WO2006061081A3 - Depot electrochimique de tantale et/ou de cuivre dans des liquides ioniques - Google Patents

Depot electrochimique de tantale et/ou de cuivre dans des liquides ioniques Download PDF

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Publication number
WO2006061081A3
WO2006061081A3 PCT/EP2005/012180 EP2005012180W WO2006061081A3 WO 2006061081 A3 WO2006061081 A3 WO 2006061081A3 EP 2005012180 W EP2005012180 W EP 2005012180W WO 2006061081 A3 WO2006061081 A3 WO 2006061081A3
Authority
WO
WIPO (PCT)
Prior art keywords
tantalum
copper
electrochemical deposition
hydroxyalkyl
ionic liquids
Prior art date
Application number
PCT/EP2005/012180
Other languages
German (de)
English (en)
Other versions
WO2006061081A2 (fr
Inventor
Urs Welz-Biermann
Frank Endres
El Abedin Sherif Zein
Original Assignee
Merck Patent Gmbh
Urs Welz-Biermann
Frank Endres
El Abedin Sherif Zein
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Merck Patent Gmbh, Urs Welz-Biermann, Frank Endres, El Abedin Sherif Zein filed Critical Merck Patent Gmbh
Priority to EP05813986A priority Critical patent/EP1831433A2/fr
Priority to US11/721,277 priority patent/US20090242414A1/en
Priority to CA002590080A priority patent/CA2590080A1/fr
Priority to JP2007544757A priority patent/JP2008523242A/ja
Publication of WO2006061081A2 publication Critical patent/WO2006061081A2/fr
Publication of WO2006061081A3 publication Critical patent/WO2006061081A3/fr

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/54—Electroplating: Baths therefor from solutions of metals not provided for in groups C25D3/04 - C25D3/50
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/38—Electroplating: Baths therefor from solutions of copper
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/66—Electroplating: Baths therefor from melts
    • C25D3/665—Electroplating: Baths therefor from melts from ionic liquids
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/10—Electroplating with more than one layer of the same or of different metals
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/60—Electroplating characterised by the structure or texture of the layers
    • C25D5/615—Microstructure of the layers, e.g. mixed structure
    • C25D5/617—Crystalline layers
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/12—Semiconductors

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Cell Electrode Carriers And Collectors (AREA)
  • Secondary Cells (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
  • Electric Double-Layer Capacitors Or The Like (AREA)

Abstract

L'invention concerne un procédé de dépôt électrochimique de tantale et/ou de cuivre sur un substrat dans un liquide ionique contenant au moins un cation tétraalkylammonium, tétraalkylphosphonium, 1,1-dialkylpyrrolidinium, 1-hydroxyalkyl-1-alkylpyrrolidinium, 1-hydroxyalkyl-3-alkylimidazolium ou bis(1-hydroxyalkyl)imidazolium, les groupes alkyle ou la chaîne alkylène dans le groupe 1-hydroxyalkyle pouvant présenter chacun indépendamment 1 à 10 atomes de carbone.
PCT/EP2005/012180 2004-12-10 2005-11-15 Depot electrochimique de tantale et/ou de cuivre dans des liquides ioniques WO2006061081A2 (fr)

Priority Applications (4)

Application Number Priority Date Filing Date Title
EP05813986A EP1831433A2 (fr) 2004-12-10 2005-11-15 Depot electrochimique de tantale et/ou de cuivre dans des liquides ioniques
US11/721,277 US20090242414A1 (en) 2004-12-10 2005-11-15 Electronchemical deposition of tantalum and/or copper in ionic liquids
CA002590080A CA2590080A1 (fr) 2004-12-10 2005-11-15 Depot electrochimique de tantale et/ou de cuivre dans des liquides ioniques
JP2007544757A JP2008523242A (ja) 2004-12-10 2005-11-15 イオン性液体中でのタンタルおよび／または銅の電気化学的沈着

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102004059520A DE102004059520A1 (de) 2004-12-10 2004-12-10 Elektrochemische Abscheidung von Tantal und/oder Kupfer in ionischen Flüssigkeiten
DE102004059520.8 2004-12-10

Publications (2)

Publication Number Publication Date
WO2006061081A2 WO2006061081A2 (fr) 2006-06-15
WO2006061081A3 true WO2006061081A3 (fr) 2007-08-02

Family

ID=35976745

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/EP2005/012180 WO2006061081A2 (fr) 2004-12-10 2005-11-15 Depot electrochimique de tantale et/ou de cuivre dans des liquides ioniques

Country Status (10)

Country Link
US (1) US20090242414A1 (fr)
EP (1) EP1831433A2 (fr)
JP (1) JP2008523242A (fr)
KR (1) KR20070085936A (fr)
CN (1) CN101076617A (fr)
CA (1) CA2590080A1 (fr)
DE (1) DE102004059520A1 (fr)
RU (1) RU2007125776A (fr)
TW (1) TW200626755A (fr)
WO (1) WO2006061081A2 (fr)

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EP1983079A1 (fr) * 2007-04-17 2008-10-22 Nederlandse Organisatie voor Toegepast-Natuuurwetenschappelijk Onderzoek TNO Couche barrière et son procédé de fabrication
US20100252446A1 (en) * 2007-08-02 2010-10-07 Akzo Nobel N.V. Method to Electrodeposit Metals Using Ionic Liquids in the Presence of an Additive
GB0715258D0 (en) * 2007-08-06 2007-09-12 Univ Leuven Kath Deposition from ionic liquids
EP2080972A1 (fr) * 2008-01-08 2009-07-22 L'AIR LIQUIDE, Société Anonyme pour l'Etude et l'Exploitation des Procédés Georges Claude Bruleur combiné et appareil lance pour four a arc électrique
CN102066304A (zh) 2008-06-17 2011-05-18 威斯康星校友研究基金会 木素纤维素生物质到燃料和化学品的化学转变方法
DE102008030988B4 (de) 2008-06-27 2010-04-01 Siemens Aktiengesellschaft Bauteil mit einer Schicht, in die CNT (Carbon Nanotubes) eingebaut sind und Verfahren zu dessen Herstellung
DE102008031003B4 (de) 2008-06-30 2010-04-15 Siemens Aktiengesellschaft Verfahren zum Erzeugen einer CNT enthaltenen Schicht aus einer ionischen Flüssigkeit
NZ597898A (en) * 2009-07-01 2014-11-28 Wisconsin Alumni Res Found Biomass hydrolysis
DE102009043594B4 (de) 2009-09-25 2013-05-16 Siemens Aktiengesellschaft Verfahren zum elektrochemischen Beschichten und Einbau von Partikeln in die Schicht
DE102009060937A1 (de) 2009-12-22 2011-06-30 Siemens Aktiengesellschaft, 80333 Verfahren zum elektrochemischen Beschichten
CN101828958B (zh) * 2010-05-19 2011-12-28 瞿东滨 高骨整合性的接骨钉
CN102912384B (zh) * 2012-10-31 2015-03-04 南京工业大学 一种由电沉积Cu-Al-Mg-Li合金制备多孔铜粉的方法
DE102013202254A1 (de) 2013-02-12 2014-08-14 Siemens Aktiengesellschaft Verfahren zur Herstellung von Hochenergiemagneten
US20140262800A1 (en) * 2013-03-12 2014-09-18 Taiwan Semiconductor Manufacturing Company, Ltd. Electroplating Chemical Leveler
CN105209666B (zh) * 2013-03-13 2017-11-10 流体公司 用于具有电沉积燃料的电化学电池的协同性添加剂
US10006141B2 (en) * 2013-06-20 2018-06-26 Baker Hughes, A Ge Company, Llc Method to produce metal matrix nanocomposite
WO2015157441A1 (fr) * 2014-04-09 2015-10-15 Nulwala Hunaid B Solvant liquide ionique pour procédé de placage électrolytique
CN104141151A (zh) * 2014-08-06 2014-11-12 哈尔滨工业大学 离子液体电沉积金属单质的方法
US10669635B2 (en) 2014-09-18 2020-06-02 Baker Hughes, A Ge Company, Llc Methods of coating substrates with composite coatings of diamond nanoparticles and metal
CA2959118A1 (fr) 2014-10-01 2016-04-07 Halliburton Energy Services, Inc. Liquides ioniques polymerisables destines a etre utilises dans des operations de formation souterraine
US9873827B2 (en) 2014-10-21 2018-01-23 Baker Hughes Incorporated Methods of recovering hydrocarbons using suspensions for enhanced hydrocarbon recovery
US10167392B2 (en) 2014-10-31 2019-01-01 Baker Hughes Incorporated Compositions of coated diamond nanoparticles, methods of forming coated diamond nanoparticles, and methods of forming coatings
JP6413751B2 (ja) * 2014-12-22 2018-10-31 日清紡ホールディングス株式会社 めっき液
US10155899B2 (en) 2015-06-19 2018-12-18 Baker Hughes Incorporated Methods of forming suspensions and methods for recovery of hydrocarbon material from subterranean formations
CN105463532A (zh) * 2015-12-29 2016-04-06 沈阳师范大学 一种新型的镀镍铁用电镀液
CN105780069A (zh) * 2015-12-29 2016-07-20 沈阳师范大学 氯化1-己基-3-甲基咪唑/氯化铁体系电镀液
US9834850B1 (en) 2016-08-08 2017-12-05 Seagate Technology Llc Method of forming one or more metal and/or metal alloy layers in processes for making transducers in sliders, and related sliders
US11424484B2 (en) 2019-01-24 2022-08-23 Octet Scientific, Inc. Zinc battery electrolyte additive
CN111826691B (zh) * 2020-08-21 2021-09-21 东北大学 一种溶剂化离子液体制备锌钽合金的方法

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US6552843B1 (en) * 2002-01-31 2003-04-22 Innovative Technology Licensing Llc Reversible electrodeposition device with ionic liquid electrolyte

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Patent Citations (5)

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US4624753A (en) * 1985-06-05 1986-11-25 Mcmanis Iii George E Method for electrodeposition of metals
WO2001013379A1 (fr) * 1999-08-18 2001-02-22 British Nuclear Fuels Plc Procede de separation de metaux
JP2001279486A (ja) * 2000-03-30 2001-10-10 Japan Science & Technology Corp タンタルのめっき法
US6936155B1 (en) * 2000-03-30 2005-08-30 Japan Science And Technology Agency Method for electroplating of tantalum
US6552843B1 (en) * 2002-01-31 2003-04-22 Innovative Technology Licensing Llc Reversible electrodeposition device with ionic liquid electrolyte

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FORSYTH S ET AL: "N-methyl-N-alkylpyrrolidinium tetrafluoroborate salts: ionic solvents and solid electrolytes", ELECTROCHIMICA ACTA, ELSEVIER SCIENCE PUBLISHERS, BARKING, GB, vol. 46, no. 10-11, 15 March 2001 (2001-03-15), pages 1753 - 1757, XP004231593, ISSN: 0013-4686 *
MURASE K ET AL: "Electrochemical behaviour of copper in trimethyl-n-hexylammonium bis((trifluoromethyl)sulfonyl)amide, an ammonium imide-type room temperature molten salt", JOURNAL OF APPLIED ELECTROCHEMISTRY, SPRINGER, DORDRECHT, NL, vol. 31, 2001, pages 1089 - 1094, XP002383238, ISSN: 0021-891X *
S. ZEIN EL ABEDIN, H. K. FARAG, E. M. MOUSTAFA, U. WELZ-BIERMANN, F. ENDRES: "Electroreduction of tantalum fluoride in a room temperature ionic liquid at variable temperatures", PHYS. CHEM. CHEM. PHYS., no. 7, 27 April 2005 (2005-04-27), pages 2333 - 2339, XP002435793 *
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Also Published As

Publication number Publication date
CN101076617A (zh) 2007-11-21
KR20070085936A (ko) 2007-08-27
US20090242414A1 (en) 2009-10-01
EP1831433A2 (fr) 2007-09-12
DE102004059520A1 (de) 2006-06-14
CA2590080A1 (fr) 2006-06-15
JP2008523242A (ja) 2008-07-03
WO2006061081A2 (fr) 2006-06-15
RU2007125776A (ru) 2009-01-20
TW200626755A (en) 2006-08-01

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