WO2006064200A1 - Article moule - Google Patents

Article moule Download PDF

Info

Publication number
WO2006064200A1
WO2006064200A1 PCT/GB2005/004778 GB2005004778W WO2006064200A1 WO 2006064200 A1 WO2006064200 A1 WO 2006064200A1 GB 2005004778 W GB2005004778 W GB 2005004778W WO 2006064200 A1 WO2006064200 A1 WO 2006064200A1
Authority
WO
WIPO (PCT)
Prior art keywords
article
layer
electronic device
moulded article
layers
Prior art date
Application number
PCT/GB2005/004778
Other languages
English (en)
Inventor
Paul Bagnall
Original Assignee
Brite Ip Limited
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Brite Ip Limited filed Critical Brite Ip Limited
Priority to EP05818654A priority Critical patent/EP1834289A1/fr
Publication of WO2006064200A1 publication Critical patent/WO2006064200A1/fr

Links

Classifications

    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/0772—Physical layout of the record carrier
    • G06K19/07728—Physical layout of the record carrier the record carrier comprising means for protection against impact or bending, e.g. protective shells or stress-absorbing layers around the integrated circuit
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card

Definitions

  • the present invention relates to an injection moulded article which incorporates an electronic device.
  • the article is planar and the electronic device is a data storage device.
  • Planar moulded articles incorporating electronic devices are known in various forms such as, for example, bank cards, identity cards and RFID tags for goods.
  • the electronic device may be susceptible to damage with the result that the electronic device ceases to function. Damage may, for example, occur due to use of the article within which it is incorporated or by the accidental impingement of a sharp object.
  • a moulded article incorporating an ' electronic device, the article comprising a planar core of plastics material having outer layer of material integrated on opposing sides thereof, wherein at least one of said outer layers includes a shield member positioned so as to protect the electronic device.
  • the shield member is positioned so as to overlie the electronic device and protect the electronic device from damage from sharp objects which may come into contact with the article.
  • the electronic device may be fully encapsulated by the core.
  • the electronic device may be provided against the inner surface one of the outer layers, where the term "inner" reflects the side of the layer which faces the core. In such an embodiment it will be appreciated that the electronic device is not fully encapsulated by the core but has a side which faces and contacts the core material.
  • the shield member may be provided on the inner side of the outer layer, which is to say the side of the layer which faces the core of the article.
  • the shield member may be provided on the outer surface of the outer layer.
  • the shield member may be of uniform thickness and be comprised of a metal such as, for example, stainless steel.
  • the shield member may be comprised of a toughened plastics material or a composite material.
  • the shield may have a thickness of between 50 to 100 microns.
  • the shield is attached to the outer layer prior to the layer being integrated with the core.
  • the outer layers are preferably integrated to the core in a non-adhesive manner which is to say that they are integrated with the core without the use of adhesive.
  • the layers may be integrated with, or non-adhesively bonded to, the cores during a moulding operation to form the article.
  • Both outer layers may be provided with a shield member of the type described.
  • the electronic device may be attached to one of the outer layers prior to the integration of said layer with the core.
  • the electronic device and shield may be attached to the same layer.
  • the electronic device and shield may be attached to opposite sides of the same layer.
  • the electronic device and shield may be attached to the same side of the layer.
  • the device may be attached to an intermediate layer which is incorporated into the core between the outer layers.
  • the intermediate layer may comprise a thin sheet of paper, card, fabric or plastics material such as, for example, polypropylene.
  • the intermediate layer may be of a laminar construction comprising a plurality of layers selected from the aforementioned materials.
  • the electronic device may comprise a chip module having a base and a body.
  • the base may comprise a substantially planar member.
  • the body may comprise a plastics material within which there is embedded a chip.
  • the electronic device is preferably provided with an antenna means in communication therewith.
  • the antenna means may be formed by a layer of conductive material applied to the layer to which the electronic device is attached.
  • the conductive material may comprise a conductive ink.
  • the outer layers may each comprise a thin sheet of paper, card, fabric or plastics material such as, for example, polypropylene.
  • Each outer layer may be of a laminar construction comprising a plurality of layers selected from the aforementioned materials.
  • a method of manufacturing a moulded article of the type described with reference to the first aspect comprising the steps of: providing first and second flexible layers of material having an electronic device and a shield attached thereto, providing a mould having a mould cavity, placing said layers against opposing faces of the cavity, closing the mould; and injecting plastics material between the layers to form the article.
  • the plastics material is preferably injected between the flexible layers through one of the layers.
  • the electronic device and shield may be provided on the same flexible layer or on separate layers.
  • the method may include the additional steps of: providing a further mould having a mould cavity, providing a further flexible layer; placing said further layer and article against opposing faces of the cavity, closing the mould, and injecting the plastics material between the layer and the article to form a further article.
  • the further layer may be provided with a shield.
  • the plastics material is preferably injected between the further flexible layer and article through the further flexible layer.
  • the step of placing the article in the further mould preferably includes the step of placing the article such that the layer thereof having the electronic device attached thereto is innermost. This is to say that the layer of the article having the electronic device attached thereto does not rest against a face of the further mould cavity.
  • the method may include the further steps of trimming, cutting or otherwise processing the article to a desired size and shape.
  • a moulded article incorporating an electronic device, the article comprising a planar core of plastics material having outer layer of material integrated on opposing sides thereof, wherein the electronic device is fully encapsulated within the core and is spaced from the outer layers.
  • the electronic device is preferably carried by an intermediate layer which is fully encapsulated by the core.
  • the intermediate layer and outer layers may comprise a thin sheet of paper, card, fabric or plastics material such as, for example, polypropylene.
  • Each layer may be of a laminar construction comprising a plurality of layers selected from the aforementioned materials.
  • the electronic device may comprise a chip module having a base and a body.
  • the base may comprise a substantially planar member.
  • the body may comprise a plastics material within which there is embedded a chip.
  • the electronic device is preferably provided with an antenna means in communication therewith.
  • the antenna means may be formed by a layer of conductive material applied to the layer to which the electronic device is attached.
  • the conductive material may comprise a conductive ink.
  • the outer layers may each comprise a thin sheet of paper, card, fabric or plastics material such as, for example, polypropylene.
  • Each outer layer may be of a laminar construction comprising a plurality of layers selected from the aforementioned materials.
  • a method of manufacturing a moulded article of the type described with reference to the third aspect comprising the steps of: providing first and second flexible layers, one of said layers having an electronic device attached thereto, providing a mould having a mould cavity, placing said layers against opposing faces of the cavity, closing the mould; and injecting plastics material between the layers to form an intermediate article, providing a further mould having a mould cavity, providing a further flexible layer; placing said further layer and intermediate article against opposing faces of the cavity, closing the mould, and injecting the plastics material between the layer and the intermediate article to form a further article.
  • the plastics material is preferably injected between the layers, and the further layer and intermediate article through one of the layers.
  • the step of placing the intermediate article in the further mould preferably includes the step of placing the intermediate article such that the layer thereof having the electronic device attached thereto is innermost. This is to say that the layer of the article having the electronic device attached thereto does not rest against a face of the further mould cavity.
  • the method may include the further steps of trimming, cutting or otherwise processing the further article to a desired size and shape.
  • Figure 1 shows a cross-sectional view of a part of a moulded article according to a first embodiment of the present invention
  • Figure 2 shows an enlarged cross-sectional view of the part of the article of figure 1 ;
  • Figure 3 shows a cross-sectional view of a part of a moulded article according to a second embodiment of the present invention;
  • Figure 4 shows an enlarged cross-sectional view of the part of the article of figure 3
  • Figure 5 shows a cross-sectional view of a part of a moulded article according to a third embodiment of the present invention
  • Figure 6 shows an enlarged cross-sectional view of the part of the article of figure 5
  • Figure 7 shows an enlarged cross-sectional view of a part of a moulded article according to a further embodiment of the present invention
  • Figure 8 shows a cross-sectional view of a part of a moulded article according to another embodiment of the present invention.
  • Figure 9 shows a perspective view of an article according to the present invention in the form of a card.
  • FIG. 10 there is shown a cross-sectional view of planar moulded article generally designated 10.
  • the article 10 includes a planar core 12 of plastics material having attached on opposing surfaces a flexible layer 14, 16.
  • the article 10 may be considered to have an upper flexible layer 14 and a lower flexible layer 16.
  • the terms "upper” and “lower” are construed with reference to the orientation of the article 10 shown in the figures and are used for the sake of simplicity in describing the respective layers 14,16.
  • each layer 14,16 includes an exterior print layer 18 and an outer protective layer 20 to prevent the print layer 18 becoming scratched or scuffed.
  • the article 10 may take the form of a substantially rectangular shaped card of the type used for banking and credit cards.
  • the article 10 may take other forms and configurations and be used for purposes other than banking and credit cards.
  • the article 10 may form a part, such as a cover, insert or page, of an identity document such as a passport.
  • the core 12 comprises an injectable thermoplastics material such as, for example, polypropylene.
  • the flexible layers 14,16 may each comprise a thin sheet of paper, card, fabric or plastics material such as, for example, polypropylene.
  • Each layer 14,16 may be of a laminar construction comprising layers selected from the aforementioned materials.
  • the article 10 further includes a chip module 22 and antenna 24 associated with the upper layer 14 and a protective shield 26 associated with the lower layer 16.
  • the chip module 22 and antenna 24 may, in combination function as an RFID device.
  • the chip module 22 comprises a metallic base 28 upon which is mounted a body 30 containing the chip.
  • the body 30 typically comprises a plastics material within which the chip is embedded.
  • the antenna 24 may typically be defined by an appropriately configured and shaped layer of electrically conductive ink applied to the flexible layer 14 by any appropriate method such as, for example, a printing operation.
  • the antenna 24 may be defined by an appropriately configured and shaped layer of electrically conductive foil applied to the flexible layer 14 by any appropriate method such as, for example, adhesive.
  • the chip module 22 is attached to the flexible layer 14 by any appropriate method such as, for example, the use of adhesive or a welding operation.
  • the chip module 22 and antenna 24 is provided on the inner surface of the of the upper layer 14, which is to say the surface of the upper layer 14 which faces the core 12.
  • the protective shield 26 is provided on the inner surface of the lower layer 16.
  • the shield 26 may comprise a thin layer of metal such as, for example, stainless steel having a thickness of between approximately 50 microns to approximately 100 microns.
  • the shield 26 may also be comprised of a non-metallic material such as, for example a toughened plastics material.
  • the shield 26 is attached to the flexible layer 16 by any appropriate method such as, for example, the use of adhesive or a welding operation. In instances where the flexible layer 16 is of a laminated construction, the shield 26 may be provided between layers of the laminate. In an alternative embodiment the shield may be provided on the outside of the flexible layer 16.
  • the chip module 22 is afforded a degree of protection in instances where the upper layer 14 is pierced by a sharp object by the presence of the metallic base 28 of the chip module.
  • the shield 26 is sized and shaped so as to be larger than or equal to the size and shape of the chip module 22. In the embodiment shown, the shield 26 has a smaller area than the layer 16 to which it is attached.
  • An example of the relative sizes of the layers 14,16, chip module 22 and shield 26 can be seen in figure 9.
  • the article 10 is formed by the placing of the layers 14,16 in an appropriately configured mould and the subsequent injection of a thermoplastics material therebetween.
  • the chip module 22, antenna 24 and shield 26 are attached to the layers 14,16 prior to their placement in the mould.
  • the mould includes a cavity corresponding substantially to the shape of the article.
  • the layers 14,16 are placed against opposing faces of the mould such that the chip module 22 of the upper layer 14 is aligned with the shield 26 of the lower layer 16 and the plastics material injected therebetween to form the core 12.
  • the plastics material is injected into the space within the mould between the layers 14,16 through one of the layers 14,16.
  • the or each layer 14,16 may be retained against a respective face of the mould cavity prior to injection of the plastics material therebetween.
  • each of the layers 14,16 may be provided with a plurality of chip modules 22 and a corresponding plurality of shields 26.
  • the article 10 removed from the mould may by cut into a plurality of sub-articles each having a at least one chip module 22 and shield 26 pair.
  • the layers 14,16 may be retained by various means such as, for example, projections of the mould cavity face, a vacuum system of the mould, and electrostatic attraction between the mould face and the layers 14,16.
  • the plastics material forming the core 12 may retain a degree of compressibility after the moulding operation so as to absorb and dissipate any impact forces subsequently experienced by the article 10.
  • FIG. 3 and 4 there is shown an alternative embodiment of an article, generally designated 32.
  • the article 32 differs from the embodiment of figures 1 and 2 in that it incorporates an additional shield 34.
  • the additional shield 34 is provided the outer surface of the upper layer 14.
  • the additional shield 34 may comprise either a metallic or non-metallic member which is applied to the layer 14 prior to the insertion of the layer 14 into a mould for the subsequent moulding of the article 32.
  • the additional shield 34 may be provided on the inner surface of the upper layer 14 or between the antenna 24 and chip module 22. It will be appreciated that in such an embodiment the additional shield 34 will need to be formed and positioned in such a way so as not to interfere with the operation of the chip module 22 and antenna 24.
  • the article 36 includes a chip module 22 and antenna which is fully incorporated within the core 12 with portions of the core 12a, 12b being provided on opposing sides thereof.
  • the module 22 and antenna 24 are provided in a carrier layer 38 which is encapsulated by the core 12.
  • An additional shield 40 is provided on the inner surface of the upper layer 14.
  • the article 36 is manufactured in a two stage procedure. First of all the lower layer 16 and the carrier layer 38 bearing the chip module 22 and antenna 24 are placed on opposing sides of an appropriately configured mould and a plastics material injected therebetween as described above to form an intermediate article. It will be understood that the plastics material injected at this stage forms a first portion 12a of the core 12 of the finished article 36. The intermediate article and the upper layer 14 are subsequently placed on opposing sides of a further mould and plastics material injected therebetween to form the article 36. In the second stage of the procedure thus described the plastics material forming the second core portion 12b is advantageously injected through the upper layer 16.
  • the embodiment of the article 36 shown in figures 5 and 6 is provided with upper and lower shields 26,40 provided on the inner sides of the layers 14,16 with respect to the core 12.
  • the shields 26,40 may be provided on the outer sides of the layers 14,16.
  • the article 36 may be alternatively configured such that a single shield is provided on one of the layers 14,16, on either the inside or outside of the layer 14,16.
  • FIG. 7 shows a cross-sectional view of a planar mounded article generally designated 42.
  • the article 42 differs in that a protective shield 44 is provided between the chip module 22 and the antenna 24.
  • the shield 44 comprises a planar member comprised of a plastics or metal material which is connected to the base 28 of the chip module 22 so as to be positioned between chip module base 28 and the antenna In the embodiment shown the shield 44 is shorter than the base 28 but longer than the chip module body 30.
  • the base 28 is connected to the antenna 24 around the edge of the shield 44.
  • the shield 44 may have a length that is equal to or greater than that of chip module base 28.
  • the shield 44 may be provided with means to connect the base 28 to the antenna 24 through the body of the shield 44. Such means may comprise one or more electrically conductive paths which extend through the shield 44.
  • Figure 8 shows a cross-sectional view of a planar mounded article generally designated 46.
  • the article 46 includes a chip module 22 and antenna 24 which is fully incorporated within the core 12 with portions of the core 12a, 12b being provided on opposing sides thereof.
  • the module 22 and antenna 24 are provided in a carrier layer 38 which is encapsulated by the core 12.
  • the article 46 is provided without shield members.
  • the article 46 is manufactured in a two stage procedure. First of all the lower layer 16 and the carrier layer 38 bearing the chip module 22 and antenna 24 are placed on opposing sides of an appropriately configured mould and a plastics material injected therebetween to form an intermediate article. It will be understood that the plastics material injected at this stage forms a first portion 12a of the core 12 of the finished article 46. The intermediate article and the upper layer 14 are subsequently placed on opposing sides of a further mould and plastics material injected therebetween to form the article 46.

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Details Of Aerials (AREA)

Abstract

L'invention se rapporte à un article moulé (10) qui incorpore un dispositif électronique (22) et comprend un cœur plan (12) de matière plastique comportant une couche extérieure de matière (14, 16) intégrée sur les côtés opposés de celui-ci, où au moins l'une desdites couches extérieures (14, 16) comprend un élément de blindage (26) positionné de façon à protéger le dispositif électronique (22).
PCT/GB2005/004778 2004-12-13 2005-12-13 Article moule WO2006064200A1 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
EP05818654A EP1834289A1 (fr) 2004-12-13 2005-12-13 Article moule

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
GB0427234A GB0427234D0 (en) 2004-12-13 2004-12-13 Moulded article
GB0427234.0 2004-12-13

Publications (1)

Publication Number Publication Date
WO2006064200A1 true WO2006064200A1 (fr) 2006-06-22

Family

ID=34073611

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/GB2005/004778 WO2006064200A1 (fr) 2004-12-13 2005-12-13 Article moule

Country Status (3)

Country Link
EP (1) EP1834289A1 (fr)
GB (1) GB0427234D0 (fr)
WO (1) WO2006064200A1 (fr)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2410471A1 (fr) * 2010-07-20 2012-01-25 Oberthur Technologies Etiquette électronique sans contact
US9037080B2 (en) 2009-11-16 2015-05-19 Oberthur Technologies Contactless electronic device, process for manufacturing the device and contactless electronic tag

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4931623A (en) * 1987-11-14 1990-06-05 Kabushiki Kaisha Toshiba Portable storage medium
EP1120824A2 (fr) * 2000-01-27 2001-08-01 LINTEC Corporation Procédé de production d'une puce de circuit intégré ayant une couche de protection
US20020021494A1 (en) 2000-08-18 2002-02-21 Delta Electronics, Inc. Optical device
US20030214794A1 (en) * 2002-05-10 2003-11-20 Hideki Takahashi IC card

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4931623A (en) * 1987-11-14 1990-06-05 Kabushiki Kaisha Toshiba Portable storage medium
EP1120824A2 (fr) * 2000-01-27 2001-08-01 LINTEC Corporation Procédé de production d'une puce de circuit intégré ayant une couche de protection
US20020021494A1 (en) 2000-08-18 2002-02-21 Delta Electronics, Inc. Optical device
US20030214794A1 (en) * 2002-05-10 2003-11-20 Hideki Takahashi IC card

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9037080B2 (en) 2009-11-16 2015-05-19 Oberthur Technologies Contactless electronic device, process for manufacturing the device and contactless electronic tag
EP2410471A1 (fr) * 2010-07-20 2012-01-25 Oberthur Technologies Etiquette électronique sans contact
FR2963141A1 (fr) * 2010-07-20 2012-01-27 Oberthur Technologies Etiquette electronique sans contact
CN102339409A (zh) * 2010-07-20 2012-02-01 欧贝特科技公司 非接触式电子标签
KR20120010157A (ko) * 2010-07-20 2012-02-02 오베르뛰르 테크놀로지스 비접촉식 전자 태그
US8439273B2 (en) 2010-07-20 2013-05-14 Oberthur Technologies Contactless electronic tag
AU2011204786B2 (en) * 2010-07-20 2015-01-29 Idemia France Contactless electronic tag
CN102339409B (zh) * 2010-07-20 2016-07-27 欧贝特科技公司 非接触式电子标签
KR101858252B1 (ko) 2010-07-20 2018-06-28 아이데미아 프랑스 비접촉식 전자 태그

Also Published As

Publication number Publication date
EP1834289A1 (fr) 2007-09-19
GB0427234D0 (en) 2005-01-12

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