WO2007007003A3 - Procede de traitement par plasma d'effluents gazeux - Google Patents
Procede de traitement par plasma d'effluents gazeux Download PDFInfo
- Publication number
- WO2007007003A3 WO2007007003A3 PCT/FR2006/050699 FR2006050699W WO2007007003A3 WO 2007007003 A3 WO2007007003 A3 WO 2007007003A3 FR 2006050699 W FR2006050699 W FR 2006050699W WO 2007007003 A3 WO2007007003 A3 WO 2007007003A3
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- plasma treatment
- gas effluents
- plasma
- effluents
- gas
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/4412—Details relating to the exhausts, e.g. pumps, filters, scrubbers, particle traps
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01D—SEPARATION
- B01D53/00—Separation of gases or vapours; Recovering vapours of volatile solvents from gases; Chemical or biological purification of waste gases, e.g. engine exhaust gases, smoke, fumes, flue gases, aerosols
- B01D53/32—Separation of gases or vapours; Recovering vapours of volatile solvents from gases; Chemical or biological purification of waste gases, e.g. engine exhaust gases, smoke, fumes, flue gases, aerosols by electrical effects other than those provided for in group B01D61/00
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01D—SEPARATION
- B01D53/00—Separation of gases or vapours; Recovering vapours of volatile solvents from gases; Chemical or biological purification of waste gases, e.g. engine exhaust gases, smoke, fumes, flue gases, aerosols
- B01D53/32—Separation of gases or vapours; Recovering vapours of volatile solvents from gases; Chemical or biological purification of waste gases, e.g. engine exhaust gases, smoke, fumes, flue gases, aerosols by electrical effects other than those provided for in group B01D61/00
- B01D53/323—Separation of gases or vapours; Recovering vapours of volatile solvents from gases; Chemical or biological purification of waste gases, e.g. engine exhaust gases, smoke, fumes, flue gases, aerosols by electrical effects other than those provided for in group B01D61/00 by electrostatic effects or by high-voltage electric fields
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01D—SEPARATION
- B01D53/00—Separation of gases or vapours; Recovering vapours of volatile solvents from gases; Chemical or biological purification of waste gases, e.g. engine exhaust gases, smoke, fumes, flue gases, aerosols
- B01D53/34—Chemical or biological purification of waste gases
- B01D53/46—Removing components of defined structure
- B01D53/68—Halogens or halogen compounds
- B01D53/70—Organic halogen compounds
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05H—PLASMA TECHNIQUE; PRODUCTION OF ACCELERATED ELECTRICALLY-CHARGED PARTICLES OR OF NEUTRONS; PRODUCTION OR ACCELERATION OF NEUTRAL MOLECULAR OR ATOMIC BEAMS
- H05H1/00—Generating plasma; Handling plasma
- H05H1/24—Generating plasma
- H05H1/26—Plasma torches
- H05H1/32—Plasma torches using an arc
- H05H1/42—Plasma torches using an arc with provisions for introducing materials into the plasma, e.g. powder, liquid
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05H—PLASMA TECHNIQUE; PRODUCTION OF ACCELERATED ELECTRICALLY-CHARGED PARTICLES OR OF NEUTRONS; PRODUCTION OR ACCELERATION OF NEUTRAL MOLECULAR OR ATOMIC BEAMS
- H05H1/00—Generating plasma; Handling plasma
- H05H1/24—Generating plasma
- H05H1/46—Generating plasma using applied electromagnetic fields, e.g. high frequency or microwave energy
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05H—PLASMA TECHNIQUE; PRODUCTION OF ACCELERATED ELECTRICALLY-CHARGED PARTICLES OR OF NEUTRONS; PRODUCTION OR ACCELERATION OF NEUTRAL MOLECULAR OR ATOMIC BEAMS
- H05H1/00—Generating plasma; Handling plasma
- H05H1/24—Generating plasma
- H05H1/46—Generating plasma using applied electromagnetic fields, e.g. high frequency or microwave energy
- H05H1/461—Microwave discharges
- H05H1/4615—Microwave discharges using surface waves
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01D—SEPARATION
- B01D2259/00—Type of treatment
- B01D2259/80—Employing electric, magnetic, electromagnetic or wave energy, or particle radiation
- B01D2259/818—Employing electrical discharges or the generation of a plasma
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02C—CAPTURE, STORAGE, SEQUESTRATION OR DISPOSAL OF GREENHOUSE GASES [GHG]
- Y02C20/00—Capture or disposal of greenhouse gases
- Y02C20/20—Capture or disposal of greenhouse gases of methane
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02C—CAPTURE, STORAGE, SEQUESTRATION OR DISPOSAL OF GREENHOUSE GASES [GHG]
- Y02C20/00—Capture or disposal of greenhouse gases
- Y02C20/30—Capture or disposal of greenhouse gases of perfluorocarbons [PFC], hydrofluorocarbons [HFC] or sulfur hexafluoride [SF6]
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Physics & Mathematics (AREA)
- Plasma & Fusion (AREA)
- General Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Analytical Chemistry (AREA)
- Oil, Petroleum & Natural Gas (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Biomedical Technology (AREA)
- Health & Medical Sciences (AREA)
- Environmental & Geological Engineering (AREA)
- Electromagnetism (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Treating Waste Gases (AREA)
- Drying Of Semiconductors (AREA)
- Chemical Vapour Deposition (AREA)
- Physical Water Treatments (AREA)
Abstract
L'invention concerne un procédé de traitement, par plasma, d'effluents gazeux à pression sensiblement atmosphérique, comportant - l'injection de l'effluent à traiter dans une torche à plasma, - l'injection de vapeur d'eau, en amont et/ou en aval du plasma.
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2008520927A JP5335423B2 (ja) | 2005-07-12 | 2006-07-10 | ガス流出物のプラズマ処理のための方法 |
EP06794474A EP1904664A2 (fr) | 2005-07-12 | 2006-07-10 | Procede de traitement par plasma d'effluents gazeux |
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR0552149 | 2005-07-12 | ||
FR0552149A FR2888519B1 (fr) | 2005-07-12 | 2005-07-12 | Procede de traitement, par plasma, d'effluents gazeux |
FR0650761 | 2006-03-03 | ||
FR0650761A FR2898066B1 (fr) | 2006-03-03 | 2006-03-03 | Procede de destruction d'effluents |
Publications (2)
Publication Number | Publication Date |
---|---|
WO2007007003A2 WO2007007003A2 (fr) | 2007-01-18 |
WO2007007003A3 true WO2007007003A3 (fr) | 2007-05-03 |
Family
ID=37637541
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/FR2006/050699 WO2007007003A2 (fr) | 2005-07-12 | 2006-07-10 | Procede de traitement par plasma d'effluents gazeux |
Country Status (4)
Country | Link |
---|---|
EP (1) | EP1904664A2 (fr) |
JP (1) | JP5335423B2 (fr) |
KR (1) | KR20080032089A (fr) |
WO (1) | WO2007007003A2 (fr) |
Families Citing this family (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2898066B1 (fr) * | 2006-03-03 | 2008-08-15 | L'air Liquide | Procede de destruction d'effluents |
FR2927547B1 (fr) * | 2008-02-14 | 2010-12-24 | Air Liquide | Procede de destruction de n20 par plasma micro-ondes a pression atmospherique. |
DE102008009624A1 (de) * | 2008-02-18 | 2009-08-20 | Cs Clean Systems Ag | Verfahren und Vorrichtung zur Reinigung der Abgase einer Prozessanlage |
KR101026457B1 (ko) * | 2008-09-02 | 2011-03-31 | (주)트리플코어스코리아 | 저압 및 대기압 플라즈마를 이용한 폐가스 제거 시스템 |
KR101248625B1 (ko) * | 2008-09-25 | 2013-04-02 | 세키스이가가쿠 고교가부시키가이샤 | 실리콘 함유막의 에칭 방법 및 장치 |
KR100987978B1 (ko) * | 2008-10-27 | 2010-10-18 | (주)트리플코어스코리아 | 가스 스크러빙 장치 및 가스 스크러빙 방법 |
KR101875421B1 (ko) * | 2014-03-06 | 2018-07-06 | 어플라이드 머티어리얼스, 인코포레이티드 | 중원자들을 함유하는 화합물들의 플라즈마 저감 |
CN114797403A (zh) * | 2017-02-09 | 2022-07-29 | 应用材料公司 | 利用水蒸气和氧试剂的等离子体减量技术 |
KR102122303B1 (ko) * | 2019-10-02 | 2020-06-12 | (주)쏠츠 | 과불화탄소가스의 고효율 처리를 위한 고에너지 열플라즈마와 고온챔버를 이용한 배기가스 처리장치 |
CN110935286B (zh) * | 2020-01-16 | 2022-03-01 | 浙江工业大学 | 一种利用离子液体复合生物基溶剂吸收残留熏蒸剂硫酰氟的方法 |
CN117420083B (zh) * | 2023-12-19 | 2024-04-09 | 哈尔滨工业大学 | 一种等离子体侵蚀痕量产物在线监测装置及方法 |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH11156156A (ja) * | 1997-11-27 | 1999-06-15 | Seiko Epson Corp | ハロゲン系ガスの処理方法、処理装置および反応処理装置並びに半導体装置 |
US20020033377A1 (en) * | 2000-03-13 | 2002-03-21 | Isamu Namose | Method of processing PFC and apparatus for processing PFC |
FR2864795A1 (fr) * | 2004-01-06 | 2005-07-08 | Air Liquide | Procede de traitement des gaz par des decharges hautes frequence |
WO2005079958A1 (fr) * | 2004-02-20 | 2005-09-01 | The Boc Group Plc | Procede et appareil de traitement d'un flux gazeux contenant un compose fluore |
Family Cites Families (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2002191963A (ja) * | 2000-12-26 | 2002-07-10 | Mitsubishi Heavy Ind Ltd | 有機ハロゲン化合物の分解処理方法および分解装置 |
FR2898066B1 (fr) * | 2006-03-03 | 2008-08-15 | L'air Liquide | Procede de destruction d'effluents |
-
2006
- 2006-07-10 EP EP06794474A patent/EP1904664A2/fr not_active Withdrawn
- 2006-07-10 JP JP2008520927A patent/JP5335423B2/ja not_active Expired - Fee Related
- 2006-07-10 KR KR1020087000816A patent/KR20080032089A/ko not_active Application Discontinuation
- 2006-07-10 WO PCT/FR2006/050699 patent/WO2007007003A2/fr not_active Application Discontinuation
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH11156156A (ja) * | 1997-11-27 | 1999-06-15 | Seiko Epson Corp | ハロゲン系ガスの処理方法、処理装置および反応処理装置並びに半導体装置 |
US20020033377A1 (en) * | 2000-03-13 | 2002-03-21 | Isamu Namose | Method of processing PFC and apparatus for processing PFC |
FR2864795A1 (fr) * | 2004-01-06 | 2005-07-08 | Air Liquide | Procede de traitement des gaz par des decharges hautes frequence |
WO2005079958A1 (fr) * | 2004-02-20 | 2005-09-01 | The Boc Group Plc | Procede et appareil de traitement d'un flux gazeux contenant un compose fluore |
Non-Patent Citations (2)
Title |
---|
PATENT ABSTRACTS OF JAPAN vol. 1999, no. 11 30 September 1999 (1999-09-30) * |
VARTANIAN V ET AL: "REDUCTION OF SEMICONDUCTOR PROCESS EMISSIONS BY REACTIVE GAS OPTIMIZATION", IEEE TRANSACTIONS ON SEMICONDUCTOR MANUFACTURING, IEEE SERVICE CENTER, PISCATAWAY, NJ, US, vol. 17, no. 4, November 2004 (2004-11-01), pages 483 - 490, XP001209966, ISSN: 0894-6507 * |
Also Published As
Publication number | Publication date |
---|---|
JP2009501073A (ja) | 2009-01-15 |
KR20080032089A (ko) | 2008-04-14 |
EP1904664A2 (fr) | 2008-04-02 |
WO2007007003A2 (fr) | 2007-01-18 |
JP5335423B2 (ja) | 2013-11-06 |
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