KR101569091B1 - Low-resistance point of contact and manufacturing method thereof - Google Patents

Abstract

The present invention relates to a low resistance contact point and a manufacturing method thereof. The low resistance contact point according to the present invention obtains low resistance in comparison with an existing carbon contact point inserted into the inside of a button pad which is made of silicon materials by punching and forming a sheeted mixture with an elastic property like rubber by mixing Si, Ni, and Ag and adding a vulcanization agent to the mixture.

Description

BACKGROUND OF THE INVENTION 1. Field of the Invention [0001] The present invention relates to a low-

The present invention relates to a low-resistance contact and a manufacturing method thereof,

More particularly, the present invention relates to a silicone rubber composition which is prepared by mixing silicone (Si), nickel (Ni) and silver and adding a vulcanizing agent thereto to form a sheet- To a low-resistance contact having a lower resistance than that of a conventional carbon contact inserted into the inner side, and a manufacturing method thereof.

The contact point inserted into the inner insertion portion of the button pad is the switching dynamics of the circuit. When the button is pressed, the button pad is pressed down and the contact point is also lowered so that the contact portion of the contact is closely contacted with the circuit board. In this case, the resistance of the contact causes a power loss. The problem of such a power loss does not need to be mentioned. Especially, most of the lost power is discharged as heat, which may cause product damage due to heat. Further, heat generation may cause deformation of the button pad due to the thermoplasticity of the button pad made of a silicone material. Therefore, it is preferable that the contact has a small resistance.

In the prior art relating to such contacts, terminals or conductive materials,

[Prior Art 1] and Registration No. 10-1131749 (Mar. 23, 2012) [Surface Contact Surface Mounting for Board Surface Mounting] [Registered Patent No. 10-1054251 (Jul. 29, 2011) Conductive elastic contact terminals] (Prior Art 2). The prior arts 1 and 2 are characterized by being produced by mixing rubber and electrically conductive metal powder. Wherein the rubber is a crosslinked synthetic rubber, natural rubber and silicone rubber, and the electrically conductive metal powder is silver, gold, copper, nickel, nickel-iron alloy, tin and silver coated copper.

However, in the above-mentioned prior arts 1 and 2, the resilience of the elastic core is recognized, but when the prior arts 1 and 2 are introduced into the contact as in the present invention, the molding of the sheeted product It is difficult to expect a solution of the technical problem that mass production is possible through the use of the core, and further it is similar in terms of providing the core, but it can be seen as other conventional technology, and therefore the structure like the lattice projection of the present invention can not be confirmed.

[0004] Another prior art is disclosed in Japanese Patent Application No. 10-1340171 (December 04, 2013) (a method for producing a conductive material, a conductive material obtained by the method, an electronic device including the conductive material and a light emitting device) (Prior Art 4), and in particular, in the case of the conventional technology 4 (Japanese Patent Application Laid-Open No. 10-2014-0040867, Apr. 03, 2014) (a manufacturing method of a conductive material, a conductive material, and a radiator including a conductive material) A conductive material utilizing carbon fiber or plastic fiber is proposed.

However, as shown in the prior art 4, In the prior art, a contact is made of a carbon compound such as carbon or the like. Generally, the contact through a carbon compound has a resistance of about 20 ohms. This may cause a phenomenon of melting of the contact due to heat generation due to the resistance value when power loss and a large voltage are applied with a considerably large resistance value.

Accordingly, the present invention has been made to solve the above-mentioned problems,

A mixture of silicon (Si), nickel (Ni), and silver is added thereto and a vulcanizing agent is added thereto to form a sheet-shaped mixture having a self-elasticity such as rubber, A method of manufacturing a low-resistance contact having a lower resistance than a carbon contact,

And a circular lattice protrusion is formed on the surface of the contact to increase the frictional force between the contact (the surface of the contact) and the terminal (the surface of the contact), thereby preventing the contact from being detached from the terminal,

In addition, the present invention aims to provide a contact manufacturing method which is excellent in workability and consumes little fuel for heating because it can introduce the inherent vulcanizing agent which constitutes core characteristics and can be vulcanized at a low temperature,

Further, the lattice grooves formed by the lattice protrusions are also provided at the portions to be coupled with the button pads, so that the engaging portions of the button pads, which are melted and bonded to the surfaces of the contacts, partially penetrate the lattice grooves, Lt; / RTI &

The inclined side portion and the receiving groove are provided to further enhance the frictional characteristics and to prevent the engaging portion in the receiving groove from being caught by the opening portion so as to be stopped even if the connection between the engaging portion of the button pad and the surface of the contact portion is partially broken. So that the coupling can be maintained.

According to the present invention,

A button pad inserted into the insertion portion of the button pad,

A contact portion contacting a terminal of a circuit board (PCB); And

And a lattice protrusion formed on an opposite side surface of the contact portion,

And the engaging portions of the button pads penetrate and engage with the lattice grooves formed by the lattice protrusions.

(S100) mixing powdered silicon (Si), nickel (Ni) and silver (Ag);

(S200) mixing the vulcanizing agent in the mixed mixture in step S100;

A cryogenically forming step (S300) of putting the mixture mixed in the step S200 into a mold to form a sheet;

(S400) of forming the sheeted mixture in the step S300 and molding the mixture according to the specifications; And

Forming a lattice protrusion on the surface of the low-resistance contact formed in the step S400 (S500);

.

The vulcanizing agent of step S200 may be selected from the group consisting of siloxane, silicone, di-Methyl, methyl vinyl, platinum, 1,3-diethenyl-1,1,3 , 1,3-diethyl-1,1,3,3-tetramethyldisiloxane complexes, methylhydrogen and

Vinyl bond (vinyl group-terminated) group.

Further, the lattice protrusions have inclined side portions having a width that narrows downward,

Wherein the lattice groove has an opening upwardly and has a receiving groove for receiving an engagement end of the button pad,

The width of the opening is preferably smaller than the width of the receiving groove.

The present invention having the above-

It is possible to provide a low resistance contact having a low resistance as compared with a carbon contact inserted into the inside of a button pad made of silicon,

Further, it is possible to prevent the contact portion from being detached from the terminal,

In addition, since it is possible to perform the vulcanization molding at a low temperature through the inherent vulcanizing agent, the workability is excellent, the consumption of fuel for heating is small,

Furthermore, the engaging portion of the button pad, which is melted and bonded to the surface of the contact, partially penetrates the lattice grooves,

The inclined side portion and the receiving groove are provided to further enhance the frictional characteristic and to allow the engaging portion inside the receiving groove to be caught by the opening portion and to be stopped even if the connection between the engaging portion of the button pad and the surface of the contact portion is partially broken. So that the coupling can be maintained.

1 is a process flow diagram of the present invention.
2 is a use state diagram of the present invention.
Figure 3 is a diagram of an embodiment

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS The present invention will now be described in detail with reference to the accompanying drawings.

While the present invention has been described in connection with certain embodiments, it is obvious that the invention is not limited to the disclosed embodiments, but, on the contrary, is intended to cover various modifications and equivalent arrangements included within the spirit and scope of the invention. It is to be understood, however, that the invention is not intended to be limited to the particular forms disclosed, but on the contrary, is intended to cover all modifications, equivalents, and alternatives falling within the spirit and scope of the invention.

In the drawings, the same reference numerals are used for the same reference numerals, and in particular, the numerals of the tens and the digits of the digits, the digits of the tens, the digits of the digits and the alphabets are the same, Members referred to by reference numerals can be identified as members corresponding to these standards.

In the drawings, the components are expressed by exaggeratingly larger (or thicker) or smaller (or thinner) in size or thickness in consideration of the convenience of understanding, etc. However, It should not be.

The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. The singular expressions include plural expressions unless the context clearly dictates otherwise. In the present application, the term " comprising " or " consisting of ", or the like, refers to the presence of a feature, a number, a step, an operation, an element, a component, But do not preclude the presence or addition of one or more other features, integers, steps, operations, components, parts, or combinations thereof.

Unless defined otherwise, all terms used herein, including technical or scientific terms, have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. Terms such as those defined in commonly used dictionaries are to be interpreted as having a meaning consistent with the contextual meaning of the related art and are to be interpreted as either ideal or overly formal in the sense of the present application Do not.

It is to be understood that the first to second aspects described in the present specification are merely referred to in order to distinguish between different components and are not limited to the order in which they are manufactured, It may not match.

Prior to the description of the present invention, it is preferable that the steps be sequentially performed, but they are not necessarily limited to the order, and the reference numerals of the respective steps should not serve as a limiting factor in the interpretation of the scope of the right.

The present invention relates to a button pad (B) made of a silicone material, which is formed by molding a sheet-like mixture having a self-elasticity such as rubber by mixing silicon (Si), nickel (Ni) (P) having a lower resistance than a conventional carbon contact (P) inserted into the inside of a low-resistance contact (P) and a manufacturing method (M) thereof.

Hereinafter, a method (M) for manufacturing a low resistance contact point P according to the present invention will be described in detail with reference to the accompanying drawings.

1, a method M for manufacturing a low resistance contact point P according to the present invention comprises mixing silicon (Si), nickel (Ni) and silver (Ag) ).

In the prior art, the contact point P is made of a carbon compound such as carbon or the like. Generally, the contact point P through the carbon compound has a resistance of about 20 ohms. On the contrary, the contact P manufactured by the present invention is manufactured by mixing silicon and nickel in the form of powder in the form of silicon as a main component, and has a resistance of about 0.2 ohm.

The contact point P inserted into the inner insertion portion 1 of the button pad B has the switching dynamics of the circuit. When the button is pressed, the button pad B is pressed down and the contact point P is also lowered, The contact portion 30 of the contact P is brought into close contact with a current to flow. At this time, the resistance of the contact P causes a power loss. The problem of this power loss does not need to be mentioned. Further, most of the lost power is discharged as heat, and if large If voltage is applied, there is a possibility of damaging the product due to heat generation. Further, the heat generation may cause deformation of the button pad B due to the thermoplasticity of the button pad B made of a silicone material. Therefore, the contact P preferably has a small resistance.

Further, the method M of manufacturing the low resistance contact point P according to the present invention may further include a step S200 of mixing the vulcanizing agent in the mixture mixed in the step S100 as shown in FIG. .

In step S200, the vulcanizing agent is also called a vulcanization agent because sulfur compounds are generally used as a vulcanizing agent. Such a vulcanizing agent refers to a substance which changes a plastic material into an elastic material.

A key feature of the present invention is that these vulcanizing agents can be combined with siloxane, silicone, di-Methyl, Methyl Vinyl, Platinum, 1,3-diethenyl- , 1,3-diethenyl-1,1,3,3-tetramethyldisiloxane complexes, methylhydrogen, and vinyl group-terminated groups, Is selected.

Next, as shown in FIG. 1, a method (M) for manufacturing a low-resistance contact point P according to the present invention includes a step of forming a sheet by forming a mixture Step S300.

In step S300, the vulcanization molding means that the plastic material is changed into the elastic material by applying pressure and heat for a certain period of time after the rubber material is arranged in the mold in the semi-finished product state. Through this vulcanization molding, the sheeted contact point P can be manufactured to fit the button pad B having various sizes and shapes through 'self-elastic point' and 'sheet point'. Particularly, the 'self-elastic point' is a feature that can improve the working efficiency. Even if irregular pressing (pressing for attachment) is performed in the process of bonding the contact point P to the button pad B, So that the operator can easily perform the attaching operation.

Hereinafter, examples of the vulcanizing agent used in steps S200 and S300 will be described.

Example 1. The first vulcanizing agent

Silicone, Silicone, Di-Methyl, Methyl Vinyl and Vinyl group-terminated mixtures of 86% by weight, siloxane, silicone, 10% by weight of a mixture of methyl (di-Methyl) and vinyl-terminated (Vinyl group-terminated), and a mixture of platinum and 1,3-diethenyl-1,1,3,3-tetramethyldisiloxane mixture -diEthenyl-1,1,3,3-Tetramethyldisiloxane Complexes) and the remaining amount of water were mixed to prepare a first vulcanizing agent. When this first vulcanizing agent was mixed with a mixture of powdered silicon (Si), nickel (Ni) and silver (Ag) and vulcanized, vulcanization molding was possible at about 100 ° C to 110 ° C.

Example 2. Second vulcanizing agent

50% by weight of a mixture of siloxane, silicone, di-Methyl, methyl vinyl and vinyl group-terminated mixture and 50% by weight of siloxane, silicone, A second vulcanizer was prepared by mixing 43% by weight of a mixture of methyl (di-Methyl) and methylhydrogen (Methyl Hydrogen) and the remaining amount of water. When this second vulcanizing agent was mixed with a mixture of powdered silicon (Si), nickel (Ni) and silver (Ag) and vulcanization was carried out, vulcanization molding was possible at about 100 ° C to 110 ° C.

As can be seen from the above two examples, since the vulcanization molding can be performed at a low temperature compared to the prior art through the vulcanizing agent which is a key feature of the present invention, the workability is excellent and the consumption of fuel for heating is small, Have.

(The prior art has a vulcanization molding at between about 200 [deg.] C and 760 [deg.] C, whereas the present invention achieves vulcanization at about 100 [deg.] C to 110 [

In addition, as shown in FIG. 1, the method M of manufacturing the low resistance contact point P according to the present invention may include forming the sheeted mixture in step S300 and molding .

In this step S400, a press having a cutting means may be used to form the mixture according to the specifications, and such a press is known and a detailed description thereof will be omitted. In addition, in this step (S400), the expression 'perforation' means that the press is cut according to each standard by the cutting means. 2 and 3, it is preferable that the low resistance contact P according to the present invention has a circular plane shape, which facilitates the fabrication of the low resistance contact point P But it is also possible to substitute various forms of the cutting means of the press according to the standard desired by the operator.

Hereinafter, a low resistance contact point P according to the present invention will be described in detail with reference to the accompanying drawings.

The low resistance contact P manufactured by the manufacturing method M described above has the contact portion 30 which is in contact with the terminal T of the circuit board. More specifically, it may be desirable to interpret that the surface of the contact P is referred to as contact 30. This contact portion 30 is in contact with the terminal T of the substrate in accordance with the pressing of the button pad B. When the contact portion 30 and the terminal T are not accurately contacted with each other, The operation of the button may not be properly performed because the terminal T is detached from the terminal T and the energization is not properly performed. In order to achieve more precise contact, the surface of the contact portion 30 is provided with a frictional force Lt; / RTI >

2 and 3 show the circular lattice protrusions 10 and the circular lattice grooves 20 formed on the surface of the contact P as means for providing the frictional force of the contact portion 30 described above, The method M of manufacturing the low resistance contact P further includes a step S500 of forming the circular lattice protrusion 10 on the surface of the low resistance contact point P formed in the step S400. And the engaging portion 2 of the button pad B penetrates and is joined to the circular lattice groove 20 formed by the circular lattice protrusion 10.

(The provision of the lattice protrusions 10 in the form of a circle is merely an embodiment, and it may be provided in a rectangular shape or an irregular shape, and thus should not serve as an element limiting the scope of the present invention.

The circular lattice protrusion 10 formed on the surface of the low resistance contact P constituting the contact portion 30 increases the frictional force between the contact portion 30 and the terminal T as described above, (T). ≪ / RTI >

The circular lattice grooves 20 formed naturally between the circular lattice protrusions 10 penetrate the engaging portion 2 of the button pad B to widen the contact area so that the two can be firmly engaged with each other. The button pad B and the contact point P are basically melted by partially melting the button pad B made of a material such as silicone so that the engaging portion 2 of the button pad B melts and is adhered to the contact point P In both cases, the joint part 2 melts into a liquid state, and the liquefied joint part 2 is formed on the surface of the contact point P by using an adhesive material (bond, hot melt, etc.) So that the contact P and the button pad B are bonded together. The circular lattice grooves 20 have the effect of penetrating the liquefied joining portion 2 in this process so that the joining can be performed over a wider area, resulting in a firm coupling.

FIG. 3 shows a modification of the circular lattice protrusions 10 and the circular lattice grooves 20. As shown in FIG.

3 (B), the circular lattice protrusion 10 has an inclined side portion 11 having a width that narrows downward, and the circular lattice groove 20 has an opening 21 on the upper side and has a receiving groove 23 for receiving the engaging end 3 of the button pad B. The width of the opening 21 is equal to the width of the receiving groove 23 .

When the circular lattice protrusion 10 is provided as described above, it is possible to prevent the contact portion 30 from deviating, but there is a possibility that the circular lattice grooves 20 may cause contact failure. In the modification of the present invention, in order to solve this problem, the area of the contact portion 30 is enlarged, but the width of the contact portion 30 becomes narrower toward the lower side ) Of the circular lattice protrusion 10 by introducing the inclined side portion 11 of the circular lattice protrusion 10 has a wider area of the contact portion 30 while remaining the function of preventing the 'contact P from escaping'.

In addition, the receiving groove 23 is provided on the inner side (or the lower side) of the circular grating groove 20 so that the penetration of the engaging portion 2 of the button pad B is deeper, The width of the receiving groove 23 is set to be smaller than the width of the receiving groove 23 so that even if the fusion bonding between the engaging portion 2 of the button pad B and the circular lattice groove 20 of the contact P is partially broken, The engagement portion 2 in the inner portion is caught by the opening portion 21 so as to be stopped, thereby adding stability of the engagement.

3 (C) (left side) shows a second modified example in which the oblique protrusion 13 is additionally provided in addition to the circular lattice protrusion 10 in order to more effectively perform the function of preventing the detachment of the contact point P .

According to the second modification, it is preferable that the apparatus further includes a slanting protrusion 13 having both ends connected to the periphery of the circular lattice protrusion 10 and serving to separate the center of the lattice protrusion 10.

3 (C) (right side) shows a third modified example in which the arc protrusion 15 is provided in addition to the circular lattice protrusion 10 in order to more effectively perform the function of preventing the detachment of the contact P .

According to a third modification, it is preferable to further include the arc protrusions 15, both ends of which are rounded around the circular lattice protrusions 10 and which divide the lattice protrusions 10 in an asymmetrical manner.

The line projection 15 according to the third modification may be considered as a modification of the second modification. The oblique projections 13 are attributable to the enhancement of the frictional characteristics and the arbor projections 15 can be construed to maximize the frictional characteristics of the oblique projections 13. [

While the present invention has been particularly shown and described with reference to exemplary embodiments thereof, it is to be understood that the invention is not limited to the disclosed exemplary embodiments, but, on the contrary, Such variations and modifications are to be construed as being included within the scope of the present invention.

M: Manufacturing method P: Low-resistance contact point
10: lattice protrusion 11: inclined side
20: Grating groove 21: Opening
23: receiving groove 30:
B: Button pad 1: Insertion part
2: engaging portion 3: engaging end

Claims (4)

Is inserted into the insertion portion (1) of the button pad (B) and is engaged with the engagement portion (2) of the button pad (B)
A contact portion 30 contacting the terminal of the circuit board (PCB);
A lattice protrusion (10) formed on an opposite side surface of the contact portion (30); And
And lattice grooves 20 formed by the lattice protrusions 10,
And the engaging portion 2 penetrates and is coupled to the lattice groove 20,
The lattice protrusion 10 has an inclined side portion 11 having a width narrowing downward,
The grating groove 20 has an opening 21 on the upper side and has a receiving groove 23 for receiving the engaging end 3 of the button pad B,
The width W21 of the opening is smaller than the width W23 of the receiving groove,
The lattice protrusions 10 are surrounded by oblique ends of the oblong protrusions 13 or both ends of the lattice protrusions 10 which are connected to both ends of the lattice protrusions 10, 10), or a combination of both of them.
A method of manufacturing a low-resistance contact according to claim 1,
A step (S100) of mixing powdered silicon (Si), nickel (Ni) and silver (Ag);
(S200) mixing the vulcanizing agent in the mixed mixture in step S100;
A cryogenically forming step (S300) of putting the mixture mixed in the step S200 into a mold to form a sheet;
(S400) of forming the sheeted mixture in the step S300 and molding the mixture according to the specifications; And
Forming the lattice protrusions on the surface of the low-resistance contact formed in step S400 (S500);
/ RTI >
3. The method of claim 2,
The vulcanizing agent of step S200 may be selected from the group consisting of siloxane, silicone, di-Methyl, Methyl Vinyl, Platinum, 1,3-diethenyl- One or more members selected from the group consisting of 1,3-diethylenediisocyanate, 1,3-diethyl-1,1,3,3-tetramethyldisiloxane complexes, methylhydrogen and vinyl group-terminated Wherein the low resistance contact is formed by the method of claim 1.
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