WO2006125102A1 - Procede et appareil pour l'evaluation d'une action de prise de composant dans une machine d'assemblage de composants electroniques - Google Patents

Procede et appareil pour l'evaluation d'une action de prise de composant dans une machine d'assemblage de composants electroniques Download PDF

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Publication number
WO2006125102A1
WO2006125102A1 PCT/US2006/019281 US2006019281W WO2006125102A1 WO 2006125102 A1 WO2006125102 A1 WO 2006125102A1 US 2006019281 W US2006019281 W US 2006019281W WO 2006125102 A1 WO2006125102 A1 WO 2006125102A1
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WO
WIPO (PCT)
Prior art keywords
pick
image
view
component
machine
Prior art date
Application number
PCT/US2006/019281
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English (en)
Other versions
WO2006125102A8 (fr
Inventor
Steven K. Case
John P. Konicek
David W. Duquette
Eric P. Rudd
Swaminathan Manickam
Original Assignee
Cyberoptics Corporation
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Cyberoptics Corporation filed Critical Cyberoptics Corporation
Priority to JP2008512511A priority Critical patent/JP2008541489A/ja
Publication of WO2006125102A1 publication Critical patent/WO2006125102A1/fr
Publication of WO2006125102A8 publication Critical patent/WO2006125102A8/fr

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/08—Monitoring manufacture of assemblages
    • H05K13/081—Integration of optical monitoring devices in assembly lines; Processes using optical monitoring devices specially adapted for controlling devices or machines in assembly lines
    • H05K13/0812—Integration of optical monitoring devices in assembly lines; Processes using optical monitoring devices specially adapted for controlling devices or machines in assembly lines the monitoring devices being integrated in the mounting machine, e.g. for monitoring components, leads, component placement

Definitions

  • Pick and place machines are generally used to manufacture electronic circuit boards.
  • a blank printed circuit board is usually supplied to the pick and place machine, which then picks electronic components from component feeders, and places such components upon the board.
  • the components are held upon the board temporarily by solder paste or adhesive until a subsequent step in which the solder paste is melted, or the adhesive is fully cured.
  • Pick and place machine operation is challenging. Since machine speed corresponds with throughput, the faster the pick and place machine runs, the less costly the manufactured board. Additionally, placement accuracy is extremely important .
  • Many electrical components, such as chip' capacitors and chip resistors are relatively small and must be accurately placed on equally small placement locations. Other components, while larger, have a significant number of leads or conductors that are spaced from one another at a relatively fine pitch. Such components must also be accurately placed to ensure that each lead is placed upon the proper pad. Thus, not only must the machine operate extremely fast, but it must also place components extremely accurately.
  • fully or partially populated boards are generally inspected after the placement operation (s) , both before and after solder reflow, in order to identify components that are improperly placed or missing or any of a variety of errors that may occur.
  • Automatic systems that perform such operation (s) are highly useful in that they help identify component placement problems prior to solder reflow allowing substantially easier rework or identify defective boards after reflow that are candidates for rework.
  • Model KS Flex available from CyberOptics Corporation of Golden Valley, Minnesota.
  • This system can be used to identify such problems as alignment and rotation errors; missing and flipped components; billboards, where the part lays improperly on its longer side edge; tombstones, where the part lays improperly on its shorter edge; partial billboards and tombstones, where the part is oriented between its normal orientation and a billboard or tombstone orientation; component defects; incorrect polarity; and wrong components.
  • Identification of errors pre- reflow provides a number of advantages. Rework is easier; closed-loop manufacturing control is facilitated; and less work in-process exists between error generation and remedy. While such systems provide highly useful inspection, they do consume plant floor-space as well as programming time, maintenance efforts and the like.
  • Picking up a component requires the placement head to be positioned over the pick up point for the target component. Once the nozzle is positioned, it is lowered to a point just above the component and, typically, a vacuum is applied through the nozzle which sucks the component up and temporarily attaches it to the end of the nozzle.
  • Each component is positioned at its pick point by a component feeder mechanism.
  • Typical feeder mechanisms include tape feeders, vibratory feeders and tray feeders.
  • identification marks such as barcodes
  • the feeder mechanism Once a component is picked up by the nozzle, the feeder mechanism must move another component into the pick position. If the component pick operation is not successful, defective workpieces are produced. Defects on workpieces that are known to be caused by bad pick operations are tombstoned components, missing components, wrong components, wrong component polarity, and misplaced components. Bad pick events can be caused .
  • the apparatus includes a placement head having at least one nozzle for releasably picking up and holding a component .
  • a robotic system is provided for generating relative movement between the placement head and a workpiece, such as a circuit board.
  • An image acquisition system is disposed to obtain at least one before-pick image of a component pick up location and at least one after-pick image of the component pick up location.
  • the before-pick image contains a plurality of image portions, having each image portion view the pick-up location from a different point of view, while the after-pick image contains a plurality of image portions, having each image portion view the pick-up location from a different point of view.
  • Fig. 1 is a diagrammatic view of a Cartesian pick and place machine with which embodiments of the invention can be practiced.
  • Fig. 2 is a diagrammatic plan view of a turret pick and place machine with which embodiments of the invention can be practiced.
  • FIG. 3 is simplified diagrammatic view of an image acquisition system aligned with a pick up point of a component placement machine.
  • FIG. 4 is a diagrammatic view of image acquisition system disposed to acquire one or more images relative to a pick operation in accordance with an embodiment of the present invention.
  • FIG. 5 is a top plan view of a system illustrated diagrammatically in FIG. 4, with nozzle the eliminated for ease of illustration.
  • FIG. 6 is a diagrammatic view of an exemplary three-point of view before-pick image acquired in accordance with an embodiment of the present invention.
  • FIG. 7 is a diagrammatic exemplary view of the three-point of view embodiment illustrated in FIG. 6, acquired after a pick operation.
  • FIG. 8 is a flow diagram of a method for acquiring multiple sets of images relative to a pick operation in an electronics assembly machine.
  • Fig. 1 is a diagrammatic view of an exemplary Cartesian pick and place machine 201 with which embodiments of the present invention are applicable.
  • Pick and place machine 201 receives a workpiece, such as circuit board 203, via transport system or conveyor 202.
  • a placement head 206 then obtains one or more electrical components to be mounted upon workpiece 203 from component feeders
  • Placement head (not shown) and moves in x, y and z directions to place the component in the proper orientation at the proper location upon workpiece 203.
  • the 206 may include multiple nozzles 208, 210, 212 to pick multiple components. Some pick and place machines may employ a placement head that moves over a stationary camera to image the component (s) in order to ascertain component location and orientation upon each nozzle.
  • the placement head 206 may also include a downwardly looking camera 209, which is generally used to locate fiducial marks upon workpiece 203 such that the relative location of placement head 206 with respect to workpiece 203 can be readily calculated.
  • Fig. 2 is a diagrammatic view of an exemplary rotary turret pick and place machine 10 with which, embodiments of the present invention are also applicable.
  • Machine 10 includes some components that are similar to machine 201 and like components are numbered similarly.
  • workpiece 203 is loaded via a conveyor onto an x-y stage (not shown) .
  • Attached to main turret 20 are nozzles 210 that are disposed at regular angular intervals around the rotating turret.
  • turret 20 indexes an angular distance equal to the angular distance between adjacent placement nozzles 210.
  • a placement nozzle 210 obtains a component 304 (shown in FIG. 3) from a component feeder 14 at a defined pick point 16. During this same interval, another nozzle 210 places a component 304 onto the workpiece 203 at a preprogrammed placement location 106. Additionally, while turret 20 pauses for the pick and place operation, upward looking camera 30 acquires and image of another component 304, which provides alignment information for that component. This alignment information is used by pick and place machine 10 to position workpiece 203 when placement nozzle 210 is positioned several steps later to place component 104. After the pick and place cycle is complete, turret 20 indexes to the next angular position and workpiece 203 is repositioned in x-y direction (s) to move the placement location to position which corresponds to the placement location 106.
  • Fig. 3 is a diagrammatic view of a placement head in accordance with embodiments of the present invention.
  • Fig. 3 illustrates image acquisition system 300 disposed to acquire images of pick up location 16 of component 304 before and after component 304 is picked up by nozzle 210 from location 16 in feeder 14.
  • Device 300 obtains images of pick up location 16 on feeder 14 prior to pick up of component 304 and then shortly thereafter. A comparison of these before and after images facilitates component-level pick up inspection and verification.
  • the area surrounding the component pick up location 16 is also imaged. Since acquisition of images of the pick up location 16 is generally done when nozzle 210 is located above the pick up location 16, it is important to be able to image pick up location 16 while minimizing or reducing interference from component 304 itself or parts of placement nozzle 210.
  • system 300 employ an optical axis allowing views that are inclined at an angle ⁇ with respect to the - S -
  • An additional advantage of having system 300 inclined at an angle ⁇ is that vertical motion of component 304, feeder, and component holding tape/tray can be detected and measured by determining the translation of these items between image acquisitions. It is also helpful to precisely time the image acquisition interval such that the pick up location 16 and the placement head 210 are relatively aligned with each other and that component 304 is visible in the feeder 14 from the camera angle. After component 304 is picked up, the second image should be timed such that it is at a preselected time during the pick up cycle. A method to precisely time the acquisitions of these two images is described in a, co-pending application Serial No. (10/970,355) .
  • Embodiments of the present invention generally obtain two or more sets of successive images of the intended pick up location (i.e. before pick up and after) . Since pick up occurs relatively quickly, and since slowing machine throughput is extremely undesirable, it is sometimes necessary to acquire two successive images very quickly since cessation of the relative motion between the placement head and the pick up position is fleeting. For example, it may be necessary to acquire two images within a period of approximately 10 milliseconds .
  • FIG. 4 is a diagrammatic view of image acquisition system 300 disposed to acquire one or more images relative to a pick operation in accordance with an embodiment of the present invention.
  • Image acquisition system 300 preferably includes an electronic camera (CCD, CMOS, or other) that is disposed to view component 304 when component 304 is held by nozzle 210.
  • image acquisition system 300 is disposed to have an optical axis such that it views component 304 from a non-zero angle with respect to horizontal.
  • System 300 also preferably includes an illuminator 310 that generates illumination 312, which illumination 312 is redirected by illumination optics 314. Redirected illumination 316 passes through the area proximate component 304 when component 304 is retained on nozzle 210.
  • Imaging optics 318 is disposed to redirect and focus the illumination upon image acquisition system 300.
  • the utilization of illumination optics 314 and imaging optics 318 allows image acquisition system 300 to obtain a backlit side elevation view of component 304, even though component 304 is maintained at an angle that is different than the optical imaging axis of image acquisition system 300.
  • image acquisition system 300 obtains an image of nozzle 210 prior to nozzle 210 picking component 304 from component feeder 14. Then, after component 304 has been picked by nozzle 210, image acquisition system 300 obtains a second, post-pick, image. A comparison of the before- and after- pick images provides important information relative to the effectiveness of the pick operation.
  • FIG. 5 is a top plan view of the system illustrated diagrammaticalIy in FIG.
  • FIG. 5 illustrates image acquisition system 300 generating a pair of illumination beams 312A, 312B, which beams 312A, 312B impinge upon illumination optics 314A, 314B, respectively.
  • Illumination optics 314A, 314B redirect the illumination such that imaging optics 318A, 318B 7 provide backlit views of component 304 from two different points of view.
  • the angular separation of the points of view is preferably 90 degrees. However, it is expressly contemplated that any suitable angular separation can be used, and that more than two points of view can be used in accordance with embodiments of the present invention.
  • Image acquisition system 300 preferably acquires a single image having the plural points of view in a single imaging activity of system 300. Additionally, the configuration of optics 314A, 314B, and/or 318A, 318B may contain elements with or without optical power and elements used in transmission or reflection. These optics preferably redirect and condition illumination emanating from one or more illumination sources on system 300. However, embodiments of the present invention also expressly include sources of illumination that may not be disposed on or within system 300.
  • FIG. 6 is a diagrammatic view of an exemplary three-point-of-view before-pick image acquired in accordance with an embodiment of the present invention.
  • Image 350 includes left image portion 352, center image portion 354, and right image portion 356.
  • Each of image portions 352, 354, and 356 views nozzle 210 from a different angle.
  • FIG. 6 illustrates center image portion 354 having increased magnification in comparisons to left and right image portions 352, 356.
  • FIG. 7 is a diagrammatic exemplary view of the three-point-of-view embodiment illustrated in FIG. 6, but after a pick operation of component 304. As illustrated in FIG. 7, left image portion 352 illustrates component 304 in one orientation, while right image portion 356 illustrates component 304 from a different view.
  • center image portion 354 illustrates component 354 from a separate, intermediate, point of view.
  • important component pick information can be determined.
  • comparing and/or contrasting each after-pick image portion with its respective before-pick image portion to form a difference image easily isolates the image of the component while suppressing extraneous features. Then, comparing or contrasting the three difference images provides a relatively straightforward technique for generating pick efficacy information.
  • FIG. 8 is a flow diagram of a method 400 for acquiring multiple sets of images relative to a pick operation in an electronics assembly machine.
  • Method 400 begins at step 402 where a pre-pick trigger is generated, or received.
  • the pre-pick trigger can be provided in any suitable manner, by any suitable technique or device that is able to reliably signal a precise point in time prior to each pick operation.
  • the trigger may be generated by- monitoring the X, Y coordinates 404 provided by one or more encoders of the electronics assembly machine .
  • the pre-pick trigger can be generated by a particular Z motion 406 of the placement head or nozzle 210. Further still, the pre- pick trigger can be generated based, at least in part, upon timing functions 408.
  • pre-pick trigger from step 402 causes image acquisition system 300 to acquire at least one pre-pick image having a plurality of image portions viewing the nozzle from different points of view, as indicated at block 410.
  • the pre-pick image is preferably obtained during a single imaging operation of image acquisition system 300.
  • the plurality of pre-pick image portions are arranged to view the nozzle from different points of view, preferably separated from 90 degrees.
  • the assembly machine picks component 304 from component feeder 160.
  • a post-pick trigger is generated or obtained.
  • the post-pick trigger can be generated as a function of Z-motion, such as the nozzle motion, 416, in the upward direction a certain distance, or the post-pick trigger can be a function of timing 418.
  • the post-pick trigger can be set to occur a precise time after component 304 has been picked.
  • generating a difference image between a given pre-pick image portion and a respective post-pick image portion will easily isolate the picked component at the selected point of view.
  • the various images, preferably difference images are contrasted and compared.
  • the image analytics performed at block 422 results in a pick indication provided at block 424.
  • suitable pick indications can be indications that no error or fault has occurred; that the picked component is fully tombstoned; that the picked component is partially tombstoned; that the picked component has a billboard condition; that the component has been picked up at one of its corners; or that the picked component is absent .
  • Embodiments of the present invention provide a number of advantages over the prior art.
  • imaging is performed from at least two different vantage points that are preferably 90 degrees apart, so that an inconvenient orientation of the component can still be analyzed effectively.
  • data is acquired immediately after each pick operation so that the analyzed result is available well before placement of the picked component needs to occur.
  • the same camera and illumination system can be used for pick evaluation and for placement evaluation.

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  • Engineering & Computer Science (AREA)
  • Operations Research (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Supply And Installment Of Electrical Components (AREA)
  • Length Measuring Devices By Optical Means (AREA)

Abstract

La présente invention a trait à un appareil d'assemblage de composants électroniques (10, 201) à évaluation de prise améliorée. L'appareil (10, 201) comporte une tête de placement (206) ayant au moins un embout (208, 210, 212) permettant la prise libérable et le maintien d'un composant (304). Un système robotique est prévu pour la génération d'un mouvement relatif entre la tête de placement (206) et une pièce de travail (203), telle qu'une carte de circuit imprimé. Un système d'acquisition d'images (300) est agencé pour l'obtention d'au moins une image précédent la prise d'un emplacement de prise de composant (16) et d'au moins une image suivant la prise de l'emplacement de prise de composant (16). L'image précédant la prise contient une pluralité de portions d'images, chaque portion d'image présentant une vue de l'emplacement de prise à partir d'un point de vue différent, tandis que l'image suivant la prise contient une pluralité de portions d'images, chaque portion d'image présentant une vue de l'emplacement de prise à partir d'un point de vue différent.
PCT/US2006/019281 2005-05-19 2006-05-18 Procede et appareil pour l'evaluation d'une action de prise de composant dans une machine d'assemblage de composants electroniques WO2006125102A1 (fr)

Priority Applications (1)

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JP2008512511A JP2008541489A (ja) 2005-05-19 2006-05-18 電子アセンブリ機械の部品ピッキング動作を評価するための方法及び装置

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US68245005P 2005-05-19 2005-05-19
US60/682,450 2005-05-19

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WO2006125102A8 WO2006125102A8 (fr) 2007-02-01

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2007033349A1 (fr) * 2005-09-14 2007-03-22 Cyberoptics Corporation Machine bras-transfert a traitement ameliore de l'image de selection des composants

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6113631B2 (ja) * 2013-11-18 2017-04-12 東芝三菱電機産業システム株式会社 作業確認システム
JP6902120B2 (ja) * 2018-01-18 2021-07-14 ヤマハ発動機株式会社 部品実装機、部品露出状態判定方法

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4809430A (en) * 1986-06-12 1989-03-07 Matsushita Electric Industrial Co., Ltd. Method and apparatus for mounting electronic parts
US20020031279A1 (en) * 2000-09-13 2002-03-14 Fuji Machine Mfg. Co., Ltd. Suction nozzle, method of detecting hold position of electric component, methods of detecting bending and angular position of suction pipe, and electric-component handling device
WO2003043400A1 (fr) * 2001-11-13 2003-05-22 Cyberoptics Corporation Machine de transfert avec fonction de controle du positionnement des composants
US20040119987A1 (en) * 2001-01-22 2004-06-24 Madsen David D. Multiple source alignment sensor with improved optics

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4809430A (en) * 1986-06-12 1989-03-07 Matsushita Electric Industrial Co., Ltd. Method and apparatus for mounting electronic parts
US20020031279A1 (en) * 2000-09-13 2002-03-14 Fuji Machine Mfg. Co., Ltd. Suction nozzle, method of detecting hold position of electric component, methods of detecting bending and angular position of suction pipe, and electric-component handling device
US20040119987A1 (en) * 2001-01-22 2004-06-24 Madsen David D. Multiple source alignment sensor with improved optics
WO2003043400A1 (fr) * 2001-11-13 2003-05-22 Cyberoptics Corporation Machine de transfert avec fonction de controle du positionnement des composants

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2007033349A1 (fr) * 2005-09-14 2007-03-22 Cyberoptics Corporation Machine bras-transfert a traitement ameliore de l'image de selection des composants

Also Published As

Publication number Publication date
JP2008541489A (ja) 2008-11-20
WO2006125102A8 (fr) 2007-02-01

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