WO2006012435A2 - Machine bras transfert a inspection amelioree - Google Patents

Machine bras transfert a inspection amelioree Download PDF

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Publication number
WO2006012435A2
WO2006012435A2 PCT/US2005/025905 US2005025905W WO2006012435A2 WO 2006012435 A2 WO2006012435 A2 WO 2006012435A2 US 2005025905 W US2005025905 W US 2005025905W WO 2006012435 A2 WO2006012435 A2 WO 2006012435A2
Authority
WO
WIPO (PCT)
Prior art keywords
inspection
workpiece
component
placement
component placement
Prior art date
Application number
PCT/US2005/025905
Other languages
English (en)
Other versions
WO2006012435A3 (fr
Inventor
John D. Gaida
Paul R. Haugen
Original Assignee
Cyberoptics Corporation
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Cyberoptics Corporation filed Critical Cyberoptics Corporation
Priority to DE112005001716T priority Critical patent/DE112005001716T5/de
Priority to JP2007522761A priority patent/JP2008507699A/ja
Publication of WO2006012435A2 publication Critical patent/WO2006012435A2/fr
Publication of WO2006012435A3 publication Critical patent/WO2006012435A3/fr

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/08—Monitoring manufacture of assemblages
    • H05K13/081—Integration of optical monitoring devices in assembly lines; Processes using optical monitoring devices specially adapted for controlling devices or machines in assembly lines
    • H05K13/0815—Controlling of component placement on the substrate during or after manufacturing

Definitions

  • Electronic assembly machines also known as pick and place machines, are generally used to manufacture electronic circuit boards.
  • a blank printed circuit board is usually supplied to the pick and place machine, which then picks electronic components from component feeders, and places such components upon the board.
  • the components are held upon the board temporarily by solder paste, or adhesive, until a subsequent step in which the solder paste is melted or the adhesive is fully cured.
  • Fully or partially populated boards are generally inspected after the placement operation(s) , both before and after solder reflow, to identify components that are improperly placed or missing or any of a variety of errors that may occur.
  • Automatic systems that perform such operation(s) are highly useful because they help identify component placement problems prior to solder reflow. This allows substantially easier rework and/or the identification of defective boards after reflow that are candidates for rework.
  • Model KS Flex available from CyberOptics Corporation of Golden Valley, Minnesota. This system can be used to identify such problems as alignment and rotation errors; missing and flipped components; billboards; tombstones; component defects; incorrect polarity; and wrong components.
  • first article inspection After adjustment to the pick and place machine, several more workpieces are assembled and inspected to verify that the causes for failures were corrected. Often, it takes several cycles of adjustment and inspection until the pick and place machine reliably places all components on the workpiece. Since the current state of the art for "first article” board inspection requires expensive automatic optical inspection machines or human inspectors, the inspection does not occur until the board is fully assembled and reflowed. The results of this process are a long delay to setup a circuit board production line for a new product and the generation of expensive scrap in the form of inoperable circuit boards.
  • the amount of time required for first article inspection ranges from 5 minutes to 5 hours depending on the complexity of the verification. Typical duration of the first article inspection process is about 30 minutes. These delays increase the complexity of changing a manufacturing line over to a new product, as well as adding cost to the manufactured boards.
  • Embodiments of the present invention provide correlation between positional information relative to the workpiece and inspection information acquired relative to the workpiece. This correlation helps a user or technician quickly identify the physical location, on the workpiece, to which the inspection information pertains. Component inspection information can then be provided to an operator along with an indication of a position of the inspected component on the workpiece.
  • Fig. 1 is a diagrammatic view of a Cartesian pick and place machine with which embodiments of the invention can be practiced.
  • Fig. 2 is a diagrammatic plan view of a turret pick and place machine with which embodiments of the invention can be practiced.
  • Fig. 3 is simplified diagrammatic view of an image acquisition system aligned with the placement point of a component placement machine.
  • Fig. 4 is a diagrammatic view of a pick and place machine with an attached image viewer disposed to display images and data of placement operations.
  • Fig. 5 is a block diagram of an embedded inspection system providing position correlated inspection information in accordance with an embodiment of the present invention.
  • Fig. 6 is a block diagram of an embedded inspection system providing position correlated inspection information in accordance with another embodiment of the present invention.
  • Fig. 7 is a flow diagram of a method of performing embedded component inspection in an electronics assembly machine in accordance with an embodiment of the present invention.
  • Fig. 1 is a diagrammatic view of an exemplary Cartesian pick and place machine 201 with which embodiments of the present invention are applicable.
  • Pick and place machine 201 receives a workpiece, such as circuit board 203, via transport system or conveyor 202.
  • a placement head 206 then obtains one or more electrical components to be mounted upon workpiece 203 from component feeders (not shown) and undergoes relative motion with respect to the workpiece in x, y and z directions to place the component in the proper orientation at the proper location upon workpiece 203.
  • Placement head 206 may include an alignment sensor 200 that may pass under components held by nozzles 210 as placement head 206 moves the component (s) from pickup locations to placement locations.
  • Sensor 200 allows placement machine 201 to view undersides of components held by nozzles 210 such that component orientation and, to some degree, component inspection can be effected while the component is being moved from the component pick-up location to the placement location.
  • Other pick and place machines may employ a placement head that moves over a stationary camera to image the component.
  • Placement head 206 may also include a downwardly- looking camera 209, which is generally used to locate fiducial marks upon workpiece 203 such that the relative location of placement head 206 with respect to workpiece 203 can be readily calculated.
  • Fig. 2 is a diagrammatic view of an exemplary rotary turret pick and place machine 10 with which embodiments of the present invention are applicable.
  • System 10 includes some components that are similar to machine 201 and like components are numbered similarly.
  • the workpiece 203 is loaded via a conveyor onto an x-y stage (not shown) .
  • Placement nozzles 210 are attached to main turret 20 and are disposed at regular angular intervals around the rotating turret .
  • the turret indexes an angular distance equal to the angular distance between adjacent placement nozzles 210.
  • a placement nozzle 210 obtains a component 104 from a component feeder 14 at a defined pick point 16. During this same interval, another nozzle 210 places a component 104 onto the workpiece 203 at a preprogrammed placement location 106. Additionally, while turret 20 pauses for the pick and place operation, an upward-looking camera 30 acquires and image of another component 104, which provides alignment information for that component. This alignment information is used by pick and place machine 10 to position workpiece 203 when the corresponding placement nozzle is positioned several steps later to place the component. After the pick and place cycle is complete, turret 20 indexes to the next angular position and workpiece 203 is repositioned in the x-y direction to move the placement location to a position that corresponds to the placement location 106.
  • setup parameters that generally need to be determined:
  • an operator typically follows a procedure to load feeders into proper locations, load nozzles in a cassette, and assemble several workpieces using the appropriate placement program. After the first workpiece or group of workpieces is assembled, the operator inspects each workpiece using visual means or using an automatic optical inspection system. If an error is found, the cause of the error is investigated and corrective action is implemented. After the corrective action is implemented, another group of workpieces is assembled and inspected. This cycle of assembly, inspection and corrective actions is repeated until the operator determines the pick and place machine is ready for production. If first article inspection is performed inside ⁇ the pick and place machine, the operator is provided with real-time feedback relative to problems occurring during the placement operation. Using this real-time feedback, problems with the setup of the pick and place machine can be diagnosed and corrected quickly before the entire board is completed, thereby reducing scrap.
  • Fig. 3 is a diagrammatic view of a placement head in accordance with embodiments of the present invention.
  • Fig. 3 illustrates an image acquisition device 100 disposed to acquire images of placement location 106 of component 104 before and after the component 104 is deposited by nozzle 210 upon location 106.
  • Device 100 obtains images of placement location 106 on workpiece 203 prior to placement of component 104 and then shortly thereafter. A comparison of these before and after images facilitates component-level placement inspection and verification.
  • the area surrounding the component placement location 106 is also imaged.
  • the device 100 Since acquisition of images of the placement location is generally done when the nozzle, such as nozzle 210, holds the component 104 above the placement location, it is important to be able to image placement location 106 while minimizing or reducing interference from the component itself or adjacent components which may be already mounted upon the workpiece.
  • the device 100 employ an optical axis allowing views that are inclined at an angle ⁇ with respect to the plane of workpiece 203.
  • An additional advantage of having the device 100 inclined at an angle ⁇ is that vertical motion of the workpiece can be detected and measured by determining the translation of the workpiece between image acquisitions.
  • the second image should be timed properly to acquire an image at a pre-selected time during the placement cycle.
  • Embodiments of the present invention generally obtain two or more successive images of the intended placement location (i.e. before placement and after) . Since placement occurs relatively quickly, and since slowing machine throughput is extremely undesirable, it is sometimes necessary to acquire two successive images very quickly since cessation of the relative motion between the placement head and the board is fleeting. For example, it may be necessary to acquire two images within a period of approximately 10 milliseconds.
  • Rapid acquisition of multiple successive images can be done in different ways.
  • One way is using commercially available CCD devices and operating them in a non-standard manner to acquire images at a rate faster than can be read from the device. Further details, regarding this image acquisition technique can be found in United States Patent 6,549,647, assigned to the Assignee of the present invention.
  • Yet another way to rapidly acquire multiple successive images is to use multiple CCD arrays arranged to view the intended placement location through common optics.
  • Embedded placement machine inspection systems improve upon component level inspections performed by pick and place machines. Such improvements include providing first article inspection in pick and place machine by collecting images of the placement event inside the machine, processing those images, and identifying errors as they happen. By providing a means to display this information as it is generated on the machine, the operator can take prompt and effective corrective actions.
  • Fig. 4 shows one embodiment of this invention. For this embodiment of the invention, a processor 222 and a monitor 220 are mounted on pick and place machine 10.
  • the location of the monitor 220 is chosen to provide the machine's operator with images and data gathered from the image acquisition system 100 shortly after the placement event. With images and data available to the operator during the assembly of the first board of a production run, the operator is able to make setup changes to the pick and place machine quicker than current practice.
  • Embodiments of the present invention generally focus upon obtaining workpiece positional information (such as x and y coordinate information) when such information cannot be readily obtained from an electronic assembly machine's control system.
  • Embodiments of the present invention can be employed to facilitate expeditious operator intervention with respect to machine setup and/or operation.
  • Placement information that is gathered by the embedded machine inspection system can contain positional information (preferably X and Y coordinates) of the workpiece corresponding to the vision system's collected images. Knowing where the errors are occurring reduces rework time since the operator is able to quickly find the relevant physical location(s) on the workpiece.
  • the component placement inspection results are correlated with positional information obtained from the control system of the pick and place machine.
  • Fig. 5 is a block diagram of an embedded inspection system providing position correlated inspection information in accordance with an embodiment of the present invention.
  • Embedded inspection system 300 includes an image acquisition device, such as camera 309, coupled to image and data processing system 302 such that system 302 receives images from camera 309.
  • image acquisition device such as camera 309
  • data processing system 302 such that system 302 receives images from camera 309.
  • the X and Y coordinates for each image are sent to system 302 via one or more position sensitive devices 311.
  • Position sensitive devices 311 include any suitable device that is able to provide an electronic indication relative to position.
  • One commercially available position sensitive device is sold under the trade designation Model GP2YDA02YK available from Sharp. Similar devices are also available from Banner Engineering, of Plymouth, Minnesota; Omron; and Keyence of Higashi-Nakaji ⁇ ia, Japan.
  • Each of PSDs 311 preferably provides positional information, such as measuring X or Y displacement of the workpiece as the workpiece moves within a pick and place machine.
  • the embedded inspection system 300 records the positional information such that it can be correlated with individual component inspection results.
  • embedded inspection system can provide individual component inspection results along with the actual position of the component inspected. This can be done by displaying an image of the workpiece to the operator and highlighting, or otherwise annunciating the position of the inspection in the image. Additionally, the highlighting or annunciation can be tailored to be somewhat indicative of overall inspection results.
  • a component that failed inspection may be displayed with a red-tint highlighting it, while a different component that passed inspection may have a green tint over it.
  • the operator can select the highlighted region to obtain more specific or complete component inspection information.
  • Fig. 5 illustrates multiple single axis position sensitive devices, embodiments of the present invention can also be practiced with a single position sensitive device that provides information relative to multiple axes.
  • Fig. 6 is a block diagram of an embedded inspection system providing position correlated inspection information in accordance with another embodiment of the present invention.
  • System 400 is similar to system 300 and like components are numbered similarly.
  • Embedded inspection system 400 includes image acquisition device, such as camera 309, coupled to image and data processing system 302.
  • System 302 receives images from device 309. As image acquisition device 309 collects component placement images occurring on workpiece 310, positional information
  • camera (s) 412 can include commercially available and/or publicly known devices that provide indications of motion. Such devices are sometimes used in optical mice. Examples of suitable devices for use as camera 412 include those disclosed in United States Patents 6,281,882;
  • System 400 acquires X and Y coordinate information from two-dimensional camera
  • system 400 which measures the displacement of workpiece 410 as workpiece 310 moves within the electronic assembly machine. As each component inspection is completed, system 400 reads the positional information of the workpiece and stores the positional information as well as data indicative of a relationship between the positional information and the component inspection results. Then, system 400 can report individual component inspection results along with an indication of the physical location on the workpiece where the inspection took place.
  • device 412 employ technology currently found in optical mice. Further, it is preferred that device 412 employ a light-emitting diode, CMOS detector, and a digital signal processor (DSP) that provides data indicative of motion observed by device
  • DSP digital signal processor
  • Fig. 7 is a flow diagram of a method of performing embedded component inspection in an electronics assembly machine in accordance with an embodiment of the present invention.
  • Method 500 can be performed to facilitate machine setup as well as machine operation. Essentially, anytime a component is inspected, positional information can be obtained relative to the location of the component on the workpiece. Thus, embodiments of the present invention assist in setting up the electronics assembly machine as well as facilitating quick diagnostics when component inspection(s) indicate a problem.
  • Method 500 begins at block 502 where at least one image of the component placement location is obtained. While the workpiece is located substantially at the same position, positional information relative to the workpiece is obtained, as indicated at block 504.
  • the positional information can be obtained from any suitable position sensitive devices and/or image acquisition devices, such as those in modern optical mice. It is noted that the acquisition of position information can occur at any time when the workpiece is in substantially the same position as when at least one component inspection image is acquired. Accordingly, it is possible in some embodiments for the positional information to be obtained before any image is acquired of the component placement location. Further, such information can be also be acquired after two or more images have been acquired of the component placement location. Further still, positional information can be acquired multiple times during component placement such that average positional information can be computed, which computation may provide better accuracy in environments where the position sensitive devices are susceptible to electromagnetic noise or vibrations.
  • the positional information is associated with the component inspection information. This association can be performed in a vast number of ways.
  • a data structure storing the inspection information may include a pointer, or indication, to a position in an array where the positional information relative to the inspection is stored.
  • the positional information can be superimposed upon an after-placement image of a component that fails inspection.
  • a positional sensor need not measure the workpiece directly, but may instead measure displacement of any apparatus to which the workpiece is fixed.

Landscapes

  • Engineering & Computer Science (AREA)
  • Operations Research (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Supply And Installment Of Electrical Components (AREA)
  • Machine Tool Sensing Apparatuses (AREA)
  • General Factory Administration (AREA)
  • Structure Of Printed Boards (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)

Abstract

Des modes de réalisation de l'invention permettent une corrélation entre des informations de position relatives à la pièce à travailler (310) et des informations d'inspection acquises relatives à la pièce à travailler. Cette corrélation permet à un utilisateur ou un technicien d'identifier rapidement l'emplacement physique, sur la pièce à travailler (310), auquel les informations d'inspection appartiennent. Des informations d'inspection de composant sont alors fournies à un opérateur ainsi qu'une indication de position du composant inspecté (104) sur la pièce à travailler (310).
PCT/US2005/025905 2004-07-21 2005-07-21 Machine bras transfert a inspection amelioree WO2006012435A2 (fr)

Priority Applications (2)

Application Number Priority Date Filing Date Title
DE112005001716T DE112005001716T5 (de) 2004-07-21 2005-07-21 Bestückungsmaschine mit verbesserter Prüfung
JP2007522761A JP2008507699A (ja) 2004-07-21 2005-07-21 検査を向上させたピックアンドプレース機械

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US58976704P 2004-07-21 2004-07-21
US60/589,767 2004-07-21

Publications (2)

Publication Number Publication Date
WO2006012435A2 true WO2006012435A2 (fr) 2006-02-02
WO2006012435A3 WO2006012435A3 (fr) 2006-03-23

Family

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Application Number Title Priority Date Filing Date
PCT/US2005/025905 WO2006012435A2 (fr) 2004-07-21 2005-07-21 Machine bras transfert a inspection amelioree

Country Status (3)

Country Link
JP (1) JP2008507699A (fr)
DE (1) DE112005001716T5 (fr)
WO (1) WO2006012435A2 (fr)

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0276080A (ja) * 1988-09-12 1990-03-15 Omron Tateisi Electron Co 基板検査装置における検査結果表示方法
US5105149A (en) * 1989-07-17 1992-04-14 Matsushita Electric Industrial Co., Ltd. Apparatus for inspecting electronic devices mounted on a circuit board
US20030110610A1 (en) * 2001-11-13 2003-06-19 Duquette David W. Pick and place machine with component placement inspection

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04343048A (ja) * 1991-05-17 1992-11-30 Nok Corp 欠品検査装置
JPH0653694A (ja) * 1992-07-28 1994-02-25 Sony Corp 電子部品実装機
JP3472443B2 (ja) * 1997-06-23 2003-12-02 沖電気工業株式会社 実装部品検査装置

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0276080A (ja) * 1988-09-12 1990-03-15 Omron Tateisi Electron Co 基板検査装置における検査結果表示方法
US5105149A (en) * 1989-07-17 1992-04-14 Matsushita Electric Industrial Co., Ltd. Apparatus for inspecting electronic devices mounted on a circuit board
US20030110610A1 (en) * 2001-11-13 2003-06-19 Duquette David W. Pick and place machine with component placement inspection

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
PATENT ABSTRACTS OF JAPAN vol. 014, no. 269 (P-1059), 11 June 1990 (1990-06-11) & JP 02 076080 A (OMRON TATEISI ELECTRON CO), 15 March 1990 (1990-03-15) *

Also Published As

Publication number Publication date
WO2006012435A3 (fr) 2006-03-23
JP2008507699A (ja) 2008-03-13
DE112005001716T5 (de) 2007-06-06

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