WO2006134715A1 - Conductive rubber integrated with metal foil - Google Patents

Conductive rubber integrated with metal foil Download PDF

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Publication number
WO2006134715A1
WO2006134715A1 PCT/JP2006/307601 JP2006307601W WO2006134715A1 WO 2006134715 A1 WO2006134715 A1 WO 2006134715A1 JP 2006307601 W JP2006307601 W JP 2006307601W WO 2006134715 A1 WO2006134715 A1 WO 2006134715A1
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WO
WIPO (PCT)
Prior art keywords
metal foil
conductive rubber
sheet
integrated
cutting
Prior art date
Application number
PCT/JP2006/307601
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French (fr)
Japanese (ja)
Inventor
Shingo Mizuguchi
Original Assignee
Fuji Polymer Industries Co., Ltd.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fuji Polymer Industries Co., Ltd. filed Critical Fuji Polymer Industries Co., Ltd.
Priority to JP2006554357A priority Critical patent/JP4530290B2/en
Publication of WO2006134715A1 publication Critical patent/WO2006134715A1/en

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Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00Screening of apparatus or components against electric or magnetic fields
    • H05K9/0073Shielding materials
    • H05K9/0081Electromagnetic shielding materials, e.g. EMI, RFI shielding
    • H05K9/0084Electromagnetic shielding materials, e.g. EMI, RFI shielding comprising a single continuous metallic layer on an electrically insulating supporting structure, e.g. metal foil, film, plating coating, electro-deposition, vapour-deposition

Definitions

  • the present invention relates to a metal foil-integrated conductive rubber obtained by integrally molding a metal foil on one surface of a conductive rubber. Applicable to conductive contact parts inside mobile phone, especially used for electrical connection between printed circuit board and shield case, and internal connection between mobile phone frame inner surface and substrate with conductive film.
  • the present invention relates to a metal foil integrated conductive rubber.
  • Electromagnetic interference such as malfunction of electronic devices due to electromagnetic noise radiated from mobile phones and influence on human bodies has become a problem.
  • methods such as electrical connection through panel-like contacts are adopted.
  • Italy 1 there is Italy 1 that uses a conductive adhesive filled with a conductive filler to join the shield case and the substrate.
  • a technique related to the present invention is a metal foil laminated sheet in which a metal foil is bonded to one side of a conductive rubber sheet, and an electric contact in an electronic device or a silicone rubber for a remote control of an electronic product. Used for conductive rubber contacts of switches.
  • these metal foil-body-type conductive rubbers are formed by bonding or integrally molding conductive rubber onto the surface of a metal foil sheet in small pieces, and then stamping or shearing to a predetermined size using metal processing technology. It is common to cut and process small parts. For example, as a method of making an electrical connection inside a mobile phone, many electrical contacts are made by screw panels.
  • FIG. 7 is a perspective view in which a shield-like contact 23 is pushed in the direction of an arrow 24 with a panel-like contact 22 interposed in a printed circuit board 21 of a conventional example to make electrical connection.
  • a printed circuit board 21 On the printed circuit board 21, there are several electronic components that generate vibrations such as vibrator motors, speakers, and receivers.
  • vibration adversely affects electronic circuits such as Locked Loop) and VCO (Voltage Control Oscillator) and electronic parts such as electret condenser microphones.
  • FIG. 8A is a cross-sectional view of a conventional metal foil-integrated conductive rubber
  • FIG. 8B is an enlarged view of a Y portion surrounded by a circle in FIG. 8A.
  • the metal foil surface can be placed at an accurate position on the printed circuit board by fine burr or jagged edges at the periphery of the metal foil. Difficult, parts are lifted and tilted during the reflow soldering process. In addition, there is a problem that sufficient solder joint strength for attaching the component to the substrate cannot be obtained.
  • a conductive layer is provided on the inside of the resin body of the mobile phone as a shield measure.
  • soldering and the use of an adhesive are problematic in terms of repairability in the event of equipment failure. In mobile phones and other devices that have a relatively high force or twisting force, cracks occur due to the stress applied to the solder joint between the shield case and the board firmly fixed by soldering.
  • Patent Document 1 Japanese Translation of Special Publication 2002-510873
  • Patent Document 2 U.S. Pat.No. 5,524,908
  • Patent Document 3 Japanese Patent Laid-Open No. 9-255837
  • the present invention can be automatically mounted by reflow soldering by cutting so as not to generate burrs outside the thickness of the metal foil, and has rubber elasticity for assembly.
  • a metal foil integrated conductive rubber that is convenient and can withstand vibrations, and a method for manufacturing the same.
  • the metal foil integrated conductive rubber of the present invention is a metal foil integrated conductive rubber in which the metal foil is integrated on at least one surface of the conductive rubber, and the periphery thereof is cut by cutting.
  • the periphery of at least a part or all of the surface opposite to the conductive rubber side is characterized by being thinly formed from the central portion toward the conductive rubber side.
  • the method for producing a metal foil-integrated conductive rubber of the present invention is a method for producing the metal foil-integrated conductive rubber, wherein the groove is formed by etching at a position including a cutting line on one surface of the metal foil sheet.
  • the conductive rubber sheet is integrally formed on the other side of the metal foil sheet to form a metal foil sheet integrated conductive rubber sheet, and the sheet is cut by a cutting blade along the groove of the metal foil sheet. It is characterized by cutting.
  • FIG. 1A is a cross-sectional view of a metal foil having grooves on one side used in Example 1 of the present invention
  • FIG. 1B is a plan view thereof.
  • FIG. 2 is a cross-sectional view of the metal foil integrated conductive sheet obtained in the same example.
  • FIG. 3A is a cross-sectional view of the cutting process of the embodiment, and FIG. 3B is a plan view of the same.
  • FIG. 4A is a sectional view of the metal foil integrated conductive rubber obtained in the same example, and FIG. 4B is a plan view thereof.
  • FIG. 4C is an enlarged view of a portion X surrounded by a circle in FIG. 4A.
  • FIG. 5 is a plan view of a metal foil of Example 2 of the present invention.
  • FIG. 6 is a perspective view of the metal foil integrated conductive rubber obtained in the same example.
  • FIG. 7 shows a conventional printed circuit board with a panel-shaped contact and a shield case pushed.
  • FIG. 8A is a cross-sectional view of a conventional metal foil-integrated conductive rubber
  • FIG. 8B is an enlarged view of a Y portion surrounded by a circle in FIG. 8A.
  • the metal foil-integrated conductive rubber in which the metal foil is integrated on at least one surface has fine “burr burr” or “jagged” at the cut end portion of the metal foil, or the metal foil surface. Since the metal foil surface is lower, the metal foil surface can be accurately placed on the printed circuit board, and the metal foil integrated conductive rubber has sufficient solder on the board. Bond strength is obtained. In addition, it has rubber elasticity, is convenient for assembly and can withstand vibration.
  • the metal foil-integrated conductive rubber of the present invention is suitably used for connection between a printed circuit board in a mobile phone and a shield case, or connection between an inner surface of a mobile phone frame on which a conductive film is applied and a printed circuit board.
  • the electrical connection with this metal foil integrated conductive rubber is said to have an adverse effect on vibrations on electronic circuits and electronic parts.
  • the problem is solved, and the conductive layer inside the resin body of the mobile phone is damaged by the electrical connection using the metal foil integrated conductive rubber. There is no risk of occurrence.
  • the metal foil integrated conductive rubber is bonded to the printed circuit board by reflow, but the opposite shield case and the conductive film on the inner surface of the mobile phone frame are contacted by pressure contact and have high repairability.
  • a conductive layer and a substrate are electrically connected to connect a printed circuit board and a shield case in a mobile phone or to protect the inner surface of a resin body.
  • a conductive polymer elastic body and a metal foil having a thickness of, for example, 0.5 mm or less are integrated on at least one surface, and the outer peripheral surface of the metal foil is thin on the outside, and is cut at that portion. Yes.
  • the metal foil is made of copper, copper alloy, aluminum, aluminum alloy, iron, stainless steel, nickel, tin, titanium, gold, silver or an alloy containing these metals having a thickness of 0.5 mm or less.
  • a metal thin film layer may be formed by plating, vapor deposition, or the like.
  • the other side of the metal foil is molded integrally with the conductive polymer elastic body. In this case, it is preferable to use a concave groove having a depth of 0.02 mm or more and a groove having a width of 0.10 mm or more subjected to force by a half etching method with a predetermined shape and pattern.
  • the base material of the conductive rubber part is a butadiene polymer (BR: ASTM, classified according to D1419), butadiene.styrene copolymer (SBR), butadiene.acrylonitrile copolymer (NBR), isoprene polymer (IR).
  • BR butadiene polymer
  • SBR butadiene.styrene copolymer
  • NBR butadiene.acrylonitrile copolymer
  • IR isoprene polymer
  • ⁇ down Doya silicone rubber preferably in whatever good tool especially if made in a rubber elastic body by curing at such ease to impart electrical conductivity by mixing a large amount of conductive material! ⁇ things like ⁇ .
  • Conductive powder mixed and added to these base materials is processed into particles of carbon, copper, copper alloy, aluminum, aluminum alloy, iron, stainless steel, nickel, tin, titanium, gold, silver, etc.
  • the conductive powder force in which the metal thin film layer is formed on the surface of the core material by plating or vapor deposition can be selected.
  • the average volume particle diameter of the conductive powder is preferably in the range of 0.5 to 70 ⁇ m.
  • the average volume particle diameter can be measured with a commercially available particle size distribution meter. For example, it can be measured using a Horiba laser diffraction particle sizer (LA920), a Shimadzu laser diffraction particle sizer (SALD2100), or the like. It is preferable that the conductive rubber in which conductive powder is mixed and added to the base material has a volume resistivity (ASTM ⁇ D991) of 10 K ⁇ ⁇ cm or less.
  • half etching is performed using any processing method such as cutting, electric discharge processing, laser processing, high-pressure water processing, and etching. Then, groove processing of a predetermined shape and pattern is performed.
  • the height of burrs at the outer peripheral portion of the metal foil of the metal foil-integrated conductive rubber is less than 0.02 mm.
  • the volume resistivity of the conductive rubber is preferably 10 ⁇ ⁇ cm or less.
  • the conductive rubber is vulcanized and molded from a compound comprising a conductive rubber composition in which conductive powder is mixed with unvulcanized silicone rubber and a vulcanizing agent is added and kneaded. It is preferable that the sheet is formed into a sheet shape.
  • the periphery of the metal foil sheet is preferably formed so as to be solderable by forming a groove by half-etching and then applying electrolytic gold plating to the surface.
  • the surface of the metal foil sheet is subjected to a surface activation treatment with a coupling agent in order to integrally form the conductive rubber sheet.
  • a silane coupling agent is used as an auxiliary agent in order to integrally mold a metal foil and a conductive rubber and to firmly burn each other.
  • the silane coupling agent applied to the surface of the metal foil is hydrolyzed and a dehydration condensation reaction takes place between the silanol group and M—OH (M is a key atom or metal atom) on the surface of the metal foil.
  • M—OH is a key atom or metal atom
  • the silane force decoupling agent the one represented by the general formula (A) can be used.
  • X is a methoxy group or ethoxy group
  • Y is an aliphatic long-chain alkyl group having 6 to 18 carbon atoms.
  • the metal foil coated with the silane coupling agent and the conductive rubber compound are overlapped with each other by two rolled rolls, rolled, closely contacted, put into a molding die, and heated to form a sheet.
  • a metal foil integrated conductive rubber sheet is obtained.
  • the sheet-shaped metal foil-body-type conductive rubber sheet is cut into a predetermined size using a cutting machine in accordance with the concave groove of the metal foil, thereby obtaining a part in which the metal foil and the conductive rubber are integrally molded.
  • the cutting with the cutting blade is performed by fixing the metal foil sheet-integrated conductive rubber sheet to the cutting panel, and cutting from the conductive rubber side using the cutting blade in accordance with the groove position of the metal foil sheet.
  • FIG. 1A is a cross-sectional view of a metal foil having grooves on one side used in this embodiment
  • FIG. 1B is a plan view of the same.
  • a groove 2 with a width of 0.5 mm and a depth of 0.05 mm is vertically formed on one side of a metal foil (for example, rolled copper foil) 1 with a thickness of 0.1 mm by a half-etching method. . 5mm pitch, length 2. 2mm pitch formed.
  • FIG. 2 is a cross-sectional view of the metal foil integrated conductive sheet 4 obtained as described above.
  • FIG. 3A is a sectional view of the cutting process
  • FIG. 3B is a plan view thereof.
  • the metal foil integrated conductive sheet 4 is fixed to the panel for cutting (not shown) with the metal foil 1 facing down, and the width 1. Omm, length, 3. Omm was cut from the conductive rubber side with a cutting blade 5.
  • 6 is a cutting position or cutting line.
  • the reason for cutting from the conductive rubber side is that the deformed shape of the conductive rubber is not destroyed at the time of cutting.
  • the adhesion strength between the conductive rubber compound A and the metal foil layer was 5N.
  • FIG. 4A is a sectional view of the metal foil-integrated conductive rubber 7 in this way
  • FIG. 4B is a plan view thereof
  • FIG. 4C is an enlarged view of a portion X surrounded by a circle in FIG. 4A.
  • the maximum was 0.005 mm.
  • Return burr 8 generated on the cut surface of the metal foil was subjected to reflow soldering on a printed circuit board that was lower than the surface of the metal foil. Since ⁇ Zagged '' is minute, the metal foil surface can be accurately placed on the printed circuit board, and the metal foil integrated conductive rubber that does not cause tilting due to reflow soldering is sufficient on the board A good solder joint strength was obtained.
  • FIG. 5 is a plan view of a metal foil (for example, rolled copper foil) 11 of this embodiment.
  • a groove 12 with a width of 0.5 mm and a depth of 0.05 mm is formed on one side of a rolled copper foil 11 with a thickness of 0.1 mm by a half-etching method, with a length of 1.5 mm and a length of 2.
  • the metal foil was formed at a pitch of 2 mm.
  • conductive rubber compound B was prepared by mixing 6 parts by mass of dicumyl peroxide as a vulcanizing agent with 100 parts by mass of conductive silicone compound, SE6770u (product name: Z Toray Co., Ltd.). It was created.
  • the conductive rubber compound B is sheeted to a thickness of 1.5 mm, and the metal foil is overlaid. Rolled to a total thickness of 1.65 mm with 2 rolls.
  • a rolled sheet is placed in the molding die, After press-curing at 170 ° C for 10 minutes, it was subjected to secondary vulcanization at 160 ° C for 8 hours to obtain a metal foil integrated conductive sheet with a total thickness of 1.5 mm.
  • FIG. 6 is a perspective view of the metal foil integrated conductive rubber 10, 11 is a metal foil, 12 is a groove formed by etching, and 13 is a conductive rubber.
  • the height of the return burr generated in the metal foil portion by cutting was measured, and the maximum was 0.005 mm.
  • the metal burr of the metal foil-integrated conductive rubber is very small. Therefore, the metal foil surface can be accurately placed on the printed circuit board, the parts are lifted by reflow soldering, and the metal foil integrated conductive rubber that does not generate tilt has sufficient solder joint strength on the circuit board. Obtained.
  • the metal foil-integrated conductive rubber of the present invention can be applied to conductive contact parts inside electrical equipment such as a mobile phone, a mobile terminal, and a personal computer, and in particular, electrical connection between a printed board and a shield case, It is useful for electrical connection between the inner surface of a cellular phone frame with a conductive coating and the substrate.

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  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
  • Laminated Bodies (AREA)
  • Manufacture Of Switches (AREA)
  • Contacts (AREA)
  • Non-Insulated Conductors (AREA)

Abstract

A conductive rubber integrated with a metal foil where a metal foil (1) is integrated at least on one surface of a conductive rubber (3), the circumference is cut, and at least the partial or entire circumference of the metal foil on the side opposite to the conductive rubber side is formed to be gradually thinner from the central portion toward the conductive rubber side. The conductive rubber integrated with a metal foil is made by forming a groove (2) by etching at a position on one surface of the metal foil (1) including a cutting line, forming the conductive rubber (3) integrally on the other surface of the metal foil to obtain a conductive rubber sheet (4) integrated with a metal foil, and then cutting the sheet (4) along the groove (3) of the metal foil by means of a cutter (5). A conductive rubber component integrated with a metal foil enabling automatic packaging by reflow soldering and being cut such that burrs do not project outward beyond the thickness of the metal foil is thereby provided.

Description

明 細 書  Specification
金属箔一体導電ゴム  Metal foil integrated conductive rubber
技術分野  Technical field
[0001] 本発明は、導電ゴムの片面に、金属箔を一体成型した金属箔一体導電ゴムに関す る。携帯電話機内部の導電性の接点部品に適用でき、特にプリント基板とシールドケ ースの電気的な接続や基板と導電性皮膜が施されている携帯電話フレーム内面と基 板との電気的接続に使用される金属箔一体導電ゴムに関する。  [0001] The present invention relates to a metal foil-integrated conductive rubber obtained by integrally molding a metal foil on one surface of a conductive rubber. Applicable to conductive contact parts inside mobile phone, especially used for electrical connection between printed circuit board and shield case, and internal connection between mobile phone frame inner surface and substrate with conductive film. The present invention relates to a metal foil integrated conductive rubber.
背景技術  Background art
[0002] 携帯電話から放射される電磁波ノイズによる電子機器の誤動作や、人体への影響 といった電磁波障害が問題となっている。その対策として、シールド性能を強化した 多層基板の採用や、導電性皮膜が形成されている携帯電話フレーム内面とプリント 基板との接続には、ネジなどによる固定や、シールドケースを基板に接合させる為に 、パネ状の接点を介在し電気的な接続を取るなどの方法が採用されている。他には シールドケースと基板の接合には、導電性フィラーを充填した導電性接着剤などを使 用する伊 1などもある。  [0002] Electromagnetic interference such as malfunction of electronic devices due to electromagnetic noise radiated from mobile phones and influence on human bodies has become a problem. As countermeasures, the use of a multilayer board with enhanced shielding performance and the connection between the inner surface of a mobile phone frame on which a conductive film is formed and the printed board are fixed with screws or the shield case is joined to the board. In addition, methods such as electrical connection through panel-like contacts are adopted. In addition, there is Italy 1 that uses a conductive adhesive filled with a conductive filler to join the shield case and the substrate.
[0003] 本発明に関連する技術としては、導電ゴムシートの片面に金属箔が接着された金 属箔積層シートであり、電子機器内の電気接点、あるいは電ィ匕製品のリモコンのシリ コーンゴムスィッチの導電ゴム接点などに利用されて ヽる。一般的にはこれらの金属 箔ー体型導電ゴムは、小片で金属箔シートの表面に導電性ゴムを接着又は一体ィ匕 成型した後に、金属加工技術をもってして所定の寸法に打抜きやシャーリング加工を 行い切断加工し小さな部品とする事が一般的である。たとえば携帯電話機内部で電 気的接続を取る方法にはネジゃパネにより電気接点を多数箇所施すことが行われて いる。  [0003] A technique related to the present invention is a metal foil laminated sheet in which a metal foil is bonded to one side of a conductive rubber sheet, and an electric contact in an electronic device or a silicone rubber for a remote control of an electronic product. Used for conductive rubber contacts of switches. In general, these metal foil-body-type conductive rubbers are formed by bonding or integrally molding conductive rubber onto the surface of a metal foil sheet in small pieces, and then stamping or shearing to a predetermined size using metal processing technology. It is common to cut and process small parts. For example, as a method of making an electrical connection inside a mobile phone, many electrical contacts are made by screw panels.
[0004] 図 7は従来例のプリント基板 21にパネ状の接点 22を介在させてシールドケース 23 を矢印 24の方向に押し込み電気的な接続をした斜視図である。プリント基板 21上に はバイブレーターモータ、スピーカーやレシーバーなどの振動を発生する電子部品 力 Sいくつか取り付けられており、その振動が基板に伝わり実装されている PLUPhase Locked Loop), VCO (電圧制御発信器)などの電子回路やエレクトレットコンデンサー マイクロフォンなどの電子部品に振動が悪影響を及ぼすという問題がある。 FIG. 7 is a perspective view in which a shield-like contact 23 is pushed in the direction of an arrow 24 with a panel-like contact 22 interposed in a printed circuit board 21 of a conventional example to make electrical connection. On the printed circuit board 21, there are several electronic components that generate vibrations such as vibrator motors, speakers, and receivers. There is a problem that vibration adversely affects electronic circuits such as Locked Loop) and VCO (Voltage Control Oscillator) and electronic parts such as electret condenser microphones.
[0005] 従来は金属箔表面に導電性ゴムを接着又は一体成型してシートを作成した後に、 金属加工技術により、所定の寸法に打ち抜き加工やシャーリング加工をおこない部 品とすることが一般的であるが、この方法で作成した部品は、導電性フィラーを充填 した導電性ゴム 32と金属箔 31という剛性、ヤング率力 ¾つたく異なる材質が積層され たシートを同時に切断するため、金属箔 31の周辺部分の切り口には微細な「かえり バリ」 33や「ギザギザ」が生じる(図 8A—B)。図 8Aは従来例の金属箔一体導電ゴム の断面図、図 8Bは図 8Aの丸で囲んだ Y部の拡大図である。プリント基板上にリフロ 一半田付けによって部品を取り付けた時に金属箔の周辺部分の切り口の微細な「か えりバリ」や「ギザギザ」により金属箔面をプリント基板上の正確な位置に配置する事 が困難で、リフロー半田付けの工程で部品の浮き上がり、傾きが発生する。また、部 品を基板に取付ける充分なハンダ接合強度が得られな 、と 、う問題があった。  [0005] Conventionally, it is common to form a sheet by bonding or integrally molding conductive rubber to the surface of a metal foil, and then punching or shearing to a predetermined size by metal processing technology. However, the parts made by this method are made of metal foil 31 because the sheets of conductive rubber 32 filled with conductive filler and metal foil 31 are rigid and Young's modulus. Fine “kaeri burr” 33 and “jagged edges” are generated at the cut-out in the peripheral part of (Fig. 8A-B). FIG. 8A is a cross-sectional view of a conventional metal foil-integrated conductive rubber, and FIG. 8B is an enlarged view of a Y portion surrounded by a circle in FIG. 8A. When a component is mounted on a printed circuit board by reflow soldering, the metal foil surface can be placed at an accurate position on the printed circuit board by fine burr or jagged edges at the periphery of the metal foil. Difficult, parts are lifted and tilted during the reflow soldering process. In addition, there is a problem that sufficient solder joint strength for attaching the component to the substrate cannot be obtained.
[0006] 携帯電話機の榭脂ボディの内側にはシールド対策の為に導電性の層が施されて いる、その層とプリント基板とをパネなどで電気的に接続する方法があるが前記の振 動により、パネの先端が導電性の層を破損してしまいシールド機能に問題が発生す ることがある。また、シールドケースと基板の接合には半田付けや導電性フィラーを充 填した導電性接着剤を使用する方法もあるが、半田付けや接着剤の使用は、機器の 故障時のリペア性に問題があること及び比較的高い力やねじれ力が力かる携帯電話 機などでは、半田付けなどで強固に固定された前記シールドケースと基板の半田接 合部に力かる応力でクラックが発生し、最悪は接合部分が剥がれて導電性が維持で きないばかりか、機器そのものが破損してしまうという問題があった。  [0006] A conductive layer is provided on the inside of the resin body of the mobile phone as a shield measure. There is a method of electrically connecting the layer and a printed circuit board with a panel or the like. Due to the movement, the tip of the panel may damage the conductive layer, causing problems in the shielding function. In addition, there is a method of soldering or using a conductive adhesive filled with a conductive filler for joining the shield case and the board. However, soldering and the use of an adhesive are problematic in terms of repairability in the event of equipment failure. In mobile phones and other devices that have a relatively high force or twisting force, cracks occur due to the stress applied to the solder joint between the shield case and the board firmly fixed by soldering. However, there was a problem that the joint part was peeled off and the conductivity could not be maintained, and the device itself was damaged.
[0007] しかし、導電性フィラーを充填した導電ゴム部品は、振動による不具合やリペア性 には問題がないものの、リフローハンダ付けによる自動実装化ができず、手作業での 取り付けと組立てになり、品質上の問題や生産上の経済性を保てないという問題があ つた o  [0007] However, although conductive rubber parts filled with conductive fillers have no problems with vibration and repairability, they cannot be automatically mounted by reflow soldering, and are manually mounted and assembled. There is a problem of quality and production economy cannot be maintained o
[0008] さらに別の従来例としては、導電性ポリテトラフルォロエチレン (PTFE)を使用した ガスケットが提案されている(特許文献 1〜3)。しかし、導電性 PTFEを使用したガス ケットはゴム弾性がなぐ組み立てに不便で振動にも弱いという問題があった。 [0008] As another conventional example, gaskets using conductive polytetrafluoroethylene (PTFE) have been proposed (Patent Documents 1 to 3). However, gas using conductive PTFE There is a problem that the ket is inconvenient to assemble with rubber elasticity and weak against vibration.
特許文献 1 :特表 2002— 510873号公報  Patent Document 1: Japanese Translation of Special Publication 2002-510873
特許文献 2 :米国特許第 5, 524, 908号明細書  Patent Document 2: U.S. Pat.No. 5,524,908
特許文献 3:特開平 9 - 255837号公報  Patent Document 3: Japanese Patent Laid-Open No. 9-255837
発明の開示  Disclosure of the invention
[0009] 本発明は、前記従来の問題を解決するため、金属箔の厚みより外側にバリを出さな いように切断してリフローハンダ付けによる自動実装が可能で、かつゴム弾性があり 組み立てに便利で振動にも耐えられる金属箔一体導電ゴム及びその製造方法を提 供する。  [0009] In order to solve the above-described conventional problems, the present invention can be automatically mounted by reflow soldering by cutting so as not to generate burrs outside the thickness of the metal foil, and has rubber elasticity for assembly. A metal foil integrated conductive rubber that is convenient and can withstand vibrations, and a method for manufacturing the same.
[0010] 本発明の金属箔一体導電ゴムは、導電ゴムの少なくとも一面に金属箔が一体化さ れている金属箔一体導電ゴムであって、周囲は裁断によって切断されており、前記 金属箔の導電ゴム側とは反対の面の少なくとも一部又は全部の周囲は中央部より導 電ゴム側に向力つて薄く形成されていることを特徴とする。  [0010] The metal foil integrated conductive rubber of the present invention is a metal foil integrated conductive rubber in which the metal foil is integrated on at least one surface of the conductive rubber, and the periphery thereof is cut by cutting. The periphery of at least a part or all of the surface opposite to the conductive rubber side is characterized by being thinly formed from the central portion toward the conductive rubber side.
[0011] 本発明の金属箔一体導電ゴムの製造方法は、前記の金属箔一体導電ゴムの製造 方法であって、金属箔シートの一方の面の裁断線を含む位置にエッチング加工によ り溝を形成しておき、前記金属箔シートの他方の面に導電ゴムシートを一体ィ匕成形し 、金属箔シート一体導電ゴムシートを形成し、前記金属箔シートの溝に沿って裁断刃 によって前記シートを切断することを特徴とする。  [0011] The method for producing a metal foil-integrated conductive rubber of the present invention is a method for producing the metal foil-integrated conductive rubber, wherein the groove is formed by etching at a position including a cutting line on one surface of the metal foil sheet. The conductive rubber sheet is integrally formed on the other side of the metal foil sheet to form a metal foil sheet integrated conductive rubber sheet, and the sheet is cut by a cutting blade along the groove of the metal foil sheet. It is characterized by cutting.
図面の簡単な説明  Brief Description of Drawings
[0012] [図 1]図 1Aは本発明の実施例 1で使用する片面に溝を有する金属箔の断面図、図 1 Bは同平面図である。  FIG. 1A is a cross-sectional view of a metal foil having grooves on one side used in Example 1 of the present invention, and FIG. 1B is a plan view thereof.
[図 2]図 2は同実施例で得られた金属箔一体導電シートの断面図である。  FIG. 2 is a cross-sectional view of the metal foil integrated conductive sheet obtained in the same example.
[図 3]図 3Aは同実施例の裁断工程の断面図、図 3Bは同平面図である。  FIG. 3A is a cross-sectional view of the cutting process of the embodiment, and FIG. 3B is a plan view of the same.
[図 4]図 4Aは同実施例で得られた金属箔一体導電ゴムの断面図、図 4Bは同平面図 [FIG. 4] FIG. 4A is a sectional view of the metal foil integrated conductive rubber obtained in the same example, and FIG. 4B is a plan view thereof.
、図 4Cは図 4Aの丸で囲んだ X部の拡大図である。 FIG. 4C is an enlarged view of a portion X surrounded by a circle in FIG. 4A.
[図 5]図 5は本発明の実施例 2の金属箔の平面図である。  FIG. 5 is a plan view of a metal foil of Example 2 of the present invention.
[図 6]図 6は同実施例で得られた金属箔一体導電ゴムの斜視図である。  FIG. 6 is a perspective view of the metal foil integrated conductive rubber obtained in the same example.
[図 7]図 7は従来例のプリント基板にパネ状の接点を介在させてシールドケースを押し 込み電気的な接続をした斜視図である。 [Fig. 7] Fig. 7 shows a conventional printed circuit board with a panel-shaped contact and a shield case pushed. FIG.
[図 8]図 8Aは従来例の金属箔一体導電ゴムの断面図、図 8Bは図 8Aの丸で囲んだ Y部の拡大図である。  FIG. 8A is a cross-sectional view of a conventional metal foil-integrated conductive rubber, and FIG. 8B is an enlarged view of a Y portion surrounded by a circle in FIG. 8A.
発明を実施するための最良の形態  BEST MODE FOR CARRYING OUT THE INVENTION
[0013] 本発明は、金属箔を少なくとも 1面に一体化されている金属箔一体導電ゴムは金属 箔の切り口部分に微細な「かえりバリ」や「ギザギザ」が微小であるか又は金属箔面よ り低い為、金属箔面をプリント基板上に正確に配置する事が出来、リフロー半田付け で部品の浮き上がり、傾きが発生する事が無ぐ金属箔一体導電ゴムは基板上に充 分なハンダ接合強度が得られる。またゴム弾性があり組み立てに便利で振動にも耐 えられる。本発明の金属箔一体導電ゴムは、携帯電話機内のプリント基板とシールド ケースの接続、あるいは導電皮膜が施されている携帯電話フレーム内面とプリント基 板との接続に好適に使用される。また、シールドケースとプリント基板を電気的に接合 する為にパネ接点などを用いる方法に比較して、本金属箔一体導電ゴムによる電気 的な接続は電子回路や電子部品に振動が悪影響を及ぼすという問題が解決され、 且つ、携帯電話機の榭脂ボディの内側の導電性の層に対しても、金属箔一体導電ゴ ムによる電気的な接続では導電性の層を破損してしまいシールド機能に問題が発生 するおそれもない。また、本金属箔一体導電ゴムはプリント基板との接合面がリフロー により固着されるが、反対のシールドケース、携帯電話フレーム内面の導電皮膜との 接合は圧接によるコンタクトとなり、リペア性も高い。  [0013] In the present invention, the metal foil-integrated conductive rubber in which the metal foil is integrated on at least one surface has fine “burr burr” or “jagged” at the cut end portion of the metal foil, or the metal foil surface. Since the metal foil surface is lower, the metal foil surface can be accurately placed on the printed circuit board, and the metal foil integrated conductive rubber has sufficient solder on the board. Bond strength is obtained. In addition, it has rubber elasticity, is convenient for assembly and can withstand vibration. The metal foil-integrated conductive rubber of the present invention is suitably used for connection between a printed circuit board in a mobile phone and a shield case, or connection between an inner surface of a mobile phone frame on which a conductive film is applied and a printed circuit board. Also, compared to the method using panel contacts etc. to electrically join the shield case and printed circuit board, the electrical connection with this metal foil integrated conductive rubber is said to have an adverse effect on vibrations on electronic circuits and electronic parts. The problem is solved, and the conductive layer inside the resin body of the mobile phone is damaged by the electrical connection using the metal foil integrated conductive rubber. There is no risk of occurrence. The metal foil integrated conductive rubber is bonded to the printed circuit board by reflow, but the opposite shield case and the conductive film on the inner surface of the mobile phone frame are contacted by pressure contact and have high repairability.
[0014] 本発明の好適な例としては、携帯電話機内のプリント基板とシールドケースの接続 、あるいは榭脂ボディの内側シールド対策のため、導電性の層と基板とを電気的に 接続するのに好適である。導電性高分子弾性体と厚さが例えば 0. 5mm以下の金属 箔が少なくとも 1面に一体化されており、前記金属箔の切断外周面は外側が薄くなつ ており、その部分で切断されている。  [0014] As a preferred example of the present invention, a conductive layer and a substrate are electrically connected to connect a printed circuit board and a shield case in a mobile phone or to protect the inner surface of a resin body. Is preferred. A conductive polymer elastic body and a metal foil having a thickness of, for example, 0.5 mm or less are integrated on at least one surface, and the outer peripheral surface of the metal foil is thin on the outside, and is cut at that portion. Yes.
[0015] 金属箔は、厚さが 0. 5mm以下の銅、銅合金、アルミニウム、アルミニウム合金、鉄 、ステンレス、ニッケル、錫、チタン、金、銀又はこれらの金属を含む合金などを展延 してなる金属箔が使用出来、又はメツキ、蒸着などによって金属薄膜層を形成したも のでも良い。さらには金属箔の導電性高分子弾性体と一体成型されたもう片方の面 には、凹状の 0. 02mm以上の深さ、幅 0. 10mm以上の溝がハーフエッチング工法 で所定の形状、パターンで力卩ェを施してあるものを使用するのが好ましい。 [0015] The metal foil is made of copper, copper alloy, aluminum, aluminum alloy, iron, stainless steel, nickel, tin, titanium, gold, silver or an alloy containing these metals having a thickness of 0.5 mm or less. A metal thin film layer may be formed by plating, vapor deposition, or the like. Furthermore, the other side of the metal foil is molded integrally with the conductive polymer elastic body. In this case, it is preferable to use a concave groove having a depth of 0.02 mm or more and a groove having a width of 0.10 mm or more subjected to force by a half etching method with a predetermined shape and pattern.
[0016] 導電ゴム部のベース材料は、ブタジエン重合物(BR: ASTM、 D1419による分類) 、ブタジエン.スチレン共重合物(SBR)、ブタジエン.アクリロニトリル共重合物(NBR )、イソプレン重合物(IR)、クロ口プレン重合物(CR)、イソブチレン ·ジェン共重合物 (IIR)、エチレン 'プロピレン共重合物(EPM)、エチレン 'プロピレン三元重合物(EP DM)、クロロスルフォン化ポリエチレン(CSM :同)、アルキレン'スルフォイド重合物( T)、アルキル'シロキサン縮合物(Si)、フッ化ビ-リデン '六フッ化プロピレン共重合 物(FPM)、ポリエステル 'イソシァネート縮合物、ポリエーテル 'イソシァネート縮合物 (U)、アクリル酸エステル重合物 (ACMZANM)などの有機合成ゴム等カゝら選ばれ る力 好ましくは、アルキル'シロキサン縮合物であり巿販のシリコーンゴムコンパゥン ドゃシリコーンゴムなどで硬化する事によりゴム弾性体になるものなら何でも良ぐ特 に好ましくは導電性物を大量に混合し導電性を付与させやす!ヽものが好ま ヽ。 [0016] The base material of the conductive rubber part is a butadiene polymer (BR: ASTM, classified according to D1419), butadiene.styrene copolymer (SBR), butadiene.acrylonitrile copolymer (NBR), isoprene polymer (IR). , Black-opened polyene polymer (CR), isobutylene-gen copolymer (IIR), ethylene 'propylene copolymer (EPM), ethylene' propylene terpolymer (EP DM), chlorosulfonated polyethylene (CSM) ), Alkylene 'sulfide polymer (T), alkyl' siloxane condensate (Si), vinylidene fluoride 'hexafluoropropylene copolymer (FPM), polyester' isocyanate condensate, polyether 'isocyanate condensate ( U), organic synthetic rubber such as acrylic acid ester polymer (ACMZANM), etc. © down Doya silicone rubber preferably in whatever good tool especially if made in a rubber elastic body by curing at such ease to impart electrical conductivity by mixing a large amount of conductive material! ヽ things like ヽ.
[0017] これらのベース材料に混合、添加する導電粉は、カーボン、銅、銅合金、アルミ-ゥ ム、アルミニウム合金、鉄、ステンレス、ニッケル、錫、チタン、金、銀などを粒子状に 加工したもの、又は核材の表面にメツキ、蒸着などによって金属薄膜層を形成した導 電性の粉体力 選ぶことができる。  [0017] Conductive powder mixed and added to these base materials is processed into particles of carbon, copper, copper alloy, aluminum, aluminum alloy, iron, stainless steel, nickel, tin, titanium, gold, silver, etc. The conductive powder force in which the metal thin film layer is formed on the surface of the core material by plating or vapor deposition can be selected.
[0018] 導電性の粉体の平均体積粒子径は 0. 5〜70 μ mの範囲が好まし、。なお、平均 体積粒子径は市販の粒度分布計で測定できる。例えば、堀場製作所レーザ回折粒 度測定器 (LA920)、島津製作所レーザ回折粒度測定器 (SALD2100)などを用い て測定することができる。ベース材料に導電粉が混合、添加された導電性ゴムは体 積抵抗率 (ASTM · D991)が 10K Ω · cm以下である事が好まし 、。  The average volume particle diameter of the conductive powder is preferably in the range of 0.5 to 70 μm. The average volume particle diameter can be measured with a commercially available particle size distribution meter. For example, it can be measured using a Horiba laser diffraction particle sizer (LA920), a Shimadzu laser diffraction particle sizer (SALD2100), or the like. It is preferable that the conductive rubber in which conductive powder is mixed and added to the base material has a volume resistivity (ASTM · D991) of 10 KΩ · cm or less.
[0019] 金属箔の片面にパターンの溝力卩ェを施す方法としては、切削加工、放電加工、レ 一ザ一加工、高圧水加工、エッチング法など任意の加工方法を用いてハーフエッチ ングし、所定の形状、パターンの溝加工をする。  [0019] As a method of applying the groove force of the pattern to one side of the metal foil, half etching is performed using any processing method such as cutting, electric discharge processing, laser processing, high-pressure water processing, and etching. Then, groove processing of a predetermined shape and pattern is performed.
[0020] 前記金属箔一体導電ゴムの金属箔の外周部のバリの高さは 0. 02mm未満である ことが好ましい。また前記導電ゴムの体積固有抵抗は 10ΚΩ 'cm以下であることが 好ましい。 [0021] 本発明方法においては、前記導電ゴムは、未加硫シリコーンゴムに導電性粉末を 混合し、さらに加硫剤を加えて混練りした導電性ゴム配合物からなるコンパゥンドから 加硫成形されシート状に形成されて ヽることが好ま ヽ。 [0020] Preferably, the height of burrs at the outer peripheral portion of the metal foil of the metal foil-integrated conductive rubber is less than 0.02 mm. The volume resistivity of the conductive rubber is preferably 10 Ω · cm or less. [0021] In the method of the present invention, the conductive rubber is vulcanized and molded from a compound comprising a conductive rubber composition in which conductive powder is mixed with unvulcanized silicone rubber and a vulcanizing agent is added and kneaded. It is preferable that the sheet is formed into a sheet shape.
[0022] また、前記金属箔シートの周囲はハーフエッチング加工により溝を形成した後、表 面に電解金メッキを施して半田付け可能に形成されていることが好ましい。  [0022] The periphery of the metal foil sheet is preferably formed so as to be solderable by forming a groove by half-etching and then applying electrolytic gold plating to the surface.
[0023] また、前記金属箔シートの溝加工を施して 、な 、面には、導電ゴムシートを一体成 形するためにカップリング剤による表面活性ィ匕処理を施すことが好ま 、。すなわち、 金属箔と導電ゴムを一体成型し相互を強固に焼き付け加工する為に補助剤としてシ ランカップリング剤を使用する。金属箔表面に塗布したシランカップリング剤は加水分 解生成物しシラノール基と金属箔表面の M— OH (Mはケィ素、又は金属原子)と間 に脱水縮合反応が起こり、金属箔表面と導電ゴムを結合させる働きをする。シラン力 ッップリング剤としては、一般式 (A)に示すようなものを用いる事ができる。  [0023] Further, it is preferable that the surface of the metal foil sheet is subjected to a surface activation treatment with a coupling agent in order to integrally form the conductive rubber sheet. That is, a silane coupling agent is used as an auxiliary agent in order to integrally mold a metal foil and a conductive rubber and to firmly burn each other. The silane coupling agent applied to the surface of the metal foil is hydrolyzed and a dehydration condensation reaction takes place between the silanol group and M—OH (M is a key atom or metal atom) on the surface of the metal foil. Works to bind conductive rubber. As the silane force decoupling agent, the one represented by the general formula (A) can be used.
[0024] YSiX (A)  [0024] YSiX (A)
3  Three
但し、 Xはメトキシ基又はエトキシ基、 Yは炭素数 6〜18の脂肪族長鎖アルキル基で ある。  X is a methoxy group or ethoxy group, and Y is an aliphatic long-chain alkyl group having 6 to 18 carbon atoms.
[0025] 代表的には、ビュルトリエトキシシラン、ビュルトリス(2—メトキシエトキシ)シラン、 3 ーメタクリロキシプロピルトリメトキシシラン、 3—グリシドキシプロピルトリメトキシシラン、 N- 2- (アミノエチル)」3—ァミノプロピルトリメトキシシラン、 N—フエ-ルー 3—アミ ノプロピルトリメトキシシラン、 3—メルカプトプロピルトリメトキシシラン、 3—クロ口プロピ ルトリメトキシシランなどがあるが金属箔の材質等力 適宜選択し 1種類又は 2種類以 上を混合して使用する事が出来る。  [0025] Typically, butyltriethoxysilane, butyltris (2-methoxyethoxy) silane, 3-methacryloxypropyltrimethoxysilane, 3-glycidoxypropyltrimethoxysilane, N-2- (aminoethyl) " 3-Aminopropyltrimethoxysilane, N-Ferrolu 3-aminopropyltrimethoxysilane, 3-mercaptopropyltrimethoxysilane, 3-chloropropyltrimethoxysilane, etc. You can select one type or a mixture of two or more types.
[0026] また、前記金属箔シートに導電ゴムシートを一体ィ匕する方法が、  [0026] In addition, a method of integrating a conductive rubber sheet with the metal foil sheet,
A.導電ゴムを薄く圧延してシート状にし、前記金属箔シートの表面活性化処理面に 重ねた後、  A. After thinly rolling the conductive rubber into a sheet shape and stacking on the surface activation treatment surface of the metal foil sheet,
B.圧延 2本ロールでさらに所定の厚みに圧延し、層間の空気を抜き去り、相互を十 分密着させ圧延シートとした後、  B. Rolling After rolling to a predetermined thickness with two rolls, removing the air between the layers, making them closely contact each other into a rolled sheet,
C.成型金型内に前記圧延シートを入れ、加圧、加熱して導電性ゴムシートを 1次カロ 硫した後、 2次加硫し、導電性ゴムシートと金属箔シートを一体化したシートを成形す る方法であることが好まし!/、。 C. A sheet in which the rolled sheet is placed in a molding die, pressurized and heated to primarily calcine the conductive rubber sheet, and then secondary vulcanized to integrate the conductive rubber sheet and the metal foil sheet. Molding It is preferable to be a method!
[0027] すなわち、前記のシランカップリング剤を施した金属箔と導電ゴム配合物を圧延 2本 ロールで相互に重ね合せ、圧延、密着させ、成形金型に投入し加熱することでシート 状の金属箔一体導電ゴムシートを得る。前記シート状の金属箔ー体型導電ゴムシー トの金属箔の凹状の溝部に合せて裁断機を使用し所定の寸法に切断する事で金属 箔と導電ゴムが一体成型された部品を得る。  [0027] That is, the metal foil coated with the silane coupling agent and the conductive rubber compound are overlapped with each other by two rolled rolls, rolled, closely contacted, put into a molding die, and heated to form a sheet. A metal foil integrated conductive rubber sheet is obtained. The sheet-shaped metal foil-body-type conductive rubber sheet is cut into a predetermined size using a cutting machine in accordance with the concave groove of the metal foil, thereby obtaining a part in which the metal foil and the conductive rubber are integrally molded.
[0028] また、前記裁断刃による切断が、前記金属箔シート一体導電ゴムシートを裁断用の パネルに固定し、金属箔シートの溝位置に合わせて、裁断刃を用いて導電ゴム側か ら切断することにより、前記金属箔シートの導電ゴム側とは反対の面の少なくとも一部 又は全部の周囲を中央部より導電ゴム側に向力つて薄く形成することが好ましい。 実施例  [0028] In addition, the cutting with the cutting blade is performed by fixing the metal foil sheet-integrated conductive rubber sheet to the cutting panel, and cutting from the conductive rubber side using the cutting blade in accordance with the groove position of the metal foil sheet. By doing so, it is preferable that at least part or all of the periphery of the surface opposite to the conductive rubber side of the metal foil sheet is formed thinly from the central portion toward the conductive rubber side. Example
[0029] 本発明の実施例を図面に基づいてより具体的に説明する。  An embodiment of the present invention will be described more specifically based on the drawings.
[0030] (実施例 1) [0030] (Example 1)
図 1Aは本実施例で使用する片面に溝を有する金属箔の断面図、図 1Bは同平面 図である。図 1A—Bに示すように、厚さ 0. 1mmの金属箔 (例えば圧延銅箔) 1の片 面に、ハーフエッチング工法で幅 0. 5mm、深さ 0. 05mmの溝 2を、縦 1. 5mmピッ チ、長さ 2. 2mmピッチで形成した。  FIG. 1A is a cross-sectional view of a metal foil having grooves on one side used in this embodiment, and FIG. 1B is a plan view of the same. As shown in Fig. 1A-B, a groove 2 with a width of 0.5 mm and a depth of 0.05 mm is vertically formed on one side of a metal foil (for example, rolled copper foil) 1 with a thickness of 0.1 mm by a half-etching method. . 5mm pitch, length 2. 2mm pitch formed.
[0031] 次に、溝力卩ェを施した金属箔の全面に 0. 5 μ m厚の電解金メッキを施した後、溝カロ ェを施して 、な ヽ面には、導電ゴム金属箔と一体形成するためにシランカップリング の溶液として塗布し、常温(25°C)で 1時間乾燥して金属箔の前処理をした。 [0031] Next, after 0.5 mm thick electrolytic gold plating was applied to the entire surface of the metal foil subjected to the groove strength check, groove groove check was performed. In order to form an integral body, it was applied as a silane coupling solution and dried at room temperature (25 ° C) for 1 hour to pre-treat the metal foil.
[0032] 次に、市販のシリコーンコンパウンド KE530U (信越ィ匕学工業社製) 100質量部に 平均粒径 20 mの銀コートガラス粉、 300質量部 (製品名 S3000、バロティ-社製) を混合し、 2· 5ジメチルー 2· 5ビス(t—ブチルパーォキシ)へキサン、 50%含有のカロ 硫剤を 5質量部混練りし導電性ゴム配合物 Aを作成した。 [0032] Next, commercially available silicone compound KE530U (manufactured by Shin-Etsu Chemical Co., Ltd.) is mixed with silver coated glass powder having an average particle size of 20 m and 300 parts by mass (product name: S3000, manufactured by Valoti Co., Ltd.). Then, 5 parts by mass of a 2.5-dimethyl-2.5-bis (t-butylperoxy) hexane, 50% -containing calorific agent was kneaded to prepare a conductive rubber compound A.
[0033] 次に、シランカップリング剤をあら力じめ塗布し、 1時間乾燥した前記金属箔に、導 電性ゴム配合物 Aを厚さ 2. 1mmにシーティングして重ねた後、圧延 2本ロールで 2. lmmの総厚に圧延した。 [0034] 次に、成型金型内に圧延シートを入れ、 20kgZcm2の圧力をかけて 170°C、 10分 のプレス加硫を施した後、 160°C、 8時間の 2次加硫を経て、総厚み 2. Ommの金属 箔一体導電シートを得た。図 2はこのようにして得られた金属箔一体導電シート 4の断 面図である。 [0033] Next, the conductive rubber compound A was applied to the metal foil that had been applied with silane coupling agent and dried for 1 hour, and the sheet was laminated with a thickness of 2.1 mm, followed by rolling. This roll was rolled to a total thickness of 2. lmm. [0034] Next, the rolled sheet was placed in a mold, after performing 170 ° C, 10 minutes of press vulcanization under pressure of 20KgZcm 2, secondary vulcanization 160 ° C, 8 hours After that, a metal foil integrated conductive sheet having a total thickness of 2. Omm was obtained. FIG. 2 is a cross-sectional view of the metal foil integrated conductive sheet 4 obtained as described above.
[0035] 図 3Aは裁断工程の断面図、図 3Bは同平面図である。図 3Aに示すように、金属箔 一体導電シート 4を裁断用のパネル (図示せず)に金属箔 1面を下側にして固定し、 金属箔 1の溝 2位置に合わせて、幅 1. Omm、長さ、 3. Ommに裁断刃 5で導電ゴム 側から切断した。 6は裁断位置又は裁断線である。導電ゴム側から切断するのは、切 断時に導電ゴムを変形した形状を破壊させな 、ためである。こうして得られた金属箔 一体導電ゴム 4の上下面にテスターをあてて測定電流 100mAにおける抵抗値を測 定したところ、 10— 2 Ω 'cmであった。導電性ゴム配合物 Aと金属箔の層間の接着強度 は 5Nであった。 FIG. 3A is a sectional view of the cutting process, and FIG. 3B is a plan view thereof. As shown in Fig. 3A, the metal foil integrated conductive sheet 4 is fixed to the panel for cutting (not shown) with the metal foil 1 facing down, and the width 1. Omm, length, 3. Omm was cut from the conductive rubber side with a cutting blade 5. 6 is a cutting position or cutting line. The reason for cutting from the conductive rubber side is that the deformed shape of the conductive rubber is not destroyed at the time of cutting. Where was boss measure the resistance value of the measured current 100mA by applying a tester to the upper and lower surfaces of the metal foil integral conductive rubber 4 thus obtained, it was 10- 2 Ω 'cm. The adhesion strength between the conductive rubber compound A and the metal foil layer was 5N.
[0036] 図 4Aはこのようにして金属箔一体導電ゴム 7の断面図、図 4Bは同平面図、図 4C は図 4Aの丸で囲んだ X部の拡大図である。図 4Cの金属箔一体導電ゴム 7の裁断部 に発生した返りバリ 8の高さ Lを測定したところ、最大 0. 005mmであった。金属箔の 切断面に発生した返りバリ 8は、金属箔の面より低ぐプリント基板にリフロー半田付け を行なったところ、金属箔一体導電ゴムの金属箔の切り口部分の「かえりバリ」や「ギ ザギザ」は微小である為、金属箔面をプリント基板上に正確に配置することができ、リ フロー半田付けで部品の浮き上がり、傾きの発生が無ぐ金属箔一体導電ゴムは基 板上に充分なハンダ接合強度が得られた。  FIG. 4A is a sectional view of the metal foil-integrated conductive rubber 7 in this way, FIG. 4B is a plan view thereof, and FIG. 4C is an enlarged view of a portion X surrounded by a circle in FIG. 4A. When the height L of the return burr 8 generated at the cut portion of the metal foil-integrated conductive rubber 7 in FIG. 4C was measured, the maximum was 0.005 mm. Return burr 8 generated on the cut surface of the metal foil was subjected to reflow soldering on a printed circuit board that was lower than the surface of the metal foil. Since `` Zagged '' is minute, the metal foil surface can be accurately placed on the printed circuit board, and the metal foil integrated conductive rubber that does not cause tilting due to reflow soldering is sufficient on the board A good solder joint strength was obtained.
[0037] (実施例 2)  [0037] (Example 2)
図 5は本実施例の金属箔 (例えば圧延銅箔) 11の平面図である。図 5に示すように 、厚さ 0. 1mmの圧延銅箔 11の片面に、ハーフエッチング工法で幅 0. 5mm、深さ 0 . 05mmの溝 12を、縦 1. 5mmピッチ、長さ 2. 2mmピッチで形成した金属箔とした。  FIG. 5 is a plan view of a metal foil (for example, rolled copper foil) 11 of this embodiment. As shown in Fig. 5, a groove 12 with a width of 0.5 mm and a depth of 0.05 mm is formed on one side of a rolled copper foil 11 with a thickness of 0.1 mm by a half-etching method, with a length of 1.5 mm and a length of 2. The metal foil was formed at a pitch of 2 mm.
[0038] 次に、溝加工を施した圧延銅箔の全面に 0. 5 μ m厚の電解金メッキを施した後、溝 加工を施していない面に、導電ゴム金属箔を一体形成するため、シランカップリング 剤、 3—メタクリロキシプロピルトリメトキシシランをイソプロパノールで 10Wt%の溶液 とし塗布し、常温下で 1時間放置して乾燥し、金属箔の前処理をした。 [0039] 次に、導電性シリコーンコンパウンド、 SE6770u、 100質量部(商品名 Z東レ 'ダウ コーユング社製)に加硫剤としてジクミルパーオキサイドを 6質量部を混合し導電性ゴ ム配合物 Bを作成した。 [0038] Next, in order to integrally form a conductive rubber metal foil on the non-grooved surface after electroplating 0.5 μm thick on the entire surface of the grooved rolled copper foil, A silane coupling agent, 3-methacryloxypropyltrimethoxysilane, was applied as a 10 Wt% solution with isopropanol, left to stand at room temperature for 1 hour, and dried to pretreat the metal foil. [0039] Next, conductive rubber compound B was prepared by mixing 6 parts by mass of dicumyl peroxide as a vulcanizing agent with 100 parts by mass of conductive silicone compound, SE6770u (product name: Z Toray Co., Ltd.). It was created.
[0040] 次に、シランカップリング剤をあら力じめ塗布し 1時間放置し乾燥した金属箔 11に、 導電性ゴム配合物 Bを厚さ 1. 5mmにシーティングし、金属箔に重ねた後、圧延 2本 ロールで 1. 65mmの総厚に圧延した。  [0040] Next, after applying the silane coupling agent and applying it to the metal foil 11 which has been allowed to stand for 1 hour and dried, the conductive rubber compound B is sheeted to a thickness of 1.5 mm, and the metal foil is overlaid. Rolled to a total thickness of 1.65 mm with 2 rolls.
[0041] 次に、成型金型内に圧延シートを入れて、
Figure imgf000011_0001
170°C、 10分のプレスカロ 硫を施した後、 160°C、 8時間の 2次加硫を経て、総厚み 1. 5mmの金属箔一体導電 シートを得た。
[0041] Next, a rolled sheet is placed in the molding die,
Figure imgf000011_0001
After press-curing at 170 ° C for 10 minutes, it was subjected to secondary vulcanization at 160 ° C for 8 hours to obtain a metal foil integrated conductive sheet with a total thickness of 1.5 mm.
[0042] 次に、金属箔一体導電シートを裁断用のパネルに金属箔面を下側にして固定し、 金属箔の溝位置に合わせて、幅、 1. Omm、長さ、 3. Omm、厚み、 1. 6mmに裁断 刃で切断した。こうして得られた金属箔一体導電ゴム 10の上下面にテスターをあて、 測定電流 100mAにおける抵抗値を測定したところ、 3. 1 Ω 'cmであった。図 6は金 属箔一体導電ゴム 10の斜視図であり、 11は金属箔、 12はエッチングにより形成され た溝部、 13は導電性ゴムである。  [0042] Next, the metal foil integrated conductive sheet is fixed to the panel for cutting with the metal foil surface facing down, and the width, 1. Omm, length, 3. Omm, A thickness of 1.6 mm was cut with a cutting blade. A resistance was measured at a measurement current of 100 mA by applying testers to the upper and lower surfaces of the metal foil-integrated conductive rubber 10 thus obtained and found to be 3.1 Ω′cm. FIG. 6 is a perspective view of the metal foil integrated conductive rubber 10, 11 is a metal foil, 12 is a groove formed by etching, and 13 is a conductive rubber.
[0043] 次に図 4Cと同様に、裁断により金属箔部に発生した返りバリの高さを測定したとこ ろ最大 0. 005mmであった。金属箔の切断面に発生したかえりバリは金属箔の面よ り低ぐプリント基板にリフロー半田付けを行なったところ、金属箔一体導電ゴムの金 属箔の「かえりバリ」や「ギザギザ」は微小である為、金属箔面をプリント基板上に正確 に配置することができ、リフロー半田付けで部品の浮き上がり、傾きの発生が無ぐ金 属箔一体導電ゴムは基板上に充分なハンダ接合強度が得られた。  Next, as in FIG. 4C, the height of the return burr generated in the metal foil portion by cutting was measured, and the maximum was 0.005 mm. When the burr generated on the cut surface of the metal foil is reflow soldered to the printed circuit board, which is lower than the surface of the metal foil, the metal burr of the metal foil-integrated conductive rubber is very small. Therefore, the metal foil surface can be accurately placed on the printed circuit board, the parts are lifted by reflow soldering, and the metal foil integrated conductive rubber that does not generate tilt has sufficient solder joint strength on the circuit board. Obtained.
産業上の利用分野  Industrial application fields
[0044] 本発明の金属箔一体導電ゴムは、例えば携帯電話機、携帯端末、ノ ソコンなどの 電気機器内部の導電性接点部品に適用でき、特にプリント基板とシールドケースの 電気的な接続や基板と導電性皮膜が施されている携帯電話フレーム内面と基板との 電気的接続に有用である。  [0044] The metal foil-integrated conductive rubber of the present invention can be applied to conductive contact parts inside electrical equipment such as a mobile phone, a mobile terminal, and a personal computer, and in particular, electrical connection between a printed board and a shield case, It is useful for electrical connection between the inner surface of a cellular phone frame with a conductive coating and the substrate.

Claims

請求の範囲 The scope of the claims
[1] 導電ゴムの少なくとも一面に金属箔が一体化されている金属箔一体導電ゴムであ つて、  [1] A metal foil integrated conductive rubber in which a metal foil is integrated on at least one surface of the conductive rubber,
周囲は裁断によって切断されており、  The surroundings are cut by cutting,
前記金属箔の導電ゴム側とは反対の面の少なくとも一部又は全部の周囲は中央部 より導電ゴム側に向かって薄く形成されていることを特徴とする金属箔一体導電ゴム  The metal foil-integrated conductive rubber, characterized in that at least part or all of the periphery of the surface opposite to the conductive rubber side of the metal foil is formed thinner from the center toward the conductive rubber side
[2] 前記金属箔一体導電ゴムの金属箔の外周部のバリの高さは 0. 02mm未満である 請求項 1に記載の金属箔一体導電ゴム。 2. The metal foil integrated conductive rubber according to claim 1, wherein the height of burrs at the outer peripheral portion of the metal foil of the metal foil integrated conductive rubber is less than 0.02 mm.
[3] 前記導電ゴムの体積固有抵抗は 10ΚΩ 'cm以下である請求項 1に記載の金属箔 一体導電ゴム。 [3] The conductive rubber integrated with metal foil according to claim 1, wherein the conductive rubber has a volume resistivity of 10ΚΩ'cm or less.
[4] 前記金属箔の切断面の周辺端部の薄く形成されて!、る部分はハーフエッチングに より形成されて!ヽる請求項 1に記載の金属箔一体導電ゴム。  [4] The metal foil-integrated conductive rubber according to [1], wherein the peripheral portion of the cut surface of the metal foil is thinly formed and the portion is formed by half etching.
[5] 前記ハーフエッチングは、深さ 0. 02mm以上、幅 0. 05mm以上である請求項 4に 記載の金属箔一体導電ゴム。 5. The metal foil integrated conductive rubber according to claim 4, wherein the half etching has a depth of 0.02 mm or more and a width of 0.05 mm or more.
[6] 前記金属箔は、厚さが 0. 5mm以下である請求項 1に記載の金属箔一体導電ゴム 6. The metal foil integrated conductive rubber according to claim 1, wherein the metal foil has a thickness of 0.5 mm or less.
[7] 前記金属箔は、銅、アルミニウム、鉄、ステンレス、ニッケル、錫、チタン、金、銀及 びこれらの少なくとも一部を含む合金力 選ばれる金属を展延したものである請求項 1に記載の金属箔一体導電ゴム。 [7] The metal foil according to claim 1, wherein the metal foil is obtained by spreading copper, aluminum, iron, stainless steel, nickel, tin, titanium, gold, silver, and an alloy force including at least a part of these metals. Metal foil integrated conductive rubber.
[8] 前記金属箔は、榭脂又は金属に銅、アルミニウム、鉄、ステンレス、ニッケル、錫、チ タン、金、銀及びこれらの少なくとも一部を含む合金をメツキまたは蒸着して金属薄膜 層を形成したものである請求項 1に記載の金属箔一体導電ゴム。  [8] The metal foil is formed by depositing or evaporating a resin or metal with copper, aluminum, iron, stainless steel, nickel, tin, titanium, gold, silver and an alloy containing at least a part thereof to form a metal thin film layer. The metal foil-integrated conductive rubber according to claim 1, wherein the conductive rubber is formed.
[9] 前記導電ゴムは、ブタジエン重合物(BR)、ブタジエン 'スチレン共重合物(SBR)、 ブタジエン.アクリロニトリル共重合物(NBR)、イソプレン重合物(IR)、クロ口プレン重 合物(CR)、イソブチレン'ジェン共重合物(IIR)、エチレン 'プロピレン共重合物(EP M)、エチレン 'プロピレン三元重合物(EPDM)、クロロスルフォン化ポリエチレン(C SM)、アルキレン'スルフォイド重合物(T)、アルキル'シロキサン縮合物(Si)、フッ 化ビ-リデン '六フッ化プロピレン共重合物(FPM)、ポリエステル 'イソシァネート縮 合物、ポリエーテル 'イソシァネート縮合物(U)、及びアクリル酸エステル重合物 (AC M/ANM)カゝら選ばれる少なくとも一つの有機合成ゴム請求項 1に記載の金属箔ー 体導電ゴム。 [9] The conductive rubber is composed of a butadiene polymer (BR), a butadiene styrene copolymer (SBR), a butadiene-acrylonitrile copolymer (NBR), an isoprene polymer (IR), a black-prene polymer (CR). ), Isobutylene 'gen copolymer (IIR), ethylene' propylene copolymer (EP M), ethylene 'propylene terpolymer (EPDM), chlorosulfonated polyethylene (CSM), alkylene' sulfide polymer (T ), Alkyl 'siloxane condensate (Si), Biridene fluoride 'propylene hexafluoride copolymer (FPM), polyester' isocyanate condensate, polyether 'isocyanate condensate (U), and acrylate polymer (AC M / ANM) The metal foil-based conductive rubber according to claim 1, wherein at least one organic synthetic rubber.
[10] 前記導電ゴムには、カーボン、銅、銅合金、アルミニウム、アルミニウム合金、鉄、ス テンレス、ニッケル、錫、チタン、金、銀、及び表面に金属薄膜層を形成した導電性の 粉体から選ばれる少なくとも一つの有機合成ゴム請求項 1に記載の金属箔一体導電 ゴム。  [10] The conductive rubber includes carbon, copper, copper alloy, aluminum, aluminum alloy, iron, stainless steel, nickel, tin, titanium, gold, silver, and conductive powder having a metal thin film layer formed on the surface. 2. The metal foil integrated conductive rubber according to claim 1, wherein at least one organic synthetic rubber selected from the group consisting of:
[11] 請求項 1〜10のいずれかに記載の金属箔一体導電ゴムの製造方法であって、 金属箔シートの一方の面の裁断線を含む位置にエッチング加工により溝を形成し ておき、前記金属箔シートの他方の面に導電ゴムシートを一体ィ匕成形し、金属箔シ 一トー体導電ゴムシートを形成し、  [11] The method for producing a metal foil integrated conductive rubber according to any one of claims 1 to 10, wherein a groove is formed by etching at a position including a cutting line on one surface of the metal foil sheet, A conductive rubber sheet is integrally formed on the other surface of the metal foil sheet to form a metal foil sheet body conductive rubber sheet,
前記金属箔シートの溝に沿って裁断刃によって前記シートを切断することを特徴と する金属箔一体導電ゴムの製造方法。  A method for producing a metal foil-integrated conductive rubber, wherein the sheet is cut by a cutting blade along a groove of the metal foil sheet.
[12] 前記導電ゴムは、未加硫シリコーンゴムに導電性粉末を混合し、さらに加硫剤をカロ えて混練りした導電性ゴム配合物カゝらなるコンパゥンドから加硫成形されシート状に 形成されている請求項 10に記載の金属箔一体導電ゴムの製造方法。 [12] The conductive rubber is formed into a sheet shape by vulcanization molding from a compound comprising a conductive rubber compounded mixture obtained by mixing conductive powder with unvulcanized silicone rubber and further kneading and kneading the vulcanizing agent. The method for producing a metal foil-integrated conductive rubber according to claim 10.
[13] 前記金属箔シートの周囲はハーフエッチング加工により溝を形成した後、表面に電 解金メッキを施して半田付け可能に形成されている請求項 10に記載の金属箔一体 導電ゴムの製造方法。 13. The method for producing a metal foil-integrated conductive rubber according to claim 10, wherein the periphery of the metal foil sheet is formed so as to be solderable by forming a groove by half-etching and then performing electrolytic plating on the surface. .
[14] 前記金属箔シートの溝加工を施して 、な 、面には、導電ゴムシートを一体成形する ためにカップリング剤による表面活性ィ匕処理を施す請求項 10に記載の金属箔一体 導電ゴムの製造方法。  [14] The metal foil integrated conductive film according to [10], wherein the surface of the metal foil sheet is subjected to a surface activation treatment with a coupling agent in order to integrally form a conductive rubber sheet. Rubber production method.
[15] 前記金属箔シートに導電ゴムシートを一体ィヒする方法が、  [15] A method of integrating a conductive rubber sheet with the metal foil sheet,
A.導電ゴムを薄く圧延してシート状にし、前記金属箔シートの表面活性化処理面に 重ねた後、  A. After thinly rolling the conductive rubber into a sheet shape and stacking on the surface activation treatment surface of the metal foil sheet,
B.圧延 2本ロールでさらに所定の厚みに圧延し、層間の空気を抜き去り、相互を十 分密着させ圧延シートとした後、 C.成型金型内に前記圧延シートを入れ、加圧、加熱して導電性ゴムシートを 1次加 硫した後、 2次加硫し、導電性ゴムシートと金属箔シートを一体化したシートを成形す る方法である請求項 10に記載の金属箔一体導電ゴムの製造方法。 B. Rolling After rolling to a predetermined thickness with two rolls, removing the air between the layers, making the rolled sheets sufficiently close to each other, C. A sheet in which the rolled sheet is placed in a molding die, pressurized and heated to first vulcanize the conductive rubber sheet, and then secondarily vulcanized to integrate the conductive rubber sheet and the metal foil sheet. 11. The method for producing a metal foil-integrated conductive rubber according to claim 10, wherein the method is a method of forming a metal foil.
前記裁断刃による切断が、前記金属箔シート一体導電ゴムシートを裁断用のパネ ルに固定し、金属箔シートの溝位置に合わせて、裁断刃を用いて導電ゴム側から切 断することにより、前記金属箔シートの導電ゴム側とは反対の面の少なくとも一部又 は全部の周囲を中央部より導電ゴム側に向力つて薄く形成する請求項 10に記載の 金属箔一体導電ゴムの製造方法。  Cutting with the cutting blade is performed by fixing the metal foil sheet-integrated conductive rubber sheet to the panel for cutting, and cutting from the conductive rubber side using the cutting blade in accordance with the groove position of the metal foil sheet. 11. The method for producing a metal foil-integrated conductive rubber according to claim 10, wherein at least part or all of the periphery of the surface opposite to the conductive rubber side of the metal foil sheet is formed thin from the center toward the conductive rubber side. .
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WO2019230736A1 (en) * 2018-05-29 2019-12-05 積水ポリマテック株式会社 Metal contact member and rubber switch member
CN112259386A (en) * 2020-09-30 2021-01-22 南通万德科技有限公司 Rubber and metal composite electric contact and preparation method thereof
CN113512369A (en) * 2021-06-07 2021-10-19 深圳先进电子材料国际创新研究院 Composite material of metal foil layer and conductive silica gel, preparation method thereof and application in SMT (surface mounting technology)

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WO2019230736A1 (en) * 2018-05-29 2019-12-05 積水ポリマテック株式会社 Metal contact member and rubber switch member
CN112259386A (en) * 2020-09-30 2021-01-22 南通万德科技有限公司 Rubber and metal composite electric contact and preparation method thereof
WO2022068636A1 (en) * 2020-09-30 2022-04-07 南通万德科技有限公司 Rubber and metal composite electric contact and preparation method therefor
CN112259386B (en) * 2020-09-30 2023-09-08 南通万德科技有限公司 Rubber and metal composite electric contact and preparation method thereof
CN113512369A (en) * 2021-06-07 2021-10-19 深圳先进电子材料国际创新研究院 Composite material of metal foil layer and conductive silica gel, preparation method thereof and application in SMT (surface mounting technology)

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