WO2006041989A3 - Cible de pulverisation assurant la formation d'un film d'electrode pour dispositifs a semi-conducteurs et son procede de fabrication - Google Patents
Cible de pulverisation assurant la formation d'un film d'electrode pour dispositifs a semi-conducteurs et son procede de fabrication Download PDFInfo
- Publication number
- WO2006041989A3 WO2006041989A3 PCT/US2005/035940 US2005035940W WO2006041989A3 WO 2006041989 A3 WO2006041989 A3 WO 2006041989A3 US 2005035940 W US2005035940 W US 2005035940W WO 2006041989 A3 WO2006041989 A3 WO 2006041989A3
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- elements
- target
- sputtering target
- matrix
- aluminum
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/34—Sputtering
- C23C14/3407—Cathode assembly for sputtering apparatus, e.g. Target
- C23C14/3414—Metallurgical or chemical aspects of target preparation, e.g. casting, powder metallurgy
Landscapes
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Physical Vapour Deposition (AREA)
- Electrodes Of Semiconductors (AREA)
Abstract
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US61601604P | 2004-10-05 | 2004-10-05 | |
US60/616,016 | 2004-10-05 |
Publications (2)
Publication Number | Publication Date |
---|---|
WO2006041989A2 WO2006041989A2 (fr) | 2006-04-20 |
WO2006041989A3 true WO2006041989A3 (fr) | 2006-08-03 |
Family
ID=36088357
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/US2005/035940 WO2006041989A2 (fr) | 2004-10-05 | 2005-10-04 | Cible de pulverisation assurant la formation d'un film d'electrode pour dispositifs a semi-conducteurs et son procede de fabrication |
Country Status (2)
Country | Link |
---|---|
TW (1) | TW200623242A (fr) |
WO (1) | WO2006041989A2 (fr) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20090008786A1 (en) | 2006-03-06 | 2009-01-08 | Tosoh Smd, Inc. | Sputtering Target |
WO2012046768A1 (fr) * | 2010-10-08 | 2012-04-12 | 株式会社神戸製鋼所 | Cible de pulvérisation en alliage à base d'al et son procédé de production |
CN102744256A (zh) * | 2012-06-25 | 2012-10-24 | 江苏南瑞淮胜电缆有限公司 | 高导电率铝杆的连铸连轧生产方法 |
CN114959595B (zh) * | 2021-12-17 | 2024-03-29 | 常州苏晶电子材料有限公司 | 溅射用高纯铝钕合金靶材及其制造方法 |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0521163A1 (fr) * | 1991-01-17 | 1993-01-07 | Ryoka Matthey Corporation | Couche de cablage a base d'alliage d'aluminium, son procede de fabrication et cible de depot d'alliage d'aluminium par pulverisation |
JP2001093862A (ja) * | 1999-09-21 | 2001-04-06 | Vacuum Metallurgical Co Ltd | 液晶ディスプレイ用の電極・配線材及びスパッタリングターゲット |
JP2004055842A (ja) * | 2002-07-19 | 2004-02-19 | Kobe Steel Ltd | 半導体デバイス電極/配線、半導体デバイス電極用膜/配線用膜並びにAl合金薄膜形成用スパッタリングターゲット |
-
2005
- 2005-10-04 TW TW094134639A patent/TW200623242A/zh unknown
- 2005-10-04 WO PCT/US2005/035940 patent/WO2006041989A2/fr active Application Filing
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0521163A1 (fr) * | 1991-01-17 | 1993-01-07 | Ryoka Matthey Corporation | Couche de cablage a base d'alliage d'aluminium, son procede de fabrication et cible de depot d'alliage d'aluminium par pulverisation |
JP2001093862A (ja) * | 1999-09-21 | 2001-04-06 | Vacuum Metallurgical Co Ltd | 液晶ディスプレイ用の電極・配線材及びスパッタリングターゲット |
JP2004055842A (ja) * | 2002-07-19 | 2004-02-19 | Kobe Steel Ltd | 半導体デバイス電極/配線、半導体デバイス電極用膜/配線用膜並びにAl合金薄膜形成用スパッタリングターゲット |
Non-Patent Citations (4)
Title |
---|
HAWKSWORTH A ET AL: "Solidification microstructure selection in the Al-rich Al-La, Al-Ce and Al-Nd systems", JOURNAL OF CRYSTAL GROWTH, ELSEVIER, AMSTERDAM, NL, vol. 197, no. 1-2, 1 February 1999 (1999-02-01), pages 286 - 296, XP004153139, ISSN: 0022-0248 * |
K.B. HYDE ET AL: "The growth morphology and nucleation mechanism of primary Ll2Al3Sc particles in Al-Sc alloys", MATERIALS SCIENCE FORUM, vol. 331-337, 2000, ch, pages 1013 - 1018, XP008065165 * |
PATENT ABSTRACTS OF JAPAN vol. 2000, no. 21 3 August 2001 (2001-08-03) * |
PATENT ABSTRACTS OF JAPAN vol. 2003, no. 12 5 December 2003 (2003-12-05) * |
Also Published As
Publication number | Publication date |
---|---|
WO2006041989A2 (fr) | 2006-04-20 |
TW200623242A (en) | 2006-07-01 |
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