JP2003130905A - Electronic component measuring instrument and measuring substrate - Google Patents

Abstract

PROBLEM TO BE SOLVED: To enable an electronic component measuring instrument to continuously measure many electronic components in a state where the instrument is in contact with the components for a long period while the instrument maintains sufficient flexibility by making bumps unpeelable from copper wiring. SOLUTION: The electronic component measuring instrument is provided with a stage 21 on which a measuring substrate 22 having the bumps 25 and 26 with which the terminals of a chip antenna 29 are brought into contact and the copper wiring 23 and 24 electrically connected to the bumps 25 and 26 is placed and a carrying means 6 which carries the chip antenna 29 onto or from the substrate 22 placed on the stage 21. The bumps 25 and 26 are constituted of metal foil tapes 25a and 26b or anisotropic conductive sheets respectively carrying elastic conductive adhesives 25a and 26a which can be stuck to the wiring 23 and 24.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a measuring device and a substrate for measuring electronic parts such as chip antennas used for measuring various characteristics such as input characteristics and reflection characteristics of electronic parts such as chip antennas.

[0002]

2. Description of the Related Art With the miniaturization of wireless communication devices, the number of antennas generally called chip antennas has increased. The chip antenna as a whole is molded into a rectangular parallelepiped shape similar to a semiconductor chip or the like. Further, electrodes (terminals) connected to internal circuits are arranged on the lower surface of the chip antenna.

When manufacturing this chip antenna, an inspection for measuring various characteristics of the chip antenna is indispensable. In order to measure the input characteristics (for example, reflection characteristics) of this antenna with high accuracy, a method such as mounting a chip antenna on a measurement substrate by soldering and measuring it is adopted.

[0004]

However, the measuring method of mounting the chip antenna on the measuring board by soldering is to actually carry out the soldering work and mount the chip antenna on the board before the inspection. Therefore, the implemented sample itself cannot be used as a product.
As a result, there is a problem that it is necessary to carry out a sampling inspection for a part of the product.

Therefore, in place of the solder, a bump made of a conductive and flexible resin that is easy to contact and release the chip antenna is brought into contact with the terminal, and a necessary signal is input and output through the bump for inspection. It is possible to do. In this case, in order to inspect a large number of chip antennas, the bumps are required to have durability that does not change the characteristics even when repeatedly contacting the chip antennas.

The present invention solves the above-mentioned problems, and is capable of continuously measuring a large number of chip antennas for a long period of time while maintaining sufficient flexibility even when it is repeatedly used. An object of the present invention is to provide a measuring device for electronic parts having good properties.

[0007]

In order to achieve the above object, a measuring device for an electronic component according to a first aspect of the present invention comprises a bump contacting a terminal of the electronic component and a copper wiring electrically connected to the bump. A stage on which a measurement substrate having is mounted, and a carrying means that carries in the electronic component on the measurement substrate mounted on the stage, or carries out the electronic component from the measurement substrate, The bumps are composed of a metal foil tape with a conductive adhesive that is elastic and can be bonded to the copper wiring. As a result, even when the measurement tact time is high, the contact property is improved due to the flexibility of the conductive adhesive, good conductivity with the copper wiring due to conductivity is achieved, and fatigue of the conductive adhesive is prevented with the metal foil tape. And enable repeated use,
The characteristics of electronic components such as chip antennas can be continuously measured over a long period of time with high reliability without causing recovery deterioration of the bump shape.

The measuring device for electronic parts according to the invention of claim 2 is characterized in that the metal foil tape is a copper foil tape or an iron foil tape. As a result, since the copper foil tape has a low electric resistance, highly accurate characteristic measurement of electronic parts can be realized, while the iron foil tape has a high measurement tact time for electronic parts such as chip antennas. Repeated measurement can be performed while effectively preventing the bump shape from being deformed. Further, in the electronic component measuring apparatus according to the invention of claim 3, the bump and the copper wiring are connected and fixed by a conductive resin so as to cover the upper surface and a part of the end surface of the bump. Characterize. This allows
It is possible to prevent the bump from coming off from the copper wiring so that the elasticity of the conductive adhesive is not lost, and it is possible to reliably prevent a large deformation or abnormal deformation of the bump itself.

Further, the measuring device for electronic parts according to the invention of claim 4 is characterized in that the conductive resin is a urethane-based conductive resin. This makes it possible to sufficiently hold the bump with respect to the copper wiring without hindering the softness of the conductive adhesive of the bump.

According to the fifth aspect of the present invention, in the electronic component measuring apparatus, the bump is replaced with the metal foil tape, and the bump has anisotropic conductivity in the thickness direction and insulation in the surface direction. It is a sheet. Thus, the terminals of the electronic component can be connected to the measurement board with one sheet. Further, in the electronic component measuring apparatus according to the invention of claim 6, the anisotropic conductive sheet is an insulating sheet disposed between the electronic component and the measurement substrate, and the sheet is arranged in a thickness direction. It is characterized by comprising a plurality of conductor wires penetrating through and spaced from each other. Thus, the upper and lower circuits can be electrically connected to each other while the conductor lines are insulated from each other.

The measuring board for an electronic component according to a seventh aspect of the present invention has a bump with which a terminal of the electronic component is in contact, and a copper wiring electrically connected to the bump. It is characterized in that it is composed of a metal foil tape with a conductive adhesive material that can be adhered to the copper wiring and has elasticity. As a result, when measuring the characteristics of an electronic component while maintaining good electrical continuity with the copper wiring, it is possible to reliably realize repeated contact with this electronic component for a long period of time. Can be realized.

Further, the measuring board of the electronic component according to the invention of claim 8 is characterized in that the metal foil tape is a copper foil tape or an iron foil tape. As a result, since the copper foil tape has a low electric resistance, highly accurate characteristic measurement of electronic parts such as a chip antenna can be realized.
With iron foil tape, even if the measurement tact time of electronic parts such as a chip antenna is high, repeated measurement can be performed while effectively preventing the bump shape from being deformed.

According to a ninth aspect of the present invention, there is provided a measuring substrate for electronic parts in which the bumps and copper wiring are connected and fixed by a conductive resin so as to cover the upper surfaces and a part of the end surfaces of the bumps. It is characterized by being This prevents the conductive resin from losing the elasticity of the conductive adhesive, makes it difficult for the bumps to be separated from the copper wiring, and reliably prevents the bumps from being largely deformed or abnormally deformed.

Further, the measuring board of the electronic component according to the invention of claim 10 is characterized in that the conductive resin is a urethane-based conductive resin. This makes it possible to sufficiently hold the bump with respect to the copper wiring without hindering the softness of the conductive adhesive of the bump.

Further, in the substrate for measuring an electronic component according to the invention of claim 11, the bump is replaced with a metal foil tape, and the bump has an anisotropic conductivity in the thickness direction and an insulation property in the plane direction. It is a characteristic sheet. Thus, the terminals of the electronic component can be connected to the measurement board with one sheet. According to a twelfth aspect of the present invention, there is provided a measurement substrate for an electronic component, wherein the anisotropic conductive sheet is an insulating sheet disposed between the electronic component and the measurement substrate, and has a thickness of the sheet. It is characterized by comprising a plurality of conductor wires penetrating in the direction and spaced from each other. Thus, the upper and lower circuits can be electrically connected to each other while the conductor lines are insulated from each other.

[0016]

BEST MODE FOR CARRYING OUT THE INVENTION An embodiment of the present invention will be described below. FIG. 2 is a plan view conceptually showing the overall structure of a chip antenna measuring system having an electronic component measuring apparatus of the present invention. In the figure, 1 is a support for the system, 2
Is a pallet supply loader for supplying the pallet 3 containing a large number of chip antennas to be measured (inspected) to the pallet positioning position, and 4 is an empty pallet 3 after the chip antenna is taken out from the pallet positioning position. A pallet discharging loader 5 is a work supply conveyor that sends out a chip antenna (work) that is picked up and mounted by a nozzle described later from the pallet 3 at the pallet positioning position, and 6 is a vacuum pressure from the work supply conveyor 5 Adsorb chip antennas one by one with the nozzle using
The suction nozzle device is made of resin and is sequentially supplied to the work positioning unit 7, the work thickness measuring unit 8, the work inspection unit 9, and the defective product storage unit 10.

Further, 11 is a work discharge conveyor provided on the opposite side of the work supply conveyor 5 with respect to the suction nozzle device 6, and 12 is for receiving the chip antenna discharged from the work discharge conveyor 11 by the nozzle,
Pallet supply unloader for supplying the empty pallet 3 to the pallet positioning position, 12 for pallet supply unloader for supplying the empty pallet to the pallet positioning position at the discharge end of the work discharge conveyor 11, and 13 for pallet positioning position It is a pallet discharging unloader that receives the pallet 3 containing the measured chip antennas.

In such a chip antenna measuring system, after the pallet 3 accommodating the chip antenna is supplied from the pallet supply loader 2 to the pallet positioning position,
The chip antennas on the pallet 3 are sent out one by one onto the work supply conveyor 5 by the suction and the suction release of the nozzles. By this delivery, the pallet 3 which has become empty is discharged to the pallet discharging loader 4. On the other hand, the chip antenna on the work supply conveyor 5 is adsorbed by the nozzle and sent to the work positioning unit 7. Here, the positioning is performed by pressing the jig against the chip antenna from four directions.

Further, the chip antenna positioned by the work positioning unit 7 is adsorbed by the nozzle and sent to the work thickness measuring unit 8 where the thickness of the chip antenna is measured. Here, a method is used in which the height of the chip antenna adsorbed by the nozzle is pressed against the table and the height of the chip antenna is measured. Subsequently, the chip antenna for which the thickness has been measured is adsorbed by the nozzle and sent to the work measuring unit 9. The work inspection unit 9 measures the electrical characteristics of the chip antenna as a work, for example, the input characteristics and the reflection characteristics.

In this way, after the electrical characteristics are measured, the chip antenna is sent out to the defective product storage unit 10 for defective nozzles, and the defective chip is sent to the pallet 3 at the pallet positioning position. It is adsorbed one by one by the nozzle and taken out. An empty pallet 3 is supplied from the pallet supply and unloader unit 12 to the pallet locating position, and the chip antennas taken out as described above are successively taken out onto the empty pallet 3 and then palletized. It is sent to the discharge unloader unit 13.

FIG. 2 is a perspective view conceptually showing the schematic structure of the work inspection section 9 which is the measuring apparatus of the chip antenna of the present invention. In the figure, reference numeral 21 is a rectangular parallelepiped stage installed on a measurement table (not shown), so that it has a support surface 21a for supporting a measurement substrate described later.
It is composed of a block in which the hollow portion 21b is formed. This block is made of an acrylic resin having a relatively small dielectric constant, and is formed by hollowing out a hollow portion 21b having a hollow shape as shown in the drawing, for example, in the shape of a square cylinder with a bottom. As a result, the hollow portion 2
The chip antenna installed on 1b is kept at a certain distance from the high dielectric constant object around the measurement environment.

A pair of the support surfaces 21a facing each other supports a measurement substrate 22 having a rectangular shape in a plan view. This measurement substrate 22, as shown in FIG.
For example, a pair of copper wirings 2 on an insulating resin substrate
3 and 24 are arranged at an interval D, and a pair of bumps 25 and 26 are opposed to each other on the copper wirings 23 and 24 opposed to each other at the interval D. The bumps 25, 26 are made of elastic metal foil tapes 25b, 26b with Ag-based conductive adhesives 25a, 26a on their back surfaces, for example.
b and 26b are adhered to the copper wirings 23 and 24 via the conductive adhesives 25a and 26a. Conductive copper foil tape or iron foil tape is used as the metal foil tapes 25b and 26b.

It should be noted that the bumps 25 and 26 have a tendency that when the adhesive strength of the conductive adhesives 25a and 26a to the copper wirings 23 and 24 is reduced or deformed, or when the metal foil tapes 25b and 26b are worn. It can be peeled off and replaced.

The bumps 25, 26 and the copper wirings 23, 24 are connected and fixed by conductive resins 27, 28 so as to cover the upper surfaces and a part of the end faces of the bumps 25, 26. The conductive resins 27 and 28 contact the bumps 25 and 26 on the conductive wires 23 and 24, respectively, so that the bumps 25 and 26 can be electrically conducted, and the bumps 25 and 26 are securely fixed to the conductive wires 23 and 24. There is.

Further, these conductive resins 27, 28
Functions to prevent the bumps 25 and 26 from being largely crushed or deformed when the chip antenna is pressed toward the copper wirings 23 and 24 by a nozzle described later when measuring the characteristics of the chip antenna. . 29 is the chip antenna as a work, which is
The bumps 25 and 26 are mounted so as to straddle the space D. At this time, a pair of terminals of the chip antenna 29 come into contact with the bumps 25 and 26, respectively.

Reference numeral 30 denotes a nozzle of the suction nozzle device 6 as a conveying means, which uses vacuum pressure to suck the chip antenna 29 and place it on the bumps 25, 26.
The bumps 25 and 26 are taken out from the bumps 25 and 26 and conveyed, and when the characteristics of the chip antenna 29 are measured, the chip antenna 29 is pressed vertically to bring the terminals into close contact with the bumps 25 and 26. To function.

In this case, it is desirable that the nozzle 30 be controlled to move up and down in a direction perpendicular to the center of the chip antenna 29. At one end of the measurement substrate 22,
Connector 31 electrically connected to each of the copper wirings 23 and 24
Is attached and functions to receive the measurement signal from the network analyzer connected to the outside through the connector 31 and to supply the measurement result data to the network analyzer.

The chip antenna automatic measuring apparatus having such a configuration is a measurement object in order to prevent the occurrence of a measurement error due to the influence of the surrounding human body or an object such as metal, that is, the influence of the dielectric constant due to the approach thereof. Chip antenna 29
The glass-epoxy resin substrate on which is mounted is supported on a hollow stage.

When measuring the characteristics of the chip antenna 29, the measurement substrate 22 is supported so that the support surface 21a of the stage 21 is in contact with at least two places on the lower surface of the peripheral portion of the measurement substrate 22, so that the nozzle 30 is supported. It is possible to prevent the measurement substrate 22 from being largely deformed from the state in which the measurement substrate 22 is kept horizontal when the chip antenna 29 is pressed by the method. In addition, even if the measurement substrate 22 is slightly deformed, the conductive resins 27 and 28 can be applied to the bumps 25,
Since 26 is held to the measurement substrate 22 via the copper wirings 23 and 24, it is possible to prevent abnormal deformation of the bumps 25 and 26. Therefore, electrical contact (adhesive contact) between each terminal of the chip antenna 29 and the bumps 25, 26 can be made reliable and stable. As a result, it is possible to avoid an error in the measurement result of the characteristic by the measuring device.

Further, since the metal foil tapes 25b and 16b of the bumps 25 and 26 face the mounting side of the antenna chip 29, frictional force and stress are exerted by the suction and pressing of the bumps 25 and 26 by the nozzle 30. Even if the metal foil tapes 25b and 26b themselves are not worn or deteriorated in strength, the durability of the bumps 25 and 26 is maintained, the bump shape can be quickly recovered, and the measurement waveform may be distorted. , It is possible to avoid falling into unmeasurable.

If a copper foil tape is used as the metal foil tape, the electrical resistance between the chip antenna and the copper wiring can be sufficiently suppressed and a highly accurate measurement signal can be obtained. on the other hand,
If an iron foil tape is used, sufficient toughness, abrasion resistance and strength can be obtained while ensuring a certain level of conductive performance.

Next, another embodiment of the present invention will be described with reference to FIGS. In this embodiment, the bump 2 made of a metal foil having a laminated structure used in one embodiment is used.
Instead of 5 and 26, an anisotropic conductive sheet 40 is provided. As shown in FIGS. 5 and 6, the anisotropic conductive sheet 40 includes a sheet 41 made of an insulating material such as silicon rubber, and fine conductor wires (for example, metal wires such as copper and aluminum) 42 arranged at predetermined intervals. It is arranged in. As shown in FIGS. 5 and 6, the anisotropic conductive sheet 40 has the conductor lines 42 parallel to each other and the sheet 4
Since 1 penetrates in the thickness direction, the conductor lines 42 are insulated from each other, and the individual conductor lines 42 are electrically connected in the vertical direction. That is, the anisotropic conductive sheet 40 has conductivity in the thickness direction and has insulation in the surface direction of the sheet.

Anisotropically conductive sheet 40 having such a structure
Is provided on the copper wirings 23 and 24 and fixed by adhesives 27 and 28, as shown in FIG.
In this case, since the upper and lower ends of the conductor wire 42 are exposed on the surface of the sheet 41, the copper wiring 2 is formed on the lower surface of the conductor wire 42.
3 and 24, and point contacts to the terminals of the chip antenna 29 on the upper surface. Therefore, the copper wiring 2 at the position where the terminal of the chip antenna 29 overlaps the terminal in plan view is formed.
3, 24 can be electrically connected. Further, since the conductor wires 42 are insulated from each other, one anisotropic conductive sheet 40 is used as the chip antenna 29 and the copper wirings 23, 2.
The copper wirings 23 and 24 can be connected to the necessary terminals of 29 of the chip antenna simply by disposing the copper wirings 23 and 24. When using this anisotropically conductive sheet 40, the adhesives 27 and 28 do not require conductivity.

When the anisotropic conductive sheet is used, the load is distributed over the entire sheet as compared with the case where a separate sheet is used for each of the copper wirings 23 and 24. Therefore,
When the chip antenna is pressed during measurement,
The load is dispersed over the entire sheet 41 and elastically deformed, and since the silicon rubber that is the main body is more durable than the metal foil tape, it can be repeatedly used as compared with the case where the metal foil tape is used. Deterioration can be reduced. Further, since the conductor wire 42 is oriented in the thickness direction, the projected area on the substrate or the electronic component is small, and the parasitic capacitance of the bump portion is reduced as compared with the case where a metal foil is used. It is possible to suppress variations in frequency. Specifically, when the same chip antenna is repeatedly measured, the variation of the resonance frequency is 0.4% when the metal foil tape is used, whereas by using the anisotropic conductive sheet, The variation could be suppressed to 0.1%.

[0035]

As described above, according to the present invention, a measurement substrate having a bump with which a terminal of an electronic component such as a chip antenna contacts and a copper wiring electrically connected to the bump is mounted. A stage and a transfer means for loading the electronic component onto the measurement substrate mounted on the stage or unloading the electronic component from the measurement substrate, and bonding the bump to the copper wiring. Since it is composed of a metal foil tape with a conductive adhesive that is flexible and capable, even when the measurement tact time is high, the flexibility of the conductive adhesive improves the contact with electronic parts and the copper wiring due to conductivity. It is possible to secure good electrical continuity with and to repeatedly use the metal foil tape based on the increase in strength, and it is possible to accurately measure the characteristics of electronic components for a long time without incurring the recovery deterioration of the bump shape. The effect is obtained.

Further, since the metal foil tape is a copper foil tape or an iron foil tape, the electrical resistance of the copper foil tape is low, so that highly accurate characteristic measurement of electronic parts can be realized. On the other hand, with the iron foil tape, Even if the measurement tact is high speed, it is possible to effectively prevent the bump shape from being deformed while maintaining sufficient strength and toughness.

Further, since the bumps and the copper wiring are connected and fixed by the conductive resin so as to cover the upper surface and a part of the end surface of the bump, the elasticity of the conductive adhesive is not lost. It is possible to prevent the bump from peeling off from the copper wiring and surely prevent a large deformation or abnormal deformation of the bump itself. Furthermore, since the conductive resin is a urethane-based conductive resin, there is an advantage in that the bump can be sufficiently held to the copper wiring without hindering the softness of the conductive adhesive of the bump. .

Further, according to the present invention, in a measuring board for an electronic component having a terminal, the electronic component has a bump with which the terminal of the electronic component comes into contact, and a copper wiring electrically connected to the bump, The bump is made of a metal foil tape with a conductive adhesive material that can be bonded to the copper wiring and has elasticity so that the electronic component can be used when measuring the characteristics of the electronic component while maintaining good conductivity with the copper wiring. It is possible to surely realize repeated contact with and for a long period of time, and it is possible to achieve this at a low cost with a substrate structure having a simple structure. By using the measurement substrate having such a simple and low-cost structure, it is possible to rapidly and continuously measure the characteristics of many electronic components.

Further, in the present invention, in the measuring device or the measuring substrate, as the bump, instead of the metal foil tape, an anisotropic conductive material having conductivity in the thickness direction and insulation in the surface direction is used. Using a sheet, specifically, an insulating sheet arranged between the electronic component and the measurement substrate,
Since a sheet consisting of a plurality of conductor wires that penetrate the sheet in the thickness direction and are spaced apart from each other is used, the conductor of the measurement circuit and the terminal of the electronic component are formed as a single sheet. The sheets can be electrically connected to each other. Further, since the load applied at the time of measurement can be absorbed by the elastic deformation of the sheet, it can be used for a long period of time.

[Brief description of drawings]

FIG. 1 is a plan view conceptually showing an electronic component measuring system including an electronic component measuring apparatus and a measurement substrate according to an embodiment of the present invention.

FIG. 2 is a perspective view showing an electronic component measuring apparatus and a measuring substrate according to an embodiment of the present invention.

FIG. 3 is an enlarged cross-sectional view showing in detail the bump structure on the measurement substrate in FIG.

FIG. 4 is an enlarged sectional view showing a pump structure of another embodiment.

5 is a partial cross-sectional perspective view of the anisotropic conductive sheet used in FIG.

6 is a plan view of the anisotropic conductive sheet of FIG.

[Explanation of symbols]

6 Suction nozzle device (conveying means) 9 Work inspection department (measurement device for electronic parts) 21 stages 22 Measurement board 23, 24 copper wiring 25, 26 bumps 25a, 26a conductive adhesive 25b, 26b metal foil tape 27, 28 Conductive resin 29 chip antenna 30 nozzles 40 Anisotropically conductive sheet 41 sheets 42 conductor wire

   ─────────────────────────────────────────────────── ─── Continued front page    (72) Inventor Eiichiro Hirose             Saitama Prefecture Chichibu-gun Yokose-cho 2270 Yokoze             Ryo Materials Co., Ltd. Ceramics Factory Den             Child Device Development Center (72) Inventor Nobuchi Sakai             Saitama Prefecture Chichibu-gun Yokose-cho 2270 Yokoze             Ryo Materials Co., Ltd. Ceramics Factory Den             Child Device Development Center F-term (reference) 2G011 AA10 AA12 AA21 AB08 AC05                       AC14 AE22

Claims (12)

[Claims] 1. A measuring device for measuring an electronic component having a terminal, wherein a stage on which a measuring substrate having a bump with which the terminal contacts and a copper wiring electrically connected to the bump is mounted, and the stage. And a transfer means for loading the electronic component onto the measurement substrate mounted on the measurement substrate or for unloading the electronic component from the measurement substrate, wherein the bump is adhesive and elastic to the copper wiring. A measuring device for electronic parts, comprising a metal foil tape with a conductive adhesive material. 2. The electronic component measuring apparatus according to claim 1, wherein the metal foil tape is a copper foil tape or an iron foil tape. 3. The electronic component according to claim 1, wherein the bump and the copper wiring are connected and fixed by a conductive resin so as to cover the upper surface and a part of the end surface of the bump. Measuring device. 4. The electronic device measuring apparatus according to claim 3, wherein the conductive resin is a urethane-based conductive resin. 5. A measuring device for measuring an electronic component having a terminal, a stage on which a measuring substrate having a bump with which the terminal comes into contact and a copper wiring electrically connected to the bump is mounted, and the stage. Carrying in the electronic component on the measurement substrate mounted on, or constituted by a transporting means for unloading the electronic component from the measurement substrate, the bump has conductivity in the thickness direction, A measuring device for electronic parts, which is an anisotropic conductive sheet having an insulating property in a plane direction. 6. The anisotropically conductive sheet is an insulating sheet disposed between the electronic component and the measurement substrate, and penetrates the sheet in the thickness direction, and is spaced apart from each other. The electronic device measuring apparatus according to claim 5, comprising a plurality of conductor wires arranged in advance. 7. A measurement substrate for measuring an electronic component having a terminal, comprising a bump with which the terminal is in contact, and a copper wiring electrically connected to the bump, wherein the bump is made of the copper. A substrate for measurement of electronic parts, which is composed of a metal foil tape with a conductive adhesive material that can be adhered to wiring and has elasticity. 8. The substrate for measuring an electronic component according to claim 7, wherein the metal foil tape is a copper foil tape or an iron foil tape. 9. The electronic component according to claim 7, wherein the bump and the copper wiring are connected and fixed by a conductive resin so as to cover the upper surface and a part of the end surface of the bump. Measurement board. 10. The substrate for measuring an electronic component according to claim 9, wherein the conductive resin is a urethane-based conductive resin. 11. A measurement substrate for measuring an electronic component having a terminal, wherein a bump with which the terminal is in contact,
And a copper wiring electrically connected to the bump,
The measurement board for an electronic component, wherein the bump is an anisotropic conductive sheet having conductivity in a thickness direction and insulation in a surface direction. 12. The anisotropic conductive sheet, which is an insulating sheet disposed between the electronic component and the measurement substrate,
The substrate for measurement of electronic components according to claim 11, comprising a plurality of conductor wires that penetrate the sheet in the thickness direction and are arranged at intervals from each other.