WO2006136192A1 - Verfahren zur bestimmung der fokuslage eines laserstrahls - Google Patents

Verfahren zur bestimmung der fokuslage eines laserstrahls Download PDF

Info

Publication number
WO2006136192A1
WO2006136192A1 PCT/EP2005/006805 EP2005006805W WO2006136192A1 WO 2006136192 A1 WO2006136192 A1 WO 2006136192A1 EP 2005006805 W EP2005006805 W EP 2005006805W WO 2006136192 A1 WO2006136192 A1 WO 2006136192A1
Authority
WO
WIPO (PCT)
Prior art keywords
workpiece
laser beam
focus position
contact
edge region
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/EP2005/006805
Other languages
German (de)
English (en)
French (fr)
Inventor
Wolfgang Scholich-Tessmann
Andreas Milich
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Trumpf Werkzeugmaschinen SE and Co KG
Original Assignee
Trumpf Werkzeugmaschinen SE and Co KG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Trumpf Werkzeugmaschinen SE and Co KG filed Critical Trumpf Werkzeugmaschinen SE and Co KG
Priority to AT05762339T priority Critical patent/ATE376473T1/de
Priority to PCT/EP2005/006805 priority patent/WO2006136192A1/de
Priority to DE502005001790T priority patent/DE502005001790D1/de
Priority to CN200580050205XA priority patent/CN101208171B/zh
Priority to JP2008517330A priority patent/JP5393150B2/ja
Priority to EP05762339A priority patent/EP1750891B1/de
Publication of WO2006136192A1 publication Critical patent/WO2006136192A1/de
Priority to US11/963,570 priority patent/US8304691B2/en
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/04—Automatically aligning, aiming or focusing the laser beam, e.g. using the back-scattered light

Definitions

  • the invention relates to a method for determining the suitable for a workpiece machining process focus position of a laser beam of a laser system, in particular a laser cutting system, in which at least two different focal positions are set.
  • DE 198 54 694 A1 describes the adjustment of the focus position of a laser beam directed onto a workpiece which emerges from a machining head with a focusing device for the laser beam.
  • Object of the present invention is to provide a method by which the focus position can be determined, the method should be automated.
  • This object is achieved according to the invention in a surprising, a ⁇ of ways that kind initially mentioned is end with a method of a ⁇ determined for different focal positions of the laser ⁇ beam whether and under what circumstances at least the peripheral region of the laser beam into contact with a workpiece comes. It is thus recognized when - depending on an adjustable focal position - the laser beam comes with its edge region in contact with material. In different Fo ⁇ kuslagen this is done at different distances of the beam axis of the laser beam from an edge of the workpiece or in dependence on the size of an already generated through hole of the workpiece.
  • the procedural invention ⁇ ren can be automated so that the focal position can be automatically ⁇ he averages. A manual measurement of a reference workpiece can therefore be omitted.
  • At least one variable describing the circumstances under which at least the edge region of the laser beam comes into contact with the workpiece is detected.
  • the circumstances describing variables for example, the distance of the beam axis to the workpiece, in particular an edge of the Workpiece or the intensity of detected radiation, such as process light, in question.
  • the edge region of the laser beam comes into contact with the workpiece, by detecting radiation emitted by the workpiece or a plasma.
  • light can be detected with a maximum sensitivity at a wavelength of one micromete. This allows the measurement to be particularly accurate. It is conceivable, but not so accurate, to detect the plasma glow when a plasma is being generated during laser processing. The accuracy suffers from the fact that the plasma lamps occur relatively late, if already a relatively large amount of material of the workpiece has been melted and consumed. Furthermore, it is conceivable to detect non-reflected process light. In all procedures, special emphasis must be placed on detecting as early as possible when the edge area of the laser beam comes into contact with the workpiece.
  • the suitable focus position or a further focal position for which in turn it is determined whether and under what circumstances the edge region of the laser beam comes into contact with the workpiece, is determined. If it results from the determined circumstances that the edge region of the laser beam does not come into contact with the workpiece, this may indicate that the suitable focus position has been found, since For example, the minimum distance of the beam axis was found to the workpiece or the laser beam at the height of the workpiece is narrower than a previously created in the workpiece passage opening. Alternatively, if the appropriate focus position has not been found, it can be determined from the previously determined circumstances for other focus positions in which direction the focus position must be adjusted for the next attempt in order to approximate the appropriate focus position.
  • a work piece with the laser beam is touched by approximating the workpiece and the laser star until the edge region of the laser beam triggers a machining process, in particular a cutting process, on the workpiece.
  • a workpiece can be touched with the laser beam from one or more sides.
  • the beam diameter can be determined at a certain läge. This process can be repeated until the lowest beam diameter is found.
  • the associated focus position is then the appropriate focus position of the laser beam for workpiece machining. It is particularly advantageous if the Laserstrah.1 is turned off when it is detected that the Laserstrah.1 comes into contact with the workpiece. By this measure, the workpiece is damaged as little as possible. In addition, this can increase the accuracy of the focus position determination.
  • a passage opening in the workpiece is first generated at a first focal position and is then repeated with at least one further focus position generating the fürgangs ⁇ kann.
  • a hole or a slot in the workpiece can be produced as a passage opening.
  • the creation of a slot has the advantage that the laser system is in operation for a certain time and thereby warms up.
  • the focal length can be determined when the laser system is heated, which corresponds to the conditions during workpiece machining.
  • a hole or a slot with an arbitrary focus position is first produced in a thin sheet (reference) and then the process is repeated at the same position with a changed focus position.
  • the beam diameter is larger compared to the first hole or slit. If no process light is generated, the beam diameter is smaller compared to the first hole or slit.
  • the process light can be measured, for example, with an optoelectronic unit the process light with a sensor, a camera, a hole mirror or the like measured become.
  • a further process step of the process of generating may a passage opening with the first turned ⁇ set focus position are repeated (reference) and in which at ⁇ closing puncture or cutting a focus position with opposite ⁇ set focus difference to the reference groove or slot as in the first experiment to get voted.
  • Can gebnissen from the two advocatesser ⁇ the direction are determined for the focus search.
  • ⁇ represents that the focal position is tuned continuously or quasi-continuously.
  • the beam axis has a fixed distance from a workpiece edge .
  • the focal position tuned ie interim ⁇ rule two extreme values changed continuously or quasi-kontinuier ⁇ Lich, and the beam axis close enough to the tool arranged at the edge of the workpiece, process light will be created for some focal positions, while no process gap will arise for other focal positions. If process light arises, this means that the laser beam has a relatively large diameter at the height of the workpiece.
  • This focal position is therefore not suitable for a laser processing process. We are looking for those focal positions where no process light is created. The size which describes the circumstances under which an edge region of the laser beam comes into contact with the workpiece, therefore serves the focus position.
  • the above method variant is relatively inaccurate when the laser beam is not moved along the workpiece. Therefore, it is advantageous to increase the accuracy when the laser beam and the workpiece are moved relative to each other during the tuning of the focus position. It is noted at which relative positions of laser beam and workpiece, the laser beam and the workpiece come into contact, in particular process light is produced. In particular, the laser beam can be moved along one side of the workpiece. With a continuous tuning of the focus position, the focal position, which is suitable for a laser processing process, can be found particularly quickly. When the laser beam is moved along the workpiece, the focus position can be determined with the laser system warmed up.
  • the appropriate focus position to f-indene is to provide in a workpiece a section, the focus position is istcjestimmt while the average production, and then ⁇ der noir to as the process at the same point, wherein during the second section Focus position is tuned with an opener.
  • Fig. 1 is a schematic representation of a part of a laser system
  • Fig. 2a shows a cross section through a workpiece and a
  • Fig. 3 is a schematic diagram for explaining the probing of a workpiece
  • Fig. 4 is a schematic diagram for explaining the tuning of the laser beam
  • FIG. 5 shows an alternative embodiment for explaining the probing of a workpiece
  • 6a are illustrations for explaining the finding of a focal position suitable for laser cutting up to 6c.
  • a laser beam 2 is directed by a mirror 3 designed as a focusing scraper mirror onto a deflection mirror 4 which is mounted in a machining head 5. is orders.
  • the laser beam 2 is focused by a lens as ⁇ formed focusing means 6 and directed onto a workpiece. 7
  • radiation is generated / which is indicated by the line 8. This is reflected back over the mirrors 4, 3 and directed by the mirror 3 to a measuring device 8.
  • the measuring device 8 utnutzt a photodiode with appropriate electronics.
  • the information of the measuring device 8 is forwarded to an evaluation and control device 9.
  • the off ⁇ value- and control device 9 determines the circumstances in which the laser beam 2, in particular an edge region of the laser beam 2 is brought into contact with the workpiece. 7
  • the associated focus position ie the position of the focusing device 6 and / or the height adjustment, ie the distance . of the machining head 5 to the workpiece 7, detected.
  • FIG. 2 shows the desired focus position for a laser processing process. This means that the narrowest point of the waisted laser beam 2 shown exactly at the height of the workpiece 7, in particular in its center. This means that a laser beam generates the smallest ⁇ hole or the narrowest kerf, if its focus is exactly in the middle of a workpiece 7, in particular a thin sheet. It is shown in FIG. 2b that, in the case of a first seal or a reference engraving with the laser beam 2, the opening 10 has been produced. Subsequently, the focus position is adjusted and is tried at the same place, a through opening.
  • FIG. 3 shows an alternative with which the focus position can be determined.
  • a workpiece 7 is shown, which is probed with a laser beam 2 from different directions, which are indicated by the arrows 12, 13, 14.
  • the laser beam diameter can be determined at a set focus position. From this, the information can be obtained whether the diameter of the laser beam 2 is small enough to produce the smallest possible cutting widths.
  • the focus position can be changed until the smallest beam diameter is found.
  • the sides or edges 15 to 18 of the workpiece 7 are produced for example by punching in order to achieve a precisely defined edge.
  • the laser beam 2 is moved in the direction of the arrow 20 along the workpiece 7.
  • the focus position of the laser beam 2 is tuned, ie changed.
  • a focus position can be found in which the edge region of the laser beam 2 is no longer in contact with the side 17 of the workpiece 7.
  • the laser beam 2 can be arranged during the movement in the direction of the arrow 20 so that its beam axis 21 is arranged approximately at a distance of one half of the beam diameter of the focused laser beam 2 from the side 17.
  • the focus position at which no process light or no radiation is generated is the desired focus position.
  • FIG. 5 shows an alternative possibility of how the focal position can be found by touching a workpiece 25.
  • the laser beam 2 is moved in the direction of arrows 27, 28, 29, 30 to the sides 31, 32, 33, 34 of the window 26.
  • the propagation of the laser beam 2 can be determined at a given läge in four quadrants.
  • the core beam thickness of the laser beam 2 can be determined.
  • the thickness of the workpiece 25 is determined by the requirements of the process accuracy. It is desirable to use as thin as possible workpieces, as this the focus position can be determined more accurately.
  • FIG. 6a illustrates that it is difficult to find exactly the point with the highest power density of the laser beam 2 due to the thickness of the workpiece 7 and the shape of the laser beam 2.
  • the laser beam 2 or the edge region of the laser beam 2 is in contact with the upper side 40 of the workpiece 7.
  • the edge region of the laser beam 2 is in contact with the underside 41 of the workpiece 7.
  • the focal position at which the laser beam 2 straight ocäer with the top Un ⁇ underside 40, 41 is in contact can be relatively accurately determined with the inventive method. However, we are looking for a focus position that lies between these two focal positions. This is illustrated in FIG. 6c.
  • FIG. 6 a is shown by the dashed line 43 and the focal position according to the representation of FIG. 6 b is represented by the dashed line 44. Exactly in the middle between these focal positions is the desired focus position, which is illustrated by the dashed line 45. ' This focus can be determined by averaging.

Landscapes

  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Laser Beam Processing (AREA)
PCT/EP2005/006805 2005-06-23 2005-06-23 Verfahren zur bestimmung der fokuslage eines laserstrahls Ceased WO2006136192A1 (de)

Priority Applications (7)

Application Number Priority Date Filing Date Title
AT05762339T ATE376473T1 (de) 2005-06-23 2005-06-23 Verfahren zur bestimmung der fokuslage eines laserstrahls
PCT/EP2005/006805 WO2006136192A1 (de) 2005-06-23 2005-06-23 Verfahren zur bestimmung der fokuslage eines laserstrahls
DE502005001790T DE502005001790D1 (de) 2005-06-23 2005-06-23 Verfahren zur bestimmung der fokuslage eines laserstrahls
CN200580050205XA CN101208171B (zh) 2005-06-23 2005-06-23 确定激光束的焦点位置的方法
JP2008517330A JP5393150B2 (ja) 2005-06-23 2005-06-23 レーザビームのフォーカス位置の決定方法
EP05762339A EP1750891B1 (de) 2005-06-23 2005-06-23 Verfahren zur bestimmung der fokuslage eines laserstrahls
US11/963,570 US8304691B2 (en) 2005-06-23 2007-12-21 Determining a focal position of a laser

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/EP2005/006805 WO2006136192A1 (de) 2005-06-23 2005-06-23 Verfahren zur bestimmung der fokuslage eines laserstrahls

Related Child Applications (1)

Application Number Title Priority Date Filing Date
US11/963,570 Continuation-In-Part US8304691B2 (en) 2005-06-23 2007-12-21 Determining a focal position of a laser

Publications (1)

Publication Number Publication Date
WO2006136192A1 true WO2006136192A1 (de) 2006-12-28

Family

ID=35717534

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/EP2005/006805 Ceased WO2006136192A1 (de) 2005-06-23 2005-06-23 Verfahren zur bestimmung der fokuslage eines laserstrahls

Country Status (7)

Country Link
US (1) US8304691B2 (enExample)
EP (1) EP1750891B1 (enExample)
JP (1) JP5393150B2 (enExample)
CN (1) CN101208171B (enExample)
AT (1) ATE376473T1 (enExample)
DE (1) DE502005001790D1 (enExample)
WO (1) WO2006136192A1 (enExample)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102007047298B3 (de) * 2007-10-02 2009-04-09 Trumpf Werkzeugmaschinen Gmbh + Co. Kg Verfahren zur Fokuslagenbestimmung und Laserbearbeitungsdüse
US8410395B2 (en) 2007-10-02 2013-04-02 Trumpf Werkzeugmaschinen Gmbh + Co. Kg Method for determining focal position

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8938317B2 (en) * 2012-01-10 2015-01-20 Mitsubishi Electronic Research Laboratories, Inc. System and method for calibrating laser cutting machines
DE102012100721B3 (de) * 2012-01-30 2013-04-11 Trumpf Werkzeugmaschinen Gmbh + Co. Kg Verfahren zum Regeln eines Laserschneidprozesses und Laserschneidmaschine
DE102013217126B4 (de) * 2013-08-28 2015-09-03 Trumpf Laser- Und Systemtechnik Gmbh Verfahren zum Feststellen von Abweichungen einer Ist-Lage eines Laserbearbeitungskopfes von einer Soll-Lage, Laserbearbeitungsmaschine und Computerprogrammprodukt
DE102015224963B3 (de) * 2015-12-11 2017-04-13 Trumpf Werkzeugmaschinen Gmbh + Co. Kg Verfahren zur Bestimmung der Referenz-Fokuslage eines Laserstrahls
DE102016111455B4 (de) 2016-06-22 2019-07-25 Trumpf Laser- Und Systemtechnik Gmbh Verfahren zur Bestimmung einer Referenz-Fokuslage sowie Werkzeugmaschine
DE102016219928A1 (de) * 2016-10-13 2018-04-19 Trumpf Werkzeugmaschinen Gmbh + Co. Kg Verfahren und Vorrichtung zur Bestimmung und zur Regelung einer Fokusposition eines Bearbeitungsstrahls
DE102018105364B4 (de) * 2018-03-08 2020-06-25 Precitec Gmbh & Co. Kg Vorrichtung zur Bestimmung einer Fokuslage eines Laserstrahls in einem Laserbearbeitungssystem, Laserbearbeitungssystem mit derselben und Verfahren zur Bestimmung einer Fokuslage eines Laserstrahls in einem Laserbearbeitungssystem
CN110711937B (zh) * 2019-11-14 2022-01-04 安徽同兴科技发展有限责任公司 一种切割机激光对焦的参数确定方法
CN112935530B (zh) * 2021-04-25 2022-12-13 山东大学深圳研究院 一种确定脉冲激光焦点位置的方法及装置
CN117644306B (zh) * 2024-01-30 2024-05-03 武汉新耐视智能科技有限责任公司 一种用于机器人激光远程焊接设备的焦点检测装置及方法

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5373135A (en) * 1988-12-30 1994-12-13 Fraunhofer-Gesellschaft Zur Foerderung Der Angewandten Forschung E.V. Process and an arrangement for treating workpiece by means of laser radiation
US5486677A (en) * 1991-02-26 1996-01-23 Fraunhofer-Gesellschaft Zur Forderung Der Angewandten Forschung E.V. Method of and apparatus for machining workpieces with a laser beam
WO1998050196A1 (en) * 1997-05-07 1998-11-12 Institutet För Verkstadsteknisk Forskning Device for detecting and calculating the focus point position, shape and power distribution of a laser beam
DE10160623A1 (de) * 2001-12-11 2003-06-12 Precitec Kg Verfahren und Vorrichtung zum Überwachen eines Laserbearbeitungsvorgangs, insbesondere eines Laserschweißvorgangs
US6791057B1 (en) * 1998-11-12 2004-09-14 Fraunhofer-Gesellschaft Zur Forderung Der Angewandten Forschung E.V. Method and device for machining workpieces using high-energy radiation

Family Cites Families (34)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3134555A1 (de) 1980-09-02 1982-07-08 Amada Co. Ltd., Isehara, Kanagawa "verfahren und einrichtung zur bestimmung der fokussierposition bei lasereinrichtungen, insbesondere laser-bearbeitungsmaschinen u.dgl."
JPS5978792A (ja) * 1982-10-29 1984-05-07 Mitsubishi Electric Corp レ−ザ−加工機用焦点追従装置
JPS60227995A (ja) * 1984-04-27 1985-11-13 Mitsubishi Electric Corp レ−ザ加工装置
JPS63180392A (ja) * 1987-01-22 1988-07-25 Toyota Motor Corp 加工レンズの焦点距離調整装置
JP2677856B2 (ja) * 1989-02-23 1997-11-17 株式会社アマダ レーザ加工方法
DE8914687U1 (de) 1989-12-14 1990-03-22 Arnold, Peter, Dr., 8000 München Vorrichtung zur Messung des Fokusortes von fokussierten Laserstrahlen aus Leistungslasern
DE4025577C2 (de) * 1990-08-11 1999-09-09 Fraunhofer Ges Forschung Vorrichtung zum berührungslosen Messen des Abstands von einem Objekt
EP0554523B1 (en) 1992-02-03 1997-04-16 Matsushita Electric Industrial Co., Ltd. Laser beam machining apparatus and method for adjusting the height of its condenser lens
JPH06254691A (ja) 1993-03-08 1994-09-13 Mitsubishi Electric Corp レーザ加工機およびレーザ加工機の焦点設定方法
JPH0716779A (ja) * 1993-06-30 1995-01-20 Matsushita Electric Ind Co Ltd レーザ加工機用焦点調整装置
JP3259462B2 (ja) * 1993-08-30 2002-02-25 松下電器産業株式会社 レーザ加工機の焦点位置検出方法およびその装置
JPH07112288A (ja) * 1993-10-14 1995-05-02 Nikon Corp レーザ加工装置
JPH07232290A (ja) * 1994-02-23 1995-09-05 Matsushita Electric Ind Co Ltd レーザ加工機用焦点調整装置
JP3209641B2 (ja) 1994-06-02 2001-09-17 三菱電機株式会社 光加工装置及び方法
FR2726496B1 (fr) * 1994-11-09 1997-01-17 Aerospatiale Procede de localisation spatiale du point focal d'un faisceau laser d'une machine d'usinage et outillage pour la mise en oeuvre de ce procede
DE19857694C2 (de) 1998-12-14 2001-07-19 Precitec Gmbh Verfahren und Vorrichtung zum Einstellen der Fokuslage eines auf ein Werkstück gerichteten Laserstrahls
JP3222430B2 (ja) * 1999-01-20 2001-10-29 ファナック株式会社 レーザ加工装置及び調整方法
US6355908B1 (en) * 1999-03-31 2002-03-12 Matsushita Electric Industrial Co., Ltd. Method and apparatus for focusing a laser
AU4280700A (en) * 1999-04-27 2000-11-10 Gsi Lumonics Inc. Laser calibration apparatus and method
US6303903B1 (en) 1999-08-11 2001-10-16 Matsushita Electric Industrial Co., Ltd Method and apparatus for determining focus position of a laser
JP2001150171A (ja) * 1999-11-26 2001-06-05 Nippon Sharyo Seizo Kaisha Ltd レーザ加工機のフォーカス調整方法およびその装置
JP2001340979A (ja) * 2000-03-30 2001-12-11 Toyota Auto Body Co Ltd レーザ加工装置
JP2002239768A (ja) * 2001-02-15 2002-08-28 Komatsu Ltd レーザ加工装置
JP4519352B2 (ja) 2001-04-12 2010-08-04 財団法人神奈川科学技術アカデミー 微細加工装置
DE10131610C1 (de) 2001-06-29 2003-02-20 Siemens Dematic Ag Verfahren zur Kalibrierung des optischen Systems einer Lasermaschine zur Bearbeitung von elektrischen Schaltungssubstraten
US6646728B1 (en) * 2001-07-09 2003-11-11 3D Systems, Inc. Calibrating a focused beam of energy in a solid freeform fabrication apparatus by measuring the propagation characteristics of the beam
US6621060B1 (en) * 2002-03-29 2003-09-16 Photonics Research Ontario Autofocus feedback positioning system for laser processing
US20030227614A1 (en) * 2002-06-05 2003-12-11 Taminiau August A. Laser machining apparatus with automatic focusing
DE10229498A1 (de) 2002-07-01 2004-01-22 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Verfahren und Vorrichtung zur Durchführung der Plasmaemissionsspektrometrie
DE10244548B4 (de) * 2002-09-25 2010-12-02 Robert Bosch Gmbh Verfahren zur Bestimmung der Fokuslage bei der Lasermaterialbearbeitung
US6992765B2 (en) * 2002-10-11 2006-01-31 Intralase Corp. Method and system for determining the alignment of a surface of a material in relation to a laser beam
DE10248458B4 (de) * 2002-10-17 2006-10-19 Precitec Kg Verfahren und Vorrichtung zum Einstellen der Fokuslage eines auf ein Werkstück gerichteten Laserstrahls
DE10255628A1 (de) 2002-11-28 2004-07-08 Siemens Ag Verfahren zur Bestimmung der Fokuslage eines Laserstrahls
DE10329744A1 (de) 2003-07-02 2004-09-30 Robert Bosch Gmbh Verfahren zur Bestimmung der Fokuslage eines Laserstrahls bezüglich einer Festkörperoberfläche

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5373135A (en) * 1988-12-30 1994-12-13 Fraunhofer-Gesellschaft Zur Foerderung Der Angewandten Forschung E.V. Process and an arrangement for treating workpiece by means of laser radiation
US5486677A (en) * 1991-02-26 1996-01-23 Fraunhofer-Gesellschaft Zur Forderung Der Angewandten Forschung E.V. Method of and apparatus for machining workpieces with a laser beam
WO1998050196A1 (en) * 1997-05-07 1998-11-12 Institutet För Verkstadsteknisk Forskning Device for detecting and calculating the focus point position, shape and power distribution of a laser beam
US6791057B1 (en) * 1998-11-12 2004-09-14 Fraunhofer-Gesellschaft Zur Forderung Der Angewandten Forschung E.V. Method and device for machining workpieces using high-energy radiation
DE10160623A1 (de) * 2001-12-11 2003-06-12 Precitec Kg Verfahren und Vorrichtung zum Überwachen eines Laserbearbeitungsvorgangs, insbesondere eines Laserschweißvorgangs

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102007047298B3 (de) * 2007-10-02 2009-04-09 Trumpf Werkzeugmaschinen Gmbh + Co. Kg Verfahren zur Fokuslagenbestimmung und Laserbearbeitungsdüse
US8410395B2 (en) 2007-10-02 2013-04-02 Trumpf Werkzeugmaschinen Gmbh + Co. Kg Method for determining focal position

Also Published As

Publication number Publication date
CN101208171B (zh) 2011-01-12
CN101208171A (zh) 2008-06-25
US20080180657A1 (en) 2008-07-31
JP5393150B2 (ja) 2014-01-22
ATE376473T1 (de) 2007-11-15
EP1750891A1 (de) 2007-02-14
US8304691B2 (en) 2012-11-06
DE502005001790D1 (de) 2007-12-06
EP1750891B1 (de) 2007-10-24
JP2008543572A (ja) 2008-12-04

Similar Documents

Publication Publication Date Title
EP3525975B1 (de) Verfahren und vorrichtung zur bestimmung und zur regelung einer fokusposition eines bearbeitungsstrahls
EP3528992B1 (de) Verfahren und maschine zum schneidenden bearbeiten eines werkstücks
DE102007063627B4 (de) Verfahren zur Bestimmung der Lage eines Laserstrahls relativ zu einer Öffnung, sowie Laserbearbeitungsmaschine
EP2675588B1 (de) Verfahren zur kontrolle einer schneidenden bearbeitung an einem werkstück
EP3475025B1 (de) Verfahren und vorrichtung zur bestimmung einer referenz-fokuslage eines strahles einer strahlbasierten werkzeugmaschine durch durchführen einer sequenz von testschnitten an einem werkstück
EP3038786B1 (de) Verfahren zum feststellen von abweichungen einer ist-lage eines laserbearbeitungskopfes von seiner soll-lage sowie laserbearbeitungsmaschine zur durchführung des verfahrens
EP2691206B1 (de) Verfahren zur laserstrahlbearbeitung eines werkstücks
DE102012100721B3 (de) Verfahren zum Regeln eines Laserschneidprozesses und Laserschneidmaschine
DE102016014564B4 (de) Messvorrichtung zum Überwachen eines Bearbeitungsprozesses unter Verwendung von an unterschiedlichen Messpositionen erfassten Messinformationen
EP3386675B1 (de) Verfahren zur bestimmung der referenz-fokuslage eines laserstrahls
EP3965990B1 (de) Verfahren und strahlbearbeitungsvorrichtung zur strahlbearbeitung eines werkstücks
EP1750891B1 (de) Verfahren zur bestimmung der fokuslage eines laserstrahls
WO2014009150A1 (de) Anordnung zum erzeugen von bohrungen oder schweissnähten mittels eines laserstrahls und einer laserstrahlablenkvorrichtung mit zwei x-y- scannern
DE102021103206A1 (de) Verfahren zum Optimieren einer Bearbeitungszeit eines Laserbearbeitungsprozesses, Verfahren zum Durchführen eines Laserbearbeitungsprozesses an einem Werkstück und Laserbearbeitungssystem, welches eingerichtet ist, um diese durchzuführen
DE102018122264B4 (de) Laserschweissvorrichtung und verfahren zur bauteilherstellung
DE4006622C2 (de) Vorrichtung zum Überwachen von mit Laserstrahlung bearbeiteten Werkstücken
DE102007047298B3 (de) Verfahren zur Fokuslagenbestimmung und Laserbearbeitungsdüse
DE102007008653A1 (de) Umformverfahren und Vorrichtung zur Durchführung eines Umformverfahrens
AT522419B1 (de) Messvorrichtung zur Bestimmung des Biegewinkels
EP4221928B1 (de) Verfahren zum verschweissen von blechteilen
DE102010039633B4 (de) Vorrichtung und Verfahren zur Bestimmung der Fokuslage eines zur Laser-Materialbearbeitung verwendeten Laserstrahls entlang der Laserstrahlachse
DE102005038587A1 (de) Messsystem und Verfahren zum Vermessen eines Laserstrahls
WO2017153100A1 (de) Verfahren zum bestimmen der lage des fokus einer laserstrahlanordnung und verfahren zum bearbeiten eines werkstücks mit laserstrahlung
DE102022002959A1 (de) Schweißvorrichtung und Verfahren zum Verschweißen zweier Werkstücke
DE102022115643A1 (de) Verfahren zum Einstechen eines Laserstrahls einer Laserschneidmaschine in ein plattenförmiges Werkstück zum Ausschneiden eines Werkstückteils aus dem Werkstück entlang einer auf dem Werkstück vorgegebenen Schneidkontur

Legal Events

Date Code Title Description
WWE Wipo information: entry into national phase

Ref document number: 2005762339

Country of ref document: EP

WWP Wipo information: published in national office

Ref document number: 2005762339

Country of ref document: EP

WWG Wipo information: grant in national office

Ref document number: 2005762339

Country of ref document: EP

WWE Wipo information: entry into national phase

Ref document number: 200580050205.X

Country of ref document: CN

NENP Non-entry into the national phase

Ref country code: DE

WWE Wipo information: entry into national phase

Ref document number: 2008517330

Country of ref document: JP

WWW Wipo information: withdrawn in national office

Country of ref document: DE