WO2006035800A1 - 薄膜ヒータおよび分析用具 - Google Patents
薄膜ヒータおよび分析用具 Download PDFInfo
- Publication number
- WO2006035800A1 WO2006035800A1 PCT/JP2005/017813 JP2005017813W WO2006035800A1 WO 2006035800 A1 WO2006035800 A1 WO 2006035800A1 JP 2005017813 W JP2005017813 W JP 2005017813W WO 2006035800 A1 WO2006035800 A1 WO 2006035800A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- thin film
- heating
- analytical tool
- heating resistor
- laminate
- Prior art date
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Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01L—CHEMICAL OR PHYSICAL LABORATORY APPARATUS FOR GENERAL USE
- B01L7/00—Heating or cooling apparatus; Heat insulating devices
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B3/00—Ohmic-resistance heating
- H05B3/0033—Heating devices using lamps
- H05B3/0038—Heating devices using lamps for industrial applications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B3/00—Ohmic-resistance heating
- H05B3/20—Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater
- H05B3/22—Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater non-flexible
- H05B3/28—Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater non-flexible heating conductor embedded in insulating material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01L—CHEMICAL OR PHYSICAL LABORATORY APPARATUS FOR GENERAL USE
- B01L2300/00—Additional constructional details
- B01L2300/08—Geometry, shape and general structure
- B01L2300/0803—Disc shape
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01L—CHEMICAL OR PHYSICAL LABORATORY APPARATUS FOR GENERAL USE
- B01L2300/00—Additional constructional details
- B01L2300/08—Geometry, shape and general structure
- B01L2300/0861—Configuration of multiple channels and/or chambers in a single devices
- B01L2300/0864—Configuration of multiple channels and/or chambers in a single devices comprising only one inlet and multiple receiving wells, e.g. for separation, splitting
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01L—CHEMICAL OR PHYSICAL LABORATORY APPARATUS FOR GENERAL USE
- B01L2300/00—Additional constructional details
- B01L2300/18—Means for temperature control
- B01L2300/1805—Conductive heating, heat from thermostatted solids is conducted to receptacles, e.g. heating plates, blocks
- B01L2300/1827—Conductive heating, heat from thermostatted solids is conducted to receptacles, e.g. heating plates, blocks using resistive heater
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01L—CHEMICAL OR PHYSICAL LABORATORY APPARATUS FOR GENERAL USE
- B01L2400/00—Moving or stopping fluids
- B01L2400/04—Moving fluids with specific forces or mechanical means
- B01L2400/0403—Moving fluids with specific forces or mechanical means specific forces
- B01L2400/0406—Moving fluids with specific forces or mechanical means specific forces capillary forces
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01L—CHEMICAL OR PHYSICAL LABORATORY APPARATUS FOR GENERAL USE
- B01L3/00—Containers or dishes for laboratory use, e.g. laboratory glassware; Droppers
- B01L3/50—Containers for the purpose of retaining a material to be analysed, e.g. test tubes
- B01L3/502—Containers for the purpose of retaining a material to be analysed, e.g. test tubes with fluid transport, e.g. in multi-compartment structures
- B01L3/5027—Containers for the purpose of retaining a material to be analysed, e.g. test tubes with fluid transport, e.g. in multi-compartment structures by integrated microfluidic structures, i.e. dimensions of channels and chambers are such that surface tension forces are important, e.g. lab-on-a-chip
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N35/00—Automatic analysis not limited to methods or materials provided for in any single one of groups G01N1/00 - G01N33/00; Handling materials therefor
- G01N2035/00346—Heating or cooling arrangements
- G01N2035/00356—Holding samples at elevated temperature (incubation)
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B2203/00—Aspects relating to Ohmic resistive heating covered by group H05B3/00
- H05B2203/013—Heaters using resistive films or coatings
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B2203/00—Aspects relating to Ohmic resistive heating covered by group H05B3/00
- H05B2203/017—Manufacturing methods or apparatus for heaters
Definitions
- the present invention relates to a thin film heater and an analysis tool to be used by being mounted on an analysis apparatus when analyzing a sample.
- a method of analyzing a sample for example, there is a method of analyzing a reaction solution obtained by reacting a sample with a reagent by an optical method.
- Such an analysis is performed, for example, by attaching an analytical tool that provides a reaction field to an analyzer that has constructed an optical system capable of irradiating and receiving light (see, for example, Patent Document 1).
- the temperature of the analytical tool especially the reaction solution
- the analytical tool 9 is held on a heat block 91 having a larger heat capacity than the reaction solution 90, and the temperature of the heat block 91 is adjusted.
- the temperature of the reaction liquid 90 is adjusted.
- the temperature of the reaction liquid is monitored by a temperature sensor 92 embedded in the heat block 91, and when the temperature of the reaction liquid becomes lower than a predetermined value, the heat block 91 is heated and heated. The temperature of the reaction solution is raised through the heat block 91.
- the conventional temperature control method has a demerit that the power consumption is large. Therefore, it has become difficult to apply the conventional temperature control method to a small analyzer that incorporates and drives a small battery (for example, a battery commonly used in homes) as an internal power source. Even if the method is applied to a small analyzer, the actual operation time of the analyzer becomes extremely short, which is not practical. On the other hand, in order to improve the shortening of the actual operation time, it is sufficient to secure a large capacity of the internal power supply. However, in this case, the analysis apparatus is prevented from being downsized and the portability is poor. Resulting in.
- Patent Document 1 Japanese Patent Application Laid-Open No. 8-114539
- Patent Document 2 JP-A-9-189703
- Patent Document 3 Japanese Patent Laid-Open No. 10-253536
- Patent Document 4 Japanese Patent Laid-Open No. 9-304269
- the present invention can be applied to an analysis tool capable of heating a liquid component held in an analysis tool with low power consumption and efficiency without increasing the size of the analysis apparatus to a target temperature, and the analysis tool.
- an analysis tool capable of heating a liquid component held in an analysis tool with low power consumption and efficiency without increasing the size of the analysis apparatus to a target temperature, and the analysis tool.
- a thin film heating resistor In the first aspect of the present invention, a thin film heating resistor, first and second thin film electrodes conductively connected to the thin film heating resistor to apply a voltage to the thin film heating resistor, A thin film heater is provided.
- an analytical tool used by being attached to an analyzer, comprising one or more reaction vessels for reacting a sample and a reagent, and the one or more reaction vessels.
- an analytical tool equipped with a thin film heater that generates heat when energized for heating, the thin film heater is connected to the thin film heating resistor in order to apply a voltage to the thin film heating resistor and the thin film heating resistor.
- an analysis tool comprising the first and second thin film electrodes.
- the thin film heating resistor is translucent.
- the thin film heating resistor may be formed as one having one or more through holes or notches for ensuring translucency, which may be formed transparently as a whole.
- the thickness of the thin film heating resistor is, for example, 20 to 300 nm. This is because it is difficult to manufacture easily when the thickness is unduly small, which may be disadvantageous in terms of workability and manufacturing cost, whereas when the thickness is unduly large, the desired resistance value ( It is also a force that may make it difficult to obtain a calorific value).
- the first thin film electrode, the thin film heating resistor, and the second thin film electrode constitute a heating laminated body laminated in this order in the film thickness direction.
- the heating laminate is translucent.
- at least a portion corresponding to the reaction tank of the heat lamination tank has translucency.
- the heating laminate may be formed entirely transparent, or may have one or more through holes or notches for ensuring translucency.
- the thin film heater preferably has a transparent base material for supporting the heating laminate.
- the thickness of the heating laminate is, for example, 200 m or less, and preferably 100 m or less. This is a force that inhibits downsizing of the analysis tool when the thickness of the heating stack is unreasonably large, for example, when the heating stack is incorporated into the analysis tool.
- the thin film heating resistor has a portion surrounding at least a part of the periphery of the one or more reaction vessels, for example, as viewed in the film thickness direction.
- the analysis tool is formed in a disk shape as a whole, for example.
- the thin film heater is also formed in a disk shape as a whole.
- the analysis tool of the present invention is configured, for example, as having a liquid receiving part for holding a sample to be supplied to the one or more reaction vessels in the center.
- the reaction tank includes a plurality of reaction tanks arranged on the same circumference centered on the liquid receiving part, while the thin film heating resistor has a through hole in a part corresponding to the liquid receiving part. It is formed in the formed annular shape.
- the analysis tool of the present invention includes, for example, a first transparent member having a plurality of flow paths, and a second transparent member joined to the first transparent member so as to cover the plurality of flow paths. Is done.
- the heating laminate is formed on the surface of the first or second transparent member.
- the heating laminate is preferably formed on the surface of the second transparent member opposite to the surface where the first transparent member is joined.
- the analysis tool further includes, for example, a transparent third transparent member for covering the heating laminate.
- the third transparent member is preferably formed in a cap shape between the first transparent member and the second transparent member and the heated laminate.
- the analysis tool of the present invention is configured to be used in contact with the first and second thin film electrodes, for example, for the first and second probes in the analyzer.
- the first and second thin film electrodes have an exposed portion for contacting the first and second probes.
- the analysis tool of the present invention is preferably configured so that the first and second thin film electrodes can be brought into contact with the first and second probes from the same side.
- the analysis tool of the present invention is configured as, for example, a microdevice having a sample volume of 00 ⁇ L or less. Further, when the analysis tool includes a plurality of flow paths, the volume of each flow path is set to, for example, 300 to 800 nL.
- the first thin film electrode, the thin film heating resistor, and the second thin film electrode are "transparent" or heated laminate force ⁇ transparent, all wavelengths in the visible light region are used.
- the heated laminate Is not visually transparent, but is included in the “transparent” in the present invention.
- FIG. 1 is an overall perspective view showing an example of a microdevice according to the present invention.
- FIG. 2 is a sectional view taken along line II—II in FIG.
- FIG. 3 is an exploded perspective view of the micro device shown in FIG. 1.
- FIG. 4 is an exploded perspective view of a heater in the microdevice shown in FIG.
- FIG. 5 is a plan view of the micro device force shown in FIG. 1 with the cap removed.
- FIG. 6 is an exploded perspective view showing another example of the thin film heater according to the present invention.
- FIG. 7A is a plan view for explaining still another example of the thin film heater, and FIG. 7B is an exploded perspective view thereof.
- FIG. 8A is a plan view for explaining still another example of the thin film heater, and FIG. 8B is an exploded perspective view thereof.
- FIG. 9A is a plan view for explaining still another example of the thin film heater, and FIG. 9B is an exploded perspective view thereof.
- FIG. 10 is a cross-sectional view for explaining a conventional temperature control method.
- the microdevice X shown in FIGS. 1 to 3 is formed with a plurality of fine flow paths, and is formed in a transparent disk shape as a whole.
- This microdevice X has a substrate 1, a thin film heater 2 and a cap 3.
- the substrate 1 is stepped down at the peripheral portion, and the liquid receiving unit 10
- the whole is formed in a transparent disk shape.
- the liquid receiving unit 10 is for holding a sample to be introduced into each channel 11. This liquid receiver
- the plurality of channels 11 are for moving the sample, and extend from the liquid receiving unit 10 toward the peripheral portion of the substrate 1. These flow paths 11 are formed radially as a whole.
- Each flow path 11 has a reaction tank 13 for reacting the sample and the reagent, and the substrate 1 is provided with a plurality of reaction tanks 13.
- the plurality of reaction tanks 13 have the same distance from the liquid receiving unit 10 and are arranged on the same circumference in the substrate 1.
- Each reaction tank 13 is provided with a reagent part 14.
- the reagent part 14 is a solid that dissolves when a sample is supplied, and reacts with a component to be detected in the sample to develop a color.
- a plurality of types of reagent parts 14 having different components or compositions are prepared so that a plurality of items can be measured in the microdevice X.
- the common channel 12 is used when the gas existing in the plurality of channels 11 is discharged to the outside.
- the common channel 12 is formed as an annular recess at the peripheral edge of the substrate and communicates with the plurality of channels 11.
- Substrate 1 having the above-described configuration is formed by resin molding using, for example, acrylic resin such as polymethylmethalate (PMMA) or polydimethylsiloxane (PDMS) t, and a transparent resin material. Can be formed. That is, the liquid receiving part 10, the plurality of flow paths 11, and the common flow path 12 can be simultaneously formed during the above-described resin molding by devising the shape of the mold.
- acrylic resin such as polymethylmethalate (PMMA) or polydimethylsiloxane (PDMS) t
- PDMS polydimethylsiloxane
- the thin film heater 2 is for heating the inside of each reaction vessel 13 and has a sub-substrate 20 and a heating laminate 21.
- the sub-substrate 20 is formed in a transparent disk shape that is slightly smaller than the substrate 1.
- the sub board 20 has through holes 20A and 20B.
- the through hole 20A is used to discharge the gas in the common flow path 12 of the substrate 1 to the outside, and is formed so as to communicate with the common flow path 12 at the peripheral edge of the sub-board 20. ing.
- the through-hole 20B is used to supply a sample to the liquid receiving part 10 of the substrate 1, and is formed so as to communicate with the liquid receiving part 10 at the center of the sub-substrate 20! .
- the heating laminate 21 generates heat due to electric resistance when energized, and is provided on the sub-substrate 20.
- This heating laminate 21 has through holes 21 A and 21 B formed at positions corresponding to the through holes 20 A and 20 B of the sub substrate 20, and as shown in FIG.
- a thin-film anode 22, a thin-film heating resistor 23, and a thin-film cathode 24 are stacked on this 20 in this order.
- the through hole 21A is for allowing the gas present in the common flow path 12 of the substrate 1 to be discharged to the outside.
- the through hole 21B is for allowing the sample to be supplied to the liquid receiving part 10 of the substrate 1.
- the thin film anode 22, the thin film heating resistor 23, and the thin film cathode 24 have through holes 22A to 24A, 22B to 24B, and are formed by notches 22C to 24C. It has a substantially annular form in which a part is separated.
- the through holes 22A to 24A constitute a through hole 21A as the heating laminate 21, and the through holes 22B to 24B constitute a through hole 21B as the heating laminate 21.
- the thin film anode 22 and the thin film cathode 24 are used for applying a voltage to the thin film heating resistor 23, and are formed to be transparent. These electrodes 22 and 24 are exposed through the probe inlet 32A and 32B of the cap 3, which will be described later, and are used for applying a voltage to the analyzer (not shown) via the probe inlet 32A and 32B. It is constructed so that the probes 40 and 41 can be brought into contact with each other!
- the thin film heating resistor 23 is heated by applying a voltage by the thin film anode 22 and the thin film cathode 24, and is formed transparently.
- transparent means a case where there is no light absorption or almost no light absorption with respect to the wavelength of light employed in analysis using at least an analytical tool, and is necessarily visually transparent. The case is not limited.
- Each of the thin film anode 22, the thin film heating resistor 23, and the thin film cathode 24 is formed into a transparent thin film having a desired resistance value by selecting a film forming method, a thickness, or a material.
- the thin film heating resistor 23 is formed so that the sheet resistance is larger than that of the thin film anode 22 and the thin film cathode 24.
- the thickness of the thin film anode 22 and the thin film cathode 24 is, for example, 1 to: LOO / zm, while the thickness of the thin film heating resistor 23 is, for example, 20 to 300 nm.
- a method for forming these thin films 22 to 24 for example, screen printing, sputtering, CVD, vapor deposition, coating, or rolling can be employed.
- a material for forming these thin films 22 to 24 for example, inorganic oxides, inorganic substances such as TiN, or organic substances such as conductive polymers can be used. For example, In O
- Examples include a composite oxide in which two or more selected oxides are combined, or a single element oxide or an oxide in which a specific element is doped into a composite oxide.
- Dopa For example, B, Al 2 O, or Ga 2 O can be exemplified. Thin film positive
- the electrode 22 and the thin film cathode 24 are made of a highly conductive metal (for example, a noble metal such as gold) and formed on a thin film metal layer on the order of nm, thereby providing light transmittance. Good.
- a highly conductive metal for example, a noble metal such as gold
- the cap 3 has a sample introduction part 30, a gas discharge port 31, and probe insertion ports 32A and 32B, but is formed in a transparent disk shape as a whole. ing
- the sample introduction unit 30 is used when a sample is introduced.
- the sample introduction part 30 is formed by providing a bulging part 33 having an opening 33A in the center part of the cap 3.
- the opening 33A communicates with the liquid receiving part 10 of the substrate 1 through the through holes 20B and 21B of the sub-substrate 20 and the heating laminate 21. For this reason, the sample can be supplied to the liquid receiving unit 10 by the sample introduction unit 30 (opening 33A).
- the gas discharge port 31 is for discharging the gas present in the plurality of flow paths 11 to the outside through the common flow path 12.
- the gas exhaust port 31 is formed as a through hole communicating with the common flow path 12 through the through holes 20A and 21A of the sub-substrate 20 and the heating laminate 21.
- the gas outlet 31 is blocked by the sealing material 31a until the microdevice 1 is used.
- the sealing material 31a is peeled off when the microdevice X is used, for example.
- the opening of the gas discharge port 31 may be performed by forming a through hole in the sealing material 3 la.
- the sealing material 31a is formed of a thin film such as an aluminum foil
- a through-hole is formed in the sealing material 31a by penetrating the needle-like member through the sealing material 31a, or the sealing material 31a has a low melting point.
- the through hole may be formed in the sealing material 31a by forming the thermoplastic resin (for example, the melting point is 100 degrees or less) and irradiating the sealing material 31a with a laser beam.
- Probe probe inlets 32A and 32B are used for inserting probes 40 and 41 when the probes 40 and 41 for voltage application in the analyzer are brought into contact with the thin film anode 22 and the thin film cathode 24 of the thin film heater 2, respectively. It is formed as a through hole.
- the cover 3 having the above-described configuration is a resin composition made of a transparent resin material, similar to the substrate 1. It can be formed by shape. In other words, the sample inlet 30, the gas outlet 31, and the probe inlet 32A, 32B can be formed at the same time as the above resin molding.
- the microdevice X When analyzing a sample, first, the microdevice X is attached to an analyzer (not shown). At this time, the sample may be supplied to the microdevice X in advance, or the sample may be supplied to the microdevice X after the microdevice X is mounted on the analyzer.
- the sample is supplied to the microdevice X through the sample introduction part 30 of the cap 3.
- the sample introduced from the sample introduction unit 30 is a force that reaches the liquid receiving unit 10 through the through holes 20B and 21B of the sub-substrate 20 and the heating laminate 21.
- the gas discharge port 31 of the microdevice X is blocked by the sealing material 31a. As a result, the capillary force does not act inside each flow path 11 and the sample remains in the liquid receiving part 10.
- the probe 40, 41 for applying voltage to the analyzer is a thin film through the probe inlet 32A, 32B of the cap 3. Contacted with anode 22 and thin film cathode 24. Then, the analyzer (not shown) applies a voltage to the thin film anode 22 and the thin film cathode 24 in the thin film heater 2 via the probes 40 and 41. As a result, the thin film heating resistor 23 is energized to generate heat, and the reaction vessel 13 is heated. The reaction tank 13 is heated by, for example, monitoring the temperature of the reaction tank 13 and performing feedback control so that the temperature of the reaction tank 13 is maintained at the target temperature, or applying a predetermined voltage value for a predetermined time. Only by applying.
- the gas discharge port 31 is opened, and the sample held in the liquid receiving part 10 is introduced into each flow path 11.
- the gas outlet 31 is opened by peeling off the sealing material 31a or by forming a through hole in the sealing material 31a.
- each flow channel 11 communicates via the common flow channel 12 and the gas discharge port 31.
- a capillary force is generated in each flow path 11, and the sample remaining in the liquid receiving part 10 moves inside each flow path 11 and is supplied to the reaction tank 13.
- the reagent part 14 is dissolved by the sample to construct a liquid phase reaction system.
- This liquid phase reaction system is heated to a target temperature by heating the reaction tank 13 by the thin film heater 2.
- a sample and a reagent react, for example, a liquid phase reaction system. Shows coloration correlated with the amount of the detected component in the sample, or a reaction product corresponding to the amount of the detected component is generated.
- the liquid phase reaction system in the reaction tank 13 exhibits translucency (light absorption) according to the amount of the component to be detected.
- the reaction vessel 13 is heated using the thin film heater 2 incorporated in the microdevice X. That is, the thin film heater 2 can be formed for each microdevice X according to its size and according to the position, number or shape of the reaction vessel. Therefore, since only the liquid phase reaction system in the reaction tank 13 can be selectively heated, the utilization efficiency of the supplied energy is increased. Since the thin film heater 2 can be provided close to the reaction tank 13, the heat energy from the thin film heater 2 to the liquid phase reaction system can be efficiently transmitted. As a result, the utilization efficiency of the supplied energy can be improved, and the power consumption required for heating the liquid phase reaction system (reaction vessel 13) can be reduced.
- a small battery such as a dry battery used in the home can be used as an internal power source for driving the thin film heater 2, and even if a small battery is used, the battery life is remarkably increased.
- the liquid phase reaction system (reaction vessel 13) can be heated sufficiently without being shortened. Therefore, even in a small analyzer, the liquid reaction system (reaction tank 13) can be heated using the internal power supply without increasing the size thereof. And if it becomes possible to cope with the internal power supply, it will not be necessary to connect to an external power supply, and the adapter will no longer be an essential item. Therefore, it is not necessary to carry the adapter when carrying the analyzer, and portability is improved.
- the analysis tool according to the present invention does not necessarily have to be configured as a microdevice first, and secondly, is not limited to one configured to analyze a sample by an optical technique, but is electrochemical.
- the sample may be configured to be analyzed by a technique.
- the sample is not limited to having a plurality of reaction vessels.
- the heater that can be used may be configured as shown in FIGS.
- the heater 5 shown in FIG. 6 includes the thin film anode 52, the thin film heating resistor 53, and the thin film cathode 54, and the thin film heater 2 described above (see FIGS. 4 and 5) and its configuration. Are in common.
- the thin film anode 52 and the thin film cathode 54 are selectively conductively connected at a portion (end portion) of the thin film heat generating resistor 53 that is divided by the notch 53C. This is different from the thin film heater 2 (see Fig. 4 and Fig. 5).
- the thin film anode 52 is connected to the lower surface 54 of the thin film heating resistor 53, while the thin film cathode 54 is connected to the upper surface 55 of the thin film heating resistor 53.
- each of the thin film anode 52 and the thin film cathode 54 may be connected to the same surface of the thin film heating resistor 53.
- the heater 6 shown in FIGS. 7A and 7B has a heating laminate 61 in which the notches 22C to 24C (see FIGS. 4 and 5) are omitted from the heating laminate 21 of the thin film heater 2.
- the heating laminate 61 includes the thin film anode 62, the thin film heating resistor 63, and the thin film cathode 64 so that each of the thin film heaters 2 in the thin film heater 2 is selectively covered with the reaction tank 13. It is formed in a donut shape with smaller dimensions (difference between inner and outer diameters) than thin films 22-24 (see Figs. 4 and 5).
- the heater 7 shown in FIGS. 8A and 8B is the heater 6 shown in FIG. 7 in which a plurality of through holes 71D are provided in a portion corresponding to the reaction tank 13 in the heating laminate 71.
- Each through hole 71D is formed by providing a plurality of through holes 72D, 73D, and 74D in portions corresponding to the respective reaction layers 13 in the thin film anode 72, the thin film heating resistor 73, and the thin film cathode 74, respectively.
- the heater 8 shown in FIGS. 9A and 9B is similar to the heater 7 shown in FIG. 8 and is provided with a plurality of through holes 81D in a portion corresponding to the reaction tank 13 in the heating laminate 81. is there.
- each through-hole 81D is provided with a plurality of through-holes 82D in a portion corresponding to each reaction layer 13 in the thin film anode 82, while each reaction layer in each of the thin film heating resistor 83 and the thin film cathode 84 is provided. It is formed by providing a plurality of notches 83D and 84D in the portion corresponding to 13. That is, the heating of each reaction tank 13 by the heating laminate 81 is not performed on the entire periphery of each reaction tank 13, but close to the common flow path 12, except for the part, and over the part. Is called.
- the thin film anode 82 may have the same shape as the thin film heating resistor 83 and the thin film cathode 84.
- each thin film may be divided by notches.
- the thin film heating resistor may be divided, and the thin film anode and the thin film cathode may be selectively connected to the end portions thereof.
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- Automatic Analysis And Handling Materials Therefor (AREA)
- Sampling And Sample Adjustment (AREA)
Abstract
Description
Claims
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN2005800330922A CN101031801B (zh) | 2004-09-30 | 2005-09-28 | 薄膜加热器和分析用具 |
JP2006537765A JP4621846B2 (ja) | 2004-09-30 | 2005-09-28 | 分析用具 |
EP05788350A EP1795899B1 (en) | 2004-09-30 | 2005-09-28 | Analytical instrument with film heater |
US11/664,207 US8137617B2 (en) | 2004-09-30 | 2005-09-28 | Thin film heater and analytical instrument |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2004-286629 | 2004-09-30 | ||
JP2004286629 | 2004-09-30 |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2006035800A1 true WO2006035800A1 (ja) | 2006-04-06 |
Family
ID=36118946
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/JP2005/017813 WO2006035800A1 (ja) | 2004-09-30 | 2005-09-28 | 薄膜ヒータおよび分析用具 |
Country Status (5)
Country | Link |
---|---|
US (1) | US8137617B2 (ja) |
EP (1) | EP1795899B1 (ja) |
JP (1) | JP4621846B2 (ja) |
CN (1) | CN101031801B (ja) |
WO (1) | WO2006035800A1 (ja) |
Cited By (30)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2013167639A (ja) * | 2007-07-13 | 2013-08-29 | Handylab Inc | ヒータ基体及びヒータユニット |
USD742027S1 (en) | 2011-09-30 | 2015-10-27 | Becton, Dickinson And Company | Single piece reagent holder |
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Also Published As
Publication number | Publication date |
---|---|
US8137617B2 (en) | 2012-03-20 |
CN101031801A (zh) | 2007-09-05 |
JP4621846B2 (ja) | 2011-01-26 |
EP1795899B1 (en) | 2012-06-06 |
EP1795899A1 (en) | 2007-06-13 |
US20070292311A1 (en) | 2007-12-20 |
CN101031801B (zh) | 2010-12-01 |
JPWO2006035800A1 (ja) | 2008-05-15 |
EP1795899A4 (en) | 2009-12-02 |
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