CN101846889B - 曝光装置 - Google Patents

曝光装置 Download PDF

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Publication number
CN101846889B
CN101846889B CN2010102005923A CN201010200592A CN101846889B CN 101846889 B CN101846889 B CN 101846889B CN 2010102005923 A CN2010102005923 A CN 2010102005923A CN 201010200592 A CN201010200592 A CN 201010200592A CN 101846889 B CN101846889 B CN 101846889B
Authority
CN
China
Prior art keywords
exposure
image
imaging device
laser beam
pixel
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN2010102005923A
Other languages
English (en)
Chinese (zh)
Other versions
CN101846889A (zh
Inventor
伊藤三好
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
V Technology Co Ltd
Original Assignee
V Technology Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by V Technology Co Ltd filed Critical V Technology Co Ltd
Publication of CN101846889A publication Critical patent/CN101846889A/zh
Application granted granted Critical
Publication of CN101846889B publication Critical patent/CN101846889B/zh
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
    • G03F9/70—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
    • G03F9/7003—Alignment type or strategy, e.g. leveling, global alignment
    • G03F9/7007—Alignment other than original with workpiece
    • G03F9/7015—Reference, i.e. alignment of original or workpiece with respect to a reference not on the original or workpiece
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70383—Direct write, i.e. pattern is written directly without the use of a mask by one or multiple beams
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/70791—Large workpieces, e.g. glass substrates for flat panel displays or solar panels

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Development (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
CN2010102005923A 2004-04-28 2005-04-28 曝光装置 Expired - Fee Related CN101846889B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2004-134443 2004-04-28
JP2004134443A JP4253708B2 (ja) 2004-04-28 2004-04-28 露光装置

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
CN2005800133483A Division CN1947069B (zh) 2004-04-28 2005-04-28 曝光装置

Publications (2)

Publication Number Publication Date
CN101846889A CN101846889A (zh) 2010-09-29
CN101846889B true CN101846889B (zh) 2012-05-09

Family

ID=35241832

Family Applications (2)

Application Number Title Priority Date Filing Date
CN2010102005923A Expired - Fee Related CN101846889B (zh) 2004-04-28 2005-04-28 曝光装置
CN2005800133483A Expired - Fee Related CN1947069B (zh) 2004-04-28 2005-04-28 曝光装置

Family Applications After (1)

Application Number Title Priority Date Filing Date
CN2005800133483A Expired - Fee Related CN1947069B (zh) 2004-04-28 2005-04-28 曝光装置

Country Status (5)

Country Link
JP (1) JP4253708B2 (enExample)
KR (1) KR101103155B1 (enExample)
CN (2) CN101846889B (enExample)
TW (1) TWI347450B (enExample)
WO (1) WO2005106596A1 (enExample)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101002156B1 (ko) 2008-03-31 2010-12-17 다이니폰 스크린 세이조우 가부시키가이샤 패턴 묘화 장치 및 패턴 묘화 방법
KR102065012B1 (ko) * 2016-07-26 2020-01-10 에이피시스템 주식회사 레이저 처리장치 및 레이저 처리방법
JP6917727B2 (ja) * 2017-02-15 2021-08-11 株式会社ディスコ レーザー加工装置
JP7211627B2 (ja) * 2020-04-10 2023-01-24 Ａｌｉｔｅｃｓ株式会社 パターン測定装置、方法及びプログラム、並びに、パターン検査装置、方法及びプログラム

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6010730A (ja) * 1983-06-30 1985-01-19 Toshiba Corp 半導体ウエハの位置合わせ方法
JP2551049B2 (ja) * 1987-11-10 1996-11-06 株式会社ニコン アライメント装置
JP2797506B2 (ja) * 1989-08-31 1998-09-17 凸版印刷株式会社 露光装置
JPH03201454A (ja) * 1989-12-28 1991-09-03 Fujitsu Ltd 半導体装置の位置合わせ方法
JP2004012903A (ja) * 2002-06-07 2004-01-15 Fuji Photo Film Co Ltd 露光装置

Non-Patent Citations (4)

* Cited by examiner, † Cited by third party
Title
JP平1-125823A 1989.05.18
JP平3-201454A 1991.09.03
JP平3-89511A 1991.04.15
JP特开平7-130634A 1995.05.19

Also Published As

Publication number Publication date
KR101103155B1 (ko) 2012-01-04
KR20070001252A (ko) 2007-01-03
TW200535453A (en) 2005-11-01
CN1947069B (zh) 2010-09-29
WO2005106596A1 (ja) 2005-11-10
CN1947069A (zh) 2007-04-11
TWI347450B (en) 2011-08-21
JP4253708B2 (ja) 2009-04-15
CN101846889A (zh) 2010-09-29
JP2005317800A (ja) 2005-11-10

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C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
C14 Grant of patent or utility model
GR01 Patent grant
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20120509

Termination date: 20210428

CF01 Termination of patent right due to non-payment of annual fee