WO2006050924A1 - Procede permettant de produire des elements de dispositifs electroniques hautement sensibles a l'humidite - Google Patents

Procede permettant de produire des elements de dispositifs electroniques hautement sensibles a l'humidite Download PDF

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Publication number
WO2006050924A1
WO2006050924A1 PCT/EP2005/011983 EP2005011983W WO2006050924A1 WO 2006050924 A1 WO2006050924 A1 WO 2006050924A1 EP 2005011983 W EP2005011983 W EP 2005011983W WO 2006050924 A1 WO2006050924 A1 WO 2006050924A1
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WO
WIPO (PCT)
Prior art keywords
desiccant material
desiccant
substrate
electronic device
enclosure
Prior art date
Application number
PCT/EP2005/011983
Other languages
English (en)
Inventor
Amol Kirtikar
Inge KRÄMER
Mandy Erdmann
Stefan Dick
Original Assignee
Süd-Chemie AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from EP04026850A external-priority patent/EP1657747A1/fr
Priority claimed from DE102004054553A external-priority patent/DE102004054553A1/de
Application filed by Süd-Chemie AG filed Critical Süd-Chemie AG
Publication of WO2006050924A1 publication Critical patent/WO2006050924A1/fr

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/16—Fillings or auxiliary members in containers or encapsulations, e.g. centering rings
    • H01L23/18—Fillings characterised by the material, its physical or chemical properties, or its arrangement within the complete device
    • H01L23/26—Fillings characterised by the material, its physical or chemical properties, or its arrangement within the complete device including materials for absorbing or reacting with moisture or other undesired substances, e.g. getters
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/095—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00 with a principal constituent of the material being a combination of two or more materials provided in the groups H01L2924/013 - H01L2924/0715
    • H01L2924/097—Glass-ceramics, e.g. devitrified glass
    • H01L2924/09701—Low temperature co-fired ceramic [LTCC]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/12—Passive devices, e.g. 2 terminal devices
    • H01L2924/1204—Optical Diode
    • H01L2924/12044—OLED

Definitions

  • the invention relates to a method of manufacturing highly mois ⁇ ture-sensitive electronic device elements.
  • Typical electronic device elements require humidity levels in a range of about 2.500 to about 5.000 parts per million (ppm) to prevent premature degradation of device performance within a specified operating and/or storing life of the device. Control of the environment to this range of humidity levels within a pack ⁇ aged device is typically achieved by encapsulating the device to ⁇ gether with a desiccant. Desiccants such as, for example, molecu ⁇ lar sieve materials or silica gel materials are used to maintain the humidity level within the above range.
  • OLED organic light-emitting devices
  • CCD charge-coupled device
  • MEMS micro-electro-mechanical sensors
  • desiccant materials usu ⁇ ally are provided in the inside of the enclosure containing the moisture-sensitive micro-electronic elements.
  • desiccant ma ⁇ terials usually are enclosed in the interior in the form of tab ⁇ lets or granules or are deposited on the interior surfaces of the enclosure in the form of a thin film. Further, the desiccant may be entrained in a polymer film.
  • EP 1 014 758 A2 discloses an organic electroluminescent device comprising a substrate, an organic electroluminescent structure formed on the substrate, and a sealing member enclosing the or ⁇ ganic electroluminescent structure for providing a seal thereto.
  • a sealing member On the inside surface of the sealing member is disposed a mixture of a desiccant and a high molecular weight organic compound, said mixture having a water absorption of up to 1.0 % as measured at 23 0 C for 24 hours according to ASTM D570.
  • US 2002/0090531 Al discloses an organic luminescence device, com ⁇ prising an organic luminescence lamination structure comprising a pair of an anode and a cathode, and at least one organic compound layer disposed between the anode and the cathode.
  • the organic lu ⁇ minescence lamination structure is enclosed in a hermetic sealing housing to block access of external air.
  • a drying agent Within the sealing hous ⁇ ing is disposed a drying agent, wherein the drying agent com ⁇ prises an organic isocyanate compound.
  • the isocyanate may react with water vapour diffusing into the sealing housing thereby ab ⁇ sorbing moisture.
  • US 5,591,379 describes a composition of matter having moisture gettering properties and applicable as coating or adhesive in a hermetic microelectronic device.
  • the composition is applied to the interior surface of the packaging and comprises a desiccant finely dispersed in a binder which is a water vapour permeable solid material.
  • the binder may be a polymer, porous ceramic or glass. Molecular sieves are especially useful as the desiccant component of the composition.
  • US 6,226,890 discloses a method of desiccating an environment surrounding a moisture sensitive electronic device sealed within an enclosure.
  • the desiccant is comprised of solid particles hav ⁇ ing a particle size range of 0.1 to 200 micrometers.
  • the desic ⁇ cant particles are comprised in a binder.
  • the binder may be in the liquid phase or dissolved in a liquid.
  • a castable blend in ⁇ cluding at least the desiccant particles and the binder is formed, said blend having a preferred weight fraction of the des ⁇ iccant particles in a range of 10% to 90 %.
  • the blend is cast onto a portion of an interior surface of the enclosure to form a desiccant layer there over and is then solidified to a solid.
  • US 2003/0037677 Al discloses a desiccant for use in a package which has a material including at least in part solid particles of one or more materials, at least one of such materials having an average particle size range of 0.001 to 0.1 micrometers to provide a high rate of water absorption and to provide an equi ⁇ librium minimum level lower than a humidity level to which a highly moisture sensitive electronic device is sensitive within a sealed enclosure.
  • the desiccant material is either used already in an "activated form", i.e. is used in a form, which does not need any further activation to achieve maximum water absorbency. This usually applies to desic- cants which bound water vapour by an "irreversible" chemical re ⁇ action. Desiccants physically absorbing moisture may be activated after their deposition on interior surfaces of the enclosure. This activation is usually done by heating the desiccant to tem ⁇ peratures of more than about 500 °C to desorb bound water mole ⁇ cules. To avoid damage of the desiccant material the binder mate ⁇ rial used to bind the desiccant to a substrate has to be selected to withstand the temperatures used.
  • the desiccant material is first placed on a substrate and the substrate is then heated together with the desiccant material for activation.
  • the mi ⁇ cro-electronic elements have to withstand the temperatures used for activation.
  • WO 98/17711 discloses a process for the enhancement of the desic ⁇ cating capacity of a desiccant polymer which includes the step of exposing the polymer to electromagnetic radiation of a wave ⁇ length/frequency that is absorbed by water molecules. The process may be applied to an industrial scale, e.g. to a large number of solid bodies of the desiccant polymer, e.g. vial stopper used for the package of moisture-sensitive pharmaceuticals, thin films, coatings etc. of the polymer.
  • WO 98/17711 makes no ref ⁇ erence to electronic devices.
  • OLEDs using zeolite based moisture getters have been proven to surpass the performance of OLEDs using other chemical based get ⁇ ters. This is due to the low levels of moisture attained by zeo ⁇ lites and also their ability to absorb oxygen in addition to moisture.
  • OLED's for example, should not develop "dark spots" thereby reducing the brightness e.g. of an OLED-display.
  • the method according to the invention comprises the steps of: providing a substrate
  • sealing member which may form together with the substrate a hermetically sealed encapsulation enclosure
  • micro-electronic elements including at least one highly moisture-sensitive micro-electronic element on the substrate
  • the desiccant material is activated by exposing the desiccant material to microwave radiation of a wave ⁇ length/frequency that is absorbed by water molecules.
  • the desiccant material prior to sealing the encapsulation enclosure is activated by ex ⁇ posing the desiccant material to microwave radiation of a wave ⁇ length/frequency that is absorbed by water molecules. It has been found that by this additional activating step the absorbing ca ⁇ pacity of the desiccant may be enhanced and therefore the life ⁇ time of the electronic device may be prolonged. Further, by the use of microwave energy it is not necessary to heat the desiccant material to high temperatures for activation. Therefore, under certain circumstances it even may be possible to place micro ⁇ electronic elements on the substrate before activation of the desiccant material as the thermal load imposed on the electronic device and its components is reduced.
  • This invention removes the last hurdle in the adoption of desic- cant pastes, preferably zeolite paste based getters, by making it possible to activate the desiccant, preferably the zeolite, at low temperatures in a short time.
  • the substrate may be made of any suitable organic or inorganic material or any combination of such materials of which electronic devices usually are fabricated. Such materials may be e.g. glass, ceramics, silicon or a organic or inorganic polymer.
  • the substrate is a glass plate, a silicon wafer or a foil made from an organic polymer.
  • the substrate is made of a plastic material, i.e. from organic polymers.
  • organic poly ⁇ mers do not have to withstand high temperatures when used to pro ⁇ vide a substrate in the method according to the invention.
  • such organic polymers Pref ⁇ erably, such organic polymers have to withstand temperatures of not more than 200 0 C.
  • Preferable plastic materials are based on polyacrylate, polyethylene, LCP (Liquid Crystal Polymer) . Usual additives may be added to thee polymers.
  • a sealing member which may form together with the substrate a hermetically sealed encapsulation enclosure.
  • the sealing member may be made of any suitable organic or inor ⁇ ganic material or any combination of such materials and may com ⁇ prise a single part, e.g. a glass plate, or may comprise several parts, e.g. a glass plate and several spacers arranged around the edges of the glass plate between the glass plate and the sub ⁇ strate.
  • the substrate and the sealing member may have any form.
  • the substrate may have a flat even form, e.g. the form of a rectangle. However, in other applications a different shape of the substrate and the sealing member may be used.
  • the substrate for example, may have the form of a cube.
  • On the substrate are placed one or more micro-electronic elements.
  • the micro- electronic elements are deposited by methods known to the skilled person from the manufacturing of microelectronic devices.
  • the mi ⁇ cro-electronic elements comprise all usual elements, e.g. cath ⁇ odes, anodes, transistor elements, capacitors, diodes, and so on.
  • the micro-electronic elements deposited on the substrate include at least one highly moisture-sensitive electronic element. Such a highly moisture-sensitive element may be e.g. a liquid-crystal element or an OLED.
  • the desiccant material is placed within a small area on at least a portion of an interior surface of the encapsulation enclosure. There are no restrictions as to the surface on which the desic ⁇ cant material is placed as long as such deposition has no harmful effect on the electronic device element.
  • the desiccant material may be deposited on the substrate and/or the micro-electronic elements and/or the sealing member. There are no restrictions as to the method of placing the desiccant material on the interior surface. Further, there are no restrictions as to the form the desiccant material is placed in the interior of the encapsulation enclosure.
  • the desiccant material may e.g. have the form of a tablet or may be deposited on the surface in the form of a thin film.
  • Such a film may be formed e.g. from a desiccant entrained polymer. There may be provided a cavity on the inside surface of the encapsulation enclosure which may be filled with the desic ⁇ cant material. There is also no restriction on the shape of the deposition. It could be a planar deposition on one surface, or the desiccant could be deposited along the periphery of the de ⁇ vice, so it is located next to the adhesive sealant.
  • the desiccant material may comprise every known organic or inor ⁇ ganic desiccant.
  • Suitable desiccants are alkali metal oxides and alkaline earth metal oxides, e.g. sodium oxide (Na 2 O), potassium oxide (K 2 O) , Calcium oxide (CaO) , Barium oxide (BaO) , magnesium oxide (MgO) , sulfates, halides, perchlorates and hydrides of al- kali and alkali earth metals, e.g. sodium hydride (NaH) which ab ⁇ sorb moisture by chemically reacting with the water.
  • Further des- iccant materials to be used in the method according to the inven ⁇ tion are desiccant materials which physically absorb water.
  • Suit ⁇ able desiccants are e.g. molecular sieves, zeolites, activated silica, activated alumina.
  • Organic desiccant materials may also be used in the method according to the invention, inorganic des ⁇ iccant materials being preferred and physically absorbing desic ⁇ cant material being further preferred.
  • Preferred physically ab ⁇ sorbing desiccant materials are selected from the group of zeo ⁇ lites, silica gel, fumed silica, and/or neutral or alkaline clays; zeolites being most preferred.
  • the desiccant material may comprise a single desiccant or may be a combination of several desiccants. When several desiccants are used those may form a homogenous mixture, a composite material, or multiple layers of desiccants.
  • the desiccant may be entrained in a suitable binder material, e.g. an organic polymer.
  • suitable binder material e.g. an organic polymer.
  • Polymers suitable as a binder material are e.g. polyethylene resins, poly ⁇ propylene resins, polystyrene resins, polyvinyl chloride, poly ⁇ carbonate resins as well as rubber materials.
  • the polymer should be inert towards the desiccant.
  • the desiccant entrained polymer may be deposited on the substrate or the sealing member e.g. in the form of a film.
  • the amount of binder may be selected within a broad range.
  • the desiccant may be contained in an amount of 10 to 90 wt.-%, preferably 60 to 90 wt.-% in the desiccant material.
  • the micro-electronic elements are hermetically sealed in an en ⁇ capsulation enclosure by bonding the substrate to the sealing member such that the micro-electronic elements are placed in a water-tight encapsulation enclosure.
  • the bonding of the substrate to the sealing cap may be achieved e.g. by a suitable adhesive or by any other method known in the manufacturing of electronic de ⁇ vices.
  • a suitable adhesive is e.g. an epoxy resin.
  • the desiccant ma ⁇ terial is activated prior to sealing the encapsulation enclosure.
  • the activation of the desiccant material is performed by exposing the desiccant material to microwave radiation of a wave ⁇ length/frequency that is absorbed by water molecules. It has been found that by exposing the desiccant material to microwave radia ⁇ tion of an appropriate wavelength, the moisture uptake capacity of the desiccant material can be significantly improved. Without wishing to be bound by theory it is assumed that by exposing the desiccant material to microwave radiation water molecules physi ⁇ cally adhering to the desiccant material are removed. For com ⁇ pounds absorbing moisture in a chemical reaction it is assumed that by exposing to microwave radiation such water molecules are removed that have not yet reacted with the desiccant material.
  • the desiccant material may be activated at any time before seal ⁇ ing the encapsulation enclosure.
  • the desiccating material may be placed on the substrate before or after placing the micro ⁇ electronic elements on the substrate.
  • the desiccant material may be activated before placing it on an interior surface of the en ⁇ capsulating enclosure or after deposition.
  • the desiccant material may even be exposed to the microwave radiation after joining the substrate and a sealing cap for forming an encapsulating enclo ⁇ sure. In the latter case a small vent hole has to be provided in the substrate or the sealing cap to remove moisture desorbed from - li ⁇
  • the desiccant material by microwave treatment. After the activa ⁇ tion of the desiccant material the vent hole is sealed by an ap ⁇ muscularte sealing material.
  • the desiccant material is acti ⁇ vated by microwave radiation before placing it on an inside sur ⁇ face of the encapsulation enclosure.
  • the microwave activation may be performed at a place close to where the highly moisture sensitive electronic device element is manufactured such that the activated desiccant material may be placed on an area of the interior surface of the encapsulation enclosure immediately after activation.
  • the process of microwave activation of the desiccant material and the sealing of the substrate and the sealing member to form an encapsulation enclosure may be performed in a single chamber, in separate chambers connected to each other through a passage, or in any other continuous process.
  • the desiccant material is first placed on a substrate and/or sealing member.
  • Several of the des ⁇ iccant coated substrates and/or sealing members are then stacked into a cassette.
  • the entire cassette is then subjected to micro ⁇ wave radiation.
  • the cassette is preferably ventilated to drive away the moisture.
  • the cassette does not have to withstand high temperatures during activation of the desiccant material.
  • the cassette may be made from a material that cannot withstand temperatures above 200 0 C, e.g. a plastic material.
  • the substrate and/or sealing mem ⁇ ber coated with the desiccant material, or the cassette contain ⁇ ing the substrates and/or sealing members coated with the acti ⁇ vated desiccant material may be enclosed in a moisture barrier envelope for transportation to a site where the encapsulation en ⁇ closure is produced.
  • the cassette is placed into a glove box after microwave activation, e.g. to remove the sub ⁇ strates and/or sealing members from the cassette for further processing.
  • the microwave activation of the desiccant material preferably is performed under vacuum or an inert gas.
  • a preferred inert gas is nitrogen.
  • the amount of time the desiccant material is exposed to the microwave radiation is less than or equal to the cycle time of the encapsulation process multiplied by the number of mi ⁇ crowave treatment workstations feeding to the encapsulation work ⁇ station.
  • the time interval between activation of the desiccant material and the sealing of the encapsulation enclosure is se ⁇ lected to be less than 10 minutes.
  • the desiccant may be activated before or after mixing it with a binder material.
  • the desiccant material is preferably activated after mixing.
  • the ac ⁇ tivation step is performed after placing the desiccant material on an inside surface of the encapsulation enclosure.
  • the activation step may be performed at reduced pressure and/or elevated tem ⁇ perature.
  • the activation step is performed at a tem ⁇ perature of less than 300°C, preferably less than 200 0 C.
  • the reduced pressure is selected in a range of less than 100 hPa, preferably within a range of 10 ⁇ 3 to 10 hPa.
  • the amount of energy applied per gram of the desiccant material is preferably at least 100 W, most preferably selected within a range of 50 W to 5 kW.
  • the desiccant material is used in the form of a fine powder having a mean particle size (D 50 ) of about 0.1 to 10 ⁇ m, preferably 2 to 8 ⁇ m, most preferred 3 to 6 ⁇ m, though not lim ⁇ ited thereto.
  • the mean particle size D 50 may be determined e.g. by laser granulometry.
  • the mean particle size D 50 corresponds to a value in which 50 % of the particles have a size smaller than D50 and 50 % of the particles have a size larger than Ds 0 .
  • the desiccant material is deposited on the inside surfaces of the encapsulation enclosure in an amount sufficient to absorb mois ⁇ ture diffusing into the interior of the encapsulation enclosure during the lifetime of the electronic device.
  • the desiccant material is preferably situated spaced from the micro ⁇ electronic element. According to one embodiment of the method according to the inven ⁇ tion the desiccant material is applied to the inside surface of the encapsulation enclosure in film form.
  • An appropriate amount of the desiccant material is 0.001 to 0.5 g/cm 2 , preferably 0.01 to 0.1 g/cm 2 , preferably having a layer thickness of 1 ⁇ m to 1 mm, preferably between 5 ⁇ m to 1 mm, most preferred 15 ⁇ m to 200 ⁇ m.
  • Any application technique may be used to form the film including e.g. roll coating, blade coating, brush coating and printing. The use of a dispenser is also acceptable.
  • the microwave radiation used to activate the desiccant material has a wave length that is absorbed by water molecules.
  • the microwave radiation has a wavelength in a range of 1 mm to 15 cm (frequency 3 x 10 11 - 2 x 10 9 ) .
  • Exposure time and power level of the microwave radiation is se ⁇ lected to achieve maximum removal of water at minimal exposure time causing minimal damages e.g. to the binder and/or parts of the electronic device elements.
  • Optimum wavelength, power level, exposure time and other conditions of the activation process can be determined by relatively easy experimentation. If the desic ⁇ cant material already contains an (organic) binder or is already placed on an interior surface of the encapsulation enclosure, it is preferred to use lower microwave radiation power for a longer exposure time. If the desiccant material contains only inorganic compounds an activation by exposure to microwave radiation at higher power levels and shorter exposure time is preferred for economic reasons. Usually the exposure time is selected to be at least 1 minute.
  • the desiccant material may be exposed to the microwave radiation in a single cycle.
  • the desiccant material may be exposed to the microwave radiation in a pulsed cycle, i.e. expo ⁇ sure of the desiccant material to the microwave radiation for a, usually short, period, followed by a resting phase during which the desiccant material is not exposed to the microwave radiation, followed, if necessary, by a further alternating exposure and resting phases.
  • the rest cycle may contain a cooling process.
  • Suitable generators for microwave radiation and apparatus in which the desiccant material is activated are known to the skilled person.
  • the microwave apparatus may have a facility to create vacuum.
  • the desiccant material may be used as such, i.e. without a binder, e.g. in the form of a compressed tablet or a granule.
  • the desiccant material comprises a binder material.
  • binder material may be e.g. a organic polymer.
  • a binder may be used having a ther ⁇ mostability of less than 200 °C. Appropriate organic binder mate ⁇ rials have already been mentioned.
  • an in ⁇ organic binder material is used.
  • the inorganic binder material preferably is a naturally occurring and/or a synthetic layered silicate.
  • a porous matrix may be formed containing the desiccant material which at the same time firmly adheres to various support materials, i.e. materials of which the support or the sealing cap is made of.
  • the desiccating properties are not influenced by the presence of the naturally occurring and/or synthetic layered silicate and in some cases are even improved.
  • the naturally oc ⁇ curring and/or synthetic layered silicate may further act as a sorbent for sorption of polar or apolar compounds present in the interior of the encapsulating enclosure which also might have a harmful effect on the electronic devices. Two and three layered alumosilicates are preferred with smectitic layered silicates be ⁇ ing especially preferred.
  • a preferred smectitic layered silicate is bentonite, preferably in its sodium form.
  • further bind ⁇ ers may be used with the desiccant material.
  • Such further binders preferably are inorganic binder materials.
  • Preferred binder mate ⁇ rials are alumino oxide hydroxide (Al(O) (OH)), pseudoboehmite, water glass, borates and low melting glasses. Those binders act to form a film on the inside surface of the encapsulation enclo ⁇ sure, to bind the particles of the desiccate material to each other and to the substrate and/or sealing member surface.
  • the naturally occurring and/or synthetic layered silicate is preferably used in form of particles to be mixed with a powdery desiccant.
  • Preferred desiccants e.g. zeolites
  • Preferred naturally occurring and/or synthetic layered silicates used as a binder in the method according to the inven ⁇ tion e.g. bentonites
  • Preferred naturally occurring and/or synthetic layered silicates used as a binder in the method according to the inven ⁇ tion e.g. bentonites, are also available as a powder and usually have a moisture content of about 3 to 20 wt.-%, preferably 8 to 12 wt.-%.
  • the moisture content may be measured by drying at 160 0 C.
  • the bentonite preferably contains > 80 wt-% montmorillo- nite (determined in the dry state) .
  • the mean particle size (D 50 ) of the naturally occurring and/or synthetic layered silicate preferably is within a range of about 2 to 8 ⁇ m, most preferred 3 to 6 ⁇ m.
  • the naturally occurring and/or synthetic layered sili ⁇ cate comprises particles of a size of more than 250 ⁇ m, prefera ⁇ bly more than 200 ⁇ m in an amount of not more than about 10 %, preferably not more than 5 wt.-%, most preferred not more than 0 wt.-%.
  • the amount of particles having a size of not more than 250 ⁇ m, preferably more than 200 ⁇ m may be determined by sieve analysis.
  • the naturally occurring and/or synthetic layered silicate preferably has a swellability of at least 15 ml/2 g, preferably within a range of 20 ml/2 g to 40 ml/2 g.
  • the inventor assumes that by the swellablility of the layered silicate the porosity of the ma ⁇ trix and the adherence towards a substrate and/or sealing member is improved.
  • the average pore size (4V/A by BET) of the layered silicate pref ⁇ erably is within a range of 3 to 15 nm, most preferred 4 to 12 nm.
  • the layered silicate con ⁇ tains about 30 to 130 meq/100 g Na + , determined by ion exchange.
  • the desiccant material be ⁇ fore placing it on an inside surface of the encapsulating enclo ⁇ sure, essentially comprises the desiccant, the layered silicate and a liquid.
  • the liquid is used to form a paste or a slurry con ⁇ taining the desiccant and the layered silicate.
  • a preferred liq ⁇ uid is water. It is also possible to use mixtures of liquids, e.g. a mixture of water and an alcohol.
  • the amount of liquid added to the desiccant material and the layered silicate prefera ⁇ bly is within a range of 10 to 80 wt.-%.
  • the activation of the desic ⁇ cant material by exposure to microwave radiation is performed af ⁇ ter placing the desiccant material on an inside surface of the encapsulating enclosure. After removal of the liquid the desic- cant material film essentially contains the desiccant and the layered silicate.
  • the desiccant material may contain further usual additives known to the skilled person.
  • additives are e.g. flowing agents, sinter additives, pigments and preservatives.
  • the desiccant material is coated onto the substrate and/or sealing member in the form of, preferably rectangular, areas.
  • the substrate and/or sealing member is di ⁇ vided into smaller pieces to obtain separate devices.
  • the microwave ra ⁇ diation is focussed so that only the desiccant coated areas are exposed to the microwave radiation whereas the uncoated areas in between, which may have other coatings, such as adhesives, are shielded from the microwaves.
  • the method according to the invention avoids high temperatures and may be performed within a short period of time, e.g. few min ⁇ utes. Therefore the desiccant material may be activated immedi ⁇ ately before placing it into the interior of a electronic device element, i.e. the activating step may be performed in the produc ⁇ tion line of the manufacturer of the electronic device element.
  • the desiccant material may be produced at the site of the desic ⁇ cant maker and may be e.g. placed on a glass lid, that forms the back panel of the electronic device element.
  • the desiccant material is activated by exposure to microwave radiation thereby achieving a longer life span of the electronic device.
  • a sample holder for holding a substrate or sealing member onto which a desiccant material is provided
  • a microwave radiation source focused on a location where the desiccant material is provided.
  • the apparatus further com ⁇ prises:
  • a suction device aimed at the area where the desiccant material is provided to suck away moisture liberated from the desiccant material.
  • the viscosity of pastes and slurries were determined according to DIN 53019/ISO 3219 using a Rheo-Stress 600 Rheometer available from Hake Company, Germany, according to the instructions of the manufacturer.
  • the swellablility was determined as follows:
  • a 100 ml graduated glass cylinder was filled with 100 ml of dis ⁇ tilled water. 2.0 g of the compound of interest were slowly de ⁇ posited on the water surface in 0.1 g to 0.2 g portions. After descending of a portion the next portion was deposited on the wa ⁇ ter surface. 1 hour after addition of the complete amount of the compound the volume of the swollen compound is determined in ml/2 g.
  • the BET-surface was determined according to DIN 66131.
  • the po- rosimetry was determined according to the pore size average pore diameter (4V/A) by BET) .
  • the particle size was determined with a Mastersizer S Ver. 2.17 (Malvern Instruments GmbH,dorfberg, Germany) according to the instructions by the manufacturer.
  • the ion exchange capacity (IEC) was determined according to the ammonium chloride method:
  • the IEC corresponds to the NH 4 -amount determined according to Kjedahl (meq/100 g clay) .
  • the ions released by the exchange reaction are contained in the washing water and may be determined by AAS (atom absorption spec ⁇ trometry) .
  • the washing water was reduced by boiling, then trans ⁇ ferred into a 250 ml-flask and deionised water filled in up to the graduation.
  • For sodium the following conditions were used: wavelength (nm) 589,0 width of slit (nm) 0,2 integr. time (s) 3 flame gases air/C 2 H 2 background compensation no mode of measuring cone, ionisation buffer 0.1 % KCl standard (mg/1) 1-5
  • the ICE is given in meq/100 g clay.
  • the viscosity of the samples was measured at shear rates of 1 s “1 , 10 s “1 , 100 s “1 , and 1.000 s “1 , (data in Pa*s) ;
  • the samples from examples 1 and 2 were placed with a pipette into glass cavities having a size of 45 mm x 29 mm x 0.4 mm.
  • the sam ⁇ ples were dried at room temperature and film formation as well as film adhesion were evaluated.
  • zeolite 4A 5 g were placed in a porcelain tray and placed in a 700 W microwave oven. The samples were exposed to microwave ra ⁇ diation for 2, 3, 4 and 5 minutes. The samples were taken out of the oven and placed in an desiccator for 15 min to cool to room temperature. The samples were then weighed again to calculate the theoretical water absorption capacity. The samples were then placed in a climatic chamber at 25 0 C and 40 % r.h. (relative hu ⁇ midity) . The samples were left for 12 hours and then taken out of the chamber and weighed again to determine the actual water ab ⁇ sorption capacity achieved.
  • Substrate 1 and sealing cap 6 are joined to each other at their outer edges by an epoxy sealant 7 to form a water-tight encapsulation enclosure 8.
  • an epoxy sealant 7 to form a water-tight encapsulation enclosure 8.
  • a desiccant film 9 is placed on the inner surface of sealing cap 6.
  • the size of the light-emitting pixels was measured and the elec ⁇ tronic device then stored for 500 h in a climatic chamber at 85 0 C and 85 % r.h. The size of the light emitting pixels was again measured and the number of dark spots determined. It was found, that no dark spots appeared and that the size of the light-emitting pixels was the same as at the beginning of the ex ⁇ periment.

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  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Electroluminescent Light Sources (AREA)
  • Solid-Sorbent Or Filter-Aiding Compositions (AREA)
  • Investigating Or Analyzing Materials By The Use Of Electric Means (AREA)

Abstract

A l'invention se rapporte à un procédé permettant de produire des éléments de dispositifs électroniques hautement sensibles à l'humidité qui contiennent des éléments micro-électroniques (2) placés dans un enveloppe (8) d'encapsulation hermétique. Les étapes de ce procédé consistent à préparer un substrat (1), à préparer un élément (6) de fermeture étanche qui, combiné au substrat (1), permet de former une enveloppe (8) d'encapsulation hermétique, à placer les éléments micro-électroniques (2) comprenant au moins un élément micro-électronique (5) hautement sensible à l'humidité sur le substrat (1), à placer un matériau dessiccatif sur une partie au moins des surfaces internes de l'enveloppe d'encapsulation (8), à enfermer hermétiquement les éléments du dispositif électronique en assemblant le substrat (1) avec l'élément (6) de fermeture étanche de telle manière que les éléments micro-électroniques (2) sont placés dans une enveloppe d'encapsulation étanche à l'eau. Le matériau dessiccatif (9) est activé lorsqu'il est exposé à un rayonnement hyperfréquence présentant une longueur d'onde/fréquence absorbée par les molécules d'eau.
PCT/EP2005/011983 2004-11-11 2005-11-09 Procede permettant de produire des elements de dispositifs electroniques hautement sensibles a l'humidite WO2006050924A1 (fr)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
DE102004054553.7 2004-11-11
EP04026850.0 2004-11-11
EP04026850A EP1657747A1 (fr) 2004-11-11 2004-11-11 Méthode de fabrication de dispositifs électroniques hautement sensibles à l'humidité
DE102004054553A DE102004054553A1 (de) 2004-11-11 2004-11-11 Verfahren zur Herstellung elektronischer Elemente mit hoher Empfindlichkeit gegen Feuchtigkeit

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WO2006050924A1 true WO2006050924A1 (fr) 2006-05-18

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CN101872846A (zh) * 2010-06-03 2010-10-27 昆山维信诺显示技术有限公司 一种金属基底干燥片及其制备方法
US8829634B2 (en) 2009-03-23 2014-09-09 Dow Global Technologies Llc Optoelectronic device

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN114551755A (zh) * 2022-02-08 2022-05-27 深圳市华星光电半导体显示技术有限公司 一种显示面板及移动终端

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8829634B2 (en) 2009-03-23 2014-09-09 Dow Global Technologies Llc Optoelectronic device
CN101872846A (zh) * 2010-06-03 2010-10-27 昆山维信诺显示技术有限公司 一种金属基底干燥片及其制备方法

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