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JPH04174980A - Connecting member for circuit - Google Patents

Connecting member for circuit

Info

Publication number
JPH04174980A
JPH04174980A JP30166790A JP30166790A JPH04174980A JP H04174980 A JPH04174980 A JP H04174980A JP 30166790 A JP30166790 A JP 30166790A JP 30166790 A JP30166790 A JP 30166790A JP H04174980 A JPH04174980 A JP H04174980A
Authority
JP
Grant status
Application
Patent type
Prior art keywords
particles
insulative
connection
conductive
circuit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP30166790A
Inventor
Yasushi Goto
Atsuo Nakajima
Tomohisa Ota
Isao Tsukagoshi
Yutaka Yamaguchi
Original Assignee
Hitachi Chem Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date

Links

Classifications

    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/28Structure, shape, material or disposition of the layer connectors prior to the connecting process
    • H01L2224/29Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
    • H01L2224/29001Core members of the layer connector
    • H01L2224/29099Material
    • H01L2224/29198Material with a principal constituent of the material being a combination of two or more materials in the form of a matrix with a filler, i.e. being a hybrid material, e.g. segmented structures, foams
    • H01L2224/29298Fillers
    • H01L2224/29399Coating material
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/28Structure, shape, material or disposition of the layer connectors prior to the connecting process
    • H01L2224/29Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
    • H01L2224/29001Core members of the layer connector
    • H01L2224/29099Material
    • H01L2224/29198Material with a principal constituent of the material being a combination of two or more materials in the form of a matrix with a filler, i.e. being a hybrid material, e.g. segmented structures, foams
    • H01L2224/29298Fillers
    • H01L2224/29499Shape or distribution of the fillers
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/838Bonding techniques
    • H01L2224/8385Bonding techniques using a polymer adhesive, e.g. an adhesive based on silicone, epoxy, polyimide, polyester
    • H01L2224/83851Bonding techniques using a polymer adhesive, e.g. an adhesive based on silicone, epoxy, polyimide, polyester being an anisotropic conductive adhesive
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01Chemical elements
    • H01L2924/01079Gold [Au]
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/30Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/321Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesive

Abstract

PURPOSE:To achieve highly reliable circuit connection that enables connection of microcircuits by heating both insulative particles and thickness-control particles being harder than the insulative particles, and containing the insulative particles and the thickness-control particles in an insulative adhesive which shows plastic fluidity, the insulative particles comprising conductive particles covered at their surface with a thermoplastic insulative layer. CONSTITUTION:This connecting member comprises insulative particles 1, thickness-control particles 2 and an adhesive 3. The insulative particles 1 have conductive particles 4 substantially covered at their surface with a thermoplastic insulative layer 6. The conductive particles 4 need to show deformation by heating and pressing at the connection of a circuit. As the insulative particles, a macromolecular material such as polystyrene and phenol resin is used as a core 7 and a conductive metal thin layer 5 of Cu, Ni, Au and the like is provided on the surface of the core. A Pb/Sn allay or the like is used as the charged particles 4 showing plastic fluidity by heat. Connection of microcircuits is thus made possible and highly reliable circuit connection is achieved.
JP30166790A 1990-11-07 1990-11-07 Connecting member for circuit Pending JPH04174980A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP30166790A JPH04174980A (en) 1990-11-07 1990-11-07 Connecting member for circuit

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP30166790A JPH04174980A (en) 1990-11-07 1990-11-07 Connecting member for circuit

Publications (1)

Publication Number Publication Date
JPH04174980A true true JPH04174980A (en) 1992-06-23

Family

ID=17899682

Family Applications (1)

Application Number Title Priority Date Filing Date
JP30166790A Pending JPH04174980A (en) 1990-11-07 1990-11-07 Connecting member for circuit

Country Status (1)

Country Link
JP (1) JPH04174980A (en)

Cited By (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0996321A2 (en) * 1998-10-22 2000-04-26 Sony Chemicals Corporation Anisotropically electroconductive adhesive and adhesive film
WO2000024005A1 (en) * 1998-10-19 2000-04-27 Dynal Particles As Particles
US6940180B1 (en) * 1996-09-05 2005-09-06 Seiko Epson Corporation Semiconductor device connecting structure, liquid crystal display unit based on the same connecting structure, and electronic apparatus using the same display unit
WO2007074652A1 (en) 2005-12-26 2007-07-05 Hitachi Chemical Company, Ltd. Adhesive composition, circuit connecting material and connecting structure of circuit member
WO2008023565A1 (en) 2006-08-25 2008-02-28 Hitachi Chemical Company, Ltd. Circuit connecting material, connection structure for circuit member using the same and production method thereof
WO2009051043A1 (en) 2007-10-15 2009-04-23 Hitachi Chemical Company, Ltd. Circuit connecting adhesive film and circuit connecting structure
US7566494B2 (en) 2005-09-02 2009-07-28 Cheil Industries, Inc. Insulated conductive particles and anisotropic conductive adhesive film using the same
JP2009277652A (en) * 2008-04-17 2009-11-26 Hitachi Chem Co Ltd Circuit connection material and connection structure for circuit member
US7815999B2 (en) 2004-05-12 2010-10-19 Cheil Industries, Inc. Insulated conductive particles and anisotropic conductive adhesive film containing the particles
US7879956B2 (en) 1997-03-31 2011-02-01 Hitachi Chemical Company, Ltd. Circuit-connecting material and circuit terminal connected structure and connecting method
CN102195157A (en) * 2010-03-18 2011-09-21 Smk株式会社 Connector
JP2011198773A (en) * 2011-06-28 2011-10-06 Sony Chemical & Information Device Corp Anisotropic conductive film, connection method, and connected body
US20120002320A1 (en) * 2010-06-30 2012-01-05 Charles Allan Brown Particle-capturing device including a component configured to provide an additional function within an enclosure exclusive of capturing particles
WO2013114930A1 (en) * 2012-01-31 2013-08-08 株式会社村田製作所 Electroconductive paste for bonding metal terminal, electronic component having metal terminal, and method for manufacturing same

Cited By (27)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7084517B2 (en) 1996-09-05 2006-08-01 Seiko Epson Corporation Semiconductor device connecting structure, liquid crystal display unit based on the same connecting structure, and electronic apparatus using the same display unit
US6940180B1 (en) * 1996-09-05 2005-09-06 Seiko Epson Corporation Semiconductor device connecting structure, liquid crystal display unit based on the same connecting structure, and electronic apparatus using the same display unit
US7879956B2 (en) 1997-03-31 2011-02-01 Hitachi Chemical Company, Ltd. Circuit-connecting material and circuit terminal connected structure and connecting method
US7967943B2 (en) 1997-03-31 2011-06-28 Hitachi Chemical Company, Ltd. Circuit-connecting material and circuit terminal connected structure and connecting method
US8142605B2 (en) 1997-03-31 2012-03-27 Hitachi Chemical Company, Ltd. Circuit-connecting material and circuit terminal connected structure and connecting method
US7968196B2 (en) 1997-03-31 2011-06-28 Hitachi Chemical Company, Ltd. Circuit-connecting material and circuit terminal connected structure and connecting method
WO2000024005A1 (en) * 1998-10-19 2000-04-27 Dynal Particles As Particles
US6787233B1 (en) 1998-10-19 2004-09-07 Dynal Biotech Asa Particles
EP0996321A3 (en) * 1998-10-22 2003-02-12 Sony Chemicals Corporation Anisotropically electroconductive adhesive and adhesive film
EP0996321A2 (en) * 1998-10-22 2000-04-26 Sony Chemicals Corporation Anisotropically electroconductive adhesive and adhesive film
US7815999B2 (en) 2004-05-12 2010-10-19 Cheil Industries, Inc. Insulated conductive particles and anisotropic conductive adhesive film containing the particles
US7566494B2 (en) 2005-09-02 2009-07-28 Cheil Industries, Inc. Insulated conductive particles and anisotropic conductive adhesive film using the same
EP2348087A1 (en) 2005-12-26 2011-07-27 Hitachi Chemical Company, Ltd. Adhesive composition, circuit connecting material and connecting structure of circuit member
WO2007074652A1 (en) 2005-12-26 2007-07-05 Hitachi Chemical Company, Ltd. Adhesive composition, circuit connecting material and connecting structure of circuit member
EP2322585A1 (en) 2005-12-26 2011-05-18 Hitachi Chemical Co., Ltd. Adhesive composition, circuit connecting material and connecting structure of circuit member
EP2339695A1 (en) 2006-08-25 2011-06-29 Hitachi Chemical Company, Ltd. Circuit connecting material, connection structure for circuit member using the same and production method thereof
WO2008023565A1 (en) 2006-08-25 2008-02-28 Hitachi Chemical Company, Ltd. Circuit connecting material, connection structure for circuit member using the same and production method thereof
WO2009051043A1 (en) 2007-10-15 2009-04-23 Hitachi Chemical Company, Ltd. Circuit connecting adhesive film and circuit connecting structure
JP2009277652A (en) * 2008-04-17 2009-11-26 Hitachi Chem Co Ltd Circuit connection material and connection structure for circuit member
CN102195157A (en) * 2010-03-18 2011-09-21 Smk株式会社 Connector
JP2011198542A (en) * 2010-03-18 2011-10-06 Smk Corp Connector
US20120002320A1 (en) * 2010-06-30 2012-01-05 Charles Allan Brown Particle-capturing device including a component configured to provide an additional function within an enclosure exclusive of capturing particles
US8427775B2 (en) * 2010-06-30 2013-04-23 HGST Netherlands B.V. Particle-capturing device including a component configured to provide an additional function within an enclosure exclusive of capturing particles
JP2011198773A (en) * 2011-06-28 2011-10-06 Sony Chemical & Information Device Corp Anisotropic conductive film, connection method, and connected body
WO2013114930A1 (en) * 2012-01-31 2013-08-08 株式会社村田製作所 Electroconductive paste for bonding metal terminal, electronic component having metal terminal, and method for manufacturing same
JPWO2013114930A1 (en) * 2012-01-31 2015-05-11 株式会社村田製作所 Metal terminal bonding conductive paste, electronic components and its manufacturing method with the metal terminals
US9396832B2 (en) 2012-01-31 2016-07-19 Murata Manufacutring Co., Ltd. Electroconductive paste for bonding metal terminal, electronic component with metal terminal, and method for manufacturing same

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