WO2006085372A1

WO2006085372A1 - Method for manufacturing inlet for electronic tag

Info

Publication number: WO2006085372A1
Application number: PCT/JP2005/002003
Authority: WO
Inventors: Toshimichi Masuta; Hisao Yamagata
Original assignee: Renesas Technology Corp.
Priority date: 2005-02-10
Filing date: 2005-02-10
Publication date: 2006-08-17
Also published as: JPWO2006085372A1; TW200637200A

Abstract

To shorten the time period required for measuring the communication characteristics of a non-contact type electronic tag, and to execute the measurement easily. A reader machine (RM) and a testing tool (TM) are electrically connected with a computer (COM) so that the decision and record of the communication results and the movement of the testing tool (TM) (or an arm (AM) holding an inlet (1)) may be controlled by the software of the computer (COM). When a worker (WK) inputs a measurement starting signal to the computer (COM), the measurement is started from the position, at which the distance between the inlet (1) and a communication antenna (ANT) is 0 mm, and is automatically executed without any operation of the worker till that distance becomes the final measurement position.

Description

Specification

Method for manufacturing inlet for electronic tag

Technical field

The present invention relates to an electronic tag inlet manufacturing technique, and more particularly to a technique effective when applied to a process of measuring the communication distance characteristic of an electronic tag.

Background art

[0002] Japanese Patent Application Laid-Open No. 2004-286566 (Patent Document 1) discloses that each IC label of an IC roll label conveyed along a predetermined direction without damaging an IC chip or an antenna has a desired communication distance. The communication inspection device that can properly perform the communication inspection is disclosed.

[0003] Also, Japanese Patent Application Laid-Open No. 2004-287800 (Patent Document 2) describes an IC product inspection apparatus capable of quickly processing an inspection of a single piece of RF-ID media such as an IC card. It is disclosed.

[0004] Japanese Patent Laid-Open No. 2003-44810 (Patent Document 3) discloses a technique for measuring the communication distance of an IC card using a reader / writer connected to a notebook computer. According to the report, it was confirmed that it was possible to communicate with a distance force of 90 mm.

[0005] In addition, Japanese Patent Laid-Open No. 2000-9776 (Patent Document 4) discloses that the noise radio wave from the outside is blocked and the antenna under test (EUT) and the antenna on the measuring device side are in the air. This is a wireless communication characteristic test apparatus that can simulate the transmission and reception of radio waves and can change the distance between both antennas in a pseudo manner.

[0006] Also, in Japanese Patent Laid-Open No. 11-72518 (Patent Document 5), as a conventional technique, a communication device is connected via a coaxial cable or a waveguide instead of an antenna to reduce the spatial distance attenuation. A technique for performing characteristic measurement and evaluation test by inserting a variable attenuator or a fixed attenuator in the middle of a coaxial cable or waveguide is disclosed.

[0007] In addition, Japanese Patent Application Laid-Open No. 2004-220141 (Patent Document 6 (corresponding US Patent Publication USP5, 644, 245)) describes an inspection pair with a large number of IC inlets formed on an insulating film. A method for accurately inspecting the quality and defect of an IC inlet, which is an elephant, is disclosed.

Patent Document 1: Japanese Patent Laid-Open No. 2004-286566 Patent Document 2: JP 2004-287800 A

Patent Document 3: Japanese Patent Laid-Open No. 2003-44810

Patent Document 4: JP 2000-9776 A

Patent Document 5: Japanese Patent Laid-Open No. 11-72518

Patent Document 6: Japanese Patent Application Laid-Open No. 2004-220141

Disclosure of the invention

Problems to be solved by the invention

[0008] A non-contact type electronic tag stores desired data in a memory circuit in a semiconductor chip (hereinafter simply referred to as a chip) and uses microwaves (other RF (Radio Frequency) radio waves or electromagnetic waves). This tag is designed to read this data. Since electronic tags store data in a memory circuit in the chip, they have the advantage of storing large amounts of data compared to tags that use barcodes. In addition, the data stored in the memory circuit has the advantage that unauthorized tampering is difficult compared to the data stored in the barcode.

[0009] The present inventors have developed a technique for measuring the communication characteristics of a non-contact type electronic tag! I'm considering it. Among them, the present inventors have found the following problems.

[0010] That is, when acquiring the communication characteristics of a non-contact type electronic tag, communication can be performed (data can be read) or communication while the distance between the electronic tag and the communication antenna is manually changed little by little. The communication status of impossible (data cannot be read) is recorded! /, And the reading limit distance is obtained as the communication distance characteristic. Therefore, it takes time to acquire the communication characteristics of one sample, and there is a problem that it takes a lot of time to determine the standard communication characteristics by acquiring a plurality of sample power communication characteristics.

[0011] In addition, in the process of selecting an electronic tag, it is confirmed that data can be read by communicating at two points, short distance and long distance, based on the standard communication characteristics. Guarantees that the distance between points is also readable. However, the sorter used for sorting has a structure in which the distance between the electronic tag and the communication antenna can be easily changed. Therefore, it is difficult to change the distance without constructing a special jig. It has become. For this reason, each time the distance is changed, stress is applied to the measuring instrument, which makes it difficult to manage the measuring instrument. [0012] Further, when measuring the communication measurement, since the radio wave environment greatly affects the measurement result, the measurement environment must be constructed in the anechoic box. For this reason, the handler used to move the electronic tag to be measured is constructed and arranged in a limited space, which makes it difficult to design a handler that can move the electronic tag at high speed. Exists.

One object of one typical invention disclosed in the present application is to provide a technique capable of shortening the time required for measuring the communication characteristics of a non-contact type electronic tag.

[0014] Further, another object of one representative invention disclosed in the present application is to provide a technique capable of easily measuring the communication characteristics of a non-contact type electronic tag.

Means for solving the problem

[0015] An outline of one representative one of the inventions disclosed in the present application will be briefly described as follows.

[0016] 1. The method for manufacturing an inlet for an electronic tag includes the following steps.

(a) dividing a plurality of semiconductor chips having a memory circuit in which predetermined data is written from a semiconductor wafer;

(b) preparing a plurality of first antennas for receiving radio waves of a predetermined frequency;

(c) connecting the semiconductor chip to each of the plurality of first antennas,

(d) a step of forming a plurality of inlets by sealing each of the plurality of semiconductor chips after the step (c);

(e) A step of inspecting communication distance characteristics of the plurality of inlets by selectively irradiating each of the plurality of inlets with the first radio wave having the predetermined frequency.

[0017] Here, the step (e)

(el) The inlet is disposed on a second antenna that communicates with the inlet, and a radio wave absorbing means that prevents reflection of radio waves from below and blocks radio waves from above is provided as the second antenna and the inlet. A step of being spaced apart above,

(e2) After the step (el), maintaining a distance between the inlet and the second antenna at a predetermined first distance, and communicating the inlet and the second antenna;

(e3) a step of repeating the step (e2) while keeping the first distance changed by a predetermined amount (e4) a step of repeating the step (e3) a predetermined number of times,

Including

The inlet is held by holding means that moves up and down on the second antenna,

The radio wave absorbing means is attached to the holding means holding means via a relay means, interlocked with the operation of the holding means,

The second antenna is electrically connected to the data reading means;

The data reading means and the holding means are electrically connected to a computer,

The computer controls the operation of the holding means by software and records the first distance and the communication result.

[0018] 2. The electronic tag inlet manufacturing method includes the following steps.

[0019] Here, the step (e)

(el) a data reading means electrically connected to the computer, and a variable attenuator electrically connected to the computer and the data reading means, and is electrically connected to communicate with the inlet; Disposing the inlet on the second antenna, and disposing radio wave absorbing means for preventing reflection of radio waves of lower force and blocking radio waves from above on the second antenna and the inlet;

(e2) After the step (el), a distance between the inlet and the second antenna is set to a predetermined value. Maintaining the first distance and communicating the inlet and the second antenna;

(e3) a step of changing the attenuation of the variable attenuator by a predetermined amount, and repeating the step (e2),

(e4) a step of repeating the step (e3) a predetermined number of times,

Including

The computer records the attenuation amount and communication result of the variable attenuator.

[0020] 3. The method for manufacturing an inlet for an electronic tag includes the following steps.

(b) providing a first socket having a first antenna for receiving radio waves of a predetermined frequency;

(c) attaching the semiconductor chip to the first socket so that the first antenna and the semiconductor chip are electrically connected;

(d) A step of inspecting the communication distance characteristics of the plurality of semiconductor chips by selectively irradiating the first socket with the first radio wave having the predetermined frequency.

[0021] Here, the step (d) includes:

(dl) The first socket is disposed on a second antenna that communicates with the semiconductor chip, and a radio wave absorber that prevents radio waves from being reflected from below and blocks radio waves from above is provided as the second antenna and Disposing the first socket on the first socket,

(d2) After the step (dl), the distance between the first socket and the second antenna is kept at a predetermined first distance, and the first socket and the second antenna communicate with each other. (D3) a step of changing the first distance by a predetermined amount and repeating the step (e2)

(d4) a step of repeating the step (d3) a predetermined number of times,

Including

The first socket is held by holding means that moves up and down on the second antenna;

The radio wave absorbing means is attached to the holding means holding means via a relay means, In conjunction with the operation of the holding means,

The second antenna and the holding unit are electrically connected to a computer, and the computer controls the operation of the holding unit by software and records the first distance and the communication result.

[0022] 4. The method for manufacturing an inlet for an electronic tag includes the following steps.

(b) preparing a measurement jig having a first socket for mounting the semiconductor chip and an impedance matching circuit, a computer electrically connected to the measurement jig, a data reading means, and a variable attenuator;

(c) attaching the semiconductor chip to the first socket and electrically connecting the semiconductor chip and the impedance matching circuit;

(d) a step of causing the semiconductor chip and the computer to communicate with each other in a state where the semiconductor chip is attached to the first socket;

(e) changing and maintaining the attenuation of the variable attenuator by a predetermined amount, and repeating the step (d),

(f) A step of inspecting communication distance characteristics of the plurality of semiconductor chips by repeating the step (e) a predetermined number of times.

Here, the computer records the attenuation amount of the variable attenuator and a communication result.

[0024] 5. The method for manufacturing an inlet for an electronic tag includes the following steps.

(b) preparing an insulating film formed with a plurality of first antennas that receive radio waves of a predetermined frequency separated from each other;

(c) connecting the semiconductor chip to each of the plurality of first antennas formed on the insulating film;

(d) After the step (c), by sealing each of the plurality of semiconductor chips A step of forming a plurality of inlets on the insulating film;

(e) providing a measurement jig having a second antenna that communicates with the inlet, and a radio wave absorbing means that prevents radio waves from being reflected from below on the second antenna and blocking radio waves from above Process,

(f) preparing a computer, a data reading means and a variable attenuator electrically connected to the measurement jig;

(g) passing the insulating film between the second antenna of the measuring jig and the radio wave absorbing means, and communicating the inlet and the computer;

(h) A step of changing the attenuation of the variable attenuator by a predetermined amount and maintaining the step (g),

(i) The step of inspecting the communication distance characteristics of the plurality of inlets by repeating the step (h) a predetermined number of times.

Here, the computer records the attenuation amount and the communication result of the variable attenuator.

[0026] If the summary of other inventions included in the present application is itemized, it is as follows.

1. A method for manufacturing an inlet for an electronic tag including the following steps:

[0027] Here, the step (e)

(el) The inlet is disposed on a second antenna that communicates with the inlet, and radio wave absorbing means for preventing radio waves from being reflected from below and blocking radio waves from above is provided for the second antenna. Na and a step of disposing them on the inlet,

(e3) a step of repeating the step (e2) while keeping the first distance changed by a predetermined amount

(e4) a step of repeating the step (e3) a predetermined number of times,

Including

The second antenna is electrically connected to the data reading means;

2. In the manufacturing method of the electronic tag inlet according to item 1,

The electromagnetic wave absorbing means is disposed at a position sufficiently larger than the communication limit distance of the inlet by a distance of a second distance from the inlet.

3. In the method for manufacturing an inlet for an electronic tag according to item 2,

The second distance is approximately twice the communication limit distance of the inlet.

4. The method for manufacturing an inlet for an electronic tag according to item 1 above,

The operation time of the holding means in the step (e3) is about 0.1 second or less.

5. In the method for manufacturing an inlet for an electronic tag according to item 1,

The positional accuracy of the holding means in the step (e2) and the step (e3) is about 0.1 mm or less.

6. A method for manufacturing an inlet for an electronic tag including the following steps:

(a) A plurality of semiconductor chips having a memory circuit in which predetermined data is written A process of dividing the body wafer into pieces,

(e) A step of inspecting communication distance characteristics of the plurality of inlets by selectively irradiating each of the plurality of inlets with the first radio wave having the predetermined frequency. Here, the step (e)

(e2) After the step (el), maintaining the distance between the inlet and the second antenna at a predetermined first distance, and communicating the inlet and the second antenna; (e3) Changing the attenuation of the variable attenuator by a predetermined amount and maintaining the step (e2),

(e4) a step of repeating the step (e3) a predetermined number of times,

Including

7. The method for manufacturing an inlet for an electronic tag according to item 6 above,

The computer performs software control of a change in the attenuation amount of the variable attenuator.

8. In the method for manufacturing an inlet for an electronic tag according to item 6,

The radio wave absorbing means is disposed at a position sufficiently larger than the communication limit distance of the semiconductor chip and spaced from the first socket by a second distance.

9. In the method for manufacturing an inlet for an electronic tag according to item 8,

The second distance is about twice the communication limit distance of the semiconductor chip. 10. In the method of manufacturing an inlet for an electronic tag according to the item 6, the variable attenuator is a variable attenuator using a mechanical contact or a semiconductor circuit, and a wattmeter is electrically connected to the computer,

A relay that switches a circuit between the second antenna and the power meter is electrically connected to the variable attenuator,

Before the step (el) and after the step (e4), the computer switches the relay to the wattmeter side and confirms whether or not a predetermined power is being output.

11. A method for manufacturing an inlet for an electronic tag including the following steps:

Here, the step (d)

(d4) a step of repeating the step (d3) a predetermined number of times,

Including

The first socket is held by holding means that moves up and down on the second antenna; The radio wave absorbing means is attached to the holding means holding means via a relay means, interlocked with the operation of the holding means,

12. In the manufacturing method of the inlet for an electronic tag according to the above item 11,

13. In the method of manufacturing an inlet for an electronic tag according to item 12,

The second distance is about twice the communication limit distance of the semiconductor chip.

14. The method of manufacturing an inlet for an electronic tag according to the above item 11,

15. In the method of manufacturing an inlet for an electronic tag according to the item 11,

16. A method for manufacturing an inlet for an electronic tag including the following steps:

(b) preparing a measurement jig having a second socket for mounting the semiconductor chip and an impedance matching circuit, a computer electrically connected to the measurement jig, a data reading means, and a variable attenuator;

(c) attaching the semiconductor chip to the second socket, and electrically connecting the semiconductor chip and the impedance matching circuit;

(d) a step of causing the semiconductor chip and the computer to communicate with each other in a state where the semiconductor chip is attached to the second socket;

(f) The step (e) is repeated a predetermined number of times to determine the communication distance characteristics of the plurality of semiconductor chips. Process to inspect.

Here, the computer records the attenuation amount and communication result of the variable attenuator.

17. In the method of manufacturing an inlet for an electronic tag according to item 16,

18. In the method for manufacturing an inlet for an electronic tag according to item 16,

The variable attenuator is a variable attenuator using a mechanical contact or a semiconductor circuit, and a wattmeter is electrically connected to the computer,

A relay that switches a circuit between the measurement jig and the power meter is electrically connected to the variable attenuator,

Before the step (d) and after the step (f), the computer switches the relay to the wattmeter side and checks whether or not predetermined power is output!

19. An electronic tag inlet manufacturing method including the following steps:

(d) after the step (c), by sealing each of the plurality of semiconductor chips, a step of forming a plurality of inlets on the insulating film;

(g) the insulating film, the second antenna of the measurement jig and the radio wave absorption means Passing between the inlet and communicating the inlet and the computer,

20. In the method for manufacturing an inlet for an electronic tag according to item 19,

A plurality of the measuring jigs are prepared,

In the plurality of measurement jigs, the insulating film is passed between the second antenna of the measurement jig and the radio wave absorbing means, and the inlet and the computer are communicated with each other to (g) — (i) Execute the process and inspect the communication distance characteristics of the plurality of inlets simultaneously.

The invention's effect

[0032] The effects obtained by the representative ones of the inventions disclosed in the present application will be briefly described as follows.

(1) The time required for measuring the communication characteristics of a non-contact type electronic tag can be shortened.

(2) The communication characteristics of the non-contact type electronic tag can be easily measured.

Brief Description of Drawings

FIG. 1 is a plan view (surface side) showing an inlet for an electronic tag that is Embodiment 1 of the present invention.

2 is an enlarged plan view showing a part of FIG.

FIG. 3 is a side view showing the electronic tag inlet according to the first embodiment of the present invention.

FIG. 4 is a plan view (back side) showing the electronic tag inlet according to the first embodiment of the present invention.

FIG. 5 is an enlarged plan view showing a part of FIG.

FIG. 6 is an enlarged plan view (surface side) of a main part of the electronic tag inlet according to the first embodiment of the present invention. FIG. 7 is an enlarged plan view (rear side) of a main part of the electronic tag inlet according to the first embodiment of the present invention.

8] FIG. 8 is a plan view of a semiconductor chip mounted on the electronic tag inlet according to the first embodiment of the present invention.

FIG. 9 is a sectional view of a bump electrode formed on the main surface of the semiconductor chip shown in FIG. 8 and its vicinity.

FIG. 10 is a cross-sectional view of dummy bump electrodes formed on the main surface of the semiconductor chip shown in FIG. 8 and the vicinity thereof.

FIG. 11 is a block diagram of a circuit formed on the main surface of the semiconductor chip shown in FIG.

12] A flowchart illustrating the manufacturing process of the electronic tag inlet according to the first embodiment of the present invention.

[13] FIG. 13 is a plan view showing a part of a long insulating film used for manufacturing the electronic tag inlet according to the first embodiment of the present invention.

14 is an enlarged plan view showing a part of the insulating film shown in FIG.

FIG. 15 is a schematic view of an inner lead bonder showing a part of the manufacturing process of the electronic tag inlet (semiconductor chip and antenna connection process) according to the first embodiment of the present invention.

FIG. 16 is an enlarged schematic view showing a main part of the inner lead bonder shown in FIG.

FIG. 17 is an enlarged plan view of a main part of an insulating film showing a part of the manufacturing process of the inlet for an electronic tag (embodiment for connecting a semiconductor chip and an antenna) according to the first embodiment of the present invention.

FIG. 18 is an essential part enlarged plan view of the insulating film showing a part of the manufacturing process of the inlet for electronic tag (the connecting process of the semiconductor chip and the antenna) according to the first embodiment of the present invention.

FIG. 19 is a schematic view showing a part of the manufacturing process of the electronic tag inlet (embodiment 1 for sealing a semiconductor chip) according to the first embodiment of the present invention.

FIG. 20 is an enlarged plan view of an essential part of an insulating film showing a part of the manufacturing process of the electronic tag inlet according to the first embodiment of the present invention (semiconductor chip sealing process).

FIG. 21 is a side view showing a state in which an insulating film used for manufacturing the electronic tag inlet according to the first embodiment of the present invention is wound on a reel.

FIG. 22 is a display example of communication inspection results of the electronic tag inlet according to the first embodiment of the present invention. It is explanatory drawing which shows.

FIG. 23 is an explanatory diagram showing a configuration of a device used for communication inspection of the electronic tag inlet according to the first embodiment of the present invention.

FIG. 24 is an explanatory diagram showing traveling waves and reflected waves in the communication inspection of the electronic tag inlet according to the first embodiment of the present invention.

FIG. 25 is an explanatory diagram showing the installation of a radio wave shielding plate in the communication inspection of the electronic tag inlet according to the first embodiment of the present invention.

FIG. 26 is a cross-sectional view showing installation of a radio wave shielding plate in the communication inspection of the electronic tag inlet according to the first embodiment of the present invention.

FIG. 27 is an explanatory diagram showing a method of using an electronic tag using the electronic tag inlet according to the first embodiment of the present invention.

FIG. 28 is a plan view of a socket used for communication inspection of a chip included in the electronic tag inlet according to the second embodiment of the present invention.

FIG. 29 is a side view of a socket used for communication inspection of a chip included in the electronic tag inlet according to the second embodiment of the present invention.

FIG. 30 is a perspective view of a socket used for communication inspection of a chip included in the electronic tag inlet according to the second embodiment of the present invention.

FIG. 31 is a perspective view of each device used for communication inspection of a chip included in the electronic tag inlet according to the second embodiment of the present invention.

[32] FIG. 32 is an explanatory diagram showing a problem in measuring the communication distance characteristics of the inlet for an electronic tag using a radio wave box.

[33] FIG. 33 is an explanatory view showing the distance dependency of communication between the electronic tag inlet and the communication antenna.

圆 34] An explanatory diagram showing a means to reproduce the distance dependence while keeping the distance between the RFID tag inlet and the communication antenna constant by introducing a variable attenuator between the communication antenna and the reader. It is.

[35] FIG. 35 is an explanatory diagram showing the selection process of the electronic tag inlet when the electronic tag inlet and the communication antenna are at a short distance. FIG. 36 is an explanatory view showing the selection process of the electronic tag inlet when the distance between the electronic tag inlet and the communication antenna is a short distance.

[37] FIG. 37 is an explanatory diagram showing measurement of communication distance characteristics of the electronic tag inlet.

[38] This is a circuit diagram when the communication antenna is connected to the reader device via a variable attenuator.

[39] FIG. 39 is a circuit diagram when the communication antenna is connected to the reader device via the variable attenuator in the third embodiment of the present invention.

FIG. 40 is a circuit diagram when the communication antenna is connected to the reader device via the variable attenuator in the third embodiment of the present invention.

[41] FIG. 41 is an internal circuit diagram of a variable attenuator connected between the communication antenna and the reader device in the third embodiment of the present invention.

FIG. 42 is an explanatory diagram showing a system for self-diagnosis of a variable attenuator connected between a communication antenna and a reader device in Embodiment 3 of the present invention.

FIG. 43] A perspective view of a measuring jig used in a system for measuring communication distance characteristics of the electronic tag inlet according to the fourth embodiment of the present invention.

FIG. 44 is an explanatory diagram of a system for measuring communication distance characteristics of the electronic tag inlet according to the fourth embodiment of the present invention.

45] FIG. 45 is an explanatory diagram showing an internal circuit of the measurement jig shown in FIG. 43.

[46] FIG. 46 is a circuit diagram showing a circuit provided in the measuring jig shown in FIG.

47] FIG. 47 is a perspective view of a measuring jig used in a system for measuring communication distance characteristics of the electronic tag inlet according to the fifth embodiment of the present invention.

FIG. 48 is an explanatory diagram showing electrical connection between a dipole antenna and a signal terminal inside the measurement jig shown in FIG. 47.

49] FIG. 49 is a perspective view for explaining the measurement of the communication distance characteristic of the inlet performed using the measurement jig shown in FIG.

FIG. 50 is a perspective view of a measuring jig used in a system for measuring communication distance characteristics of the electronic tag inlet according to the fifth embodiment of the present invention.

[FIG. 51] Electric power between the monopole antenna and the signal terminal inside the measurement jig shown in FIG. It is explanatory drawing which shows air connection.

FIG. 52 is a perspective view of a measuring jig used in a system for measuring communication distance characteristics of an electronic tag inlet according to the fifth embodiment of the present invention.

BEST MODE FOR CARRYING OUT THE INVENTION

[0034] Before describing the present invention in detail, the meaning of terms in the present application will be described as follows.

[0035] An electronic tag is a central electronic component of an RFID system or an EPC (Electronic Product Code) system, and generally has electronic information and communication functions on a chip of several millimeters or less (including more than that). This means data rewriting function, and communicates with the reader by radio waves or electromagnetic waves. It is also called a wireless tag or IC tag. By attaching it to a product, it is possible to perform information processing that is more sophisticated and complex than bar code. There is also a tag that can be used semi-permanently without a battery due to non-contact power transmission technology from the antenna side (external or internal). The tag has various shapes such as a label type, a card type, a coin type and a stick type, and is selected according to the application. The communication distance ranges from several millimeters to several meters, and these are also used depending on the application.

[0036] Inlet (generally a complex of an RFID chip and an antenna, however, there is also an antenna! /, Or an antenna integrated on the chip. Therefore, an inlet may also be included without an antenna. Is a basic product form with an IC chip mounted on a metal coil (antenna), and the metal coil and IC chip are generally exposed, but may be sealed.

[0037] An anechoic box and an anechoic chamber are free space environments in which external electromagnetic waves are blocked.

(Electromagnetic shield and radio wave anechoic), a facility that measures and evaluates the amount of electromagnetic radiation from electronic equipment and the resistance of electronic equipment to electromagnetic waves from other radiation sources in its free space environment To tell.

[0038] A dipole antenna refers to two 1Z4-wave conductor bars joined together.

By joining two 1Z4 wavelength conductor rods, it becomes a 1Z2 wavelength conductor.

[0039] A monopole antenna refers to an antenna composed of a 1Z4 wavelength conductor rod, and can be regarded as a half of a dipole antenna. The antenna is not limited to these. Other three-dimensional antennas, planar antennas, printed circuit antennas, microstrip antennas, and the like may be used.

[0040] In the following embodiment, when necessary for the sake of convenience, the description will be divided into a plurality of sections or embodiments, but they are not irrelevant unless otherwise specified. One is related to some or all of the other modification, details, supplementary explanation, etc.

[0041] In the following embodiments, when referring to the number of elements, etc. (including the number, numerical value, quantity, range, etc.), it is limited to a specific number clearly when clearly indicated and in principle. Except in some cases, the number is not limited to the specific number, and may be a specific number or more.

[0042] Furthermore, in the following embodiments, the constituent elements (including element steps and the like) are not necessarily specified unless explicitly stated or considered to be clearly essential in principle. It goes without saying that it is not essential. Also, in the examples, etc., when it is said that it consists of “A” or “consists of A”, it excludes other elements unless specifically stated that it is the only element. Well! Needless to say! /

[0043] Similarly, in the following embodiments, when referring to the shape, positional relationship, etc. of the components, etc., unless otherwise specified, and in principle it is not clearly apparent in principle, In particular, it shall include an approximation or similar to its shape. The same applies to the above numerical values and ranges.

[0044] Also, components having the same function are denoted by the same reference symbols throughout the drawings for describing the embodiments, and the repetitive description thereof is omitted.

[0045] In the drawings used in the present embodiment, even a plan view may be partially hatched to make the drawings easy to see.

Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings.

[Embodiment 1]

FIG. 1 is a plan view (front side) showing an inlet for an electronic tag according to the first embodiment, FIG. 2 is a plan view showing a part of FIG. 1 on an enlarged scale, and FIG. 3 is a plan view showing the first embodiment. FIG. 4 is a side view showing the electronic tag inlet, and FIG. 4 is a plan view (back side) showing the electronic tag inlet of the first embodiment. FIG. 5 is an enlarged plan view showing a part of FIG. As described above, a part or all of this embodiment (example) is a part or all of the following embodiment (example). Therefore, as a general rule, the explanation of the overlapping parts is omitted.

[0048] An electronic tag inlet (hereinafter, simply referred to as an inlet) 1 according to the first embodiment constitutes a main part of a non-contact type electronic tag including an antenna for receiving microwaves. This inlet 1 has a copper foil antenna 3 bonded to one surface of a long and narrow rectangular insulating film 2, and a chip 5 connected to the antenna 3 with the surface and side surfaces sealed with potting grease 4. And prepare. On one surface of the insulating film 2 (the surface on which the antenna 3 is formed), a cover film 6 for protecting the antenna 3 and the chip 5 is laminated as necessary.

[0049] The length of the antenna 3 along the long side direction of the insulating film 2 is 56 mm, for example, and is optimized so as to efficiently receive microwaves having a frequency of 2.45 GHz. In addition, the width of the antenna 3 is 3 mm, and the antenna 3 is optimized so that both the size reduction of the inlet 1 and the securing of strength can be achieved.

[0050] An "L" -shaped slit 7 whose one end reaches the outer edge of the antenna 3 is formed at a substantially central portion of the antenna 3. A potting grease 4 is formed in the middle of the slit 7. The sealed chip 5 is mounted.

6 and 7 are enlarged plan views showing the vicinity of the central portion of the antenna 3 in which the slit 7 is formed. FIG. 6 shows the front side of the inlet 1 and FIG. 7 shows the back side. ing . In these drawings, illustration of the potting resin 4 and the cover film 6 for sealing the chip 5 is omitted.

As shown in the figure, a device hole 8 formed by punching a part of the insulating film 2 is formed in the middle of the slit 7, and the chip 5 is arranged at the center of the device hole 8. Has been. The dimensions of the device hole 8 are, for example, vertical X horizontal = 0.8 mm X O. 8 mm, and the dimensions of the chip 5 are vertical X horizontal = 0.48 mm X O. 48 mm.

As shown in FIG. 6, on the main surface of the chip 5, for example, four Au (gold) bumps 9a, 9b, 9c, and 9d are formed. In addition, each of these Au bumps 9a, 9b, 9c, and 9d is a lead 1 that is formed integrally with the antenna 3 and has one end extending inside the device hole 8. 0 is connected.

[0054] Of the four leads 10, the two leads 10 extend from one of the antennas 3 divided into two by the slits 7 to the inside of the device hole 8, and Au bumps 9a and 9c of the chip 5 And are electrically connected. The remaining two leads 10 also have the other force of the antenna 3 extending inside the device hole 8 and are electrically connected to the Au bumps 9b and 9d of the chip 5.

FIG. 8 is a plan view showing the layout of the four Au bumps 9a, 9b, 9c, 9d formed on the main surface of the chip 5, and FIG. 9 is an enlarged cross section in the vicinity of the Au bump 9a. FIG. 10 is an enlarged cross-sectional view in the vicinity of the Au bump 9 c, and FIG. 11 is a block diagram of a circuit formed on the chip 5.

[0056] Chip 5 is formed of a single crystal silicon substrate having a thickness of approximately 0.15 mm, and the main surface thereof includes a rectifier and transmitter as shown in FIG. A circuit is formed. The ROM has a 128-bit storage capacity and can store a larger amount of data than a storage medium such as a barcode. In addition, the data stored in the ROM has the advantage that unauthorized tampering is more difficult than the data stored in the barcode.

[0057] Four Au bumps 9a, 9b, 9c, and 9d are formed on the main surface of the chip 5 on which the circuit is formed. These four Au bumps 9a, 9b, 9c, 9d are located on a pair of imaginary diagonal lines shown by the two-dot chain line in FIG. 8, and the intersection of these diagonal lines (center of the main surface of chip 5) They are laid out so that their distances are almost equal. These Au bumps 9a, 9b, 9c, and 9d are formed using, for example, an electrolytic plating method, and the height thereof is, for example, about 15 m.

Note that the layout of these Au bumps 9a, 9b, 9c, and 9d is not limited to the layout shown in FIG. 8, but may be a layout that is easy to balance against the weight at the time of chip connection. For example, in a planar layout, the polygonal force formed by the tangents of the Au bumps is preferably arranged so as to surround the center of the chip.

[0059] Of the four Au bumps 9a, 9b, 9c, 9d, for example, the Au bump 9a constitutes the input terminal of the circuit shown in FIG. 11, and the Au bump 9b constitutes the GND terminal. . The remaining two Au bumps 9c and 9d constitute dummy bumps not connected to the above circuit. As shown in FIG. 9, the Au bump 9 a constituting the input terminal of the circuit is the uppermost metal layer exposed by etching the passivation film 20 and the polyimide resin 21 covering the main surface of the chip 5. It is formed on the wiring 22. In addition, a rare metal film 23 is formed between the Au bump 9a and the uppermost metal wiring 22 to enhance the adhesion between them. The passivation film 20 is composed of, for example, a laminated film of an oxide silicon film and a silicon nitride film, and the uppermost metal wiring 22 is composed of, for example, an A1 alloy film. In addition, the rare metal film 23 is composed of, for example, a laminated film of a Ti film having a high adhesion to the A1 alloy film and a Pd film having a high adhesion to the Au bump 9a. Although illustration is omitted, the connection part between the Au bump 9b and the uppermost metal wiring 22 constituting the GND terminal of the circuit has the same structure as described above. On the other hand, as shown in FIG. 10, the Au bump 9c (and 9d) constituting the dummy bump is connected to the metal layer 24 formed on the same wiring layer as the uppermost metal wiring 22, and this 1S metal. Layer 24 is not connected to the circuit.

As described above, the inlet 1 of the first embodiment is provided with a slit 7 whose one end reaches the outer edge of the antenna 3 in a part of the antenna 3 formed on one surface of the insulating film 2. The input terminal (Au bump 9a) of the chip 5 is connected to one side of the antenna 3 divided into two by the above, and the GND terminal (Au bump 9b) of the chip 5 is connected to the other side. With this configuration, the effective length of the antenna 3 can be increased, so that the inlet 1 can be reduced in size while ensuring the necessary antenna length.

[0062] In addition, the inlet 1 of the first embodiment is provided with Au bumps 9a and 9b and dummy Au bumps 9c and 9d constituting circuit terminals on the main surface of the chip 5, and these four Connect the Au bumps 9a, 9b, 9c, and 9d to the lead 10 of the antenna 3. With this configuration, the effective contact area between the Au bump and the lead 10 is larger than when only two Au bumps 9a and 9b connected to the circuit are connected to the lead 10. The bond strength of 10, that is, the connection reliability of both is improved. Also, by arranging four Au bumps 9a, 9b, 9c, 9d on the main surface of chip 5 with the layout shown in Fig. 8, lead 10 is placed on Au bumps 9a, 9b, 9c, 9d. The chip 5 does not tilt with respect to the insulating film 2 when connected. As a result, the chip 5 can be reliably sealed with the potting resin 4, so that the manufacturing yield of the inlet 1 is improved. [0063] Next, a method of manufacturing the inlet 1 configured as described above will be described with reference to FIGS.

FIG. 12 is a flowchart for explaining the manufacturing process of the inlet 1. As shown in this flow chart, first, wafer processing is performed to form a semiconductor element, an integrated circuit, the bump electrodes 9a-9d, etc. on the main surface of a wafer-like semiconductor substrate (hereinafter simply referred to as a substrate). (Process Pl). Subsequently, the wafer-like substrate is divided into chips by dicing to form the aforementioned chip 5 (process P2).

FIG. 13 is a plan view showing the insulating film 2 used for manufacturing the inlet 1, and FIG. 14 is a plan view showing a part of FIG. 13 in an enlarged manner.

As shown in FIG. 13, the insulating film 2 is carried into the manufacturing process of the inlet 1 while being wound around the reel 25. On one surface of the insulating film 2, a large number of antennas 3 are formed at predetermined intervals. In order to form these antennas 3, for example, a Cu foil having a thickness of about 18 μm is bonded to one surface of the insulating film 2, and this Cu foil is etched into the shape of the antenna 3. At this time, the slit 7 and the lead 10 described above are formed in each antenna 3. Thereafter, Sn (tin) plating is applied to the surface of the lead 10. In order to make the insulating film and the antenna thinner, for example, a first Cu film is formed on the surface of the insulating film having a thickness of about 38 m by sputtering, and the first Cu film is used as a seed layer for electrolysis. A second Cu film thicker than the first Cu film is formed by a plating method, and the first and second Cu films are patterned.

[0067] The insulating film 2 conforms to the standard of a film carrier tape, and is made of, for example, a polyimide resin film having a width of 50 μm or 70 mm and a thickness of 75 μm. 6. Device hole 8 shown in FIG. 7 is formed. In addition, sprocket holes 26 for conveying the insulating film 2 are formed at predetermined intervals on both sides of the insulating film 2. The device hole 8 and the sprocket hole 26 are formed by punching a part of the insulating film 2 with a punch.

Next, as shown in FIG. 15, the reel 25 is attached to the inner lead bonder 30 having the bonding stage 31 and the bonding tool 32, and the insulating film 2 is moved along the upper surface of the bonding stage 31. Then, chip 5 is connected to antenna 3 (process P3). [0069] To connect the chip 5 to the antenna 3, as shown in FIG. 16 (enlarged view of the main part in FIG. 15), the chip 5 is mounted on the bonding stage 31 heated to about 100 ° C. After positioning the device hole 8 of the insulating film 2 directly above the chip 5, the bonding tool 32 heated to about 400 ° C is pressed against the upper surface of the lead 10 protruding inside the device hole 8, and Au bump ( 9a-9d) and lead 10 are brought into contact. At this time, by applying a predetermined load to the bonding tool 3 2 for about 2 seconds, an Au—Sn eutectic alloy layer is formed at the interface between the Sn plating formed on the surface of the lead 10 and the Au bump (9a-9d). The Au bumps (9a-9d) and the lead 10 are bonded to each other.

[0070] Next, a new chip 5 is mounted on the bonding stage 31, and then the insulating film 2 is moved by one pitch of the antenna 3, and then the same operation as above is performed. Connect chip 5 to antenna 3. Thereafter, the chip 5 is connected to all the antennas 3 formed on the insulating film 2 by repeating the same operation as described above. The insulating film 2 that has been connected to the chip 5 and the antenna 3 is conveyed to the next resin sealing process while being wound around the reel 25.

[0071] In order to improve the connection reliability between the Au bump (9a-9d) and the lead 10, the four leads 10 are arranged in a direction perpendicular to the long side direction of the antenna 3 as shown in FIG. It is better to extend it. As shown in Fig. 18, when the four leads 10 are extended parallel to the long side direction of the antenna 3, when the completed inlet 1 is bent, the Au bump (9a-9d) and the lead 10 Since a strong tensile stress acts on the joint, there is a risk that the connection reliability between the two will decrease.

[0072] In the resin sealing process of chip 5, as shown in FIG. 19 and FIG. 20, potting resin 4 is used by using a dispenser 33 or the like on the upper surface and side surface of chip 5 mounted inside device hole 8. Then, the potting resin 4 is beta in the heating furnace (process P4). Force not shown In the resin sealing process, the potting resin 4 is supplied and beta treatment is performed while the insulating film 2 is moved. Then, the insulating film 2 that has been sealed with the grease is transported to the next inspection process (process P5) while being wound on the reel 25, and the connection state of the chip 5 and the antenna 3 and the quality of the appearance are checked. Inspection is performed. Many antennas 3 formed on the insulating film 2 are electrically separated from each other. Therefore, the continuity test between the individual antenna 3 and the chip 5 can be easily performed. Then, the manufacturing process of the inlet 1 is completed by laminating the cover film 6 (see FIG. 3) on one surface of the insulating film 2 (the surface on which the antenna 3 is formed).

[0073] As shown in Fig. 21, the inlet 1 manufactured as described above is packed in a state of being wound around a reel 25 and shipped to a customer (step P6).

Here, the inspection process of the process P5 will be described in detail.

[0075] The aforementioned inlet 1 has a communication distance characteristic, and the communication state changes depending on the distance between the reader device and the communication antenna electrically connected. In process P5, an arbitrary number (for example, 20) of inlets 1 are taken as samples, and the communication distance characteristics of these samples are measured to check whether they are within the specified values. In this inspection, for example, Inlet 1 and the reader unit communicate with each other while changing the frequency in increments of 1 MHz between 2. 407 GHz and 2.426 GHz for one distance (communication antenna ANT force is also applied to inlet 3 for the radio wave (first (Radio waves). Such communication is carried out at intervals of 5 mm between 0-330 mm, for example, for a total of 67 points. When the communication result is judged and recorded manually, according to the result, such as (A) when communication is possible, (B) when communication is not possible, and (C) when communication is not possible, For example, record using symbols such as A, B, and C (see Figure 22). However, when the communication result is manually determined in this way, for example, the determination of (A) when communication is possible and (C) when communication cannot be performed may vary depending on the subjectivity of the worker. . Also, if the operation of the inspection jig that holds the inlet 1 is manually performed to change the distance between the inlet 1 and the communication antenna, the work amount of the inspection jig is large. It takes a long time to move, and the position accuracy of the inspection jig may also decrease. In this way, when the communication result is recorded and the inspection jig is operated manually, the time required for one communication is 0.3 seconds, the recording time is 5 seconds, and the inspection jig is required to move. If the time is 5 seconds, the inspection time required for one inlet 1 inspection is (0.3 X 20 + 5 + 5) X 67 = 1072 = 18 minutes, and there are 20 inlet 1 samples. Takes 18 X 20 = 360 minutes.

Therefore, in the first embodiment, as shown in FIG. 23, as shown in FIG. ) The RM and the inspection jig TM are electrically connected to the computer COM, and the communication result is discriminated, recorded, and the inspection jig TM is moved by software control of the computer COM. As a result, the work by the worker WK can be greatly reduced, and the inspection process can be simplified.

[0077] The movement of the inspection jig TM is actually performed by the vertical movement of the arm (holding means) AM holding the inlet 1, and the computer COM controls the amount of movement of the vertical movement of the arm. . When the operator WK inputs a measurement start signal to the computer COM, the position force measurement is started with the distance between the inlet 1 and the communication antenna ANT being Omm, and that distance becomes the final measurement position (for example, 330 mm). It is automatically performed without the operator's hand. By controlling each operation with the computer COM in this way, the position accuracy of the arm AM, that is, the accuracy of the distance between the inlet 1 and the communication antenna ANT is improved by one digit or more compared to the case where it is controlled manually. According to the experiment conducted by the present inventors, it was able to be within about 0.1 mm. Whether it is a manual measurement or a computer-controlled measurement, the time it takes for the reader to read once is about 0.05 seconds. However, the monitoring software used for manual measurement requires a waiting time in consideration of human reaction time, so the measurement time is 0.3 seconds. In the case of computer control, it is not necessary to consider human reaction time, and it is possible to save only about 0.05 seconds because waiting time can be omitted. In addition, the movement time of the measuring jig TM, that is, the operating time of the arm AM, can be set to about 0.1 second, which is about 4.9 seconds shorter than when manually controlled (about 5 seconds). It was. In addition, the recording time of the measurement results can be reduced to almost 0 seconds, which is about 5 seconds shorter than when recording manually. Based on these numbers, the inspection time required for inspection of one inlet 1 is (0. 05 X 20 + 0 + 0. 1) X 67 = 73. 7 = 1. 23 minutes. The total measurement time when there are 20 samples of 1 is 1.23 X 20 = 24.6 minutes, which can be greatly reduced to approximately 7Z100 when controlled manually (360 minutes).

[0078] Further, in the first embodiment, the determination of the communication result is performed by the computer COM and the subjectivity of the worker WK can be excluded, so that a reproducible evaluation result can be obtained. From the above, according to the first embodiment, simple, high-speed and reliable It is possible to provide a measurement system for the communication distance characteristics of the let 1.

[0079] In the first embodiment, in consideration of the above measurement system, the influence of radio waves on the measurement result is also considered. The measurement of the communication distance characteristics of Inlet 1 must be performed in a so-called free space where there is no object that reflects radio waves in the surroundings and radio waves do not enter from outside. Therefore, if the measurement system cannot be installed in the anechoic chamber or anechoic box, as shown in Fig. 24, a measurement space with as few objects as possible around it is formed, and the measurement system is placed in the measurement space. Will be inspected. However, when an inspection is performed with such a measurement space, a traveling wave FW transmitted from the inlet 1 and the communication antenna ANT, for example, is installed on the back side of the ceiling CL. As a result, the communication distance characteristics of the inlet 1 may become a peculiar result.

Therefore, in the first embodiment, as shown in FIGS. 25 and 26, a radio wave shielding plate (radio wave absorbing means) DSB is disposed above the inlet 1 and the communication antenna ANT. This radio wave shielding plate DSB is composed of, for example, a radio wave absorber DSB1 having a thickness of about 20 mm, in which a conductive sponge is coated with a paint that also serves as a radio wave absorber, and a support DSB2 made of radio wave transmitting material (for example, polystyrene foam) and force. Is formed. Further, a support SJG made of a radio wave transmitting material (for example, styrene foam) is attached to the arm AM of the inspection jig TM. Supports DSB2 and SJG are configured to hold the electromagnetic wave absorber, and the structure is such that the arm AM can maintain a constant distance D1 from the inlet 1 in conjunction with vertical movement. The radio wave shield DSB is placed at a position sufficiently far from the communication limit of the inlet 1 design. For example, the distance D1 is the communication limit distance of the inlet 1 design (antenna ANT and inlet 1 in Fig. 26). Attach the radio wave shielding plate DSB to the support SJG so that it is about twice the distance D2). Before the radio wave shield DSB is fixed to the support SJG, the influence of the reflected wave force reflected by the radio wave shield DSB on the upward traveling wave FW transmitted from the communication antenna ANT is minimized. Finely adjust the position of the radio wave shielding plate DSB in the height direction so that it becomes the position. The traveling wave FW is radiated in an oblique direction, but the traveling wave FW radiated in the oblique direction does not return to the antenna ANT even if it is reflected, so it can be almost ignored. In other words, the upward traveling wave FW is reflected through the inlet 1 Since this will have the greatest effect on the measured value of the transmission distance characteristic, it is possible to prevent the measured value of the communication distance characteristic of the inlet 1 from being affected by preventing the reflected wave of the upward traveling wave FW. It becomes possible. That is, by installing the radio wave shield DSB as described above, the upward traveling wave FW transmitted from the antenna ANT can be absorbed by the radio wave shield DSB, and the traveling wave becomes a reflected wave. This prevents problems that cause abnormalities in the measured values of the communication distance characteristics of Inlet 1.

[0081] A customer who has purchased the inlet 1 cuts the insulating film 2 to obtain the separated inlet 1 as shown in FIG. 1 and FIG. 5, and then the inlet 1 and other members. An electronic tag is manufactured by combining and. For example, FIG. 27 shows an example in which a double-sided adhesive tape or the like is attached to the back surface of the inlet 1 to produce an electronic tag and this is attached to the surface of an article such as a slip 34.

[0082] (Embodiment 2)

In the second embodiment, for example, when manufacturing the inlet 1 (see FIG. 1) shown in the first embodiment, the steps after the step of mounting the chip 5 (see FIG. 4) on the antenna 3 are performed on the customer side. In this case, the communication distance characteristics of the chip 5 are measured on the shipping side or the like.

FIGS. 27 to 28 are a plan view, a side view, and a perspective view of the socket SKT used for measuring the communication distance characteristics of the chip 5, respectively. In principle, description of the same parts as those in the first embodiment (Example 1) is omitted. As described above, part or all of the present embodiment (example) is part or all of the preceding or subsequent embodiment (example).

[0084] The socket SKT is formed with an antenna substrate AKB and a chip holder CHG force. These antenna substrate AKB and chip holder CHG are formed of an insulating material (for example, plastic). Antenna pattern ATP having the same shape and material as antenna 3 (see FIG. 1) of inlet 1 in the first embodiment is attached to antenna substrate AKB. Chip 5 is arranged on this antenna pattern ATP. The chip holder COG is attached to the chip holder CHG, and this chip holder COG is structured to fix the chip 5 arranged on the antenna pattern ATP. The The chip retainer COG is made of a flexible insulating material (elastomer, etc.) such as urethane rubber, and has a structure that prevents damage to the chip 5 when the chip 5 is fixed on the antenna pattern ATP. RU

[0085] When the chip 5 is not mounted on the antenna 3, a communication distance characteristic cannot be measured because communication using radio waves is not possible. Therefore, by integrating the chip 5 and the socket SKT using the socket SKT of the second embodiment as described above, it can be regarded as the same as the inlet 1 of the first embodiment. Even with the chip 5 that is not mounted, it is possible to measure the communication distance characteristics as in the first embodiment.

[0086] Even when the communication distance characteristic of the chip 5 is measured using an automatic machine, the antenna substrate ATB can be used. As shown in Fig. 31, after placing the tip 5 on the antenna pattern ATP by the transport collet HKR, the tip 5 is fixed to the antenna pattern ATP by the terminal retainer TOG. In this state, the communication distance characteristics of chip 5 are measured.

[0087] According to the second embodiment as described above, the same effect as in the first embodiment can be obtained.

[Embodiment 3]

FIG. 32 is an explanatory diagram showing a problem when the communication distance characteristic of inlet 1 is measured using a radio wave chest. In principle, the description of the same parts as those in the first embodiment (Example 1) and the second embodiment (Example 2) is omitted. As described above, part or all of the present embodiment (example) is part or all of the preceding or subsequent embodiment (example).

[0089] In the anechoic box DAB, the communication antenna ANT described in the first embodiment and the fixing jig KJG for fixing the communication antenna ANT are arranged. The fixing jig KJG is a radio wave B sound box by the fixing screw KNJ. Fixed to DAB! The communication antenna ANT and the reader RM are electrically connected by a semi-rigid cable KBL. Inlet 1 is fed into the anechoic box DAB in the state of continuous insulation film 2 before being cut into individual inlets 1, and the communication distance characteristics are measured for each inlet 1. It is. The distance D3 between the inlet 1 and the communication antenna ANT is changed by loosening the fixing screw KNJ and changing the position of the communication antenna ANT together with the fixing jig KJG.

[0090] When the communication distance characteristic of the inlet 1 is measured under the above configuration,

(a) It is difficult to automatically change the distance D3 between the inlet 1 and the communication antenna ANT, and it takes time to acquire measurement data.

(b) There must be enough space in the anechoic box DAB to secure the required distance D3, which leads to an increase in the anechoic box DAB.

(c) A mechanism for accurately changing the distance D3 is required.

(d) In order to communicate with radio waves, it is necessary to block external radio waves with the anechoic box DAB, and it is difficult to downsize the radio B sound box DAB.

(e) Anechoic box If parts are changed inside the DAB, the radio wave environment will change, and data will be re-acquired.

(f) If the communication antenna ANT (fixing jig KJG) is moved frequently, the semi-rigid cable KBL will be stressed and damaged.

Such problems arise.

[0091] As shown in FIG. 33, the radio wave (traveling wave) transmitted from the communication antenna ANT spreads radially from the communication antenna ANT, so that the inlet 1 is moved away from the communication antenna ANT. The power received is smaller. Also, since the reflected wave from inlet 1 is also diffused in a radiation manner, the amount of modulation received by communication antenna ANT decreases as the inlet moves away.

Therefore, in the third embodiment, as shown in FIG. 34, a variable attenuator KGK is introduced between the communication antenna ANT and the reader RM, and the distance between the inlet 1 and the communication antenna ANT is introduced. The distance dependence is reproduced by changing the attenuation while D3 is fixed. In other words, the attenuation characteristic due to the distance between the standard inlet 1 and the communication antenna ANT is examined in advance, and the attenuation is changed by the variable attenuator KGK while keeping the distance D3 constant. The characteristic can be measured. As a result, the above-mentioned problems (a)-(f) can be solved.

[0093] In addition, since the anechoic box DAB can be miniaturized, the communication distance is long! Communication distance characteristics can be measured without using a large anechoic box DAB. In addition, in the case of the long inlet 1 with a communication distance of about lm or more, the number of measurement points increases when measuring the communication distance characteristics, and there is a concern that the measurement time may be lengthened. However, this embodiment shown in FIG. According to the configuration of 3, it is not necessary to change the distance D3 between the inlet 1 and the communication antenna ANT, and the measurement time can be shortened.

[0094] By the way, the inlet 1 cannot communicate if it is too far away from the communication antenna ANT, but it can also communicate if the received power is too strong and the internal circuit malfunctions. There are cases where it is not possible. Actually, in the process of selecting inlet 1 as a product, the power unavailability of communication at a short distance (under a strong electric field) as shown in FIG. 35 is measured, and then a long distance as shown in FIG. It is possible to communicate in a weak electric field.By measuring the force or power, it is possible to communicate at a distance between them by ensuring that communication is possible at both short and long distances. Guarantee that there is. In addition, as described above, when measuring the communication distance characteristics, the measurement is performed from the short distance to the long distance (see FIG. 37). In other words, one measurement device is required for communication measurement at short distance (under strong electric field), one for communication measurement at long distance (under weak electric field), and one for measurement of communication distance characteristics. Become. On the other hand, by adopting the configuration of the third embodiment as shown in FIG. 34, it becomes possible to perform these three measurements with one measuring device.

FIG. 38 shows a circuit when the communication antenna ANT is connected to the reader RM via the variable attenuator KGK. As shown in Fig. 38, since the power sent from the reader RM is sent to the communication antenna ANT via the variable attenuator KGK, the attenuation of the variable attenuator KGK is set to OdB. However, since the loss of the variable attenuator KGK itself actually exists, it cannot be strictly set to OdB. Therefore, there is a problem that power (radio waves) cannot be applied to the inlet 1 from the communication antenna ANT.

Therefore, in Embodiment 3, as shown in FIG. 39, a circuit that does not pass through variable attenuator KGK is provided, and this circuit and variable attenuator KGK can be switched by relays RL1 and RL2. . Thereby, the attenuation of the variable attenuator RM itself can be eliminated. In addition, as shown in Fig. 40, the circuit configuration using the bipolar double-headed relays RL3 and RL4 enables variable reduction. When the communication antenna ANT and the reader RM are electrically connected in a circuit that does not pass the attenuator KGK, the relay contacts can be reduced by one compared to the circuit configuration shown in Fig. 39. Further, the attenuation can be reduced.

FIG. 41 is a circuit diagram showing an internal circuit configuration of variable attenuator KGK. As shown in Fig. 41, attenuators GSK1 to GSK7 with various attenuation amounts are arranged in series in the variable attenuator KGK. Attenuators GSK1 to GS K7 There is a circuit KR1—KR7 to make it pass! /. Attenuator GSK1 One GSK7 and circuit KR1-KR7 can be switched by mechanical contact type relays RL11-RL17, so that various attenuations can be formed. Fig. 41 shows the force when seven attenuators GSK1 to GSK7 are arranged in the variable attenuator KGK. More attenuators can be arranged to further set the attenuation of the fine force. If you do not need to set a fine attenuation, or if you want to set only a small attenuation, you may use less than 7 attenuators.

[0098] When a variable attenuator KGK with an internal relay RL 11 RL17 as shown in Fig. 41 is used, the life of the variable attenuator KGK can be determined by repeating the switching of relays RL11-RL17. Therefore, it is necessary to periodically inspect the variable attenuator KGK. Therefore, in the third embodiment, as shown in FIG. 42, the relay RL5 is attached to the variable attenuator circuit KGC including the variable attenuator KGK and the relays RL3 and RL4, and the connection destination includes the communication antenna ANT and the power meter DRK. Switch to the power measurement circuit DSC. The relay RL5 can be switched under the control of the computer COM, and the computer COM reads from the wattmeter DRK whether or not the variable damping circuit KGC force is outputting a predetermined power and performs self-diagnosis. This self-diagnosis is automatically performed before, for example, the measurement of the communication distance characteristic of inlet 1 and after the measurement is completed. As a result, the variable attenuator KGK can be inspected regularly without increasing the burden on the operator. As a result, it is possible to improve the overall reliability of the system that measures the communication distance characteristics of inlet 1.

[0099] (Embodiment 4)

Next, the fourth embodiment will be described. Embodiment 1 (Example 1), form of implementation In principle, the description of the same parts as in Embodiment 2 (Example 2) and Embodiment 3 (Example 3) is omitted. As described above, part or all of this embodiment (example) is part or all of the preceding or subsequent embodiment (example).

[0100] Inlet 1 (see Fig. 1) is a device that communicates by radio waves. In addition, the strength of the radio wave reaching Inlet 1 depends on the surrounding radio wave environment, so the uncertain factor increases. In order to increase the production efficiency of inlet 1, it is preferable to eliminate this uncertain factor as much as possible. Since the inlet 1 itself operates at a high frequency current, radio waves are not necessarily required when measuring the communication distance characteristics of the inlet 1. Rather, for accurate measurement, it is preferable to carry out measurement through radio waves as much as possible.

[0101] Therefore, in the fourth embodiment, the chip 5 (see Fig. 4) is mounted on the antenna 3 (see Fig. 1) using the measuring jig SJG1 as shown in Fig. 43 before the step of mounting the chip 5 (see Fig. 4). Measure the communication distance characteristics of 5. The configuration (circuit configuration) of the measurement system other than the measurement jig SJG1 is, for example, the same as the configuration of the measurement system shown in FIG. 42 in the third embodiment (see FIG. 44). Measurement jig SJG1 has a structure in which socket SKT2 and signal terminal ST1 are attached to housing KT1. The top plate of the housing KT1 to which the socket SKT2 is attached has a structure in which a copper pattern is attached to, for example, a glass epoxy board, and the copper pattern is attached to the inside of the housing KT1. The side plate to which the signal terminal ST1 is attached and other side plates are made of metal such as aluminum or iron. As shown in FIG. 45, the chip 5 mounted in the socket SKT2 is electrically connected to the signal terminal ST1 via the microstrip line MSL (the copper pattern). The chip 5 mounted on the socket SKT2 is also electrically connected to the ground wiring GL that is electrically connected to the ground potential. For example, the characteristic impedance of the measurement system circuit including the variable attenuation circuit KGC (see Fig. 42) is about 50 Ω, but the characteristic impedance of chip 5 is not about 50 ohms. Not enough power is applied to chip 5. Therefore, as shown in FIG. 46, an impedance matching circuit ISK is inserted between the chip 5 and the microstrip line MSL and the ground wiring GL to match the characteristic impedance of both. In this mobile phone 4, the impedance matching circuit ISK is an impedance converter IHK attached to the microstrip line MSL (see Fig. 45). An open stub can be illustrated as an impedance change lHK.

[0102] By adopting the configuration of the fourth embodiment as described above, the anechoic box for forming the measurement environment becomes unnecessary, and the measurement jig SJG1 can be downsized. For example, a measurement jig for a transistor can be used as the measurement jig SJG1. This makes it possible to design the measuring jig SJG1 so that the measurement of the communication distance characteristics of chip 5 can be performed at high speed.

[0103] In addition, by adopting the configuration of the fourth embodiment as described above, it is possible to omit the part that transmits and receives radio waves, so the measurement environment is not affected by surrounding radio waves. Can be formed. As a result, it is possible to improve the measurement system of the communication distance characteristic of the chip 5 of the fourth embodiment.

[Embodiment 5]

In Embodiment 4, the communication distance characteristic of chip 5 is measured before the step of mounting chip 5 (see FIG. 4) on antenna 3 (see FIG. 1) using measurement jig SJG1 (see FIG. 43). In the fifth embodiment, the communication distance characteristic of the inlet 1 is measured in a situation where the chip 5 is mounted on the antenna 3 (see FIG. 1). In principle, the same parts as those in Embodiment 1 (Example 1), Embodiment 2 (Example 2), Embodiment 3 (Example 3), and Embodiment 4 (Example 4) are described. The description is omitted. As described above, a part or all of the present embodiment (example) is a part or all of the preceding embodiment (example).

FIG. 47 is a perspective view of measurement jig S JG2 used for measuring the communication distance characteristic of inlet 1 in the fifth embodiment. The configuration (circuit configuration) of the measurement system other than the measurement jig SJG2 is, for example, the same as the configuration of the measurement system shown in FIG. The measuring tool SJG2 has a structure in which, for example, a dipole antenna DPA and a signal terminal ST2 are attached to the housing KT2. The top plate of the housing KT2 to which the dipole antenna DPA is attached has a structure in which a copper pattern is attached to a glass epoxy substrate, for example, in the same manner as the measurement jig SJG1 described in the fourth embodiment. The copper pattern is attached inside the case KT2. Also, the side plate to which signal terminal ST2 is attached The other side plates are formed of a metal such as aluminum or iron as in the measurement jig SJG1 of the fourth embodiment. The dipole antenna DPA is arranged in the housing KT2, and is electrically connected to the signal terminal ST2 via the balun BRN inside the measuring jig SJG2 (see FIG. 48). By arranging the dipole antenna DPA so as to appear on the upper surface of the housing KT2, it is possible to prevent radio waves from radiating outside the measuring jig as much as possible except in the upward direction. An opening reaching the dipole antenna DPA is provided in the top plate of the housing KT2, and radio waves are emitted from the opening in a semicircular shape to communicate with the inlet 1. In the fifth embodiment, a shield SLD having a radio wave absorbing material force as shown in FIG. 49 is arranged to prevent radio waves radiated in a semicircular shape from radiating in directions other than upward. As a result, it is possible to prevent a malfunction that communicates with the inlet 1 other than the measurement target. When measuring the communication distance characteristics of inlet 1, the insulation film 2 before being divided into individual inlets 1 is passed through the top surface (top plate) of the housing KT2 and the shield SLD, and the insulation film 2 is formed. Measure the communication distance characteristics of inlet 1 continuously.

[0106] In addition, a monopole antenna MPA may be used instead of the dipole antenna DPA (see Fig. 50). In this case, the monopole antenna MPA is electrically connected to the signal terminal ST2 via the shielded cable SKB and V inside the measuring jig SJG2 (see Fig. 51).

[0107] When the communication distance characteristics of inlet 1 are measured using the measurement jig SJG2 as described above, the communication antenna of the measurement jig SJG2 becomes a dipole antenna DPA or a monopole antenna MPA, resulting in a low gain. By selecting one that has good matching with the dipole antenna (antenna 3) of the force inlet 1 itself, it is possible to bring them close to each other. As a result, the power received by inlet 1 can be made equivalent to the case of using a one-patch communication antenna ANT (see Fig. 33, for example). In addition, when the dipole antenna DPA or monopole antenna MPA is placed !, the radio wave attenuates rapidly when it is away from the upper surface of the measurement tool SJG2, so it is difficult to send unnecessary radio waves to other than the inlet 1 being measured. Become. Furthermore, since it becomes difficult to receive a wave from anything other than inlet 1 being measured, the measurement accuracy of the communication distance characteristic of inlet 1 can be improved. [0108] When measuring the communication distance characteristics of inlet 1 using the measurement jig SJG2 as described above, inlet 1 and dipole antenna DP A or monopole antenna can be obtained by using variable attenuator KGK. Since the distance dependence is reproduced while keeping the distance to the MPA constant, the communication limit value of the inlet 1 can be measured. As a result, quality control of inlet 1 can be facilitated. In addition, management with the standard sample is also possible when managing the measuring jig SJG2.

[0109] Further, when the communication distance characteristic of the inlet 1 is measured using the measurement jig SJG2 as described above, the measurement jig SJG2 is shielded, so that an anechoic box is not necessary. Therefore, the space required for measurement can be greatly reduced, and according to experiments conducted by the present inventors, it was possible to reduce the space to about 1Z100.

[0110] When the communication distance characteristic of inlet 1 is measured using the measurement jig SJG2 as described above, communication measurement at a short distance (under a strong electric field) is performed as in the third embodiment. Communication measurement at a long distance (under a weak electric field) and measurement of communication distance characteristics can be performed with one measuring jig SJG2. As a result, the number of manufacturing steps of the inlet 1 of the fifth embodiment can be reduced.

[0111] In addition, when measuring the communication distance characteristics of the inlet 1 using the measuring jig SJG2 as described above, the positional accuracy is not required to be stricter than the measurement using the auxiliary antenna. . Therefore, management of the measuring jig SJG2 can be facilitated.

[0112] Regarding the auxiliary antenna for enabling the selection on the non-contact RFID continuous tape in the mu-chip, prior applications by other inventors including one of the inventors (Japanese special No. 2004-220141, corresponding US application number 10-753, 454; US filing date January 9, 2004).

[0113] Further, when the insulating film 2 is passed between the upper surface (top plate) of the housing KT2 and the shield SLD, the antenna 3 is attached so that the antenna 3 contacts the dipole antenna DPA or the monopole antenna MPA. The characteristics of the chip 5 itself can be measured by passing the insulating film 2 with the surface facing toward the housing KT2.

[0114] Further, since the measurement jig SJG2 can be reduced in size, a plurality of measurement jigs SJG2 (housing KT2) can be used side by side. That is, as shown in Fig. 52, By arranging the tools SJG2 (housing KT2) and allowing the insulating film 3 to pass through all of these measuring jigs SJG2, the communication distance characteristics of a plurality of inlets 1 can be measured at a time. As a result, the time required for measuring the communication distance characteristics of inlet 1 can be further reduced.

[0115] While the invention made by the present inventor has been specifically described based on the embodiments, the present invention is not limited to the above-described embodiments, and various modifications can be made without departing from the scope of the invention. There's nothing wrong!

[0116] In the above-described embodiment, the force that constitutes the antenna using the Cu foil attached to the insulating film made of polyimide resin is used, for example, the A1 (aluminum) foil attached to one surface of the insulating film. The material cost of the inlet can be reduced by configuring the antenna or by configuring the insulating film with a less expensive resin (for example, polyethylene terephthalate) than the polyimide resin. When the antenna is composed of A1 foil, it is preferable to connect the Au bump of the chip and the antenna by, for example, forming an AuZAl joint using both ultrasonic and heating.

Industrial applicability

[0117] The method for manufacturing an inlet for an electronic tag of the present invention can be applied to a step of measuring the communication distance characteristics of the electronic tag.

Claims

The scope of the claims

[1] RFID device manufacturing method including the following steps:

(a) The communication distance characteristic of the RFID element having the first antenna is approximately equal to the distance between the first antenna and the second antenna by using the second antenna provided outside the RFID element. The process of measuring in a constant state.

[2] In the RFID element manufacturing method of claim 1, the measurement is performed on a plurality of RFID elements substantially simultaneously.

[3] In the RFID element manufacturing method according to claim 2, the plurality of RFID elements are fixed on a single tape.

[4] In the method for manufacturing an RFID element according to Claim 1, the RFID element has an antenna on an integrated circuit chip storing ID data.

[5] RFID device manufacturing method including the following steps:

(a) A step of electrically measuring a communication distance characteristic of an RFID element that substantially does not have an antenna without using an antenna provided outside the RFID element.

[6] RFID device manufacturing method including the following steps:

(a) The communication distance characteristics of an RFID element having substantially no antenna are measured using radio waves between the first and second antennas using the first and second antennas provided outside the RFID element. The process of measuring.

[7] In the RFID element manufacturing method according to [6], the measurement is performed in a state in which a distance between the first antenna and the second antenna is substantially constant.

[8] RFID device manufacturing method including the following steps:

(a) The communication distance characteristic of the RFID element having the first antenna is automatically determined by using the second antenna provided outside the RFID element to determine the distance between the first antenna and the second antenna. The process of measuring automatically at multiple points by changing it automatically.

[9] RFID device manufacturing method including the following steps:

(a) A step of electrically measuring the communication distance characteristics of the RFID element without using an antenna provided outside the RFID element.