WO2006056473A3 - Encombrements reduits de la technologie de montage en surface avec adaptation des impedances - Google Patents

Encombrements reduits de la technologie de montage en surface avec adaptation des impedances Download PDF

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Publication number
WO2006056473A3
WO2006056473A3 PCT/EP2005/012691 EP2005012691W WO2006056473A3 WO 2006056473 A3 WO2006056473 A3 WO 2006056473A3 EP 2005012691 W EP2005012691 W EP 2005012691W WO 2006056473 A3 WO2006056473 A3 WO 2006056473A3
Authority
WO
WIPO (PCT)
Prior art keywords
impedance
arrangement
vias
routing density
talk
Prior art date
Application number
PCT/EP2005/012691
Other languages
English (en)
Other versions
WO2006056473A2 (fr
Inventor
Danny Morlion
Stefaan Hendrik Jozef Sercu
Winnie Heyvaert
Geest Jan De
Original Assignee
Framatome Connectors Int
Danny Morlion
Stefaan Hendrik Jozef Sercu
Winnie Heyvaert
Geest Jan De
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Framatome Connectors Int, Danny Morlion, Stefaan Hendrik Jozef Sercu, Winnie Heyvaert, Geest Jan De filed Critical Framatome Connectors Int
Priority to CN2005800473019A priority Critical patent/CN101112135B/zh
Priority to EP05823915A priority patent/EP1839466A2/fr
Publication of WO2006056473A2 publication Critical patent/WO2006056473A2/fr
Publication of WO2006056473A3 publication Critical patent/WO2006056473A3/fr

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/646—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00 specially adapted for high-frequency, e.g. structures providing an impedance match or phase match
    • H01R13/6461—Means for preventing cross-talk
    • H01R13/6471—Means for preventing cross-talk by special arrangement of ground and signal conductors, e.g. GSGS [Ground-Signal-Ground-Signal]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/646—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00 specially adapted for high-frequency, e.g. structures providing an impedance match or phase match
    • H01R13/6473—Impedance matching
    • H01R13/6477—Impedance matching by variation of dielectric properties
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3405—Edge mounted components, e.g. terminals
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/403—Edge contacts; Windows or holes in the substrate having plural connections on the walls thereof
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09145—Edge details
    • H05K2201/09163—Slotted edge
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09145—Edge details
    • H05K2201/0919—Exposing inner circuit layers or metal planes at the side edge of the PCB or at the walls of large holes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/09845—Stepped hole, via, edge, bump or conductor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10287—Metal wires as connectors or conductors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/1034—Edge terminals, i.e. separate pieces of metal attached to the edge of the PCB

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Details Of Connecting Devices For Male And Female Coupling (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
  • Structure Of Printed Boards (AREA)

Abstract

Cette invention concerne des méthodologies permettant de définir des encombrements de la technologie de montage en surface avec adaptation des impédances sur un substrat, tel qu'une carte à circuits imprimés, qui est conçu par exemple pour recevoir un composant électrique présentant un système de conducteurs de bornes. Un tel encombrement peut contenir un système de pastilles électroconductrices (P) et un système de trous traversants électroconducteurs (V). Le système de trous traversants peut être différent du système de pastilles. Les trous traversants (V) peuvent être conçus pour augmenter la densité d'acheminement, tout en limitant la diaphonie et en assurant une impédance adaptée entre le composant et le substrat. Le système de trous traversants peut être modifié pour produire une densité d'acheminement souhaitée sur une couche de la carte. En augmentant la densité d'acheminement, on peut réduire le nombre de couches de la carte, ce qui tend à diminuer la capacitance et à augmenter ainsi l'impédance. Des trous traversants des mise à la masse (G) et des trous traversants de transport de signaux (S) peuvent être disposés les uns par rapport aux autres, de façon à modifier l'impédance. Ainsi, on peut modifier la disposition des trous traversants pour obtenir une impédance adaptée à l'impédance du composant. On peut également modifier la disposition des trous traversants pour limiter la diaphonie entre des conducteurs de signaux voisins. Ainsi, on peut définir la disposition des trous traversants pour équilibrer les besoins en impédance, en diaphonie et en densité d'acheminement du système.
PCT/EP2005/012691 2004-11-29 2005-11-28 Encombrements reduits de la technologie de montage en surface avec adaptation des impedances WO2006056473A2 (fr)

Priority Applications (2)

Application Number Priority Date Filing Date Title
CN2005800473019A CN101112135B (zh) 2004-11-29 2005-11-28 改进的匹配阻抗表面贴装技术基底面
EP05823915A EP1839466A2 (fr) 2004-11-29 2005-11-28 Encombrements reduits de la technologie de montage en surface avec adaptation des impedances

Applications Claiming Priority (6)

Application Number Priority Date Filing Date Title
US63154504P 2004-11-29 2004-11-29
US63149904P 2004-11-29 2004-11-29
US60/631,545 2004-11-29
US60/631,499 2004-11-29
US68651405P 2005-06-01 2005-06-01
US60/686,514 2005-06-01

Publications (2)

Publication Number Publication Date
WO2006056473A2 WO2006056473A2 (fr) 2006-06-01
WO2006056473A3 true WO2006056473A3 (fr) 2006-09-08

Family

ID=36217936

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/EP2005/012691 WO2006056473A2 (fr) 2004-11-29 2005-11-28 Encombrements reduits de la technologie de montage en surface avec adaptation des impedances

Country Status (3)

Country Link
EP (1) EP1839466A2 (fr)
CN (5) CN101673886B (fr)
WO (1) WO2006056473A2 (fr)

Families Citing this family (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1916915A (zh) * 2005-08-19 2007-02-21 鸿富锦精密工业（深圳）有限公司 改良过孔阻抗的方法
GB0709792D0 (en) * 2007-05-22 2007-06-27 Texas Instruments Ltd Optimization of organic packaging interconnect for gigabit signalling
CN101728351B (zh) * 2008-10-16 2011-07-20 英业达股份有限公司 接垫布局
US8591257B2 (en) * 2011-11-17 2013-11-26 Amphenol Corporation Electrical connector having impedance matched intermediate connection points
EP2739125A1 (fr) * 2012-11-28 2014-06-04 Tyco Electronics Svenska Holdings AB Interface de connexion électrique pour connecter des fils électriques pour la transmission de données à grande vitesse
CN103857179A (zh) * 2012-12-03 2014-06-11 泰科电子日本合同会社 Pwb占用区、具有pwb占用区的pwb、pwb与板对板连接器组件
EP3084894B1 (fr) * 2013-12-18 2021-02-17 Intel Corporation Dispositif et procédé de routage de mise à la terre
KR20160137558A (ko) * 2014-03-24 2016-11-30 센티넬 커넥터 시스템즈, 아이엔씨. 크로스 오버 통신 잭용 테스트 장치 및 이의 작동 방법
CN105764232A (zh) * 2014-12-17 2016-07-13 鸿富锦精密工业(武汉)有限公司 印刷电路板及应用该印刷电路板的电子装置
CN104822225B (zh) * 2015-04-30 2018-03-13 华为技术有限公司 一种电路板和印刷电路板组件
JP6594361B2 (ja) * 2017-02-16 2019-10-23 株式会社ソニー・インタラクティブエンタテインメント 通信機器
EP3707971A4 (fr) * 2017-11-08 2021-07-28 Amphenol Corporation Empreinte de face arrière destinée à des connecteurs électriques à haute densité et haute vitesse
CN110474183B (zh) * 2018-05-09 2020-11-20 陈松佑 用于内存模块卡的卡缘连接器及电路板组合
CN109587943A (zh) * 2018-11-09 2019-04-05 加弘科技咨询(上海)有限公司 差分线零桩线共铺走线电路板及电子器件
CN109600933B (zh) * 2018-11-28 2020-09-18 北京遥测技术研究所 同轴电连接器内导体与印制板焊盘三维立体锡膏涂覆方法
US11658080B2 (en) * 2020-10-29 2023-05-23 Hewlett Packard Enterprise Development Lp Methods and systems for transposition channel routing
CN117440595A (zh) * 2022-09-27 2024-01-23 中兴智能科技南京有限公司 差分排布结构和印制电路板
CN115696737A (zh) * 2022-11-01 2023-02-03 超聚变数字技术有限公司 电路板和计算设备

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US4636919A (en) * 1985-03-20 1987-01-13 Hitachi, Ltd. Multilayer printed circuit board
US6150729A (en) * 1999-07-01 2000-11-21 Lsi Logic Corporation Routing density enhancement for semiconductor BGA packages and printed wiring boards
US6198635B1 (en) * 1999-05-18 2001-03-06 Vsli Technology, Inc. Interconnect layout pattern for integrated circuit packages and the like
US6232564B1 (en) * 1998-10-09 2001-05-15 International Business Machines Corporation Printed wiring board wireability enhancement
US6538213B1 (en) * 2000-02-18 2003-03-25 International Business Machines Corporation High density design for organic chip carriers
US20040216071A1 (en) * 2003-04-22 2004-10-28 Miller Leah M. Routing structure for transceiver core
WO2006053891A1 (fr) * 2004-11-19 2006-05-26 Alcatel Lucent Largeur hors pas pour améliorer le routage de cartes de circuit imprimé

Family Cites Families (2)

* Cited by examiner, † Cited by third party
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US5784262A (en) * 1995-11-06 1998-07-21 Symbios, Inc. Arrangement of pads and through-holes for semiconductor packages
US6717825B2 (en) * 2002-01-18 2004-04-06 Fci Americas Technology, Inc. Electrical connection system for two printed circuit boards mounted on opposite sides of a mid-plane printed circuit board at angles to each other

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4636919A (en) * 1985-03-20 1987-01-13 Hitachi, Ltd. Multilayer printed circuit board
US6232564B1 (en) * 1998-10-09 2001-05-15 International Business Machines Corporation Printed wiring board wireability enhancement
US6198635B1 (en) * 1999-05-18 2001-03-06 Vsli Technology, Inc. Interconnect layout pattern for integrated circuit packages and the like
US6150729A (en) * 1999-07-01 2000-11-21 Lsi Logic Corporation Routing density enhancement for semiconductor BGA packages and printed wiring boards
US6538213B1 (en) * 2000-02-18 2003-03-25 International Business Machines Corporation High density design for organic chip carriers
US20040216071A1 (en) * 2003-04-22 2004-10-28 Miller Leah M. Routing structure for transceiver core
WO2006053891A1 (fr) * 2004-11-19 2006-05-26 Alcatel Lucent Largeur hors pas pour améliorer le routage de cartes de circuit imprimé

Also Published As

Publication number Publication date
CN101673885A (zh) 2010-03-17
CN101674707B (zh) 2012-02-22
CN101673885B (zh) 2012-07-18
CN101112135B (zh) 2010-12-29
CN101673887A (zh) 2010-03-17
EP1839466A2 (fr) 2007-10-03
CN101673886B (zh) 2012-07-25
CN101673887B (zh) 2013-04-10
CN101112135A (zh) 2008-01-23
CN101673886A (zh) 2010-03-17
CN101674707A (zh) 2010-03-17
WO2006056473A2 (fr) 2006-06-01

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