WO2005112527A1 - Connector employing flexible printed board - Google Patents

Connector employing flexible printed board Download PDF

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Publication number
WO2005112527A1
WO2005112527A1 PCT/JP2005/008769 JP2005008769W WO2005112527A1 WO 2005112527 A1 WO2005112527 A1 WO 2005112527A1 JP 2005008769 W JP2005008769 W JP 2005008769W WO 2005112527 A1 WO2005112527 A1 WO 2005112527A1
Authority
WO
WIPO (PCT)
Prior art keywords
flexible printed
printed circuit
circuit board
connection
board
Prior art date
Application number
PCT/JP2005/008769
Other languages
French (fr)
Japanese (ja)
Inventor
Hiroyuki Suzuki
Tomiyo Ema
Original Assignee
Matsushita Electric Industrial Co., Ltd.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co., Ltd. filed Critical Matsushita Electric Industrial Co., Ltd.
Priority to EP05739223A priority Critical patent/EP1746867A4/en
Priority to US11/569,020 priority patent/US20070202713A1/en
Publication of WO2005112527A1 publication Critical patent/WO2005112527A1/en

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/36—Assembling printed circuits with other printed circuits
    • H05K3/361—Assembling flexible printed circuits with other printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/148—Arrangements of two or more hingeably connected rigid printed circuit boards, i.e. connected by flexible means
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10128—Display
    • H05K2201/10136—Liquid Crystal display [LCD]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/17—Post-manufacturing processes
    • H05K2203/176—Removing, replacing or disconnecting component; Easily removable component
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/225—Correcting or repairing of printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
    • H05K3/323—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives by applying an anisotropic conductive adhesive layer over an array of pads

Definitions

  • the present invention relates to a connection device for connecting a flexible printed board used for a module component to another flexible printed board or a hard board.
  • a flexible printed circuit board 6 used as a part of a module of an electronic component such as a liquid crystal 7 is connected to another electronic component 4a. Is directly connected to the printed circuit board 1 on which is mounted by using soldering or thermocompression bonding agent 8.
  • Fig. 13 shows a procedure of a conventional reconnection method.
  • the connection section with the adhesive 8 is heated with a hot plate or the like (step S21). While heating, the lower printed circuit board 1 is pressed, the upper flexible printed circuit board 6 is pulled in the horizontal or upward direction, and the connection portion 50 is peeled off (step S22).
  • the adhesive 8 remaining on each of the peeled substrates is physically removed with tweezers or the like, or removed in a diagonal manner with a solvent such as acetone (step S23).
  • a new adhesive 8 is attached to the printed circuit board 1 or the flexible printed circuit board 6 and heated (step S24). Flexible while the adhesive 8 is heated Press the printed circuit board 6 and the printed circuit board 1 (step S25). With the above procedure, reconnection is completed! /, (Step S26).
  • Patent Document 1 JP-A-2003-133678 (page 5, FIG. 9)
  • Patent Document 2 JP-A-5-90725 (Page 3, FIG. 1)
  • Patent Document 3 JP-A-61-22580 (page 2, FIG. 1 (b))
  • connection device of the present invention employs a configuration in which a flexible printed board and another printed board are relayed by a flexible printed board for connection. With this configuration, the work of reconnecting the flexible printed circuit board to another printed circuit board can be easily performed by replacing the connection flexible printed circuit board to be relayed.
  • the connecting device of the present invention employs a configuration in which a connecting portion of the connecting flexible printed circuit board is provided with a thermoplastic adhesive. With this configuration, the flexible printed circuit board for connection can be heated to reconnect the flexible printed circuit board to another printed circuit board. The flexible printed circuit board for connection can be peeled off from the flexible printed circuit board and the printed circuit board without being damaged.
  • the connection device of the present invention has a configuration in which a thermoplastic adhesive is provided on one or both connection portions of a flexible printed circuit board for connection. With this configuration, after the flexible printed circuit board for connection is peeled off, the adhesive remaining on the flexible printed circuit board and other printed circuit boards is not removed, and the connection is performed with no new adhesive applied. Reconnection can be easily performed by replacing the flexible printed circuit board.
  • connection device of the present invention employs a configuration in which conductive particles are included in a thermoplastic adhesive. With this configuration, it is possible to absorb variations in the height of the terminals of the flexible printed circuit board for connection, flexible printed circuit boards, and other printed circuit boards, as well as variations in the unevenness of the mounting, thereby improving the stability of electrical connection. it can.
  • the protrusion is provided on one or both terminals of the flexible printed circuit board for connection to be relayed.
  • the present invention relates to a method for connecting a flexible printed circuit board used for a module component or the like and another flexible printed circuit board or a rigid board to a connecting part provided with a thermoplastic adhesive in one or both connecting parts in advance.
  • the connection with the flexible printed circuit board facilitates the reconnection work.
  • by providing a connecting flexible printed circuit board for relaying there is an effect that electronic components such as a liquid crystal module provided on the flexible printed circuit board or the rigid board can be reconnected without being damaged by distortion, heat, or the like. .
  • FIG. 1 (a) Cross-sectional view of a connection device according to the first embodiment of the present invention before connection (b) Cross-sectional view of the connection device of the first embodiment of the present invention ( c) Partial sectional view of the connection device according to the first embodiment of the present invention
  • FIG. 2 is an external view of a flexible printed circuit board for connection according to a first embodiment of the present invention.
  • FIG. 3 is a flowchart of a method for reconnecting a connecting device of the present invention.
  • FIG. 4 (a) Cross-sectional view of a connection device according to a second embodiment of the present invention. (B) Partial cross-sectional view of a connection device according to a second embodiment of the present invention.
  • FIG. 5 (a) Cross-sectional view of a connection device according to a third embodiment of the present invention. (B) Partial cross-sectional view of a connection device according to a third embodiment of the present invention.
  • FIG. 6 is an external view of a connection flexible printed circuit board according to a third embodiment of the present invention.
  • FIG. 7 (a) a cross-sectional view of a connection device according to a fourth embodiment of the present invention; Partial sectional view of a connection device according to an embodiment.
  • FIG. 8 (a) Cross-sectional view of a connection device according to a fifth embodiment of the present invention. (B) Partial cross-sectional view of a connection device according to a fifth embodiment of the present invention.
  • FIG. 9 (a) Cross-sectional view of a connection device according to a sixth embodiment of the present invention. (B) Partial cross-sectional view of a connection device according to a sixth embodiment of the present invention.
  • FIG. 10 (a) Cross-sectional view of a connection device according to a seventh embodiment of the present invention. (B) Partial cross-sectional view of a connection device according to a seventh embodiment of the present invention.
  • FIG. 11 (a) Cross-sectional view of a connection device according to an eighth embodiment of the present invention. (B) Partial cross-sectional view of a connection device according to an eighth embodiment of the present invention.
  • FIG. 12 is a cross-sectional view of a conventional connection device.
  • FIG. 13 is a flowchart of a conventional connection device reconnection method.
  • FIG. 1 shows a cross-sectional view of the connection device according to the first embodiment of the present invention.
  • the same parts as those in the conventional example are denoted by the same reference numerals, and description thereof is omitted.
  • FIG. 1A is a cross-sectional view of a state before the printed circuit board 1 and the flexible printed circuit board 6 are connected by the connecting flexible printed circuit board 9.
  • Fig. 1 (b) is a cross-sectional view of the state in which the printed circuit board 1 and the flexible printed circuit board 6 are connected by the connection flexible printed circuit board 9, and
  • Fig. 1 (c) is an enlarged view of the connection part in Fig. 1 (b). It is sectional drawing.
  • FIG. 2 is an external view showing the connection flexible printed circuit board 9 with the terminals 5c and 5d facing upward.
  • the printed circuit board 1 has a conductor 2a on the surface.
  • the conductor 2a forms a circuit pattern, and a terminal 5a is provided at one end of the conductor 2a.
  • the electronic component 4a is arranged on the printed circuit board 1 so as to be electrically connected to the conductor 2a.
  • a resist 3a is provided on portions other than the terminals 5a and the electronic components 4a of the printed circuit board 1 to prevent an electrical short circuit.
  • the flexible printed circuit board 6 is a part of a liquid crystal 7 module.
  • the flexible print substrate 6 has a conductor 2b on the surface.
  • the conductor 2b forms a circuit pattern, and a terminal 5b is provided at one end of the conductor 2b.
  • the electronic component 4b is arranged on the flexible printed circuit board 6 so as to be electrically connected to the conductor 2b.
  • a resist 3b is provided on portions of the flexible printed circuit board 6 other than the terminals 5b and the electronic components 4b to prevent an electrical short circuit.
  • the flexible printed circuit board 9 for connection includes a conductor 2c on one surface.
  • the conductor 2c forms a circuit pattern, and terminals 5c and 5d are provided at both ends of the conductor 2c.
  • a resist 3c is provided on portions other than the terminals 5c and 5d of the connection flexible printed circuit board 9 to prevent an electrical short circuit.
  • a thermoplastic adhesive 8 is applied in advance to the connecting portion 50 including the terminals 5c and 5d.
  • FIG. 3 is a flowchart of the reconnection method of the present invention. First, the connection portion 50 of the connection flexible printed circuit board 9 is heated with a hot plate or the like (step S11), and in this state, the upper connection flexible printed circuit board 9 is pulled horizontally or upward to perform printing.
  • connection flexible printed board 9 is peeled off from the board 1 and the flexible printed board 6 (Step S12). After peeling off the flexible printed circuit board 9 for connection, an adhesive is applied to the new flexible printed circuit board 9 for connection, and if necessary, heat treatment is performed (step S13). The connection flexible printed circuit board 9 with the adhesive is replaced with the peeled connection flexible printed circuit board 9 (step S14), and the newly prepared connection flexible printed circuit board 9 with the adhesive is printed on the flexible printed circuit board 6 again.
  • the substrate 1 is connected by heating and pressurizing (step S15) to complete reconnection (step S16). At this time, since the adhesive is previously attached to the replacement connection flexible printed circuit board 9, the remaining adhesive is removed as in the conventional example, and the printed circuit board 1 and the flexible printed circuit board 6 are newly attached. There is no need to reapply the adhesive 8 to the.
  • connection portion 50 is peeled off while heating the flexible printed circuit board 9 for connection, thereby preventing the printed circuit board 1 and the flexible printed circuit board 6 from being damaged.
  • the adhesive can be attached to the connection flexible printed circuit board 9 for replacement in advance, so that the adhesive 8 can be removed from the printed circuit board 1 and the flexible printed circuit board 6, and the printed circuit board 1 can be removed after the removal.
  • the reconnection work can be performed without re-adhering the adhesive 8 to the flexible printed circuit board 6.
  • the printed board 1 may be any type of printed board such as a flexible printed board or a hard board.
  • the liquid crystal 7 may be another electronic component such as a speaker.
  • FIG. 4 is a sectional view of a connection device according to a second embodiment of the present invention.
  • 4A is a cross-sectional view showing a state in which the printed circuit board 1 and the flexible printed circuit board 6 are connected by the connection flexible printed circuit board 9, and
  • FIG. 4B is a partial cross-sectional view in which the connection portion of FIG. 4A is enlarged.
  • conductive particles 10 are included in an adhesive 8 used for connecting the printed circuit board 1, the flexible printed circuit board 6, and the flexible printed circuit board 9 for connection.
  • Other configurations and The reconnection method is the same as in the first embodiment.
  • a reconnection operation can be easily performed as in the first embodiment. Furthermore, since the conductive particles 10 contained in the adhesive 8 conduct between the terminals 5a and 5c and between the terminals 5b and 5d, variations in height of the terminals 5a and 5b and variations in unevenness of plating can be absorbed. The stability of the electrical connection after the connection can be improved.
  • FIG. 5 shows a sectional view of a connection device according to a third embodiment of the present invention.
  • FIG. 5 (a) is a cross-sectional view showing a state in which the printed circuit board 1 and the flexible printed circuit board 6 are connected by the connection flexible printed circuit board 9, and
  • FIG. 5 (b) is a partial cross-sectional view in which the connection portion of FIG. FIG.
  • protrusions 11 are formed on the terminals 5c and 5d of the connection flexible printed circuit board 9 in advance by plating or etching.
  • Other configurations and a reconnection method are the same as those in the first embodiment.
  • a reconnection operation can be easily performed similarly to the first embodiment. Further, the protrusion 11 breaks through the adhesive 8 sandwiched between the terminals 5a and 5c and the terminals 5b and 5d, and the protrusion 11 contacts the terminals 5a and 5b, so that the stability of the electrical connection can be improved. .
  • FIG. 6 is an external view of the connection flexible printed circuit board 9 according to the third embodiment, with the terminals 5c and 5d shown above.
  • the conductive particles 10 are not used for the adhesive 8. Since the distance A between the wires of the terminals 5c and 5d can be reduced, the width of the flexible printed circuit board 9 for connection can be reduced.
  • the protrusions 11 may be physically processed by a mold or the like in addition to the chemical processing.
  • FIG. 7 shows a sectional view of a connection device according to a fourth embodiment of the present invention.
  • 7A is a cross-sectional view showing a state in which the printed circuit board 1 and the flexible printed circuit board 6 are connected by the connection flexible printed circuit board 9, and
  • FIG. 7B is a partial cross-sectional view in which the connection portion of FIG. 7A is enlarged.
  • the flexible printed circuit board 9 for connection is on the terminals 5c and 5d on one side.
  • the projection 11 is provided.
  • the adhesive 8 used for the connection includes the conductive particles 10. Other configurations and a reconnection method are the same as those in the first embodiment.
  • a reconnection operation can be easily performed as in the first embodiment. Further, since the protrusions 11 pierce the adhesive 8 sandwiched between the terminals 5a and 5c and the terminals 5b and 5d, the stability of the electrical connection can be improved. Furthermore, since the conductive particles 10 contained in the adhesive 8 conduct between the terminals 5a and 5c and between the terminals 5b and 5d, it is necessary to absorb variations in height of the terminals 5a and 5b and variations in plating irregularities. Therefore, the stability of the electrical connection after the connection can be improved.
  • FIG. 8 shows a sectional view of a connection device according to a fifth embodiment of the present invention.
  • FIG. 8 (a) is a cross-sectional view showing a state in which a connection flexible printed circuit board 12 is connected between the printed circuit board 1 and the flexible printed circuit board 6, and
  • FIG. 8 (b) is an enlarged view of the connection portion in FIG. 8 (a). It is a partial sectional view.
  • a connecting flexible printed board 12 for connecting the printed board 1 and the flexible printed board 6 is a double-sided wiring board, and has terminals 5e and 5f on both sides. The terminals 5e and 5f are electrically connected to each other by filling the holes made in the connection flexible printed circuit board 12 with the conductors 2d.
  • Other configurations and a reconnection method are the same as those in the first embodiment.
  • the reconnection work can be easily performed similarly to the first embodiment, by peeling off the flexible printed circuit board 12 for connection.
  • the flexible printed board 12 for connection is broken first, so that the flexible printed board 6 can be prevented from being damaged.
  • the terminals 5e and 5f on both sides of the connection flexible printed circuit board 12 with the thermoplastic adhesive 8 the area required for connection is smaller than that of the connection device of the first embodiment. can do
  • the flexible printed circuit board 12 having the terminals 5e and 5f on both sides may be a single-sided wiring board bent to have terminals on both sides or a multilayer wiring board.
  • FIG. 9 shows a sectional view of a connection device according to a sixth embodiment of the present invention.
  • FIG. 9 (a) is a cross-sectional view showing a state in which the connection flexible printed circuit board 12 is connected between the printed circuit board 1 and the flexible printed circuit board 6, and
  • FIG. 9 (b) is an enlarged view of the connection portion of FIG. It is a partial sectional view.
  • an adhesive 8 used for connection contains conductive particles 10.
  • Other configurations and a reconnection method are the same as those in the fifth embodiment.
  • a reconnection operation can be performed easily as in the first embodiment. Further, as in the second embodiment, variations in height of the terminals 5a and 5b and variations in unevenness of plating can be absorbed, and the stability of electrical connection after connection can be improved. Furthermore, similarly to the fifth embodiment, the connection flexible printed circuit board 12 has the terminals 5e and 5f on both sides, so that the area required for connection can be reduced as compared with the connection device of the second embodiment. .
  • FIG. 10 is a sectional view of a connection device according to a seventh embodiment of the present invention.
  • FIG. 10 (a) is a cross-sectional view showing a state in which the connection flexible printed circuit board 12 is connected between the printed circuit board 1 and the flexible printed circuit board 6, and
  • FIG. 10 (b) is an enlarged view of the connecting portion in FIG. 10 (a).
  • the flexible printed circuit board 12 for connection has protrusions 11 on the terminals 5e and 5f on both sides.
  • Other configurations and a reconnection method are the same as those in the fifth embodiment.
  • a reconnection operation can be easily performed as in the first embodiment.
  • the protrusion 11 breaks through the adhesive 8 and the protrusion 11 comes into contact with the terminals 5a and 5b, the stability of the electrical connection can be improved.
  • the adhesive 8 does not use the conductive particles 10, the distance between the wires of the terminals 5e and 5f can be reduced. Therefore, the width of the connection flexible printed circuit board 12 can be reduced.
  • the connection flexible printed circuit board 12 has the terminals 5e and 5f on both sides, so that the area required for connection can be reduced as compared with the connection device of the third embodiment. . (Embodiment 8)
  • FIG. 11 shows a sectional view of a connection device according to an eighth embodiment of the present invention.
  • the flexible printed circuit board 12 for connection is provided with protrusions 11 on the terminals 5e and 5f on both sides, and the adhesive 8 has the conductive particles 10.
  • Other configurations and a reconnection method are the same as those in the fifth embodiment.
  • a reconnection operation can be performed easily as in the first embodiment.
  • the protrusion 11 breaks through the adhesive 8
  • the stability of the electrical connection can be improved.
  • the conductive particles 10 contained in the adhesive 8 conduct between the terminals 5a and 5e and between the terminals 5b and 5f, variations in the height of the terminals 5a and 5b and variations in unevenness of the plating are absorbed. Therefore, the stability of the electrical connection after the connection can be further improved. Since the connection flexible printed circuit board 12 has the terminals 5e and 5f on both sides, the area required for connection can be reduced as compared with the connection device of the fourth embodiment.
  • connection device using the flexible printed board according to the present invention can easily perform reconnection between the flexible printed board and the printed board. Therefore, high-density mounting is performed using the flexible printed board. It is useful for electronic devices such as portable devices.

Abstract

When a flexible printed board used in a module component and other printed board are reconnected, there have been problems that the flexible printed board is damaged at the time of stripping the joint, removal of adhesive is difficult, readhesion of adhesive is difficult and the printed boards cannot be reconnected easily. Thermosetting adhesive (8) is applied previously to the joint (50) of a connection flexible printed board (9), for connecting a flexible printed board (6) connected with an electronic component (4b) and a liquid crystal (7), with a printed board (1) mounted with an electronic component (4a). Reconnection work of the printed board (1) and the flexible printed board (6) can be carried out easily by replacing the interconnecting connection flexible printed board (9).

Description

明 細 書  Specification
フレキシブルプリント基板を用レ、た接続装置  Connection equipment using flexible printed circuit boards
技術分野  Technical field
[0001] 本発明はモジュール部品に使われているフレキシブルプリント基板を他のフレキシ ブルプリント基板や硬質基板に接続する接続装置に関するものである。  The present invention relates to a connection device for connecting a flexible printed board used for a module component to another flexible printed board or a hard board.
背景技術  Background art
[0002] モジュール部品に使われて!/、るフレキシブルプリント基板を他のフレキシブルプリン ト基板や硬質基板に接続する装置として、一般的にコネクタを用いて接続する方法 が広く使われている（例えば、特許文献 1参照)。しかし、コネクタを用いた接続にお いては、基板の交換が容易にできるが、薄型化、軽量化に限界がある。  [0002] As a device for connecting a flexible printed circuit board used for module components to another flexible printed circuit board or a rigid board, a method of connecting using a connector is widely used (for example, And Patent Document 1). However, in connection using a connector, the board can be easily replaced, but there is a limit to the reduction in thickness and weight.
[0003] この問題を解決するために、コネクタを用いずに接続する方法として、フレキシブル プリント基板と他のフレキシブルプリント基板や硬質基板とを半田で接続する方法や 、熱圧着型の接着剤を用いた接続方法が採用されている (例えば、特許文献 2、特 許文献 3参照)。  [0003] In order to solve this problem, as a method of connecting without using a connector, a method of connecting a flexible printed board to another flexible printed board or a hard board by soldering, or a method of using a thermocompression bonding agent is used. (For example, refer to Patent Document 2 and Patent Document 3).
[0004] コネクタを用いずに接続する方法としては、例えば図 12に示すように、液晶 7などの 電子部品のモジュールの一部として使われて 、るフレキシブルプリント基板 6を、他 の電子部品 4aが実装されているプリント基板 1に、半田付けや熱圧着型の接着剤 8 を用いて直接接続している。  As a method of connecting without using a connector, for example, as shown in FIG. 12, a flexible printed circuit board 6 used as a part of a module of an electronic component such as a liquid crystal 7 is connected to another electronic component 4a. Is directly connected to the printed circuit board 1 on which is mounted by using soldering or thermocompression bonding agent 8.
[0005] そのため、フレキシブルプリント基板 6とプリント基板 1の接続不良が出た場合はフレ キシブルプリント基板 6とプリント基板 1を ヽつたん剥がした後、再接続を行って!/、た。  [0005] Therefore, when a connection failure between the flexible printed circuit board 6 and the printed circuit board 1 occurs, the flexible printed circuit board 6 and the printed circuit board 1 are separated from each other, and then reconnected.
[0006] 従来の再接続の方法の手順を図 13に示す。まず、接着剤 8が付いた接続部をホッ トプレートなどで加熱する (ステップ S21)。加熱した状態で下側のプリント基板 1を押 さえ、上側のフレキシブルプリント基板 6を水平方向または上方向に引張り、接続部 5 0を剥す (ステップ S22)。剥したそれぞれの基板に残った接着剤 8をピンセットなどで 物理的に除去、または、アセトンなどの溶剤でィ匕学的に除去する (ステップ S23)。接 着剤 8を除去した後に、プリント基板 1もしくはフレキシブルプリント基板 6に新しく接着 剤 8を付着させ、加熱する (ステップ S24)。接着剤 8を加熱した状態で、フレキシブル プリント基板 6とプリント基板 1を加圧する (ステップ S25)。以上の手順で、再接続を 完成させて!/、た (ステップ S 26)。 [0006] Fig. 13 shows a procedure of a conventional reconnection method. First, the connection section with the adhesive 8 is heated with a hot plate or the like (step S21). While heating, the lower printed circuit board 1 is pressed, the upper flexible printed circuit board 6 is pulled in the horizontal or upward direction, and the connection portion 50 is peeled off (step S22). The adhesive 8 remaining on each of the peeled substrates is physically removed with tweezers or the like, or removed in a diagonal manner with a solvent such as acetone (step S23). After removing the adhesive 8, a new adhesive 8 is attached to the printed circuit board 1 or the flexible printed circuit board 6 and heated (step S24). Flexible while the adhesive 8 is heated Press the printed circuit board 6 and the printed circuit board 1 (step S25). With the above procedure, reconnection is completed! /, (Step S26).
特許文献 1 :特開 2003— 133678号公報 (第 5頁、図 9)  Patent Document 1: JP-A-2003-133678 (page 5, FIG. 9)
特許文献 2 :特開平 5— 90725号公報 (第 3頁、図 1)  Patent Document 2: JP-A-5-90725 (Page 3, FIG. 1)
特許文献 3：特開昭 61 - 22580号公報 (第 2頁、図 1 (b) )  Patent Document 3: JP-A-61-22580 (page 2, FIG. 1 (b))
発明の開示  Disclosure of the invention
発明が解決しょうとする課題  Problems to be solved by the invention
[0007] 上記従来の接続装置では、（1)接続部 50を引き剥がす際にフレキシブルプリント 基板 6が破損する。（2)接着剤 8の除去が困難である。（3)新しい接着剤 8の再付着 力うまくいかない、などの問題があった。 [0007] In the conventional connection device described above, (1) the flexible printed circuit board 6 is damaged when the connection portion 50 is peeled off. (2) It is difficult to remove the adhesive 8. (3) The re-adhesive strength of the new adhesive 8 did not work.
[0008] また、再接続を行う際、事前に基板の接続部を加熱して接着剤 8を付ける場合、液 晶 7のような耐熱性の弱い部品があると部分的な加熱で実施する必要があり、高密度 な実装を行って 、るモジュール部品では、接続部と耐熱性の弱 、部品との間隔が狭 いため、さらに (4)部分的な加熱が困難である。（5)長時間の加熱が必要な場合に は作業効率も悪くなる、という問題があった。 [0008] In addition, when reconnecting, when heating the connection portion of the substrate and applying the adhesive 8 in advance, if there is a component having low heat resistance such as the liquid crystal 7, it is necessary to perform partial heating. (4) Partial heating is difficult due to the low heat resistance and the short distance between the components in the module components that are mounted at high density. (5) When long-time heating is required, there is a problem that work efficiency is deteriorated.
[0009] 本発明は、上記従来の課題を解決した、容易に再接続することができるフレキシブ ルプリント基板の接続装置を提供することを目的とする。  [0009] It is an object of the present invention to provide a flexible printed circuit board connection device that solves the above-mentioned conventional problems and can be easily reconnected.
課題を解決するための手段  Means for solving the problem
[0010] 本発明の接続装置は、フレキシブルプリント基板と他のプリント基板を接続用フレキ シブルプリント基板で中継する構成を採る。この構成により、フレキシブルプリント基 板と他のプリント基板の再接続の作業を、中継して ヽる接続用フレキシブルプリント基 板を取り替えることにより容易に行うことができる。 The connection device of the present invention employs a configuration in which a flexible printed board and another printed board are relayed by a flexible printed board for connection. With this configuration, the work of reconnecting the flexible printed circuit board to another printed circuit board can be easily performed by replacing the connection flexible printed circuit board to be relayed.
[0011] また、本発明の接続装置は、接続用フレキシブルプリント基板の接続部に熱可塑性 の接着剤を備えた構成を採る。この構成により、接続用フレキシブルプリント基板を熱 して、フレキシブルプリント基板と他のプリント基板を再接続することができるため、フ レキシブルプリント基板およびプリント基板に設けられた液晶などの熱に弱い部品を 損傷することなぐフレキシブルプリント基板およびプリント基板より接続用フレキシブ ルプリント基板を剥がすことができる。 [0012] また、本発明の接続装置は、接続用フレキシブルプリント基板の片面または両面の 接続部に熱可塑性の接着剤を備えた構成を有する。この構成により、接続用フレキ シブルプリント基板を剥がした後、フレキシブルプリント基板および他のプリント基板 上に残った接着剤の除去を行わず、また、新たに接着剤を付けない状態のままで、 接続用フレキシブルプリント基板を取り替えることにより容易に再接続を行うことがで きる。 [0011] The connecting device of the present invention employs a configuration in which a connecting portion of the connecting flexible printed circuit board is provided with a thermoplastic adhesive. With this configuration, the flexible printed circuit board for connection can be heated to reconnect the flexible printed circuit board to another printed circuit board. The flexible printed circuit board for connection can be peeled off from the flexible printed circuit board and the printed circuit board without being damaged. [0012] The connection device of the present invention has a configuration in which a thermoplastic adhesive is provided on one or both connection portions of a flexible printed circuit board for connection. With this configuration, after the flexible printed circuit board for connection is peeled off, the adhesive remaining on the flexible printed circuit board and other printed circuit boards is not removed, and the connection is performed with no new adhesive applied. Reconnection can be easily performed by replacing the flexible printed circuit board.
[0013] また、本発明の接続装置は、熱可塑性の接着剤に導電性粒子を含めた構成を採る 。この構成により、接続用フレキシブルプリント基板、フレキシブルプリント基板および 他のプリント基板の端子部の高さのばらつきやめつきの凹凸のばらつきを吸収するこ とができ、電気的な接続の安定性を高めることができる。  [0013] The connection device of the present invention employs a configuration in which conductive particles are included in a thermoplastic adhesive. With this configuration, it is possible to absorb variations in the height of the terminals of the flexible printed circuit board for connection, flexible printed circuit boards, and other printed circuit boards, as well as variations in the unevenness of the mounting, thereby improving the stability of electrical connection. it can.
[0014] また、本発明の接続装置は、中継する接続用フレキシブルプリント基板の片面また は両面の端子上に突起を設けている。この構成により、接続用フレキシブルプリント 基板とフレキシブルプリント基板および、接続用フレキシブルプリント基板と他のプリ ント基板の接続において、突起の先端が端子と端子の間に挟まった接着剤を突き破 り、フレキシブルプリント基板の端子およびプリント基板の端子に接するため、電気的 な接続の安定性をさらに高めることができる。  [0014] Further, in the connection device of the present invention, the protrusion is provided on one or both terminals of the flexible printed circuit board for connection to be relayed. With this configuration, when connecting the flexible printed circuit board for connection to the flexible printed circuit board, and when connecting the flexible printed circuit board for connection to another printed circuit board, the tip of the projection breaks through the adhesive sandwiched between the terminals, and the flexible printed circuit board is flexible. Since the terminals of the printed circuit board and the terminals of the printed circuit board are in contact with each other, the stability of electrical connection can be further improved.
発明の効果  The invention's effect
[0015] 本発明は、モジュール部品などに使われているフレキシブルプリント基板と、他のフ レキシブルプリント基板や硬質基板を、あらかじめ片面または両面の接続部に熱可 塑性の接着剤を備えた接続用フレキシブルプリント基板で接続したことにより、再接 続の作業を容易に行うことができる。また、中継する接続用フレキシブルプリント基板 を設けることにより、フレキシブルプリント基板や硬質基板に設けられた液晶モジユー ル等の電子部品を、歪みや熱などで破損させることなく再接続できるという効果があ る。  [0015] The present invention relates to a method for connecting a flexible printed circuit board used for a module component or the like and another flexible printed circuit board or a rigid board to a connecting part provided with a thermoplastic adhesive in one or both connecting parts in advance. The connection with the flexible printed circuit board facilitates the reconnection work. In addition, by providing a connecting flexible printed circuit board for relaying, there is an effect that electronic components such as a liquid crystal module provided on the flexible printed circuit board or the rigid board can be reconnected without being damaged by distortion, heat, or the like. .
図面の簡単な説明  Brief Description of Drawings
[0016] [図 1] (a)本発明第 1の実施の形態における接続装置の接続前の状態の断面図 (b) 本発明第 1の実施の形態における接続装置の接続状態の断面図（c)本発明第 1の 実施の形態における接続装置の部分断面図 [図 2]本発明第 1の実施の形態における接続用フレキシブルプリント基板の外観図 [図 3]本発明の接続装置の再接続方法のフローチャート FIG. 1 (a) Cross-sectional view of a connection device according to the first embodiment of the present invention before connection (b) Cross-sectional view of the connection device of the first embodiment of the present invention ( c) Partial sectional view of the connection device according to the first embodiment of the present invention FIG. 2 is an external view of a flexible printed circuit board for connection according to a first embodiment of the present invention. FIG. 3 is a flowchart of a method for reconnecting a connecting device of the present invention.
[図 4] (a)本発明第 2の実施の形態における接続装置の断面図 (b)本発明第 2の実 施の形態における接続装置の部分断面図  FIG. 4 (a) Cross-sectional view of a connection device according to a second embodiment of the present invention. (B) Partial cross-sectional view of a connection device according to a second embodiment of the present invention.
[図 5] (a)本発明第 3の実施の形態における接続装置の断面図 (b)本発明第 3の実 施の形態における接続装置の部分断面図  FIG. 5 (a) Cross-sectional view of a connection device according to a third embodiment of the present invention. (B) Partial cross-sectional view of a connection device according to a third embodiment of the present invention.
[図 6]本発明第 3の実施の形態における接続用フレキシブルプリント基板の外観図 [図 7] (a)本発明第 4の実施の形態における接続装置の断面図 (b)本発明第 4の実 施の形態における接続装置の部分断面図  FIG. 6 is an external view of a connection flexible printed circuit board according to a third embodiment of the present invention. FIG. 7 (a) a cross-sectional view of a connection device according to a fourth embodiment of the present invention; Partial sectional view of a connection device according to an embodiment.
[図 8] (a)本発明第 5の実施の形態における接続装置の断面図 (b)本発明第 5の実 施の形態における接続装置の部分断面図  FIG. 8 (a) Cross-sectional view of a connection device according to a fifth embodiment of the present invention. (B) Partial cross-sectional view of a connection device according to a fifth embodiment of the present invention.
[図 9] (a)本発明第 6の実施の形態における接続装置の断面図 (b)本発明第 6の実 施の形態における接続装置の部分断面図  FIG. 9 (a) Cross-sectional view of a connection device according to a sixth embodiment of the present invention. (B) Partial cross-sectional view of a connection device according to a sixth embodiment of the present invention.
[図 10] (a)本発明第 7の実施の形態における接続装置の断面図 (b)本発明第 7の実 施の形態における接続装置の部分断面図  FIG. 10 (a) Cross-sectional view of a connection device according to a seventh embodiment of the present invention. (B) Partial cross-sectional view of a connection device according to a seventh embodiment of the present invention.
[図 11] (a)本発明第 8の実施の形態における接続装置の断面図 (b)本発明第 8の実 施の形態における接続装置の部分断面図  FIG. 11 (a) Cross-sectional view of a connection device according to an eighth embodiment of the present invention. (B) Partial cross-sectional view of a connection device according to an eighth embodiment of the present invention.
[図 12]従来の接続装置の断面図  FIG. 12 is a cross-sectional view of a conventional connection device.
[図 13]従来の接続装置の再接続方法のフローチャート  FIG. 13 is a flowchart of a conventional connection device reconnection method.
符号の説明 Explanation of symbols
1 プリント基板  1 Printed circuit board
2aゝ 2bゝ 2cゝ 2d 導体  2a ゝ 2b ゝ 2c ゝ 2d conductor
3a、 3b、 3c レジス卜  3a, 3b, 3c registry
4a, 4b 電子部品  4a, 4b Electronic components
5a、 5b、 5c、 5d、 5e、 5f 子  5a, 5b, 5c, 5d, 5e, 5f child
50 接続部  50 Connection
6 フレキシブルプリント基板  6 Flexible printed circuit board
7 液晶 8 接着剤 7 LCD 8 Adhesive
9、 12 接続用フレキシブルプリント基板  9, 12 Flexible printed circuit board for connection
10 導電性粒子  10 conductive particles
11 突起  11 protrusion
発明を実施するための最良の形態  BEST MODE FOR CARRYING OUT THE INVENTION
[0018] 以下、本発明を実施するための最良の形態について、図面を参照しながら説明す る。  Hereinafter, the best mode for carrying out the present invention will be described with reference to the drawings.
[0019] (実施の形態 1)  (Embodiment 1)
図 1に本発明の第 1の実施の形態に係る接続装置の断面図を示す。なお、従来例 と同一の部分は同一の番号を付して説明を省略する。図 1 (a)は、プリント基板 1とフ レキシブルプリント基板 6を接続用フレキシブルプリント基板 9で接続する前の状態の 断面図である。図 1 (b)は接続用フレキシブルプリント基板 9でプリント基板 1とフレキ シブルプリント基板 6を接続した状態の断面図であり、図 1 (c)は図 1 (b)の接続部を 拡大した部分断面図である。図 2に接続用フレキシブルプリント基板 9の端子 5c、 5d を上にして示した外観図を示す。  FIG. 1 shows a cross-sectional view of the connection device according to the first embodiment of the present invention. The same parts as those in the conventional example are denoted by the same reference numerals, and description thereof is omitted. FIG. 1A is a cross-sectional view of a state before the printed circuit board 1 and the flexible printed circuit board 6 are connected by the connecting flexible printed circuit board 9. Fig. 1 (b) is a cross-sectional view of the state in which the printed circuit board 1 and the flexible printed circuit board 6 are connected by the connection flexible printed circuit board 9, and Fig. 1 (c) is an enlarged view of the connection part in Fig. 1 (b). It is sectional drawing. FIG. 2 is an external view showing the connection flexible printed circuit board 9 with the terminals 5c and 5d facing upward.
[0020] 図 1 (a)において、プリント基板 1は表面上に導体 2aを備える。導体 2aは回路パタ ーンを形成し、導体 2aの一端に端子 5aを設ける。導体 2aと電気的に繋がるように、 電子部品 4aをプリント基板 1上に配置する。プリント基板 1の端子 5aおよび電子部品 4a以外の部分にレジスト 3aを設け、電気的に短絡することを防止する。  In FIG. 1A, the printed circuit board 1 has a conductor 2a on the surface. The conductor 2a forms a circuit pattern, and a terminal 5a is provided at one end of the conductor 2a. The electronic component 4a is arranged on the printed circuit board 1 so as to be electrically connected to the conductor 2a. A resist 3a is provided on portions other than the terminals 5a and the electronic components 4a of the printed circuit board 1 to prevent an electrical short circuit.
[0021] フレキシブルプリント基板 6は液晶 7のモジュールの一部である。フレキシブルプリン ト基板 6は表面上に導体 2bを備える。導体 2bは回路パターンを形成し、導体 2bの一 端に端子 5bを設ける。導体 2bと電気的に繋がるように、電子部品 4bをフレキシブル プリント基板 6上に配置する。フレキシブルプリント基板 6の端子 5bおよび電子部品 4 b以外の部分にレジスト 3bを設け、電気的に短絡することを防止する。  The flexible printed circuit board 6 is a part of a liquid crystal 7 module. The flexible print substrate 6 has a conductor 2b on the surface. The conductor 2b forms a circuit pattern, and a terminal 5b is provided at one end of the conductor 2b. The electronic component 4b is arranged on the flexible printed circuit board 6 so as to be electrically connected to the conductor 2b. A resist 3b is provided on portions of the flexible printed circuit board 6 other than the terminals 5b and the electronic components 4b to prevent an electrical short circuit.
[0022] 接続用フレキシブルプリント基板 9は片面に導体 2cを備える。導体 2cは回路パター ンを形成し、導体 2cの両端に端子 5c、 5dを設ける。接続用フレキシブルプリント基板 9の端子 5c、 5d以外の部分にレジスト 3cを設け、電気的に短絡することを防止してい る。端子 5c、 5dを含む接続部 50に熱可塑性の接着剤 8をあらかじめ付着しておく。 [0023] 図 3は本発明の再接続方法のフローチャートである。まず、接続用フレキシブルプリ ント基板 9の接続部 50をホットプレートなどで加熱を行い (ステップ S 11)、その状態 で上側の接続用フレキシブルプリント基板 9を水平方向または、上方向に引張ること でプリント基板 1およびフレキシブルプリント基板 6から接続用フレキシブルプリント基 板 9を剥す (ステップ S 12)。接続用フレキシブルプリント基板 9を剥したあと、新規の 接続用フレキシブルプリント基板 9に接着剤の付着を行い、加熱処理が必要な場合 には加熱処理を行う（ステップ S13)。この接着剤付きの接続用フレキシブルプリント 基板 9と剥した接続用フレキシブルプリント基板 9を取替え (ステップ S14)、再度、新 しく用意した接着剤付きの接続用フレキシブルプリント基板 9をフレキシブルプリント 基板 6とプリント基板 1とを加熱加圧して接続し (ステップ S15)、再接続を完成させる（ ステップ S16)。このとき、交換用の接続用フレキシブルプリント基板 9には、あらかじ め接着剤を付着するため、従来例のように接着剤の残りを除去し、プリント基板 1およ びフレキシブルプリント基板 6に新たに接着剤 8を付け直す必要はない。 The flexible printed circuit board 9 for connection includes a conductor 2c on one surface. The conductor 2c forms a circuit pattern, and terminals 5c and 5d are provided at both ends of the conductor 2c. A resist 3c is provided on portions other than the terminals 5c and 5d of the connection flexible printed circuit board 9 to prevent an electrical short circuit. A thermoplastic adhesive 8 is applied in advance to the connecting portion 50 including the terminals 5c and 5d. FIG. 3 is a flowchart of the reconnection method of the present invention. First, the connection portion 50 of the connection flexible printed circuit board 9 is heated with a hot plate or the like (step S11), and in this state, the upper connection flexible printed circuit board 9 is pulled horizontally or upward to perform printing. The connection flexible printed board 9 is peeled off from the board 1 and the flexible printed board 6 (Step S12). After peeling off the flexible printed circuit board 9 for connection, an adhesive is applied to the new flexible printed circuit board 9 for connection, and if necessary, heat treatment is performed (step S13). The connection flexible printed circuit board 9 with the adhesive is replaced with the peeled connection flexible printed circuit board 9 (step S14), and the newly prepared connection flexible printed circuit board 9 with the adhesive is printed on the flexible printed circuit board 6 again. The substrate 1 is connected by heating and pressurizing (step S15) to complete reconnection (step S16). At this time, since the adhesive is previously attached to the replacement connection flexible printed circuit board 9, the remaining adhesive is removed as in the conventional example, and the printed circuit board 1 and the flexible printed circuit board 6 are newly attached. There is no need to reapply the adhesive 8 to the.
[0024] このような本発明の第 1の実施の形態によれば、接続用フレキシブルプリント基板 9 を加熱しながら接続部 50を剥すことによりプリント基板 1およびフレキシブルプリント 基板 6の損傷を防ぎ、また、本発明により、交換用の接続用フレキシブルプリント基板 9に事前に接着剤を付着させることができるため、プリント基板 1およびフレキシブル プリント基板 6から接着剤 8の除去することや、除去後にプリント基板 1およびフレキシ ブルプリント基板 6に接着剤 8の再付着を行わずに再接続の作業を行うことができる。  According to such a first embodiment of the present invention, the connection portion 50 is peeled off while heating the flexible printed circuit board 9 for connection, thereby preventing the printed circuit board 1 and the flexible printed circuit board 6 from being damaged. According to the present invention, the adhesive can be attached to the connection flexible printed circuit board 9 for replacement in advance, so that the adhesive 8 can be removed from the printed circuit board 1 and the flexible printed circuit board 6, and the printed circuit board 1 can be removed after the removal. In addition, the reconnection work can be performed without re-adhering the adhesive 8 to the flexible printed circuit board 6.
[0025] またプリント基板 1は、フレキシブルプリント基板、硬質基板などどのような種類のプ リント基板でも良い。また液晶 7は、スピーカ一等の他の電子部品でも良い。  [0025] The printed board 1 may be any type of printed board such as a flexible printed board or a hard board. The liquid crystal 7 may be another electronic component such as a speaker.
[0026] (実施の形態 2)  (Embodiment 2)
次に本発明の第 2の実施の形態のフレキシブルプリント基板を用いた接続装置に ついて説明する。図 4に本発明の第 2の実施の形態の接続装置の断面図を示す。図 4 (a)は接続用フレキシブルプリント基板 9でプリント基板 1とフレキシブルプリント基板 6を接続した状態の断面図であり、図 4 (b)は図 4 (a)の接続部を拡大した部分断面 図である。図 4において、プリント基板 1、フレキシブルプリント基板 6と接続用フレキシ ブルプリント基板 9の接続に用いる接着剤 8に導電性粒子 10を含む。他の構成およ び再接続方法は、実施の形態 1と同様である。 Next, a connection device using a flexible printed circuit board according to a second embodiment of the present invention will be described. FIG. 4 is a sectional view of a connection device according to a second embodiment of the present invention. 4A is a cross-sectional view showing a state in which the printed circuit board 1 and the flexible printed circuit board 6 are connected by the connection flexible printed circuit board 9, and FIG. 4B is a partial cross-sectional view in which the connection portion of FIG. 4A is enlarged. FIG. In FIG. 4, conductive particles 10 are included in an adhesive 8 used for connecting the printed circuit board 1, the flexible printed circuit board 6, and the flexible printed circuit board 9 for connection. Other configurations and The reconnection method is the same as in the first embodiment.
[0027] 本発明の第 2の実施の形態によれば、第 1の実施の形態と同様に容易に再接続作 業を行うことができる。更に、接着剤 8に含まれた導電性粒子 10が端子 5aと 5c、 5bと 5dの間を導電するため、端子 5a、 5bの高さばらつきや、めっきの凹凸ばらつきを吸 収することができ、接続後の電気的な接続の安定性を高めることができる。  According to the second embodiment of the present invention, a reconnection operation can be easily performed as in the first embodiment. Furthermore, since the conductive particles 10 contained in the adhesive 8 conduct between the terminals 5a and 5c and between the terminals 5b and 5d, variations in height of the terminals 5a and 5b and variations in unevenness of plating can be absorbed. The stability of the electrical connection after the connection can be improved.
[0028] (実施の形態 3)  (Embodiment 3)
次に本発明の第 3の実施の形態のフレキシブルプリント基板を用いた接続装置に ついて説明する。図 5に本発明の第 3の実施の形態の接続装置の断面図を示す。図 5 (a)は接続用フレキシブルプリント基板 9でプリント基板 1とフレキシブルプリント基板 6を接続した状態の断面図であり、図 5 (b)は図 5 (a)の接続部を拡大した部分断面 図である。図 5において、接続用フレキシブルプリント基板 9の端子 5c、 5d上に予め めっきやエッチングでィ匕学的に加工された突起 11を備える。他の構成および再接続 方法は実施の形態 1と同じである。  Next, a connection device using a flexible printed circuit board according to a third embodiment of the present invention will be described. FIG. 5 shows a sectional view of a connection device according to a third embodiment of the present invention. FIG. 5 (a) is a cross-sectional view showing a state in which the printed circuit board 1 and the flexible printed circuit board 6 are connected by the connection flexible printed circuit board 9, and FIG. 5 (b) is a partial cross-sectional view in which the connection portion of FIG. FIG. In FIG. 5, protrusions 11 are formed on the terminals 5c and 5d of the connection flexible printed circuit board 9 in advance by plating or etching. Other configurations and a reconnection method are the same as those in the first embodiment.
[0029] 本発明の第 3の実施の形態によれば、第 1の実施の形態と同様に容易に再接続作 業を行うことができる。更に、端子 5aと 5c、および端子 5bと 5dの間に挟まった接着剤 8を突起 11が突き破り、また突起 11が端子 5a、 5bに接するため、電気的な接続の安 定性を高めることができる。  [0029] According to the third embodiment of the present invention, a reconnection operation can be easily performed similarly to the first embodiment. Further, the protrusion 11 breaks through the adhesive 8 sandwiched between the terminals 5a and 5c and the terminals 5b and 5d, and the protrusion 11 contacts the terminals 5a and 5b, so that the stability of the electrical connection can be improved. .
[0030] 図 6に第 3の実施の形態の接続用フレキシブルプリント基板 9の端子 5c、 5dを上に して示した外観図を示す。第 3の実施の形態においては、接着剤 8に導電性粒子 10 を用いていない。端子 5c、 5dの配線と配線の間隔 Aを小さくすることができるため、 接続用フレキシブルプリント基板 9の幅を小さくすることができる。また、突起 11は化 学的加工のほか、金型などにより物理的にカ卩ェしても良い。  FIG. 6 is an external view of the connection flexible printed circuit board 9 according to the third embodiment, with the terminals 5c and 5d shown above. In the third embodiment, the conductive particles 10 are not used for the adhesive 8. Since the distance A between the wires of the terminals 5c and 5d can be reduced, the width of the flexible printed circuit board 9 for connection can be reduced. The protrusions 11 may be physically processed by a mold or the like in addition to the chemical processing.
[0031] (実施の形態 4)  (Embodiment 4)
次に本発明の第 4の実施の形態のフレキシブルプリント基板を用いた接続装置に ついて説明する。図 7に本発明の第 4の実施の形態の接続装置の断面図を示す。図 7 (a)は接続用フレキシブルプリント基板 9でプリント基板 1とフレキシブルプリント基板 6を接続した状態の断面図であり、図 7 (b)は図 7 (a)の接続部を拡大した部分断面 図である。図 7において、接続用フレキシブルプリント基板 9は片面の端子 5c、 5d上 に突起 11を備えている。また、接続に用いる接着剤 8に導電性粒子 10を含む。他の 構成および再接続方法は、実施の形態 1と同じである。 Next, a connection device using a flexible printed circuit board according to a fourth embodiment of the present invention will be described. FIG. 7 shows a sectional view of a connection device according to a fourth embodiment of the present invention. 7A is a cross-sectional view showing a state in which the printed circuit board 1 and the flexible printed circuit board 6 are connected by the connection flexible printed circuit board 9, and FIG. 7B is a partial cross-sectional view in which the connection portion of FIG. 7A is enlarged. FIG. In FIG. 7, the flexible printed circuit board 9 for connection is on the terminals 5c and 5d on one side. The projection 11 is provided. The adhesive 8 used for the connection includes the conductive particles 10. Other configurations and a reconnection method are the same as those in the first embodiment.
[0032] 本発明の第 4の実施の形態によれば、第 1の実施の形態と同様に容易に再接続作 業を行うことができる。さらに、端子 5aと 5c、および端子 5bと 5dの間に挟まった接着 剤 8を突起 11が突き破るため、電気的な接続の安定性を高めることができる。更に、 接着剤 8に含まれた導電性粒子 10が端子 5aと 5c、 5bと 5dの間を導電するため、端 子 5a、 5bの高さのばらつきと、めっきの凹凸のばらつきを吸収することができ、接続 後の電気的な接続の安定性を高めることができる。  According to the fourth embodiment of the present invention, a reconnection operation can be easily performed as in the first embodiment. Further, since the protrusions 11 pierce the adhesive 8 sandwiched between the terminals 5a and 5c and the terminals 5b and 5d, the stability of the electrical connection can be improved. Furthermore, since the conductive particles 10 contained in the adhesive 8 conduct between the terminals 5a and 5c and between the terminals 5b and 5d, it is necessary to absorb variations in height of the terminals 5a and 5b and variations in plating irregularities. Therefore, the stability of the electrical connection after the connection can be improved.
[0033] (実施の形態 5)  (Embodiment 5)
次に本発明の第 5の実施の形態のフレキシブルプリント基板を用いた接続装置に ついて説明する。図 8に本発明の第 5の実施の形態の接続装置の断面図を示す。図 8 (a)はプリント基板 1とフレキシブルプリント基板 6の間に接続用フレキシブルプリント 基板 12を接続した状態の断面図であり、図 8 (b)は図 8 (a)の接続部を拡大した部分 断面図である。図 8において、プリント基板 1とフレキシブルプリント基板 6とを接続す る接続用フレキシブルプリント基板 12は両面配線板であり、両面に端子 5e、 5fを有し ている。端子 5e、 5fは接続用フレキシブルプリント基板 12にあけた穴に導体 2dを充 填することにより導通している。他の構成および再接続方法は、実施の形態 1と同じ である。  Next, a connection device using a flexible printed circuit board according to a fifth embodiment of the present invention will be described. FIG. 8 shows a sectional view of a connection device according to a fifth embodiment of the present invention. FIG. 8 (a) is a cross-sectional view showing a state in which a connection flexible printed circuit board 12 is connected between the printed circuit board 1 and the flexible printed circuit board 6, and FIG. 8 (b) is an enlarged view of the connection portion in FIG. 8 (a). It is a partial sectional view. In FIG. 8, a connecting flexible printed board 12 for connecting the printed board 1 and the flexible printed board 6 is a double-sided wiring board, and has terminals 5e and 5f on both sides. The terminals 5e and 5f are electrically connected to each other by filling the holes made in the connection flexible printed circuit board 12 with the conductors 2d. Other configurations and a reconnection method are the same as those in the first embodiment.
[0034] 本発明の第 5の実施の形態によれば、接続用フレキシブルプリント基板 12を剥がす ことにより、第 1の実施の形態と同様に容易に再接続作業を行うことができる。プリント 基板 1が硬質基板であるときは、接続用フレキシブルプリント基板 12が先に破れるの でフレキシブルプリント基板 6の損傷を防ぐことができる。更に、接続用フレキシブル プリント基板 12の両面の端子 5e、 5fにあらカゝじめ、熱可塑性の接着剤 8を備えること により、第 1の実施の形態の接続装置より接続に必要な面積を少なくすることができる  According to the fifth embodiment of the present invention, the reconnection work can be easily performed similarly to the first embodiment, by peeling off the flexible printed circuit board 12 for connection. When the printed board 1 is a hard board, the flexible printed board 12 for connection is broken first, so that the flexible printed board 6 can be prevented from being damaged. Further, by providing the terminals 5e and 5f on both sides of the connection flexible printed circuit board 12 with the thermoplastic adhesive 8, the area required for connection is smaller than that of the connection device of the first embodiment. can do
[0035] なお、両面に端子 5e、 5fを有する接続用フレキシブルプリント基板 12は、片面配線 板を折り曲げて両面に端子を備える構成にしたものや、多層配線板でも良い。 The flexible printed circuit board 12 having the terminals 5e and 5f on both sides may be a single-sided wiring board bent to have terminals on both sides or a multilayer wiring board.
[0036] (実施の形態 6) 次に本発明の第 6の実施の形態のフレキシブルプリント基板を用いた接続装置に ついて説明する。図 9に本発明の第 6の実施の形態の接続装置の断面図を示す。図 9 (a)はプリント基板 1とフレキシブルプリント基板 6の間に接続用フレキシブルプリント 基板 12を接続した状態の断面図であり、図 9 (b)は図 9 (a)の接続部を拡大した部分 断面図である。図 9において、接続に用いる接着剤 8は導電性粒子 10を含んだもの である。他の構成および再接続方法は、実施の形態 5と同じである。 (Embodiment 6) Next, a connection device using a flexible printed circuit board according to a sixth embodiment of the present invention will be described. FIG. 9 shows a sectional view of a connection device according to a sixth embodiment of the present invention. FIG. 9 (a) is a cross-sectional view showing a state in which the connection flexible printed circuit board 12 is connected between the printed circuit board 1 and the flexible printed circuit board 6, and FIG. 9 (b) is an enlarged view of the connection portion of FIG. It is a partial sectional view. In FIG. 9, an adhesive 8 used for connection contains conductive particles 10. Other configurations and a reconnection method are the same as those in the fifth embodiment.
[0037] 本発明の第 6の実施の形態によれば、第 1の実施の形態と同様に容易に再接続作 業を行うことができる。更に、第 2の実施の形態と同様に端子 5a、 5bの高さばらつき や、めっきの凹凸ばらつきを吸収することができ、接続後の電気的な接続の安定性を 高めることができる。更に、第 5の実施の形態と同様に、接続用フレキシブルプリント 基板 12は両面に端子 5e、 5fを備えるため、第 2の実施の形態の接続装置より接続に 必要な面積を少なくすることができる。  According to the sixth embodiment of the present invention, a reconnection operation can be performed easily as in the first embodiment. Further, as in the second embodiment, variations in height of the terminals 5a and 5b and variations in unevenness of plating can be absorbed, and the stability of electrical connection after connection can be improved. Furthermore, similarly to the fifth embodiment, the connection flexible printed circuit board 12 has the terminals 5e and 5f on both sides, so that the area required for connection can be reduced as compared with the connection device of the second embodiment. .
[0038] (実施の形態 7)  (Embodiment 7)
次に本発明の第 7の実施の形態のフレキシブルプリント基板を用いた接続装置に ついて説明する。図 10に本発明の第 7の実施の形態の接続装置の断面図を示す。 図 10 (a)はプリント基板 1とフレキシブルプリント基板 6の間に接続用フレキシブルプリ ント基板 12を接続した状態の断面図であり、図 10 (b)は図 10 (a)の接続部を拡大し た部分断面図である。図 10において、接続用フレキシブルプリント基板 12は両面の 端子 5e、 5f上に突起 11を備えたものである。他の構成および再接続方法は、実施 の形態 5と同じである。  Next, a connection device using a flexible printed circuit board according to a seventh embodiment of the present invention will be described. FIG. 10 is a sectional view of a connection device according to a seventh embodiment of the present invention. FIG. 10 (a) is a cross-sectional view showing a state in which the connection flexible printed circuit board 12 is connected between the printed circuit board 1 and the flexible printed circuit board 6, and FIG. 10 (b) is an enlarged view of the connecting portion in FIG. 10 (a). FIG. In FIG. 10, the flexible printed circuit board 12 for connection has protrusions 11 on the terminals 5e and 5f on both sides. Other configurations and a reconnection method are the same as those in the fifth embodiment.
[0039] 本発明の第 7の実施の形態によれば、第 1の実施の形態と同様に容易に再接続作 業を行うことができる。更に、第 3の実施の形態と同様に突起 11が接着剤 8突き破り、 突起 11が端子 5a、 5bに接するため、電気的な接続の安定性を高めることができる。 また、接着剤 8が導電性粒子 10を用いていないため、端子 5e、 5fの配線と配線の間 隔を小さくすることが出来る。このため、接続用フレキシブルプリント基板 12の幅を小 さくすることができる。更に、第 5の実施の形態と同様に、接続用フレキシブルプリント 基板 12は両面に端子 5e、 5fを備えるため、第 3の実施の形態の接続装置より接続に 必要な面積を少なくすることができる。 [0040] (実施の形態 8) According to the seventh embodiment of the present invention, a reconnection operation can be easily performed as in the first embodiment. Further, similarly to the third embodiment, since the protrusion 11 breaks through the adhesive 8 and the protrusion 11 comes into contact with the terminals 5a and 5b, the stability of the electrical connection can be improved. Further, since the adhesive 8 does not use the conductive particles 10, the distance between the wires of the terminals 5e and 5f can be reduced. Therefore, the width of the connection flexible printed circuit board 12 can be reduced. Further, similarly to the fifth embodiment, the connection flexible printed circuit board 12 has the terminals 5e and 5f on both sides, so that the area required for connection can be reduced as compared with the connection device of the third embodiment. . (Embodiment 8)
次に本発明の第 8の実施の形態のフレキシブルプリント基板を用いた接続装置に っ 、て説明する。図 11に本発明の第 8の実施の形態の接続装置の断面図を示す。 図 11において、接続用フレキシブルプリント基板 12は両面の端子 5e、 5f上に突起 1 1を備え、接着剤 8は導電性粒子 10を有している。他の構成および再接続方法は、 実施の形態 5と同じである。  Next, a connection device using a flexible printed circuit board according to an eighth embodiment of the present invention will be described. FIG. 11 shows a sectional view of a connection device according to an eighth embodiment of the present invention. In FIG. 11, the flexible printed circuit board 12 for connection is provided with protrusions 11 on the terminals 5e and 5f on both sides, and the adhesive 8 has the conductive particles 10. Other configurations and a reconnection method are the same as those in the fifth embodiment.
[0041] 本発明の第 8の実施の形態によれば、第 1の実施の形態と同様に容易に再接続作 業を行うことができる。更に、第 4の実施の形態と同様に、突起 11が接着剤 8突き破る ため、電気的な接続の安定性を高めることができる。また、接着剤 8に含まれた導電 性粒子 10が端子 5aと 5e、 5bと 5fの間を導電するため、端子 5a、 5bの高さのばらつ きと、めっきの凹凸のばらつきを吸収することができ、接続後の電気的な接続の安定 性を更に高めることができる。接続用フレキシブルプリント基板 12は両面に端子 5e、 5fを備えるため、第 4の実施の形態の接続装置より接続に必要な面積を少なくするこ とがでさる。  According to the eighth embodiment of the present invention, a reconnection operation can be performed easily as in the first embodiment. Further, similarly to the fourth embodiment, since the protrusion 11 breaks through the adhesive 8, the stability of the electrical connection can be improved. In addition, since the conductive particles 10 contained in the adhesive 8 conduct between the terminals 5a and 5e and between the terminals 5b and 5f, variations in the height of the terminals 5a and 5b and variations in unevenness of the plating are absorbed. Therefore, the stability of the electrical connection after the connection can be further improved. Since the connection flexible printed circuit board 12 has the terminals 5e and 5f on both sides, the area required for connection can be reduced as compared with the connection device of the fourth embodiment.
本発明を詳細にまた特定の実施態様を参照して説明したが、本発明の精神と範囲 を逸脱することなく様々な変更や修正を加えることができることは当業者にとって明ら かである。  Although the present invention has been described in detail and with reference to specific embodiments, it will be apparent to those skilled in the art that various changes and modifications can be made without departing from the spirit and scope of the invention.
本出願は、 2004年 5月 14日出願の日本特許出願 No.2004-144505に基づくものであ り、その内容はここに参照として取り込まれる。  This application is based on Japanese Patent Application No. 2004-144505 filed on May 14, 2004, the contents of which are incorporated herein by reference.
産業上の利用可能性  Industrial applicability
[0042] 本発明に係るフレキシブルプリント基板を用いた接続装置はフレキシブルプリント基 板とプリント基板との再接続を容易に行うことが可能なため、フレキシブルプリント基 板を用いて高密度な実装を行う携帯機器などの電子機器に有用である。 [0042] The connection device using the flexible printed board according to the present invention can easily perform reconnection between the flexible printed board and the printed board. Therefore, high-density mounting is performed using the flexible printed board. It is useful for electronic devices such as portable devices.

Claims

請求の範囲 The scope of the claims
[1] フレキシブルプリント基板と他のプリント基板とを接続する接続装置において、  [1] In a connection device for connecting a flexible printed board to another printed board,
前記フレキシブルプリント基板と前記他のプリント基板との間に接続用フレキシブル プリント基板を中継手段として用いた接続装置。  A connection device using a flexible printed circuit board for connection as a relay between the flexible printed circuit board and the other printed circuit board.
[2] 前記接続用フレキシブルプリント基板と前記フレキシブルプリント基板、  [2] the connection flexible printed board and the flexible printed board,
および前記接続用フレキシブルプリント基板と前記他のプリント基板とを、熱可塑性 の接着剤で接続した請求項 1記載の接続装置。  2. The connection device according to claim 1, wherein the connection flexible printed board and the other printed board are connected with a thermoplastic adhesive.
[3] 前記接続用フレキシブルプリント基板の片面または両面の接続部に熱可塑性の接着 剤を付着させたことを特徴とする請求項 2記載の接続装置。 3. The connection device according to claim 2, wherein a thermoplastic adhesive is attached to one or both connection portions of the connection flexible printed circuit board.
[4] 前記接着剤は導電性粒子を含んだ接着剤としたことを特徴とする請求項 2または請 求項 3記載の接続装置。 4. The connection device according to claim 2, wherein the adhesive is an adhesive containing conductive particles.
[5] 前記接続用フレキシブルプリント基板の片面または両面の端子上に突起を備えたこ とを特徴とする請求項 2から請求項 4いずれかに記載の接続装置。 5. The connection device according to claim 2, wherein a projection is provided on one or both terminals of the flexible printed circuit board for connection.
PCT/JP2005/008769 2004-05-14 2005-05-13 Connector employing flexible printed board WO2005112527A1 (en)

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Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4605186B2 (en) * 2007-06-08 2011-01-05 住友電気工業株式会社 Substrate manufacturing method
JP2009004603A (en) * 2007-06-22 2009-01-08 Sumitomo Electric Ind Ltd Method of manufacturing substrate
DE102021117881A1 (en) 2021-07-12 2023-01-12 Valeo Schalter Und Sensoren Gmbh Detection device for monitoring at least one monitoring area, vehicle with at least one detection device and method for producing a detection device

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59219877A (en) * 1983-05-30 1984-12-11 キヤノン株式会社 Connecting structure of electronic part
JPS63134568U (en) * 1987-02-26 1988-09-02
JPH04174980A (en) * 1990-11-07 1992-06-23 Hitachi Chem Co Ltd Connecting member for circuit
JP2000252603A (en) * 1999-03-03 2000-09-14 Denso Corp Connecting structure of circuit board
JP2001119116A (en) * 1999-10-15 2001-04-27 Nec Kagoshima Ltd Connecting structure for liquid crystal display device
JP2001135391A (en) * 1999-10-29 2001-05-18 Auto Network Gijutsu Kenkyusho:Kk Connection material of circuit conductor of flat conductor wiring board, and connection method using the same

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04301817A (en) * 1991-03-29 1992-10-26 Rohm Co Ltd Liquid crystal display device and its production
JP3035021B2 (en) * 1991-08-29 2000-04-17 株式会社リコー Liquid crystal display device and method of manufacturing the same
US5592365A (en) * 1993-12-21 1997-01-07 Sharp Kabushiki Kaisha Panel assembly structure and panel assembling method capable of achieving a highly reliable connection of electrode terminals even when the electrode terminals have a fine pitch

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59219877A (en) * 1983-05-30 1984-12-11 キヤノン株式会社 Connecting structure of electronic part
JPS63134568U (en) * 1987-02-26 1988-09-02
JPH04174980A (en) * 1990-11-07 1992-06-23 Hitachi Chem Co Ltd Connecting member for circuit
JP2000252603A (en) * 1999-03-03 2000-09-14 Denso Corp Connecting structure of circuit board
JP2001119116A (en) * 1999-10-15 2001-04-27 Nec Kagoshima Ltd Connecting structure for liquid crystal display device
JP2001135391A (en) * 1999-10-29 2001-05-18 Auto Network Gijutsu Kenkyusho:Kk Connection material of circuit conductor of flat conductor wiring board, and connection method using the same

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
See also references of EP1746867A4 *

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EP1746867A1 (en) 2007-01-24

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