Classifications

• • G—PHYSICS
  • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
  • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
  • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
  • G03F7/70—Microphotolithographic exposure; Apparatus therefor
  • G03F7/70383—Direct write, i.e. pattern is written directly without the use of a mask by one or multiple beams
• • G—PHYSICS
  • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
  • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
  • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
  • G03F7/70—Microphotolithographic exposure; Apparatus therefor
  • G03F7/70691—Handling of masks or workpieces
  • G03F7/70775—Position control, e.g. interferometers or encoders for determining the stage position
• • G—PHYSICS
  • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
  • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
  • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
  • G03F7/70—Microphotolithographic exposure; Apparatus therefor
  • G03F7/70691—Handling of masks or workpieces
  • G03F7/70791—Large workpieces, e.g. glass substrates for flat panel displays or solar panels
• • G—PHYSICS
  • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
  • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
  • G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
  • G03F9/70—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
  • G03F9/7003—Alignment type or strategy, e.g. leveling, global alignment
  • G03F9/7007—Alignment other than original with workpiece
  • G03F9/7011—Pre-exposure scan; original with original holder alignment; Prealignment, i.e. workpiece with workpiece holder
• • G—PHYSICS
  • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
  • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
  • G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
  • G03F9/70—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
  • G03F9/7003—Alignment type or strategy, e.g. leveling, global alignment
  • G03F9/7007—Alignment other than original with workpiece
  • G03F9/7015—Reference, i.e. alignment of original or workpiece with respect to a reference not on the original or workpiece

Definitions

• the present invention relates to an exposure apparatus for exposing a functional pattern on an object to be exposed, and more particularly, to an image capturing means for capturing an image of a reference position set in a reference functional pattern formed in advance on the object to be exposed.
• a conventional exposure apparatus uses a mask in which a mask pattern corresponding to a functional pattern is formed on a glass substrate in advance, and transfers and exposes the mask pattern on an object to be exposed, for example, a stepper or a micro mirror.
• projection Microrror Projection
• Proximity proximity
• the overlay accuracy of the functional patterns between the layers becomes a problem.
• high absolute dimensional accuracy was required for the mask pattern arrangement, which increased the cost of the mask.
• an alignment between the functional pattern of the underlying layer and the mask pattern is necessary, and this alignment is particularly difficult for a large mask.
• an exposure apparatus that directly draws a CAD data pattern on an object to be exposed using an electron beam or a laser beam without using a mask.
• This type of exposure apparatus includes a laser light source, an exposure optical system that reciprocally scans the laser beam emitted from the laser light source, and a transport unit that transports the object to be exposed while mounted thereon, based on CAD data.
• the laser beam is reciprocally scanned while controlling the emission state of the laser light source, and the object to be exposed is conveyed in a direction perpendicular to the laser beam scanning direction, and corresponds to a functional pattern on the object to be exposed.
• the CAD data pattern is formed two-dimensionally (for example, see Patent Document 1).
• an object of the present invention is to provide an exposure apparatus that addresses such a problem, improves the overlay accuracy of functional patterns, and suppresses an increase in the cost of the exposure apparatus.
• an exposure apparatus relatively scans a light beam emitted from an exposure optical system in a direction orthogonal to a moving direction of an object to be exposed.
• An exposure apparatus that exposes a function pattern at a predetermined pitch on an exposure body, wherein the imaging unit captures a reference function pattern serving as a reference of an exposure position formed in advance on the exposure target; and Performs predetermined image processing on the image data of the reference function pattern, and removes defects in the reference function pattern image corresponding to one scanning region of the light beam to generate a defect-free reference function pattern image.
• an optical system control means for detecting a reference position of exposure start or end in the defect-free reference function pattern image and controlling start or stop of irradiation of the light beam based on the reference position.
• the optical system control unit performs predetermined image processing on the image data of the reference function pattern acquired by the imaging unit, and corresponds to one scanning area of the light beam.
• a defect in the reference function pattern image is removed to generate a defect-free reference function pattern image, a start position or an end reference position of exposure is detected in the defect-free reference function pattern image, and the reference position is used as a reference. Controls the start or stop of light beam irradiation. Accordingly, even when the reference function pattern formed in advance on the object to be exposed has a defect, a predetermined function pattern is formed at a predetermined position with high accuracy.
• the optical system control means uses the two image data of the reference function pattern acquired by the imaging means to perform a logical sum of the respective image data, thereby obtaining the defect-free reference function pattern image. Is generated. Thus, using the two image data of the reference function pattern acquired by the imaging means, the optical system control means performs a logical sum of the respective image data to generate a defect-free reference function pattern image.
• the optical system control means uses the image data of the immediately preceding reference function pattern acquired by the imaging means and the image data of the newly acquired reference function pattern, and This is to generate a defect-free reference function pattern image by taking the logical sum of image data at the same position before and after the body movement direction.
• the optical system control means can use the image data before and after the moving direction of the object to be exposed. The logical sum of each image data at the same position is calculated to generate a defect-free reference function pattern image.
• the optical system control means uses the image data of the adjacent reference function pattern in the image data of the reference function pattern acquired by the imaging means to perform a logical sum of the respective image data.
• a defect-free reference function pattern image is generated.
• the image data of the reference function pattern obtained by the imaging unit is used to obtain the logical sum of each image data by the optical system control unit using the image data of the adjacent reference function pattern, and the defect-free reference function is obtained.
• the exposure apparatus relatively scans the light beam emitted from the exposure optical system in a direction orthogonal to the moving direction of the object to be exposed, and applies a predetermined pitch to the object to be exposed.
• An exposure device for exposing a functional pattern in (1) an imaging unit for imaging a reference functional pattern serving as a reference for an exposure position formed in advance on the object to be exposed, The image data of the reference function pattern in the predetermined area is copied to an area subsequent to the predetermined area and cannot be obtained by the imaging means! / ⁇
• the image of the reference function pattern is complemented, and the complemented reference function pattern is added.
• An optical system control means for detecting a reference position at the start or end of exposure in the pattern image, and controlling the start or stop of irradiation of the light beam based on the reference position.
• the image data of the reference functional pattern of the predetermined area obtained by the imaging means by the optical system control means cannot be copied to an area subsequent to the predetermined area and obtained by the imaging means!
• the image of the function pattern is complemented, the reference position of the exposure start or end is detected in the complemented reference function pattern image, and the start or stop of the light beam irradiation is controlled based on the reference position. Accordingly, even when all of the reference function patterns formed on the exposed body in the scanning direction of the light beam cannot be acquired by the imaging unit, the predetermined function pattern is formed at a predetermined position with high accuracy.
• predetermined image processing is performed on the image data of the reference function pattern acquired by the imaging means, and the image data of the reference function pattern corresponding to one scanning region of the light beam is obtained.
• the predetermined function pattern is heightened at a predetermined position. Exposure can be performed with high accuracy. Therefore, even when a plurality of functional patterns are laminated and formed, the overlay accuracy of the functional patterns of each layer is improved.
• the image data of the immediately preceding reference function pattern acquired by the imaging means and the image data of the newly acquired reference function pattern are used to acquire the image.
• the stage on which the exposure object is placed Even when there is a defect such as a foreign substance attached to the surface, the defect can be removed. Therefore, it is possible to prevent the above-described defect from being mistakenly regarded as a reference position and performing exposure.
• the exposure accuracy of the predetermined function pattern can be improved.
• the image data of the reference function pattern acquired by the imaging means uses the image data of the adjacent reference function pattern to obtain the image data of each image data.
• the adjacent function patterns are compared to determine the defect. Can be removed.
• the image data of the reference function pattern of the predetermined area obtained by the imaging means is copied to an area subsequent to the predetermined area, and the reference function pattern which cannot be obtained by the imaging means.
• FIG. 1 is a conceptual diagram showing an embodiment of an exposure apparatus according to the present invention.
• FIG. 2 is a perspective view illustrating the configuration and operation of an optical switch.
• FIG. 3 is an explanatory diagram showing a relationship between a scanning position of a laser beam and an imaging position of an imaging unit.
• FIG. 4 is a block diagram showing a first half of a processing system in an internal configuration of the image processing unit.
• FIG. 5 is a block diagram showing a latter half of a processing system in the internal configuration of the image processing unit.
• FIG. 6 is an explanatory diagram showing a relationship between a black matrix moving in a direction orthogonal to a scanning direction of a laser beam and a scanning trajectory of the laser beam.
• FIG. 7 is a flowchart illustrating a procedure of a pattern forming method using the exposure apparatus.
• FIG. 8 is an explanatory diagram showing a state in which the output of the ring buffer memory is binarized.
• FIG. 9 is an explanatory diagram showing an image of an exposure start position preset for pixels of a black matrix and a look-up table thereof.
• FIG. 10 Reference positions preset for pixels of a black matrix and elements of an image pickup means.
• FIG. 9 is an explanatory diagram showing a relationship with the target.
• FIG. 11 is an explanatory diagram showing a state in which an image of a defect existing in a pixel of a black matrix is excluded.
• FIG. 12 is an explanatory diagram showing an image of an exposure end position preset for pixels of a black matrix and a look-up table thereof.
• FIG. 13 is an explanatory diagram showing a state of detecting an exposure position for the pixel in the glass substrate transport direction.
• FIG. 14 is an explanatory diagram showing a state in which the scanning position of the laser beam is corrected.
• FIG. 15 is a conceptual diagram showing an embodiment of an exposure apparatus according to the second invention.
• FIG. 16 is an explanatory diagram showing a state in which a pixel array image of a missing black matrix is generated and exposed.
• Imaging means
• FIG. 1 is a conceptual diagram showing an embodiment of an exposure apparatus according to the present invention.
• the exposure apparatus 1 exposes a functional pattern on an object to be exposed, and includes a laser light source 2, an exposure optical system 3, a transport means 4, an imaging means 5, and a back light irradiating means 6 as an illuminating means.
• the above-mentioned functional pattern is a pattern of a component part necessary for performing an intended operation of a product.For example, in a color filter, a pixel pattern of a black matrix or each color of red, blue, and green is used. Filter pattern, half In the case of a conductor component, it is a wiring pattern, various electrode patterns, or the like.
• a glass substrate for a color filter is used as an object to be exposed will be described.
• the laser light source 2 emits a light beam, and is, for example, a high-output all-solid-state mode-locked laser light source that generates ultraviolet light of 355 nm and has an output of 4 W or more.
• An exposure optical system 3 is provided in front of the laser light source 2 in the light beam emission direction.
• the exposure optical system 3 is for reciprocally scanning a laser beam as a light beam on a glass substrate 8, and a light switch 9, a light switch 9, a light deflector 10, and a first mirror 11. , A polygon mirror 12, an f ⁇ lens 13, and a second mirror 14.
• the optical switch 9 switches between the irradiation of the laser beam and the stop of the irradiation.
• the first and second polarizing elements 15A and 15B are replaced with the respective polarizing elements 15A. , 15B are separated from each other so that the polarization axes p are orthogonal to each other (in the figure, the polarization axis p of the polarization element 15A is set in the vertical direction, and the polarization axis p of the polarization element 15B is set in the horizontal direction).
• an electro-optic modulator 16 is provided between the first and second polarizing elements 15A and 15B.
• the electro-optic modulator 16 operates so as to rotate the polarization plane of polarized light (linearly polarized light) at a high speed of several nsec when a voltage is applied. For example, when the applied voltage is zero, the linearly polarized light having, for example, a vertical polarization plane selectively transmitted by the first polarizing element 15A in FIG. Then, the light reaches the second polarizing element 15B. Since the second polarizing element 15B is arranged so as to selectively transmit linearly polarized light having a horizontal polarization plane, the second polarizing element 15B cannot transmit the linearly polarized light having a vertical polarization plane, In this case, irradiation of the laser beam is stopped.
• the light deflecting means 10 scans the laser beam at a positive position by shifting the scanning position of the laser beam in a direction orthogonal to the scanning direction (the moving direction of the glass substrate 8 corresponds to the direction of arrow A shown in FIG. 1).
• This is, for example, an acousto-optic element (AO element).
• the first mirror 11 serves to bend the traveling direction of the laser beam passing through the light deflecting means 10 in the direction in which the polygon mirror 12 described later is provided, and is a plane mirror. Further, the polygon mirror 12 reciprocally scans the laser beam, and for example, forms eight mirrors on the side surface of a regular octagonal columnar rotating body.
• the laser beam reflected by one of the mirrors is scanned one-dimensionally in the forward direction with the rotation of the polygon mirror 12, and at the moment when the irradiation position of the laser beam moves to the next mirror surface.
• one-dimensional forward scanning is started again with the rotation of the polygon mirror 12.
• the f ⁇ lens 13 is used to make the scanning speed of the laser beam uniform on the glass substrate 8, and the focal position is made substantially coincident with the position of the mirror surface of the polygon mirror 12. Be placed.
• the second mirror 14 reflects the laser beam that has passed through the f0 lens 13 so as to be incident on the surface of the glass substrate 8 in a direction substantially perpendicular thereto, and is a plane mirror.
• a line sensor 17 is provided at a portion on the scanning start side of the laser beam that reciprocally scans in the vicinity of the surface on the emission side of the f0 lens 13 so as to be orthogonal to the scanning direction. The shift amount between the predetermined scanning position and the actual scanning position is detected, and the scanning start time of the laser beam is detected.
• the line sensor 17 may be provided anywhere as long as a scanning start point of the laser beam can be detected on the f ⁇ lens 13 side.
• the line sensor 17 may be provided on a glass substrate transfer stage 18 described later.
• a transport means 4 is provided below the second mirror 14.
• the transport means 4 is for placing the glass substrate 8 on the stage 18 and transporting the glass substrate 8 at a predetermined speed in a direction orthogonal to the scanning direction of the laser beam.
• a transport drive unit 20 such as a motor for rotating the transport roller 19.
• An imaging unit 5 is provided above the transport unit 4 and in front of the laser beam scanning position in the transport direction indicated by the arrow A.
• the imaging means 5 is for imaging pixels of a black matrix as a reference function pattern serving as a reference for exposure formed in advance on the glass substrate 8, and is, for example, a line CCD in which light receiving elements are arranged in a line. is there.
• the imaging position E of the imaging means 5 and the scanning of the laser beam are performed.
• the distance D from the position F is set so as to be an integral multiple (n times) of the arrangement pitch P of the pixels 22 of the black matrix 21 in the transport direction.
• FIG. 1 shows an example in which three imaging units 5 are installed.
• the scanning range of the force laser beam is narrower than the image processing area of one imaging unit 5, only one imaging unit 5 is used.
• the scanning range is wider than the image processing area of one imaging unit 5, a plurality of imaging units may be installed accordingly.
• a back light irradiating means 6 is provided below the transport means 4.
• the back light illuminating means 6 illuminates the pixels 22 to enable imaging by the imaging means 5, and is, for example, a surface light source.
• An optical system control means 7 is provided so as to be connected to the laser light source 2, the optical switch 9, the light deflecting means 10, the polygon mirror 12, the line sensor 17, the transport means 4 and the imaging means 5.
• the optical system control means 7 detects a preset reference position in the pattern image of the pixel 22 imaged by the imaging means 5 and starts laser beam irradiation by the laser light source 2 with respect to the reference position.
• the voltage applied to the light deflecting means 10 is controlled to deflect the laser beam emission direction, and the rotation speed of the polygon mirror 12 is controlled.
• a light source driving unit 23 for turning on the laser light source 2 an optical switch controller 24 for controlling the start and stop of the irradiation of the laser beam, and an optical deflecting unit driving for controlling the amount of laser beam deflection in the optical deflecting unit 10.
• An AZD conversion unit 28 that performs AZD conversion of an image captured by the imaging unit 5; and an image processing unit that determines an irradiation start position and an irradiation stop position of the laser beam based on the AZD-converted image data. 29 and data of a laser beam irradiation start position (hereinafter, referred to as an exposure start position) and an irradiation stop position (hereinafter, referred to as an exposure end position) obtained by processing in the image processing section 29.
• an exposure start position a laser beam irradiation start position
• an irradiation stop position hereinafter, referred to as an exposure end position
• a storage unit 30 for storing a look-up table for the exposure start position and the exposure end position and the like, and the optical switch 9 is turned on and off based on the data of the exposure start position and the exposure end position read from the storage unit 30
• the apparatus includes a modulation data creation processing section 31 for creating modulation data, and a control section 32 for appropriately controlling the entire apparatus to perform a predetermined target operation.
• FIG. 4 and FIG. 5 are block diagrams showing one configuration example of the image processing section 29.
• the image processing unit 29 includes, for example, three ring buffer memories 33A, 33B, and 33C connected in parallel, and three ring buffer memories 33A, 33B, and 33C connected in parallel for each of the ring buffer memories 33A, 33B, and 33C.
• the exposure start position determination circuit 36 that outputs an exposure start position determination result when both data match, the output data of the nine line buffer memories 34A, 34B, and 34C are shown in FIG.
• Memory Compare the image data look-up table (LUT for exposure end position) corresponding to the second reference position that determines the exposure end position obtained from 30. When both data match, the exposure end position determination result And an exposure end position judging circuit 37 for outputting the same.
• the image processing unit 29 receives the exposure start position determination result and counts the number of coincidences of the image data corresponding to the first reference position.
• the output of the counting circuit 38A is compared with the exposure start pixel number obtained from the storage unit 30 shown in FIG. 1, and when both values match, the exposure start signal is output to the modulation data creation processing unit 31 shown in FIG.
• a head pixel counting circuit 40 that counts the number of head pixels based on the output of the counting circuit 38A.
• the output of the head pixel counting circuit 40 is compared with the exposure pixel column number obtained from the storage unit 30 shown in FIG. 1, and when the two values match, the exposure pixel column designation signal is converted to the modulation data shown in FIG. And a comparison circuit 41 for outputting to the creation processing unit 31.
• the counting circuits 38A and 37B are reset by the reading start signal when the reading operation by the imaging means 5 is started. When the formation of the predetermined exposure pattern specified in advance is completed, the leading pixel counting circuit 40 is reset by the exposure pattern end signal.
• the exposure apparatus 1 configured as described above and a pattern forming method will be described.
• the optical system control means 7 is driven.
• the laser light source 2 is activated to emit a laser beam.
• the polygon mirror 12 starts rotating, and the laser beam can be scanned.
• the optical switch 9 is still turned off! Therefore, no laser beam is emitted! ,.
• the glass substrate 8 is placed on the stage 18 of the transfer means 4. Since the transfer means 4 transfers the glass substrate 8 at a constant speed, the scanning trajectory (arrow B) of the laser beam moves relative to the moving direction of the stage 18 (arrow A) as shown in FIG. Become diagonal. Therefore, when the glass substrate 8 is set in parallel with the moving direction (arrow A), the exposure position is set to the scanning start pixel 22a and the scanning end pixel 22b of the black matrix 21 as shown in FIG. In some cases. In this case, as shown in FIG. 3B, the glass substrate 8 is installed at an angle to the transport direction (the direction of arrow A), and the arrangement direction of the pixels 22 and the scanning locus of the laser beam (arrow B). ) Should match.
• the above-mentioned shift amount is small. Therefore, the glass substrate 8 is set in parallel with the moving direction, and the above-mentioned amount of displacement is measured based on the data imaged by the imaging means 5 to control the light deflection means 10 of the exposure optical system 3.
• the shift amount may be corrected. In the following description, the above-described shift amount is assumed to be negligible.
• the transport drive unit 20 is driven to move the stage 18 in the direction of arrow A in FIG. This and At this time, the transport drive unit 20 is controlled by the transport controller 26 of the optical system control means 7 to have a constant speed.
• the imaging unit 5 starts imaging, and starts exposure based on the captured image data of the black matrix 21.
• the position and the exposure end position are detected.
• the pattern forming method will be described with reference to the flowchart shown in FIG.
• step S 1 an image of the pixel 22 of the black matrix 21 is obtained by the imaging unit 5.
• the acquired image data is taken into the three ring buffer memories 33A, 33B and 33C of the image processing section 29 shown in FIG. 4 and processed.
• the latest three data are output from each of the ring buffer memories 33A, 33B, and 33C.
• the previous data is output from the ring buffer memory 33A
• the previous data is output from the ring buffer memory 33B
• the latest data is also output from the ring buffer memory 33C.
• these data are respectively arranged by three line buffer memories 34A, 34B, 34C so that an image of, for example, a 3 ⁇ 3 CCD pixel is arranged on the same clock (time axis).
• the result is obtained, for example, as an image as shown in FIG.
• this image When this image is digitized, it corresponds to a 3 ⁇ 3 numerical value as shown in FIG. Since these digitized images are arranged on the same clock, they are compared with a threshold by the comparison circuit 35 to be binarized. For example, if the threshold value is “45”, the image in FIG. 14A is binarized as shown in FIG.
• step S2 reference positions for exposure start and exposure end are detected. Specifically, the reference position detection is performed by the exposure start position determination circuit 36 by comparing the above-mentioned binarized data with the data of the exposure start position LUT obtained from the storage unit 30 shown in FIG.
• the first reference position for specifying the exposure start position is set at the upper left corner of the pixel 22 of the black matrix 21 as shown in FIG.
• the LUT for the exposure is as shown in FIG. 7B, and the data of the LUT for the exposure start at this time is “000011011”. Therefore, the binary data is compared with the data “000011011” of the exposure start LUT, and when the two data match, it is determined that the image data acquired by the imaging unit 5 is the first reference position.
• the exposure start position determination circuit 36 determines the start position. Output the fixed result. When six pixels 22 are arranged as shown in FIG. 10, the upper left corner of each pixel 22 corresponds to the first reference position.
• the image data of the pixel row L acquired by the imaging unit 5 is stored in the storage unit 20.
• the image data of the next pixel row L is acquired, the image data of the pixel row L is stored from the storage unit 20.
• the OR of image data of pixels 22 located at the same position before and after the moving direction of the glass substrate 8 (direction of arrow A) in the image processing section 29 as shown in FIG. I take the.
• the OR of the image data of each pixel 22 can remove the defect 42 from the image data.
• the above-described reference position is detected using the image data of the pixel row having no defect.
• defect 42 cannot be removed by the method described above.
• the image of the defect 42 is removed by taking the logical sum of the image data of the adjacent pixels 22. More specifically, the moving direction of the glass substrate 8 is described with respect to the last pixel row L image acquired as shown in FIG. 11B and the image obtained by shifting the pixel row L image by one pitch in the column direction. The logical sum of the image data of pixel 22 located at the same position before and after (in the direction of arrow A) is calculated. In this case, it is rare that the defect 42 is present at the same position of the adjacent pixels 22 at the same time. Therefore, the OR of the image data of each pixel 22 is calculated, so that the last pixel row L is calculated. The defect 42 can also be removed from the image. As a result, a pixel row with no defect can be generated.
• the number of matches is counted in the counting circuit 38A shown in FIG.
• the count number is compared with the exposure start pixel number obtained from the storage unit 30 shown in FIG. 1 in the comparison circuit 39A, and when the both values match, the exposure start signal is converted into the modulation data shown in FIG. Output to the processing unit 31.
• the first pixel 22 and the fourth pixel in the scanning direction of the laser beam are defined as the first reference position, the image corresponding to the first reference position is taken.
• the element addresses in the line CCD of the image means 5, for example, "1000", "4000" are stored in the optical switch controller 24.
• the above-mentioned binarized data is compared in the exposure end position determination circuit 37 with the data of the exposure end position LUT obtained from the storage unit 30 shown in FIG.
• the second reference position for specifying the exposure end position is set at the upper right corner of the pixel 22 of the black matrix 21 as shown in FIG. Is as shown in FIG. 11B, and the data of the exposure end position LUT at this time is “110110000”. Therefore, the binary data is compared with the data “110110000” of the exposure end position LUT, and when the two data match, the image data acquired by the imaging means 5 is the reference position for the exposure end.
• the exposure end position determination circuit 37 outputs an end position determination result. As described above, as shown in FIG. 10, for example, when six pixels 22 are arranged, the upper right corner of each pixel 22 corresponds to the second reference position.
• the number of matches is counted in the counting circuit 38B shown in FIG. Then, the count number is compared with the exposure end pixel number obtained from the storage unit 30 shown in FIG. 1 in the comparison circuit 39B, and when the two values match, the exposure end signal is sent to the modulation data creation processing unit 31 shown in FIG. Output to In this case, as shown in FIG. 10, for example, if the upper right corners of the first pixel 22 and the fourth pixel 22 in the scanning direction of the laser beam are defined as the second reference position, the second reference position is determined. Imaging means corresponding to the reference position
• the element addresses of the five-line CCD for example, "1900" and "4900" are stored in the optical switch controller 24.
• the process proceeds to step S3.
• step S3 an exposure position in the moving direction of the glass substrate 8 is detected.
• the distance D between the scanning position F of the laser beam and the imaging position E of the imaging means 5 is set to an integral multiple (n times) of the arrangement pitch P of the pixels 22 in the moving direction.
• the exposure position can be determined by counting the scanning cycle of the laser beam. For example, as shown in FIG. If the distance D from the image position is set to, for example, three times the array pitch P of the pixels 22, the first and second reference positions are detected at the ends of the pixels 22 in step S2.
• the scanning start timing of the laser beam and Matches when the laser beam scans at the cycle T, the transport speed of the glass substrate 8 is controlled to move by one pitch of the pixels 22 in synchronization with the cycle T of the laser beam. Therefore, the pixel 22 moves to the position shown in FIG. Further, after 2T, the pixel 22 moves to the position shown in FIG. Then, after 3T, the column center line of the pixel 22 reaches the scanning position of the laser beam, as shown in FIG. Thus, the exposure position is detected.
• step S 4 the exposure position is adjusted while scanning the laser beam. Specifically, as shown in FIG. 14, the exposure position is adjusted by changing the current scanning position (element address) of the laser beam detected by the line sensor 17 provided on the f0 lens 13 and a predetermined reference element address. Then, the deviation amount is detected by comparing with the reference position, and the light deflection means 10 is controlled so that the scanning position of the laser beam coincides with the reference element address (reference scanning position).
• step S5 exposure is started. Exposure is started by controlling the optical switch 9 on-time by the optical switch controller 24. In this case, first, the optical switch 9 is turned on and the laser beam is scanned, and the optical switch 9 is turned off as soon as the scanning start time of the laser beam is detected by the line sensor 17. At this time, for example, the element address “1000” of the imaging unit 5 corresponding to the exposure start position in FIG. 10 is read out from the modulation data creation processing unit 31, and the time t from the scanning start time of the laser beam to the exposure start position is It is calculated by the control unit 32. In this case, the scanning time t from the scanning start time of the laser beam to the element address “1” of the imaging means 5 is measured in advance, and
• the optical switch 9 is turned on and exposure is started after t from the laser beam scanning start time.
• an exposure end position is detected.
• step S7 it is determined whether one scan of the laser beam has been completed.
• the process returns to step S2 and the above-described operation is repeated.
• step S2 as shown in FIG. 10, for example, when the second exposure start position “4000” and the second exposure end position “4900” are detected, the process proceeds to step S5 via step S4. Exposure starts at element address "4000” in the same manner as described above, and ends at element address "4900".
• step S7 if "YES" is determined, the process returns to step S1 and shifts to an operation of detecting a new exposure position. Then, by repeatedly executing the above-described operation, an exposure pattern is formed in a desired area.
• the image data of the first pixel row acquired by the imaging unit 5 and stored in the storage unit 20 is read, and the image data of the next pixel row newly acquired is read.
• a defect 42 such as a foreign object or a scratch attached to the stage 18 or the glass substrate 8
• Column image data can be generated. Therefore, it is possible to prevent the defect 42 from being erroneously recognized as a reference position and to perform exposure, thereby improving the exposure accuracy of a predetermined functional pattern.
• a reference position predetermined for the pixel 22 is detected using the image data of the non-defective pixel row, and an exposure pattern is formed based on the reference position! Therefore, the overlay accuracy of the functional pattern on the pixel 22 is improved. Therefore, even when the present invention is applied to a process of forming a laminated pattern using a plurality of exposure apparatuses 1, high overlay accuracy can be ensured. As a result, it is possible to suppress an increase in the cost of the exposure apparatus 1 in which there is no need to equalize the mechanical precision between the exposure apparatuses.
• the reference position predetermined for the pixel 22 is read by the imaging means 5, and the exposure and the stop of the exposure are performed based on the reference position. Exposure work becomes easy because there is no need to align 2 with the exposure pattern.
• FIG. 15 is a conceptual diagram showing an embodiment of an exposure apparatus according to the second invention. Here, only the portions different from the exposure apparatus shown in FIG. 1 will be described.
• the second invention includes only one imaging means 5 having an image processing area smaller than the scanning range of the laser beam.
• the detection of the reference position set to the pixel 22 of the black matrix 21 is performed, for example, as shown in FIG.
• the comparison is made between the image data and the LUT for the exposure start position and the LUT for the exposure end position shown in Fig. 5.
• the exposure start position is set at the upper left corner of the first pixel 22 and the exposure end position is set at the upper right corner of the fourth pixel 22,
• the corresponding line CCD element addresses of the imaging means 5, for example, "1000" and "4900" are stored in the storage unit 20.
• W for example, 1000 CLK
• the same exposure control for example, the exposure time "3900CLK" is performed. If applied to the area 4 W after the exposure start position “1000” (the copied pixel row image area 43B), the pixel row following the image processing area 43A of the imaging means 5 as shown in FIG. Also, the same exposure pattern 44 can be formed. Further, if the same operation is repeatedly performed, the entire region of the pixel row can be exposed.
• a pixel row image is generated by copying the image of the pixel row obtained by the imaging unit 5 to a subsequent missing area of the image, and the generated pixel row is generated. Exposure based on an image causes areas that cannot be acquired by the imaging unit 5 to be used. A predetermined functional pattern can also be exposed with high precision to the pixel rows in the area.
• the number of the imaging units 5 to be installed can be reduced, and the cost of the exposure apparatus can be reduced.
• the image processing area 43A may be narrow, the high-resolution imaging means 5 can be applied, and the detection accuracy of the reference position is improved. Therefore, the exposure accuracy of the exposure pattern can be further improved.
• FIG. 15 shows an example in which the imaging unit 5 is disposed above the transport unit 4, and may be disposed below the force transport unit 4.
• the image obtained by the imaging means of the pixel array of the black matrix 21 formed in advance on the glass substrate 8 may be lost due to the presence of suction grooves, mounting bolts, etc., for absorbing the glass substrate 8 formed on the stage 18.
• a predetermined functional pattern can be enhanced even for the pixel row hidden behind the suction groove, the mounting bolt, and the like. Exposure can be performed with high accuracy.
• the illuminating means is the back illumination, but may be epi-illumination.
• the exposure apparatus of the present invention is not limited to the one applied to a large substrate such as a color filter of a liquid crystal display, but may be applied to an exposure apparatus such as a semiconductor.

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• Life Sciences & Earth Sciences (AREA)
• Sustainable Development (AREA)
• Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
• Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)

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Citations (5)

• 2004
  • 2004-04-28 JP JP2004134443A patent/JP4253708B2/ja not_active Expired - Fee Related
• 2005
  • 2005-04-28 WO PCT/JP2005/008117 patent/WO2005106596A1/ja not_active Ceased
  • 2005-04-28 KR KR1020067022508A patent/KR101103155B1/ko not_active Expired - Fee Related
  • 2005-04-28 CN CN2010102005923A patent/CN101846889B/zh not_active Expired - Fee Related
  • 2005-04-28 CN CN2005800133483A patent/CN1947069B/zh not_active Expired - Fee Related
  • 2005-04-28 TW TW094113749A patent/TWI347450B/zh not_active IP Right Cessation

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