WO2005118912A1 - Procédé pour fixer une poudre métallique sur une surface de transfert de la chaleur et la surface de transfert de la chaleur - Google Patents

Procédé pour fixer une poudre métallique sur une surface de transfert de la chaleur et la surface de transfert de la chaleur Download PDF

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Publication number
WO2005118912A1
WO2005118912A1 PCT/FI2005/000249 FI2005000249W WO2005118912A1 WO 2005118912 A1 WO2005118912 A1 WO 2005118912A1 FI 2005000249 W FI2005000249 W FI 2005000249W WO 2005118912 A1 WO2005118912 A1 WO 2005118912A1
Authority
WO
WIPO (PCT)
Prior art keywords
copper
heat transfer
powder
transfer surface
porous
Prior art date
Application number
PCT/FI2005/000249
Other languages
English (en)
Finnish (fi)
Inventor
Petri Rissanen
Olli Laaksonen
Original Assignee
Luvata Oy
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Luvata Oy filed Critical Luvata Oy
Publication of WO2005118912A1 publication Critical patent/WO2005118912A1/fr

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/30—Selection of soldering or welding materials proper with the principal constituent melting at less than 1550 degrees C
    • B23K35/302—Cu as the principal constituent
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C24/00—Coating starting from inorganic powder
    • C23C24/08—Coating starting from inorganic powder by application of heat or pressure and heat
    • C23C24/10—Coating starting from inorganic powder by application of heat or pressure and heat with intermediate formation of a liquid phase in the layer
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C26/00—Coating not provided for in groups C23C2/00 - C23C24/00
    • C23C26/02—Coating not provided for in groups C23C2/00 - C23C24/00 applying molten material to the substrate
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F13/00—Arrangements for modifying heat-transfer, e.g. increasing, decreasing
    • F28F13/18—Arrangements for modifying heat-transfer, e.g. increasing, decreasing by applying coatings, e.g. radiation-absorbing, radiation-reflecting; by surface treatment, e.g. polishing
    • F28F13/185—Heat-exchange surfaces provided with microstructures or with porous coatings

Definitions

  • the purpose of the method developed is to form a porous surface layer on top of a heat transfer surface, and to make it attach itself firmly to the surface below it at a temperature and time suitable for industrial production.
  • the heat transfer surface is copper or a copper alloy, preferably oxygen-free copper or deoxidised high phosphorous copper.
  • the powder forming the porous surface is fine-grained copper powder or copper alloy powder.
  • brazing solder is brought to the heat transfer surface to bind the copper powder to the substrate.
  • the brazing solder preferably contains nickel, tin and phosphorus alloyed with copper.
  • the invention also relates to the heat transfer surface onto which the porous layer is formed by means of the copper or copper alloy powder and said brazing solder.
  • the invention relates to a method for forming a strongly adhesive porous surface layer on a heat transfer surface.
  • the heat transfer surface is copper or copper alloy, preferably oxygen-free or deoxidised high phosphorous copper.
  • the powder forming the porous surface is fine-grained copper powder or copper alloy powder.
  • brazing solder is brought to the heat transfer surface, and preferably contains nickel, tin and phosphorous alloyed with copper. In order to perform the brazing, the heat transfer surface is taken for heat treatment, where the temperature is a maximum of 725°C.
  • the heat transfer surface may be treated with a binder or a binder may be mixed into the metal powder to be used in preparing a coating, as described in the prior art, but this is not necessary. If a binder is used, its removal takes place by annealing according to known techniques.
  • the paste was sprayed onto the surface of the copper strip.
  • the thickness of the sprayed coating layer was approximately 100 ⁇ m.
  • the strip was conveyed through a resistance furnaces acting as a drying and brazing furnace at a rate of 10 cm/min.
  • the temperature of the binder drying and evaporation furnace was approximately 300°C and that of the brazing furnace about 700°C.
  • Nitrogen atmosphere was used as shielding gas, which included some hydrogen to prevent the oxidation of the component.
  • Figure 3 shows the heat transfer capacity of a porous heat transfer surface manufactured in accordance with example 1 as a function of the temperature difference (Ts - Tlq) between the surface (q) and the liquid (pentane) with comparisons between a smooth surface and a ridged surface.

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • General Engineering & Computer Science (AREA)
  • Other Surface Treatments For Metallic Materials (AREA)

Abstract

L'objet du procédé développé est de former une couche poreuse au-dessus d'une surface de transfert de la chaleur, laquelle couche est à fixer solidement sur la surface en dessous à une température et à un moment pouvant être appliqués à la fabrication industrielle. La surface de transfert de la chaleur est en cuivre et alliage de cuivre, de préférence du cuivre dépourvu d'oxygène ou désoxydé à forte teneur en phosphore. La poudre formant la surface poreuse est une poudre de cuivre à grain fin ou une poudre d’alliage de cuivre. Dans le procédé selon l’invention, une brasure contenant de préférence du nickel, de l’étain et du phosphore alliés à du cuivre, est amenée à la surface de transfert de la chaleur. L’invention concerne également la surface de transfert de la chaleur sur laquelle se forme une surface poreuse au moyen d'une poudre de cuivre ou d'alliage de cuivre et la brasure décrite.
PCT/FI2005/000249 2004-06-03 2005-06-01 Procédé pour fixer une poudre métallique sur une surface de transfert de la chaleur et la surface de transfert de la chaleur WO2005118912A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
FI20040760A FI120051B (fi) 2004-06-03 2004-06-03 Menetelmä metallipulverin liittämiseksi lämmönsiirtopintaan ja lämmönsiirtopinta
FI20040760 2004-06-03

Publications (1)

Publication Number Publication Date
WO2005118912A1 true WO2005118912A1 (fr) 2005-12-15

Family

ID=32524441

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/FI2005/000249 WO2005118912A1 (fr) 2004-06-03 2005-06-01 Procédé pour fixer une poudre métallique sur une surface de transfert de la chaleur et la surface de transfert de la chaleur

Country Status (3)

Country Link
FI (1) FI120051B (fr)
TW (1) TW200602610A (fr)
WO (1) WO2005118912A1 (fr)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2009131786A2 (fr) * 2008-04-24 2009-10-29 3M Innovative Properties Company Article de transfert thermique à structure poreuse
WO2012163321A1 (fr) * 2011-05-27 2012-12-06 Mtu Aero Engines Gmbh Procédé d'injection de gaz froid présentant une meilleure adhérence et une porosité de couche réduite
US20150111060A1 (en) * 2013-10-22 2015-04-23 General Electric Company Cooled article and method of forming a cooled article
EP2617515A4 (fr) * 2010-08-05 2016-06-01 Senju Metal Industry Co Matériau de soudure de dispositif à semi-conducteurs
CN106141496A (zh) * 2016-07-28 2016-11-23 华南理工大学 一种铜磷锡镍钎料及其制备方法和应用
CN116140866A (zh) * 2023-03-10 2023-05-23 北京工业大学 一种新型低熔点vc均热板用铜基钎料焊膏

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI688741B (zh) * 2018-10-12 2020-03-21 廣州力及熱管理科技有限公司 製作具有印刷毛細結構之超薄熱管板的方法
TWI702371B (zh) * 2019-03-21 2020-08-21 賴耀惠 複合式虹吸均溫板
TWI710744B (zh) * 2019-04-15 2020-11-21 廣州力及熱管理科技有限公司 薄型均溫板的製作方法

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3821018A (en) * 1969-10-10 1974-06-28 Union Carbide Corp Porous metallic layer formation
JPS61210186A (ja) * 1985-03-15 1986-09-18 Nippon Light Metal Co Ltd 金属体表面に多孔質金属層を形成する方法
US5378294A (en) * 1989-11-17 1995-01-03 Outokumpu Oy Copper alloys to be used as brazing filler metals
US6342106B1 (en) * 1997-10-24 2002-01-29 Degussa Ag Flux-free brazing paste
US20030001000A1 (en) * 2001-06-28 2003-01-02 Shabtay Yoram Leon Method of manufacturing heat transfer tubes
WO2004018147A1 (fr) * 2002-08-23 2004-03-04 J.W. Harris Co., Inc. Alliage de brasure au phosphore/cuivre

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3821018A (en) * 1969-10-10 1974-06-28 Union Carbide Corp Porous metallic layer formation
JPS61210186A (ja) * 1985-03-15 1986-09-18 Nippon Light Metal Co Ltd 金属体表面に多孔質金属層を形成する方法
US5378294A (en) * 1989-11-17 1995-01-03 Outokumpu Oy Copper alloys to be used as brazing filler metals
US6342106B1 (en) * 1997-10-24 2002-01-29 Degussa Ag Flux-free brazing paste
US20030001000A1 (en) * 2001-06-28 2003-01-02 Shabtay Yoram Leon Method of manufacturing heat transfer tubes
WO2004018147A1 (fr) * 2002-08-23 2004-03-04 J.W. Harris Co., Inc. Alliage de brasure au phosphore/cuivre

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
PATENT ABSTRACTS OF JAPAN vol. 011, no. 047 13 February 1987 (1987-02-13) *

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2009131786A2 (fr) * 2008-04-24 2009-10-29 3M Innovative Properties Company Article de transfert thermique à structure poreuse
WO2009131786A3 (fr) * 2008-04-24 2010-12-09 3M Innovative Properties Company Article de transfert thermique à structure poreuse
EP2617515A4 (fr) * 2010-08-05 2016-06-01 Senju Metal Industry Co Matériau de soudure de dispositif à semi-conducteurs
WO2012163321A1 (fr) * 2011-05-27 2012-12-06 Mtu Aero Engines Gmbh Procédé d'injection de gaz froid présentant une meilleure adhérence et une porosité de couche réduite
US20150111060A1 (en) * 2013-10-22 2015-04-23 General Electric Company Cooled article and method of forming a cooled article
CN104564164A (zh) * 2013-10-22 2015-04-29 通用电气公司 冷却制品和形成冷却制品的方法
US10539041B2 (en) * 2013-10-22 2020-01-21 General Electric Company Cooled article and method of forming a cooled article
CN106141496A (zh) * 2016-07-28 2016-11-23 华南理工大学 一种铜磷锡镍钎料及其制备方法和应用
CN116140866A (zh) * 2023-03-10 2023-05-23 北京工业大学 一种新型低熔点vc均热板用铜基钎料焊膏

Also Published As

Publication number Publication date
TW200602610A (en) 2006-01-16
FI20040760A0 (fi) 2004-06-03
FI120051B (fi) 2009-06-15
FI20040760A (fi) 2005-12-04

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