[C-] MNWBNISUBARLIT-UHFFFAOYSA-N 0.000 claims description 4
- 239000011248 coating agent Substances 0.000 claims description 3
- 239000000463 material Substances 0.000 claims description 3
- ZVCDLGYNFYZZOK-UHFFFAOYSA-M sodium cyanate Chemical compound [Na]OC#N ZVCDLGYNFYZZOK-UHFFFAOYSA-M 0.000 claims description 3
- YBNMDCCMCLUHBL-UHFFFAOYSA-N (2,5-dioxopyrrolidin-1-yl) 4-pyren-1-ylbutanoate Chemical compound C=1C=C(C2=C34)C=CC3=CC=CC4=CC=C2C=1CCCC(=O)ON1C(=O)CCC1=O YBNMDCCMCLUHBL-UHFFFAOYSA-N 0.000 claims description 2
- CPLXHLVBOLITMK-UHFFFAOYSA-N Magnesium oxide Chemical compound [Mg]=O CPLXHLVBOLITMK-UHFFFAOYSA-N 0.000 claims description 2
- CDAISMWEOUEBRE-GPIVLXJGSA-N inositol Chemical compound O[C@H]1[C@H](O)[C@@H](O)[C@H](O)[C@H](O)[C@@H]1O CDAISMWEOUEBRE-GPIVLXJGSA-N 0.000 claims description 2
- SBIBMFFZSBJNJF-UHFFFAOYSA-N selenium;zinc Chemical compound [Se]=[Zn] SBIBMFFZSBJNJF-UHFFFAOYSA-N 0.000 claims description 2
- 238000000926 separation method Methods 0.000 claims description 2
- FAPWRFPIFSIZLT-UHFFFAOYSA-M Sodium chloride Chemical compound [Na+].[Cl-] FAPWRFPIFSIZLT-UHFFFAOYSA-M 0.000 claims 2
- 239000011780 sodium chloride Substances 0.000 claims 1
- 238000009736 wetting Methods 0.000 claims 1
- 238000007654 immersion Methods 0.000 abstract 1
- WUPHOULIZUERAE-UHFFFAOYSA-N 3-(oxolan-2-yl)propanoic acid Chemical compound OC(=O)CCC1CCCO1 WUPHOULIZUERAE-UHFFFAOYSA-N 0.000 description 14
- 229910052980 cadmium sulfide Inorganic materials 0.000 description 14
- 239000011734 sodium Substances 0.000 description 11
- 229910052708 sodium Inorganic materials 0.000 description 10
- 229910052783 alkali metal Inorganic materials 0.000 description 9
- 150000001340 alkali metals Chemical class 0.000 description 9
- OMZSGWSJDCOLKM-UHFFFAOYSA-N copper(II) sulfide Chemical compound [S-2].[Cu+2] OMZSGWSJDCOLKM-UHFFFAOYSA-N 0.000 description 8
- DGAQECJNVWCQMB-PUAWFVPOSA-M Ilexoside XXIX Chemical compound C[C@@H]1CC[C@@]2(CC[C@@]3(C(=CC[C@H]4[C@]3(CC[C@@H]5[C@@]4(CC[C@@H](C5(C)C)OS(=O)(=O)[O-])C)C)[C@@H]2[C@]1(C)O)C)C(=O)O[C@H]6[C@@H]([C@H]([C@@H]([C@H](O6)CO)O)O)O.[Na+] DGAQECJNVWCQMB-PUAWFVPOSA-M 0.000 description 7
- 239000000243 solution Substances 0.000 description 7
- QGZKDVFQNNGYKY-UHFFFAOYSA-N Ammonia Chemical compound N QGZKDVFQNNGYKY-UHFFFAOYSA-N 0.000 description 6
- UMGDCJDMYOKAJW-UHFFFAOYSA-N thiourea Chemical compound NC(N)=S UMGDCJDMYOKAJW-UHFFFAOYSA-N 0.000 description 6
- 239000011787 zinc oxide Substances 0.000 description 6
- 239000010949 copper Substances 0.000 description 5
- 239000011521 glass Substances 0.000 description 5
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 4
- LHQLJMJLROMYRN-UHFFFAOYSA-L cadmium acetate Chemical compound [Cd+2].CC([O-])=O.CC([O-])=O LHQLJMJLROMYRN-UHFFFAOYSA-L 0.000 description 4
- 229910052802 copper Inorganic materials 0.000 description 4
- 230000000694 effects Effects 0.000 description 4
- 238000010348 incorporation Methods 0.000 description 4
- -1 sodium halides Chemical class 0.000 description 4
- 238000004544 sputter deposition Methods 0.000 description 4
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 description 3
- XSQUKJJJFZCRTK-UHFFFAOYSA-N Urea Natural products NC(N)=O XSQUKJJJFZCRTK-UHFFFAOYSA-N 0.000 description 3
- 230000015572 biosynthetic process Effects 0.000 description 3
- 229910052750 molybdenum Inorganic materials 0.000 description 3
- 239000011733 molybdenum Substances 0.000 description 3
- BWGNESOTFCXPMA-UHFFFAOYSA-N Dihydrogen disulfide Chemical compound SS BWGNESOTFCXPMA-UHFFFAOYSA-N 0.000 description 2
- 238000000137 annealing Methods 0.000 description 2
- 239000007864 aqueous solution Substances 0.000 description 2
- HVMJUDPAXRRVQO-UHFFFAOYSA-N copper indium Chemical compound [Cu].[In] HVMJUDPAXRRVQO-UHFFFAOYSA-N 0.000 description 2
- 230000001419 dependent effect Effects 0.000 description 2
- 238000009792 diffusion process Methods 0.000 description 2
- 238000007598 dipping method Methods 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 229910052738 indium Inorganic materials 0.000 description 2
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 229910000069 nitrogen hydride Inorganic materials 0.000 description 2
- GKKCIDNWFBPDBW-UHFFFAOYSA-M potassium cyanate Chemical compound [K]OC#N GKKCIDNWFBPDBW-UHFFFAOYSA-M 0.000 description 2
- 239000002243 precursor Substances 0.000 description 2
- 229910001415 sodium ion Inorganic materials 0.000 description 2
- 238000005507 spraying Methods 0.000 description 2
- 238000005987 sulfurization reaction Methods 0.000 description 2
- 238000007740 vapor deposition Methods 0.000 description 2
- 229910001413 alkali metal ion Inorganic materials 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910021529 ammonia Inorganic materials 0.000 description 1
- XKRFYHLGVUSROY-UHFFFAOYSA-N argon Substances [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 1
- 229910052786 argon Inorganic materials 0.000 description 1
- 230000004888 barrier function Effects 0.000 description 1
- 238000003486 chemical etching Methods 0.000 description 1
- 238000010549 co-Evaporation Methods 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 239000008367 deionised water Substances 0.000 description 1
- 229910021641 deionized water Inorganic materials 0.000 description 1
- 238000005137 deposition process Methods 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 239000001257 hydrogen Substances 0.000 description 1
- 229910052739 hydrogen Inorganic materials 0.000 description 1
- 239000011261 inert gas Substances 0.000 description 1
- 238000005457 optimization Methods 0.000 description 1
- 238000005240 physical vapour deposition Methods 0.000 description 1
- 238000005204 segregation Methods 0.000 description 1
- 150000003388 sodium compounds Chemical class 0.000 description 1
- 238000003631 wet chemical etching Methods 0.000 description 1
- 238000007704 wet chemistry method Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/04—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
- H01L31/06—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices characterised by potential barriers
- H01L31/072—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices characterised by potential barriers the potential barriers being only of the PN heterojunction type
- H01L31/0749—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices characterised by potential barriers the potential barriers being only of the PN heterojunction type including a AIBIIICVI compound, e.g. CdS/CulnSe2 [CIS] heterojunction solar cells
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/0248—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by their semiconductor bodies
- H01L31/0256—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by their semiconductor bodies characterised by the material
- H01L31/0264—Inorganic materials
- H01L31/032—Inorganic materials including, apart from doping materials or other impurities, only compounds not provided for in groups H01L31/0272 - H01L31/0312
- H01L31/0322—Inorganic materials including, apart from doping materials or other impurities, only compounds not provided for in groups H01L31/0272 - H01L31/0312 comprising only AIBIIICVI chalcopyrite compounds, e.g. Cu In Se2, Cu Ga Se2, Cu In Ga Se2
- H01L31/0323—Inorganic materials including, apart from doping materials or other impurities, only compounds not provided for in groups H01L31/0272 - H01L31/0312 comprising only AIBIIICVI chalcopyrite compounds, e.g. Cu In Se2, Cu Ga Se2, Cu In Ga Se2 characterised by the doping material
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
- Y02E10/541—CuInSe2 material PV cells
Definitions
- the invention relates to a method for applying alkali metal ions to the CIGSSe absorber layer of a chalcopyrite solar cell.
- Dunn harsh solar cells with I-III-VI 2 -Chalkopyrit- absorber layers that is compounds of the form Cu (In x Gai_ x ) (Se y , Si_ y ) 2 with O ⁇ x ⁇ l and O ⁇ y ⁇ l, currently forming a promising approach for the production of cost-effective solar cells with high efficiency.
- the present method is particularly concerned with solar cells based on polycrystalline absorber layers of copper indium disulfide.
- the solar cells are produced in a multistage process by first applying to a glass substrate a back-contact layer mostly consisting of molybdenum and then copper and indium. In a sulfurization process, the formation of the copper indium disulfide layer (CuInS 2 ) takes place. That through a
- a buffer layer usually cadmium sulfide (CdS), and a zinc oxide window layer (ZnO) as a front electrode and possibly front contacts are applied to the absorber layer. From empirical studies it is known that the efficiency of the solar cell increases significantly if alkali ions can diffuse into the absorber layer.
- CdS cadmium sulfide
- ZnO zinc oxide window layer
- a first common method is the use of alkaline glass substrates.
- alkali ions may diffuse into the absorber layer.
- the alkali metal is not uniformly distributed in the glass substrate and diffused so different degrees in the absorber layer.
- the deposition conditions of the back contact layer can also have an influence on the diffusion behavior of the alkali ions.
- alkali metal-containing precursor layer for example NaF, Na 2 Se or Na 2 S
- a third possibility is the alkali metal incorporation during or after the deposition of the absorber layer.
- a metered addition of a sodium compound by means of co-evaporation during the vapor deposition of the absorber layer material is proposed, for example, in DE 100 24 882 A1.
- An alkali metal incorporation after the deposition of the absorber layer is proposed in DE 102 59 258 A1.
- sodium is recommended for incorporation into the absorber layer, in the form of sodium halides or sodium chalcogenides.
- the introduction should be carried out by means of CVD or PVD Deposition or a wet separation and subsequent annealing at 400 ° C in a vacuum or under an inert gas atmosphere.
- the invention has for its object to provide a method for applying alkali ions on the surface of the CIGSSe absorber layer of a chalcopyrite solar cell, which can be easily put into the technological process for the production of the layer structure of a chalcopyrite solar cell and in which the alkali metal easy and reliable dosing.
- the object is achieved by the features of claim 1.
- Advantageous embodiments are the subject of the dependent claims. Thereafter, the application of the alkali ions during an already following the deposition of the CIS absorber layer chemical treatment phase of the absorber layer, that is, a subsequent etching and / or a subsequent bath chemical coating.
- the substrate is after processing the CIS absorber layer and before the application of further layers with a solution of 1 to 30% by weight of sodium cyanate (NaCN) and
- CuInS2 copper sulfide
- CuS / Cu2S copper sulfide
- CuS has a high conductivity and would cause short circuits within the absorber layer or between the absorber layer and the other layers. The CuS layer must therefore be selectively removed.
- the removal of the CuS layer is usually carried out in a wet-chemical process step using potassium cyanate (KCN).
- KCN potassium cyanate
- electrochemical etching processes DE 103 44 315 B3
- wet-chemical etching is used, but not below
- the method has the advantage that in comparison to the previously known methods, no additional process step is required, since the wet-chemical treatment of the absorber layer according to the current state of knowledge anyway an irreplaceable process step.
- Etching and concurrent application of the sodium ions can be accomplished by both dipping and spraying for a given time. This is followed by a drying process and the further processing of the solar cell, that is to say, for example, application of a CdS buffer layer, a ZnO window layer (front electrode) and optionally aluminum front contacts.
- An annealing process to infiltrate the sodium may improve the effect, but is not essential.
- the treatment can be carried out under atmospheric pressure and at a temperature below 100 0 C, in the simplest case
- the heat treatment can be carried out between 20 0 C and 500 0 C.
- the application of the alkali ions during the application of the adjoining the absorber layer buffer layer by means of chemical bath deposition wherein the bath, based on the water content, about 0.01 to 10.0 wt.% Sodium hydroxide (NaOH) is added.
- the buffer layer usually made of cadmium sulfide (CdS), protects the surface of the absorber layer from damage caused by the application of the contact layer could occur. In addition, it ensures a surface doping of the absorber layer.
- CdS cadmium sulfide
- buffer layer such as ZnS, ZnSe, InS, PbSe or MgO.
- the buffer layer can be applied by sputtering, vapor deposition or by chemical bath deposition.
- the chemical bath deposition is used, which is also the most advantageous method.
- chemical bath deposition is usually carried out by immersing the substrate coated with the absorber layer in an aqueous solution of cadmium acetate (CdAc) and ammonia (NH 3) and thiourea (SC (NH 2) 2).
- CdAc cadmium acetate
- NH 3 ammonia
- SC thiourea
- the water is heated to about 40 0 C - 100 ° C and then added a CdAc / NH3 solution and thiourea.
- the substrate is immersed in the solution for about 1 to 20 minutes and then rinsed immediately.
- Fig. 1 shows the efficiency and the open circuit voltage of samples in different etching methods
- Fig. 2 shows the efficiency and the open circuit voltage for three samples after the application of alkali ions during a wet-chemical coating.
- a back contact layer for example molybdenum
- a CIS absorber layer is deposited, for example by sputtering copper and indium and then
- the treatment can be through
- the treatment time is based on the concentration of the atzloss and Temperature dependent and would be at a higher concentration of NaCN possibly shorter.
- the substrate is rinsed with water and dried with air.
- the substrate is provided with the further layers, which are necessary for the function of the solar cell, that is, applying a CdS buffer layer and a ZnO window layer.
- FIG. 1 shows the achieved values for the efficiency and the voltage of a solar cell in comparison with other variants of etching listed below or the previously known standard etching method (FIGS. 1-5). Indicated are average values for the efficiency and the voltage.
- Ratio of the product of current and voltage at an operating point to the product of short-circuit current and no-load voltage) and short-circuit current of the solar cell are only insignificantly influenced by the process.
- the best values are achieved with the above-described Atzlosung at a treatment time of about 3 minutes.
- a jolt contact layer and the CIS absorber layer are likewise applied to a glass substrate. Unlike the first
- the unwanted CuS / Cu2S is removed with a sodium-free Atzlosung.
- a CdS buffer layer After etching the absorber layer, it is provided with a CdS buffer layer.
- a solution of CdAc in NH3 is prepared and dissolved in 60 ° C warm water.
- the solution is thiourea and, based on the amount of water, 0.06 wt.% NaOH was added.
- the substrate is immersed in the solution for about 7 minutes and then immediately rinsed and dried.
- Fig. 2 shows the experimental results for the second
- Exemplary Embodiment The mean and maximum values for the efficiency and the voltage of cells on three investigated substrates (1-3) for a CdS bath "with sodium" (addition of 0.045 g NaOH to the CdS bath) are given in each case in comparison with a standard bath "without sodium”. Full factor and short-circuit current of the solar cells are only insignificantly influenced by the variation (constant).
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- Engineering & Computer Science (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Inorganic Chemistry (AREA)
- Life Sciences & Earth Sciences (AREA)
- Sustainable Energy (AREA)
- Photovoltaic Devices (AREA)
Abstract
L'invention concerne un procédé dé permettant d'appliquer des ions alcalins sur la surface de la couche d'absorption de CIGSSe d'une cellule solaire de chalkopyrite. Selon l'invention, les ions alcalins sont appliqués pendant une phase de traitement chimique de la couche d'absorption, c'est-à-dire un procédé de mordançage consécutif et/ou un revêtement chimique en bain, dès que la couche d'absorption est déposée sur un substrat.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE200610004909 DE102006004909A1 (de) | 2006-02-01 | 2006-02-01 | Verfahren zum Aufbringen von Alkaliionen auf die Oberfläche der CIGSSe-Absorberschicht einer Chalkopyrit-Solarzelle |
DE102006004909.8 | 2006-02-01 |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2007088146A1 true WO2007088146A1 (fr) | 2007-08-09 |
Family
ID=37963665
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/EP2007/050818 WO2007088146A1 (fr) | 2006-02-01 | 2007-01-29 | Procédé permettant d'appliquer des ions alcalins sur la surface d'une couche d'absorption de cigsse d'une cellule solaire de chalkopyrite |
Country Status (2)
Country | Link |
---|---|
DE (1) | DE102006004909A1 (fr) |
WO (1) | WO2007088146A1 (fr) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8604336B2 (en) | 2010-02-09 | 2013-12-10 | Dow Global Technologies Llc | Photovoltaic device with transparent, conductive barrier layer |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102008037177B4 (de) | 2008-08-09 | 2010-06-17 | Helmholtz-Zentrum Berlin Für Materialien Und Energie Gmbh | Verfahren zur Herstellung nanostrukturierter Metalloxide oder -chalkogenide mittels chemischer Badabscheidung |
EP3627564A1 (fr) * | 2018-09-22 | 2020-03-25 | (CNBM) Bengbu Design & Research Institute for Glass Industry Co., Ltd. | Procédé de traitement ultérieur d'une couche absorbante |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE10022652A1 (de) * | 2000-04-28 | 2001-11-08 | Hahn Meitner Inst Berlin Gmbh | Verfahren zum selektiven Entfernen von Fremdphasen an Oberflächen von sulfidhaltigen Chalkopyrithalbleitern |
FR2839201A1 (fr) * | 2002-04-29 | 2003-10-31 | Electricite De France | Procede de fabrication de semi-conducteurs en couches minces a base de composes i-iii-vi2, pour applications photovoltaiques |
DE10259258A1 (de) * | 2002-12-11 | 2004-07-08 | Würth Solar Gmbh & Co. Kg | Verfahren zur Herstellung einer Verbindungshalbleiterschicht mit Alkalimetallzusatz |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4909863A (en) * | 1988-07-13 | 1990-03-20 | University Of Delaware | Process for levelling film surfaces and products thereof |
DE4442824C1 (de) * | 1994-12-01 | 1996-01-25 | Siemens Ag | Solarzelle mit Chalkopyrit-Absorberschicht |
DE10024882A1 (de) * | 2000-05-19 | 2001-11-29 | Zsw | Verfahren zur Herstellung einer photoelektrisch aktiven Verbindungshalbleiterschicht mit Alkalimetall-Dotieranteil |
DE10344315B3 (de) * | 2003-09-21 | 2004-12-09 | Hahn-Meitner-Institut Berlin Gmbh | Elektrochemisches Ätzverfahren zum selektiven Entfernen von Fremdphasen an der Oberfläche eines sulfidhaltigen Chalkopyrithalbeiters |
-
2006
- 2006-02-01 DE DE200610004909 patent/DE102006004909A1/de not_active Withdrawn
-
2007
- 2007-01-29 WO PCT/EP2007/050818 patent/WO2007088146A1/fr active Application Filing
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE10022652A1 (de) * | 2000-04-28 | 2001-11-08 | Hahn Meitner Inst Berlin Gmbh | Verfahren zum selektiven Entfernen von Fremdphasen an Oberflächen von sulfidhaltigen Chalkopyrithalbleitern |
FR2839201A1 (fr) * | 2002-04-29 | 2003-10-31 | Electricite De France | Procede de fabrication de semi-conducteurs en couches minces a base de composes i-iii-vi2, pour applications photovoltaiques |
DE10259258A1 (de) * | 2002-12-11 | 2004-07-08 | Würth Solar Gmbh & Co. Kg | Verfahren zur Herstellung einer Verbindungshalbleiterschicht mit Alkalimetallzusatz |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8604336B2 (en) | 2010-02-09 | 2013-12-10 | Dow Global Technologies Llc | Photovoltaic device with transparent, conductive barrier layer |
Also Published As
Publication number | Publication date |
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DE102006004909A1 (de) | 2007-09-13 |
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