KR101295822B1 - Method of manufacturing smt type electrical contacts - Google Patents
Method of manufacturing smt type electrical contacts Download PDFInfo
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- KR101295822B1 KR101295822B1 KR1020130042321A KR20130042321A KR101295822B1 KR 101295822 B1 KR101295822 B1 KR 101295822B1 KR 1020130042321 A KR1020130042321 A KR 1020130042321A KR 20130042321 A KR20130042321 A KR 20130042321A KR 101295822 B1 KR101295822 B1 KR 101295822B1
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- silicon sheet
- silicon
- metal foil
- electrical contact
- manufacturing
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- 238000004519 manufacturing process Methods 0.000 title claims abstract description 21
- 239000010703 silicon Substances 0.000 claims abstract description 90
- 229910052710 silicon Inorganic materials 0.000 claims abstract description 90
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims abstract description 89
- 238000000034 method Methods 0.000 claims abstract description 22
- 238000005530 etching Methods 0.000 claims abstract description 3
- 229910052751 metal Inorganic materials 0.000 claims description 79
- 239000002184 metal Substances 0.000 claims description 79
- 239000011888 foil Substances 0.000 claims description 61
- 239000000843 powder Substances 0.000 claims description 17
- 239000003795 chemical substances by application Substances 0.000 claims description 15
- 239000000463 material Substances 0.000 claims description 12
- 229920001187 thermosetting polymer Polymers 0.000 claims description 9
- 238000003756 stirring Methods 0.000 claims description 8
- 238000005520 cutting process Methods 0.000 claims description 5
- 238000010030 laminating Methods 0.000 claims description 5
- 229920001296 polysiloxane Polymers 0.000 claims description 4
- 238000003825 pressing Methods 0.000 claims description 4
- 239000011248 coating agent Substances 0.000 abstract description 3
- 238000000576 coating method Methods 0.000 abstract description 3
- 239000007788 liquid Substances 0.000 abstract description 2
- 239000000853 adhesive Substances 0.000 description 11
- 230000001070 adhesive effect Effects 0.000 description 11
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 8
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 8
- 239000000499 gel Substances 0.000 description 8
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 5
- 239000011889 copper foil Substances 0.000 description 4
- 229910052759 nickel Inorganic materials 0.000 description 4
- 229910000640 Fe alloy Inorganic materials 0.000 description 3
- 229920001971 elastomer Polymers 0.000 description 3
- 239000000835 fiber Substances 0.000 description 3
- 238000004806 packaging method and process Methods 0.000 description 3
- 229920002379 silicone rubber Polymers 0.000 description 3
- 239000004945 silicone rubber Substances 0.000 description 3
- 238000005476 soldering Methods 0.000 description 3
- 238000001179 sorption measurement Methods 0.000 description 3
- 229910000881 Cu alloy Inorganic materials 0.000 description 2
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 2
- 229910001128 Sn alloy Inorganic materials 0.000 description 2
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 230000007547 defect Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000000806 elastomer Substances 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 229910052709 silver Inorganic materials 0.000 description 2
- 239000004332 silver Substances 0.000 description 2
- 239000011135 tin Substances 0.000 description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- 229910000990 Ni alloy Inorganic materials 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- 239000012790 adhesive layer Substances 0.000 description 1
- DMFGNRRURHSENX-UHFFFAOYSA-N beryllium copper Chemical compound [Be].[Cu] DMFGNRRURHSENX-UHFFFAOYSA-N 0.000 description 1
- 230000006835 compression Effects 0.000 description 1
- 238000007906 compression Methods 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000001125 extrusion Methods 0.000 description 1
- 229910002804 graphite Inorganic materials 0.000 description 1
- 239000010439 graphite Substances 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 235000015110 jellies Nutrition 0.000 description 1
- 239000008274 jelly Substances 0.000 description 1
- 239000007791 liquid phase Substances 0.000 description 1
- 238000011068 loading method Methods 0.000 description 1
- 230000001050 lubricating effect Effects 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 238000012856 packing Methods 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 150000003071 polychlorinated biphenyls Chemical class 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 238000007652 sheet-forming process Methods 0.000 description 1
- SBEQWOXEGHQIMW-UHFFFAOYSA-N silicon Chemical compound [Si].[Si] SBEQWOXEGHQIMW-UHFFFAOYSA-N 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 229910052718 tin Inorganic materials 0.000 description 1
Images
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R43/00—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
- H01R43/16—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for manufacturing contact members, e.g. by punching and by bending
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
- H01R12/50—Fixed connections
- H01R12/51—Fixed connections for rigid printed circuits or like structures
- H01R12/55—Fixed connections for rigid printed circuits or like structures characterised by the terminals
- H01R12/57—Fixed connections for rigid printed circuits or like structures characterised by the terminals surface mounting terminals
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/02—Contact members
- H01R13/03—Contact members characterised by the material, e.g. plating, or coating materials
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/02—Contact members
- H01R13/22—Contacts for co-operating by abutting
- H01R13/24—Contacts for co-operating by abutting resilient; resiliently-mounted
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Laminated Bodies (AREA)
Abstract
Description
본 발명은 표면실장형 전기접촉단자 제조방법에 관한 것으로서, 더욱 상세하게는 표면실장기술(SMT) 머신에서 소형화된 전기접촉단자를 회로기판(PCB)에 효과적으로 올려놓기 위하여 내열성, 전기전도성 및 완충성을 갖도록 실리콘을 얇은 시트 형태로 제작한 뒤 실리콘시트의 상,하면에 같은 재질의 금속박을 포개고, 가열 및 압착하여 별도의 접착제 없이 실리콘시트와 금속박들을 결합하여, 이를 원하는 크기로 절단한 뒤 SMT 머신에 사용되는 테이프앤릴(tape-and-reel)에 상,하 구분없이 포장함으로써, 제조가 편리하고, 상하구분에 따른 표면실장 불량이 발생되지 않는 표면실장형 전기접촉단자 제조방법에 관한 것이다.The present invention relates to a method of manufacturing a surface-mount type electrical contact terminal, and more particularly, in order to effectively mount a miniaturized electrical contact terminal on a circuit board (PCB) in a surface mount technology (SMT) machine. After the silicon sheet is made into a thin sheet form, the metal foil of the same material is stacked on the upper and lower surfaces of the silicon sheet, heated and pressed to combine the silicon sheet and the metal foil without a separate adhesive, and then cut to a desired size and then SMT machine The present invention relates to a method of manufacturing a surface mount type electrical contact terminal in which a tape-and-reel is used for packaging without distinguishing the upper and lower parts, and thus the manufacturing is convenient and surface mounting defects are not generated according to the upper and lower divisions.
일반적으로 전기접촉단자는 EMI(electromagnetic interference)개스킷 용도로 많이 사용된다. 전기접촉단자는 소형화된 휴대기기에서 인쇄 회로 기판(PCB)의 그라운드 트레이스 등의 전기적인 접지에 해당하는 부분으로 이루어진 전기 전도성 실드를 전기적으로 접촉시키는데 사용되는 전도성 인터페이스 재료이다. 최근에는 전기접촉단자를 SMT 머신에서 다른 회로부품들과 함께 PCB 상의 표면 실장 부분에 장착하는 추세이다. 이러한 기술은 국내특허 제680015호에 개시된 바 있다.In general, electrical contact terminals are widely used for electromagnetic interference (EMI) gaskets. The electrical contact terminal is a conductive interface material used to electrically contact an electrically conductive shield made of a portion corresponding to an electrical ground such as a ground trace of a printed circuit board (PCB) in a miniaturized portable device. Recently, electrical contact terminals have been mounted in surface mount parts on PCBs along with other circuit components in SMT machines. This technique has been disclosed in Korean Patent No. 680015.
SMT 머신은 표면실장부품(SMD)을 공급하는 부품공급기(Feeder)와, 표면실장부품(SMD)을 흡착하는 진공흡착장치와, 상기 진공흡착장치를 상하, 좌우로 이동시키는 이동수단과, 상기 진공흡착장치와 이동수단을 통해 이동하는 표면실장부품(SMD)의 위치 및 방향을 확인하고, 체크한 후 교정하는 비젼(Vision)으로 이루어진다. 상기 부품공급기에는 테이프앤릴(tape-and-reel)이 사용되는데, 테이프앤릴은 부품을 정렬하여 진공흡착장치의 진공헤드가 전기접촉단자를 정확하게 픽업할 수 있도록 해주는 부분이다.The SMT machine includes a component feeder for supplying a surface mount component (SMD), a vacuum adsorption device for adsorbing the surface mount component (SMD), moving means for moving the vacuum absorption device up and down, left and right, and the vacuum It consists of a vision (Vision) to check, check and correct the position and direction of the surface-mounted component (SMD) moving through the adsorption device and the moving means. A tape-and-reel is used for the component feeder. The tape-and-reel is a portion that aligns the components so that the vacuum head of the vacuum adsorption device can pick up the electrical contact terminals accurately.
진공픽업된 전기접촉단자는 인쇄회로기판의 납땜위치에 정확하게 놓이는데, 이후 리플로우(Reflow)납땜 장비에서 230℃ 내지 290℃에 이르는 고온에서도 물성변화가 없어야 하며, 더욱이 탄성을 잃지 않아야 하고, 납땜이 용이하게 이루어질 수 있어야 하는 등 매우 까다로운 조건들이 요구된다. The vacuum picked-up electrical contact terminals are placed precisely at the soldering position of the printed circuit board. Afterwards, the reflow soldering equipment should have no change in physical properties even at high temperatures ranging from 230 ° C to 290 ° C. Very demanding conditions are required such that this can be done easily.
종래 구조에 따른 전기접촉단자는 상기한 조건을 충족하기 위해 탄성이 좋은 금속 예를 들어, 베릴륨 동 포일이나 스테인레스 포일, 동 포일 등을 일정 폭으로 절단하고 프레스 금형으로 타발하여 탄성이 있는 형태로 가공한 후 열처리를 통해 탄성효과를 향상시킴으로써, 인쇄회로기판에 실장하여 전기를 도전하는 구조로 되어 있다.The electrical contact terminal according to the conventional structure is cut to a certain width, such as beryllium copper foil, stainless foil, copper foil, etc. in order to satisfy the above conditions, and cut into a press mold and processed into an elastic form. Then, by improving the elastic effect through heat treatment, the structure is mounted on a printed circuit board to conduct electricity.
그런데 상기한 바와 같은 종래의 전기접촉단자는 전체가 금속으로 이루어 짐으로서 공차관리가 필요하고, 이에 따라 제조상의 어려움이 많았다. 또한 항복강도 이상 압력을 가할 경우 탄성의 효과가 저하될 뿐 아니라, 고가의 인발 또는 압출 금형비가 필요하며, 절단하기가 어려워 사용자가 자유롭게 필요한 길이로 절단하여 사용할 수 없는 문제점이 있었다. 따라서, 이러한 문제점을 개선하기 위하여 종래에는 전체가 전도성인 실리콘 고무 또는 표면만 전도성 고무를 코팅 한 전도성 실리콘 고무의 밑면에 납땜이 가능한 동박을 부착하여 전자회로기판에 실장하는 구조가 개발되었다.By the way, the conventional electrical contact terminal as described above is made of a metal as a whole, the tolerance management is required, accordingly a lot of manufacturing difficulties. In addition, the application of pressure above the yield strength not only decreases the effect of elasticity, but also requires expensive drawing or extrusion mold costs, and it is difficult to cut, so that the user cannot freely cut and use the required length. Therefore, in order to solve this problem, a structure in which a solderable copper foil is attached to a bottom surface of a conductive silicone rubber, which is entirely conductive, or a conductive silicone rubber coated only with a conductive rubber, is mounted on an electronic circuit board.
그러나, 상기한 종래의 전기전도성 전기접촉단자는 금속박과 탄성체 간의 접착을 위하여 별도의 전기전도성 접착제를 사용하여야 하기 때문에 전체적으로 전기저항이 저하되는 문제가 있을 뿐 아니라, 납땜시 고온분위기에서 표면에 돌출되어 있는 금속파우더의 산화 혹은 탄성체인 실리콘 고무의 팽창으로 인하여 전기저항이 저하되는 경시변화 문제도 발생하고 있다. 또한, 전자회로기판에 납땜하기 위하여, 종래의 전기접촉단자는 밑면에 별도의 접착제를 사용하여 동박을 부착해야 하는 부가적인 공정이 있게 되며, 여러 공정을 거치게 되므로 가격이 고가인 단점이 있다.However, since the conventional electrically conductive electrical contact terminals have to use a separate electrically conductive adhesive for adhesion between the metal foil and the elastic body, there is a problem that the overall electrical resistance is lowered and protrudes from the high temperature atmosphere at the time of soldering. Due to the oxidation of the metal powder or the expansion of the silicone rubber, which is an elastic body, there is a problem of change over time, in which the electrical resistance is lowered. In addition, in order to solder to an electronic circuit board, the conventional electrical contact terminal has an additional process to attach the copper foil using a separate adhesive on the bottom, there is a disadvantage that the price is expensive because it goes through several processes.
또한 탄성체를 감싸는 금속박의 형태로 제조되는 방식이 다수 제안된 바 있으나, 두께 및 폭을 줄일 수 없으므로 제품을 소형화하기 어려운 실정이다.In addition, although many methods have been proposed in the form of a metal foil surrounding the elastic body, it is difficult to miniaturize the product because the thickness and width cannot be reduced.
상기한 종래의 문제점들을 인식하고 이를 해결하기 위해 본 발명자는 국내특허 제1052948호를 제시한 바 있다. 이 특허는 전기전도성 탄성체의 상하면에 전기도전성 섬유 혹은 금속박을 별도의 접착제 없이 부착하는 공정으로 제조되는데, 액상 또는 겔 상태로 구성하여 상기 전기 전도성 섬유와 금속박을 상하면에 접착제 층이 없이 직접 부착 후 일시에 경화시켜서 얻어진 것이다. 또한 전기전도성 탄성체는 전기전도성을 발현하기 위해 내열성폴리머에 금속분말이 포함된다.In order to recognize and solve the above-mentioned conventional problems, the present inventor has proposed Korean Patent No. 1052948. This patent is a process of attaching an electrically conductive fiber or a metal foil to the upper and lower surfaces of an electrically conductive elastomer without a separate adhesive. The composition is formed in a liquid or gel state and is temporarily attached after directly attaching the electrically conductive fibers and the metal foil to the upper and lower surfaces without an adhesive layer. It is obtained by hardening at. In addition, the electrically conductive elastomer includes a metal powder in the heat resistant polymer to express the electrical conductivity.
그러나 상기 본 발명자의 특허는 탄성체의 상하면에 재질이 서로 다른 금속박과 도전성 섬유가 부착되므로 SMT 머신의 표면실장과정에서 상하면이 바뀌면 실장불량이 발생될 우려가 있었다. 또한 탄성체를 금속박에 직접 코팅하는 방법으로 전기접촉단자를 제조함으로 탄성체의 두께를 일정하게 유지시키는데 어려움이 있었다.However, the inventors of the present invention, because the metal foil and the conductive fiber of different materials are attached to the upper and lower surfaces of the elastic body there is a fear that the mounting failure occurs when the upper and lower sides are changed during the surface mounting process of the SMT machine. In addition, there is a difficulty in maintaining a constant thickness of the elastic body by manufacturing an electrical contact terminal by coating the elastic body directly on the metal foil.
본 발명은 종래의 문제점들을 개선하고, 특히 본 발명자의 특허를 구체화한 것으로서, 본 발명의 목적은 젤리 상의 실리콘에 가류제(加硫劑) 및 금속분말을 차례로 투입하고 일정시간 교반하면 실리콘시트를 만들 수 있다는 점에 착안한 것이다. 본 발명의 목적은 젤 상의 실리콘에 가류제 및 금속분말을 혼합하여 실리콘시트를 제작한 뒤, 실리콘시트의 상하면에 같은 재질의 금속박을 적층하여 금형에 내장하고 열프레스하여 완전경화된 실리콘시트를 제작한 후, 규격화된 크기로 절단하여 전기접촉단자를 대량으로 양산할 수 있는 표면실장형 전기접촉단자 제조방법을 제공함에 있다.The present invention improves the conventional problems, and in particular, embodies the patent of the present inventors, an object of the present invention is to add a vulcanizing agent and a metal powder to the silicon on the jelly in turn and stirring the silicon sheet for a certain time The idea is to make it. An object of the present invention is to produce a silicon sheet by mixing a vulcanizing agent and a metal powder in the silicon on the gel, then laminating metal foil of the same material on the upper and lower surfaces of the silicon sheet in a mold and heat press to produce a fully cured silicon sheet After that, the present invention provides a surface-mounted electrical contact terminal manufacturing method capable of mass-producing electrical contact terminals by cutting to a standardized size.
본 발명의 다른 목적은 금속박에 실리콘을 코팅하면 두께를 일정하게 맞춰야 되는 어려움이 있으나, 본 발명은 실리콘을 두개의 롤러 사이로 통과시켜 균일한 두께의 실리콘시트를 제작하고, 다시 금형에 넣어 열경화시킴으로써, 두께가 일정하고 규격화된 전기접촉단자를 생산할 수 있는 표면실장형 전기접촉단자 제조방법을 제공함에 있다.Another object of the present invention is that the coating of silicon on the metal foil has a difficulty in adjusting the thickness uniformly, but the present invention is to pass the silicon between the two rollers to produce a silicon sheet of uniform thickness, and then put into a mold and thermoset In addition, the present invention provides a method for manufacturing a surface-mount type electrical contact terminal capable of producing a standardized electrical contact terminal with a constant thickness.
본 발명의 또 다른 목적은 실리콘시트의 상하면에 같은 재질의 금속박을 적재하고 가열 및 압착하면 별도의 접착제 없이 층분리되지 않은 상태의 전기접촉단자를 제조할 수 있으므로 생산성이 우수하고, 또한 SMT 머신의 테이프앤릴에 전기접촉단자를 포장할 때 상하 구분없이 포장할 수 있으므로 포장시간이 단축되며, 인쇄회로기판에서 상하면이 뒤바뀌는 표면실장 불량이 발생되지 않는 표면실장형 전기접촉단자 제조방법을 제공함에 있다.Still another object of the present invention is to provide a high productivity, since it is possible to manufacture a non-layered electrical contact terminal without a separate adhesive by loading a metal foil of the same material on the upper and lower surfaces of the silicon sheet without any adhesive. When packaging the electrical contact terminal in the tape and reel can be packaged without the upper and lower division packaging time is shortened, to provide a surface-mount type electrical contact terminal manufacturing method that does not cause a surface mount failure that the upper and lower sides are reversed in the printed circuit board.
이를 위하여 본 발명은 젤 상의 실리콘에 가류제 및 금속분말을 순차적으로 투입 교반하고, 상기 교반된 실리콘을 두개의 롤러 사이로 통과시켜 균일한 두께를 갖는 실리콘시트로 만드는 공정; 같은 재질의 금속박 두개를 준비한 뒤, 한 개를 금형 내에 넣고 그 위에 상기 실리콘시트와 나머지 금속박을 순차적으로 적층하는 공정; 적층된 금속박과 실리콘시트를 열프레스 하여 상기 실리콘시트의 상하면에 금속박이 열경화 접착되도록 하는 공정; 그리고 열경화된 금속박과 실리콘시트를 규격화된 크기로 절단하는 공정들로 이루어진 특징이 있다.To this end, the present invention is a step of sequentially adding and stirring the vulcanizing agent and the metal powder to the silicon on the gel, and passing the stirred silicon between two rollers to make a silicon sheet having a uniform thickness; Preparing two metal foils of the same material, putting one into a mold, and sequentially laminating the silicon sheet and the remaining metal foil on it; Heat-pressing the laminated metal foil and the silicon sheet so that the metal foil is thermoset bonded to the upper and lower surfaces of the silicon sheet; And it is characterized by the process of cutting the thermosetting metal foil and silicon sheet to a standardized size.
본 발명에 따르면 젤 상의 실리콘에 가류제를 일정비율 투입하고 일정시간 교반하면 탄성을 가지게 된다. 여기에 금속분말을 정량 투입하고 계속 교반하면 전기전도성이 부여되는데, 이후 두개의 롤러 사이로 교반된 실리콘을 통과시키면 상,하롤러 사이의 간극만큼 두께를 갖는 실리콘시트가 완성된다.According to the present invention, a certain amount of vulcanizing agent is added to the silicone on the gel and stirred for a certain time to have elasticity. When the metal powder is added to the metering solution and continuously stirred, electrical conductivity is given. Then, when the silicon is passed between the two rollers, a silicon sheet having a thickness equal to the gap between the upper and lower rollers is completed.
두 롤러 사이의 간격에 따라 실리콘시트의 두께를 약 1mm 이내로 균일하게 제작할 수 있다. 실리콘시트가 완성되면 금속박을 실리콘시트의 상하면에 적층하고 이들 적층물을 금형 내부에 투입한다. 바람직하게는 금형의 바닥에 금속박을 깔고 그 위에 실리콘시트를 올려놓은 뒤 다른 금속박을 실리콘시트의 상면에 적층한다. 그리고 열프레스(Hot Press)를 작동시켜 실리콘시트와 금속박의 적층물을 가열 및 압착하여 실리콘시트가 열경화되는 과정에서 금속박과 실리콘시트가 별도의 접착제 없이 접착되어 층분리되지 않는다.The thickness of the silicon sheet can be uniformly produced within about 1 mm according to the distance between the two rollers. When the silicon sheet is completed, the metal foil is laminated on the upper and lower surfaces of the silicon sheet and these laminates are put into the mold. Preferably, the metal foil is laid on the bottom of the mold and the silicon sheet is placed thereon, and then another metal foil is laminated on the upper surface of the silicon sheet. In addition, the metal foil and the silicon sheet are bonded without a separate adhesive and are not separated from each other in the process of heating and compressing the laminate of the silicon sheet and the metal foil by operating a hot press to heat-press the silicon sheet.
열프레스공정이 끝나면 실리콘시트와 금속박의 적층물을 규격화된 크기로 절단하고 금속박의 표면을 도금하여 전도성 및 납땜성을 개선하면 전기접촉단자가 완성된다. 본 발명 한 실시예의 전기접촉단자는 탄성을 갖는 실리콘시트가 금속박의 표면에 액상으로 코팅되지 않으므로 제조공정이 간단하고, 또한 실리콘시트를 두 롤러 사이로 통과시켜 두께를 균일하게 맞출 수 있으며, 도전성 실리콘시트 상하면을 금속박과 일체화시킴으로써 전기접촉저항을 일정하게 유지시킬 수 있다.After the heat press process, the laminate of the silicon sheet and the metal foil is cut to a standard size and the surface of the metal foil is plated to improve the conductivity and solderability, thereby completing the electrical contact terminal. The electrical contact terminal of the embodiment of the present invention is simple because the silicon sheet having elasticity is not coated in the liquid phase on the surface of the metal foil, the manufacturing process is simple, and the thickness can be uniformly matched by passing the silicon sheet between the two rollers, conductive silicon sheet By integrating the upper and lower surfaces with the metal foil, the electrical contact resistance can be kept constant.
그리고 실리콘시트의 상하면에 같은 재질의 금속박이 적층되기 때문에 상하 구분이 없으므로 SMT 머신에 사용되는 테이프앤릴에 수납 포장할 때 편리하고 인쇄회로기판에서 표면실장될 때 상하구분에 따른 표면실장 불량이 발생되지 않는 등의 이점이 있다.And since the metal sheet of the same material is laminated on the upper and lower sides of the silicon sheet, there is no upper and lower division, so it is convenient for storing and packing on tape and reel used in SMT machines, and when mounting the surface on a printed circuit board, surface mounting defects are not generated according to the upper and lower divisions. There are advantages such as not.
도 1은 본 발명 한 실시예의 전기접촉단자 제조방법을 나타낸 공정도
도 2는 본 발명 한 실시예의 전기접촉단자 단면도1 is a process chart showing a method for manufacturing an electrical contact terminal of an embodiment of the present invention
2 is a cross-sectional view of the electrical contact terminal of an embodiment of the present invention
본 발명 한 실시예의 전기접촉단자는 실리콘시트와 금속박으로 구성된다. 실리콘시트(10)는 젤 상의 실리콘을 두개의 롤러 사이로 통과시켜 시트상태로 제작한 것이다.The electrical contact terminal of an embodiment of the present invention is composed of a silicon sheet and a metal foil. The
쇼어경도 30인 젤 상의 실리콘에 가류제를 넣고 니더기(Kneader)에서 교반시킨다. 가류제는 실리콘 전체중량에 대하여 약 2 ∼ 5중량% 사용되며, 상온에서 약 30분 정도 혼합하여 실리콘에 가류제가 골고루 퍼지도록 한다.The vulcanizing agent is added to the silicone on the gel having a Shore hardness of 30 and stirred in a kneader. The vulcanizing agent is used in an amount of about 2 to 5% by weight based on the total weight of the silicone, and mixed at about room temperature for about 30 minutes to evenly spread the vulcanizing agent over the silicon.
교반된 실리콘에 금속분말을 첨가하고 약 40℃ 이하에서 1시간 정도 배합한다. 금속분말은 금속분말, 가류제 및 실리콘이 교반된 젤상의 실리콘시트 전체 중량의 60 ∼ 80중량% 사용되는데, 전기전도 특성에 따라 그 함량은 조정된다. 금속분말은 은, 은 코팅 동, 니켈, 니켈 그라파이트 등에서 선택된 재질로써, 금속분말의 형상은 구형, 비정형을 단독 또는 혼합하여 적용할 수 있다.Metal powder is added to the stirred silicon and blended at about 40 ° C. or less for about 1 hour. The metal powder is used 60 to 80% by weight of the total weight of the metal powder, the vulcanizing agent and the silicon-silicon gel sheet, the content is adjusted according to the electrical conductivity properties. The metal powder is a material selected from silver, silver coated copper, nickel, nickel graphite, and the like, and the shape of the metal powder may be applied alone or in combination of spherical and amorphous forms.
상기 가류제 및 금속분말이 배합된 젤 상의 실리콘을 두개의 롤러 사이로 통과시켜 실리콘시트(10)를 제작한다. 두개의 롤러는 간격이 변하지 않게 고정된 것이므로 이들 사이로 통과된 실리콘시트(10)는 균일한 두께를 갖는다.The
상기 실리콘시트 성형공정에서 만들어진 실리콘시트(10)의 상하면에 금속박(20)을 배치한다. 금속박(20)은 실리콘시트(10)와 접착되는 면을 전처리할 필요가 있다. 금속박(20)의 생산과정에서 윤활 성분의 이형제가 뭍을 수 있으므로 이를 세척한다. 그리고 접착면의 표면을 거칠게 처리하여 표면적을 늘리고 접착성을 개선하고자 접착면을 에칭 처리하여 접착면에 요철(21)이 형성되도록 한다.The
상기 금속박(20)은 전기전도성 재질인데, 납땜이 가능 한 철, 니켈, 주석, 동, 철과 니켈합금, 철과 주석합금, 철과 동 합금 중의 하나로 선택되는 물질로 구성된다. 금속박(20)은 그 두께가 0.005mm ∼ 0.025mm인 것으로서, 바람직하게는 10 ∼ 20㎛의 두께를 갖는다.The
상기 금속박 전처리공정에서 금속박(20)의 접착면을 에칭하지 않고 프라이머처리할 수도 있다. 프라이머는 고형분이 전체중량의 약 5% 정도인데, 실리콘시트(10)와 금속박(20)의 열프레스 접착과정에서 실리콘과 금속박의 접착 친화력을 높여 접착성이 개선되도록 하기 위한 것이다.In the metal foil pretreatment step, the adhesive surface of the
금속박 전처리공정이 끝나면 전처리된 표면이 위로 향하도록 금속박(20)을 금형 내부에 깔고 그 위에 실리콘시트(10)를 올려 놓는다. 그리고 실리콘시트(10)의 표면에 전처리된 표면이 실리콘시트(10)와 접하도록 다른 금속박(20)을 적층한다. 이후 열프레스하는데, 150 ∼ 200℃에서 일정압력으로 1 ∼ 5분 동안 가압하여 실리콘시트(10)를 열경화시킨다.After the metal foil pretreatment process is completed, the
상기 열프레스공정에서 실리콘시트(10)가 열경화되면서 이의 상하면에 금속박(20)이 열접착된다.In the heat press process, the
열접착된 실리콘시트(10)와 금속박(20)을 금형에서 꺼낸 뒤 규격화된 크기의 전기접촉단자 형태로 절단한다. 그리고 절단된 전기접촉단자의 상하면에 놓인 금속박(20)의 표면을 도금한다. 도금은 전해방식으로 주석을, 무전해 방식으로 니켈을 사용하여 금속박(20)의 표면에 처리된다.The heat-bonded
표면에 도금처리된 전기접촉단자는 일정 압력을 가한 상태에서 그 저항값이 약 0.01 내지 0.5Ω이고, 쇼어경도는 약 50 ∼ 70이며, 압축률은 30 ∼ 60%를 갖는다.The plated electrical contact terminal has a resistance value of about 0.01 to 0.5Ω, a Shore hardness of about 50 to 70, and a compression ratio of 30 to 60% under a constant pressure.
10 : 실리콘시트 20 : 금속박
21 : 요철10: silicon sheet 20: metal foil
21: unevenness
Claims (4)
상기 열프레스공정 전에 상기 실리콘시트와 접착되는 금속박의 표면을 에칭처리하여 요철이 형성되도록 하고, 열프레스과정에서 이 요철에 실리콘시트의 실리콘이 스며들어 접착성이 증가되도록 한 것을 특징으로 하는 표면실장형 전기접촉단자 제조방법.Adding and stirring a vulcanizing agent to the silicon on the gel, and then adding and stirring the metal powder, and passing the stirred silicon between two rollers to form a silicon sheet having a uniform thickness; Preparing two metal foils of the same material, putting one into a mold, and sequentially laminating the silicon sheet and the remaining metal foil on it; Heat-pressing the laminated metal foil and the silicon sheet so that the metal foil is thermoset bonded to the upper and lower surfaces of the silicon sheet; And in the manufacturing method of the surface-mount type electrical contact terminal consisting of the steps of cutting the thermoset metal foil and silicon sheet to a standard size,
The surface mounting is characterized by etching the surface of the metal foil adhered to the silicon sheet before the heat press process to form irregularities, and in the heat press process, the silicon of the silicon sheet penetrates into the irregularities to increase the adhesiveness. Type electrical contact terminal manufacturing method.
상기 열프레스공정 전에 상기 실리콘시트와 접착되는 금속박의 표면을 프라이머 처리하여 접착성이 개선되도록 한 것을 특징으로 하는 표면실장형 전기접촉단자 제조방법.Adding and stirring a vulcanizing agent to the silicon on the gel, and then adding and stirring the metal powder, and passing the stirred silicon between two rollers to form a silicon sheet having a uniform thickness; Preparing two metal foils of the same material, putting one into a mold, and sequentially laminating the silicon sheet and the remaining metal foil on it; Heat-pressing the laminated metal foil and the silicon sheet so that the metal foil is thermoset bonded to the upper and lower surfaces of the silicon sheet; And in the manufacturing method of the surface-mount type electrical contact terminal consisting of the steps of cutting the thermoset metal foil and silicon sheet to a standard size,
The method of manufacturing a surface-mounted electrical contact terminal, characterized in that to improve the adhesion to the surface of the metal foil to be bonded to the silicon sheet before the heat press process.
상기 가류제는 실리콘 전체중량에 대하여 2 ∼ 5중량% 사용되며,
상기 금속분말은 금속분말, 가류제 및 실리콘이 교반된 젤상의 실리콘시트 전체 중량의 60 ∼ 80중량% 사용됨을 특징으로 하는 표면실장형 전기접촉단자 제조방법.Adding and stirring a vulcanizing agent to the silicon on the gel, and then adding and stirring the metal powder, and passing the stirred silicon between two rollers to form a silicon sheet having a uniform thickness; Preparing two metal foils of the same material, putting one into a mold, and sequentially laminating the silicon sheet and the remaining metal foil on it; Heat-pressing the laminated metal foil and the silicon sheet so that the metal foil is thermoset bonded to the upper and lower surfaces of the silicon sheet; And in the manufacturing method of the surface-mount type electrical contact terminal consisting of the steps of cutting the thermoset metal foil and silicon sheet to a standard size,
The vulcanizing agent is used 2 to 5% by weight based on the total weight of the silicone,
Wherein the metal powder is a metal powder, vulcanizing agent and silicon is a surface-mount type electrical contact terminal manufacturing method, characterized in that 60 to 80% by weight of the total weight of the gel-silicon sheet stirred.
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| KR20160071153A (en) | 2014-12-11 | 2016-06-21 | 정상희 | Method of manufacturing composition for point of contact and point of contact for keypad |
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| KR101825198B1 (en) * | 2016-11-15 | 2018-02-05 | (주)유에스티 | Method of bonding silicon compound on copper plate |
| CN112235965A (en) * | 2019-07-15 | 2021-01-15 | 卓英社有限公司 | Heat-conducting elastic protection component for Harper |
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| KR20160057008A (en) * | 2014-11-12 | 2016-05-23 | 주식회사 이엔씨테크 | The solderable foil multilayer elastomeric connector manufacturing method |
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| CN112235965A (en) * | 2019-07-15 | 2021-01-15 | 卓英社有限公司 | Heat-conducting elastic protection component for Harper |
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