WO2007057304A1 - Verwendung eines doppelseitigen haftklebebandes zur verklebung bei der herstellung von elektronikartikeln - Google Patents

Verwendung eines doppelseitigen haftklebebandes zur verklebung bei der herstellung von elektronikartikeln Download PDF

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Publication number
WO2007057304A1
WO2007057304A1 PCT/EP2006/068058 EP2006068058W WO2007057304A1 WO 2007057304 A1 WO2007057304 A1 WO 2007057304A1 EP 2006068058 W EP2006068058 W EP 2006068058W WO 2007057304 A1 WO2007057304 A1 WO 2007057304A1
Authority
WO
WIPO (PCT)
Prior art keywords
silicone
adhesive
pressure
sensitive adhesive
psa
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/EP2006/068058
Other languages
German (de)
English (en)
French (fr)
Inventor
Nils Utesch
Stephan ZÖLLNER
Kristin Kerber
Alexander Herrmann
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tesa SE
Original Assignee
Tesa SE
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tesa SE filed Critical Tesa SE
Priority to EP06819235.0A priority Critical patent/EP1951833B1/de
Priority to CN200680042685XA priority patent/CN101309989B/zh
Priority to JP2008540565A priority patent/JP2009516040A/ja
Publication of WO2007057304A1 publication Critical patent/WO2007057304A1/de
Anticipated expiration legal-status Critical
Priority to KR1020087014393A priority patent/KR101343486B1/ko
Ceased legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C09J7/38—Pressure-sensitive adhesives [PSA]
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C09J2203/318—Applications of adhesives in processes or use of adhesives in the form of films or foils for the production of liquid crystal displays
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/10—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet
    • C09J2301/12—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet by the arrangement of layers
    • C09J2301/124—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet by the arrangement of layers the adhesive layer being present on both sides of the carrier, e.g. double-sided adhesive tape
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/10—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet
    • C09J2301/12—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet by the arrangement of layers
    • C09J2301/124—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet by the arrangement of layers the adhesive layer being present on both sides of the carrier, e.g. double-sided adhesive tape
    • C09J2301/1242—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet by the arrangement of layers the adhesive layer being present on both sides of the carrier, e.g. double-sided adhesive tape the opposite adhesive layers being different
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2433/00—Presence of (meth)acrylic polymer
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2483/00—Presence of polysiloxane
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/14—Layer or component removable to expose adhesive
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/14—Layer or component removable to expose adhesive
    • Y10T428/1452—Polymer derived only from ethylenically unsaturated monomer
    • Y10T428/1457—Silicon
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/14—Layer or component removable to expose adhesive
    • Y10T428/1462—Polymer derived from material having at least one acrylic or alkacrylic group or the nitrile or amide derivative thereof [e.g., acrylamide, acrylate ester, etc.]
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31652—Of asbestos
    • Y10T428/31663—As siloxane, silicone or silane
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31855—Of addition polymer from unsaturated monomers
    • Y10T428/31938—Polymer of monoethylenically unsaturated hydrocarbon

Definitions

  • the invention relates to the use of a double-sided adhesive tape for bonding in the manufacture of electronic articles, in particular in the manufacture of optical data display articles (LCD products).
  • LCD products optical data display articles
  • Pressure sensitive adhesive tapes are widely used processing aids in the age of industrialization. Especially for use in the computer industry very high demands are placed on pressure-sensitive adhesive tapes. In addition to a small one
  • the PSA tapes should be used in a wide temperature range and meet certain optical properties.
  • LC displays which are needed for computers, televisions, laptops, PDAs, mobile phones, digital cameras, etc.
  • LCDs liquid crystal displays
  • PES polyethylene
  • PU polyurethane
  • silicone silicone
  • the materials mentioned protect the LCDs from being destroyed by individual or repeated shock or impact effects (so-called LCD cushioning).
  • the vibration-damping function is particularly marked by silicone, which in addition has the broadest temperature application range and the highest chemical and physical resistance in comparison to PE and PU.
  • silicone rubbers and foams are in addition to a high UV and ozone resistance in particular the combined functions of High temperature resistance, elasticity and pronounced damping behavior against shocks and vibrations.
  • long-term temperature loads in the range of -75 ° C to 260 ° C have no negative influence on the material properties of silicone rubbers.
  • silicone rubbers and foams are widely used in the field of LCD attenuation.
  • Adhesive tapes based on two different pressure-sensitive adhesives such as polyacrylates and silicone, are known for fixing said silicone rubbers and foams in electronic devices (see, for example, US patents 6,521,309).
  • these adhesive tapes are not specified.
  • the adhesive tapes in particular due to the migration of the plasticizers contained in the silicone rubbers, a deterioration of the anchoring over time can be observed.
  • the object of the invention is therefore to provide adhesive tapes which largely avoid migration of the plasticizers and nevertheless satisfy the adhesive requirements for the abovementioned fields of application.
  • the main claim relates to the use of a double-sided adhesive tape for fastening silicone rubbers, wherein the adhesive tape comprises a backing and two adhesive layers, wherein the first adhesive layer consists of an acrylate-based pressure-sensitive adhesive and the second pressure-sensitive adhesive composition consists of a crosslinked silicone pressure-sensitive adhesive.
  • the migration of plasticizers into the silicone adhesive of the adhesive tapes used according to the invention can be largely avoided by previously physically and / or chemically crosslinking the silicone composition of the adhesive tapes.
  • the person skilled in the art knows of the crosslinking of pressure-sensitive adhesives for increasing the cohesion of these compositions and for adjusting certain adhesive properties. He could not expect an influence on the resistance to plasticizers, all the less, as other known pressure-sensitive adhesives such as e.g. Acrylate PSAs do not show this effect. So he had no reason to want to solve the above task by a networking process.
  • the double-sided adhesive tapes used in accordance with the invention consist of a carrier, preferably a ribbon-shaped carrier, and adhesive layers applied on both sides of the carrier.
  • the carrier consists of a PET film, in particular one having a film thickness of 12 .mu.m to 50 .mu.m.
  • the film should preferably be temperature resistant and dimensionally stable.
  • the first adhesive layer preferably consists of an acrylic PSA.
  • an acrylic PSA In addition to UV and chemical resistance, the use of this material ensures above all a long-term temperature resistance of 100 ° C and a short-term temperature resistance of 200 ° C.
  • this acrylic PSA can advantageously be additized with resins, plasticizers and / or fillers.
  • acrylate pressure-sensitive adhesives are particularly advantageously used which, because of their chemical structure or physical properties, have high adhesion to polar substrates.
  • Acrylate pressure-sensitive adhesives which consist of solution or emulsion polymers or UV-crosslinked prepolymers have proven to be very suitable.
  • the acrylate pressure-sensitive adhesive can be admixed with at least one adhesive resin.
  • the acrylate PSA may be admixed with crosslinking agents and / or additives, the latter preferably from the group of microspheres, nanoparticles, colorants, thermally conductive agents, electrically conductive agents, aging inhibitors, light stabilizers, antiozonants, fatty acids, plasticizers, nucleating agents, blowing agents, accelerators and / or fillers ,
  • the first adhesive layer is preferably used for bonding the adhesive tape to a substrate.
  • the substrate can be, for example, plastics or metal-plastic composites used in the electronics and telecommunications industries.
  • the basis weight of the first adhesive layer (2) is preferably between 20 g / m 2 and 150 g / m 2 , very preferably between 20 and 100 g / m 2 .
  • the second pressure-sensitive adhesive layer is preferably used to attach the silicone rubbers or foams to the adhesive tape. It particularly preferably consists of a silicone pressure-sensitive adhesive which is chemically or physically crosslinked.
  • a radical crosslinking by a radical crosslinking, the time-dependent aging of the silicone PSA, characterized by increasing cohesion and reduced adhesion, can be significantly reduced.
  • a radical crosslinking can advantageously be carried out chemically by the use of BPO derivatives (benzoyl peroxide derivatives) and / or by the use of electron beams.
  • the silicone pressure-sensitive adhesive very advantageously has a high adhesion to nonpolar substrates and silicone rubbers and / or foams as well as to siliconized and / or silicone-containing substrates.
  • the crosslinking of the silicone pressure-sensitive adhesive layer is effected by means of electron irradiation (electron beam curing, ESH).
  • ESH electron beam curing
  • the networking by means of ESH leads in an unexpected manner to two directly related advantages.
  • the radicals generated by the ESH lead to crosslinking of the silicone PSA and, on the other hand, to the formation of a firm bond of the PSA with the PET film.
  • the silicone adhesive layer preferably has a basis weight of 20 to 100 g / m 2 .
  • silicone pressure-sensitive adhesives for the second adhesive layer, it is possible with particular advantage to use the following condensation-curing systems consisting of silicate resins and polydimethyl- or polydiphenylsiloxanes DC 280, DC 282, Q2-7735, DC 7358, Q2-7406 from Dow Corning, PSA 750, PSA 518, PSA 910 from GE Bayer Silicones, KRT 001, KRT 002, KRT 003 from ShinEtsu, PSA 45559 from Wacker Silicones and PSA 400 from Rhodia, and also advantageously the following addition-crosslinking systems consisting of silicate resins, polydimethyl- or polydiphenylsiloxanes and crosslinkers (crosslinking substances, especially functionalized hydrosilanes ) DC 7657, DC 2013 from Dow Corning, PSA 6574 from GE Bayer Silicones, KR 3700, KR 3701 from ShinEtsu.
  • condensation-curing systems consisting of silicate resins and poly
  • the support is corona treated before the application of the acrylic pressure-sensitive adhesive layer and / or a primer layer is provided between the support and the silicone pressure-sensitive adhesive layer.
  • one or both of the pressure-sensitive adhesive layers are provided with cover materials prior to the use according to the invention, advantageously with release paper or release film.
  • the acrylic pressure-sensitive adhesive layer is covered with a release paper or a siliconized release film, and / or the silicone pressure-sensitive adhesive layer with a fluorosiliconized film.
  • the adhesive layers of the adhesive tape according to the invention do not come into contact with each other or the silicone pressure-sensitive adhesive does not come into contact with the mounting material, both adhesive layers are individually laminated.
  • the mounting material of the acrylate pressure-sensitive adhesive layer can consist of a paper siliconised on one side, of siliconized PE-coated paper or of a siliconized film.
  • a fluorosiliconized film is used.
  • the invention thus relates to a double-sided adhesive tape consisting of a band-shaped support and adhesive layers arranged on both sides of the support, wherein the first adhesive layer consists in particular of an acrylate adhesive and the second pressure-sensitive adhesive layer in particular of a silicone adhesive, which is used for fastening vibration-damping silicone rubbers or -
  • the first adhesive layer is used in particular for fastening to a substrate, such as a mobile phone or screen housing consisting of pure plastic or a metal-plastic composite material
  • the second adhesive layer in particular for fixing the silicone rubber or foam on the Adhesive tape is used, wherein the crosslinked acrylate pressure-sensitive adhesive in particular has a short-term temperature resistance for temperature loads of over 200 ° C and the silicone PSA due to chemical or physical crosslinking for a resistance against aging and on the other hand shows plasticizers, which has a lasting anchorage of silicone PSA on the band-shaped carrier result.
  • an asymmetrical adhesive tape system is created with respect to the product structure, with which vibration damping silicone rubbers or foams can be quickly and usefully fixed in plastic housings of, for example, mobile phones, laptops or flat screens.
  • the adhesive tape with the acrylate adhesive can be fixed to the substrate to subsequently remove the fluorosilicon whatsoevere release film of silicone adhesive on which finally the silicone rubber is fixed, or the tape is after removal of the fluorosiliconinstrumenten release film of the silicone adhesive first laminated to the silicone rubber over a large area, the composite subsequently punched, and the punched parts thus obtained after removal of the remaining siliconized masking paper with the acrylic PSA attached to the substrate.
  • the covering materials used on both sides serve to protect against sticking together of the pressure-sensitive silicone adhesive with the covering paper of the acrylic PSA in the rolled-up state of the adhesive tape according to the invention, which is stored and transported in roll form.
  • the invention further relates to an adhesive bond comprising a plastic substrate, in particular an electronic component, a double-sided adhesive tape with a backing and two adhesive layers, wherein the first adhesive layer consists of an acrylate-based pressure-sensitive adhesive and the second pressure-sensitive adhesive comprises a crosslinked silicone pressure-sensitive adhesive, and a silicone rubber or foam, wherein the acrylic PSA to the plastic substrate and the silicone PSA facing the silicone rubber or foam.
  • the adhesive tape used is preferably one of the adhesive tapes described above, wherein each of the described embodiments can be used advantageously.
  • the invention relates to a double-sided adhesive tape suitable for fixing silicone rubbers in electronic components, comprising a support and two adhesive layers, the first adhesive layer consisting of an acrylate-based pressure-sensitive adhesive and the second pressure-sensitive adhesive composition consisting of a crosslinked silicone pressure-sensitive adhesive.

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Adhesive Tapes (AREA)
  • Adhesives Or Adhesive Processes (AREA)
PCT/EP2006/068058 2005-11-15 2006-11-03 Verwendung eines doppelseitigen haftklebebandes zur verklebung bei der herstellung von elektronikartikeln Ceased WO2007057304A1 (de)

Priority Applications (4)

Application Number Priority Date Filing Date Title
EP06819235.0A EP1951833B1 (de) 2005-11-15 2006-11-03 Verwendung eines doppelseitigen haftklebebandes zur verklebung bei der herstellung von elektronikartikeln
CN200680042685XA CN101309989B (zh) 2005-11-15 2006-11-03 双面压敏胶带在电子制品制造中用于粘合的用途
JP2008540565A JP2009516040A (ja) 2005-11-15 2006-11-03 電子製品を製造する際の接合のための両面接着テープの用途
KR1020087014393A KR101343486B1 (ko) 2005-11-15 2008-06-13 전자 제품의 제조에서의 결합을 위한 양면 압력 민감성접착 테이프의 용도

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102005054781A DE102005054781A1 (de) 2005-11-15 2005-11-15 Verwendung eines doppelseitigen Haftklebebandes zur Verklebung bei der Herstellung von Elektronikartikel
DE102005054781.8 2005-11-15

Publications (1)

Publication Number Publication Date
WO2007057304A1 true WO2007057304A1 (de) 2007-05-24

Family

ID=37710843

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/EP2006/068058 Ceased WO2007057304A1 (de) 2005-11-15 2006-11-03 Verwendung eines doppelseitigen haftklebebandes zur verklebung bei der herstellung von elektronikartikeln

Country Status (7)

Country Link
US (1) US7569278B2 (https=)
EP (1) EP1951833B1 (https=)
JP (1) JP2009516040A (https=)
KR (1) KR101343486B1 (https=)
CN (1) CN101309989B (https=)
DE (1) DE102005054781A1 (https=)
WO (1) WO2007057304A1 (https=)

Cited By (3)

* Cited by examiner, † Cited by third party
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EP2062952A1 (de) * 2007-11-07 2009-05-27 tesa SE Haftklebebänder für den Rollenwechsel von Flachbahnmaterialien
JP2012519227A (ja) * 2009-03-04 2012-08-23 テーザ・ソシエタス・ヨーロピア 感圧接着剤
DE102021205464A1 (de) 2021-05-28 2022-12-01 Tesa Se Klebeband mit unvernetzter Silikon-Haftklebmasse

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US8378046B2 (en) 2007-10-19 2013-02-19 3M Innovative Properties Company High refractive index pressure-sensitive adhesives
US20090105437A1 (en) * 2007-10-19 2009-04-23 3M Innovative Properties Company High refractive index pressure-sensitive adhesives
US20090110861A1 (en) * 2007-10-29 2009-04-30 3M Innovative Properties Company Pressure sensitive adhesive article
US8309650B2 (en) * 2007-10-30 2012-11-13 3M Innovative Properties Company High refractive index adhesives
US20100086778A1 (en) * 2008-10-08 2010-04-08 Shurtape Technologies, Inc. Multilayer adhesive tape
US8822560B2 (en) 2008-10-29 2014-09-02 3M Innovative Properties Company Electron beam cured silicone release materials
US20110206924A1 (en) * 2008-10-29 2011-08-25 Liu Junkang J Electron beam cured, nonfunctionalized silicone pressure sensitive adhesives
KR102001292B1 (ko) * 2008-10-29 2019-07-17 쓰리엠 이노베이티브 프로퍼티즈 컴파니 전자빔 경화된 실리콘 물질
BRPI0914379A2 (pt) * 2008-10-29 2015-10-20 3M Innovative Properties Co "adesivo, artigo médico e método para adesão de um substrato médico a um substrato biológico"
JP5260259B2 (ja) * 2008-12-22 2013-08-14 東洋紡株式会社 表示画面用光学フィルター
DE102009011164A1 (de) * 2009-03-04 2010-09-09 Tesa Se Klebeband, insbesondere zur Verklebung von Photovoltaiklaminaten
EP2226369A1 (en) * 2009-03-05 2010-09-08 3M Innovative Properties Company Adhesive article comprising an acrylic foam layer
DE102009045812A1 (de) * 2009-10-19 2011-04-28 Tesa Se Verfahren zur Herstellung von Verklebungen
CN102869829A (zh) 2010-04-29 2013-01-09 3M创新有限公司 电子束固化的硅化纤维幅材
CN102585718A (zh) * 2011-01-12 2012-07-18 苏州安洁科技股份有限公司 一种双面胶带
CN107086198B (zh) * 2011-08-30 2020-09-11 亮锐控股有限公司 将衬底接合到半导体发光器件的方法
TW201319203A (zh) * 2011-11-03 2013-05-16 Au Optronics Corp 膠帶結構
KR101253991B1 (ko) * 2011-12-07 2013-04-11 도레이첨단소재 주식회사 연성인쇄회로기판용 점착제 조성물 및 이를 이용한 연성인쇄회로기판용 점착필름
CN102610419A (zh) * 2012-02-29 2012-07-25 南通万德科技有限公司 一体式橡胶簧片按钮及其控制面板
CN102838943A (zh) * 2012-08-29 2012-12-26 苏州佳值电子工业有限公司 一种用于网络摄像头翻盖部件装饰的橡胶件
CN104385725A (zh) * 2014-11-06 2015-03-04 苏州佳值电子工业有限公司 一种止滑橡胶脚垫
JP2016210930A (ja) * 2015-05-12 2016-12-15 Dic株式会社 粘着シート、表面保護部材及び電子機器
JP6731219B2 (ja) 2015-05-28 2020-07-29 スリーエム イノベイティブ プロパティズ カンパニー 粘着シート
FR3043407B1 (fr) * 2015-11-10 2017-11-24 Saint Gobain Performance Plastics France Procede de collage
US9909035B1 (en) * 2017-09-29 2018-03-06 Mayapple Baby Llc Mountable articles, dual-adhesive-adhesive tape and mounting methods using them
KR20190062970A (ko) * 2017-11-29 2019-06-07 쓰리엠 이노베이티브 프로퍼티즈 컴파니 감압 터치 센서용 폼 테이프
KR102881921B1 (ko) * 2020-03-27 2025-11-06 현대모비스 주식회사 차량 램프용 통기부재 및 이의 제조방법
CN113292933B (zh) * 2021-05-14 2022-11-04 安徽富印新材料股份有限公司 一种高导热系数压敏胶及高导热系数压敏胶带

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KR101343486B1 (ko) 2013-12-19
CN101309989B (zh) 2013-03-20
KR20080085141A (ko) 2008-09-23
JP2009516040A (ja) 2009-04-16
EP1951833B1 (de) 2016-07-27
CN101309989A (zh) 2008-11-19
US7569278B2 (en) 2009-08-04
DE102005054781A1 (de) 2007-05-16
US20070110941A1 (en) 2007-05-17

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