WO2006073067A1

WO2006073067A1 - Resin composition excelling in anticorrosive and/or conductive performance and member coated with resin composition

Info

Publication number: WO2006073067A1
Application number: PCT/JP2005/023612
Authority: WO
Inventors: Kazuo Kobayashi
Original assignee: Shieldtechs, Inc.
Priority date: 2005-01-06
Filing date: 2005-12-22
Publication date: 2006-07-13
Also published as: JP2006213909A

Abstract

A resin composition comprised of a resin compounded with clad scale micropowder of different types of metals containing at least either (a) Zn and/or Al formed into scaly micropowder or (b) Cu and/or Ni formed into scaly micropowder. The resin composition can be easily applied to a base material while taking advantage of the conventional corrosion preventive (anticorrosive) method. The resin composition exhibits excellent anticorrosive and conductive characteristics equivalent to or higher than those of hot-dip plating. The resin composition obviates the occurrence of any thermal brittleness in base materials and requires no additional treatments, such as pore sealing treatment. The resin composition is available as a nonpolluting anticorrosive agent that even in the event of thick coating, is free of anxiety about residual stress and permits workmanship capable of coping with aging deterioration. The resin composition is available as a nonpolluting electromagnetic wave shielding agent that solves problems of conventional electromagnetic wave shielding technology and exhibits electromagnetic wave shielding characteristics with a uniform coating film structure formed through conventional application method while avoiding the need to select locality of execution. Moreover, there is disclosed a resin-coated member having a base material surface coated with this resin composition.

Description

Specification

Resin composition excellent in anti-mold property and Z or conductivity and resin composition covering member

Technical field

[0001] The present invention can be applied easily, has conductivity with a small amount of metal powder, and / or has excellent anti-corrosion (corrosion-preventing) properties equal to or better than zinc plating. In addition, the present invention relates to a resin composition that also exhibits excellent shielding properties for blocking electromagnetic waves, and a resin-coated member coated with such a resin composition.

Background art

[0002] In steel materials, it is necessary to prevent corrosion (anti-corrosion) on the surface, but as such a method, (I) by coating the surface with a coating film or other organic resin material with a multilayer film, oxygen, Coating method that blocks contact with sulfides, halides, etc. (i) Melting method in which the object to be treated is immersed in molten zinc or molten zinc-aluminum for a certain period of time, and zinc-aluminum is deposited and formed. III) Metal spraying methods are known in which zinc or aluminum is melted with a gas flame, arc, etc., adhered to the surface of steel materials, etc., and prevented by applying a sacrificial anode reaction due to the potential difference between the metals (for example, JP-A-2001-271152, JP-A-9-125221, JP-A-9-3614, JP-A-8-176781, and the like.

[0003] On the other hand, electromagnetic interference and information leakage are seen as problems due to the widespread use of various electronic devices, wireless LANs, mobile phones, etc. and the arrival of the ubiquitous era. Nyen shielding paint is used. As such technology, there are known techniques such as bonding of metal plates and bonding of shield plates mixed with conductive fillers into building materials. In addition, an electromagnetic shielding material in which a metallic filler or fiber is mixed with synthetic rubber or synthetic resin has been proposed (for example, JP-A-2002-309107, JP-A-10-316910). . Further, a technique for improving electromagnetic wave shielding properties by imparting conductivity by a method such as metal plating or metal deposition is also known.

[0004] It has been pointed out that the various anti-corrosion (corrosion-prevention) methods described above have the following problems. Yes. First, (I) anti-corrosion (anti-corrosion) methods using paint mainly use organic solvent-based paints. Hardness is insufficient, resulting in surface damage and scratches due to wear. This causes the deterioration of the blocking function and peeling, and also causes corrosion due to damage due to deterioration caused by ultraviolet rays.

[0005] (ii) Although the melt-sealing method has a corrosion resistance of 10 to 15 years, a large-scale plant for immersing the workpiece in molten zinc or the like is necessary to implement it. There is a problem that it cannot be applied to the maintenance of steel structures. In particular, sheet steel is not applicable to long steel materials due to problems such as melting temperature, immersion pool, and distortion of workpieces due to high temperatures.

[0006] Recent advances in zinc and aluminum alloying technology Costs are required for facilities such as ceramic furnaces, and environmental regulations are becoming stricter in wastewater treatment of harmful substances. There's a problem. Furthermore, with zinc-aluminum alloy plating, the size of the crystal grains of zinc and aluminum that are produced varies depending on the cooling temperature of zinc and aluminum, so that corrosion is likely to occur from the so-called grain interface. There is also.

[0007] (III) The metal spraying method has a feature that a functional surface such as a zinc'aluminum alloy is directly formed on the surface of the steel material. However, it requires mechanical equipment for metal spraying (spraying gun, power supply device, blower, wire rod take-out device, spraying extension cord, etc.), and construction efficiency is also a determinant of craftsman's technology. There is a heavy burden of carrying in equipment and maintenance, and even from this, it is necessary to consider profitability, and there are difficulties in spraying on existing steel structures and construction in narrow structures There's a problem. In addition, in order to force zinc'aluminum to adhere to the surface of the object to be treated, the steel structure surface is subjected to shot blasting or sand blasting, and an anchor effect is exhibited using a rough surface forming agent. Pre-processing is required. Furthermore, if the metal spray surface is made thicker in order to enhance the effect of metal spraying, there is a problem in that the adhesiveness such as peeling of the metal spray layer is deteriorated due to the generation of internal strain and residual stress due to the difference in heat dissipation effect. In addition, since a spongy hole is formed on the surface of the sprayed material, it is pointed out that a further sealing process is required.

[0008] On the other hand, the electromagnetic wave shielding methods that have been proposed so far also include the following: Problems have been pointed out. For example, the method of pasting metal plates and pasting shield plates mixed with conductive fillers into building materials cannot be applied to narrow parts, complex shapes, uneven surfaces, mating parts, etc. There is a problem that electromagnetic waves are leaked from the gap between the bonded portions and cannot be completely blocked even if they are covered with conductive tape. In particular, there is a drawback that the construction cost is high in terms of profitability. In conductive shield paints, narrow areas, complex shapes, and uneven parts can be applied and electromagnetic leakage can be prevented. Organic paints and organic solvents (toluene, etc.) are used for paint components. Therefore, environmental problems due to volatilization of residual harmful substances (formaldehyde etc.), electromagnetic leakage from cracks due to aging due to temperature, humidity, and ultraviolet rays can be cited as problems. Furthermore, even with synthetic rubber electromagnetic wave sheets and electromagnetic wave shielding films, there is a problem that even if the seam is closed with a conductive tape, electromagnetic waves cannot be completely blocked due to peeling of the tape or the like.

[0009] The present invention has been made under such circumstances, and the object thereof is to enable easy painting while producing the advantages of the conventional anti-corrosion (corrosion-prevention) method, and to melt the force. Exhibits superior antibacterial and conductive properties equivalent to those of metal plating, eliminates the need for additional processing such as sealing that prevents thermal embrittlement in the base material, and eliminates the risk of residual stress even when applied thickly. As a non-polluting antifungal agent that can be applied to prevent deterioration, it further eliminates the problems associated with conventional electromagnetic shielding technology, and has a uniform coating structure with the conventional coating method regardless of the construction site. It is an object of the present invention to provide a resin composition useful as a pollution-free electromagnetic wave shielding agent that exhibits characteristics, and a resin-coated member in which such a resin composition is coated on a substrate surface.

Disclosure of the invention

[0010] The resin composition of the present invention that has achieved the above-mentioned object is: (a) Zn and Z or A1 formed in a scale-foil-like fine powder; and (b) formed in a scale-foil-like fine powder. The gist is that a fine powder of clad scale foil of a dissimilar metal containing at least one of Cu and / or Ni is blended with a resin. This resin composition is preferably blended with a powder or alloy powder of one or more elements selected from the group power consisting of Mn, Mg, Mo, Li, C and Ag, if necessary.

[0011] The resin used in the resin composition of the present invention has a general formula: R ¹ Si (OR ² ) (wherein R ¹ Is a hydrocarbon group having from 10 to 10 carbon atoms, R ² is an alkyl group having 1 to 3 carbon atoms, 2 to

Curable silicone resin comprising a silanic compound or a partially hydrolyzed condensate thereof, which is an acyl group of 3 or an alkoxyacyl group of 3 to 5 carbon atoms, and N is an integer of 0 to 2. Is mentioned.

[0012] If necessary, the resin composition of the present invention may also contain (1) a metal alkoxide (excluding Si alkoxide) or lithium hydroxide (LiOH), whereby the resin composition These characteristics can be further improved.

[0013] By coating the surface of the substrate with the resin composition as described above, a resin composition-coated member having excellent antifungal properties and / or conductivity can be obtained.

Brief Description of Drawings

FIG. 1 is a graph showing the electric field shielding effect of a resin composition measured over a wide frequency range.

FIG. 2 is a graph showing the magnetic field shielding effect of a resin composition measured over a wide frequency range.

BEST MODE FOR CARRYING OUT THE INVENTION

[0015] The present inventor has intensively studied to achieve the above object. As a result, (a) Zn and / or A1 formed on the scale-like fine powder and (b) Cu and / or Ni formed on the scale-like fine powder. The inventors have found that a resin composition that can achieve the above-mentioned object can be realized by using a metal clad scale foil powder in a resin, and the present invention has been completed.

[0016] The components (a) and (b) above are used in the form of a scale-foil fine powder, and the "scale foil-like fine powder" means a flaky fine powder, It can be manufactured by applying a ball mill. For example, in A1, the A1 foil can be made into an aluminum scale foil-like fine powder by the above method. In addition, by combining the components (a) and (b) formed into a scale-foil-like fine powder as appropriate and applying impact pressure in an inert atmosphere with a vibration mill, etc. Due to the electrostatic effect of impact energy, other powders are irregularly pressed onto the powder surface, resulting in a clad scale foil fine powder.

[0017] The resin composition of the present invention contains at least one of the above-mentioned components (a) and (b). However, the combination of clad scale fine powder is not necessarily the component (a) and (b). The clad scale fine powder is composed of (a) components or (b) components. Can also be used. For example, Zn powder and A1 powder formed into a scale-foil-like powder are pulverized into fine pieces with a vibration mill, so that the surface of the Zn scale foil powder, which is the base material, has irregularly low A1 scale powder. And then clad by completely or partially coating the surface of the Zn powder to form a composite material of dissimilar metals. This situation is the same for the components (b) or between the components (a) and (b). However, when selecting (a) components or (b) components inevitably, a combination of “Zn powder and A1 powder” or “Cu powder and Ni powder” can be used. This constitutes a fine powder of clad scale foil.

[0018] The component (a) is a scale-like Zn and Z or A1 fine powder. The size (particle diameter) is preferably about 10 to 50 μm, and the thickness 1 to about 10 μm. More preferably, the size is 15 to 30 / im and the thickness is 2 to 6 μΐη. The component (b) is a scale-like Cu and / or Ni fine powder. The strength (particle size) is preferably about 10-30 μm and the thickness is about 0.5-5 μm. More preferably, a size of 10 to 20 / m and a thickness of 1 to 3 / m are good.

[0019] By blending the clad scale fine powder as described above into the resin, a resin composition having excellent antifungal properties and / or conductivity can be realized. By adopting such a configuration, the reason why the above-mentioned effects can be obtained has not been clarified, but I could probably think as follows. That is, when the clad scale fine powder as described above is blended in the resin, the metal powder can be made uniform in the resin and has a uniform coating film structure. It was thought to be excellent in conductivity

[0020] In order to exert the effect of the present invention, the blending ratio of the clad scale fine powder to the resin is preferably 50% by mass or more. However, when it is excessively blended, the ratio of the resin is reduced. Since the paintability deteriorates, it is preferable to make it 60% by mass or less.

[0021] The clad scale fine powder used in the antifungal agent of the present invention preferably has a size (particle size) of about 10 to 50 μm and a thickness of about 1 to 8 _μm. Preferably size 20-40 m, thickness It should be 2-5 μm.

[0022] It should be noted that the ratio at which each component is clad may be appropriately set. For example, when combining Zn and A1, the zinc component is 70 to 95 masses with respect to the total mass of Zn and A1. The range of about 85% by mass to 95% by mass is preferable. As the volume with respect to the ratio of zinc and aluminum is closer to the same capacity, the sacrificial anode effect due to the difference in standard electrode potential becomes more prominent.

[0023] For example, in the zinc / aluminum clad fine powder, A1 standard electrode potential is _1.662V, zinc standard electrode potential-0.762V, iron standard electrode potential by laminating each component Since the voltage is 0.447V, the sacrificial anode effect due to the potential difference between them improves the fender resistance.

[0024] The component (a) contributes to improvement of anti-mold properties, and the component (b) contributes to conductivity (electromagnetic wave shielding property). What is necessary is just to set arbitrarily about the blending ratio of (a) component and (b) component according to the characteristic requested | required.

[0025] In the resin composition of the present invention, if necessary, it is also useful to blend a powder or alloy powder of one or more elements selected from the group consisting of Mn, Mg, Mo, Li, C and Ag. . These components reduce the gap between the powder particles in the resin, thereby making the dispersed state of the powder particles more airtight, further improving the uniformity of the metal powder in the resin and the uniform coating film structure. These components are also effective for imparting conductivity, as in the case of component (b). In order to exert these effects, it is appropriate that the mixing ratio of the resin is about:! To 12% by mass. Of these components, C powder (graphite powder) formed in a scale foil shape is particularly preferable. Moreover, in order to exhibit the effect by the combination of these components more effectively, the size (particle size) is preferably about 1 to 10 zm.

[0026] As the resin used in the resin composition of the present invention, various resins such as a modified silicone resin and a curable silicone resin can be used, and the type of the resin is not particularly limited. The silane compound represented by 1) or a partially hydrolyzed condensate thereof is preferably a curable silicone resin.

[0027] The curable silicone resin is conventionally a so-called silicone varnish solution in which a curable silicone resin having a terminal silanol group is dissolved in an organic solvent such as toluene or xylene. Although it is frequently used, this has the following problems (1) and (2).

(1) An organic solvent having a low flash point is an essential component.

(2) —Generally, long-time heat curing at 150 ° C or higher is required to form a cured coating film. For this reason, a large amount of energy is required for curing, and the application range is limited to the line coating method, so on-site construction is basically impossible.

[0028] Because of these problems, as a solvent-free room-temperature curable silicone resin that does not contain an organic solvent and can be cured at room temperature, a silicone alkoxy oligomer obtained by partial (co) hydrolytic condensation of organoalkoxysilane; If necessary, the addition of a curing catalyst that promotes moisture curing of this silicone alkoxy oligomer is studied, and by using a resin represented by the general formula (1) described below, curing at room temperature is possible, It can also be applied to maintenance of steel structures and indoor / outdoor electromagnetic shielding construction.

[0029] By blending the clad scale powder with the curable silicone resin as described above, a uniform laminated film can be formed and the resin composition can be further improved.

[0030] There are two types of inorganic zinc paints that have been used in the past: a type in which powders such as zinc are mixed with an inorganic high molecular silicone paint system immediately before use, and a type that is washed with modified silicone. Conductivity cannot be exhibited unless zinc powder: 90-96 mass% is included as a solid component. In addition, there are organic or inorganic antifouling paints mixed with simple scale metal powder, but since it is a mixture of simple metal powders, the anti-fouling (anticorrosion) effect becomes uneven due to irregular arrangement in the coating film. The zinc powder as a metal solid component: 90-96% by mass.

[0031] On the other hand, in the resin composition according to the present invention, conductivity can be imparted by adding a small amount of clad scale foil powder, and good anti-corrosion (anticorrosion) properties can be secured. . In addition, when 90 to 96% by mass of metal powder is blended, the formed surface becomes rough and porous, so that the effect is not exhibited unless the film thickness is 100 μm or more. In the film formation with the resin composition, the effect is exhibited even when the film thickness is about 50 μm. With the resin composition of the present invention, excellent workability that can be applied simply as in the conventional coating method, and even if the amount of metal powder is reduced, the resulting film is an inorganic zinc paint, an organic 'inorganic antifouling paint. Excellent, equal to or better than hot dip galvanizing and metal spraying In addition to exhibiting antifungal properties, it has various advantages such as the need for troublesome post-treatment such as sealing treatment.

[0032] As described above, in the resin composition in which the clad scale powder is blended with the curable silicone resin, the hydrolyzable reactive group _OR (a) of the curable silicone resin undergoes a hydrolysis reaction, and the metal surface ( It can adsorb to the hydroxyl group of Me) by hydrogen bonding, and then chemically dehydrate (Me_O_Si_ ○ R) by dehydrating condensation reaction to form a film that adheres firmly to the steel structure. In addition, clad scale fine powder is a heterogeneous metal bond (for example, OR-Al-O-Si-O-Zn-O-Si_〇R) formed by partial hydrolysis or dehydration condensation reaction. Therefore, the cured silicone resin has no residual harmful components and has excellent weather resistance. It shows some non-polluting protection (corrosion protection).

[0033] The curable silicone resin preferably used in the present invention contains an alkoxysilyl group, which is a silane compound represented by the following general formula (1), or a portion thereof (both). One or a mixture of two or more hydrolysis condensates.

[0034] R ¹ Si (OR ² )

N 4-N

R ¹ in the general formula (1) may be the same or different and is an unsubstituted or substituted monovalent hydrocarbon group having!: 10 to 10 carbon atoms, specifically a methyl group or an ethyl group. , Propyl group, butyl group, hexyl group, octyl group, decyl group, etc. alkyl group, cyclohexyl group, etc. cycloalkyl group, vinyl group, aryl group etc., alkenyl group, phenyl group, tolyl group, etc. The aryl group is exemplified.

[0035] R ² is an alkyl group having 1 to 3 carbon atoms, an acyl group having 2 to 3 carbon atoms, or an alkoxyalkyl group having 3 to 5 carbon atoms, specifically a methyl group, an ethyl group, Propyl group, Isopropyl group power Alkyl groups selected, acyl groups such as acetyl groups, methoxyethyl groups, ethoxyethyl groups, propoxycetyl groups, methoxypropyl groups, ethoxypropyl groups, and other alkoxyalkyl groups.

[0036] N in the general formula (1) is an integer of 0 to 2 (N = 0, 1, 2), but the hardenability of the resin composition, the surface hardness of the cured coating film, the substrate and In view of adhesion of the curable silicone resin, N = 1 silane compound and / or its partial (co) hydrolysis condensate It is more preferable that the ratio is 30 mol% or more, and 40 to 100 mol% is more preferable. The proportion of the N = 0 silane compound and / or its partial (co) hydrolyzed condensate is preferably 40 mol% or less in the curable silicone resin, and the N = 2 silane compound The ratio of the partial (co) hydrolysis condensate is preferably 60 mol% or less in the curable silicone resin.

[0037] As the curable silicone resin component, in addition to the silane compound of N = l and Z or a partial (co) hydrolysis condensate thereof, the silane compound of N = 0 and the portion thereof (co) hydrolytic condensate When added, the surface hardness of the cured film (resin film) can be increased, but if the amount is too large, cracks may occur on the surface of the film, and N = 2 silane compound and / or its part When a (co) hydrolysis condensate is used in combination, toughness and flexibility are imparted to the cured coating, but if the amount is too large, sufficient crosslinking density cannot be obtained. May decrease.

[0038] Specific examples of such silane compounds and partial (co) hydrolysis condensates thereof include tetramethoxysilane, tetraethoxysilane, methyltrimethoxysilane, methyltriethoxysilane, methyltriisopropoxysilane, Methyltriacetoxysilane, methyltris (methoxyethoxy) silane, methyltris (methoxypropoxy) silane, etyltrimethoxysilane, propyltrimethoxysilane, butyltrimethoxysilane, hexyltrimethoxysilane, octyltrimethoxysilane, decyl Trimethoxysilane, cyclohexyltrimethoxysilane, vinyltrimethoxysilane, butyltriethoxysilane, allyltrimethoxysilane, phenyltrimethoxysilane, phenyltriethoxysilane, tolyltrimethoxy Lanthanum, cyanoethyltriethoxyxysilane, β- (3,4-epoxycyclohexylenole) ethinoretrimethoxysilane, γ-metatalinopropyltrimethoxysilane, γ-aminopropyltriethoxysilane, N_j3 (aminoethylinole) ) Γ-Aminoprovir trimethoxysilane, フ -Finenore γ-Aminoprovir trimethoxy , Diphenyldimethoxysilane, diphenyljetoxysilane, methylphenyldimethoxysilane, γ-clopropylpropylmethyldimethoxysilane, 3,3,3-trifluoropropylmethyldimethoxysilane, γ-glycidoxypropylmethylger Toxisilane, γ-methacrylo

, Y-aminopropylmethyl jetoxysilane, N-β (aminoethyl) γ-aminopropoxysilane or acyloxysilane, and partial (co) hydrolysis condensates thereof.

[0039] Among these silane compounds and silane compounds as precursors of partial (co) hydrolysis condensates, versatility, cost, and curability when used as an antifungal agent or an electromagnetic shielding agent, From the viewpoint of coating film (film) characteristics, R ¹ in the general formula (1) is a group selected from a methyl group and a phenyl group, and R ² is a group selected from a methyl group and an ethyl group. Specifically, methyltrimethoxysilane, methyltriethoxysilane, phenyltrimethoxysilane, phenyltriethoxysilane, dimethyldimethoxysilane, dimethylenogetoxysilane, diphenylenole are preferable. Examples include dimethoxysilane and dipheninoresiethoxysilane.

[0040] As the partial (co) hydrolysis condensate, a dimer of the above silane compound (1 mol of water is allowed to act on 2 mol of the silane compound and 2 mol of alcohol is eliminated). Siloxane units) to 100 mer, preferably 2 to 50 mer, more preferably 2 to 30 mer can be suitably used, and two or more silane compounds are used as raw materials. The (co) hydrolysis condensate can also be used.

[0041] As the curable silicone resin that may be used in the resin composition of the present invention, the above-mentioned silane compound or a partial (co) hydrolysis condensate thereof may be used alone, but two types having different structures are used. The above silane compound or partial (co) hydrolysis condensate may be used, or the silane compound and partial (co) hydrolysis condensate may be used in combination. However, partial (co) hydrolysis condensate is an essential component from the viewpoint of volatility during mixing and coating of components, workability, ease of curability control, and the amount of alcohol generated by moisture curing. It is preferable to do. [0042] As the partial (co) hydrolysis condensate as described above, those commercially available as silicone alkoxy oligomers can be used, but less than an equivalent amount of hydrolyzable silane compound can be added based on a conventional method. It can be produced by removing by-products such as alcohol and hydrochloric acid after reacting with the decomposed water. As the raw material hydrolyzable silane compound, for example, when using alkoxysilanes or acyloxysilanes as described above, an acid such as hydrochloric acid or sulfuric acid, an alkali metal such as sodium hydroxide or potassium hydroxide, or an alkali In the case of direct production from chlorosilanes that require partial hydrolysis and condensation using alkaline earth metal such as alkaline earth metal hydroxide or triethylamine as a reaction catalyst, water or What is necessary is just to make alcohol react.

[0043] In addition, workability at the time of mixing each component, antibacterial agent · coating properties of electromagnetic shielding agent, antibacterial effect • When considering the shielding effect, the viscosity (mechanical properties) of curable silicone resin component at 25 ° C The silane compound described above for the purpose of adjusting viscosity and curability is preferably 1 to 200 mPa's, more preferably 5 to 50 mPa's, and even more preferably 10 to 30 mPa's. It can be used, and in some cases, it is also acceptable to use a solvent component such as alcohol together.

[0044] Further, a silane coupling agent having an epoxy group, amino group, mercapto group or the like is added for the purpose of improving the adhesion to the substrate, or a silanol group-containing silicone resin is used for the purpose of improving the coating film properties. It is also possible to use parts together.

[0045] It is also effective to contain (1) a metal alkoxide (2) lithium hydroxide (LiOH) if necessary in the resin composition of the present invention. Among these, metal alkoxides enter between the three-dimensional cross-links formed by the curable silicone resin, and the metal ions released by reaction with moisture improve the conductivity of the film, resulting in sacrificial anodic action and electromagnetic shielding properties. By strengthening, the anti-magnetic effect “electromagnetic wave shielding effect” can be improved.

[0046] As the type of metal alkoxide, various alkoxides such as Al, Li, Sn, Zr, Fe, and Zn can be used. From the viewpoint of metal ionicity, Si alkoxide cannot be adopted. Among these, A1 alkoxide can be preferably used because it has a high effect of increasing conductivity. Examples of the alkoxy group may include a methoxy group, an ethoxy group, a propoxy group, an isopropoxy group, a butoxy group, a hexenoreoxy group, and a phenoxy group. In view of easiness, an isopropoxy group is preferred. Particularly preferred is aluminum triisopropoxide.

[0047] When the above metal alkoxide is used, it is good in combination with alcohols. As the alcohol used at this time, monohydric alcohols are preferable, and 2-propanol is particularly preferable. The content of the metal alkoxide is preferably in the range of! To 20 parts by mass with respect to 100 parts by mass of the resin component from the viewpoint of the ratio of the metal powder and the metal ions and the prevention of gelling of the silicone resin. 8: The range is 15 parts by mass.

[0048] On the other hand, by mixing lithium hydroxide with a curable silicone resin, as in the case of the above metal alcohol, partially liberated Li ions impart conductivity to the silicone resin, thereby forming the curable silicone resin. It can penetrate between the three-dimensional cross-linking, improve the conductivity of the film, enhance the sacrificial anodic action and electromagnetic wave shielding characteristics, and improve the antibacterial effect and electromagnetic wave shielding effect.

[0049] Lithium hydroxide has the ability to use hydrates and hydrates S, and if hydrates are mixed with curable silicone resin, viscosity increases easily due to hydrolysis reaction. It is preferable to use a non-hydrate.

[0050] When the above lithium hydroxide anhydride is used, the content is preferably in the range of 0 :! to 5 parts by mass with respect to 100 parts by mass of the resin component, preferably 0.5-2 parts by mass Part range.

[0051] If necessary, the resin composition of the present invention (when a curable silicone resin is used)

A curing catalyst for moisture curing the curable silicone resin containing an alkoxysilyl group may be used. Such curing catalysts include acids such as phosphoric acid; organic amines such as triethanolamine; organic amine salts such as dimethylamine acetate; quaternary ammonium salts such as tetramethylammonium hydroxide; carbonic acid Alkali (earth) metal salts of organic acids such as sodium hydride; Aminoalkylsilane compounds such as γ-aminopropyltriethoxysilane; Carboxylic acid metal salts such as zinc octylate; Organic tin compounds such as dioctyltin dilaurate; Examples thereof include titanic acid esters such as tetraisopropyl titanate and tetrabutyl titanate; metal chelate compounds such as acetylacetone aluminum salt.

The blending amount of the curing catalyst varies depending on the type of the curable silicone resin component and the curing catalyst to be used and the desired curing rate, but the curability and the work can be increased or decreased. Generally, it is preferable that the amount be in the range of 0.:! To 20 parts by mass with respect to 100 parts by mass of the curable silicone resin component, because the properties, storage stability, and coating film properties are adversely affected. It is good to mix in the range of 5-10 parts by mass.

[0053] The resin composition of the present invention includes various pigments, dyes, fillers, adhesion improvers, leveling properties in addition to the above components within the range that does not interfere with the effects of the present invention depending on the purpose of use. It is optional to add improvers, inorganic and organic ultraviolet absorbers, storage stability improvers, plasticizers, anti-aging agents, and the like.

[0054] In producing the resin composition of the present invention, the clad scale fine powder may be mixed in the resin. Specifically, first, the resin component and the metal alkoxide were sufficiently mixed. In a dispersion stirrer, a predetermined amount of (a) component and / or (b) component force, clad scale-foil fine powder is added and mixed, and stirred for 60 minutes to 120 minutes. In this mixing, it is preferable to carry out in a nitrogen atmosphere for the purpose of preventing hydrolyzable groups such as alkoxy groups from being hydrolyzed due to water mixing.

[0055] As the base material on which the resin composition of the present invention is coated, steel materials such as steel and pig iron are representatively exemplified for the purpose of imparting antifungal properties, For the purpose of imparting electromagnetic shielding properties, wood, gypsum board material, concrete-based material, and plastic material can be mentioned. Examples of the coating method (coating method) at this time include a dipping method, a spray method, and a brush coating method, and it is also possible to perform on-site coating. Further, the coating amount of the resin composition may vary depending on the type and purpose of the substrate. Generally, it is preferable that the coating thickness after curing is in the range of 150 to 30 μΐη. Is in the range of 100-60 μm.

[0056] The curing conditions of the resin composition are not particularly limited. However, the resin composition is cured by moisture in the air to form a film. It can be dried by allowing it to stand for 30 minutes to 2 hours in an ambient atmosphere (surface tack free state), and the curing reaction can be completed by leaving it for several hours to several days. In this case, it is optional to further heat-treat the substrate to be coated as long as it does not adversely affect the properties of the coating film, but the initial stage force of the drying process is exposed to high temperatures. It is preferable because the silane compound in the solvent evaporates and the moisture necessary for curing is not supplied. It ’s not good.

[0057] The resin composition according to the present invention bonds dissimilar metals in a bridge shape by chemical bonding, becomes stronger with time due to sharing of internal electrons between metals, and bonds semi-permanently without cracking or peeling. A film coated with such a film on the surface of the base material is a resin composition-coated member having excellent antifungal properties and / or conductivity.

Example

[0058] Hereinafter, the working effects of the present invention will be described more specifically by way of examples. However, the present invention is not limited by the following examples, and the design may be changed as appropriate within a range that can meet the gist of the preceding and following descriptions. These are all included in the technical scope of the present invention.

[0059] As the components in the resin composition of the present invention, the following (A) to (H) were prepared, and using these components, the resin compositions of the following Examples:! To 16 and Comparative Examples 1 to 7 I adjusted things.

[0060] (A) Clad ^ g end)

(A-1): Clad component ratio is 100% by mass of zinc / aluminum fine powder, zinc powder: 88% by mass, aluminum powder: 12% by mass; Size (particle size): 20-40 / m , Thickness: ~~ 5 xm (purity 98%)

(A- 2): cladding component ratio, with respect to zinc Z aluminum fine powder per 100 wt%, zinc powder: 90 mass ^_0/0, aluminum powder: 10 mass ^_0/0; size (particle diameter): 20 -40 μm, thickness 4-7 xm (purity 98%)

(A-3): Clad component ratio is 100% by mass of nickel Z aluminum fine powder, nickel powder: 90% by mass, aluminum powder: 10% by mass; Size (particle size): 15-30 μm , Thickness 3-6 μm (purity 98%)

(A-4): Clad component ratio is 100% by mass of nickel Z copper fine powder, nickel powder: ⁹⁸ % by mass, copper powder: ² % by mass; size (particle size): I ⁵ ~: 30 am, thickness 3-6 μm (purity 98%)

(A-5): Clad component ratio is 100% by mass of zinc / aluminum / copper fine powder, zinc powder: 90% by mass, aluminum powder: 9.5% by mass, copper powder: 0.5% ; Size (particle size): 20-40 μm, thickness 4-7 / im (purity 98%) (A-6): Nickel powder: 95% by mass, aluminum powder: 5% by mass, clad component ratio of 100% by mass of nickel / aluminum fine powder; Size (particle size): 15-30 / i _m , thickness 3-6 μm (purity 98%)

(A-7): Clad component ratio is nickel Z copper Z aluminum fine powder total 100 mass%, nickel powder: 99.5 mass%, copper powder: 0.4 mass%, aluminum powder: 0.1 mass%; Particle size): 15-30 xm, thickness 3-6 zm (purity 98%)

Nyui cow silicone ^)

(B-1): Partially hydrolyzed condensate of methyltrimethoxysilane (average degree of polymerization: 5, viscosity 5 mPas)

(B-2): Partial hydrolysis hydrolysis condensate of methyltrimethoxysilane (average polymerization degree: 25, viscosity: 15 mPa-sj Partial cohydrolysis condensation product (average polymerization degree: 10, viscosity: 35 mPa * s) Cohydrolyzed condensate (average polymerization degree: 20, viscosity: lOOmPa · s)

Component (C) (metal alkoxide or lithium hydroxide)

(C-1): Aluminum triisopropoxide

(C-2): Lithium hydroxide

(D) Other components (curing catalyst, solvent)

(D-1): Di-n-butoxyethyl acetate acetate aluminum

(D-2): Tetraisopropoxy titanium

(D-3): Absolute ethanol

(E) (Summary

(E-1) Size (particle size): 10 to 30 xm, thickness:! To 5 μm (purity 98%)

(F), (Uggel fine not developed into grains)

(F-1) Size (particle size): 7 ~: 10 xm (Purity 98%)

(G) Made, made, made ^^) (G-1) Size (particle size): 4-8μΐη

(Η) ^ is open 5¾)

(Η— 1) Size (particle size): 0.5 · 2μΐη (Purity 98%)

[0061] [Example 1]

(1) At room temperature and in a nitrogen atmosphere, (B-1): 62 parts by mass, (Β-2): 18 parts by mass, (Β-5): 2 parts by mass as the curable silicone resin of component (Β) And (D_l): 8 parts by mass as a curing catalyst were added and mixed with stirring. To this mixture of components (B) and (D), 10 parts by mass of (C-1): metal alkoxide of component (C) was further added, and the mixture was stirred and mixed again.

(2) As component (A), (A_l): 100 parts by mass were prepared.

(3) Mixture of component (B), (C), (D) prepared in step (1): 45 parts by mass and mixed powder of component (A) prepared in step (2): 55 parts by mass The mixture was mixed and sufficiently stirred and mixed under a nitrogen atmosphere while maintaining at 28 ° C. or lower by water cooling using a dispersion stirrer.

(4) In order to adjust the viscosity, the mixture of components (A) to (D) prepared in step (3): 100 parts by mass and (D-3): 4 parts by mass as a solvent and stirring Mixing was performed to obtain a resin composition. The viscosity of this resin composition was 60 mPa's.

[Example 2]

(1) The amount of each component used in Example 1 was the same as in step (2) except that (A) component (A-2): 100 parts by mass was prepared, and a resin composition was obtained. It was. The viscosity of this resin composition was 50 mPa's.

[0063] [Example 3]

(1) The amount of each component used in Example 1 was determined as (B-2): 18 parts by mass, (B-3): 68 parts by mass as the curable silicone resin of component (B) in step (1). Part (B-5): 2 parts by mass was stirred and mixed, and (D-2): 2 parts by mass was added and mixed as a curing catalyst to obtain a resin composition. The viscosity of this resin composition was 90 mPa's.

[0064] [Example 4]

In step (1), the amount of each component used in Example 1 was determined as (B-1): 40 parts by mass, (B-4): 30 parts by mass as the curable silicone resin of component (B). (B-5): Stir 12 parts by mass The mixture was stirred and the same adjustment was performed except that (D-1): 8 parts by mass was added and mixed as a curing catalyst to obtain a resin composition. The viscosity of this resin composition was 90 mPa's.

[Example 5]

In step (2), the amount of each component used in Example 1 is (A) as component (A-3)

: The same adjustment was performed except that 100 parts by mass was prepared, and a resin composition was obtained. The viscosity of this resin composition was 90 mPa's.

[Example 6]

(1) Under room temperature and nitrogen atmosphere, (B-1): 59 parts by mass, (B-2): 18 parts by mass, (B-5): 2 parts by mass as the curable silicone resin of component (B) And (D_l): 8 parts by mass as a curing catalyst were added and mixed by stirring. To this mixture of components (B) and (D), (C-1): 12 parts by mass was added as a metal alkoxide of component (C), and the mixture was stirred and mixed again.

(2) As component (A), (A-4): 94.5 mass parts were prepared.

(3) (F-1): 5 parts by mass as component (F) and (G-1): 0.5 parts by mass as component (G) were prepared.

(4) Mixture of components (B), (C), (D) prepared in step (1): 40 parts by mass, and (A), (F), () prepared in steps (2), (3) Component G): 60 parts by mass was blended and sufficiently stirred and mixed in a nitrogen atmosphere while maintaining at 28 ° C. or less by water cooling using a dispersion stirrer.

(5) Mixture of components (A) to (D), (F), (G) prepared in step (4) for viscosity adjustment: 100 parts by mass as a solvent (D-3) : 5 parts by mass was added and mixed with stirring to obtain a resin composition. The viscosity of this resin composition was 60 mPa's.

[0067] [Example 7]

(1) The amount of each component used in Example 6 was prepared in steps (4), (B), (C), and (D) in step (4): 45 parts by mass, and in steps (2) and (3) Components (A), (F), (G): 55 parts by weight were mixed, and the mixture was sufficiently stirred and mixed in a nitrogen atmosphere while maintaining at 28 ° C or lower by water cooling using a dispersion stirrer. Operation was performed to obtain a resin composition. The viscosity of this resin composition was 50 mPa's.

[Example 8] (1) Prepare the amount of each component used in Example 6 in step (1) as (A) component (A-7): 8.3 parts by mass and (E) component (El): 86.2 parts by mass in step (1) did. Mixture of components (B), (C) and (D) prepared in step (4): 40 parts by mass, and components (E), (F) and (G) prepared in steps (2) and (3) : 60 parts by mass was mixed and sufficiently stirred and mixed in a nitrogen atmosphere while maintaining at 28 ° C or lower by water cooling using a dispersion stirrer.

In order to adjust the viscosity, the mixture of components (B) to (D) and (E) to (G) prepared in step (4): 100 parts by mass, further as solvent (D-3): 5 parts by mass The mixture was stirred and mixed to obtain a resin composition. The viscosity of this resin composition was 55 mPa's.

[0069] [Example 9]

(1) Under room temperature and nitrogen atmosphere, (B-1): 71 parts by mass, (B-4): 18 parts by mass, (B-5): 2 parts by mass as the curable silicone resin of component (B) And (D_l): 8 parts by mass as a curing catalyst were added and mixed with stirring. To this mixture of components (B) and (D), (C-2): 1 part by mass as lithium hydroxide of component (C) was further added and stirred and mixed again.

(2) (A-1): 100 parts by mass were prepared as the component (A).

(4) In order to adjust the viscosity, the mixture of components (A) to (D) prepared in step (3): 100 parts by mass and (D-3): 4 parts by mass as a solvent and stirring Mixing was performed to obtain a resin composition. The viscosity of this resin composition was 50 mPa's.

[0070] [Example 10]

(1) A resin composition was obtained in the same manner as in Example 9 except that the amount of each component used in Example 9 was prepared in step (2) except that (A) component (A_5): 100 parts by mass was prepared. The viscosity of this resin composition was 50 mPa's.

[0071] [Example 11]

(1) The amount of each component used in Example 9 was determined in the step (1) as (B) component curable silicone resin (B-4): 18 parts by mass, (B-3): 78 masses. Part, (B-5): 2 parts by mass The mixture was stirred and the same adjustment was performed except that (D-2): 2 parts by mass was added and mixed as a curing catalyst to obtain a resin composition. The viscosity of this resin composition was 70 mPa's.

[Example 12]

In step (1), the amount of each component used in Example 9 was determined as (B-1): 49 parts by mass, (B-4): 30 parts by mass, as the curable silicone resin of component (B). (B-5): 12 parts by mass was stirred and mixed, and the same adjustment was performed except that (D-1): 8 parts by mass was added and mixed as a curing catalyst to obtain a resin composition. The viscosity of this resin composition was 90 mPa's.

[0073] [Example 13]

The amount of each component used in Example 1 was adjusted in the same manner as in step (2) except that (A-6): 100 parts by mass was prepared as component (A) to obtain a resin composition. The viscosity of this resin composition was 80 mPa's.

[0074] [Example 14]

(1) Under room temperature and nitrogen atmosphere, (B-1): 71 parts by mass, (B-4): 18 parts by mass, (B-5): 2 parts by mass as the curable silicone resin of component (B) And (D-1): 8 parts by mass as a curing catalyst were added and mixed with stirring. To this mixture of components (B) and (D), (C-2): 1 part by mass as lithium hydroxide of component (C) was further added and stirred and mixed again.

(2) As component (A), (A-7): 94.5 mass parts were prepared.

(5) Mixture of components (A) to (D), (F), (G) prepared in step (4) for viscosity adjustment: 100 parts by mass as a solvent (D-3) : 5 parts by mass was added and mixed with stirring to obtain a resin composition. The viscosity of this resin composition was 90 mPa's.

[0075] [Example 15]

(1) The amount of each component used in Example 14 is the same as that in step (4) in (B), (C), and (D) components. Mixture of 45 parts by mass and (A), (F), and (G) components prepared in steps (2) and (3): 55 parts by mass, and water cooling using a dispersion stirrer to 28 ° C or less While maintaining the above, the same operation was performed except that the mixture was sufficiently stirred and mixed under a nitrogen atmosphere to obtain a resin composition. The viscosity of this resin composition was 60 mPa's.

[Example 16]

(1) The amount of each component used in Example 14 was determined in step (2) as (A) component (A-7): 89.5 parts by mass and (E) component (E-1): 5 A mass part was prepared. Mixture of components (B), (C) and (D) prepared in step (4): 40 parts by mass, and (E), (F) and (G) prepared in steps (2) and (3) Ingredients: 60 parts by mass were blended, and the mixture was thoroughly stirred and mixed in a nitrogen atmosphere while maintaining a temperature of 28 ° C. or less by water cooling using a dispersion stirrer.

Mixture of components (B) to (D) and (E) to (G) prepared in step (4) for viscosity adjustment: 100 parts by mass, and further as solvent (D-3): 5 parts by mass The mixture was stirred and mixed to obtain a resin composition. The viscosity of this resin composition was 90 mPa's.

[0077] [Comparative Example 1]

In the step (1), the amount of each component used in Example 1 was stirred and mixed in (B-1): 72 parts by mass, (B2): 18 parts by mass, (B-5): 2 parts by mass, Further, 8 parts by mass of (D 1) as a curing catalyst was added and mixed and stirred. At this time, the component (C) was not used, and the same adjustment was carried out except for that to obtain a resin composition. The viscosity of this resin composition was 60 mPa's.

[0078] [Comparative Example 2]

A galvanized steel sheet was prepared. This zinc-plated steel sheet is obtained by immersing a test piece of the same size as the test piece prepared in the example to have a coating thickness of 60 μm.

[0079] [Comparative Example 3]

Organic Gintari Paint was prepared. An acrylic resin product with a zinc content of 98% by mass was used.

[0080] [Comparative Example 4]

An inorganic Zintari paint was prepared. An acrylic silicate resin product with a zinc content of 98% by mass was used.

[0081] [Comparative Example 5] (1) Under room temperature and nitrogen atmosphere, (B-1): 59 parts by mass, (B-2): 18 parts by mass, (B-5): 2 parts by mass as the curable silicone resin of component (B) And (D-1): 8 parts by mass as a curing catalyst were added and mixed with stirring. To this mixture of components (B) and (D), (C-1): 12 parts by mass as a metal alkoxide of component (C) was further added and mixed again with stirring.

(2) As component (E), (E-4): 94.5 parts by mass were prepared.

(3) As component (F), (F-1): 5.5 parts by mass were prepared.

(4) Mixture of components (B), (C), (D) prepared in step (1): 40 parts by mass and components (E), (F) prepared in steps (2), (3): 60 parts by mass was blended, and the mixture was sufficiently stirred and mixed in a nitrogen atmosphere while maintaining a temperature of 28 ° C. or lower by water cooling using a dispersion stirrer.

(5) Mixture of components (B) to (D), (E), and (F) prepared in step (3) for viscosity adjustment: 100 parts by mass as a solvent (D-3): 5 parts by mass was added and mixed with stirring to obtain a resin composition. The viscosity of this resin composition was 60 mPa's.

[0082] [Comparative Example 6]

In Step (2), the amount of each component used in Comparative Example 1 is (E-1): 94 parts by mass, (F

—1): 5 parts by mass, (H-1): Except that 1 part by mass was prepared, the same adjustment was performed to obtain a resin composition. The viscosity of this resin composition was 55 mPa's.

[0083] [Comparative Example 7]

(1) At room temperature under a nitrogen atmosphere, (B-1): 71 parts by mass, (B-2): 18 parts by mass, (B-5): 2 parts by mass as the curable silicone resin of component (B) And (D-1): 8 parts by mass as a curing catalyst were added and mixed with stirring. To this mixture of components (B) and (D), (C-2): 1 part by mass as lithium hydroxide of component (C) was further added and stirred and mixed again.

(2) As component (E), (E-4): 94.5 parts by mass were prepared.

(3) As component (F), (F-1): 5.5 parts by mass were prepared.

(4) Mixture of components (B), (C), (D) prepared in step (1): 40 parts by mass and components (E), (F) prepared in steps (2), (3): 60 parts by mass was blended, and the mixture was sufficiently stirred and mixed in a nitrogen atmosphere while maintaining a temperature of 28 ° C. or lower by water cooling using a dispersion stirrer. (5) Mixture of components (B) to (D), (E), and (F) prepared in step (3) for viscosity adjustment: 100 parts by mass as a solvent (D-3): 5 parts by mass was added and mixed with stirring to obtain a resin composition. The viscosity of this resin composition was 60 mPa's.

[0084] Each of the above resin compositions was evaluated for antifungal properties and electromagnetic wave shielding properties by the following methods. In addition, an antifungal test is performed about Example:!-5, 9-: 13, comparative example:!-4, and electromagnetic shielding property is Example 6-8, 14-: 16, comparative example 5-7. Went about.

[0085] [Preparation of anti-mold test piece and anti-mold test method]

Steel plate (Material: SPCC, 1. Omm X 70mm XI 50mm) is surface-treated with sandblast (fine: average surface roughness Rzl 5 xm), degreased and washed with 2_propanol, and dried with air play gun Each resin composition was applied so as to have a coating thickness of 60 μm, and allowed to stand for 7 days in an atmosphere at a temperature of 25 ° C. and a humidity of 55% to obtain a cured film, which was used as a test piece.

[0086] A cast test for accelerated durability test, which is a kind of galvanizing test for each of the above test pieces. CFIS

The antifungal property was evaluated by observing the presence or absence of wrinkles visually by conducting an antifungal test in accordance with H8520) (test temperature: 50 ± 2 ° C, 360 hours).

[0087] [Measurement of electromagnetic shielding properties]

The electromagnetic shielding properties were measured by Advantest (near electromagnetic field). At this time, remove the dust and dirt from the surface of the plywood (5mm x 200mm x 200mm) and apply the resin composition so that the coating thickness is 80 μm when dried with an air spray gun. The sample was left to stand for 7 days in an atmosphere of temperature: 25 ° C and humidity: 55% to form a cured film, which was used as a test piece.

[0088] The amount of each component in each resin composition (expressed in mass%), the electrical resistance value, and the viscosity at 25 ° C are shown in Tables 1 and 2 below. In addition, the results of the antifungal test for each resin composition are shown in Table 3 and Table 4 below together with the curability of the resin composition. Table 5 shows the electromagnetic shielding properties of each resin composition. Of the measured electromagnetic shielding properties, the electrical resistance is low, and the electromagnetic shielding properties when using the resin composition of Example 8 are shown in Fig. 1 (electric field) and Fig. 2 (magnetic field).

[0089] [Table 1]

25 ° C curable film thickness (m)

360th hour: Group dots in several places

1 o 60

Recognize white and red foxes.

360th hour: Group dots in several places

2 o 60

Recognize white and red foxes.

Intermittent: Group dots in several places Example 3 o 360 o'clock

60

Recognize white and red foxes.

360th hour: Group dots in several places

4 〇 60

Recognize white and red foxes.

360th hour: Red sharks appear on the entire surface

5 o 60

Make a raw | £.

25 ° C Curability Film thickness (〃m) Test result

360 hours: several places

Recognize white and red foxes.

1 0 360 hours: Several dots

o 60

Recognize white and red foxes.

360

1 1st hour: Group dots in several places Example 0 60

Recognize white and red foxes.

360th hour: Group dots in several places

1 2 o 60

Recognize white and red foxes.

360th hour: Red sharks appear on the entire surface

1 3 o 60

Life.

144th hour: Hakuho on almost the whole surface

1 o 60 Spotted pits are observed in several places.

Eye: almost white

2-72 hours

60

And the occurrence of red coral. Comparative example

48th hour: Almost all of red coral

3 o 60

Acknowledge the occurrence.

48th hour: Almost all of red coral

4 0 60

Acknowledge the occurrence. [0093] [Table 5]

[0094] From these results, it can be considered as follows. First, the examples satisfying the requirements specified in the present invention:! To 5 and 9 to 13 show that excellent antifungal properties are exhibited. It can also be seen that Examples 6 to 8 and 14 to 16 exhibit good electromagnetic shielding properties. The results in Figs. 1 and 2 were measured in the frequency band of 0 Hz to lGHz for Example 8 with low electrical resistance, but the shielding effect became higher as the frequency band became higher. It can be seen that the electric field is _60dB or more (frequency band of marker 500MHz).

Industrial applicability

[0095] In the present invention, (a) Zn and / or A1 formed on a scale-foil fine powder, and (b) formed on a scale-foil fine powder. Cu and / or Ni, at least The clad scale fine powder of dissimilar metal, which contains any force, can be easily applied by blending with the resin, and it has conductivity and / or a small amount of metal powder. In addition, a resin composition that has excellent anti-corrosion (corrosion-prevention) properties equivalent to or better than zinc plating and that also exhibits excellent shielding properties to block electromagnetic waves has been realized.

Claims

The scope of the claims

[1] A dissimilar metal comprising at least one of (a) Zn and / or A1 formed on a scale-like fine powder and (b) Cu and / or Ni formed on a scale-like fine powder A resin composition having excellent antifungal properties and / or electrical conductivity, wherein the clad scale fine powder is blended with a resin.

[2] The resin composition according to claim 1, further comprising a powder or alloy powder of one or more elements selected from the group force consisting of Mn, Mg, Mo, Li, C and Ag.

[3] The resin is represented by the general formula: R ¹ Si (OR ² ) (wherein R ¹ is a hydrocarbon group having 1 to 10 carbon atoms.

N 4-N

R ² is an alkyl group having 1 to 3 carbon atoms, an acyl group having 2 to 3 carbon atoms or an alkoxyacyl group having 3 to 5 carbon atoms, and N is an integer of 0 to 2). 3. The resin composition according to claim 1, wherein the resin composition is a curable silicone resin comprising a silane compound or a partially hydrolyzed condensate thereof.

[4] The resin composition according to any one of claims 1 to 3, further comprising a metal alkoxide (excluding Si alkoxide).

[5] The resin composition according to any one of claims 1 to 3, further comprising lithium hydroxide.

[6] A resin composition-coated member excellent in antifungal properties, Z or conductivity, which is obtained by coating the surface of the substrate with the resin composition according to any one of claims 1 to 5.