WO2007007797A1

WO2007007797A1 - Cobalt- or iron-base alloy excellent in the resistance to corrosion from molten lead-free solder and members of lead-free soldering apparatus which are made of the alloy

Info

Publication number: WO2007007797A1
Application number: PCT/JP2006/313886
Authority: WO
Inventors: Katsuo Sugahara; Akira Mitsuhashi; Sadao Saito
Original assignee: Mitsubishi Materials Corporation
Priority date: 2005-07-13
Filing date: 2006-07-12
Publication date: 2007-01-18

Abstract

The invention provides a Co-base alloy excellent in the resistance to corrosion from lead-free solder, particularly from molten lead-free Sn-Ag solder, and members of lead-free soldering apparatus which are made of the alloy. A Co-base alloy having a composition which contains Cr: 20.0 to 35.0%, Fe: 0.1 to 25.0%, C: 0.01 to 1.20%, Mn: 0.5 to 2.0%, and Si: 0.1 to 2.0%, and further contains, if necessary, (a) Ni: 1.0 to 24.0%, (b) La: 0.01 to 0.15% and/or Ce: 0.01 to 0.15% or (c) Mg: 0.001 to 0.05%, or two or more of (a) to (c), the balance being Co and unavoidable impurities; and members of lead-free soldering apparatus which are made of the alloy.

Description

Specification

Co-base alloy or Fe base alloy with excellent erosion resistance against molten lead-free solder and lead-free soldering equipment members made of the Co base alloy or Fe base alloy

[0001] The present invention relates to a lead-free soldering that has excellent corrosion resistance against molten lead-free solder, particularly molten Sn-Ag solder, and also has the strength of the Co-based alloy or Fe-based alloy. The present invention relates to a device member.

Background art

[0002] In recent years, interest in environmental issues has increased, and for example, in Europe, it has been decided to regulate the inclusion of harmful substances in electronic devices. One of the regulated substances is lead. Since lead is the main component of solder used in the joining of electronic components, it does not use lead at all. Sn—Ag lead-free solder (the composition of Sn—Ag solder, which is lead-free solder) 3.5% Ag, Sn-3.0% Ag-0. L% Cu, etc. are known) and are being replaced by conventional lead solder. Therefore, at present, the term “lead-free solder” generally refers to the Sn—Ag solder. However, the Sn-Ag solder, which is a lead-free solder, has higher reactivity and higher melting temperature than conventional lead solder. Therefore, SUS304 (Cr: l 8-20% by mass) , Ni: 8 to: L0.5 mass%, balance: Fe and inevitable impurities), SUS309S (0 :: 22 to 24 mass%,? ^: 12 to 15 mass%, balance: Fe and inevitable impurities), SUS31 6 (0 :: 16-18% by mass,? ^: 10-14% by mass, Mo: 2-3% by mass, balance: Fe and inevitable impurities) It cannot withstand the erosion of solder, so conventional soldering equipment made of stainless steel can be damaged and have a short service life, necessitating early replacement of the soldering equipment. It has become clear.

[0003] Here, the erosion of stainless steel by molten Sn-Ag solder which is molten lead-free solder will be described. Generally, a non-reactive substance such as an acid-skin film called a passive film is formed on the surface of stainless steel. It prevents molten Sn—Ag solder from coming into direct contact with the metal surface and avoids damage. However, if the surface film disappears due to wear due to convection of the molten metal during use, the molten Sn Ag solder and the metal directly react to cause damage. That is, when a metal such as Fe or Ni having a high melting point reacts with Sn having a low melting point at a temperature lower than its melting point, Sn, which is a low melting point metal, diffuses into the solid, such as Fe or Ni, which has a high melting point, and Sn As the Sn content of the reaction product increases, the melting point decreases and eventually melts into the molten metal, causing damage.

Therefore, in order to alleviate the damage of the soldering equipment to lead-free solder, the surface of the stainless steel that constitutes the soldering equipment is ceramic coated or a nitride layer is provided on the surface of the stainless steel to melt the equipment. We are trying to improve the erosion resistance of lead-free solder (see Non-Patent Document 1, Non-Patent Document 2, Non-Patent Document 3, Non-Patent Document 4, etc.).

Non-Patent Document 1: NIKKEI ELECTRONICS 2003. 9. 1 pp. 49-52

Non-Patent Document 2: NiKKEI ELECTRONICS 2004. 1. 5 pp. 91-98

Non-Patent Document 3: NIKKEI ELECTRONICS 2004. 2. 2 page 37

Non-Patent Document 4: NIKKEI ELECTRONICS 2004. 2. 16 Page 35

Disclosure of the invention

[0004] However, when surface treatment such as ceramic coating or nitriding treatment is applied, problems such as force that cannot be easily repaired by welding, etc., and complicated treatment such as the inner surface of the tube member cannot be performed. For this reason, there has been a demand for a high corrosion resistant material for molten lead-free solder that can be used without surface treatment such as coating or nitriding.

[0005] Therefore, the present inventor noticed that the solid solubility limit of Co to Sn is much smaller than that of Ni and Fe, and optimized various additive elements to prevent erosion resistance to molten lead-free solder. In order to obtain an excellent metallic material of Co-based alloy, we conducted intensive research.

[0006] As a result, as a first condition, Cr: 20.0 to 35. In mass% (hereinafter,% represents mass%).

0%, Fe: 0.1 to 25.0%, C: 0.01 to: L 20%, Mn: 0.5 to 2.0%, Si: 0.1 to 2.0%, In addition, if necessary, (a) Ni: l. 0-24.0%,

(b) One or two of La: 0.01 to 0.15% and Ce: 0.01 to 0.15%,

(c) Mg: 0.001 to 0.05%,

Co-based alloys containing one or more of these, with the balance being Co and inevitable impurity power composition, have excellent erosion resistance against molten lead-free solder, and therefore were produced from this Co-based alloy. The soldering equipment has been found to have a much longer service life because the erosion resistance to molten lead-free solder, including the welds, has been dramatically increased.

This invention was made on the basis of strong knowledge,

(1) the mass ^{_{0/0, Cr: 20.0~35.0%}} , Fe: 0.1~25.0%, C: 0.01~: L 20%, M n: 0.5~2.0%, Si: contains 0.1% to 2.0%, Co-based alloy with excellent erosion resistance against molten lead-free solder with a composition consisting of Co and inevitable impurities in the balance,

(2) the mass ^{_{0/0, Cr: 20.0~35.0%}} , Fe: 0.1~25.0%, C: 0.01~: L 20%, M n: 0.5~2.0%, Si: contains 0.1% to 2.0%, Furthermore, a Co-based alloy with excellent corrosion resistance against molten lead-free solder containing Ni: l.0 to 24.0%, with the balance being Co and inevitable impurities.

(3) mass ^{_{0/0, Cr: 20.0~35.0%}} , Fe: 0.1~25.0%, C: 0.01~: L 20%, M n: 0.5~2.0%, Si: contains 0.1% to 2.0%, Co with excellent corrosion resistance against molten lead-free solder containing one or two of La: 0.01-0.15% and Ce: 0.01-0.15%, with the balance consisting of Co and inevitable impurities Base alloy,

(4) the mass ^{_{0/0, Cr: 20.0~35.0%}} , Fe: 0.1~25.0%, C: 0.01~: L 20%, M n: 0.5~2.0%, Si: contains 0.1% to 2.0%, Furthermore, a Co-based alloy having excellent corrosion resistance against molten lead-free solder containing Mg: 0.001 to 0.05% and the balance being Co and inevitable impurities.

(5) Weight ^{_{0/0, Cr: 20.0~35.0%}} , Fe: 0.1~25.0%, C: 0.01~: L 20%, M n: 0.5~2.0%, Si: contains 0.1% to 2.0%, Further, Ni: 0 to 24.0%, and La: 0.01 to 0.15% and Ce: 0.01 to 0.15%, one or two of them, with the balance being Co and inevitable impurities Against molten lead-free solder Co-based alloy with excellent erosion resistance,

(6) Weight ^{_{0/0, Cr: 20.0~35.0%}} , Fe: 0.1~25.0%, C: 0.01~: L 20%, M n: 0.5~2.0%, Si: contains 0.1% to 2.0%, In addition, it contains Ni: 0 to 24.0% and Mg: 0.001-0.05%, and the Co base has excellent erosion resistance against molten lead-free solder having a composition consisting of Co and inevitable impurities. alloy,

(7) mass ^{_{0/0, Cr: 20.0~35.0%}} , Fe: 0.1~25.0%, C: 0.01~: L 20%, M n: 0.5~2.0%, Si: contains 0.1% to 2.0%, Furthermore, it contains one or two of La: 0.01-0.15% and Ce: 0.01-0.15%, and further Mg: 0.001-0.05%, with the balance having a composition of Co and inevitable impurities. Co-based alloy with excellent corrosion resistance against lead-free solder,

(8) at a mass ^{_{0/0, Cr: 20.0~35.0%}} , Fe: 0.1~25.0%, C: 0.01~: L 20%, M n: 0.5~2.0%, Si: contains 0.1% to 2.0%, In addition, Ni: 0 to 24.0%, La: 0.01 to 0.15% and Ce: 0.01 to 0.15%, or Mg: 0.001-0.05% However, it is characterized by a Co-based alloy that has excellent corrosion resistance against molten lead-free solder, the balance of which is composed of Co and inevitable impurities.

The Co-based alloy having excellent erosion resistance to molten lead-free solder according to the present invention is effective as a member of a lead-free soldering device, and more specifically, a solder bath, a jet nozzle, a lead-free soldering device, It is effective as a component of various components of lead-free soldering equipment such as propellers, shafts, ducts, heater protection tubes, and heater cover tubes. Therefore, this invention

(9) A lead-free soldering device member made of a Co-based alloy having the composition according to any one of (1) to (8),

(10) A solder bath for a lead-free soldering apparatus that also has a Co-based alloy power having the component composition according to any one of (1) to (8),

(11) A lead-free soldering device injection nozzle that also has a Co-based alloy power having the component composition according to any one of (1) to (8),

(12) Co-base alloy force having the composition according to any one of (1) to (8) Propeller for lead-free soldering equipment,

(13) A lead-free soldering device shaft that also has a Co-based alloy power having the component composition according to any one of (1) to (8),

(14) A lead-free soldering device duct comprising a Co-based alloy having the component composition according to any one of (1) to (8),

(15) A heater protective tube for a lead-free soldering apparatus that also has a Co-based alloy power having the component composition according to any one of (1) to (8),

(16) A heater-coated tube for a lead-free soldering apparatus having a Co-based alloy power having the component composition according to any one of (1) to (8).

[0009] Next, the reasons for limitation of each element in the alloy composition of the lead-free soldering device member in the first condition of the present invention will be described in detail.

Cr:

Cr is concentrated on the surface to form a thin and dense Cr O-based passive film.

twenty three

This has the effect of preventing molten Sn-Ag solder, which is a molten lead-free solder, from contacting and reacting directly with the soldering equipment parts, but even if it contains less than 20.0% Cr On the other hand, if the content exceeds 35.0%, processing becomes difficult. Therefore, Cr contained in the lead-free soldering apparatus member having the Co-base alloy force of the present invention is set to 20. 0 to 35.0%. More preferably, it is 25.0 to 32.0%.

[0010] Fe:

Fe is added because it dissolves in a small amount in molten lead-free solder, thereby suppressing the reactivity of molten lead-free solder, especially molten Sn-Ag solder, and consequently suppressing damage caused by lead-free solder. However, if Fe is contained in an amount of less than 0.1%, the desired effect cannot be obtained. On the other hand, if it exceeds 25.0%, the corrosion resistance against lead-free solder deteriorates, which is not preferable. Therefore, the content of Fe is set to 0.1-25.0%. More preferably, it is 15.0 to 22.0%.

[0011] C:

C forms WC, which is a hardened phase, together with W, which is contained at the same time, and finely disperses this in the substrate, thereby significantly improving the wear resistance and resistance to flowing molten lead-free solder. Although it has the effect of remarkably improving the erodibility, the desired effect cannot be obtained even if C contains less than 0.01%. On the other hand, if C exceeds 20%, the alloy becomes brittle, This is not preferable because it is difficult to apply a shape to a plate. Therefore, the C content is determined to be 0.01-: L 20%. A more preferred range is 0.06-0. 5%.

[0012] Mn:

Mn stabilizes the austenite structure, which is the crystal structure of the parent phase, thereby suppressing brittleness and, as a result, has the effect of facilitating shape formation. However, Mn is contained in an amount of less than 0.5%. However, if the content exceeds 2.0%, the wettability with lead-free solder is increased and the reaction with molten lead-free solder is promoted, thereby accelerating damage. It is not preferable. Therefore, the Mn content is set to 0.5 to 2.0% (the layer is preferably 0.5 to 1.5%).

[0013] Si:

Since Si has a high affinity with oxygen, it forms SiO on the surface and is free of molten lead together with CrO

2 2 3

Although it has the effect of inhibiting the Sn—Ag alloy, which is a solder, from contacting and reacting directly with a metal, the desired effect cannot be obtained even if Si is contained in an amount of less than 0.1%. If the content exceeds 50%, brittleness of the alloy becomes obvious and it becomes difficult to impart a shape to a plate or the like. Therefore, the Si content is determined to be 0.1 to 2.0%. A more preferable range is 0.2 to 1.5%.

[0014] Ni:

Ni is an element that stabilizes the austenite structure, which is the crystal structure of the parent phase. Therefore, by suppressing the formation of harmful phases in the weld that remains in the solidified state, Ni Since it has the effect of improving the erosion resistance to free solder, the desired effect cannot be obtained even if Ni less than 1.0% is added. On the other hand, it exceeds 24.0%. If contained, the wear resistance against molten lead-free solder is lowered, which is not preferable. Therefore, the Ni content is set to 1.0 to 24.0%. A more preferable range is 1.0 to 8.0%.

[0015] La and Ce:

These components can be added in small amounts to form a Co base formed in molten lead-free solder. It is added as necessary because it has the effect of improving the erosion resistance against lead-free solder by improving the adhesion of the alloy surface film. However, if the La content is less than 0.01%, the desired effect cannot be obtained. On the other hand, if it exceeds 0.15%, the surface film tends to be peeled off, which is undesirable. Therefore, the content of La is set to 0.01 to 0.15%. A more preferable range of the La content is 0.05 to 0.12%.

Similarly, if the Ce content is less than 0.01%, a sufficient effect cannot be obtained to improve the adhesion of the surface coating of the Co-based alloy. On the other hand, if it exceeds 0.15%, conversely The surface film is not preferable because it easily peels off and becomes harmful. Therefore, the Ce content is determined to be 0.01 to 0.15%. A more preferable range of the Ce content is 0.05 to 0.12%.

[0016] Mg:

When Mg coexists with Mn, it stabilizes the austenite structure, which is the crystal structure of the parent phase, thereby suppressing brittleness and facilitating shape formation. If the content is less than 0.001%, the desired effect is not exhibited. On the other hand, if the content exceeds 0.05%, the phase stability is deteriorated and processing becomes difficult. Therefore, the content of Mg is set to 0.001 to 0.05% (the layer is preferably 0.002% to 0.001%).

[0017] Inevitable impurities:

Forces that include P and s as unavoidable impurities These impurities cause cracks during alloy production such as high-temperature processing and high-temperature cracks in welds. Therefore, it is desirable to reduce as much as possible.

[0018] Next, under the same condition as the first condition, a component added with W: 3.0 to 15.0% is used as the second condition, and the same effect as the first condition is obtained. It was.

[0019] (17) a mass ^{_{0/0, Cr:. 20.}} 0~35 0%, W:. 3. 0~15 0%, Fe:. 0. 1~25 0%, C:

0.01-: L 20%, Mn: 0.5-2.0%, Si: 0.1-2.0%, with the remainder consisting of Co and inevitable impurities Co-based alloy with excellent corrosion resistance to solder,

(18) the mass ^{_{0/0, Cr:. 20.}} 0~35 0%, W:. 3. 0~15 0%, Fe:. 0. 1~25 0%, C: 0.01 ~: Molten lead containing 20% L, Mn: 0.5 ~ 2.0%, Si: 0.1 ~ 2.0%, Ni: l.0 ~ 24.0%, the balance being Co and inevitable impurities Co-based alloy with excellent corrosion resistance against free solder,

(19) the mass ^{_{0/0, Cr: 20.0~35.0%}} , W: 3.0~15.0%, Fe: 0.1~25.0%, C: 0.01~: L 20%, Mn: 0.5~2.0%, Si: 0.1~ It contains 2.0%, and also contains: La: 0.01 to 0.15% and Ce: 0.01 to 0.15% of one or two, with the balance being Co and unavoidable impurity free composition Co-based alloy with excellent corrosion resistance to solder,

(20) the mass ^{_{0/0, Cr: 20.0~35.0%}} , W: 3.0~15.0%, Fe: 0.1~25.0%, C: 0.01~: L 20%, Mn: 0.5~2.0%, Si: 0.1~ Co-based alloy with excellent corrosion resistance against molten lead-free solder containing 2.0% and Mg: 0.001-0.05%, with the balance being Co and inevitable impurities

(21) the mass ^{_{0/0, Cr: 20.0~35.0%}} , W: 3.0~15.0%, Fe: 0.1~25.0%, C: 0.01~: L 20%, Mn: 0.5~2.0%, Si: 0.1~ Containing 2.0%, further containing Ni: 0-24.0%, further containing one or two of La: 0.01-0.15% and Ce: 0.01-0.15%, the balance being Co and inevitable Co-base alloy with excellent erosion resistance against molten lead-free solder with a composition of impurity power

(22) the mass ^{_{0/0, Cr: 20.0~35.0%}} , W: 3.0~15.0%, Fe: 0.1~25.0%, C: 0.01~: L 20%, Mn: 0.5~2.0%, Si: 0.1~ Corrosion resistance to molten lead-free solder containing 2.0%, further containing Ni: 0-24.0%, further containing Mg: 0.001-0.05%, and the balance consisting of Co and inevitable impurities Excellent Co-base alloy,

(23) the mass ^{_{0/0, Cr: 20.0~35.0%}} , W: 3.0~15.0%, Fe: 0.1~25.0%, C: 0.01~: L 20%, Mn: 0.5~2.0%, Si: 0.1~ Containing 2.0%, further containing: La: 0.01 to 0.15% and Ce: 0.01 to 0.15%, or Mg: 0

Co-based alloy with excellent corrosion resistance against molten lead-free solder containing 0.001 to 0.05% and the balance being Co and inevitable impurities.

(24) the mass ^{_{0/0, Cr: 20.0~35.0%}} , W: 3.0~15.0%, Fe: 0.1~25.0%, C: 0.01-: L 20%, Mn: 0.5-2.0%, Si: 0.1-2.0%, Ni: l. 0-24.0%, and further La: 0.01 to 0.15% and Ce: 0.01 to 0.15% of one or two, Mg: 0.001-0.05%, the balance is It is characterized by a Co-based alloy having a composition consisting of Co and inevitable impurities and having excellent corrosion resistance against molten lead-free solder.

Therefore, the Co-based alloy having excellent erosion resistance against molten lead-free solder according to the present invention is effective as a member of a lead-free soldering apparatus, and more specifically, a lead-free soldering apparatus. It is effective as a component of various components of lead-free soldering equipment such as solder tanks, spray nozzles, propellers, shafts, ducts, heater protection tubes, and heater cladding tubes. Therefore, the present invention

(25) A lead-free soldering device member made of a Co-based alloy having the composition according to any one of (17) to (24),

(26) A solder bath for a lead-free soldering device comprising a Co-based alloy having the composition according to any one of (17) to (24),

(27) A lead-free soldering device injection nozzle made of a Co-based alloy having the component composition according to any one of (17) to (24),

(28) A propeller for a lead-free soldering device comprising a Co-based alloy having the component composition according to any one of (17) to (24),

(29) A lead-free soldering device shaft comprising a Co-based alloy having the composition according to any one of (17) to (24),

(30) A lead-free soldering device duct made of a Co-based alloy having the composition according to any one of (17) to (24),

(31) A heater protective tube for a lead-free soldering device, comprising a Co-based alloy having the composition according to any one of (17) to (24),

(32) A heater-coated tube for a lead-free soldering device made of a Co-based alloy having the component composition according to any one of (17) to (24).

[0021] Next, according to the second condition, the alloy composition of each lead-free soldering device member is the same as that of the first condition, except for the following matters. [0022] Cr contained in a lead-free soldering apparatus member having a Co-based alloying power is set to 20.0 to 35.0%, and more preferably 21.0 to 25.0%.

Further, the Fe content is 0.1-25.0%, more preferably 0.5-5.0%. Furthermore, the Ni content is set to 1.0 to 24.0%, and a more preferable range is 8.0 to 24.0%.

[0023] W:

W has the effect of suppressing damage due to the flow of molten lead-free solder by improving the wear resistance, but the desired effect cannot be obtained even if W is contained in less than 3.0%. If W exceeds 15.0%, the effect of Cr is remarkably impaired, and as a result, the erosion resistance against molten lead-free solder is deteriorated. Therefore, the content of W is set to 3.0 to 15.0%. More preferably, it is 13. 0-15. 0%.

[0024] Sarakuko and the present inventors have conducted intensive research to obtain an Fe-based alloy having excellent erosion resistance against molten lead-free solder.

(Ii) Co: 15 to 48% by mass (hereinafter, “%” represents mass%) and Cr: 13 to 28%, and various other additive elements are optimized and Fe-based alloys are Fe-based Even an alloy has excellent erosion resistance against molten lead-free solder, and its composition is Co: 15-48%, Cr: 13-28%, Si: 0.2-3.5%, A1: 0.05 to 0.4%, Mn: 0.02 to 2%, C: 0.02 to 0.5%, N: 0.01 to 0.3%, the balance being Fe and inevitable I prefer to be made of impurities,

(Mouth) In addition to the Fe-based alloy described in (i) above,

(a) 1-10% of one or more of W and Mo in total,

(b) 0.1 to 3% in total of one or more of Nb and Ta,

(c) One or more of Y and rare earth elements in a total of 0.001-0.3%, containing one or more of (a) to (c), the balance being We have obtained knowledge that Fe and Fe-based alloys that have a composition that also has inevitable impurity power have superior erosion resistance against molten lead-free solder.

This invention was made on the basis of strong knowledge,

(33) the mass ^{_{0/0, Co: 15~48%}} , Cr: 13~28%, Si:. 0. 2~3 5%, A1:. 0. 05~0 4%, Mn: 0. 02 ~ 2%, C: 0.02-0.5%, N: 0.01-0.3%, remaining power Fe-based alloy with excellent corrosion resistance against molten lead-free solder with a composition of e and inevitable impurities

(34) the mass ^{_{0/0, Co: 15~48%}} , Cr: 13~28%, Si: 0.2~3.5%, A1: 0.05~0

.4%, Mn: 0.02 to 2%, C: 0.02 to 0.5%, N: 0.01 to 0.3%, and 1 to 10% in total of one or more of W and Mo An Fe-based alloy with excellent erosion resistance against molten lead-free solder having a composition comprising the balance Fe and inevitable impurities,

(35) the mass ^{_{0/0, Co: 15~48%}} , Cr: 13~28%, Si: 0.2~3.5%, A1: 0.05~0

.4%, Mn: 0.02 to 2%, C: 0.02 to 0.5%, N: 0.01 to 0.3%, and one or more of Nb and Ta in total 0.1 to 3% A Fe-based alloy that is excellent in erosion resistance against molten lead-free solder having a composition comprising the balance Fe and inevitable impurities,

(36) the mass ^{_{0/0, Co: 15~48%}} , Cr: 13~28%, Si: 0.2~3.5%, A1: 0.05~0

.4%, Mn: 0.02 to 2%, C: 0.02 to 0.5%, N: 0.01 to 0.3%, and 0.001 to 0.3% in total of one or more of Y and rare earth elements A Fe-based alloy with excellent erosion resistance to molten lead-free solder with the balance being Fe and inevitable impurities.

(37) the mass ^{_{0/0, Co: 15~48%}} , Cr: 13~28%, Si: 0.2~3.5%, A1: 0.05~0

.4%, Mn: 0.02 to 2%, C: 0.02 to 0.5%, N: 0.01 to 0.3%, and 1 to 10% in total of one or more of W and Mo Fe with excellent erosion resistance against molten lead-free solder containing 0.1 to 3% of one or more of Nb and Ta in total, the balance being Fe and inevitable impurities Base alloy,

(38) the mass ^{_{0/0, Co: 15~48%}} , Cr: 13~28%, Si: 0.2~3.5%, A1: 0.05~0

.4%, Mn: 0.02 to 2%, C: 0.02 to 0.5%, N: 0.01 to 0.3%, and 1 to 10% in total of one or more of W and Mo Furthermore, it has excellent corrosion resistance against molten lead-free solder containing 0.001-0.3% in total of one or more of Y and rare earth elements, with the balance being composed of Fe and inevitable impurities. Fe-based alloy, (39) the mass ^{_{0/0, Co: 15~48%}} , Cr: 13~28%, Si:. 0. 2~3 5%, A1: 0. 05~0

4%, Mn: 0.02 to 2%, C: 0.02 to 0.5%, N: 0.01 to 0.3%, and one or two of Nb and Ta Contain more than 0.1 to 3% of the total species, and further add one or more of Y and rare earth elements to a total of 0.001 to 0.3%, the balance being Fe and inevitable Fe-based alloy with excellent erosion resistance against molten lead-free solder having a composition with impurity power,

(40) the mass ^{_{0/0, Co: 15~48%}} , Cr: 13~28%, Si:. 0. 2~3 5%, A1: 0. 05~0

4%, Mn: 0.02 to 2%, C: 0.02 to 0.5%, N: 0.01 to 0.3%, and one or two of W and Mo 1 to 10% in total, and 0.1 to 3% in total of one or more of Nb and Ta, and one or more of Y and rare earth elements This is characterized by an Fe-based alloy having a total corrosion resistance of 0.001-0.3% and a balance of Fe and inevitable impurities and having excellent corrosion resistance against molten lead-free solder.

The Fe-based alloy with excellent erosion resistance to molten lead-free solder of this invention has significantly greater erosion resistance against molten lead-free solder, including welds, when used as a component in lead-free soldering equipment. As lead rises, lead-free soldering equipment and components such as solder tanks, spray nozzles, propellers, shafts, ducts, heater protection tubes, and heater cladding tubes of lead-free soldering equipment They have obtained knowledge that the life of various components has been significantly improved.

Therefore, the present invention

(41) A lead-free soldering device member made of an Fe-based alloy having the composition described in any one of (33) to (40),

(42) A solder bath for a lead-free soldering device made of an Fe-based alloy having the composition described in any one of (33) to (40),

(43) A spray nozzle for a lead-free soldering device made of an Fe-based alloy having the composition according to any one of (33) to (40),

(44) A propeller for a lead-free soldering device made of an Fe-based alloy having the composition according to any one of (33) to (40), (45) A shaft for a lead-free soldering device made of an Fe-based alloy having the composition described in any one of (33) to (40),

(46) A duct for a lead-free soldering device made of an Fe-based alloy having the composition according to any one of (33) to (40),

(47) A heater protective tube for a lead-free soldering device made of an Fe-based alloy having the composition described in any one of (33) to (40),

(48) Of the above (33) to (40), characterized in that the heater cladding tube for a lead-free soldering device is made of an Fe-based alloy having the composition described in any one of the above It is.

Next, the reason for limitation of each element in the alloy composition of the Fe-based alloy and the lead-free soldering device member excellent in erosion resistance to the molten lead-free solder of the present invention will be described in detail.

Co:

Co is incorporated into the Fe-based alloy to improve wear resistance, and at the same time, suppresses the thermodynamic reaction to molten Sn, thereby suppressing the damage caused by molten lead-free solder. Addition force Co content of less than 15% is not enough to suppress the reactivity with Sn in particular. On the other hand, if the content exceeds 48%, the reactivity suppression effect will be saturated, which is economical. It is not preferable. Therefore, Co contained in the Fe-based alloy and lead-free soldering apparatus member having the Fe-based alloy force of the present invention is set to 15 to 48%. One layer is preferably 20 to 45%.

Cr:

twenty three

This prevents the molten Sn-Ag solder, which is a molten lead-free solder, from contacting and reacting directly with the soldering device components, but the desired effect can be achieved even if it contains less than 13% Cr. On the other hand, if the content exceeds 28%, the precipitation of Cr alpha phase is promoted, and as a result, processing becomes difficult. Therefore, Cr contained in the lead-free soldering apparatus member having the Fe-base alloy power of the present invention is set to 13 to 28%. More preferably, it is 15 to 25%. Si:

Since Si has a high affinity with oxygen, lead forms SiO on the surface and melts together with CrO

2 2 3

Although it has the effect of inhibiting the Sn-Ag alloy, which is a free solder, from contacting and reacting directly with a metal, the desired effect cannot be obtained even if Si is contained in less than 0.2%. If it exceeds 5%, the brittleness of the alloy becomes obvious and it is difficult to give shape to the plate. Therefore, the Si content is determined to be 0.2 to 3.5%. A more preferable range is 0.5 to 2.0%.

A1:

Since A1 has a high affinity with oxygen, it forms Al 2 O on the surface and melts together with Cr 2 O

2 3 2 3

Since it has the effect of preventing the molten Sn-Ag alloy, which is a lead-free solder, from contacting and reacting directly with the metal, the desired effect cannot be obtained even if it contains less than 0.05% of A1. On the other hand, if the content exceeds 0.4%, erosion is accelerated, which is not preferable. Therefore, the content of A1 is set to 0.05-5.4%. A more preferred range is 0.05 to 0.2%.

Mn:

Mn stabilizes the austenite structure, which is the crystal structure of the parent phase, thereby suppressing brittleness and, as a result, has an effect of facilitating shape formation. However, Mn is contained in an amount of less than 0.02%. However, if the content exceeds 2.0%, the wettability with lead-free solder is increased and the reaction with molten lead-free solder is promoted, accelerating damage. It is not preferable. Therefore, the content of Mn is set to 0.02-2.0%. More preferably, the content is 0.1 to 1.0%.

N:

N stabilizes the austenite structure, which is the crystal structure of the parent phase, thereby suppressing brittleness and, as a result, has the effect of facilitating shape formation. However, N is contained in an amount of less than 0.01%. However, the desired effect cannot be obtained. On the other hand, if the content exceeds 0.3%, it becomes brittle and the workability is impaired. Therefore, the N content is set to 0.01 to 0.3%. More preferably, it is 0.1 to 0.3%.

C: C forms a chromium carbide that is a hardened phase together with Cr contained at the same time, and has the effect of remarkably improving the wear resistance against molten lead-free solder by finely dispersing this, but C is less than 0.02%. However, if the content exceeds 0.5%, the alloy becomes brittle and it is difficult to impart a shape to a plate or the like. It was but connexion, determined from 0.02 to 0.5 ^_0/0 [This content of C. More preferably! /ヽrange ί or 0.04 to 0.3 ^_0/0.

W and Mo:

Both W and Mo have the effect of suppressing damage caused by molten lead-free solder by improving wear resistance, so the power added as needed W or Mo totals one or more of W and Mo However, if the content is less than 1%, the desired effect cannot be obtained. On the other hand, if one or more of W and Mo are more than 10% in total, the cache properties deteriorate. Therefore, the content of W and Mo is determined to be 1 to 10% in total for one or more of W and Mo. Preferably, it is 3 to 8%.

Nb and Ta:

Nb and Ta form carbides such as NbC and TaC together with C that is contained at the same time, and finely disperse this to add significantly to the wear resistance of molten lead-free solder. The desired effect cannot be obtained even if one or more of Nb and Ta are included in a total of less than 0.1%. On the other hand, one or more of Nb and Ta are not contained. When the total content exceeds 3%, workability deteriorates. Therefore, the content of Nb and Ta was determined so that one or more of Nb and Ta totaled 0.1 to 3%. Preferably, it is 0.2 to 1%.

Y and rare earth elements:

These components have the effect of improving the erosion resistance of lead-free solder by improving the adhesion of the surface film of the Fe-based alloy formed in molten lead-free solder by adding a trace amount. It is added as necessary. However, even if one or more of Y and rare earth elements are contained in a total amount of less than 0.001%, the desired effect cannot be obtained. The surface film is not preferable because it easily peels off and is harmful. Therefore, the content of Y and rare earth elements is Y and One or more of the rare earth elements was set to 0.001-0.3% in total. A more preferred range is 0.05 to 0.12%.

Inevitable impurities:

Forces that include P and S as unavoidable impurities These impurities cause cracks during alloy production such as high temperature processing and hot cracks in welds. Therefore, it is desirable to reduce as much as possible. In addition, if the Ni content is less than 3% and the Zr, Mg, Ca and Ti contents are each less than 0.05%, the characteristics of the Fe-based alloy of the present invention are not significantly impaired. Inclusion is allowed.

BEST MODE FOR CARRYING OUT THE INVENTION

[0028] Using an ordinary high-frequency melting furnace, melted and forged to produce an ingot having a thickness of 40 mm and a weight of about 5 kg, with a Co-based alloy having the composition shown in Tables 1 to 4 did. This ingot was subjected to homogenization heat treatment at 1230 ° C for 10 hours and held in the range of 1000 to 1230 ° C, while the thickness of lmm was reduced by one hot rolling while the final thickness was reduced. : 3mm thin plate, then held at 1200 ° C for 30 minutes, water-quenched for solid solution treatment, and puffed on the surface of the lead-free soldering device member of the present invention (hereinafter referred to as the member of the present invention) 1) to 31 and a comparative lead-free soldering device member (hereinafter referred to as a comparative member) 1 to 14 were produced.

Further, a conventional lead-free soldering device member (hereinafter referred to as a conventional member) having a thickness of 3 mm and made of SUS304 was prepared.

Furthermore, a lead-free solder with a composition of Sn- 3.2% Ag-0. L% Cu, which is known as the basic composition of lead-free solder, was prepared.

[0030] Thin plates made of the present invention members 1 to 31, comparative members 1 to 14 and conventional members were cut into dimensions of 30 mm in length, 20 mm in width, and 3 mm in thickness, respectively, to produce unwelded test pieces, Furthermore, the present invention members 1 to 31, comparative members 1 to 14 and the conventional members are also made of butt welding of the same material type using an argon arc welding machine with a thin plate of 3 mm. Including plate force Welded bead was cut into dimensions of 30 mm in length and 20 mm in width so that the weld bead was located in the center, and a specimen with welding was prepared. After polishing the surface of these specimens and finally polishing the surface of water-resistant emery paper # 400, these were ultrasonically vibrated in acetone. Held for 5 minutes to degrease.

Further, a lead-free solder having a composition of Sn—3.2% Ag-0. L% Cu was heated to 455 ° C. and kept at this temperature to produce a molten lead-free solder. The molten lead-free solder was convected by a stirring blade, and the unwelded specimen and the welded specimen were immersed in the convected molten lead-free solder and held for 1000 hours. After holding for 1000 hours, take out the specimen without welding and the specimen with welding, observe the cross section of the specimen without welding and the specimen with welding with an optical microscope, and observe the maximum erosion depth of the base metal part and welding part. The results are shown in Tables 1 to 4 and evaluated for corrosion resistance against molten lead-free solder.

[0032] [Table 1]

0330

* 卬 indicates that the value is out of the composition range of the present invention.

From the results shown in Table 14, the maximum erosion depth of the non-welded specimen of the invention member 1 31 is smaller than the maximum erosion depth of the non-welded specimen of SUS304 stainless steel, which is a conventional member. Invention member 1 31 Maximum weld depth of welded specimen Since this is smaller than the maximum erosion depth of the welded part of the specimen with welded SUS304 stainless steel, which is a conventional member, members 1 to 31 of the present invention have higher corrosion resistance to molten lead-free solder than conventional members. In particular, it can be seen that the corrosion resistance of the welded portion is excellent.

However, the welded specimens of comparative members 1 to 14, which are also inferior to this invention, have poor erosion resistance at the welded part, or poorly eroded at both the welded part of the welded specimen and the welded specimen. It can also be seen that there are characteristics that are preferable because some cracks are generated during processing into a plate.

[0037] An ingot having a thickness of 40 mm and a weight of about 5 kg with a Co-based alloy having the composition shown in Tables 5 to 8 was prepared by melting and forging using a normal high-frequency melting furnace. . This ingot was subjected to homogenization heat treatment at 1230 ° C for 10 hours and held in the range of 1000 to 1230 ° C, while the thickness of lmm was reduced by one hot rolling while the final thickness was reduced. : 3mm thin plate, then held at 1200 ° C for 30 minutes, water-quenched for solid solution treatment, and puffed on the surface of the lead-free soldering device member of the present invention (hereinafter referred to as the member of the present invention) A thin plate consisting of 32 to 73 and a comparative lead-free soldering device member (hereinafter referred to as a comparative member) 15 to 30 was produced.

Furthermore, a conventional lead-free soldering device member (hereinafter referred to as a conventional member) having a thickness of 3 mm made of SUS304 was prepared.

Furthermore, a lead-free solder having a composition of Sn-3.0% Ag-0.l% Cu, which is known as the basic composition of lead-free solder, was prepared.

[0038] The present invention members 32 to 73, comparative members 15 to 30 and the thin plate which is also a conventional member are cut into dimensions of 30 mm in length, 20 mm in width, and 3 mm in thickness, respectively. Further, the present invention members 32 to 73, comparative members 15 to 30 and the conventional members can be made into a thickness: 3 mm thin plate by using an argon arc welding machine to butt-weld the same material type. Plate force including welded part A welded test piece was prepared by cutting the weld bead into a center of 30 mm length and 20 mm width. The surfaces of these test pieces were polished and finally polished with a water-resistant emery paper # 400 finish, and these were degreased by holding them in an ultrasonic vibration state in acetone for 5 minutes. Furthermore, a lead-free solder having a composition of Sn—3.0% Ag—0.1% Cu was heated to 460 ° C. and maintained at this temperature to produce a molten lead-free solder. The molten lead-free solder was convected by a stirring blade, and the unwelded specimen and the welded specimen were immersed in the convected molten lead-free solder and held for 1000 hours. After holding for 1000 hours, take out the specimen without welding and the specimen with welding, observe the cross section of the specimen without welding and the specimen with welding with an optical microscope, and observe the maximum erosion depth of the base metal part and welding part. The results are shown in Tables 5-8 and evaluated for corrosion resistance against molten lead-free solder.

[0040] [Table 5]

0041

* Indicates that the value is out of the composition range of the present invention.

From the results shown in Table 58, the maximum erosion depth of the non-welded specimen of the present invention member 32 73 is smaller than the maximum erosion depth of the non-welded specimen of SUS304 stainless steel, which is a conventional member. Furthermore, the maximum penetration of the welded part of the present invention member 32 73 with welds Since the corrosion depth is smaller than the maximum erosion depth in the welded part of the specimen with welded SUS304 stainless steel, which is a conventional member, the members 32 to 73 of the present invention are molten lead-free solder compared to the conventional member. Excellent corrosion resistance against welding, especially corrosion resistance against welds.

However, the welded specimens of comparative members 15-30, which are also invented by this invention, are inferior in the erosion resistance of the welded part, or inferior in the erosion resistance of both the welded part of the welded specimen and the welded specimen. In addition, it can be seen that there are preferable characteristics because there are cracks in the process of processing into a plate.

[0045] An ingot having a thickness of 40 mm and a weight of about 5 kg having an Fe-based alloy force having the composition shown in Tables 9 to 15 was prepared by melting and forging using a normal high-frequency melting furnace. The ingot was subjected to homogenization heat treatment at 1230 ° C for 10 hours and held within the range of 1000-1230 ° C, and the final thickness was reduced while reducing the thickness of lmm by one hot rolling: The lead-free soldering device member of the present invention (hereinafter referred to as the present invention component) is obtained by forming a 3 mm thin plate, then subjecting it to 1200 ° C for 30 minutes, water-quenching to give a solid solution treatment, and puffing the surface. A thin plate comprising 74 to 155 and a comparative lead-free soldering device member (hereinafter referred to as a comparative member) 31 to 49 was produced.

Furthermore, a conventional lead-free soldering device member (hereinafter referred to as a conventional member) having a thickness of 3 mm and made of SUS304 was prepared.

Furthermore, a lead-free solder having a composition of Sn—3.0% Ag—0.1% Ni, which is known as a basic composition of lead-free solder, was prepared.

[0048] The present invention members 74 to 155, the comparison members 31 to 49, and the thin plate which is also a conventional member are cut into dimensions of 30 mm in length, 20 mm in width, and 3 mm in thickness, respectively. After polishing the surfaces of these test pieces and finally polishing the surface of a water-resistant emery paper # 400 finish, they were degreased by holding them in an ultrasonic vibration state in acetone for 5 minutes.

Furthermore, a lead-free solder with a composition of Sn-3.0% Ag-0.l% Ni was heated to 435 ° C and held at this temperature to produce a molten lead-free solder. The molten lead-free solder was convected by a stirring blade, and the test piece was immersed in the convected molten lead-free solder and held for 1000 hours. After holding for 1000 hours, remove the specimen and cross-section the specimen with an optical microscope. The maximum erosion depth was measured by microscopic observation, and the results are shown in Tables 16 to 17 to evaluate the erosion resistance against molten lead-free solder.

[Table 9]

Inamoto Akira Ingredient composition (mass: ¾) (the balance includes inevitable impurities) Member 99 34 CoC A 1 M n C N W M O T a N b

6 0.14 0.15 0.25 0.16 .02

4 8 0.11 0.27 0.23 0.04 9.98

6 0.13 0.86 0.27 0.18 1.01

92 5 0.09 0.95 0.25 0.14 9.95

4 5 0.14 1.47 0.14 0.13 0.11

, 2 6 .30 1.64 0.13 0.22 2.99

2 0.15 0.61 0.22 0.13 0.12

0.13 0.85 0.22 0.16 2.98

97 4 0.07 0.56 0.26 0.12

8 4 0.17 0.45 0.24 0.17

2 0 0.16 0.76 0.23 0.15

27.5 9 0.18 .38 0.16 0.13

5 0.16 .0.98 0.18 0.22 3.44 3.14

02 9 0.17 0.52 0.16 0.16 0.25 0.36

28 0.25 0.31 0.17 0.21

[] [] 0052

§S

Ingredient composition (mass%) (the balance includes inevitable impurities)

§S

Ingredient composition (mass%) (the balance includes inevitable impurities)

Material Rare earth element of the present invention C o S i A 1 M n C N W M o T a N b Y 1 '' e

34 4 2.71 0.16 1.52 0.17 0.08 0.11 balance

35 4. 2.50 0.31 L.47 0.12 0.03 2.98 Balance

.77 0.25 0.50 0.24 0.14 0.12 balance

1.84 0.16 0.83 0.24 0.07 2.97 balance

L.91 0.08 0.51 0.27 0.19 0.001 balance

1.69 0.15 0.47 0.21 0.17 0.297 balance

1.94 0.18 0.79 0.27 0.25 CeO.002 balance

4 2.71 0.19 L.34 0.15 0.23 Ce: 0.298 balance

42 2.10 0.18 0.97 0.17 0.10 3.42 3.16 balance

43 2.97 0.16 0.50 0.18 0.08 0.24 0.37 Balance

LaO.065

44 39.4 1.40 0.24 0.38 0.16 0.20 0.107 Balance

Ce: 0.050

.59 0.18 0.17 0.24 0.19 3.53 0.18 balance .41 0.08 0.55 0.08 0.11 3.48 0.15 0.081 balance

.90 0.12 0.69 0.31 0.12 2.57 0.059 balance

La: 0.052

.73 0.28 .50 0.17 0.17 4.81 0.17 balance

Ce: 0.040

§S

Ingredient composition (mass? S) (the balance includes inevitable impurities)

* Mark indicates that the value is out of the composition range of the present invention.

* Indicates that the value is outside the composition range H of the present invention.

Maximum erosion depth Maximum erosion depth Member Remarks Member Remarks (im) (am)

74 24-104 19

75 37-105 22

76 15-106 25

77 22 107 26

78 Ά4-108 22

79 35-109 21

80 23-110 16

81 32-111 18

82 28-112 19

83 22-113 16

84 17-114 22-

85 31-115 14-

86 19-116 26

87 25-117 11

88-Books

29 118 16

Departure

89 28-119 16

Light

90 19-120 22

91 20-121 18

92 31-122 26

93 25-123 22

94 19-124 24

95 28-125 12

96 23-126 27

97 31-127 17

98 34-128 14

99 26-129 17

100 24-130 18

1D1 27-131 16

102-132 12-

103 24-133 22-]

[0058] From the results shown in Tables 9 to 17, the maximum erosion depth of the specimens 74 to 155 of the present invention is smaller than that of the conventional SUS304 stainless steel specimen. From the results, it can be seen that the present invention members 74 to 155 have superior erosion resistance against lead-free solder compared to conventional members!

[0059] However, the test pieces of the comparative members 31 to 49 that are out of the present invention have inferior erosion resistance, and also have undesirable characteristics such as cracks that may occur during processing into a plate. I have a lot of power. Industrial applicability

The lead-free soldering device member that also has the Co-base alloy or Fe-base alloy force of the present invention has excellent erosion resistance against lead-free solder, particularly erosion resistance against welds. Lead-free soldering equipment can be used without damage for a long period of time, and has excellent effects in the electronics and electrical industries.

Claims

The scope of the claims

[1] in a weight ^{_{0/0, Cr: 20.0 ~}} 35.0%, Fe: 0.1 ~ 25.0%, C: 0.01~: L 20%, Mn: 0 .5~2.0%, Si: contains 0.1% to 2.0% In addition, a Co alloy with excellent corrosion resistance to molten lead-free solder, characterized in that the balance has a composition that also has Co and inevitable impurity power.

[2] Mass ^{_{0/0, Cr: 20.0~35.0%}} , Fe: 0.1~25.0%, C: 0.01~: L 20%, Mn: 0 .5~2.0%, Si: it contains 0.1% to 2.0% Further, a Co-based alloy having excellent corrosion resistance against molten lead-free solder, characterized by containing Ni: 0-24.0% and having a balance force SCo and inevitable impurity power.

[3] Mass ^{_{0/0, Cr: 20.0~35.0%}} , Fe: 0.1~25.0%, C: 0.01~: L 20%, Mn: 0 .5~2.0%, Si: it contains 0.1% to 2.0% Furthermore, it contains 1 or 2 of La: 0.01-0.15% and Ce: 0.01-0.15%, with the balance consisting of Co and inevitable impurities. Co-based alloy with excellent corrosion resistance to solder.

[4] Mass ^{_{0/0, Cr: 20.0~35.0%}} , Fe: 0.1~25.0%, C: 0.01~: L 20%, Mn: 0 .5~2.0%, Si: it contains 0.1% to 2.0% Further, a Co-based alloy having excellent corrosion resistance against molten lead-free solder, characterized by further containing Mg: 0.001 to 0.05% and the balance having a composition of Co and inevitable impurities.

In [5] Mass ^{_{0/0, Cr: 20.0~35.0%}} , Fe: 0.1~25.0%, C: 0.01~: L 20%, Mn: 0 .5~2.0%, Si: it contains 0.1% to 2.0% In addition, Ni: l. 0 to 24.0%, La: 0.01 to 0.15% and Ce: 0.01 to 0.15% are contained, and the balance is Co and inevitable impurity power A Co-based alloy with excellent corrosion resistance against molten lead-free solder, characterized by having the following composition:

[6] Mass ^{_{0/0, Cr: 20.0~35.0%}} , Fe: 0.1~25.0%, C: 0.01~: L 20%, Mn: 0 .5~2.0%, Si: it contains 0.1% to 2.0% Furthermore, Ni: l. 0 to 24.0%, Mg: 0.001-0.05%, the balance being Co and unavoidable impurities, erosion resistance to molten lead-free solder Excellent Co-base alloy.

In [7] Mass ^{_{0/0, Cr: 20.0~35.0%}} , Fe: 0.1~25.0%, C: 0.01~: L 20%, Mn: 0

.5 to 2.0%, Si: 0.1 to 2.0%, further: La: 0.01 to 0.15% and Ce: 0 to 01 to 0.15%, or Mg: 0.001 to A Co-based alloy having excellent corrosion resistance to molten lead-free solder, characterized by containing 0.05% and the balance being Co and inevitable impurities.

[8] Mass ^{_{0/0, Cr: 20.0~35.0%}} , Fe: 0.1~25.0%, C: 0.01~: L 20%, Mn: 0 .5~2.0%, Si: it contains 0.1% to 2.0% Ni: l. 0 to 24.0%, La: 0.01 to 0.15% and Ce: 0.01 to 0.15%, or Mg: 0.001-0.05 Co-based alloy with excellent corrosion resistance to molten lead-free solder, characterized in that it has a composition comprising Co and inevitable impurities.

[9] A lead-free soldering apparatus member having a Co-based alloy power having the component composition according to claim 1, 2, 3, 4, 5, 6, 7 or 8.

[10] A solder bath for a lead-free soldering apparatus, characterized in that it has a Co-based alloy power having the composition according to claim 1, 2, 3, 4, 5, 6, 7 or 8.

[11] An injection nozzle for a lead-free soldering device, characterized in that it has a Co-based alloy power having the component composition according to claim 1, 2, 3, 4, 5, 6, 7 or 8.

[12] A propeller for a lead-free soldering apparatus, characterized in that it has a Co-based alloy power having the component composition according to claim 1, 2, 3, 4, 5, 6, 7 or 8.

[13] A shaft for a lead-free soldering device, characterized in that it has a Co-based alloy force having the composition according to claim 1, 2, 3, 4, 5, 6, 7 or 8.

[14] The outside of the lead-free soldering apparatus characterized by having a Co-based alloy having the component composition according to claim 1, 2, 3, 4, 5, 6, 7 or 8.

[15] A heater protective tube for a lead-free soldering device, characterized in that it has a Co-based alloy power having the composition according to claim 1, 2, 3, 4, 5, 6, 7 or 8.

[16] A heater cladding tube for a lead-free soldering device, characterized in that it has a Co-based alloy power having the component composition according to claim 1, 2, 3, 4, 5, 6, 7 or 8.

In [17] Mass ^{_{0/0, Cr: 20.0~35.0%}} , W: 3.0~15.0%, Fe: 0.1~25.0%, C: 0.0

1 to 1.20%, Mn: 0.5 to 2.0%, Si: 0.1 to 2.0%, the balance being Co and Co-based alloy with excellent corrosion resistance against molten lead-free solder, characterized by having a composition consisting of unavoidable impurities.

[18] In the mass ^{_{0/0, Cr: 20.0~35.0%}} , W: 3.0~15.0%, Fe: 0.1~25.0%, C: 0.0 1~1.20%, Mn: 0.5~2.0%, Si: 0.1~2.0 Co-based alloy with excellent erosion resistance against molten lead-free solder characterized by containing Ni: l.0 to 24.0% and the balance being Co and inevitable impurities. .

[19] In the mass ^{_{0/0, Cr: 20.0~35.0%}} , W: 3.0~15.0%, Fe: 0.1~25.0%, C: 0.0 1~1.20%, Mn: 0.5~2.0%, Si: 0.1~2.0 Further, it contains one or two of La: 0.01 to 0.15% and Ce: 0.01 to 0.15%, and the balance is composed of Co and inevitable impurities. Co-based alloy with excellent corrosion resistance against molten lead-free solder.

[20] In the mass ^{_{0/0, Cr: 20.0~35.0%}} , W: 3.0~15.0%, Fe: 0.1~25.0%, C: 0.0 1~1.20%, Mn: 0.5~2.0%, Si: 0.1~2.0 Co-based alloy with excellent corrosion resistance to molten lead-free solder, characterized in that it has a composition containing Mg: 0.001 to 0.05% and the balance being Co and inevitable impurities.

[21] In the mass ^{_{0/0, Cr: 20.0~35.0%}} , W: 3.0~15.0%, Fe: 0.1~25.0%, C: 0.0 1~1.20%, Mn: 0.5~2.0%, Si: 0.1~2.0 Ni: 1 to 24.0%, La: 0.01 to 0.15%, and Ce: 0.01 to 0.15%, and the balance is 1 to 2 Co-based alloy with excellent corrosion resistance to molten lead-free solder, characterized by having a composition of Co and inevitable impurities.

[22] In the mass ^{_{0/0, Cr: 20.0~35.0%}} , W: 3.0~15.0%, Fe: 0.1~25.0%, C: 0.0 1~1.20%, Mn: 0.5~2.0%, Si: 0.1~2.0 Molten lead containing Ni: l.0 to 24.0%, further containing Mg: 0.001 to 0.05%, and the balance comprising Co and inevitable impurities Co-based alloy with excellent corrosion resistance to free solder.

[23] In the mass ^{_{0/0, Cr: 20.0~35.0%}} , W: 3.0~15.0%, Fe: 0.1~25.0%, C: 0.0 1~1.20%, Mn: 0.5~2.0%, Si: 0.1~2.0 Contain%: La: 0.01-0

15% and Ce: contain one or two of 0.01 to 0.15%, and Mg: 0.001 to 0.05%, the balance being Co and inevitable impurities Co-base alloy with excellent erosion resistance against molten lead-free solder characterized by its composition.

[24] In the mass ^{_{0/0, Cr:. 20.}} 0~35 0%, W:. 3. 0~15 0%, Fe:. 0. 1~25 0%, C: 0. 0 1~1 20%, Mn: 0.5 to 2.0%, Si: 0.1 to 2.0%, Ni: l. 0 to 24.0%, and La: 0.01 ~ 0.15% and Ce: 1 ~ 0.15% in the range of 0.01 ~ 0.15%, further Mg: 0.001-0.05%, the balance being Co and inevitable Co-based alloy with excellent corrosion resistance to molten lead-free solder, characterized by having a composition consisting of impurities.

[25] A lead-free soldering device member comprising a Co-based alloy having the component composition according to claim 17, 18, 19, 20, 21, 22, 23, or 24.

[26] A solder bath for a lead-free soldering apparatus, characterized in that it also has a Co-based alloy having the component composition according to claim 17, 18, 19, 20, 21, 22, 23, or 24.

[27] An injection nozzle for a lead-free soldering apparatus, characterized in that it is a Co-based alloy having the component composition according to claim 17, 18, 19, 20, 21, 22, 23, or 24.

[28] A propeller for a lead-free soldering device, characterized in that the Co-based alloy having the component composition according to claim 17, 18, 19, 20, 21, 22, 23, or 24.

[29] A shaft for a lead-free soldering apparatus, characterized in that it also has a Co-based alloy having the component composition according to claim 17, 18, 19, 20, 21, 22, 23, or 24.

[30] A duct for a lead-free soldering device, characterized in that it also has a Co-based alloy having the component composition according to claim 17, 18, 19, 20, 21, 22, 23, or 24.

[31] A heater protective tube for a lead-free soldering apparatus, characterized in that it also has a Co-based alloy having the component composition according to claim 17, 18, 19, 20, 21, 22, 23, or 24.

[32] A heater-clad tube for a lead-free soldering apparatus, characterized in that it also has a Co-based alloy having the component composition according to claim 17, 18, 19, 20, 21, 22, 23, or 24.

In [33] Mass ^{_{0/0, Co: 15~48%}} , Cr: 13~28%, Si:. 0. 2~3 5%, A1:. 0. 05~0 4%

, Mn: 0.02 to 2%, C: 0.02 to 0.5%, N: 0.01 to 0.3%, with the balance being composed of Fe and inevitable impurities For molten lead-free solder Fe-based alloy with excellent corrosion resistance.

In [34] Mass ^{_{0/0, Co: 15~48%}} , Cr: 13~28%, Si: 0.2~3.5%, A1: 0.05~0.4%, Mn: 0.02~2%, C: 0.02~0.5% N: 0.01 to 0.3%, further containing one or more of W and Mo in a total of 1 to 10%, with the balance being composed of Fe and inevitable impurities Fe-based alloy with excellent corrosion resistance against molten lead-free solder.

In [35] Mass ^{_{0/0, Co: 15~48%}} , Cr: 13~28%, Si: 0.2~3.5%, A1: 0.05~0.4%, Mn: 0.02~2%, C: 0.02~0.5% N: 0.01 to 0.3%, further containing one or more of Nb and Ta in a total of 0.1 to 3%, with the balance being composed of Fe and inevitable impurities Fe-based alloy with excellent corrosion resistance against molten lead-free solder.

In [36] Mass ^{_{0/0, Co: 15~48%}} , Cr: 13~28%, Si: 0.2~3.5%, A1: 0.05~0.4%, Mn: 0.02~2%, C: 0.02~0.5% N: 0.01 to 0.3%, Y and one or more of the rare earth elements in total 0.001-0.3% in total, with the balance being Fe and inevitable impurity composition Fe-based alloy with excellent erosion resistance against molten lead-free solder.

In [37] Mass ^{_{0/0, Co: 15~48%}} , Cr: 13~28%, Si: 0.2~3.5%, A1: 0.05~0.4%, Mn: 0.02~2%, C: 0.02~0.5% , N: 0.01 to 0.3%, further containing 1 or 10% of W and Mo in total, and further containing 1 or 2 kinds of Nb and Ta Fe-base alloy with excellent erosion resistance against molten lead-free solder, characterized in that it contains a total of 0.1 to 3% and the balance is composed of Fe and inevitable impurities.

In [38] Mass ^{_{0/0, Co: 15~48%}} , Cr: 13~28%, Si: 0.2~3.5%, A1: 0.05~0.4%, Mn: 0.02~2%, C: 0.02~0.5% N: 0.01 to 0.3%, further containing 1 or 10% in total of one or more of W and Mo, and one or two of Y and rare earth elements Corrosion resistance to molten lead-free solder characterized by containing 0.001-0.3% in total with the balance being composed of Fe and inevitable impurities. Fe-based alloy with excellent food properties.

In [39] Mass ^{_{0/0, Co: 15~48%}} , Cr: 13~28%, Si:. 0. 2~3 5%, A1:. 0. 05~0 4%, Mn: 0. 02 ~ 2%, C: 0.02-0.5%, N: 0.01-0.3%, and one or more of Nb and Ta in total 0.1. -3%, and one or more of Y and rare earth elements are contained in a total of 0.001-0.3%, and the balance is composed of Fe and inevitable impurities. Fe-based alloy with excellent corrosion resistance against molten lead-free solder.

In [40] Mass ^{_{0/0, Co: 15~48%}} , Cr: 13~28%, Si:. 0. 2~3 5%, A1:. 0. 05~0 4%, Mn: 0. 02 -2%, C: 0.02-0.5%, N: 0.01-0.3%, and one or more of W and Mo in total 1-10 1% or more of Nb and Ta in total, and 0.1 to 3% in total, and further one or more of Y and rare earth elements in total of 0.001 An Fe-based alloy excellent in erosion resistance against molten lead-free solder, characterized by comprising 0.3% and the balance being composed of Fe and inevitable impurities.

[41] A lead-free soldering device member having an Fe-based alloy power excellent in erosion resistance to the molten lead-free solder according to any one of claims 33 to 40.

[42] A solder bath for a lead-free soldering device, characterized by having an Fe-based alloy power excellent in corrosion resistance to the molten lead-free solder according to any one of claims 33 to 40 .

[43] An Fe-based alloy mold characterized by being an Fe-based alloy mold having excellent erosion resistance to the molten lead-free solder according to any one of claims 33 to 40. This is a spray nozzle for lead-free soldering equipment.

[44] A propeller for a lead-free soldering device, characterized in that the Fe-based alloy has excellent erosion resistance to the molten lead-free solder according to any one of claims 33 to 40.

[45] A shaft for a lead-free soldering apparatus, characterized in that the Fe-based alloy has excellent erosion resistance to the molten lead-free solder according to any one of claims 33 to 40.

[46] The lead-free soldering apparatus according to any one of claims 33 to 40, wherein the Fe-based alloy has excellent erosion resistance against the molten lead-free solder.

[47] A heater protection tube for a lead-free soldering apparatus, characterized by having an Fe-based alloy power having the component composition according to any one of claims 33 to 40.

[48] A heater-clad tube for a lead-free soldering apparatus, which also has an Fe-based alloy power having the component composition according to any one of claims 33 to 40.