JP4568650B2 - Board-to-board connection structure - Google Patents

Description

  BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a connection structure between substrates, and in particular, a printed circuit board connected to a liquid crystal monitor of a personal computer and a wiring board of an electronic device such as a mobile phone / digital camera, and a substrate of the electronic device. The present invention relates to a connection structure between a substrate and a circuit.

  In recent years, there have been an increasing number of cases in which ultra-fine coaxial cables are used as wiring in consumer devices, particularly as wiring material for liquid crystal monitors of personal computers and wiring materials for mobile phones and digital cameras. The use of ultra-fine coaxial cables has increased because the stable transmission characteristics of coaxial cables and the high degree of freedom of assembly shape resulting from a thin and flexible structure have been matched to the needs.

  Referring to FIG. 11, conventionally, a board-to-board connection structure 101 includes, for example, a printed board 103, and one end of a plurality of micro coaxial cables 105 is connected to the printed board 103. A very fine coaxial cable assembly 107 is provided. When the printed circuit board 103 and the circuit board 109 of the other electronic device are connected, the plurality of micro coaxial cables 105 are grounded to absorb noise generated outside.

  As the micro coaxial cable assembly 107, a plurality of micro coaxial cables 105 are arranged in parallel at a pitch of 0.3 mm, for example, and flat cable processing is performed in which both sides are unitized into a sandwich with a bundling tape (not shown). Yes. Further, a terminal on one end side in the longitudinal direction of the plurality of micro coaxial cables 105 is connected to, for example, an FPC as a printed circuit board 103 for connecting to a substrate circuit 109 of an electronic device, for example.

  The printed circuit board 103 is provided with a plug connector 111, and a ground circuit 113 for dropping an external conductor (not shown) of the plurality of micro coaxial cables 105 connected to the printed circuit board 103 to the ground is electrically connected to the plug connector 111. Wired. On the other hand, the board circuit 109 is provided with a receptacle connector 115, and a ground circuit 117 is provided for dropping the receptacle connector 115 to the ground. Further, the plug connector 111 and the receptacle connector 115 can be fitted and removed from each other.

  Referring to FIGS. 12 and 13 together, each of the micro coaxial cables 105 has a structure in which, for example, seven center conductors 119 having a diameter of 0.025 mm or 0.03 mmφ are twisted. An insulating layer 121 of, for example, Teflon (registered trademark) resin as a fluorine resin is applied to the outer periphery of the central conductor 119, and the outer periphery of the insulating layer 121 has, for example, about 20 cross sections having a diameter of 0.025 mm or 0.03 mmφ. An outer conductor 123 in which a circular strand is twisted is provided, and the outer periphery of the outer conductor 123 is covered with a jacket 125 of, for example, Teflon (registered trademark) resin as a fluorine resin.

  As shown in Patent Document 1, each of the plurality of micro coaxial cables 105 has its end jacket 125 removed to expose the external conductor 123, and the exposed portion of the external conductor 123 is a pair of ground bars. 127 and 129 are sandwiched from above and below and fixed by soldering 133 with solder 133, and the lower ground bar 127 is soldered together to the shield layer 131 of the printer substrate 103. Further, the center conductor 119 of each micro coaxial cable 105 is connected to each center conductor connection portion 135 of the printer substrate 103. The shield layer 131 is electrically connected to the ground circuit 113 as shown in FIG.

Therefore, in the micro coaxial cable assembly 107 described above, when the plug connector 111 and the receptacle connector 115 are fitted to each other and the printed circuit board 103 and the circuit board 109 of the electronic device are connected, a plurality of external noises are generated. It passes from the outer conductor 123 of the micro coaxial cable 105 through the lower ground bar 127 and is absorbed by the shield layer 131 and the ground circuit 113 of the printer substrate 103, the plug connector 111, the receptacle connector 115, the ground circuit 117, and the substrate circuit 109. .
JP 2004-215435 A

  By the way, in the conventional board-to-board connection structure 101, since the externally generated noise is absorbed by the board circuit 109, the ground circuits 113 and 117 up to the board circuit 109 are detoured. 103, the plug connector 111, and the receptacle connector 115 are affected by external noise, which may affect the signal current.

  In addition, since the resistance of the ground circuits 113 and 117 increases with only one circuit of the plug connector 111 and the receptacle connector 115, the number of connector circuits (number of pins) must be increased to use several circuits in order to reduce the circuit resistance. Don't be. Therefore, the number of connector circuits (number of pins) becomes large, and there is a problem that it is useless.

  The present invention has been made to solve the above-described problems.

The board-to-board connection structure of the present invention includes a first connector and a plurality of center conductor connection portions, and each center conductor connection portion of each end of a plurality of micro coaxial cables arranged in parallel is connected to each center conductor connection portion. The external conductors of the plurality of micro coaxial cables are exposed, and the exposed portions of the external conductors are sandwiched and fixed between a pair of wide first and second ground bars from both sides, and the first ground bar is fixed. A first board connected to the first board and a second board provided with a second connector at a position corresponding to the first connector on the first board; A connection structure between substrates for connecting a second substrate,
A ground circuit is provided at a position of the second substrate facing the second ground bar of the first substrate, and a conductive foam material is attached to at least one of the second ground bar and the ground circuit, so that the conductive The second ground bar is electrically connected to the ground circuit through a foam material.

The board-to-board connection structure of the present invention includes a first connector and a plurality of center conductor connection portions, and each center conductor connection portion of each end of a plurality of micro coaxial cables arranged in parallel is connected to each center conductor connection portion. The outer conductors of the plurality of micro coaxial cables are exposed and the exposed portions of the outer conductors are sandwiched and fixed between a pair of first and second ground bars of normal width from both sides, and the first ground bar is fixed. A first board connected to the first board, and a second board having a second connector at a position corresponding to the first connector of the first board, and the first connector and the second connector are fitted together. A connection structure for connecting the second substrate and the second substrate,
A third ground bar wider than the width of the second ground bar is attached to the second ground bar of the first substrate, and a ground circuit is provided at a position facing the third ground bar of the second substrate. A conductive foam material is attached to at least one of the three ground bars and the ground circuit, and the third ground bar and the ground circuit are electrically connected via the conductive foam material.

  As can be understood from the means for solving the above-described problems, according to the connection structure between substrates according to claim 1 of the present invention, the first and second connectors are fitted to each other and the first and second connectors are fitted to each other. When the two substrates are connected, the second ground bar and the ground circuit of the second substrate come into close contact with each other via the conductive foam material, so that the noise generated outside is the second ground bar, the conductive foam material. The second substrate is grounded directly through the ground circuit. Therefore, the noise of the micro coaxial cable does not affect the signal currents of the first and second connectors, the first substrate, and the like. In addition, since the conductive foam material has cushioning properties, even if vibration or impact occurs in the electronic device mounting this board-to-board connection structure, the above contact surfaces do not leave, so that it is stable. The contact state can be maintained.

  Further, a special circuit such as a jumper line is not required for the ground.

  Furthermore, since the ground circuit and the second ground bar are in close contact with each other through the conductive foam material, the first and second connectors can be easily and quickly inserted and removed.

  Further, since the ground circuit does not pass through the first and second connectors, the number of pins of the connector can be reduced.

  According to the connection structure between substrates of claim 2 of the present invention, when the first substrate and the second substrate are connected by fitting the first and second connectors together, the third ground bar and the second substrate are connected. Since the ground circuit is brought into close contact with the conductive foam material, externally generated noise is directly grounded to the second substrate through the second and third ground bars, the conductive foam material and the ground circuit. Is done. Therefore, the noise of the micro coaxial cable does not affect the signal currents of the first and second connectors, the first substrate, and the like. In addition, since the conductive foam material has cushioning properties, even if vibration or impact occurs in the electronic device mounting this board-to-board connection structure, the contact surfaces described above do not leave, and thus stable. The contact state can be maintained.

  Further, a special circuit such as a jumper line is not required for the ground.

  Furthermore, since the ground circuit and the second ground bar are in close contact with each other through the conductive foam material, the first and second connectors can be easily and quickly inserted and removed.

  Further, since the ground circuit does not pass through the first and second connectors, the number of pins of the connector can be reduced.

  Moreover, in addition to said effect, the connection structure of the board | substrates of Claim 2 has the outstanding effect shown below rather than the connection structure of the board | substrates of Claims 1-3 mentioned above.

  In other words, the first and second ground bars that sandwich and fix the outer conductor from above and below, for example, have a normal narrow width, and only the third ground bar needs to be wider than the width of the first and second ground bars. Since the exposed portion of each micro coaxial cable is shortened, there is no problem such as the exposed external conductor fraying before the first and second ground bars are attached. Further, the exposed dimension of the outer conductor of the micro coaxial cable need not be changed from the conventional narrow width.

  Further, since the substrate-to-substrate connection structure of claim 2 only needs to make the third ground bar wider as described above, the first and second ground bars in the substrate-to-substrate connection structure of claim 1 described above. It is more economical than using a wide width because it uses less material.

  Furthermore, when the first and second ground bars are wide in the above-mentioned board-to-board connection structure according to claim 1, skill is required for the operator to perform soldering with the outer conductor interposed therebetween. When the first and second ground bars are narrow in the connection structure between the substrates, the third ground bar having a wide width is attached later, so that no skill is required.

  In addition, when the first and second ground bars are wide, it takes a lot of time for soldering with the outer conductor sandwiched between them, such as the time for mounting on a dedicated jig and the heating time for melting the solder. When the second ground bar is narrow, a wide third ground bar is attached later, so there is only one wide third ground bar, so attachment to the jig is easy and work efficiency is improved. Working time can be reduced.

  Embodiments of the present invention will be described below with reference to the drawings.

  Referring to FIG. 1, a board-to-board connection structure 1 according to the first embodiment includes, for example, a printed board 3 as a first board, and the printed board 3 includes a plurality of micro coaxial cables 5. An ultrafine coaxial cable assembly 7 configured by connecting one of the terminals is provided. When the printed circuit board 3 is connected to, for example, a circuit board 9 as a second board of the electronic device, the plurality of micro coaxial cables 5 are grounded to absorb noise generated outside. It has a configuration.

  As the micro coaxial cable assembly 7, flat cable processing is performed in which a plurality of micro coaxial cables 5 are arranged in parallel at a pitch of 0.3 mm, for example, and both sides thereof are unitized into a sandwich by a bundling tape (not shown). Yes. Further, the terminal on one end side in the longitudinal direction of the plurality of micro coaxial cables 5 is, for example, a flexible printed flexible FPC (Flexible Printed) as the printed circuit board 3 for connecting to the substrate circuit 9 of the electronic device. Circuit). The printed circuit board 3 of this FPC has a copper circuit formed on a polyimide base material and a cover lay provided thereon. Details of the terminal connecting portion on one end side of the printed circuit board 3 will be described later. In addition, in the micro coaxial cable assembly 7 of this embodiment, although it is illustrated in a small number in FIG. 1, for example, 30 micro coaxial cables 5 are used.

  The FPC printer board 3 is provided with, for example, a plug connector 11 as a first connector, while the board circuit 9 is provided with, for example, a receptacle connector 13 as a second connector, and the plug connector 11 and the receptacle connector 13 are provided. Can be fitted and removed from each other.

  Referring to FIGS. 2 and 3 together, each of the micro coaxial cables 5 has a structure in which, for example, seven cross-sectional strands having a diameter of 0.025 mm or 0.03 mmφ are twisted to form the central conductor 15. An insulating layer 17 of, for example, Teflon (registered trademark) resin as a fluorine-based resin is applied to the outer periphery of the central conductor 15, and the outer periphery of the insulating layer 17 is about 0.025 mm or 0.03 mmφ in diameter, for example. An outer conductor 19 in which 20 strands having a circular cross section are twisted is provided, and the outer periphery of the outer conductor 19 is covered with a jacket 21 of, for example, Teflon (registered trademark) resin as a fluorine resin. In this embodiment, the outer diameter of the micro coaxial cable 5 is φ0.29 mm.

  As a configuration of the terminal connecting portion of the micro coaxial cable 5 described above, the jacket 21 of the terminal of each micro coaxial cable 5 is removed to expose each external conductor 19. The exposed external conductors 19 are sandwiched from above and below by, for example, a lower ground bar 23 as a pair of first ground bars and an upper ground bar 25 as a second ground bar, and soldered with solder 27 to be fixed. The lower ground bar 23 is soldered to the shield layer 3A of the printed circuit board 3 at a time. Further, the center conductor 15 of each micro coaxial cable 5 is connected to each center conductor connection portion 29 of the printed circuit board 3.

  The wide ground bars 23 and 25 have a thickness of 0.05 to 0.00 mm in this embodiment. The width is 1 mm and the width is 1.0 mm or more and 7.0 mm or less. If the width dimension is less than 1.0 mm, the connection (contact) area is small, which is not good. On the other hand, if the width dimension exceeds 7.0 mm, the connection area becomes too large and the cost becomes high. In addition, as a preferred embodiment of the present invention, it is desirable that the width dimension is about 2 to 5 mm in that no electrical failure occurs and it does not affect the design and dimensional constraints of the finished product. .

  Incidentally, the normal ground bar has a thickness of 0.05-0. A metal plate having a width dimension of 0.5 to 1.0 mm at 1 mm is used.

  In addition, a conductive foam 31 is attached to the upper surface of the upper ground bar 25 with a conductive adhesive 33. In this embodiment, the conductive foam material 31 is made of a plastic (resin) foam material having cushioning properties (flexibility) like a sponge and plated with a conductive metal. At 5 mm, the size is almost the same as the ground bar 25. The size of the conductive foam 31 may be smaller than that of the ground bar 25, but it is preferable that the size of the conductive foam 31 is substantially the same as the surface of the ground bar 25 because the larger the adhesion surface, the more difficult it is to peel off. The conductive foam 31 is not made of metal but is made of a resinous and flexible conductive resin, and may be a conductive rubber sheet.

  In this embodiment, an FPC is used as the printed circuit board 3, but any type of printed circuit board 3 can be used.

  On the other hand, the substrate circuit 9 has a ground at a position facing the ground bar 25 of the FPC 3, that is, at a place where the conductive foam 31 contacts the conductive foam 31 so as to be in close contact with the conductive foam 31. The circuit 35 is exposed on the surface of the substrate circuit 9.

  With the above configuration, when the printed board 3 and the board circuit 9 are connected by fitting the plug connector 11 and the receptacle connector 13 to each other, the ground bar 25 and the ground circuit 35 of the board circuit 9 are connected via the conductive foam material 31. Therefore, noise generated outside is directly grounded to the substrate circuit 9 through the ground bar 25, the conductive foam material 31, and the ground circuit 35. In addition, since the conductive foam material 31 has cushioning properties (flexibility), the ground bar 25 and the conductive foam material can be used even if vibration or impact occurs in the electronic device mounted with the connection structure between the substrates. The contact surfaces of the material 31 and the ground circuit 35 are not separated. A stable contact state can be maintained. If the ground bar 25 and the ground circuit 35 of the substrate circuit 9 are simply in contact with each other, the contact surface between the ground bar 25 and the ground circuit 35 is separated by the vibration and impact described above. However, in this embodiment, a stable contact state can be maintained.

  For example, in this embodiment, when the plug connector 11 and the receptacle connector 13 are fitted, the gap between the printed board 3 and the board circuit 9 is about 1.0 mm. If the upper and lower ground bars 23 and 25 are each 0.1 mm and the micro coaxial cable 5 is 0.29 mm, the total is 0.49 (≈0.5) mm. The gap with 9 is about 0.5 mm. Therefore, since the conductive foam 31 having a thickness of 1.5 mm contracts by about 1.0 mm, the ground bar 25 and the ground circuit 35 come into contact with each other through the conductive foam 31, Ensuring conduction. Even if the thickness of the conductive foam 31 is 1.0 mm, about 0.5 mm is contracted.

  Therefore, the noise of the micro coaxial cable 5 does not pass through the plug connector 11, the receptacle connector 13, and the printed circuit board 3 as in the prior art, so that it affects the signal current as compared with the conventional circuitous route to the circuit board 9. Does not affect.

  Further, a special circuit such as a jumper line is not required for the ground.

  Furthermore, since the ground circuit 35 and the ground bar 25 are in close contact with each other via the conductive foam material 31, the plug connector 11 and the receptacle connector 13 can be inserted and removed easily and quickly. Incidentally, when the ground circuit is fitted using the plug connector 11 and the receptacle connector 13 as in the prior art, the insertion and removal is troublesome to fit the unevenness like the connector pin, and some pins are enlarged. In addition, since the number of pins increases, a greater force is required to insert and remove. On the other hand, when the ground circuit is coupled with solder or the like, it cannot be easily separated, and it is troublesome because it is necessary to melt the solder when the connector is inserted and removed.

  Further, since the ground circuit 35 does not pass through the plug connector 11 and the receptacle connector 13, the number of pins of the ground circuit connector can be reduced.

  Next, a connection structure 37 between substrates according to the second embodiment of the present invention will be described with reference to the drawings. In addition, the part of the structure similar to the connection structure 1 of the board | substrates of 1st Embodiment mentioned above attaches | subjects the same code | symbol, and abbreviate | omits detailed description.

  Referring to FIG. 4, the board-to-board connection structure 37 of the second embodiment is electrically connected to the ground circuit 35 of the board circuit 9 so that the conductive foam 31 is in contact with the ground bar 25 and is conducted. It sticks through the adhesive 33. Other configurations are the same as those of the first embodiment described above.

  Therefore, the same operation and effect as the above-described connection structure 1 between the substrates of the first embodiment can be obtained.

  Next, a board-to-board connection structure 39 according to a third embodiment of the present invention will be described with reference to the drawings. In addition, the part of the structure similar to the connection structure 1 of the board | substrates of 1st Embodiment mentioned above attaches | subjects the same code | symbol, and abbreviate | omits detailed description.

  Referring to FIG. 5, in the connection structure 39 between the substrates of the third embodiment, the first conductive foam material 41 is adhered to the ground bar 25 via the conductive adhesive 33. The second conductive foam material 43 is attached to the ground circuit 35 of the substrate circuit 9 via the conductive adhesive 33 so that the second conductive foam material 43 is brought into contact with the first conductive foam material 41 to be conducted. The first and second conductive foam materials 41 and 43 are the same as the conductive foam material 31 of the first embodiment described above. Other configurations are the same as those of the first embodiment described above.

  Therefore, the same operation and effect as the above-described connection structure 1 between the substrates of the first embodiment can be obtained.

  Next, a connection structure 45 between substrates according to a fourth embodiment of the present invention will be described with reference to the drawings. In addition, the part of the structure similar to the connection structure 1 of the board | substrates of 1st Embodiment mentioned above attaches | subjects the same code | symbol, and abbreviate | omits detailed description.

  6 to 8, the difference between the board-to-board connection structure 45 of the fourth embodiment and the board-to-board connection structure 1 of the first embodiment is that the micro coaxial cable 5 It is in the structure of the terminal connection part.

  A portion where each outer conductor 19 is exposed by removing the jacket 21 at the end of each micro coaxial cable 5 has a narrow width as in the prior art, and a lower ground bar 47 and a second ground as a pair of first ground bars. The upper ground bar 49 as a bar is narrow. The exposed external conductors 19 are sandwiched from above and below by the pair of ground bars 47 and 49 and fixed by soldering with solder 27, and the lower ground bar 47 is collectively attached to the shield layer 3A of the printed circuit board 3. And soldered. Further, for example, a wide ground bar 51 as a third ground bar wider than the width of the ground bar 49 is soldered to the upper ground bar 49 which is the second ground bar. Note that the connection between the narrow ground bar 49 and the wide ground bar 51 is not limited to soldering, and any material such as a conductive adhesive may be used as long as it is of an electrically conductive material.

  In this embodiment, the narrow ground bars 47 and 49 have a thickness of 0.05 to 0.00 mm. 1 mm and a width of 0.5 mm to 1.0 mm. On the other hand, the wide ground bar 51 has a thickness of 0.05 to 0.00 mm in this embodiment. The width is 1 mm and the width is 1.0 mm or more and 7.0 mm or less. In addition, as a preferred embodiment of the present invention, it is desirable that the width dimension is about 2 to 5 mm in that no electrical failure occurs and it does not affect the design and dimensional constraints of the finished product. .

  In addition, a conductive foam material 31 similar to that of the first embodiment described above is adhered to the upper surface of the upper ground bar 51 with a conductive adhesive 33.

  Other configurations are the same as those of the first embodiment described above.

  With the above configuration, the exposed outer conductor 19 of each of the plurality of micro coaxial cables 5 is fixed by being sandwiched from above and below by narrow-width ground bars 47 and 49, so that the exposed portion of the outer conductor 19 of each micro coaxial cable 5 is fixed. Therefore, the external conductor 19 exposed before the ground bars 47 and 49 are attached is not frayed. Incidentally, in the case of the first embodiment described above, since it is sandwiched and fixed by the wide ground bars 23, 25 from above and below, the exposed length of the external conductor 19 is appropriately adjusted according to the width of the ground bars 23, 25. If the exposed length of the external conductor 19 is increased, the external conductor 19 may be frayed before the ground bars 23 and 25 are attached.

  Further, since the wide ground bar 51 is attached after the usual narrow ground bars 47 and 49 similar to the conventional ones are attached, it is not necessary to change the exposed dimension of the outer conductor 19 of the micro coaxial cable.

  In addition, it is economical because less material is used than when a pair of wide ground bars 23 and 25 are used.

  Further, in the first embodiment, skill is required for an operator to sandwich the outer conductor 19 between the wide ground bars 23 and 25, but in the fourth embodiment, a wide ground bar is used later. Because it is installed, no skill is required.

  In the first embodiment, in order to solder the outer conductor 19 between the two wide ground bars 23 and 25, a lot of time is required such as a time for attaching to a dedicated jig and a heating time for melting the solder. However, in the fourth embodiment, since the wide ground bar is attached later, since the single wide ground bar 51 is provided, attachment to the jig is facilitated, work efficiency is improved, and work time is increased. Can be shortened.

  Although the above is a point which can obtain a further effect compared with 1st Embodiment, in addition to this, the effect similar to the effect of 1st Embodiment mentioned above is also acquired.

  Next, a board-to-board connection structure 53 according to a fifth embodiment of the invention will be described with reference to the drawings. In addition, the part of the structure similar to the connection structure 45 of the board | substrates of 4th Embodiment mentioned above attaches | subjects the same code | symbol, and abbreviate | omits detailed description.

  Referring to FIG. 9, the board-to-board connection structure 53 of the fifth embodiment is configured so that the conductive foam 31 contacts and is in contact with the ground bar 51 as the third ground bar. Is attached to the ground circuit 35 via a conductive adhesive 33. Other configurations are the same as those of the above-described fourth embodiment.

  Therefore, the same operation and effect as those of the connection structure 45 between substrates of the fourth embodiment described above can be obtained.

  Next, a connection structure 55 between substrates according to a sixth embodiment of the present invention will be described with reference to the drawings. In addition, the part of the structure similar to the connection structure 45 of the board | substrates of 4th Embodiment mentioned above attaches | subjects the same code | symbol, and abbreviate | omits detailed description.

  Referring to FIG. 10, in the connection structure 55 between the substrates of the sixth embodiment, the first conductive foam material 41 is connected to the ground bar 51 as the third ground bar via the conductive adhesive 33. Attached to the ground circuit 35 of the substrate circuit 9 via a conductive adhesive 33 so that the second conductive foam material 43 is in contact with and conductive with the first conductive foam material 41. Has been. The first and second conductive foam materials 41 and 43 are the same as the conductive foam material 31 of the fourth embodiment described above. Other configurations are the same as those of the above-described fourth embodiment.

  Therefore, the same operation and effect as those of the connection structure 45 between substrates of the fourth embodiment described above can be obtained.

It is a perspective view which shows the connection structure of the board | substrates of 1st Embodiment of this invention. It is a partial top view which shows the structure of the terminal connection part of the several micro coaxial cable of FIG. It is sectional drawing of the arrow III-III line | wire of FIG. It is a perspective view which shows the connection structure of the board | substrates of 2nd Embodiment of this invention. It is a perspective view which shows the connection structure of the board | substrates of 3rd Embodiment of this invention. It is a perspective view which shows the connection structure of the board | substrates of 4th Embodiment of this invention. It is a partial top view which shows the structure of the terminal connection part of the several micro coaxial cable of FIG. It is sectional drawing of the arrow VIII-VIII line | wire of FIG. It is a perspective view which shows the connection structure of the board | substrates of 5th Embodiment of this invention. It is a perspective view which shows the connection structure of the board | substrates of 6th Embodiment of this invention. It is a perspective view which shows the connection structure of the conventional board | substrates. It is a partial top view which shows the structure of the terminal connection part of the several micro coaxial cable of FIG. It is sectional drawing of the arrow XIII-XIII line | wire of FIG.

Explanation of symbols

1 Board-to-board connection structure (of the first embodiment)
3 Printed circuit board (first circuit board)
3A Shield layer 5 Micro coaxial cable 7 Micro coaxial cable assembly 9 Substrate circuit (second substrate)
11 Plug connector (first connector)
13 Receptacle connector (second connector)
15 Center conductor 17 Insulating layer 19 Outer conductor 21 Jacket 23 Ground bar (first ground bar)
25 Grand Bar (2nd Grand Bar)
29 Central conductor connection part 31 Conductive foam material 33 Conductive adhesive 35 Ground circuit 37 Connection structure between substrates (in the second embodiment)
39 Connection structure between substrates (in the third embodiment)
41 1st electroconductive foam material 43 2nd electroconductive foam material 45 Connection structure of board | substrates (4th Embodiment)
47 Grand Bar (First Grand Bar)
49 Grand Bar (2nd Grand Bar)
51 Grand Bar (3rd Grand Bar)
53 Connection structure between substrates (of the fifth embodiment)
55 Connection structure between substrates (sixth embodiment)

Claims (2)

A plurality of micro coaxial cables each having a first connector and a plurality of center conductor connection portions connected to each center conductor connection portion of each of the center conductors of a plurality of micro coaxial cables arranged in parallel. A first board that exposes the outer conductor of the cable and sandwiches and fixes the exposed portion of the outer conductor between a pair of wide first and second ground bars from both sides and connects the first ground bar; A second board having a second connector at a position corresponding to the first connector of the board; and a board for connecting the first board and the second board by fitting the first connector and the second connector together. A connection structure,
A ground circuit is provided at a position of the second substrate facing the second ground bar of the first substrate, and a conductive foam material is attached to at least one of the second ground bar and the ground circuit, so that the conductive A connection structure between substrates, wherein the second ground bar and a ground circuit are made conductive through a foam material. A plurality of micro coaxial cables each having a first connector and a plurality of center conductor connection portions connected to each center conductor connection portion of each of the center conductors of a plurality of micro coaxial cables arranged in parallel. A first board that exposes the outer conductor of the cable, sandwiches and fixes the exposed portion of the outer conductor between a pair of first and second ground bars of normal width from both sides, and connects the first ground bar; A board that connects the first board and the second board by fitting the first connector and the second connector together with a second board having a second connector at a position corresponding to the first connector on one board. The connection structure of
A third ground bar wider than the width of the second ground bar is attached to the second ground bar of the first substrate, and a ground circuit is provided at a position facing the third ground bar of the second substrate. A connection structure between substrates, wherein a conductive foam material is attached to at least one of the three ground bars and the ground circuit, and the third ground bar and the ground circuit are electrically connected to each other through the conductive foam material. .

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