Classifications

• • G—PHYSICS
  • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
  • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
  • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
  • G03F7/70—Microphotolithographic exposure; Apparatus therefor
  • G03F7/70383—Direct write, i.e. pattern is written directly without the use of a mask by one or multiple beams
• • G—PHYSICS
  • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
  • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
  • G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
  • G03F9/70—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
  • G03F9/7003—Alignment type or strategy, e.g. leveling, global alignment
  • G03F9/7007—Alignment other than original with workpiece
  • G03F9/7011—Pre-exposure scan; original with original holder alignment; Prealignment, i.e. workpiece with workpiece holder
• • G—PHYSICS
  • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
  • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
  • G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
  • G03F9/70—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
  • G03F9/7003—Alignment type or strategy, e.g. leveling, global alignment
  • G03F9/7007—Alignment other than original with workpiece
  • G03F9/7015—Reference, i.e. alignment of original or workpiece with respect to a reference not on the original or workpiece
• • G—PHYSICS
  • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
  • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
  • G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
  • G03F9/70—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
  • G03F9/7088—Alignment mark detection, e.g. TTR, TTL, off-axis detection, array detector, video detection

Definitions

• the present invention relates to an exposure apparatus and a pattern forming method for directly exposing a function pattern on an object to be exposed, and more particularly, to a reference position set in a function pattern to be a reference previously formed on the object to be exposed. Improve the overlay accuracy of the functional patterns and control the cost of the exposure equipment by controlling the start and stop of the irradiation of the light beam based on the reference position. And an exposure apparatus.
• a conventional exposure apparatus uses a mask in which a mask pattern corresponding to a functional pattern is formed on a glass substrate in advance, and transfers and exposes the mask pattern on an object to be exposed, for example, a stepper or a micro mirror.
• projection Microrror Projection
• Proximity proximity
• the overlay accuracy of the functional patterns between the layers becomes a problem.
• high absolute dimensional accuracy was required for the mask pattern arrangement, which increased the cost of the mask.
• an alignment between the functional pattern of the underlying layer and the mask pattern is necessary, and this alignment is particularly difficult for a large mask.
• an exposure apparatus that directly draws a CAD data pattern on an object to be exposed using an electron beam or a laser beam without using a mask.
• This type of exposure apparatus includes a laser light source, an exposure optical system that reciprocally scans the laser beam emitted from the laser light source, and a transport unit that transports the object to be exposed while mounted thereon, based on CAD data.
• the laser beam is reciprocally scanned while controlling the emission state of the laser light source, and the object to be exposed is conveyed in a direction perpendicular to the laser beam scanning direction, and corresponds to a functional pattern on the object to be exposed.
• CAD data patterns are formed two-dimensionally (for example, patent Reference 1).
• Patent Document 1 JP 2001-144415 A
• a first invention is an exposure apparatus that scans a light beam relative to an object to be exposed by an exposure optical system and directly exposes a functional pattern on the object to be exposed.
• the exposure light is disposed on the same side as the exposure optical system with respect to the object to be exposed, and the scanning position of the light beam in the conveying direction of the object to be exposed is an imaging position.
• Illuminating means for enabling imaging by means, and detecting a reference position preset in the reference function pattern imaged by the imaging means, and starting or irradiating the light beam with reference to the reference position.
• Control irradiation stop It is obtained by a university system control unit.
• the illumination device disposed at least in one of the vertical directions with respect to the object to be exposed.
• the illumination unit illuminates a function pattern serving as a reference for an exposure position formed in advance on the object to be exposed, and is disposed on the same side as the exposure optical system with respect to the object to be exposed, and in the transport direction of the object to be exposed.
• An image pickup unit having an image pickup position on the near side of the scanning position of the light beam picks up an image of the functional pattern serving as the reference, and a reference set in advance to the reference function pattern imaged by the image pickup unit by the optical system control unit. The position is detected, and irradiation start or irradiation of the light beam reciprocating with respect to the reference position is controlled. As a result, the accuracy of superimposing the predetermined function pattern on the reference function pattern formed in advance on the object to be exposed is improved.
• the illumination means is provided on the same side as the imaging means with respect to the object to be exposed.
• the reference function pattern formed in advance on the object to be exposed is illuminated by the illumination means from the same side as the imaging means, and the reference function pattern is imaged by the reflection illumination by the imaging means.
• the object to be exposed is a transparent substrate, and the illuminating means is arranged on the opposite side of the image taking means with respect to the object to be exposed.
• the reference function pattern formed in advance on the transparent object to be exposed is illuminated by the illumination means from the side opposite to the imaging means, and the reference function pattern is imaged by the transmission means by the imaging means.
• the illuminating means is disposed on both sides in the vertical direction with respect to the object to be exposed, and can be switched to each other for use. Thereby, the illuminating means arranged on both sides in the vertical direction with respect to the object to be exposed are switched to each other to illuminate a reference function pattern formed in advance on the object to be exposed, and the image pickup means transmits or illuminates the pattern.
• the reference functional pattern is imaged by one of the reflected illuminations.
• the second invention is an exposure apparatus that relatively scans a transparent object to be exposed with a light beam by an exposure optical system and directly exposes a functional pattern on the object to be exposed,
• the exposure object is disposed on the opposite side of the exposure optical system with respect to the exposure object, and is formed in advance on the exposure object with an imaging position in front of the light beam scanning position in the transport direction of the exposure object.
• An optical system control means for detecting a reference position preset in the function pattern serving as the reference, and controlling the start or stop of irradiation of the light beam based on the reference position.
• the functional pattern serving as a reference of the exposure position formed in advance on the object to be exposed is illuminated by the illuminating means provided at least in one of the vertical directions with respect to the transparent object to be exposed.
• the transparent exposure substrate is disposed on an opposite side of the exposure optical system with respect to the exposure target body by an imaging means having an imaging position near the scanning position of the light beam in the transport direction of the exposure target.
• An image of the function pattern serving as the reference is transmitted from below, and a reference position preset in the reference function pattern imaged by the imaging means is detected by the optical system control means, and the reference position is used as a reference.
• the reference position is used as a reference.
• the illumination means is provided on the same side as the imaging means with respect to the object to be exposed.
• the reference function pattern formed in advance on the object to be exposed is illuminated by the illumination means from the same side as the imaging means, and the reference function pattern is imaged by the reflection illumination by the imaging means.
• the illuminating means is disposed on the opposite side of the imaging means from the object to be exposed.
• the reference function pattern formed in advance on the transparent object to be exposed is illuminated by the illumination means from the side opposite to the imaging means, and the reference function pattern is imaged by the transmission illumination by the imaging means.
• the illuminating means is disposed on both sides in the vertical direction with respect to the object to be exposed, and can be switched to each other for use. Thereby, the illuminating means arranged on both sides in the vertical direction with respect to the object to be exposed are switched to each other to illuminate a reference function pattern formed in advance on the object to be exposed, and the image pickup means transmits or illuminates the pattern.
• the reference functional pattern is imaged by one of the reflected illuminations.
• the imaging means captures a function pattern serving as a reference of an exposure position formed in advance on the object to be exposed, and the captured function pattern image serving as a reference is pre-printed.
• a predetermined functional pattern is provided at a predetermined position with respect to the reference position. Can be performed with high accuracy. Therefore, even when a plurality of functional patterns are laminated and formed, the overlay accuracy of the functional patterns of each layer is improved.
• the exposure optical system and the imaging means can be manufactured in an integrated structure, so that the mechanical stability of this part can be increased and the cost can be reduced. It can be reduced. Further, attachment to the device is facilitated.
• the imaging means is disposed on the side opposite to the exposure optical system, and the reference function pattern formed in advance on the transparent object to be exposed is used for the exposure.
• the reference function pattern is imaged to detect the reference position. can do. Therefore, even if the reference functional pattern is covered with the opaque film, the predetermined pattern of each layer can be superposed with high accuracy.
• the illuminating means is disposed on the same side as the imaging means with respect to the object to be exposed, so that an opaque film is formed on the reference functional pattern.
• the function pattern serving as the reference can be imaged.
• the illumination means is arranged on the side opposite to the imaging means with respect to the transparent object to be exposed, so that the contrast of the image acquired by the imaging means is reduced.
• the accuracy of image data acquisition is improved. Therefore, highly accurate exposure can be realized.
• the illuminating means is disposed on both sides of the object to be exposed in an upward and downward direction, and can be switched to each other for use.
• the same exposure apparatus can be used for either transparent or opaque cases and for transparent or opaque films formed on the reference functional pattern.
• FIG. 1 is a conceptual diagram showing a first embodiment of an exposure apparatus according to the present invention.
• FIG. 2 is a perspective view illustrating the configuration and operation of an optical switch.
• FIG. 3 is an explanatory diagram showing a relationship between a scanning position of a laser beam and an imaging position of an imaging unit.
• FIG. 4 is a block diagram showing a first half of a processing system in an internal configuration of the image processing unit.
• FIG. 5 is a block diagram showing a latter half of a processing system in the internal configuration of the image processing unit.
• FIG. 6 is an explanatory diagram showing a relationship between a black matrix moving in a direction orthogonal to a scanning direction of a laser beam and a scanning trajectory of the laser beam.
• FIG. 7 is a flowchart illustrating a procedure of a pattern forming method according to the present invention.
• FIG. 8 is an explanatory diagram showing a method of binarizing the output of the ring buffer memory.
• FIG. 9 is an explanatory diagram showing an image of an exposure start position preset for pixels of a black matrix and a look-up table thereof.
• FIG. 10 is an explanatory diagram showing a relationship between a reference position preset for a pixel of a black matrix and an element of an imaging unit.
• FIG. 11 is an explanatory diagram showing an image of an exposure end position preset for pixels of a black matrix and a look-up table thereof.
• FIG. 12 is an explanatory diagram showing a method for detecting an exposure position for the pixel in the glass substrate transport direction.
• FIG. 13 is an explanatory diagram showing a method of correcting a scanning position of a laser beam.
• FIG. 14 is a conceptual diagram showing a main part of a second embodiment according to the present invention.
• FIG. 15 is a conceptual diagram showing a main part of a third embodiment according to the present invention.
• FIG. 16 is a conceptual diagram showing a main part of a fourth embodiment according to the present invention.
• FIG. 17 is a conceptual diagram showing a main part of a fifth embodiment according to the present invention.
• Imaging means
• Optical system control means 8 Glass substrate (subject)
• FIG. 1 is a conceptual diagram showing a first embodiment of an exposure apparatus according to the present invention.
• the exposure apparatus 1 directly exposes a functional pattern on an object to be exposed, and includes a laser light source 2, an exposure optical system 3, a transport unit 4, an imaging unit 5, an illumination unit 6, and an optical system.
• the above-mentioned functional pattern is a pattern of a component required for the product to perform its intended operation.For example, in the case of a color filter, a pixel pattern of a black matrix or a red, blue, or green color filter is used. In the case of a semiconductor component, it is a wiring pattern, various electrode patterns, and the like. In the following description, an example in which a glass substrate for a color filter is used as an object to be exposed will be described.
• the laser light source 2 emits a light beam, and is, for example, a high-output all-solid-state mode-locked laser light source having an output of 4 W or more for generating ultraviolet light of 355 nm.
• An exposure optical system 3 is provided in front of the laser light source 2 in the light beam emission direction.
• the exposure optical system 3 is for reciprocally scanning a laser beam as a light beam on a glass substrate 8, and a light switch 9, a light switch 9, a light deflector 10, and a first mirror 11. , A polygon mirror 12, an f ⁇ lens 13, and a second mirror 14.
• the optical switch 9 is for switching between the irradiation of the laser beam and the stop of the irradiation.
• the first and second polarizing elements 15A and 15B are connected to the respective polarizing elements 15A. , 15B are separated from each other so that the polarization axes p are orthogonal to each other (in the figure, the polarization axis p of the polarization element 15A is set in the vertical direction, and the polarization axis p of the polarization element 15B is set in the horizontal direction).
• an electro-optic modulator 16 is provided between the first and second polarizing elements 15A and 15B.
• the electro-optic modulator 16 operates so as to rotate the polarization plane of polarized light (linearly polarized light) at a high speed of several nsec when a voltage is applied. For example, when the applied voltage is zero, the linearly polarized light having a vertical polarization plane, for example, which is selectively transmitted by the first polarizing element 15A in FIG. The light is transmitted as it is and reaches the second polarizing element 15B. Since the second polarizing element 15B is arranged so as to selectively transmit linearly polarized light having a horizontal polarization plane, the second polarizing element 15B cannot transmit the linearly polarized light having a vertical polarization plane, In this case, irradiation of the laser beam is stopped.
• the light deflecting means 10 scans the laser beam by shifting the scanning position of the laser beam in a direction orthogonal to the scanning direction (the moving direction of the glass substrate 8 coincides with the direction of arrow A shown in FIG. 1), and scans the position.
• This is, for example, an acousto-optic element (AO element).
• the first mirror 11 is for bending the traveling direction of the laser beam that has passed through the light deflecting means 10 in the direction in which the polygon mirror 12 described later is installed, and is a plane mirror. Further, the polygon mirror 12 reciprocally scans the laser beam, and for example, forms eight mirrors on the side surface of a regular octagonal columnar rotating body. In this case, the laser beam reflected by one of the mirrors is scanned one-dimensionally in the forward direction with the rotation of the polygon mirror 12, and at the moment when the irradiation position of the laser beam moves to the next mirror surface. Returning to the backward direction, one-dimensional forward scanning is started again with the rotation of the polygon mirror 12.
• the f 13 lens 13 makes the scanning speed of the laser beam uniform on the glass substrate 8, and makes the focal position substantially coincide with the position of the mirror surface of the polygon mirror 12. Be placed.
• the second mirror 14 reflects the laser beam that has passed through the f0 lens 13 so as to be incident on the surface of the glass substrate 8 in a direction substantially perpendicular thereto, and is a plane mirror.
• a line sensor 17 is provided at a portion on the scanning start side of the laser beam that reciprocally scans in the vicinity of the surface on the emission side of the f0 lens 13 so as to be orthogonal to the scanning direction. The shift amount between the predetermined scanning position and the actual scanning position is detected, and the scanning start time of the laser beam is detected.
• the line sensor 17 may be provided anywhere as long as the laser beam scanning start point on the f 13 lens 13 side can be detected.For example, the line sensor 17 may be provided on a glass substrate transfer stage 18 side described later. A little.
• a transport unit 4 is provided below the second mirror 14.
• the transport means 4 is for placing the glass substrate 8 on the stage 18 and transporting the glass substrate 8 at a predetermined speed in a direction orthogonal to the scanning direction of the laser beam.
• a transport drive unit 20 such as a motor for rotating the transport roller 19.
• An imaging unit 5 is provided above the transfer unit 4 and in front of the laser beam scanning position in the transfer direction indicated by arrow A.
• the imaging means 5 is for imaging pixels of a black matrix as a functional pattern serving as a reference for an exposure position formed in advance on the glass substrate 8, and is, for example, a line CCD in which light receiving elements are arranged in a line. is there.
• the distance D between the imaging position E of the imaging means 5 and the scanning position F of the laser beam is an integral multiple (n) of the arrangement pitch P of the pixels 22 of the black matrix 21 in the transport direction. Times).
• FIG. 1 shows an example in which three imaging units 5 are installed.
• the scanning range of the force laser beam is narrower than the image processing area of one imaging unit 5, only one imaging unit 5 is used.
• the scanning range is wider than the image processing area of one imaging unit 5, a plurality of imaging units 5 may be installed accordingly.
• An illumination unit 6 is provided below the transport unit 4.
• the illuminating means 6 illuminates the pixel 22 to enable the imaging means 5 to perform imaging.
• the laser light source 2 the optical switch 9, the light deflecting means 10, the polygon mirror 12, the line sensor
• An optical system control means 7 is connected to the transport means 4 and the imaging means 5.
• the optical system control means 7 detects a preset reference position in the pattern image of the pixel 22 imaged by the imaging means 5 and starts laser beam irradiation by the laser light source 2 with respect to the reference position. Controls irradiation stop and outputs the output of line sensor 17.
• the voltage applied to the light deflecting means 10 is controlled to deflect the laser beam emission direction, and the rotation speed of the polygon mirror 12 is controlled to set the laser beam scanning speed to a predetermined speed. Maintaining and controlling the transfer speed of the glass substrate 8 by the transfer means 4 to a predetermined speed.
• a light source driving unit 23 for turning on the laser light source 2 an optical switch controller 24 for controlling the start and stop of the irradiation of the laser beam, and an optical deflecting unit driving for controlling the amount of laser beam deflection in the optical deflecting unit 10.
• Unit 25A a polygon drive unit 25B that controls the driving of the polygon mirror 12, a transport controller 26 that controls the transport speed of the transport unit 4, an illumination light controller 27 that turns on and off the illumination unit 6, and an image pickup unit.
• An AZD conversion unit 28 that performs AZD conversion of the image captured by the means 5; an image processing unit 29 that determines a laser beam irradiation start position and an irradiation stop position based on the AZD converted image data; and an image processing unit 29
• the data of the laser beam irradiation start position (hereinafter, referred to as exposure start position) and irradiation stop position (hereinafter, referred to as exposure end position) obtained by the processing described above are stored.
• a storage unit 30 for storing a lookup table of a position and an exposure end position, and modulation data for turning on / off the optical switch 9 based on the data of the exposure start position and the exposure end position read from the storage unit 30 are created.
• a control unit 32 that appropriately controls the entire apparatus to perform a predetermined target operation.
• the image processing unit 29 includes, for example, three ring buffer memories 33A, 33B, and 33C connected in parallel, and three ring buffer memories 33A, 33B, and 33C connected in parallel for each of the ring buffer memories 33A, 33B, and 33C.
• the exposure start position determination circuit 36 that outputs an exposure start position determination result when both data match, the output data of the nine line buffer memories 34A, 34B, and 34C are shown in FIG.
• An exposure end position determination circuit 37 that compares the data with a lookup table (exposure end position LUT) and outputs an exposure end position determination result when both data match.
• the image processing unit 29 receives the above-described exposure start position determination result and counts the number of coincidences of the image data corresponding to the first reference position.
• the output of the counting circuit 38A is compared with the exposure start pixel number obtained from the storage unit 30 shown in FIG. 1, and when both values match, the exposure start signal is output to the modulation data creation processing unit 31 shown in FIG.
• a comparison circuit 39B that outputs an exposure end signal to the modulation data creation processing unit 31 shown in FIG.
• the pixel counting circuit 40 compares the output of the head pixel counting circuit 40 with the exposure pixel column number obtained from the storage unit 30 shown in FIG. And a comparison circuit 41 for outputting to the modulation data creation processing section 31 shown in FIG.
• the counting circuits 38A and 38B are reset by the reading start signal when the reading operation by the imaging means 5 is started. When the formation of the predetermined exposure pattern specified in advance is completed, the leading pixel counting circuit 40 is reset by the exposure pattern end signal.
• the exposure apparatus 1 configured as described above and a pattern forming method will be described.
• the optical system control means 7 is driven.
• the laser light source 2 is activated to emit a laser beam.
• the polygon mirror 12 starts rotating, and the laser beam can be scanned.
• the optical switch 9 is still turned off! Therefore, no laser beam is emitted! ,.
• the glass substrate 8 is placed on the stage 18 of the transfer means 4. Since the transfer means 4 transfers the glass substrate 8 at a constant speed, the scanning trajectory (arrow B) of the laser beam moves relative to the moving direction of the stage 18 (arrow A) as shown in FIG. Become diagonal. Therefore, when the glass substrate 8 is set in parallel with the above moving direction (arrow A), As shown in a), the exposure position may be shifted between the scan start pixel 22a and the scan end pixel 22b of the black matrix 21. In this case, as shown in FIG. 3B, the glass substrate 8 is installed at an angle to the transport direction (the direction of arrow A), and the arrangement direction of the pixels 22 and the scanning locus of the laser beam (arrow B). ) Should match.
• the above-mentioned shift amount is small. Therefore, the glass substrate 8 is set in parallel with the moving direction, and the above-mentioned amount of displacement is measured based on the data imaged by the imaging means 5 to control the light deflection means 10 of the exposure optical system 3.
• the shift amount may be corrected. In the following description, the above-described shift amount is assumed to be negligible.
• the transport drive unit 20 is driven to move the stage 18 in the direction of arrow A in FIG.
• the transport drive section 20 is controlled by the transport controller 26 of the optical system control means 7 to have a constant speed.
• the imaging unit 5 starts imaging, and starts exposure based on the captured image data of the black matrix 21.
• the position and the exposure end position are detected.
• the pattern forming method will be described with reference to the flowchart shown in FIG.
• step S1 an image of the pixel 22 of the black matrix 21 is obtained by the imaging unit 5.
• the acquired image data is taken into the three ring buffer memories 33A, 33B and 33C of the image processing section 29 shown in FIG. 4 and processed.
• the latest three data are output from each of the ring buffer memories 33A, 33B, and 33C.
• the previous data is output from the ring buffer memory 33A
• the previous data is output from the ring buffer memory 33B
• the latest data is also output from the ring buffer memory 33C.
• these data are respectively arranged by three line buffer memories 34A, 34B, 34C so that an image of, for example, a 3 ⁇ 3 CCD pixel is arranged on the same clock (time axis).
• the result is obtained, for example, as an image as shown in FIG.
• this image When this image is digitized, it corresponds to a 3 ⁇ 3 numerical value as shown in FIG. Since these digitized images are arranged on the same clock, they are compared with a threshold by the comparison circuit 35 to be binarized. For example, if the threshold is “45”, the image in FIG. It will be done.
• step S2 reference positions for exposure start and exposure end are detected. Specifically, the reference position detection is performed by the exposure start position determination circuit 36 by comparing the above-mentioned binarized data with the data of the exposure start position LUT obtained from the storage unit 30 shown in FIG.
• the exposure start position determination circuit 36 outputs the start position determination result.
• the upper left corner of each pixel 22 corresponds to the first reference position.
• the number of matches is counted in counting circuit 38A shown in FIG. Then, the count number is compared with the exposure start pixel number obtained from the storage unit 30 shown in FIG. 1 by the comparison circuit 39A, and when the two values match, the exposure start signal is converted into the modulation data shown in FIG. Output to the processing unit 31.
• the processing unit 31 for example, the first pixel 22 and the fourth pixel 22 in the scanning direction of the laser beam.
• the element addresses for example, "1000" and "4000" in the line CCD of the imaging means 5 corresponding to the first reference position are the optical switch controller. LA24.
• the above-mentioned binarized data is compared with the data of the exposure end position LUT obtained from the storage section 30 shown in FIG.
• the second reference position for specifying the exposure end position is set at the upper right corner of the pixel 22 of the black matrix 21 as shown in FIG. Is as shown in FIG. 11B
• the data of the exposure end position LUT at this time is “110110000”. Therefore, the binary data is compared with the data “110110000” of the exposure end position LUT, and when the two data match, the image data acquired by the imaging means 5 is the reference position for the exposure end.
• the upper right corner of each pixel 22 corresponds to the second reference position.
• the number of matches is counted in the counting circuit 38B shown in FIG. Then, the count number is compared with the exposure end pixel number obtained from the storage unit 30 shown in FIG. 1 in the comparison circuit 39B, and when the two values match, the exposure end signal is sent to the modulation data creation processing unit 31 shown in FIG. Output to In this case, as shown in FIG. 10, for example, the first pixel 22 and the fourth pixel 22 in the scanning direction of the laser beam.
• the imaging means When the upper right corner of the camera is defined as the second reference position, the imaging means corresponding to the second reference position
• the element addresses of the five-line CCD for example, "1900" and "4900" are stored in the optical switch controller 24.
• the process proceeds to step S3.
• step S3 an exposure position in the moving direction of the glass substrate 8 is detected.
• the distance D between the scanning position F of the laser beam and the imaging position E of the imaging means 5 is set to an integral multiple (n times) of the arrangement pitch P of the pixels 22 in the moving direction.
• the exposure position can be determined by counting the scanning cycle of the laser beam. For example, as shown in FIG. 12, when the distance D between the scanning position of the laser beam and the imaging position of the imaging means 5 is set to, for example, three times the arrangement pitch P of the pixels 22, step S2 After detecting the first and second reference positions at the end of the pixel 22 (see FIG. 2A), the glass substrate 8 moves and the center line of the pixel column is moved to the imaging position of the imaging means 5.
• the timing coincides with the laser beam scanning start timing.
• the transport speed of the glass substrate 8 is controlled to move by one pitch of the pixels 22 in synchronization with the cycle T of the laser beam. Therefore, the pixel 22 moves to the position shown in FIG. Further, after 2T, the pixel 22 moves to the position shown in FIG. Then, after 3T, the column center line of the pixel 22 reaches the scanning position of the laser beam, as shown in FIG. Thus, the exposure position is detected.
• step S4 the exposure position is adjusted while scanning the laser beam. Done. Specifically, as shown in FIG. 13, the exposure position is adjusted by changing the current scanning position (element address) of the laser beam detected by the line sensor 17 provided on the f0 lens 13 and a predetermined reference element address. Then, the deviation amount is detected by comparing with the reference position, and the light deflection means 10 is controlled so that the scanning position of the laser beam coincides with the reference element address (reference scanning position).
• step S5 exposure is started. Exposure is started by controlling the optical switch 9 on-time by the optical switch controller 24. In this case, first, the optical switch 9 is turned on and the laser beam is scanned, and the optical switch 9 is turned off as soon as the scanning start time of the laser beam is detected by the line sensor 17. At this time, for example, the element address “1000” of the imaging unit 5 corresponding to the exposure start position in FIG. 10 is read out from the modulation data creation processing unit 31, and the time t from the scanning start time of the laser beam to the exposure start position is It is calculated by the control unit 32. In this case, the imaging hand starts from the scanning start time of the laser beam.
• the scanning time t up to the element address “1” in step 5 is measured in advance, and the laser beam
• the optical switch 9 is turned on and exposure is started after t from the laser beam scanning start time.
• step S6 an exposure end position is detected.
• step S7 it is determined whether one scan of the laser beam has been completed.
• the process returns to step S2 and the above-described operation is repeated.
• step S2 as shown in FIG. 10, for example, when the second exposure start position “4000” and the second exposure end position “4900” are detected, the process proceeds to step S5 via step S4. Exposure starts at element address "4000” in the same manner as described above, and ends at element address "4900".
• step S 7 if “YES” is determined, the process returns to step S 1 and a new exposure position is set. Move to the operation of detecting. Then, by repeatedly executing the above-described operation, an exposure pattern is formed in a desired area.
• the pixel 22 of the black matrix 21 formed in advance on the glass substrate 8 captured by the imaging unit 5 is captured, and the captured pixel is captured. Since an exposure pattern is formed by detecting a reference position set in advance in the image 22 and controlling the start or stop of laser beam irradiation with reference to the reference position, exposure of the pixel 22 is performed. The accuracy is improved.
• the exposure pattern is formed based on a predetermined reference position in the pixel 22, the problem of deterioration of the overlay accuracy of the functional pattern due to the difference in accuracy between the exposure apparatuses. Can be eliminated. Therefore, high overlay accuracy can be ensured even when the present invention is applied to a process of forming a layered pattern using a plurality of exposure apparatuses 1. As a result, an increase in the cost of the exposure apparatus 1 can be suppressed.
• the exposure optical system 3 and the imaging means 5 can be manufactured in an integrated structure. Efficiency and cost can be reduced. Further, attachment to the device is facilitated.
• the illuminating means 6 By arranging the illuminating means 6 on the side opposite to the imaging means 5 with respect to the transparent glass substrate 8, the contrast of the image acquired by the imaging means 5 is improved, and the accuracy of acquiring the image data is improved. improves. Therefore, highly accurate exposure can be realized.
• the exposure apparatus 1 of the fourth embodiment shown in FIG. 14 has an imaging unit 5 and an illuminating unit 6 both disposed below the transporting unit 4, and the glass substrate 8 It is possible to image the pixels 22 of the black matrix 21 formed in advance on the surface of the device.
• the pixel 22 of the black matrix 21 formed on the upper surface of the glass substrate 8 by the reflected illumination is imaged by the imaging means from the downward force through the glass substrate 8 to control the optical system.
• the reference position set for the pixel 22 is detected by the means 7 to control the start and end of exposure, and for example, a red, blue, and green color filter is provided at a position corresponding to the pixel 22. Expose a first-class predetermined functional pattern.
• a predetermined function pattern can be formed at a predetermined position with respect to a reference position with high accuracy. Therefore, even when a plurality of layers of patterns are stacked on the pixel 22, the pattern registration accuracy of each layer is increased. Further, since the imaging means 5 and the illuminating means 6 are provided on the same side as the exposure optical system 3, the exposure optical system 3 and each of the above means can be manufactured in an integrated structure. Therefore, the mechanical stability of this portion can be increased, and the cost can be reduced. In addition, attachment to the device becomes easier. Further, since the lower side of the glass substrate 8 can be entirely used for the space of the driving mechanical system of the transfer means 4, the design becomes easy.
• the exposure apparatus 1 according to the third embodiment shown in FIG. 15 has an imaging unit 5 disposed above the transport unit 6 and illumination units 6a and 6b disposed on both the upper and lower sides of the transport unit 4 so as to be switched with each other. It has been made usable.
• the upper illuminating means 6a is turned on to image the reference function pattern formed on the upper surface of the substrate by the imaging means. Then, the optical system control means 7 detects a reference position set in the reference function pattern, controls the start and end of exposure, and forms a predetermined exposure pattern at a predetermined position with respect to the reference position.
• the lower illuminating means 6b is turned on, and the imaging unit 5 images the reference functional pattern by the transmissive illumination with high contrast.
• the illuminating means 6a and 6b are transmitted or reflected according to the attributes of the substrate such as whether the substrate to be used is transparent or non-transparent. It can be used by switching to lighting, improving convenience.
• the exposure apparatus 1 has an imaging unit 5 and an illuminating unit 6 both disposed below the transporting unit 4 and through a transparent glass substrate 8 to form a downward force plate.
• the glass substrate 8 This is to enable imaging of pixels 22 of a black matrix 21 formed in advance on the surface.
• the lighting device illuminates the black matrix 21 previously formed on the surface of the glass substrate 8 through the transparent glass substrate 8, and the imaging device 5
• the lower camera also captures an image of the pixel 22 of the black matrix 21 through the glass substrate 8, detects the reference position set in the pixel 22 by the optical system control means 7, and controls exposure start and exposure end. Then, a predetermined functional pattern such as a red, blue, or green color filter is exposed at a position corresponding to the pixel 22.
• a predetermined function pattern can be formed at a predetermined position with respect to a reference position with high accuracy. Therefore, even when a plurality of layers of patterns are stacked on the pixel 22, the pattern registration accuracy of each layer is increased. Also, when an opaque film is formed on the reference pixel 22, for example, the reference pixel 22 is imaged from below through the transparent glass substrate 8 to detect the reference position. be able to. Therefore, even if the pixel 22 is covered with the opaque film, it is possible to perform the superposition of the predetermined functional pattern of each layer with high accuracy.
• the exposure apparatus 1 has an imaging unit 5 disposed below the transport unit 4 and an illumination unit 6 disposed above the transport unit 4, and is transparent.
• the lower part through the glass substrate 8 can also image the pixels 22 of the black matrix 21 formed in advance on the surface of the glass substrate 8.
• the pixels 22 of the black matrix 21 formed on the upper surface of the glass substrate 8 by the transmitted illumination are imaged by the imaging means from the downward force through the glass substrate 8 to control the optical system.
• the reference position set for the pixel 22 is detected by the means 7 to control the start and end of the exposure, and a predetermined function such as a red, blue, or green color filter is provided at the position corresponding to the pixel 22. Expose the pattern.
• the reference position is different from the reference position.
• a predetermined function pattern can be formed at a predetermined position with high accuracy. Therefore, even when a plurality of layers of patterns are stacked on the pixel 22, the pattern registration accuracy of each layer is increased.
• the transmitted illumination is used, the contrast of the image acquired by the imaging means 5 is improved, and the accuracy of acquiring the image data is improved. Therefore, highly accurate exposure can be realized.
• the illumination means 6 having a small installation space is disposed on the same side as the exposure optical system 3, the installation spaces of the illumination means 6 and the exposure optical system 3 do not interfere with each other.
• the exposure apparatus of the present invention is not limited to an apparatus applied to a large substrate such as a color filter of a liquid crystal display, but can also be applied to an exposure apparatus such as a semiconductor.

Landscapes

• Physics & Mathematics (AREA)
• General Physics & Mathematics (AREA)
• Engineering & Computer Science (AREA)
• Multimedia (AREA)
• Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
• Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)

Applications Claiming Priority (2)

Publications (1)

Family

ID=35241829

Family Applications (1)

Country Status (3)

Families Citing this family (10)

Citations (4)

Family Cites Families (1)

• 2004
  • 2004-04-28 JP JP2004134440A patent/JP4338577B2/ja not_active Expired - Fee Related
• 2005
  • 2005-04-28 WO PCT/JP2005/008114 patent/WO2005106590A1/ja not_active Ceased
  • 2005-04-28 TW TW94113744A patent/TWI394007B/zh not_active IP Right Cessation

Patent Citations (4)

Also Published As

Similar Documents

Legal Events