Classifications

• • H—ELECTRICITY
  • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
  • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
  • H10N70/00—Solid-state devices having no potential barriers, and specially adapted for rectifying, amplifying, oscillating or switching
  • H10N70/801—Constructional details of multistable switching devices
  • H10N70/821—Device geometry
  • H10N70/823—Device geometry adapted for essentially horizontal current flow, e.g. bridge type devices
• • H—ELECTRICITY
  • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
  • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
  • H10N70/00—Solid-state devices having no potential barriers, and specially adapted for rectifying, amplifying, oscillating or switching
  • H10N70/801—Constructional details of multistable switching devices
  • H10N70/881—Switching materials
  • H10N70/882—Compounds of sulfur, selenium or tellurium, e.g. chalcogenides
  • H10N70/8828—Tellurides, e.g. GeSbTe
• • H—ELECTRICITY
  • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
  • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
  • H10N70/00—Solid-state devices having no potential barriers, and specially adapted for rectifying, amplifying, oscillating or switching
  • H10N70/011—Manufacture or treatment of multistable switching devices
  • H10N70/061—Shaping switching materials
  • H10N70/063—Shaping switching materials by etching of pre-deposited switching material layers, e.g. lithography
• • H—ELECTRICITY
  • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
  • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
  • H10N70/00—Solid-state devices having no potential barriers, and specially adapted for rectifying, amplifying, oscillating or switching
  • H10N70/20—Multistable switching devices, e.g. memristors
  • H10N70/231—Multistable switching devices, e.g. memristors based on solid-state phase change, e.g. between amorphous and crystalline phases, Ovshinsky effect
• • H—ELECTRICITY
  • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
  • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
  • H10N70/00—Solid-state devices having no potential barriers, and specially adapted for rectifying, amplifying, oscillating or switching
  • H10N70/801—Constructional details of multistable switching devices
  • H10N70/881—Switching materials
  • H10N70/884—Switching materials based on at least one element of group IIIA, IVA or VA, e.g. elemental or compound semiconductors
• • G—PHYSICS
  • G11—INFORMATION STORAGE
  • G11C—STATIC STORES
  • G11C13/00—Digital stores characterised by the use of storage elements not covered by groups G11C11/00, G11C23/00, or G11C25/00
  • G11C13/0002—Digital stores characterised by the use of storage elements not covered by groups G11C11/00, G11C23/00, or G11C25/00 using resistive RAM [RRAM] elements
  • G11C13/0004—Digital stores characterised by the use of storage elements not covered by groups G11C11/00, G11C23/00, or G11C25/00 using resistive RAM [RRAM] elements comprising amorphous/crystalline phase transition cells

Definitions

• the invention relates to a phase change memory cell.
• Standard Phase Change Memory (PCM) lateral/line type cell are designed with a geometrical constriction in the form of an hourglass pattern of the structure, as described in a paper by Martijn H. R. Lankhorst, Bas W. S. M. M. Ketelaars And R. A. M. Wolters., "Low-cost and nanoscale non-volatile memory concept for future silicon chips", Nature Materials, (Published online: 13 March 2005), and a paper by P. Haring Bolivar, F. Merget, D.-H. Kim, B. Hadam and H.
• a constriction in vertical direction can be obtained by using a local thinning of the PCM layer thereby locally reducing the thickness t of the phase-change material.
• a phase- change-memory cell comprising two insulated regions formed in a first phase- change material connected by a region formed in a second phase-change material whereby the crystallization temperature of the second phase-change material is below the crystallization temperature of the first phase-change material.
• a method for forming a phase-change-memory cell comprising two insulated regions formed in a first phase-change material connected by a region formed in a second phase-change material whereby the crystallization temperature of the second phase-change material is below the crystallization temperature of the first phase-change material, the method comprising: - forming two insulated regions in a first phase-change material; and
• Figure 1A shows a schematic cross-section and scanning electron micrograph of an example type of a PCM line cell with TiN contacts and Al bond-pads processed on a silicon wafer;
• Figure 1 B shows a schematic cross-section and plan view of an example type of a PCM line cell
• Figure 2 shows a schematic plan view of part of a PCM cell
• Figure 3 shows a schematic plan view of part of a PCM cell during manufacture in accordance with the invention
• Figure 4 is a schematic cross-section showing thinning of the active region during manufacture of the PCM cell in accordance with the invention.
• Figure 5 is schematic top view of the active region in a second embodiment of the invention.
• a layer of a first PCM material such as GST225 is deposited on a substrate.
• This first PCM layer is patterned a first time, e.g. in the hourglass shape as shown in Figure 2.
• a removable hardmask such as TiW can be used. This hardmask is formed over the first
• the patterned hardmask is used to pattern the underlying first PCM layer.
• a second mask (Fig. 3) is then used to define the active region ("hot spot") or the first-to-melt region within this first patterned
• the first PCM layer is thus patterned a second time to remove a section of the central part in the PCM cell, thereby creating two insulated regions of the first PCM material.
• a hardmask layer such as TiW can be used in this second patterning step in similar fashion as was done in the first patterning step.
• both the first and the second mask of Fig. 3 are combined into a single mask defining both insulated parts in one single patterning step.
• the hardmask layer is then selectively removed.
• a layer of second PCM material is then deposited which crystallizes at a temperature below the temperature of the first PCM layer.
• This second PCM layer can be Ge4.
• this second PCM layer is deposited in a separate deposition step, its thickness can be chosen independently of the thickness of the first PCM layer.
• the cross-sectional area in a direction perpendicular to the current flow path is reduced (Fig.4), and as the resistivity of the second PCM layer is selected to be the same as or less than the resistivity of the first PCM layer, this decreased cross-sectional area would result in an increase of the current density within this second PCM layer compared to the first PCM layer.
• the second PCM layer is then patterned to form a conductive path between two corresponding insulated regions of the first PCM material.
• the same hourglass mask as in the first patterning step may be used (e.g., the first mask).
• a stack of two PCM layers is formed with the layers aligned to each other.
• this patterned second PCM layer will extend from one insulated region to another insulated region that is formed in the first PCM layer, thereby bridging the gap separating the first PCM regions, its width W2 can be made less than the width W1 of the gap (Fig. 5). This way, the current density can be increased in this second PCM layer compared to the first PCM layer.
• This solution which uses an additional mask, can be considered for the second option, wherein a different mask is used to pattern the second PCM layer. If present, the hardmask layer is then selectively removed.
• the benefit of this new integration flow is that the material and geometry factors are combined to improve the controllability and, thus, the uniformity and reproducibility of cell characteristics.
• the PCM material Ge4 located in the active region e.g., the region constituting the "hot spot" melts, e.g., recrystallizes, at a lower temperature (thereby requiring a lower current density) than the PCM material GST 225 connecting the active region to the electrodes.
• the cross-sectional area is reduced in the active region not only in the width W (due to hourglass shape), but also in the thickness t because of the removal of GST 225 in the active region as shown in Fig. 4. Note that forming a thin layer by deposition is more controllable than by reducing the thickness of an as-deposited layer by a post etch process.
• a benefit of this increased control is that melting will substantially only occur in the active area, and this melting will occur with a lower statistical spread of characteristics.
• An additional benefit is that we reduce the risks of melt occurrence at the interface between the electrode and the phase-change material, which, if not reduce would likely result in segregation and/or a degradation in reliability. This benefit is substantially realized by using GST 225 in the periphery.

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• Engineering & Computer Science (AREA)
• Manufacturing & Machinery (AREA)
• Semiconductor Memories (AREA)
• Recrystallisation Techniques (AREA)
• Crystals, And After-Treatments Of Crystals (AREA)
• Control For Baths (AREA)
• External Artificial Organs (AREA)

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• 2006
  • 2006-05-18 AT AT06744974T patent/ATE420440T1/de not_active IP Right Cessation
  • 2006-05-18 EP EP06744974A patent/EP1886317B8/en active Active
  • 2006-05-18 DE DE602006004729T patent/DE602006004729D1/de active Active
  • 2006-05-18 WO PCT/IB2006/051575 patent/WO2006123305A1/en not_active Ceased
  • 2006-05-18 US US11/914,645 patent/US8008644B2/en active Active
  • 2006-05-18 CN CN2006800171422A patent/CN101213612B/zh active Active
  • 2006-05-18 JP JP2008511849A patent/JP4862113B2/ja active Active

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