WO2006021130A1 - Improved sn-0.7wt%cu lead-free solder - Google Patents

Improved sn-0.7wt%cu lead-free solder Download PDF

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Publication number
WO2006021130A1
WO2006021130A1 PCT/CN2004/001025 CN2004001025W WO2006021130A1 WO 2006021130 A1 WO2006021130 A1 WO 2006021130A1 CN 2004001025 W CN2004001025 W CN 2004001025W WO 2006021130 A1 WO2006021130 A1 WO 2006021130A1
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Prior art keywords
solder
lead
free solder
present
improved
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PCT/CN2004/001025
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French (fr)
Chinese (zh)
Inventor
Minghan Cheng
Liesong Cai
Xiangping Chen
Yue Zhao
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Minghan Cheng
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Publication of WO2006021130A1 publication Critical patent/WO2006021130A1/en

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C

Definitions

  • the present invention relates to a Sn-0.7 wt% C U lead-free solder. Background technique
  • Sn-0.7 wt% Cu solder has a melting point of 227 ⁇ of Sn-Cu eutectic.
  • solder joint is rough and not bright, the solderability, the diffusivity is poor, and the liquid is easily oxidized, which affects the further application of the material.
  • the object of the present invention is to provide an improved Sn-0.7wt which is excellent in the brightness and fineness of the solder joint surface, high in the diffusion rate of the solder alloy, and excellent in oxidation resistance of the solder surface, overcoming the above-mentioned deficiency of the conventional Sn-0.7 wt% Cu lead-free solder. %Cu lead-free solder.
  • a modified Sn-0.7wt% Cu lead-free solder characterized by adding 0.001 to 1.5 wt% to the Sn-0.7 wt% Cu lead-free material. Ti element.
  • 0.0001 to 0.8% by weight of any one of Li, Na, K, Rb or Cs is added to the addition of 0.001 to 1.5% by weight of lanthanum.
  • the present invention Compared with the conventional Sn-0.7wt% C U lead-free solder, the present invention has the following technical effects:
  • the diffusion rate of the solder alloy can be increased by 5%.
  • the diffusion rate of the solder can be further increased by 8-10%. .
  • solder with Ti element At 240 ⁇ 270°C, the surface of the solder has excellent oxidation resistance, compared with when no Ti or ⁇ + alkaline element is used (for example, K). The liquid surface of the 0.7 wt% Cu alloy quickly appeared as a large number of oxide layers from light yellow to dark brown.
  • the lead-free solder of the present invention is prepared by strictly controlling Ti and alkaline elements (for example, K). Content, the process is to prepare a uniform intermediate alloy, prepare Cu-20 wt% Ti master alloy (eutectic point: about 880 ° C) and Sn- (l ⁇ 3) wt% K intermediate alloy, two intermediate alloy preparation After that, the chemical composition of the composition is first analyzed to determine the exact content of Ti, K, and the like. According to the actual requirements of the alloy, the actual content of the elements Cu, Ti and K is analyzed after the preparation of the alloy solder, and then various performance tests are carried out.
  • Example 1 Sn-0.7 wt% Cu-0.05 wt% Ti
  • Example 2 Sn-0.7 wt% Cu-0.05 wt% Ti-0.05 wt% K Comparison of performance of Examples 1, 2 and Comparative Examples of the present invention
  • Corrosive medium NaC1 5wt% + H 2 0, 200h, 35 °C
  • the lead-free solder of the present invention is Sn-0.7 wt% Cu-(0.001 ⁇ 1.5) wt% Ti or Sn-0.7 wt% Cu-(0.001 ⁇ 1.5) wt% Ti-(0.0001 ⁇ 0.8) wt%K and common Compared with Sn-0.7 wt%Cu solder alloy, the performance is greatly improved.
  • the Sn-0.7 wt% Cu-(0.001 ⁇ 1.5) wt% Ti-(0.0001 ⁇ 0.8) wt%K solder of the present invention is excellent in solder matching, and can be applied to hot air leveling of PCB and wave soldering of THT, respectively.

Abstract

The present invention relates to an improved Sn-0.7wt%Cu lead-free solder, which further comprises 0.001-1.5wt% of Ti, and 0.0001-0.8wt% of anyone basic element chosen from Li, Na, K, Rb or Cs based on the Sn-0.7wt%Cu lead-free solder. In contrast to traditional Sn-0.7wt%Cu lead-free solders, the present solder has better surface brightness and fineness of joints, higher diffusivity of solder alloy, and better oxidation resistance of the solder surface.

Description

一种改进型 Sn-0.7wt%Cu无铅焊料 技术领域  Improved Sn-0.7wt%Cu lead-free solder
本发明涉及一种 Sn-0.7wt%CU无铅焊料。 背景技术 The present invention relates to a Sn-0.7 wt% C U lead-free solder. Background technique
Sn-0.7wt%Cu焊料熔点为 227Ό的 Sn-Cu共晶。 目前， 它被人们选择为无铅 焊接材料之一。 然而就其特性而言， 它存在许多的不够理想之处， 比如： 焊点外 观粗糙不光亮， 可焊性、 扩散率差， 液态下易于氧化等， 影响了该悍料的进一步 应用。  Sn-0.7 wt% Cu solder has a melting point of 227 Å of Sn-Cu eutectic. Currently, it has been chosen as one of the lead-free solder materials. However, in terms of its characteristics, it has many unsatisfactory features, such as: the solder joint is rough and not bright, the solderability, the diffusivity is poor, and the liquid is easily oxidized, which affects the further application of the material.
发明内容 Summary of the invention
本发明的目的在于克服上述普通 Sn-0.7wt%Cu无铅焊料的不足而提供一种 焊点表面光亮和细腻、 焊料合金的扩散率高、 焊料表面抗氧化性优良的改进型 Sn-0.7wt%Cu无铅焊料。  SUMMARY OF THE INVENTION The object of the present invention is to provide an improved Sn-0.7wt which is excellent in the brightness and fineness of the solder joint surface, high in the diffusion rate of the solder alloy, and excellent in oxidation resistance of the solder surface, overcoming the above-mentioned deficiency of the conventional Sn-0.7 wt% Cu lead-free solder. %Cu lead-free solder.
本发明的目的是通过下述技术方案予以实现： 一种改进型 Sn-0.7wt%Cu无 铅焊料，其特征在于在 Sn-0.7wt%Cu无铅悍料中添加有 0.001~1.5wt%的 Ti元素。  The object of the present invention is achieved by the following technical solution: A modified Sn-0.7wt% Cu lead-free solder characterized by adding 0.001 to 1.5 wt% to the Sn-0.7 wt% Cu lead-free material. Ti element.
作为本发明的进一步改进， 在添加有 0.001~1.5wt%的 Ή元素的基础上还添 加有 0.0001~0.8wt%的 Li、 Na、 K、 Rb或 Cs中的任意一种碱性元素。  As a further improvement of the present invention, 0.0001 to 0.8% by weight of any one of Li, Na, K, Rb or Cs is added to the addition of 0.001 to 1.5% by weight of lanthanum.
与普通的 Sn-0.7wt%CU无铅焊料相比， 本发明具有以下技术效果： Compared with the conventional Sn-0.7wt% C U lead-free solder, the present invention has the following technical effects:
K加入合适含量的 Ti元素后， 使悍点表面出现了十分光亮和极其细腻的结 晶效果。  When K is added with a suitable amount of Ti element, a very bright and extremely fine crystallization effect appears on the surface of the defect.
2、 加入合适含量的 Ti元素后， 焊料合金的扩散率可提高 5%， 在该基础上 再加入微量碱性元素 （以 K为例） 后， 可进一步提高焊料的扩散率达 8-10%。  2. After adding a suitable amount of Ti element, the diffusion rate of the solder alloy can be increased by 5%. On the basis of adding a trace amount of basic elements (for example, K), the diffusion rate of the solder can be further increased by 8-10%. .
3、 加有 Ti元素的焊料， 在温度 240~270°C下， 焊料表面有十分优良的抗氧 化性， 与不加 Ti或 Ή+碱性元素 （以 K为例） 时相比， Sn-0.7 wt%Cu合金的液 态表面很快就出现由浅黄变成深棕的大量氧化层。  3. Solder with Ti element. At 240~270°C, the surface of the solder has excellent oxidation resistance, compared with when no Ti or Ή+ alkaline element is used (for example, K). The liquid surface of the 0.7 wt% Cu alloy quickly appeared as a large number of oxide layers from light yellow to dark brown.
体实施方式  Body embodiment
本发明的无铅焊料制备时重点在于严格控制 Ti及碱性元素 （以 K为例） 的 含量，工艺上采用先制备均匀的中间合金，配制 Cu-20 wt%Ti中间合金（共晶点： 约 880°C ) 和 Sn-(l~3)wt%K中间合金， 两种中间合金制备后， 先经成分化学分 析， 确立 Ti、 K等的准确含量。 按合金实际要求含量加入， 合金焊料制备后进行 元素 Cu、 Ti、 K的实际含量分析， 然后进行各项有关性能测试。 The lead-free solder of the present invention is prepared by strictly controlling Ti and alkaline elements (for example, K). Content, the process is to prepare a uniform intermediate alloy, prepare Cu-20 wt% Ti master alloy (eutectic point: about 880 ° C) and Sn- (l ~ 3) wt% K intermediate alloy, two intermediate alloy preparation After that, the chemical composition of the composition is first analyzed to determine the exact content of Ti, K, and the like. According to the actual requirements of the alloy, the actual content of the elements Cu, Ti and K is analyzed after the preparation of the alloy solder, and then various performance tests are carried out.
实施例 1： Sn-0.7 wt%Cu-0.05 wt%Ti  Example 1: Sn-0.7 wt% Cu-0.05 wt% Ti
实施例 2: Sn-0.7 wt%Cu-0.05 wt%Ti-0.05 wt%K 本发明实施例 1、 2与比较例性能比较  Example 2: Sn-0.7 wt% Cu-0.05 wt% Ti-0.05 wt% K Comparison of performance of Examples 1, 2 and Comparative Examples of the present invention
Figure imgf000003_0001
本发明实施例 1、 2与比较例抗腐蚀性能比较
Figure imgf000003_0001
Comparison of corrosion resistance performance of Examples 1, 2 and Comparative Examples of the present invention
Figure imgf000003_0002
Figure imgf000003_0002
▲ ： 腐蚀介质： NaC1 5wt% + H20， 200h, 35 °C ▲ : Corrosive medium: NaC1 5wt% + H 2 0, 200h, 35 °C
试验结果表明：  The results showed that:
本 发 明 的 无 铅 焊 料 Sn- 0.7 wt%Cu-(0.001~l .5)wt%Ti 或 Sn-0.7 wt%Cu-(0.001~1.5) wt%Ti-(0.0001~0.8)wt%K与普通 Sn-0.7 wt%Cu焊料合金相 比， 性能有很大提高。  The lead-free solder of the present invention is Sn-0.7 wt% Cu-(0.001~1.5) wt% Ti or Sn-0.7 wt% Cu-(0.001~1.5) wt% Ti-(0.0001~0.8) wt%K and common Compared with Sn-0.7 wt%Cu solder alloy, the performance is greatly improved.
本发明的 Sn-0.7 wt%Cu-(0.001~1.5) wt%Ti-(0.0001~0.8)wt%K焊料匹配优良 的焊剂， 分别可以应用于 PCB的热风整平和 THT的波峰焊中。  The Sn-0.7 wt% Cu-(0.001~1.5) wt% Ti-(0.0001~0.8) wt%K solder of the present invention is excellent in solder matching, and can be applied to hot air leveling of PCB and wave soldering of THT, respectively.

Claims

权 利 要 求 Rights request
1、 一种改进型 Sn-0.7wt%Cu无铅焊料， 其特征在于在 Sn-0.7wt%Cu无铅焊 料中添加有 0.001~1.5wt%的 Ti元素。  A modified Sn-0.7 wt% Cu lead-free solder characterized in that 0.001 to 1.5 wt% of Ti element is added to a Sn-0.7 wt% Cu lead-free solder.
2、 根据权利要求 1所述的一种改进型 Sn-0.7wt%Cu无铅焊料， 其特征在于 还添加有 0.0001~0.8wt%的 Li、 Na、 K、 Rb或 Cs中的任意一种碱性元素。  2. A modified Sn-0.7 wt% Cu lead-free solder according to claim 1, characterized in that 0.001 to 0.8 wt% of any one of Li, Na, K, Rb or Cs is further added. Sex element.
PCT/CN2004/001025 2004-08-24 2004-09-07 Improved sn-0.7wt%cu lead-free solder WO2006021130A1 (en)

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CN 200410051200 CN1269613C (en) 2004-08-24 2004-08-24 Improved Sn-0.7 wt% Cu lead-free welding flux

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Cited By (3)

* Cited by examiner, † Cited by third party
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KR100903026B1 (en) * 2007-04-12 2009-06-16 중앙대학교 산학협력단 Leed-free alloy for soldering
CN104588911A (en) * 2014-12-11 2015-05-06 徐国华 Lead-free solder and preparation method thereof
CN104588910A (en) * 2014-12-11 2015-05-06 徐国华 Lead-free solder with praseodymium, cesium, zinc and tin and preparation method thereof

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US7749336B2 (en) 2005-08-30 2010-07-06 Indium Corporation Of America Technique for increasing the compliance of tin-indium solders
JP4569423B2 (en) * 2005-08-31 2010-10-27 株式会社日立製作所 Manufacturing method of semiconductor device
US9260768B2 (en) 2005-12-13 2016-02-16 Indium Corporation Lead-free solder alloys and solder joints thereof with improved drop impact resistance
CN101244492B (en) * 2008-03-21 2011-05-04 天津市松本环保科技有限公司 Lead-free solder wire containing soldering fluid and method for manufacturing soldering fluid
CN102476251A (en) * 2010-11-25 2012-05-30 中国科学院金属研究所 Sn-Cu lead-free welding flux capable of resisting atmospheric corrosion
CN101987402B (en) * 2010-11-30 2012-09-05 哈尔滨工业大学 Method for brazing Ti2AlC ceramics and Cu with Cu-Sn-Ti solder
CN104353840B (en) * 2014-11-25 2017-11-03 北京康普锡威科技有限公司 A kind of LED inexpensive lead-free solder alloy powders and preparation method thereof
CN104526180A (en) * 2014-12-11 2015-04-22 徐国华 Lead-free solder containing cerium, rubidium and zinc and preparation method thereof
CN104607817A (en) * 2014-12-11 2015-05-13 徐国华 Lanthanum, selenium, cesium, zinc and tin alloy solder and preparation method thereof
CN107309574B (en) * 2017-06-20 2020-09-01 华北水利水电大学 High-strength silver-based brazing filler metal containing graphene and smelting method thereof

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JP2002076029A (en) * 2000-08-25 2002-03-15 Hitachi Ltd Solder material and semiconductor device and electronic device using the material
CN1442272A (en) * 2003-04-11 2003-09-17 深圳市亿铖达工业有限公司 Leadless soft brazing alloy for wave crest soldering

Patent Citations (4)

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Publication number Priority date Publication date Assignee Title
JP2000190090A (en) * 1998-12-21 2000-07-11 Senju Metal Ind Co Ltd Lead free solder
JP2001358458A (en) * 2000-06-12 2001-12-26 Hitachi Ltd Electronic equipment having lead-free solder connection
JP2002076029A (en) * 2000-08-25 2002-03-15 Hitachi Ltd Solder material and semiconductor device and electronic device using the material
CN1442272A (en) * 2003-04-11 2003-09-17 深圳市亿铖达工业有限公司 Leadless soft brazing alloy for wave crest soldering

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100903026B1 (en) * 2007-04-12 2009-06-16 중앙대학교 산학협력단 Leed-free alloy for soldering
CN104588911A (en) * 2014-12-11 2015-05-06 徐国华 Lead-free solder and preparation method thereof
CN104588910A (en) * 2014-12-11 2015-05-06 徐国华 Lead-free solder with praseodymium, cesium, zinc and tin and preparation method thereof

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CN1269613C (en) 2006-08-16

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