JPWO2006085372A1 - Method for manufacturing inlet for electronic tag - Google Patents

Abstract

In order to shorten the time required for measuring the communication characteristics of the non-contact type electronic tag and to enable the measurement to be performed easily, the reader machine RM and the inspection jig TM are electrically connected to the computer COM, and the communication result Discriminating, recording, and moving the inspection jig TM (arm AM holding the inlet 1) by software control of the computer COM. When the operator WK inputs a measurement start signal to the computer COM, The measurement is started from a position where the distance to the communication antenna ANT is 0 mm, and is automatically performed without the operator's hand until the distance reaches the final measurement position.

Description

  The present invention relates to a manufacturing technique of an electronic tag inlet, and more particularly to a technique effective when applied to a process of measuring a communication distance characteristic of an electronic tag.

  Japanese Unexamined Patent Publication No. 2004-286666 (Patent Document 1) properly communicates each IC label of an IC roll label conveyed along a predetermined direction at a desired communication distance without damaging an IC chip or an antenna. A communication inspection apparatus that can be inspected is disclosed.

  Japanese Patent Application Laid-Open Publication No. 2004-287800 (Patent Document 2) discloses an IC product inspection apparatus capable of quickly processing inspection of a single piece RF-ID media such as an IC card. .

  Japanese Patent Laid-Open No. 2003-44810 (Patent Document 3) discloses a technique for measuring the communication distance of an IC card using a reader / writer connected to a personal computer. There is a statement that it was confirmed that communication was possible from a distance.

  In Japanese Patent Laid-Open No. 2000-9776 (Patent Document 4), a noise radio wave from the outside is blocked, and an artificial radio wave between the antenna of the device under test (EUT) and the antenna on the measuring apparatus side is simulated. A wireless communication characteristic test apparatus that performs simple exchange and makes it possible to arbitrarily vary the distance between the antennas in a pseudo manner is disclosed.

  Japanese Patent Application Laid-Open No. 11-72518 (Patent Document 5) discloses a variable attenuator for connecting a communication device via a coaxial cable or a waveguide instead of an antenna to provide a spatial distance attenuation. Alternatively, a technique for performing characteristic measurement and evaluation test by inserting a fixed attenuator in the middle of a coaxial cable or waveguide is disclosed.

Japanese Patent Application Laid-Open No. 2004-220141 (Patent Document 6 (corresponding US Patent Publication USP 5,644,245)) discloses an IC inlet to be inspected in a state where a large number of IC inlets are formed on an insulating film. A method for accurately inspecting good and bad is disclosed.
JP 2004-286666 A JP 2004-287800 A JP 2003-44810 A JP 2000-9776 A Japanese Patent Laid-Open No. 11-72518 JP 2004-220141 A

  A non-contact type electronic tag stores desired data in a memory circuit in a semiconductor chip (hereinafter simply referred to as a chip), and reads this data using microwaves (other RF (Radio Frequency) radio waves or electromagnetic waves). This is the tag. Since the electronic tag stores data in a memory circuit in the chip, there is an advantage that a large amount of data can be stored as compared with a tag using a barcode. Further, the data stored in the memory circuit has an advantage that unauthorized tampering is difficult as compared with the data stored in the barcode.

  The present inventors are examining a technique for measuring communication characteristics of a non-contact type electronic tag. Among them, the present inventors have found the following problems.

  In other words, when acquiring the communication characteristics of a non-contact type electronic tag, the distance between the electronic tag and the communication antenna is changed manually little by little, and communication is possible (data can be read) or communication is impossible (data The communication state is recorded, and the reading limit distance is obtained as the communication distance characteristic. Therefore, it takes time to acquire the communication characteristics of one sample, and there is a problem that enormous time is required to determine the standard communication characteristics by acquiring the communication characteristics from a plurality of samples.

  Also, in the step of selecting the electronic tag, it is confirmed that data can be read by communicating at two points, short distance and long distance, based on the standard communication characteristics, and between the two points. Guaranteed to be readable at distance. However, since the sorter used for sorting does not have a structure that can easily change the distance between the electronic tag and the communication antenna, it is difficult to change the distance unless a special jig is constructed. ing. For this reason, every time the distance is changed, stress is applied to the measuring instrument, and there is a problem that management of the measuring instrument becomes difficult.

  Further, when measuring the communication measurement, since the radio wave environment greatly affects the measurement result, the measurement environment must be constructed in the radio wave anechoic box. For this reason, the handler used to move the electronic tag to be measured is constructed and arranged in a limited space, and there is a problem that it is difficult to design a handler that can move the electronic tag at high speed. .

  One object of one typical invention disclosed in the present application is to provide a technique capable of shortening the time required for measuring the communication characteristics of a non-contact type electronic tag.

  Another object of one representative invention disclosed in the present application is to provide a technique capable of easily measuring the communication characteristics of a non-contact type electronic tag.

  The outline of one representative one of the inventions disclosed in the present application will be briefly described as follows.

1. The method for manufacturing an inlet for an electronic tag includes the following steps.
(A) a step of separating a plurality of semiconductor chips having a memory circuit in which predetermined data is written from a semiconductor wafer;
(B) preparing a plurality of first antennas for receiving radio waves of a predetermined frequency;
(C) connecting the semiconductor chip to each of the plurality of first antennas;
(D) a step of forming a plurality of inlets by sealing each of the plurality of semiconductor chips after the step (c);
(E) A step of inspecting communication distance characteristics of the plurality of inlets by selectively irradiating each of the plurality of inlets with the first radio wave having the predetermined frequency.

Here, the step (e)
(E1) Disposing the inlet on a second antenna that communicates with the inlet, and providing a radio wave absorber on the second antenna and the inlet that prevents reflection of radio waves from below and blocks radio waves from above. A step of arranging them apart from each other;
(E2) After the step (e1), maintaining the distance between the inlet and the second antenna at a predetermined first distance, and communicating the inlet and the second antenna;
(E3) changing and maintaining the first distance by a predetermined amount and repeating the step (e2);
(E4) a step of repeating the step (e3) a predetermined number of times,
Including
The inlet is held by holding means that moves up and down on the second antenna;
The radio wave absorbing means is attached to the holding means holding means via a relay means, interlocked with the operation of the holding means,
The second antenna is electrically connected to the data reading means;
The data reading means and the holding means are electrically connected to a computer,
The computer controls the operation of the holding means by software, and records the first distance and the communication result.

2. The method for manufacturing an inlet for an electronic tag includes the following steps.
(A) a step of separating a plurality of semiconductor chips having a memory circuit in which predetermined data is written from a semiconductor wafer;
(B) preparing a plurality of first antennas for receiving radio waves of a predetermined frequency;
(C) connecting the semiconductor chip to each of the plurality of first antennas;
(D) a step of forming a plurality of inlets by sealing each of the plurality of semiconductor chips after the step (c);
(E) A step of inspecting communication distance characteristics of the plurality of inlets by selectively irradiating each of the plurality of inlets with the first radio wave having the predetermined frequency.

Here, the step (e)
(E1) Secondly, electrically connected via the data reading means electrically connected to the computer, and the computer and a variable attenuator electrically connected to the data reading means, and communicating with the inlet. A step of disposing the inlet on the antenna and disposing radio wave absorbing means for preventing radio waves from being reflected from below and blocking the radio wave from above on the second antenna and the inlet;
(E2) After the step (e1), maintaining the distance between the inlet and the second antenna at a predetermined first distance, and communicating the inlet and the second antenna;
(E3) a step of changing the attenuation of the variable attenuator by a predetermined amount and repeating the step (e2);
(E4) a step of repeating the step (e3) a predetermined number of times,
Including
The computer records the attenuation amount and communication result of the variable attenuator.

3. The method for manufacturing an inlet for an electronic tag includes the following steps.
(A) a step of separating a plurality of semiconductor chips having a memory circuit in which predetermined data is written from a semiconductor wafer;
(B) preparing a first socket to which a first antenna that receives radio waves of a predetermined frequency is attached;
(C) attaching the semiconductor chip to the first socket so that the first antenna and the semiconductor chip are electrically connected;
(D) A step of inspecting communication distance characteristics of the plurality of semiconductor chips by selectively irradiating the first socket with the first radio wave of the predetermined frequency.

Here, the step (d) includes:
(D1) The first socket is disposed on a second antenna that communicates with the semiconductor chip, and a radio wave absorbing means that prevents reflection of radio waves from below and blocks radio waves from above is provided for the second antenna and A step of disposing the first socket on the first socket;
(D2) After the step (d1), the distance between the first socket and the second antenna is maintained at a predetermined first distance, and the first socket and the second antenna communicate with each other. The process of
(D3) changing and maintaining the first distance by a predetermined amount and repeating the step (e2);
(D4) a step of repeating the step (d3) a predetermined number of times,
Including
The first socket is held by holding means that moves up and down on the second antenna;
The radio wave absorbing means is attached to the holding means holding means via a relay means, interlocked with the operation of the holding means,
The second antenna and the holding means are electrically connected to a computer;
The computer controls the operation of the holding means by software, and records the first distance and the communication result.

4). The method for manufacturing an inlet for an electronic tag includes the following steps.
(A) a step of separating a plurality of semiconductor chips having a memory circuit in which predetermined data is written from a semiconductor wafer;
(B) preparing a measurement jig having a first socket for mounting the semiconductor chip and an impedance matching circuit, a computer electrically connected to the measurement jig, a data reading unit, and a variable attenuator;
(C) attaching the semiconductor chip to the first socket and electrically connecting the semiconductor chip and the impedance matching circuit;
(D) a step of causing the semiconductor chip and the computer to communicate with each other under a situation where the semiconductor chip is attached to the first socket;
(E) changing the attenuation of the variable attenuator by a predetermined amount, and repeating the step (d);
(F) The step of repeating the step (e) a predetermined number of times to inspect the communication distance characteristics of the plurality of semiconductor chips.

  Here, the computer records the attenuation amount and communication result of the variable attenuator.

5. The method for manufacturing an inlet for an electronic tag includes the following steps.
(A) a step of separating a plurality of semiconductor chips having a memory circuit in which predetermined data is written from a semiconductor wafer;
(B) preparing an insulating film formed in a state where a plurality of first antennas that receive radio waves of a predetermined frequency are separated from each other;
(C) connecting the semiconductor chip to each of the plurality of first antennas formed on the insulating film;
(D) a step of forming a plurality of inlets on the insulating film by sealing each of the plurality of semiconductor chips after the step (c);
(E) A measurement jig having a second antenna that communicates with the inlet and a radio wave absorbing unit that prevents reflection of radio waves from below on the second antenna and blocks radio waves from above is prepared. Process,
(F) preparing a computer, a data reading means and a variable attenuator electrically connected to the measurement jig;
(G) passing the insulating film between the second antenna of the measuring jig and the radio wave absorbing means, and communicating the inlet and the computer;
(H) A step of changing the attenuation amount of the variable attenuator by changing it by a predetermined amount and repeating the step (g).
(I) The step of repeating the step (h) a predetermined number of times and inspecting the communication distance characteristics of the plurality of inlets.

  Here, the computer records the attenuation amount and communication result of the variable attenuator.

If the outline of other inventions included in the present application is itemized, it is as follows.
1. The manufacturing method of the inlet for electronic tags including the following processes:
(A) a step of separating a plurality of semiconductor chips having a memory circuit in which predetermined data is written from a semiconductor wafer;
(B) preparing a plurality of first antennas for receiving radio waves of a predetermined frequency;
(C) connecting the semiconductor chip to each of the plurality of first antennas;
(D) a step of forming a plurality of inlets by sealing each of the plurality of semiconductor chips after the step (c);
(E) A step of inspecting communication distance characteristics of the plurality of inlets by selectively irradiating each of the plurality of inlets with the first radio wave having the predetermined frequency.

Here, the step (e)
(E1) Disposing the inlet on a second antenna that communicates with the inlet, and providing a radio wave absorber on the second antenna and the inlet that prevents reflection of radio waves from below and blocks radio waves from above. A step of arranging them apart from each other;
(E2) After the step (e1), maintaining the distance between the inlet and the second antenna at a predetermined first distance, and communicating the inlet and the second antenna;
(E3) changing and maintaining the first distance by a predetermined amount and repeating the step (e2);
(E4) a step of repeating the step (e3) a predetermined number of times,
Including
The inlet is held by holding means that moves up and down on the second antenna;
The radio wave absorbing means is attached to the holding means holding means via a relay means, interlocked with the operation of the holding means,
The second antenna is electrically connected to the data reading means;
The data reading means and the holding means are electrically connected to a computer,
The computer controls the operation of the holding means by software, and records the first distance and the communication result.
2. In the method for manufacturing an inlet for an electronic tag according to Item 1,
The radio wave absorbing means is disposed at a position separated from the inlet by a second distance sufficiently larger than the communication limit distance of the inlet.
3. In the method for manufacturing an inlet for an electronic tag according to Item 2,
The second distance is about twice the communication limit distance of the inlet.
4). In the method for manufacturing an inlet for an electronic tag according to Item 1,
The operation time of the holding means in the step (e3) is about 0.1 second or less.
5. In the method for manufacturing an inlet for an electronic tag according to Item 1,
The positional accuracy of the holding means in the steps (e2) and (e3) is about 0.1 mm or less.
6). The manufacturing method of the inlet for electronic tags including the following processes:
(A) a step of separating a plurality of semiconductor chips having a memory circuit in which predetermined data is written from a semiconductor wafer;
(B) preparing a plurality of first antennas for receiving radio waves of a predetermined frequency;
(C) connecting the semiconductor chip to each of the plurality of first antennas;
(D) a step of forming a plurality of inlets by sealing each of the plurality of semiconductor chips after the step (c);
(E) A step of inspecting communication distance characteristics of the plurality of inlets by selectively irradiating each of the plurality of inlets with the first radio wave having the predetermined frequency.

Here, the step (e)
(E1) Secondly, electrically connected via the data reading means electrically connected to the computer, and the computer and a variable attenuator electrically connected to the data reading means, and communicating with the inlet. A step of disposing the inlet on the antenna and disposing radio wave absorbing means for preventing radio waves from being reflected from below and blocking the radio wave from above on the second antenna and the inlet;
(E2) After the step (e1), maintaining the distance between the inlet and the second antenna at a predetermined first distance, and communicating the inlet and the second antenna;
(E3) a step of changing the attenuation of the variable attenuator by a predetermined amount and repeating the step (e2);
(E4) a step of repeating the step (e3) a predetermined number of times,
Including
The computer records the attenuation amount and communication result of the variable attenuator.
7). In the method for manufacturing an inlet for an electronic tag according to Item 6,
The computer controls the change of the attenuation amount of the variable attenuator by software.
8). In the method for manufacturing an inlet for an electronic tag according to Item 6,
The radio wave absorbing means is disposed at a position separated from the first socket by a second distance sufficiently larger than a communication limit distance of the semiconductor chip.
9. In the method for manufacturing an inlet for an electronic tag according to Item 8,
The second distance is about twice the communication limit distance of the semiconductor chip.
10. In the method for manufacturing an inlet for an electronic tag according to Item 6,
The variable attenuator is a variable attenuator using a mechanical contact or a semiconductor circuit,
A wattmeter is electrically connected to the computer,
A relay that switches a circuit between the second antenna and the power meter is electrically connected to the variable attenuator,
Before the step (e1) and after the step (e4), the computer switches the relay to the wattmeter side and checks whether or not predetermined power is being output.
11. The manufacturing method of the inlet for electronic tags including the following processes:
(A) a step of separating a plurality of semiconductor chips having a memory circuit in which predetermined data is written from a semiconductor wafer;
(B) preparing a first socket to which a first antenna that receives radio waves of a predetermined frequency is attached;
(C) attaching the semiconductor chip to the first socket so that the first antenna and the semiconductor chip are electrically connected;
(D) A step of inspecting communication distance characteristics of the plurality of semiconductor chips by selectively irradiating the first socket with the first radio wave of the predetermined frequency.

Here, the step (d) includes:
(D1) The first socket is disposed on a second antenna that communicates with the semiconductor chip, and a radio wave absorbing means that prevents reflection of radio waves from below and blocks radio waves from above is provided for the second antenna and A step of disposing the first socket on the first socket;
(D2) After the step (d1), the distance between the first socket and the second antenna is maintained at a predetermined first distance, and the first socket and the second antenna communicate with each other. The process of
(D3) changing and maintaining the first distance by a predetermined amount and repeating the step (e2);
(D4) a step of repeating the step (d3) a predetermined number of times,
Including
The first socket is held by holding means that moves up and down on the second antenna;
The radio wave absorbing means is attached to the holding means holding means via a relay means, interlocked with the operation of the holding means,
The second antenna and the holding means are electrically connected to a computer;
The computer controls the operation of the holding means by software, and records the first distance and the communication result.
12 In the method for manufacturing an inlet for an electronic tag according to Item 11,
The radio wave absorbing means is disposed at a position separated from the first socket by a second distance sufficiently larger than a communication limit distance of the semiconductor chip.
13. In the method for producing an inlet for an electronic tag according to Item 12,
The second distance is about twice the communication limit distance of the semiconductor chip.
14 In the method for manufacturing an inlet for an electronic tag according to Item 11,
The operation time of the holding means in the step (e3) is about 0.1 second or less.
15. In the method for manufacturing an inlet for an electronic tag according to Item 11,
The positional accuracy of the holding means in the steps (e2) and (e3) is about 0.1 mm or less.
16. The manufacturing method of the inlet for electronic tags including the following processes:
(A) a step of separating a plurality of semiconductor chips having a memory circuit in which predetermined data is written from a semiconductor wafer;
(B) providing a measurement jig having a second socket for mounting the semiconductor chip and an impedance matching circuit, a computer electrically connected to the measurement jig, a data reading unit, and a variable attenuator;
(C) attaching the semiconductor chip to the second socket and electrically connecting the semiconductor chip and the impedance matching circuit;
(D) a step of causing the semiconductor chip and the computer to communicate with each other under a situation where the semiconductor chip is attached to the second socket;
(E) changing the attenuation of the variable attenuator by a predetermined amount and keeping it, and repeating the step (d);
(F) The step of inspecting the communication distance characteristics of the plurality of semiconductor chips by repeating the step (e) a predetermined number of times.

Here, the computer records the attenuation amount and communication result of the variable attenuator.
17. In the method for producing an inlet for an electronic tag according to Item 16,
The computer controls the change of the attenuation amount of the variable attenuator by software.
18. In the method for producing an inlet for an electronic tag according to Item 16,
The variable attenuator is a variable attenuator using a mechanical contact or a semiconductor circuit,
A wattmeter is electrically connected to the computer,
The variable attenuator is electrically connected to a relay that switches a circuit between the measurement jig and the power meter,
Before the step (d) and after the step (f), the computer switches the relay to the wattmeter side and checks whether or not predetermined power is being output.
19. The manufacturing method of the inlet for electronic tags including the following processes:
(A) a step of separating a plurality of semiconductor chips having a memory circuit in which predetermined data is written from a semiconductor wafer;
(B) preparing an insulating film formed in a state where a plurality of first antennas that receive radio waves of a predetermined frequency are separated from each other;
(C) connecting the semiconductor chip to each of the plurality of first antennas formed on the insulating film;
(D) a step of forming a plurality of inlets on the insulating film by sealing each of the plurality of semiconductor chips after the step (c);
(E) A measurement jig having a second antenna that communicates with the inlet and a radio wave absorbing unit that prevents reflection of radio waves from below on the second antenna and blocks radio waves from above is prepared. Process,
(F) preparing a computer, a data reading means and a variable attenuator electrically connected to the measurement jig;
(G) passing the insulating film between the second antenna of the measuring jig and the radio wave absorbing means, and communicating the inlet and the computer;
(H) A step of changing the attenuation amount of the variable attenuator by changing it by a predetermined amount and repeating the step (g).
(I) The step of repeating the step (h) a predetermined number of times and inspecting the communication distance characteristics of the plurality of inlets.

Here, the computer records the attenuation amount and communication result of the variable attenuator.
20. In the method for manufacturing an inlet for an electronic tag according to Item 19,
A plurality of the measuring jigs are prepared,
In the plurality of measurement jigs, the insulating film is passed between the second antenna and the radio wave absorbing means of the measurement jig, and the inlet and the computer communicate with each other. (I) The step is performed, and the communication distance characteristics of the plurality of inlets are simultaneously inspected.

Among the inventions disclosed in the present application, effects obtained by typical ones will be briefly described as follows.
(1) The time required for measuring the communication characteristics of a non-contact type electronic tag can be shortened.
(2) The communication characteristics of the non-contact type electronic tag can be easily measured.

It is a top view (surface side) which shows the inlet for electronic tags which is Embodiment 1 of this invention. It is a top view which expands and shows a part of FIG. It is a side view which shows the inlet for electronic tags which is Embodiment 1 of this invention. It is a top view (back side) which shows the inlet for electronic tags which is Embodiment 1 of this invention. It is a top view which expands and shows a part of FIG. It is a principal part enlarged plan view (surface side) of the inlet for electronic tags which is Embodiment 1 of this invention. It is a principal part enlarged plan view (back side) of the inlet for electronic tags which is Embodiment 1 of this invention. It is a top view of the semiconductor chip mounted in the inlet for electronic tags which is Embodiment 1 of this invention. FIG. 9 is a cross-sectional view of a bump electrode formed on the main surface of the semiconductor chip shown in FIG. 8 and its vicinity. FIG. 9 is a cross-sectional view of a dummy bump electrode formed on the main surface of the semiconductor chip shown in FIG. 8 and the vicinity thereof. It is a block diagram of the circuit formed in the main surface of the semiconductor chip shown in FIG. It is a flowchart explaining the manufacturing process of the inlet for electronic tags which is Embodiment 1 of this invention. It is a top view which shows a part of elongate insulating film used for manufacture of the inlet for electronic tags which is Embodiment 1 of this invention. It is a top view which expands and shows a part of insulating film shown in FIG. It is the schematic of the inner lead bonder which shows a part (semiconductor chip and antenna connection process) of the manufacturing process of the inlet for electronic tags which is Embodiment 1 of this invention. It is the schematic which expands and shows the principal part of the inner lead bonder shown in FIG. It is a principal part expanded plan view of the insulating film which shows a part (semiconductor chip and antenna connection process) of the manufacturing process of the inlet for electronic tags which is Embodiment 1 of this invention. It is a principal part expanded plan view of the insulating film which shows a part (semiconductor chip and antenna connection process) of the manufacturing process of the inlet for electronic tags which is Embodiment 1 of this invention. It is the schematic which shows a part (resin sealing process of a semiconductor chip) of the manufacturing process of the inlet for electronic tags which is Embodiment 1 of this invention. It is a principal part enlarged plan view of the insulating film which shows a part (resin sealing process of a semiconductor chip) of the manufacturing process of the inlet for electronic tags which is Embodiment 1 of this invention. It is a side view which shows the state which wound up the insulating film used for manufacture of the inlet for electronic tags which is Embodiment 1 of this invention on the reel. It is explanatory drawing which shows the example of a display of the communication test result of the inlet for electronic tags which is Embodiment 1 of this invention. It is explanatory drawing which shows the structure of the apparatus used for the communication test | inspection of the inlet for electronic tags which is Embodiment 1 of this invention. It is explanatory drawing which shows the traveling wave and reflected wave in the communication test | inspection of the inlet for electronic tags which is Embodiment 1 of this invention. It is explanatory drawing shown about installation of the electromagnetic wave shielding board in the communication test | inspection of the inlet for electronic tags which is Embodiment 1 of this invention. It is sectional drawing shown about installation of the electromagnetic wave shielding board in the communication test | inspection of the inlet for electronic tags which is Embodiment 1 of this invention. It is explanatory drawing which shows the usage method of the electronic tag using the inlet for electronic tags which is Embodiment 1 of this invention. It is a top view of the socket used for the communication inspection of the chip | tip contained in the inlet for electronic tags which is Embodiment 2 of this invention. It is a side view of the socket used for the communication inspection of the chip | tip contained in the inlet for electronic tags which is Embodiment 2 of this invention. It is a perspective view of the socket used for the communication inspection of the chip | tip contained in the inlet for electronic tags which is Embodiment 2 of this invention. It is a perspective view of each apparatus used for the communication inspection of the chip | tip contained in the inlet for electronic tags which is Embodiment 2 of this invention. It is explanatory drawing which shows the subject in the case of measuring the communication distance characteristic of the inlet for electronic tags using an anechoic box. It is explanatory drawing which shows the distance dependence of the communication between the inlet for electronic tags, and a communication antenna. It is explanatory drawing which shows the means to reproduce distance dependence by introducing the variable attenuator between a communication antenna and a reader machine, and maintaining the distance between the inlet for electronic tags, and a communication antenna. It is explanatory drawing which shows the selection process of the inlet for electronic tags in case the distance between the electronic tag inlet and the communication antenna is a short distance. It is explanatory drawing which shows the selection process of the inlet for electronic tags in case a short distance is between the inlet for electronic tags and a communication antenna. It is explanatory drawing which shows the measurement of the communication distance characteristic of the inlet for electronic tags. It is a circuit diagram at the time of connecting a communication antenna to a reader machine through a variable attenuator. It is a circuit diagram at the time of connecting the communication antenna to the reader machine via the variable attenuator in Embodiment 3 of this invention. It is a circuit diagram at the time of connecting the communication antenna to the reader machine via the variable attenuator in Embodiment 3 of this invention. It is an internal circuit diagram of the variable attenuator connected between the communication antenna and the reader machine in Embodiment 3 of this invention. It is explanatory drawing which shows the system which self-diagnose the variable attenuator connected between the communication antenna and the reader machine in Embodiment 3 of this invention. It is a perspective view of the measuring jig used with the system which measures the communication distance characteristic of the inlet for electronic tags which is Embodiment 4 of this invention. It is explanatory drawing of the system which measures the communication distance characteristic of the inlet for electronic tags which is Embodiment 4 of this invention. It is explanatory drawing which shows the internal circuit of the measuring jig shown in FIG. FIG. 44 is a circuit diagram showing a circuit provided inside the measurement jig shown in FIG. 43. It is a perspective view of the measuring jig used with the system which measures the communication distance characteristic of the inlet for electronic tags which is Embodiment 5 of this invention. It is explanatory drawing which shows the electrical connection of the dipole antenna and signal terminal in the inside of the measurement jig | tool shown in FIG. It is a perspective view explaining the measurement of the communication distance characteristic of an inlet performed using the measuring jig shown in FIG. It is a perspective view of the measuring jig used with the system which measures the communication distance characteristic of the inlet for electronic tags which is Embodiment 5 of this invention. It is explanatory drawing which shows the electrical connection of the monopole antenna and signal terminal in the inside of the measurement jig | tool shown in FIG. It is a perspective view of the measuring jig used with the system which measures the communication distance characteristic of the inlet for electronic tags which is Embodiment 5 of this invention.

  Before describing the present invention in detail, the meaning of terms in the present application will be described as follows.

  An electronic tag is a central electronic component of an RFID system or EPC (Electronic Product Code) system, and generally has electronic information, communication functions, and data rewriting functions on a chip of several millimeters or less (including cases where it exceeds that). Say what you pack, and communicate with the reader using radio waves or electromagnetic waves. It is also called a wireless tag or an IC tag, and by attaching it to a product, it is possible to perform information processing that is more sophisticated and complicated than a barcode. There is also a tag that can be used semi-permanently without a battery by a non-contact power transmission technology from the antenna side (outside or inside the chip). The tag has various shapes such as a label type, a card type, a coin type, and a stick type, and is selected according to the application. The communication distance ranges from several millimeters to several meters, and these are also properly used depending on the application.

  An inlet (generally a composite of an RFID chip and an antenna, but there is also an antenna without an antenna or an antenna integrated on a chip. Therefore, an antenna without an antenna may also be included in the inlet). A basic product form in which an IC chip is mounted on a coil (antenna). The metal coil and the IC chip are generally exposed, but may be sealed.

  An anechoic box and an anechoic chamber have a free space environment (electromagnetic shield and anechoic) that shields electromagnetic waves from the outside, and the amount of electromagnetic waves emitted from electronic devices in the free space environment, Equipment that measures and evaluates the resistance of electronic equipment to electromagnetic waves from a radiation source.

  The dipole antenna refers to two quarter-wave conductor bars joined together, and becomes a half-wave conductor by joining two quarter-wave conductor bars together.

  A monopole antenna means a conductor composed of a quarter wavelength conductor, and can be regarded as a half cut out of a dipole antenna. The antennas are not limited to these, but may be other three-dimensional antennas, planar antennas, printed circuit antennas, microstrip antennas, and the like.

  In the following embodiments, when it is necessary for the sake of convenience, the description will be divided into a plurality of sections or embodiments. However, unless otherwise specified, they are not irrelevant to each other. There are some or all of the modifications, details, supplementary explanations, and the like.

  Further, in the following embodiments, when referring to the number of elements (including the number, numerical value, quantity, range, etc.), especially when clearly indicated and when clearly limited to a specific number in principle, etc. Except, it is not limited to the specific number, and may be more or less than the specific number.

  Further, in the following embodiments, the constituent elements (including element steps and the like) are not necessarily indispensable unless otherwise specified and apparently essential in principle. Needless to say. In addition, when referring to the constituent elements in the embodiments, etc., “consisting of A” and “consisting of A” do not exclude other elements unless specifically stated that only the elements are included. Needless to say.

  Similarly, in the following embodiments, when referring to the shapes, positional relationships, etc. of the components, etc., the shapes are substantially the same unless otherwise specified, or otherwise apparent in principle. And the like are included. The same applies to the above numerical values and ranges.

  Also, components having the same function are denoted by the same reference symbols throughout the drawings for describing the embodiments, and the repetitive description thereof is omitted.

  In the drawings used in the present embodiment, even a plan view may be partially hatched to make the drawings easy to see.

  Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings.

(Embodiment 1)
1 is a plan view (front side) showing an inlet for an electronic tag according to the first embodiment, FIG. 2 is a plan view showing a part of FIG. 1 in an enlarged manner, and FIG. 3 is a plan view showing the first embodiment. FIG. 4 is a side view showing the electronic tag inlet, FIG. 4 is a plan view (back side) showing the electronic tag inlet of Embodiment 1, and FIG. 5 is an enlarged plan view showing a part of FIG. . As described above, part or all of the present embodiment (example) is part or all of the following embodiment (example). Therefore, in principle, the description of the overlapping parts is omitted.

  An electronic tag inlet (hereinafter simply referred to as an inlet) 1 according to the first embodiment constitutes a main part of a non-contact type electronic tag provided with an antenna for receiving microwaves. The inlet 1 includes an antenna 3 made of Cu foil bonded to one surface of an elongated rectangular insulating film 2 and a chip 5 connected to the antenna 3 with the surface and side surfaces sealed with a potting resin 4. ing. A cover film 6 for protecting the antenna 3 and the chip 5 is laminated on one surface of the insulating film 2 (surface on which the antenna 3 is formed) as necessary.

  The length of the antenna 3 along the long side direction of the insulating film 2 is, for example, 56 mm, and is optimized so that microwaves with a frequency of 2.45 GHz can be received efficiently. Further, the width of the antenna 3 is 3 mm, and the antenna 3 is optimized so that both the downsizing of the inlet 1 and the securing of strength can be achieved.

  An “L” -shaped slit 7 whose one end reaches the outer edge of the antenna 3 is formed in the substantially central portion of the antenna 3, and a chip sealed with a potting resin 4 in the middle of the slit 7. 5 is implemented.

  6 and 7 are enlarged plan views showing the vicinity of the central portion of the antenna 3 in which the slit 7 is formed. FIG. 6 shows the front side of the inlet 1 and FIG. 7 shows the back side. In these drawings, illustration of the potting resin 4 and the cover film 6 for sealing the chip 5 is omitted.

  As shown in the figure, a device hole 8 formed by punching out a part of the insulating film 2 is formed in the middle of the slit 7, and the chip 5 is disposed at the center of the device hole 8. . The size of the device hole 8 is, for example, length × width = 0.8 mm × 0.8 mm, and the size of the chip 5 is length × width = 0.48 mm × 0.48 mm.

  As shown in FIG. 6, on the main surface of the chip 5, for example, four Au (gold) bumps 9a, 9b, 9c, 9d are formed. Each of the Au bumps 9 a, 9 b, 9 c, 9 d is connected to a lead 10 that is formed integrally with the antenna 3 and has one end extending inside the device hole 8.

  Of the four leads 10, the two leads 10 extend from one of the antennas 3 divided by the slit 7 to the inside of the device hole 8 and are electrically connected to the Au bumps 9 a and 9 c of the chip 5. It is connected. The remaining two leads 10 extend from the other side of the antenna 3 to the inside of the device hole 8 and are electrically connected to the Au bumps 9 b and 9 d of the chip 5.

  FIG. 8 is a plan view showing a layout of four Au bumps 9a, 9b, 9c, 9d formed on the main surface of the chip 5, FIG. 9 is an enlarged sectional view in the vicinity of the Au bump 9a, and FIG. FIG. 11 is an enlarged cross-sectional view of the vicinity of the Au bump 9c, and FIG.

  The chip 5 is formed of a single crystal silicon substrate having a thickness of about 0.15 mm, and a circuit including rectification / transmission, clock extraction, a selector, a counter, a ROM, and the like as shown in FIG. 11 is formed on the main surface. ing. The ROM has a storage capacity of 128 bits and can store a large amount of data compared to a storage medium such as a barcode. In addition, the data stored in the ROM has an advantage that unauthorized tampering is difficult as compared with the data stored in the barcode.

  Four Au bumps 9a, 9b, 9c, and 9d are formed on the main surface of the chip 5 on which the circuit is formed. These four Au bumps 9a, 9b, 9c, and 9d are located on a pair of virtual diagonal lines indicated by a two-dot chain line in FIG. 8, and from the intersection (the center of the main surface of the chip 5) of these diagonal lines. Are laid out so that their distances are substantially equal. These Au bumps 9a, 9b, 9c, 9d are formed by using, for example, an electrolytic plating method, and the height thereof is, for example, about 15 μm.

  Note that the layout of these Au bumps 9a, 9b, 9c, and 9d is not limited to the layout shown in FIG. 8, but is preferably a layout that can easily balance the weight at the time of chip connection. It is preferable that the polygon formed by the tangent line of the Au bump in the planar layout is arranged so as to surround the center of the chip.

  Of the four Au bumps 9a, 9b, 9c, 9d, for example, the Au bump 9a constitutes an input terminal of the circuit shown in FIG. 11, and the Au bump 9b constitutes a GND terminal. The remaining two Au bumps 9c and 9d constitute dummy bumps not connected to the circuit.

  As shown in FIG. 9, the Au bump 9a constituting the input terminal of the circuit is formed on the uppermost metal wiring 22 exposed by etching the passivation film 20 covering the main surface of the chip 5 and the polyimide resin 21. Has been. In addition, a barrier metal film 23 is formed between the Au bump 9a and the uppermost metal wiring 22 to increase the adhesion between them. The passivation film 20 is composed of, for example, a laminated film of a silicon oxide film and a silicon nitride film, and the uppermost metal wiring 22 is composed of, for example, an Al alloy film. Further, the barrier metal film 23 is composed of, for example, a laminated film of a Ti film having a high adhesion to the Al alloy film and a Pd film having a high adhesion to the Au bump 9a. Although illustration is omitted, the connection part between the Au bump 9b and the uppermost metal wiring 22 constituting the GND terminal of the circuit has the same configuration as described above. On the other hand, as shown in FIG. 10, Au bumps 9c (and 9d) constituting dummy bumps are connected to a metal layer 24 formed in the same wiring layer as the uppermost metal wiring 22, but this metal Layer 24 is not connected to the circuit.

  As described above, the inlet 1 according to the first embodiment is provided with a slit 7 whose one end reaches the outer edge of the antenna 3 on a part of the antenna 3 formed on one surface of the insulating film 2, and is divided into two by the slit 7. The input terminal (Au bump 9a) of the chip 5 is connected to one of the antennas 3 and the GND terminal (Au bump 9b) of the chip 5 is connected to the other. With this configuration, since the effective length of the antenna 3 can be increased, the inlet 1 can be reduced in size while ensuring the necessary antenna length.

  Further, the inlet 1 of the first embodiment is provided with Au bumps 9a and 9b and dummy Au bumps 9c and 9d constituting circuit terminals on the main surface of the chip 5, and these four Au bumps 9a. , 9b, 9c, 9d are connected to the lead 10 of the antenna 3. With this configuration, the effective contact area between the Au bump and the lead 10 becomes larger than when only the two Au bumps 9a and 9b connected to the circuit are connected to the lead 10, so that the Au bump and the lead 10 The adhesive strength, that is, the connection reliability between the two is improved. Further, by arranging the four Au bumps 9a, 9b, 9c, 9d on the main surface of the chip 5 in the layout as shown in FIG. 8, the lead 10 is connected to the Au bumps 9a, 9b, 9c, 9d. In this case, the chip 5 does not tilt with respect to the insulating film 2. Thereby, since the chip 5 can be reliably sealed with the potting resin 4, the manufacturing yield of the inlet 1 is improved.

  Next, the manufacturing method of the inlet 1 comprised as mentioned above is demonstrated using FIGS.

  FIG. 12 is a flowchart for explaining the manufacturing process of the inlet 1. As shown in this flowchart, first, a wafer process for forming a semiconductor element, an integrated circuit, the bump electrodes 9a to 9d and the like on a main surface of a wafer-like semiconductor substrate (hereinafter simply referred to as a substrate) is performed (steps). P1). Subsequently, the wafer-like substrate is divided into chips by dicing to form the aforementioned chips 5 (process P2).

  FIG. 13 is a plan view showing the insulating film 2 used for manufacturing the inlet 1, and FIG. 14 is a plan view showing a part of FIG. 13 in an enlarged manner.

  As shown in FIG. 13, the insulating film 2 is carried into the manufacturing process of the inlet 1 while being wound around the reel 25. A large number of antennas 3 are formed in advance on one surface of the insulating film 2 at a predetermined interval. In order to form these antennas 3, for example, a Cu foil having a thickness of about 18 μm is bonded to one surface of the insulating film 2, and this Cu foil is etched into the shape of the antenna 3. At this time, the above-described slit 7 and lead 10 are formed in each antenna 3. Thereafter, Sn (tin) plating is applied to the surface of the lead 10. In order to form the insulating film and the antenna further thinly, for example, a first Cu film is formed on the surface of the insulating film having a thickness of about 38 μm by a sputtering method, and the first Cu film is used as a seed layer by an electrolytic plating method. A second Cu film thicker than the first Cu film may be formed, and the first and second Cu films may be patterned.

  The insulating film 2 conforms to the standard of the film carrier tape, and is made of, for example, a polyimide resin film having a width of 50 μm or 70 mm and a thickness of 75 μm, and a part of the device film shown in FIGS. 8 is formed. In addition, sprocket holes 26 for conveying the insulating film 2 are formed at both sides of the insulating film 2 at a predetermined interval. The device hole 8 and the sprocket hole 26 are formed by punching a part of the insulating film 2 with a punch.

  Next, as illustrated in FIG. 15, the reel 25 is mounted on the inner lead bonder 30 including the bonding stage 31 and the bonding tool 32, and the antenna 3 is moved while moving the insulating film 2 along the upper surface of the bonding stage 31. Chip 5 is connected to (step P3).

  In order to connect the chip 5 to the antenna 3, as shown in FIG. 16 (enlarged view of the main part in FIG. 15), the chip 5 is mounted on the bonding stage 31 heated to about 100 ° C. After positioning the device hole 8 of the insulating film 2 on top, the bonding tool 32 heated to about 400 ° C. is pressed against the upper surface of the lead 10 protruding inside the device hole 8, and Au bumps (9 a to 9 d) and the lead 10 are pressed. Contact. At this time, by applying a predetermined load to the bonding tool 32 for about 2 seconds, an Au—Sn eutectic alloy layer is formed at the interface between the Sn plating formed on the surface of the lead 10 and the Au bumps (9a to 9d). Then, the Au bumps (9a to 9d) and the lead 10 are bonded to each other.

  Next, a new chip 5 is mounted on the bonding stage 31. Subsequently, the insulating film 2 is moved by one pitch of the antenna 3, and then the same operation as described above is performed, whereby the chip 5 is mounted on the antenna. Connect to 3. Thereafter, the chip 5 is connected to all the antennas 3 formed on the insulating film 2 by repeating the same operation as described above. The insulating film 2 for which the connection work between the chip 5 and the antenna 3 has been completed is conveyed to the next resin sealing step while being wound around the reel 25.

  In order to improve the connection reliability between the Au bumps (9a to 9d) and the lead 10, the four leads 10 are extended in a direction perpendicular to the long side direction of the antenna 3 as shown in FIG. Better. As shown in FIG. 18, when the four leads 10 are extended in parallel with the long side direction of the antenna 3, when the completed inlet 1 is bent, the Au bumps (9a to 9d) and the leads 10 are Since a strong tensile stress acts on the joint, there is a risk that the connection reliability between the two will be reduced.

  In the resin sealing process of the chip 5, as shown in FIGS. 19 and 20, the potting resin 4 is supplied to the upper surface and the side surface of the chip 5 mounted inside the device hole 8 using a dispenser 33 or the like. Potting resin 4 is baked in a heating furnace (process P4). Although illustration is omitted, also in this resin sealing step, the potting resin 4 is supplied and baked while the insulating film 2 is moved. Then, the insulating film 2 after the resin sealing operation is completed is conveyed to the next inspection process (process P5) in a state of being wound on the reel 25, and the connection state of the chip 5 and the antenna 3 and the quality of the appearance are inspected. Done. Since a large number of antennas 3 formed on the insulating film 2 are electrically separated from each other, the continuity test between the individual antennas 3 and the chips 5 can be easily performed. Then, the manufacturing process of the inlet 1 is completed by laminating the cover film 6 (see FIG. 3) on one surface of the insulating film 2 (surface on which the antenna 3 is formed).

  As shown in FIG. 21, the inlet 1 manufactured as described above is packed in a state of being wound on a reel 25 and shipped to a customer (process P6).

  Here, the inspection process of the process P5 will be described in detail.

  The aforementioned inlet 1 has a communication distance characteristic, and the communication state changes depending on the distance between the reader device and the communication antenna electrically connected. In step P5, an arbitrary number (for example, 20) of inlets 1 are taken out as samples, and the communication distance characteristics of these samples are measured to inspect whether they are within a specified value. In this inspection, for example, the inlet 1 and the reader unit communicate with each other while changing the frequency by 1 MHz between 2.407 GHz and 2.426 GHz for one distance (a radio wave (first radio wave) from the communication antenna ANT to the inlet 3). ). Such communication is performed, for example, at intervals of 5 mm between 0 to 330 mm, that is, all 67 points. When the communication result is judged and recorded by hand, (A) communication can be performed, (B) communication cannot be performed, and (C) communication cannot be performed. , B, C, etc. (see FIG. 22). However, if the communication result is manually determined in this manner, for example, the determination of whether (A) communication is possible or (C) communication cannot be performed may vary depending on the subjectivity of the operator. In addition, in order to change the distance between the inlet 1 and the communication antenna, when the operation of the inspection jig for holding the inlet 1 is also performed manually, the movement of the inspection jig is large due to the large amount of work by human hands. It takes a long time, and the position accuracy of the inspection jig may be lowered. Thus, when the communication result is recorded and the inspection jig is manually operated, the time required for one communication is 0.3 seconds, the time required for recording is 5 seconds, and the inspection jig is required to move. If the time is 5 seconds, the inspection time required for inspection of one inlet 1 is (0.3 × 20 + 5 + 5) × 67 = 1072 seconds≈18 minutes, and when there are 20 samples of inlet 1, × 20 = 360 minutes are required.

  Therefore, in the first embodiment, as shown in FIG. 23, the reader (data reading means) RM and the inspection jig TM are electrically connected to the computer COM, and the communication result is discriminated, recorded and inspected. Is configured to be controlled by software control of the computer COM. Thereby, since the work by the worker WK can be greatly reduced, the inspection process can be simplified.

  The inspection jig TM is actually moved by the vertical movement of the arm (holding means) AM that holds the inlet 1, and the computer COM controls the amount of movement of the vertical movement of the arm. When the operator WK inputs a measurement start signal to the computer COM, the measurement starts from a position where the distance between the inlet 1 and the communication antenna ANT is 0 mm until the distance reaches the final measurement position (for example, 330 mm). It is automatically carried out without the operator's hand. By controlling each operation by the computer COM in this way, the position accuracy of the arm AM, that is, the accuracy of the distance between the inlet 1 and the communication antenna ANT is improved by one digit or more as compared with the case where it is controlled manually. According to the experiment conducted by the present inventors, it was able to be within about 0.1 mm. Whether it is manual measurement or computer-controlled measurement, the time required for the reader to actually read once is about 0.05 seconds. However, the monitoring software used for manual measurement requires a waiting time in consideration of human reaction time, so the measurement time is 0.3 seconds. In the case of computer control, it is not necessary to consider human reaction time, and it is possible to save only about 0.05 seconds because waiting time can be omitted. Further, the moving time of the measuring jig TM, that is, the operating time of the arm AM can be set to about 0.1 second, which is shortened by about 4.9 seconds compared with the case where it is manually controlled (about 5 seconds). . Further, the recording time of the measurement result can be set to almost 0 seconds, which can be shortened by about 5 seconds compared with the case where the measurement results are recorded manually. Based on these numerical values, the inspection time required for the inspection of one inlet 1 is (0.05 × 20 + 0 + 0.1) × 67 = 73.7 seconds≈1.23 minutes. The total measurement time in the case of 20 is 1.23 × 20 = 24.6 minutes, which can be significantly reduced to about 7/100 of the case of manual control (360 minutes).

  In the first embodiment, the determination of the communication result is performed by the computer COM and the subjectivity of the worker WK can be excluded, so that a reproducible evaluation result can be obtained. From the above, according to the first embodiment, it is possible to provide a simple, high-speed and reliable measurement system for the communication distance characteristic of the inlet 1.

  In the first embodiment, in addition to the above measurement system, the influence of radio waves on the measurement result is also considered. The measurement of the communication distance characteristic of the inlet 1 must be performed in a so-called free space in which there is no object that reflects radio waves in the surroundings and radio waves do not enter from outside. Therefore, when the measurement system cannot be installed in the anechoic chamber or anechoic box, as shown in FIG. 24, a measurement space free from objects such as metal is formed as much as possible, and the measurement system is installed in the measurement space. Will be inspected. However, when the inspection is performed with such a measurement space, for example, the traveling wave FW transmitted from the inlet 1 and the communication antenna ANT is reflected on the pipe DT installed on the back side of the ceiling CL and reflected. There is a possibility that the communication distance characteristic of the inlet 1 may have a peculiar result due to the return as the wave RW.

  Therefore, in the first embodiment, as shown in FIGS. 25 and 26, a radio wave shielding plate (radio wave absorbing means) DSB is disposed above the inlet 1 and the communication antenna ANT. The radio wave shielding plate DSB is formed of, for example, a radio wave absorber DSB1 having a thickness of about 20 mm obtained by applying a paint made of a radio wave absorber to a conductive sponge, and a support DSB2 made of a radio wave transmitting material (for example, polystyrene foam). Yes. Further, a support SJG made of a radio wave transmitting material (for example, styrene foam) is attached to the arm AM of the inspection jig TM. The support DSB2 and SJG are configured to hold the radio wave absorber, and the arm AM is structured to be able to keep the distance D1 between the inlet 1 and the inlet 1 constant in conjunction with the vertical movement. The radio wave shielding plate DSB is disposed at a position sufficiently far from the designed communication limit of the inlet 1. For example, the distance D1 is the designed communication limit distance of the inlet 1 (the antenna ANT and the inlet 1 in FIG. 26). The radio wave shielding plate DSB is attached to the support SJG so as to be about twice the distance D2). Further, before the radio wave shielding plate DSB is fixed to the support SJG, the upward traveling wave FW transmitted from the communication antenna ANT is at a position where the influence from the reflected wave reflected by the radio wave shielding plate DSB is minimum. Thus, the position of the radio wave shielding plate DSB is finely adjusted in the height direction. The traveling wave FW is radiated in an oblique direction, but the traveling wave FW radiated in the oblique direction does not return to the antenna ANT even if it is reflected, and can be almost ignored. That is, since the reflected wave of the traveling wave FW in the upward direction has the most influence on the measured value of the communication distance characteristic of the inlet 1, the reflected wave of the traveling wave FW in the upward direction is prevented by preventing the reflected wave of the inlet 1. It is possible to prevent the measurement value of the communication distance characteristic from being affected. In other words, by installing the radio wave shielding plate DSB as described above, the upward traveling wave FW transmitted from the antenna ANT can be absorbed by the radio wave shielding plate DSB, and the traveling wave becomes a reflected wave as an inlet. It is possible to prevent a problem that causes an abnormality in the measured value of the communication distance characteristic of 1.

  A customer who has purchased the inlet 1 cuts the insulating film 2 to obtain an individualized inlet 1 as shown in FIGS. 1 to 5, and then combines the inlet 1 with another member. To produce an electronic tag. For example, FIG. 27 shows an example in which a double-sided adhesive tape or the like is attached to the back surface of the inlet 1 to produce an electronic tag and this is attached to the surface of an article such as a slip 34.

(Embodiment 2)
In the second embodiment, for example, when manufacturing the inlet 1 (see FIG. 1) shown in the first embodiment, the steps after the step of mounting the chip 5 (see FIG. 4) on the antenna 3 are performed on the customer side or the like. In the case of performing, the communication distance characteristic of the chip 5 is measured on the shipping side or the like.

  27 to 28 are a plan view, a side view, and a perspective view of the socket SKT used for measuring the communication distance characteristics of the chip 5, respectively. In principle, description of the same parts as those of the first embodiment (Example 1) is omitted. As described above, part or all of the present embodiment (example) is part or all of the preceding or subsequent embodiment (example).

  The socket SKT is formed of an antenna substrate AKB and a chip holder CHG. These antenna substrate AKB and chip holder CHG are formed of an insulating material (for example, plastic). An antenna pattern ATP having the same shape and material as the antenna 3 (see FIG. 1) of the inlet 1 in the first embodiment is attached to the antenna substrate AKB. The chip 5 is disposed on the antenna pattern ATP. A chip presser COG is attached to the chip holder CHG, and the chip presser COG is configured to fix the chip 5 disposed on the antenna pattern ATP. The chip presser COG is formed of a flexible insulating material (elastomer or the like) such as urethane rubber, for example, and has a structure that prevents the chip 5 from being damaged when the chip 5 is fixed on the antenna pattern ATP. .

  When the chip 5 is not mounted on the antenna 3, communication distance characteristics cannot be measured because radio communication is not possible. Therefore, by integrating the chip 5 and the socket SKT using the socket SKT of the second embodiment as described above, it can be regarded as the same as the inlet 1 of the first embodiment. It is possible to measure the communication distance characteristic even in the chip 5 that is not provided, as in the first embodiment.

  Even when the communication distance characteristic of the chip 5 is measured using an automatic machine, the antenna substrate ATB can be used. As shown in FIG. 31, after the chip 5 is arranged on the antenna pattern ATP by the transport collet HKR, the chip 5 is fixed to the antenna pattern ATP by the terminal pressing tool TOG. In this state, the communication distance characteristic of the chip 5 is measured.

  According to the second embodiment as described above, the same effect as in the first embodiment can be obtained.

(Embodiment 3)
FIG. 32 is an explanatory diagram showing a problem when the communication distance characteristic of the inlet 1 is measured using an anechoic box. In principle, description of the same parts as those in the first embodiment (Example 1) and the second embodiment (Example 2) is omitted. As described above, part or all of the present embodiment (example) is part or all of the preceding or subsequent embodiment (example).

  In the anechoic box DAB, the communication antenna ANT described in the first embodiment and the fixing jig KJG for fixing the communication antenna ANT are arranged. The fixing jig KJG is fixed to the anechoic box DAB by a fixing screw KNJ. Yes. The communication antenna ANT and the reader machine RM are electrically connected by a semi-rigid cable KBL. The inlet 1 is fed into the anechoic box DAB in the state of the continuous insulating film 2 before being cut into the individual inlets 1, and the communication distance characteristics are measured for each inlet 1. The distance D3 between the inlet 1 and the communication antenna ANT is changed by loosening the fixing screw KNJ and changing the position of the communication antenna ANT together with the fixing jig KJG.

When the communication distance characteristic of the inlet 1 is measured under the above configuration,
(A) It is difficult to automatically change the distance D3 between the inlet 1 and the communication antenna ANT, and it takes time to acquire measurement data.
(B) A space that can secure the required amount of the distance D3 must be provided in the anechoic box DAB, resulting in an increase in the size of the anechoic box DAB.
(C) A mechanism for accurately changing the distance D3 is required.
(D) Since communication is performed using radio waves, it is necessary to block external radio waves in the anechoic box DAB, and it is difficult to downsize the anechoic box DAB.
(E) If there is a change in the parts inside the anechoic box DAB, the radio wave environment will change, and data will be reacquired.
(F) If the communication antenna ANT (fixing jig KJG) is frequently moved, the semi-rigid cable KBL is stressed and broken.
Such problems arise.

  As shown in FIG. 33, since the radio wave (traveling wave) transmitted from the communication antenna ANT is diffused radially from the communication antenna ANT, the power received by the inlet 1 decreases as the distance from the communication antenna ANT increases. Further, since the reflected wave from the inlet 1 is also diffused radially, the amount of modulation received by the communication antenna ANT decreases as the inlet moves away.

  Therefore, in the third embodiment, as shown in FIG. 34, a variable attenuator KGK is introduced between the communication antenna ANT and the reader RM, and the distance D3 between the inlet 1 and the communication antenna ANT is fixed. Reproduce the distance dependency by changing the attenuation amount. That is, the attenuation characteristic caused by the distance between the standard inlet 1 and the communication antenna ANT is examined in advance, and the attenuation is changed by the variable attenuator KGK while keeping the distance D3 constant. The characteristic can be measured. Thereby, the above-mentioned problems (a) to (f) can be solved.

  In addition, since the anechoic box DAB can be downsized, the communication distance characteristic can be measured without using the large anechoic box DAB even with the inlet 1 having a long communication distance. In addition, in the case of the long inlet 1 having a communication distance of about 1 m or more, the number of measurement points increases when measuring the communication distance characteristics, and there is a concern that the measurement time may be lengthened. However, the present embodiment shown in FIG. According to the configuration 3, it is not necessary to change the distance D3 between the inlet 1 and the communication antenna ANT, and the measurement time can be shortened.

  By the way, the inlet 1 may not be able to communicate if the distance from the communication antenna ANT is too far, and may not be able to communicate because the received power is too strong and the internal circuit malfunctions even if it is too close. Actually, in the process of selecting the inlet 1 as a product, it is measured whether or not communication at a short distance (under a strong electric field) as shown in FIG. 35 is possible, and then a long distance (weak) as shown in FIG. By measuring whether or not communication under an electric field is possible, it is possible to communicate at a distance between them by guaranteeing that communication at both short and long distances is possible. Guarantee. As described above, when measuring the communication distance characteristic, the measurement is performed over the entire distance from the short distance to the long distance (see FIG. 37). That is, one measurement device is required for communication measurement at a short distance (under a strong electric field), one for measurement of communication at a long distance (under a weak electric field), and one for measurement of communication distance characteristics. On the other hand, by adopting the configuration of the third embodiment as shown in FIG. 34, these three measurements can be carried out with one measuring device.

  FIG. 38 shows a circuit when the communication antenna ANT is connected to the reader RM via the variable attenuator KGK. As shown in FIG. 38, the power sent from the reader RM is sent to the communication antenna ANT after passing through the variable attenuator KGK, so even if the attenuation of the variable attenuator KGK is set to 0 dB, it is actually Since there is a loss of the variable attenuator KGK itself, it cannot be strictly set to 0 dB. Therefore, there is a problem that strong power (radio wave) cannot be applied to the inlet 1 from the communication antenna ANT.

  Therefore, in the third embodiment, as shown in FIG. 39, a circuit that does not pass through the variable attenuator KGK is provided, and this circuit and the variable attenuator KGK can be switched by relays RL1 and RL2. Thereby, attenuation of the variable attenuator RM itself can be eliminated. Also, as shown in FIG. 40, the communication antenna ANT and the reader RM are electrically connected by a circuit that does not pass through the variable attenuator KGK by adopting a circuit configuration using the bipolar dual-headed relays RL3 and RL4. At this time, since the number of contact points of the relay can be reduced by one as compared with the circuit configuration shown in FIG. 39, the amount of attenuation can be further reduced.

  FIG. 41 is a circuit diagram showing an internal circuit configuration of the variable attenuator KGK. As shown in FIG. 41, various attenuators GSK1 to GSK7 are arranged in series in the variable attenuator KGK, and the attenuators GSK1 to GSK7 are arranged in parallel with the attenuators GSK1 to GSK7. Circuits KR1 to KR7 for preventing passage are provided. The attenuators GSK1 to GSK7 and the circuits KR1 to KR7 can be switched by mechanical contact type relays RL11 to RL17, respectively, so that various attenuation amounts can be formed. In FIG. 41, a case where seven attenuators GSK1 to GSK7 are arranged in the variable attenuator KGK is illustrated. When a fine attenuation setting is unnecessary or only a small attenuation is set, the number of attenuators may be less than seven.

  When the variable attenuator KGK having mechanical contact type relays RL11 to RL17 as shown in FIG. 41 is used, the life of the variable attenuator KGK is shortened by repeated switching of the relays RL11 to RL17. Therefore, it is required to periodically inspect the variable attenuator KGK. Therefore, in the third embodiment, as shown in FIG. 42, the relay RL5 is attached to the variable attenuator circuit KGC including the variable attenuator KGK and the relays RL3 and RL4, and the connection destination includes the power including the communication antenna ANT and the power meter DRK. It can be switched with the measurement circuit DSC. The relay RL5 is switched by the control of the computer COM, and the computer COM reads from the wattmeter DRK whether the predetermined power is output from the variable attenuation circuit KGC and performs self-diagnosis. This self-diagnosis is automatically performed, for example, before starting the measurement of the communication distance characteristic of the inlet 1 and after the end of the measurement. As a result, the variable attenuator KGK is regularly inspected without increasing the burden on the operator. As a result, it is possible to improve the overall reliability of the system that measures the communication distance characteristics of the inlet 1.

(Embodiment 4)
Next, the fourth embodiment will be described. In principle, description of the same parts as those in the first embodiment (Example 1), the second embodiment (Example 2), and the third embodiment (Example 3) is omitted. As described above, part or all of the present embodiment (example) is part or all of the preceding or subsequent embodiment (example).

  The inlet 1 (see FIG. 1) is a device that communicates by radio waves. In addition, since the strength of the radio wave reaching the inlet 1 depends on the surrounding radio wave environment, an uncertain factor increases. In order to increase the production efficiency of the inlet 1, it is preferable to eliminate this uncertain factor as much as possible. Since the inlet 1 itself operates with a high-frequency current, radio waves are not necessarily required when measuring the communication distance characteristics of the inlet 1. Rather, for accurate measurement, it is preferable to perform measurement without using radio waves as much as possible.

  Therefore, in the fourth embodiment, the communication distance of the chip 5 before the step of mounting the chip 5 (see FIG. 4) on the antenna 3 (see FIG. 1) using the measuring jig SJG1 as shown in FIG. Measure characteristics. The configuration (circuit configuration) of the measurement system other than the measurement jig SJG1 is, for example, the same as the configuration of the measurement system shown in FIG. 42 in the third embodiment (see FIG. 44). The measuring jig SJG1 has a structure in which a socket SKT2 and a signal terminal ST1 are attached to a housing KT1. The top plate of the housing KT1 to which the socket SKT2 is attached has a structure in which a copper pattern is attached to a glass epoxy substrate, for example, and the copper pattern is attached to the inside of the housing KT1. Further, the side plate to which the signal terminal ST1 is attached and other side plates are made of metal such as aluminum or iron. As shown in FIG. 45, the chip 5 attached to the socket SKT2 is electrically connected to the signal terminal ST1 via the microstrip line MSL (the copper pattern). Further, the chip 5 mounted in the socket SKT2 is also electrically connected to the ground wiring GL that is electrically connected to the ground potential. For example, the characteristic impedance of the measurement system circuit including the variable attenuation circuit KGC (see FIG. 42) is about 50Ω, but the characteristic impedance of the chip 5 is not about 50 ohms. Therefore, sufficient power is not applied. Therefore, as shown in FIG. 46, an impedance matching circuit ISK is inserted between the chip 5 and the microstrip line MSL and the ground wiring GL to match the characteristic impedances of both. In the mobile phone 4 of the present embodiment, an impedance converter IHK (see FIG. 45) attached to the microstrip line MSL can be exemplified as the impedance matching circuit ISK, and an open stub can be exemplified as the impedance converter IHK. it can.

  With the configuration of the fourth embodiment as described above, an anechoic box for forming a measurement environment is not required, and the measurement jig SJG1 can be downsized. For example, a transistor measurement jig can be used as the measurement jig SJG1. As a result, the measurement jig SJG1 can be designed so that the communication distance characteristics of the chip 5 can be measured at high speed.

  In addition, by adopting the configuration of the fourth embodiment as described above, a portion for transmitting and receiving radio waves can be omitted, so that a measurement environment that is not affected by surrounding radio waves can be formed. it can. Thereby, it is possible to improve the measurement system of the communication distance characteristic of the chip 5 of the fourth embodiment.

(Embodiment 5)
In the fourth embodiment, the communication distance characteristic of the chip 5 is measured before the step of mounting the chip 5 (see FIG. 4) on the antenna 3 (see FIG. 1) using the measuring jig SJG1 (see FIG. 43). In the fifth embodiment, the communication distance characteristic of the inlet 1 is measured in a situation where the chip 5 is mounted on the antenna 3 (see FIG. 1). In principle, the same parts as those in the first embodiment (Example 1), the second embodiment (Example 2), the third embodiment (Example 3), and the fourth embodiment (Example 4) are described. Is omitted. As described above, part or all of the present embodiment (example) is part or all of the preceding embodiment (example).

  FIG. 47 is a perspective view of the measuring jig SJG2 used for measuring the communication distance characteristic of the inlet 1 in the fifth embodiment. The configuration (circuit configuration) of the measurement system other than the measurement jig SJG2 is the same as the configuration of the measurement system shown in FIG. 42 in the third embodiment, for example. The measuring jig SJG2 has a structure in which, for example, a dipole antenna DPA and a signal terminal ST2 are attached to the housing KT2. The top plate of the housing KT2 to which the dipole antenna DPA is attached has a structure in which a copper pattern is attached to a substrate made of glass epoxy, for example, like the measurement jig SJG1 described in the fourth embodiment. The copper pattern is attached inside the housing KT2. Further, the side plate to which the signal terminal ST2 is attached and the other side plates are formed of a metal such as aluminum or iron in the same manner as the measurement jig SJG1 of the fourth embodiment. The dipole antenna DPA is disposed in the housing KT2 and is electrically connected to the signal terminal ST2 through the balun BRN inside the measurement jig SJG2 (see FIG. 48). By disposing the dipole antenna DPA so as to appear on the upper surface of the housing KT2, it is possible to prevent radio waves from being radiated to the outside of the measuring jig as much as possible except in the upward direction. An opening reaching the dipole antenna DPA is provided in the top plate of the housing KT2, and radio waves are radiated in a semicircular shape from the opening to communicate with the inlet 1. In the fifth embodiment, a shield SLD made of a radio wave absorber as shown in FIG. 49 is arranged to prevent radio waves radiated in a semicircular shape from radiating in directions other than the upward direction. Thereby, the malfunction which communicates with inlets 1 other than a measuring object can be prevented. When measuring the communication distance characteristics of the inlet 1, the insulating film 2 before being divided into the individual inlets 1 is passed between the upper surface (top plate) of the housing KT 2 and the shield SLD and formed on the insulating film 2. The communication distance characteristics of the inlet 1 are continuously measured.

  Further, a monopole antenna MPA may be used instead of the dipole antenna DPA (see FIG. 50). In this case, the monopole antenna MPA is electrically connected to the signal terminal ST2 via the shield cable SKB inside the measurement jig SJG2 (see FIG. 51).

  When the communication distance characteristic of the inlet 1 is measured using the measurement jig SJG2 as described above, the communication antenna of the measurement jig SJG2 becomes the dipole antenna DPA or the monopole antenna MPA, but the gain is reduced. By selecting one that has good matching with respect to one dipole antenna (antenna 3), it is possible to bring them closer to a very short distance. As a result, the power received by the inlet 1 can be made equivalent to the case of using a one-patch communication antenna ANT (for example, see FIG. 33). In addition, since the radio wave attenuates rapidly when it is away from the upper surface of the measurement jig SJG2 on which the dipole antenna DPA or the monopole antenna MPA is disposed, it is difficult to transmit unnecessary radio waves to other than the inlet 1 being measured. Furthermore, since it becomes difficult to receive radio waves from anything other than the inlet 1 being measured, the measurement accuracy of the communication distance characteristics of the inlet 1 can be improved.

  Further, when the communication distance characteristic of the inlet 1 is measured using the measuring jig SJG2 as described above, the variable attenuator KGK is used to connect the inlet 1 and the dipole antenna DPA or the monopole antenna MPA. Since the distance dependency is reproduced while the distance is kept constant, the communication limit value of the inlet 1 can be measured. Thereby, quality control of the inlet 1 can be facilitated. Furthermore, management with a standard sample can be performed in managing the measurement jig SJG2.

  Further, when the communication distance characteristic of the inlet 1 is measured using the measurement jig SJG2 as described above, the anechoic box becomes unnecessary because the measurement jig SJG2 is shielded. Therefore, the space required for the measurement can be greatly reduced, and according to experiments conducted by the present inventors, the space can be reduced to about 1/100.

  Further, when the communication distance characteristic of the inlet 1 is measured using the measuring jig SJG2 as described above, the communication measurement at a short distance (under a strong electric field), the long distance as in the third embodiment. Communication measurement (under a weak electric field) and measurement of communication distance characteristics can be performed with one measuring jig SJG2. Thereby, the number of manufacturing steps of the inlet 1 of the fifth embodiment can be reduced.

  Further, when the communication distance characteristic of the inlet 1 is measured using the measurement jig SJG2 as described above, the strictness of the position accuracy is not required as compared with the measurement using the auxiliary antenna. Therefore, management of the measurement jig SJG2 can be facilitated.

  As for the auxiliary antenna for enabling selection on the non-contact RFID continuous tape in the muchip, prior applications by other inventors including one of the inventors (Japanese Patent Application Laid-Open No. 2004-220141). , Corresponding US Application No. 10-753,454; US Application Date Jan. 9, 2004) and will not be repeated except as necessary.

  Further, when the insulating film 2 is passed between the upper surface (top plate) of the housing KT2 and the shield SLD, the surface to which the antenna 3 is attached is arranged so that the antenna 3 is in contact with the dipole antenna DPA or the monopole antenna MPA. By passing the insulating film 2 toward the housing KT2 side, the characteristics of the chip 5 itself can be measured.

  Further, since the measurement jig SJG2 can be reduced in size, a plurality of measurement jigs SJG2 (housing KT2) can be used side by side. That is, as shown in FIG. 52, by arranging a plurality of measurement jigs SJG2 (housing KT2) and allowing the insulating film 3 to pass through all of the measurement jigs SJG2, communication between the plurality of inlets 1 is performed. Distance characteristics can be measured at once. As a result, the time required for measuring the communication distance characteristic of the inlet 1 can be further shortened.

  As mentioned above, the invention made by the present inventor has been specifically described based on the embodiment. However, the present invention is not limited to the embodiment, and various modifications can be made without departing from the scope of the invention. Needless to say.

  In the above embodiment, the antenna is configured using Cu foil attached to an insulating film made of polyimide resin. For example, the antenna is configured using Al (aluminum) foil attached to one surface of an insulating film, By configuring the insulating film with a resin (for example, polyethylene terephthalate) that is less expensive than the polyimide resin, the material cost of the inlet can be reduced. When the antenna is made of an Al foil, the connection between the Au bump of the chip and the antenna is preferably performed by forming an Au / Al junction using, for example, ultrasonic waves and heating.

  The manufacturing method of the inlet for electronic tags of this invention can be applied to the process of measuring the communication distance characteristic of an electronic tag.

Claims (9)

An RFID element manufacturing method including the following steps:
(A) The communication distance characteristic of the RFID element having the first antenna is set such that the distance between the first antenna and the second antenna is substantially constant by using the second antenna provided outside the RFID element. The process to measure in the state.   The RFID element manufacturing method according to claim 1, wherein the measurement is performed on a plurality of RFID elements substantially simultaneously.   3. The method of manufacturing an RFID element according to claim 2, wherein the plurality of RFID elements are fixed on a single tape.   2. The method of manufacturing an RFID element according to claim 1, wherein the RFID element has an antenna on an integrated circuit chip storing ID data. An RFID element manufacturing method including the following steps:
(A) A step of electrically measuring a communication distance characteristic of an RFID element substantially having no antenna without using an antenna provided outside the RFID element. An RFID element manufacturing method including the following steps:
(A) A communication distance characteristic of an RFID element that substantially does not have an antenna is measured using radio waves between the first and second antennas using first and second antennas provided outside the RFID element. The process of measuring.   In the method for manufacturing an RFID element according to claim 6, the measurement is performed in a state in which the distance between the first antenna and the second antenna is substantially constant. An RFID element manufacturing method including the following steps:
(A) The communication distance characteristic of the RFID element having the first antenna is automatically determined by using the second antenna provided outside the RFID element, and the distance between the first antenna and the second antenna is automatically set. The process of automatically measuring at multiple points. An RFID element manufacturing method including the following steps:
(A) A step of electrically measuring the communication distance characteristics of the RFID element without using an antenna provided outside the RFID element.

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