WO2006030352A2 - Electronic device comprising a flexible printed circuit board conductively connected to a metallic stiffener by means of solder - Google Patents

Electronic device comprising a flexible printed circuit board conductively connected to a metallic stiffener by means of solder Download PDF

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Publication number
WO2006030352A2
WO2006030352A2 PCT/IB2005/052936 IB2005052936W WO2006030352A2 WO 2006030352 A2 WO2006030352 A2 WO 2006030352A2 IB 2005052936 W IB2005052936 W IB 2005052936W WO 2006030352 A2 WO2006030352 A2 WO 2006030352A2
Authority
WO
WIPO (PCT)
Prior art keywords
conductive layer
solder
metallic stiffener
hole
conductive
Prior art date
Application number
PCT/IB2005/052936
Other languages
French (fr)
Other versions
WO2006030352A3 (en
Inventor
Wouter Maes
Original Assignee
Arima Devices Corporation
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Arima Devices Corporation filed Critical Arima Devices Corporation
Publication of WO2006030352A2 publication Critical patent/WO2006030352A2/en
Publication of WO2006030352A3 publication Critical patent/WO2006030352A3/en

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/44—Manufacturing insulated metal core circuits or other insulated electrically conductive core circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0393—Flexible materials
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0302—Properties and characteristics in general
    • H05K2201/0305—Solder used for other purposes than connections between PCB or components, e.g. for filling vias or for programmable patterns
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/095—Conductive through-holes or vias
    • H05K2201/09554—Via connected to metal substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/095—Conductive through-holes or vias
    • H05K2201/09563—Metal filled via
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10954—Other details of electrical connections
    • H05K2201/10977—Encapsulated connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
    • H05K3/0061—Laminating printed circuit boards onto other substrates, e.g. metallic substrates onto a metallic substrate, e.g. a heat sink
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections

Definitions

  • the invention relates to an electronic device comprising a flexible printed circuit board having an electrically conductive layer on one side of the flexible board, and a conductive metallic stiffener which is attached to the flexible board, wherein said conductive layer is conductively connected to the metallic stiffener by means of solder.
  • the metallic stiffener must be made of a solderable material or coated with such a material.
  • the metallic stiffener is attached to the surface of the flexible board, or to a portion of this surface, by means of an adhesive layer which is present between the flexible board and the metallic stiffener. In some applications, it may be desirable to provide an electrically conductive connection between the metallic Stiffener and the conductive layer on the flexible board.
  • US-A-6,534,848 describes several manners of coupling a flexible board (substrate) to a metallic stiffener which is conductively connected to the electrically conductive layer on the flexible board.
  • the conductive layer on the flexible board faces the metallic stiffener and an adhesive layer is present in between.
  • a hole in the adhesive layer comprises a volume of solder, so that an electrically conductive connection between the metallic stiffener and the conductive layer is achieved.
  • the flexible board is provided with a through-hole in which the solder connecting the metallic stiffener with the conductive layer is present and through which the solder can be applied.
  • the connection by means of the solder can be applied when the flexible board is already attached to the metallic stiffener.
  • the solder can be applied in the through-hole, and a reliable reflow of the solder can take place within a short time.
  • a part of the surface of the conductive layer must be accessible for the solder. If the conductive layer faces the metallic stiffener, a portion of the surface of the conductive layer near the through-hole must therefore be free from the adhesive material.
  • said conductive layer is present on the side of the flexible board facing away from the metallic stiffener.
  • the flexible printed circuit board is preferably a single-sided board having only one electrically conductive layer at the side facing away from the metallic stiffener.
  • a single-sided flexible board can sometimes be used where a dual or multilayer design would be required.
  • the conductive layer is covered by a cover layer, wherein the hole in the cover layer has a larger diameter than the corresponding hole in the conductive layer.
  • a portion of the surface of the conductive layer around the edge of the hole is available for connection with the solder.
  • the hole in the material of the flexible board preferably has a larger diameter than the corresponding hole in the conductive layer.
  • the invention also relates to a method of attaching a flexible printed circuit board having an electrically conductive layer on one side of the flexible board to a conductive metallic stiffener, wherein solder is applied to conductively connect said conductive layer to the metallic stiffener, and the flexible board is provided with a through- hole, the solder for connecting the metallic stiffener with the conductive layer being applied in said through-hole after the flexible board has been attached to the metallic stiffener.
  • the invention will now be further elucidated by means of a description of an embodiment of the device according to the invention, having a structure comprising a flexible printed circuit board with an electrically conductive layer on one side of the flexible board and comprising a conductive metallic stiffener which is attached to the flexible printed circuit board.
  • Fig. 1 is a sectional view of a portion of the structure; and Fig. 2 is a sectional view taken on the line II-II in Figure 1.
  • Figures are schematic representations showing only the mutual relation of relevant parts of the structure.
  • Figure 1 shows a portion of a flexible plate-like substrate (layer 1 of an insulating material) comprising a layer 2 of electrically conductive material, for example, copper at one side (the upper side).
  • the layer 2 of conductive material is covered by a cover layer 3 of an insulating material.
  • These three layers 1,2,3 jointly form a single-sided flexible printed circuit board, a part of which is shown in Figures 1 and 2.
  • portions of the layer 2 of conductive material are etched away in order to create a certain pattern of the conductive material on the substrate 1.
  • Figure 2 is a sectional view taken on the line H-II, i.e. along a plane through the layer 2 of conductive material.
  • the conductive material in Figure 2 is indicated by the shaded area, showing an outer area 4, an inner area 5, and two parallel conductive paths 6,7, located between the outer area 4 and the inner area 5.
  • Figure 1 further shows a portion of a metallic stiffener 8, which is a rather thick metal plate. At least a part of the flexible board 1,2,3 is attached to the stiffener 8 by means of a layer 9 of adhesive material shown as a fat, solid line in Figure 1.
  • the stiffener 8 supports the flexible board 1,2,3 and reduces bending and other deformations of the flexible board.
  • a flexible printed circuit board may have a plurality of layers of conductive material, mutually separated by insulating layers, or only one layer 2 of conductive material as shown in the described structure.
  • the one or more conductive layers 2 comprise conductive paths 6,7 for electrically connecting electronic components such as chips, which may be attached to the flexible board.
  • the conductive layer 2 may also comprise conductive areas 4,5, for example, for shielding purposes. If a connection between the two conductive areas 4,5 is required, while the conductive areas 4,5 are separated by one or more conductive paths 6,7, an electrically conductive link outside the conductive layer 2 is required.
  • a conductive link can be established in an additional layer of conductive material on the flexible board. However, in the described structure, such a conductive link is established through the metallic stiffener 8, so that an additional conductive layer is not required.
  • the flexible board 1,2,3 is provided with a through-hole 10 at such a location that the conductive material of layer 2 is present on the inner surface of the through-hole 10.
  • the through-hole can be filled with solder which reflows in such a way that it makes contact with the surface of the stiffener 8 as well as with the material of area 4 of the conductive layer 2.
  • the surface of the stiffener 8 at the location of the through-hole 10 must be clean and free from adhesive material in order to ensure an appropriate electric connection between the stiffener 8 and the solder.
  • the diameter of the through-hole in the cover layer 3 and/or the diameter of the through-hole in the substrate 1 can be made larger than that of the through-hole in the conductive material of layer 2, as is shown in Figure 1. More surface of the conductive material of layer 2 is then available for contacting the solder during the reflow process.
  • the through-hole 10 in Figure 1 is located in area 4 of the conductive layer 2 and electrically connects area 4 of the conductive material 2 with the material of the metallic stiffener 8.
  • Area 4 can be electrically connected to area 5 of the conductive layer 2 through metallic stiffener 8 by providing a conductive connection between the metallic stiffener 8 and area 5.
  • Such a conductive connection can be made by means of another through-hole 11 (see Figure 2), similar to through-hole 10. It will be clear that the metallic stiffener 8 functions as a conductive bridge between the two areas 4,5 of layer 2.
  • the embodiment of the electronic device as described above is only an example; a great many other embodiments are possible.
  • the presence of an insulating cover layer 3 is not always required.

Abstract

An electronic device comprises a flexible, printed circuit board having an electrically conductive layer (2) on one side of the flexible board, and a conductive metallic stiffener (8) which is attached to the flexible board. Said conductive layer (2) is conductively connected to the metallic stiffener (8) by means of solder. The flexible board is provided with a through-hole (10), the solder connecting the metallic stiffener (8) with the conductive layer (2) being present in said through-hole (10).

Description

Electronic device comprising a flexible printed circuit board
The invention relates to an electronic device comprising a flexible printed circuit board having an electrically conductive layer on one side of the flexible board, and a conductive metallic stiffener which is attached to the flexible board, wherein said conductive layer is conductively connected to the metallic stiffener by means of solder. To this end, the metallic stiffener must be made of a solderable material or coated with such a material.
In order to reduce bending and other deformations of the flexible printed circuit board (hereinafter referred to as flexible board), the metallic stiffener is attached to the surface of the flexible board, or to a portion of this surface, by means of an adhesive layer which is present between the flexible board and the metallic stiffener. In some applications, it may be desirable to provide an electrically conductive connection between the metallic Stiffener and the conductive layer on the flexible board.
US-A-6,534,848 describes several manners of coupling a flexible board (substrate) to a metallic stiffener which is conductively connected to the electrically conductive layer on the flexible board. The conductive layer on the flexible board faces the metallic stiffener and an adhesive layer is present in between. A hole in the adhesive layer comprises a volume of solder, so that an electrically conductive connection between the metallic stiffener and the conductive layer is achieved. Although a reliable conductive connection can be obtained, the described structure has some disadvantages.
In order to provide an appropriate reflow of the solder, there must be one proper heat treatment of both the solder and the adhesive layer, so that the adhesive material cures, and at the same time the solder reflows correctly. For this reason, an appropriate adhesive material as well as a specific treatment must be applied. Furthermore, in order to apply the known method of connecting the flexible board to the metallic stiffener, the conductive layer must be located at the side of the flexible board where the metallic stiffener is present. Consequently, the known method can only be applied in certain structures. Moreover, after the conductive connection has been made by means of the solder, the solder cannot be removed in order to disconnect the conductive layer from the metallic stiffener, for example, for testing purposes.
It is an object of the invention to provide an electronic device, wherein the electrically conductive layer of the flexible printed circuit board is electrically connected to the metallic stiffener to which the flexible board is attached, and wherein one or more of the above disadvantages are avoided.
It is another object of the invention to provide an electronic device, wherein a standard reflow solder process can be applied to connect the stiffener with the electrically conductive layer of the flexible printed circuit board.
To achieve this object, the flexible board is provided with a through-hole in which the solder connecting the metallic stiffener with the conductive layer is present and through which the solder can be applied. The connection by means of the solder can be applied when the flexible board is already attached to the metallic stiffener. After the flexible board and the metallic stiffener have been attached to each other by means of the usual method and the usual adhesive material, the solder can be applied in the through-hole, and a reliable reflow of the solder can take place within a short time. Of course, a part of the surface of the conductive layer must be accessible for the solder. If the conductive layer faces the metallic stiffener, a portion of the surface of the conductive layer near the through-hole must therefore be free from the adhesive material.
In a preferred embodiment, said conductive layer is present on the side of the flexible board facing away from the metallic stiffener. Such a structure is not possible when applying the method according to US-A-6,534,848. However, depending on the design of the electronic device, such a structure may be required. Another advantage is the possibility of visible inspection of the connection between the solder and the conductive layer.
The flexible printed circuit board is preferably a single-sided board having only one electrically conductive layer at the side facing away from the metallic stiffener. When using the metallic stiffener for high-frequency grounding, a single-sided flexible board can sometimes be used where a dual or multilayer design would be required.
In another preferred embodiment, the conductive layer is covered by a cover layer, wherein the hole in the cover layer has a larger diameter than the corresponding hole in the conductive layer. A portion of the surface of the conductive layer around the edge of the hole is available for connection with the solder. The hole in the material of the flexible board preferably has a larger diameter than the corresponding hole in the conductive layer. By etching away a portion of the substrate material around the through-hole underneath the conductive layer, a part of the lower surface of the conductive layer is available for connection with the solder. In some designs, only one through-hole is sufficient to connect the conductive layer to the metallic stiffener. In more complex designs, it is preferred that a plurality of through-holes is present in the flexible board in order to connect different parts of the conductive layer with the metallic stiffener. In this way, the different parts of the conductive layer can be interconnected through the metallic stiffener. The invention also relates to a method of attaching a flexible printed circuit board having an electrically conductive layer on one side of the flexible board to a conductive metallic stiffener, wherein solder is applied to conductively connect said conductive layer to the metallic stiffener, and the flexible board is provided with a through- hole, the solder for connecting the metallic stiffener with the conductive layer being applied in said through-hole after the flexible board has been attached to the metallic stiffener.
The invention will now be further elucidated by means of a description of an embodiment of the device according to the invention, having a structure comprising a flexible printed circuit board with an electrically conductive layer on one side of the flexible board and comprising a conductive metallic stiffener which is attached to the flexible printed circuit board.
In the drawing,
Fig. 1 is a sectional view of a portion of the structure; and Fig. 2 is a sectional view taken on the line II-II in Figure 1.
The Figures are schematic representations showing only the mutual relation of relevant parts of the structure. Figure 1 shows a portion of a flexible plate-like substrate (layer 1 of an insulating material) comprising a layer 2 of electrically conductive material, for example, copper at one side (the upper side). The layer 2 of conductive material is covered by a cover layer 3 of an insulating material. These three layers 1,2,3 jointly form a single-sided flexible printed circuit board, a part of which is shown in Figures 1 and 2. Before the cover layer 3 is applied on the flexible board, portions of the layer 2 of conductive material are etched away in order to create a certain pattern of the conductive material on the substrate 1.
Figure 2 is a sectional view taken on the line H-II, i.e. along a plane through the layer 2 of conductive material. The conductive material in Figure 2 is indicated by the shaded area, showing an outer area 4, an inner area 5, and two parallel conductive paths 6,7, located between the outer area 4 and the inner area 5. Around area 4 and between the areas 4,5 and the parallel conductive paths 6,7, there is insulating material of the cover layer 3, which material is not shaded in Figure 2, although it is shown in a sectional view.
Figure 1 further shows a portion of a metallic stiffener 8, which is a rather thick metal plate. At least a part of the flexible board 1,2,3 is attached to the stiffener 8 by means of a layer 9 of adhesive material shown as a fat, solid line in Figure 1. The stiffener 8 supports the flexible board 1,2,3 and reduces bending and other deformations of the flexible board.
A flexible printed circuit board may have a plurality of layers of conductive material, mutually separated by insulating layers, or only one layer 2 of conductive material as shown in the described structure. The one or more conductive layers 2 comprise conductive paths 6,7 for electrically connecting electronic components such as chips, which may be attached to the flexible board. The conductive layer 2 may also comprise conductive areas 4,5, for example, for shielding purposes. If a connection between the two conductive areas 4,5 is required, while the conductive areas 4,5 are separated by one or more conductive paths 6,7, an electrically conductive link outside the conductive layer 2 is required. Of course, such a conductive link can be established in an additional layer of conductive material on the flexible board. However, in the described structure, such a conductive link is established through the metallic stiffener 8, so that an additional conductive layer is not required.
In order to electrically connect the material of conductive area 4 with the material of the stiffener 8, the flexible board 1,2,3 is provided with a through-hole 10 at such a location that the conductive material of layer 2 is present on the inner surface of the through-hole 10. After the flexible board 1,2,3 has been attached to the stiffener 8 by means of the adhesive layer 9, the through-hole can be filled with solder which reflows in such a way that it makes contact with the surface of the stiffener 8 as well as with the material of area 4 of the conductive layer 2. Of course, the surface of the stiffener 8 at the location of the through-hole 10 must be clean and free from adhesive material in order to ensure an appropriate electric connection between the stiffener 8 and the solder. In order to ensure an appropriate electric contact between the conductive material of layer 2 and the solder, the diameter of the through-hole in the cover layer 3 and/or the diameter of the through-hole in the substrate 1 can be made larger than that of the through-hole in the conductive material of layer 2, as is shown in Figure 1. More surface of the conductive material of layer 2 is then available for contacting the solder during the reflow process.
The through-hole 10 in Figure 1 is located in area 4 of the conductive layer 2 and electrically connects area 4 of the conductive material 2 with the material of the metallic stiffener 8. Area 4 can be electrically connected to area 5 of the conductive layer 2 through metallic stiffener 8 by providing a conductive connection between the metallic stiffener 8 and area 5. Such a conductive connection can be made by means of another through-hole 11 (see Figure 2), similar to through-hole 10. It will be clear that the metallic stiffener 8 functions as a conductive bridge between the two areas 4,5 of layer 2.
The embodiment of the electronic device as described above is only an example; a great many other embodiments are possible. For example, there may be only one through-hole for connecting one location of the conductive layer 2 with the metallic stiffener 8. The presence of an insulating cover layer 3 is not always required. There may also be more than one conductive layer in the flexible printed circuit board, with only one or even more conductive layers being conductively connected with the stiffener.

Claims

CLAIMS:
1. An electronic device comprising a flexible printed circuit board having an electrically conductive layer (2) on one side of the flexible board, and a conductive metallic stiffener (8) which is attached to the flexible board, wherein said conductive layer (2) is conductively connected to the metallic stiffener (8) by means of solder and wherein the flexible board is provided with a through-hole (10), the solder connecting the metallic stiffener (8) with the conductive layer (2) being present in said through-hole (10).
2. An electronic device as claimed in claim 1, wherein said conductive layer (2) is present on the side of the flexible board facing away from the metallic stiffener (8).
3. An electronic device as claimed in any one of the preceding claims, wherein the flexible printed circuit board is a single-sided board having only one electrically conductive layer (2).
4. An electronic device as claimed in any one of the preceding claims, wherein the conductive layer (2) is covered by a cover layer (3), and wherein the hole (10) in the cover layer (3) has a larger diameter than the corresponding hole (10) in the conductive layer (2).
5. An electronic device as claimed in any one of the preceding claims, wherein the hole (10) in the material of the flexible board has a larger diameter than the corresponding hole in the conductive layer (2).
6. An electronic device as claimed in any one of the preceding claims, wherein a plurality of through-holes (10,11) is present in the flexible board.
7. A method of attaching a flexible printed circuit board having an electrically conductive layer (2) on one side of the flexible board to a conductive metallic stiffener (8), wherein solder is applied to conductively connect said conductive layer (2) to the metallic stiffener (8), and wherein the flexible board is provided with a through-hole (10), the solder for connecting the metallic stiffener (8) with the conductive layer (2) being applied in said through-hole (8) after the flexible board has been attached to the metallic stiffener (8).
PCT/IB2005/052936 2004-09-13 2005-09-08 Electronic device comprising a flexible printed circuit board conductively connected to a metallic stiffener by means of solder WO2006030352A2 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
EP04104416.5 2004-09-13
EP04104416 2004-09-13

Publications (2)

Publication Number Publication Date
WO2006030352A2 true WO2006030352A2 (en) 2006-03-23
WO2006030352A3 WO2006030352A3 (en) 2006-07-27

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PCT/IB2005/052936 WO2006030352A2 (en) 2004-09-13 2005-09-08 Electronic device comprising a flexible printed circuit board conductively connected to a metallic stiffener by means of solder

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WO (1) WO2006030352A2 (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI401450B (en) * 2010-01-11 2013-07-11 Zhen Ding Technology Co Ltd Method for testing flexible printed circuit board
TWI507119B (en) * 2010-07-16 2015-11-01 Zhen Ding Technology Co Ltd Flexible printed circuit board and method for manufacturing the same
US9474154B2 (en) 2014-07-18 2016-10-18 Starkey Laboratories, Inc. Reflow solderable flexible circuit board — to — flexible circuit board connector reinforcement

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6172307B1 (en) * 1993-03-01 2001-01-09 Motorola, Inc. Feedthrough via connection on solder resistant layer
US20030034174A1 (en) * 2000-05-26 2003-02-20 Zhong-You Shi Circuit board and a method for making the same
US6534848B1 (en) * 2000-09-07 2003-03-18 International Business Machines Corporation Electrical coupling of a stiffener to a chip carrier
EP1376778A2 (en) * 2002-06-25 2004-01-02 Motorola, Inc. Ground connector assembly with substrate strain relief and method of making the same
US6700748B1 (en) * 2000-04-28 2004-03-02 International Business Machines Corporation Methods for creating ground paths for ILS
DE10335805A1 (en) * 2003-08-05 2005-03-17 Schweizer Electronic Ag Circuit board with metal base forming potential reference plane and heat sink for power-dissipating components, includes both electrical and thermal vias for heat dissipation

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6172307B1 (en) * 1993-03-01 2001-01-09 Motorola, Inc. Feedthrough via connection on solder resistant layer
US6700748B1 (en) * 2000-04-28 2004-03-02 International Business Machines Corporation Methods for creating ground paths for ILS
US20030034174A1 (en) * 2000-05-26 2003-02-20 Zhong-You Shi Circuit board and a method for making the same
US6534848B1 (en) * 2000-09-07 2003-03-18 International Business Machines Corporation Electrical coupling of a stiffener to a chip carrier
EP1376778A2 (en) * 2002-06-25 2004-01-02 Motorola, Inc. Ground connector assembly with substrate strain relief and method of making the same
DE10335805A1 (en) * 2003-08-05 2005-03-17 Schweizer Electronic Ag Circuit board with metal base forming potential reference plane and heat sink for power-dissipating components, includes both electrical and thermal vias for heat dissipation

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI401450B (en) * 2010-01-11 2013-07-11 Zhen Ding Technology Co Ltd Method for testing flexible printed circuit board
TWI507119B (en) * 2010-07-16 2015-11-01 Zhen Ding Technology Co Ltd Flexible printed circuit board and method for manufacturing the same
US9474154B2 (en) 2014-07-18 2016-10-18 Starkey Laboratories, Inc. Reflow solderable flexible circuit board — to — flexible circuit board connector reinforcement

Also Published As

Publication number Publication date
TW200623996A (en) 2006-07-01
WO2006030352A3 (en) 2006-07-27

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